JPH01104031U - - Google Patents
Info
- Publication number
- JPH01104031U JPH01104031U JP1987198978U JP19897887U JPH01104031U JP H01104031 U JPH01104031 U JP H01104031U JP 1987198978 U JP1987198978 U JP 1987198978U JP 19897887 U JP19897887 U JP 19897887U JP H01104031 U JPH01104031 U JP H01104031U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- film carrier
- curvature
- radius
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198978U JPH01104031U (US07413550-20080819-C00001.png) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198978U JPH01104031U (US07413550-20080819-C00001.png) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104031U true JPH01104031U (US07413550-20080819-C00001.png) | 1989-07-13 |
Family
ID=31489453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987198978U Pending JPH01104031U (US07413550-20080819-C00001.png) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104031U (US07413550-20080819-C00001.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113339A (en) * | 1979-02-22 | 1980-09-01 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor integrated circuit device |
| JPS5762550A (en) * | 1980-10-01 | 1982-04-15 | Nec Corp | Semiconductor device |
-
1987
- 1987-12-25 JP JP1987198978U patent/JPH01104031U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113339A (en) * | 1979-02-22 | 1980-09-01 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor integrated circuit device |
| JPS5762550A (en) * | 1980-10-01 | 1982-04-15 | Nec Corp | Semiconductor device |
