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Publication date
Application filedfiledCritical
Priority to JP1987201448UpriorityCriticalpatent/JPH0630448Y2/ja
Publication of JPH01104343UpublicationCriticalpatent/JPH01104343U/ja
Application grantedgrantedCritical
Publication of JPH0630448Y2publicationCriticalpatent/JPH0630448Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/79—Apparatus for Tape Automated Bonding [TAB]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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Engineering & Computer Science
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Manufacturing & Machinery
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Computer Hardware Design
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Microelectronics & Electronic Packaging
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Power Engineering
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Dot-Matrix Printers And Others
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Printers Or Recording Devices Using Electromagnetic And Radiation Means
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