JPH01103235A - Laser beam shrink fitting - Google Patents

Laser beam shrink fitting

Info

Publication number
JPH01103235A
JPH01103235A JP25959687A JP25959687A JPH01103235A JP H01103235 A JPH01103235 A JP H01103235A JP 25959687 A JP25959687 A JP 25959687A JP 25959687 A JP25959687 A JP 25959687A JP H01103235 A JPH01103235 A JP H01103235A
Authority
JP
Japan
Prior art keywords
fitting
laser beam
shrink
laser
shrink fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25959687A
Other languages
Japanese (ja)
Inventor
Seiichiro Kimura
盛一郎 木村
Kiyoshi Yamada
清 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP25959687A priority Critical patent/JPH01103235A/en
Publication of JPH01103235A publication Critical patent/JPH01103235A/en
Pending legal-status Critical Current

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  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To realize shrink fitting with high precision by locally irradiating the laser beam onto the minutely bent parts of a press part or molded part and executing shrink fitting. CONSTITUTION:When an internal part 2 is fitted into an outer part 3, the internal part 2 is inserted into the outer part 3, and the minutely bent parts 4,... are adjusted to the positions of the fitting recessed parts 5,.... Then, if necessary, a force is applied so that the minutely bent parts 4,... are shifted to the fitting recessed parts 5,... by using an auxiliary jig 6. Then, the laser beam 9 irradiated from a laser oscillator 8 by using a laser radiation device 7 is controlled by a light collecting lens 10, and irradiated onto a dividing mirror 11, and the light is divided and locally irradiated to each minutely bent part 4,.... The minutely bent parts 4,... in plastic deformation are softened by the irradiation of the laser beam 9, and spread outside by the return force, and automatically fitted into the fitting recessed parts 5,..., and shrink fitting is completed. Since, the heating for the whole of the part is suppressed, thermal deformation and the generation of strain are prevented, and shrink fitting with high precision is permitted.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) この発明は、例えばプレス部品や成型部品の微小曲げ部
分のレーザ焼ばめ方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for laser shrink-fitting a minutely bent portion of, for example, a press part or a molded part.

(従来の技術) 従来、プレス部品や成型部品等では、外部部品に対して
内部部品を焼ばめする場合、高周波加熱あるいはバーナ
による焼ばめ方法を採用し、内部部品の外周全体を加熱
膨部させて外部部品と強固に嵌合するようにしている。
(Conventional technology) Conventionally, when shrink-fitting an internal part to an external part for press parts, molded parts, etc., a shrink-fitting method using high-frequency heating or a burner is used to heat and expand the entire outer periphery of the internal part. This allows for a secure fit with external parts.

しかしながら、このような高周波加熱による焼ばめ方法
では、部材が焼き入れ部品であるときには焼き入れ硬度
が低下したり、全体を加熱するために歪みが発生したり
する問題点があった。
However, such a shrink fitting method using high-frequency heating has the problem that when the member is a hardened part, the hardness of the hardened part decreases, and distortion occurs due to heating the whole part.

また、従来はプレス部品や成型部品の一部に微小曲げ部
分を形成しておき、この微小曲げ部分を高周波あるいは
バーナ等で加熱して焼ばめする方法も採っていたが、こ
の方法でも、加熱時間がかかるため加熱される部品の全
体の温度が上昇し、熱変形、硬度変化が生じ、高精度の
焼ばめが実現できない問題点があった。
Additionally, in the past, a method was used in which a minute bend was formed in a part of a press part or a molded part, and the minute bend was heated with a high frequency or a burner to shrink-fit, but even with this method, Because it takes time to heat up, the overall temperature of the heated parts rises, causing thermal deformation and changes in hardness, making it impossible to achieve high-precision shrink fitting.

(発明が解決しようとする問題点) このように従来の焼ばめ方法では、部品の変形、硬度変
化、歪みの発生が苦しく、高精度の焼ばめができない問
題点があった。
(Problems to be Solved by the Invention) As described above, the conventional shrink fitting method has problems in that it is difficult to deform parts, change hardness, and cause distortion, making it impossible to perform highly accurate shrink fitting.

