JPH01107153U - - Google Patents

Info

Publication number

JPH01107153U

JPH01107153U JP232488U JP232488U JPH01107153U JP H01107153 U JPH01107153 U JP H01107153U JP 232488 U JP232488 U JP 232488U JP 232488 U JP232488 U JP 232488U JP H01107153 U JPH01107153 U JP H01107153U

Authority

JP

Japan

Prior art keywords

external lead

brazed

ceramic package

standoff

ceramic

Prior art date

1988-01-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000919 ceramic Substances 0.000 claims description 9
• 239000004065 semiconductor Substances 0.000 claims 1
• 238000005219 brazing Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1