JPH01104728U - - Google Patents

Info

Publication number

JPH01104728U

JPH01104728U JP20135287U JP20135287U JPH01104728U JP H01104728 U JPH01104728 U JP H01104728U JP 20135287 U JP20135287 U JP 20135287U JP 20135287 U JP20135287 U JP 20135287U JP H01104728 U JPH01104728 U JP H01104728U

Authority

JP

Japan

Prior art keywords

semiconductor element

resin

sealed package

molding material

view

Prior art date

1987-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 6
• 230000003014 reinforcing effect Effects 0.000 claims description 2
• 239000012778 molding material Substances 0.000 claims 2
• 239000000463 material Substances 0.000 description 2
• 238000010586 diagram Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000002787 reinforcement Effects 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1