この発明は、このような従来の問題点に鑑みなされたも
ので、プレス部品や成型部品の微小曲げ部分に局所的に
レーザビームを照射して焼ばめすることにより、高精度
の焼ばめが実現できるレーザ焼ばめ方法を提供すること
を目的とする。
This invention was made in view of these conventional problems, and it achieves highly accurate shrink fitting by locally irradiating a laser beam to the micro-bending portions of pressed parts and molded parts to perform shrink fitting. The purpose of the present invention is to provide a laser shrink fitting method that can realize the following.

[発明の構成J (問題点を解決するための手段) この発明のレーザ焼ばめ方法は、外部部品又は内部部品
の一方に微小曲げ部分を形成し、前記外部部品に対して
内部部品を嵌め込むととも、前記微小曲げ部分にレーザ
ビームを照射して曲げを若干伸展させ、もしくは押し曲
げて焼ばめするものである。
[Structure J of the Invention (Means for Solving Problems) The laser shrink fitting method of the present invention involves forming a minute bending portion in one of an external component or an internal component, and fitting the internal component to the external component. At the same time, the micro-bending portion is irradiated with a laser beam to slightly extend the bending portion, or the portion is pressed and bent for shrink-fitting.

また、この発明のレーザ焼ばめ方法では、前記微小曲げ
部分に対するレーザ照射の際、微小曲げ部分を焼ばめす
る方向に治具によr)Il械的な力を加えることにより
、より確実に焼ばめを行なうことができる。
In addition, in the laser shrink fitting method of the present invention, when laser irradiation is applied to the micro-bending portion, mechanical force is applied to the jig in the direction of shrink-fitting the micro-bending portion, thereby making it more reliable. Shrink fit can be performed.

(実施例) 以下、この発明の実施例を図を参照しながら詳説する。(Example) Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings.

第1図はこの発明の一実施例を使用するレーザ焼ばめ装
置1を示しており、プレス部品のような内部部品2が外
部部品3に対して嵌め込まれている。内部部品2の側面
の一部には、焼ばめのための微小曲げ部分4,4.・・
・が形成されている。そして、外部部品3には、前記微
小曲げ部分4,4゜・・・と対応する位置に穴又は講の
ような嵌合凹部5゜5、・・・が形成されている。
FIG. 1 shows a laser shrink fitting apparatus 1 using an embodiment of the invention, in which an internal part 2, such as a pressed part, is fitted onto an external part 3. A portion of the side surface of the internal component 2 has minute bending portions 4, 4 . for shrink fitting.・・・
・is formed. In the external component 3, fitting recesses 5.degree. 5, .

この実施例の場合、さらに微小曲げ部分4,4゜・・・
を嵌合凹部5,5.・・・に確実に嵌まり込ませるため
に補助治具6を用いており、この補助治具6を押さえる
ことにより各微小曲げ部分4が嵌合凹部5の方向に移動
するようになっている。
In the case of this embodiment, there are further minute bending portions 4, 4°...
the fitting recesses 5, 5. An auxiliary jig 6 is used to securely fit into the fitting recess 5. By pressing the auxiliary jig 6, each minute bent portion 4 moves in the direction of the fitting recess 5. .

焼ばめのために使用するレーザ照射装置7は、例えば1
kWCO,レーザを用い、レーザ発振器8から出てくる
レーザビーム9を集光レンズ10により集光し、分割ミ
ラー11により各微小曲げ部分4,4.・・・に照射す
るように分光する。
The laser irradiation device 7 used for shrink fitting is, for example, 1
Using a kWCO laser, a laser beam 9 emitted from a laser oscillator 8 is focused by a condensing lens 10, and a splitting mirror 11 is used to collect each micro-bending portion 4, 4 . Splits the light so that it irradiates...

この分割ミラー11は、この実施例の場合、4つの方向
に分光するため四角錐形状をしている。
In this embodiment, the splitting mirror 11 has a quadrangular pyramid shape in order to separate light into four directions.

