JPH01107130U - - Google Patents

Info

Publication number
JPH01107130U
JPH01107130U JP105088U JP105088U JPH01107130U JP H01107130 U JPH01107130 U JP H01107130U JP 105088 U JP105088 U JP 105088U JP 105088 U JP105088 U JP 105088U JP H01107130 U JPH01107130 U JP H01107130U
Authority
JP
Japan
Prior art keywords
adhesive
semiconductor pellets
holding
semiconductor
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP105088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP105088U priority Critical patent/JPH01107130U/ja
Publication of JPH01107130U publication Critical patent/JPH01107130U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP105088U 1988-01-08 1988-01-08 Pending JPH01107130U (US08197722-20120612-C00093.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP105088U JPH01107130U (US08197722-20120612-C00093.png) 1988-01-08 1988-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP105088U JPH01107130U (US08197722-20120612-C00093.png) 1988-01-08 1988-01-08

Publications (1)

Publication Number Publication Date
JPH01107130U true JPH01107130U (US08197722-20120612-C00093.png) 1989-07-19

Family

ID=31200600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP105088U Pending JPH01107130U (US08197722-20120612-C00093.png) 1988-01-08 1988-01-08

Country Status (1)

Country Link
JP (1) JPH01107130U (US08197722-20120612-C00093.png)

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