JPH01104726U - - Google Patents

Info

Publication number
JPH01104726U
JPH01104726U JP20128787U JP20128787U JPH01104726U JP H01104726 U JPH01104726 U JP H01104726U JP 20128787 U JP20128787 U JP 20128787U JP 20128787 U JP20128787 U JP 20128787U JP H01104726 U JPH01104726 U JP H01104726U
Authority
JP
Japan
Prior art keywords
recesses
wafer
stage
metal ball
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20128787U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20128787U priority Critical patent/JPH01104726U/ja
Publication of JPH01104726U publication Critical patent/JPH01104726U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP20128787U 1987-12-29 1987-12-29 Pending JPH01104726U (US07652168-20100126-C00068.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20128787U JPH01104726U (US07652168-20100126-C00068.png) 1987-12-29 1987-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20128787U JPH01104726U (US07652168-20100126-C00068.png) 1987-12-29 1987-12-29

Publications (1)

Publication Number Publication Date
JPH01104726U true JPH01104726U (US07652168-20100126-C00068.png) 1989-07-14

Family

ID=31699924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20128787U Pending JPH01104726U (US07652168-20100126-C00068.png) 1987-12-29 1987-12-29

Country Status (1)

Country Link
JP (1) JPH01104726U (US07652168-20100126-C00068.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021106218A (ja) * 2019-12-26 2021-07-26 エイブリック株式会社 吸着保持装置、吸着保持方法、及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021106218A (ja) * 2019-12-26 2021-07-26 エイブリック株式会社 吸着保持装置、吸着保持方法、及び半導体装置の製造方法

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