従って、内部部品2を外部部品3に嵌め込むに際しては
、まず内部部品2を外部部品3内に挿入し、微小曲げ部
分4,4.・・・を嵌合凹部5,5゜・・・の位置に合
わせる。続いて、必要に応じて、補助治具6を用い各微
小曲げ部分4,4.・・・を嵌合凹部5,5.・・・側
に移動するように力を加えておく。
Therefore, when fitting the internal component 2 into the external component 3, the internal component 2 is first inserted into the external component 3, and the minutely bent portions 4, 4. ... to the position of the fitting recess 5, 5°... Subsequently, each micro-bending portion 4, 4 . ... into the fitting recesses 5, 5. ...Apply force to move it to the side.

続いて、レーザ照射装置7を用い、レーザ発振器8から
出てくるレーザビーム9を集光レンズ10により集光し
て分割ミラー11に照射し、ここで分光して各微小曲げ
部分4,4.・・・に局所的に照射する。
Next, using the laser irradiation device 7, the laser beam 9 emitted from the laser oscillator 8 is focused by the condensing lens 10 and irradiated onto the splitting mirror 11, where it is separated and separated into the respective micro-bending portions 4, 4, . ...is locally irradiated.

このレーザビーム9の照射により、塑性変形していた微
小曲げ部分4,4.・・・が軟化して元に戻る力によっ
て外側に拡がり、嵌合凹部5,5.・・・に自動的に嵌
り込み、焼ばめが完了する。
Due to the irradiation with this laser beam 9, the minutely bent portions 4, 4, which had been plastically deformed. ... expands outward due to the force of softening and returning to its original state, and the fitting recesses 5, 5. It will automatically fit into ... and the shrink fit will be completed.

この焼ばめの際、補助治具6を使用するならば、各微小
曲げ部分4,4.・・・はさらに外部に拡げられ、焼ば
めが一層強固なものにできる。
If the auxiliary jig 6 is used during this shrink fitting, each small bent portion 4, 4. ...is further expanded to the outside, making the shrink fit even stronger.

ここで、内部部品2が焼き入れ鋼の場合でも、レーザビ
ーム9による照射は短時間であり、局所的な照射なので
、全体的な温度上昇がなくて冷却時間も速いため、硬度
の低下や熱変形も生じない。
Here, even if the internal parts 2 are made of hardened steel, the irradiation by the laser beam 9 is short and local, so there is no overall temperature rise and the cooling time is fast, so there is no decrease in hardness or heat No deformation occurs.

さらに、外部部品3については、まったく加熱がなされ
ないため、その変形が生じず、精度の高い焼ばめが実現
できるのである。
Furthermore, since the external component 3 is not heated at all, no deformation occurs and a highly accurate shrink fit can be achieved.

第2図はこの発明の他の実施例を示しており、補助治具
6を用いることなく外部部品3に対して内部部品2を焼
ばめする実施例を示している。この場合には、レーザビ
ーム9の照射により、塑性変形していた微小曲げ部分4
,4.・・・が熱膨張により元の形に戻ろうとして外に
拡がり、嵌合凹部5.5.・・・に自分で嵌まり込み、
焼ばめできる。
FIG. 2 shows another embodiment of the present invention, in which the inner part 2 is shrink-fitted to the outer part 3 without using the auxiliary jig 6. In this case, the minute bending portion 4 that has been plastically deformed due to the irradiation with the laser beam 9
,4. ... tries to return to its original shape due to thermal expansion and expands outward, causing the fitting recess 5.5. I got caught up in...
Can be shrink fit.

第3図はさらに池の実施例を示しており、外部部品3に
嵌合凹部5,5.・・・を設けず、塑性変形している各
微小曲げ部分4,4.・・・にレーザビーム9を照射す
ることにより、各微小曲げ部分4゜4、・・・が外側に
拡がろうとする力により外部部品3の内側面と強固に密
着し、焼ばめできるのである。
FIG. 3 further shows an embodiment of the pond, in which the external part 3 has fitting recesses 5, 5. ... is not provided, and each micro-bending portion 4, 4. is plastically deformed. By irradiating the laser beam 9 on ..., each micro-bending portion 4゜4, ... is firmly attached to the inner surface of the external component 3 due to the force of expanding outward, and shrink fitting can be achieved. be.

