JPH01104070U - - Google Patents
Info
- Publication number
- JPH01104070U JPH01104070U JP19665387U JP19665387U JPH01104070U JP H01104070 U JPH01104070 U JP H01104070U JP 19665387 U JP19665387 U JP 19665387U JP 19665387 U JP19665387 U JP 19665387U JP H01104070 U JPH01104070 U JP H01104070U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- solder
- flow
- chip components
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19665387U JPH01104070U (enExample) | 1987-12-26 | 1987-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19665387U JPH01104070U (enExample) | 1987-12-26 | 1987-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104070U true JPH01104070U (enExample) | 1989-07-13 |
Family
ID=31487253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19665387U Pending JPH01104070U (enExample) | 1987-12-26 | 1987-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104070U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051670A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 実装基板、およびその実装方法 |
-
1987
- 1987-12-26 JP JP19665387U patent/JPH01104070U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051670A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 実装基板、およびその実装方法 |
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