第4図は、内部部品2の微小曲げ部分4,4゜・・・を
外部部品3の穴で構成されている嵌合凹部5゜5、・・
・に焼ばめするに際し、レーザビーム9の照射を外側か
ら行なう実施例を示したものである。
FIG. 4 shows the micro-bending portions 4, 4°... of the internal part 2 and the fitting recesses 5°5, . . . formed by holes in the external part 3.
・This shows an embodiment in which the laser beam 9 is irradiated from the outside when shrink-fitting.

このように外側からレーザビーム9の照射を行なっても
、各微小曲げ部分4,4.・・・が局所的に加熱されて
元に戻ろうとして外側に拡がり、嵌合凹部5,5.・・
・と強固に嵌まり合うのである。
Even if the laser beam 9 is irradiated from the outside in this way, each minute bending portion 4, 4. ... is locally heated and tries to return to its original state and spreads outward, causing the fitting recesses 5, 5 .・・・
・They fit tightly together.

第5図はさらに他の実施例を示しており、内部部品21
F!Iに嵌合凹部5,5.・・・を設け、外部部品3側
に微小曲げ部分4,4.・・・を設け、レーザビーム9
を外側から各微小曲げ部分4,4.・・・に照射しなが
ら補助治具12により各微小曲げ部分4゜4、・・・を
嵌合凹部5,5.・・・に押し込むようして焼ばめする
のである。
FIG. 5 shows still another embodiment, in which internal parts 21
F! I have fitting recesses 5, 5. ... are provided, and minute bending portions 4, 4... are provided on the external component 3 side. ..., and the laser beam 9
from the outside to each micro-bending portion 4, 4. . . while irradiating each minute bent portion 4° 4, . It is shrink-fitted by pushing it into...

尚、13は補助治具12が微小曲げ部分4を押し込むた
めの力を付勢するスプリングである。
Incidentally, reference numeral 13 denotes a spring that applies a force for the auxiliary jig 12 to press into the minutely bent portion 4.

(具体例) 第1図に示す装置1を用いて行なったレーザ焼ばめ方法
の具体例を、次に説明する。
(Specific Example) Next, a specific example of the laser shrink fitting method performed using the apparatus 1 shown in FIG. 1 will be described.

レーザビーム9に1kWのCO2レーザを用い、集光レ
ンズ10として焦点距離が15インチものを使用した9
分割ミラー11は、銅製のダイヤモンド切削ミラーを採
用した。
A 1kW CO2 laser was used as the laser beam 9, and a 15-inch focal length was used as the condenser lens 9.
As the divided mirror 11, a copper diamond-cut mirror was adopted.

内部部品2は焼き入れ鋼でRc60の硬さを持つもので
、微小曲げ部分4,4.・・・の部分は機械的に戻す方
向に変形させることのできないものである。外部部品3
も同様の硬さを持つ部品であり、嵌合凹部5.5.・・
・を形成したものを用いた。
The internal part 2 is made of hardened steel and has a hardness of Rc60, and has minute bending parts 4, 4. . . . cannot be mechanically deformed in the direction of return. External parts 3
are parts with similar hardness, and the fitting recesses 5.5.・・・
・ was used.

レーザビーム9の各微小曲げ部分4.4.・・・に照射
するスポットは約3IIll〜41111とし、250
Wの強さに制御した。
Each minute bending portion of the laser beam 9 4.4. The spot to be irradiated is approximately 3IIll to 41111, and 250
Controlled to the strength of W.

微小曲げ部分4,4.・・・め温度が約400℃〜15
00℃まで上昇することにより塑性変形された部分が外
側に拡がり、嵌合凹部5,5.・・・に嵌まり込んだ、
この各微小曲げ部分4,4.・・・の拡がりを助けるた
めに補助治具6を用いた。
Micro-bending portion 4, 4. ...The temperature is about 400℃~15
As the temperature rises to 00°C, the plastically deformed portion expands outward, forming the fitting recesses 5, 5. I got stuck in...
These minute bending portions 4, 4. An auxiliary jig 6 was used to help spread...

焼ばめの完了後は、レーザ特有の自冷効果により急冷さ
れ、微小曲げ部分4,4.・・・の硬度の低下はほとん
ど見られず、強固に焼ばめできた。
After the shrink fit is completed, the small bent portions 4, 4 are rapidly cooled by the self-cooling effect unique to the laser. There was almost no decrease in hardness, and a strong shrink fit was achieved.

[発明の効果j 以上のようにこの発明によれば、レーザビームにより微
小曲げ部分を照射して塑性変型部分を軟化させ、相手部
品に密着させるため、硬度の低下を来すことなく強固な
焼ばめができる。しかも、レーザビームの局所的な照射
であるため、部品全体が加熱されることがなく、熱変形
、歪みを起こさせることなく精度の高い焼ばめができる
[Effects of the Invention j As described above, according to the present invention, the micro-bending portion is irradiated with a laser beam to soften the plastically deformed portion and bring it into close contact with the mating part. A fit is possible. Moreover, since the laser beam is applied locally, the entire part is not heated, and highly accurate shrink fitting can be achieved without causing thermal deformation or distortion.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例に使用する焼ばめ装置を示
す一部切欠せる斜視図、第2図はこの発明の他の実施例
を示す一部切欠せる斜視図、第3図はこの発明のさらに
他の実線例の一部切欠せる斜視図、第4図はさらに他の
実施例の一部切欠せる斜視図、第5図はまたさらに他の
実施例の一部切欠せる斜視図である。
FIG. 1 is a partially cutaway perspective view showing a shrink fitting device used in one embodiment of the present invention, FIG. 2 is a partially cutaway perspective view showing another embodiment of the present invention, and FIG. FIG. 4 is a partially cutaway perspective view of still another solid line embodiment of the present invention; FIG. 5 is a partially cutaway perspective view of yet another embodiment; FIG. It is.

Claims (2)

【特許請求の範囲】[Claims] (1)外部部品又は内部部品の一方に微小曲げ部分を形
成し、前記外部部品に対して内部部品を嵌め込むととも
に、前記微小曲げ部分にレーザビームを照射して曲げを
若干伸展させ、もしくは押し曲げて焼ばめすることを特
徴とするレーザ焼ばめ方法。
(1) Form a minute bend in either the external component or the internal component, fit the internal component into the external component, and irradiate the minute bend with a laser beam to slightly extend or push the bend. A laser shrink fit method characterized by bending and shrink fitting.
(2)前記微小曲げ部分に対するレーザ照射の際、微小
曲げ部分を焼ばめする方向に治具により機械的な力を加
えることを特徴とする特許請求の範囲第1項に記載のレ
ーザ焼ばめ方法。
(2) Laser shrinkage according to claim 1, characterized in that when laser irradiation is applied to the minutely bent portion, mechanical force is applied by a jig in a direction to shrink fit the minutely bent portion. method.
JP25959687A 1987-10-16 1987-10-16 Laser beam shrink fitting Pending JPH01103235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25959687A JPH01103235A (en) 1987-10-16 1987-10-16 Laser beam shrink fitting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25959687A JPH01103235A (en) 1987-10-16 1987-10-16 Laser beam shrink fitting

Publications (1)

Publication Number Publication Date
JPH01103235A true JPH01103235A (en) 1989-04-20

Family

ID=17336303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25959687A Pending JPH01103235A (en) 1987-10-16 1987-10-16 Laser beam shrink fitting

Country Status (1)

Country Link
JP (1) JPH01103235A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304253B2 (en) 2004-07-22 2007-12-04 Samsung Electronics Co., Ltd. Switching device of an image recording and replaying apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304253B2 (en) 2004-07-22 2007-12-04 Samsung Electronics Co., Ltd. Switching device of an image recording and replaying apparatus

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