JPH01102060A - High-stability maleimide composition for heat-resistant resin - Google Patents
High-stability maleimide composition for heat-resistant resinInfo
- Publication number
- JPH01102060A JPH01102060A JP25959487A JP25959487A JPH01102060A JP H01102060 A JPH01102060 A JP H01102060A JP 25959487 A JP25959487 A JP 25959487A JP 25959487 A JP25959487 A JP 25959487A JP H01102060 A JPH01102060 A JP H01102060A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- maleimide
- weight
- heat
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract description 32
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 title description 15
- 229920006015 heat resistant resin Polymers 0.000 title description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims abstract description 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims abstract description 4
- 125000005843 halogen group Chemical group 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- 239000003223 protective agent Substances 0.000 claims description 7
- 239000003945 anionic surfactant Substances 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- -1 N-substituted maleimide Chemical class 0.000 abstract description 44
- 239000000084 colloidal system Substances 0.000 abstract description 7
- 238000003860 storage Methods 0.000 abstract description 7
- 229920000642 polymer Polymers 0.000 abstract description 6
- 239000004094 surface-active agent Substances 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 4
- 239000000839 emulsion Substances 0.000 abstract description 4
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- 238000007334 copolymerization reaction Methods 0.000 abstract description 3
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 abstract description 2
- 239000003093 cationic surfactant Substances 0.000 abstract description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 abstract description 2
- 238000010557 suspension polymerization reaction Methods 0.000 abstract description 2
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 9
- 229920000056 polyoxyethylene ether Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229940051841 polyoxyethylene ether Drugs 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- YBCOMRLISIAZIY-UHFFFAOYSA-N 1-benzyl-3-chloropyrrole-2,5-dione Chemical compound O=C1C(Cl)=CC(=O)N1CC1=CC=CC=C1 YBCOMRLISIAZIY-UHFFFAOYSA-N 0.000 description 1
- KOQFJKQRPZRORH-UHFFFAOYSA-N 1-benzyl-3-methylpyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1CC1=CC=CC=C1 KOQFJKQRPZRORH-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- XXLSBWLCDXNJAQ-UHFFFAOYSA-N 1-cyclohexyl-3-methylpyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1CCCCC1 XXLSBWLCDXNJAQ-UHFFFAOYSA-N 0.000 description 1
- FDAOHAAJGZHMKN-UHFFFAOYSA-N 1-ethyl-3-hexylpyrrole-2,5-dione Chemical compound CCCCCCC1=CC(=O)N(CC)C1=O FDAOHAAJGZHMKN-UHFFFAOYSA-N 0.000 description 1
- CYAVCUNFWUJTHY-UHFFFAOYSA-N 1-ethyl-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(CC)C(=O)C=C1C1=CC=CC=C1 CYAVCUNFWUJTHY-UHFFFAOYSA-N 0.000 description 1
- QKMBVFKXQWIKOZ-UHFFFAOYSA-N 1-hexadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCN1C(=O)C=CC1=O QKMBVFKXQWIKOZ-UHFFFAOYSA-N 0.000 description 1
- HOLZCMFSCBLOLX-UHFFFAOYSA-N 1-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O HOLZCMFSCBLOLX-UHFFFAOYSA-N 0.000 description 1
- KIKBJYQCJJXCBZ-UHFFFAOYSA-N 1-octylpyrrole-2,5-dione Chemical compound CCCCCCCCN1C(=O)C=CC1=O KIKBJYQCJJXCBZ-UHFFFAOYSA-N 0.000 description 1
- CZUQOPAKOZMIPQ-UHFFFAOYSA-N 1-pentylpyrrole-2,5-dione Chemical compound CCCCCN1C(=O)C=CC1=O CZUQOPAKOZMIPQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- FDQMDCGTDRRHJO-UHFFFAOYSA-N 1-tetradecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCN1C(=O)C=CC1=O FDQMDCGTDRRHJO-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SAXLYHBASQFYJK-UHFFFAOYSA-N 3-benzyl-1-methylpyrrole-2,5-dione Chemical compound O=C1N(C)C(=O)C=C1CC1=CC=CC=C1 SAXLYHBASQFYJK-UHFFFAOYSA-N 0.000 description 1
- CFIVFZRAYHMUOH-UHFFFAOYSA-N 3-bromo-1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C(Br)=CC(=O)N1C1CCCCC1 CFIVFZRAYHMUOH-UHFFFAOYSA-N 0.000 description 1
- UFUQBRMYERTCQH-UHFFFAOYSA-N 3-bromo-1-methylpyrrole-2,5-dione Chemical compound CN1C(=O)C=C(Br)C1=O UFUQBRMYERTCQH-UHFFFAOYSA-N 0.000 description 1
- PITPMXOIFIFPHF-UHFFFAOYSA-N 3-chloro-1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C(Cl)=CC(=O)N1C1CCCCC1 PITPMXOIFIFPHF-UHFFFAOYSA-N 0.000 description 1
- VCJAXUAZKWUPSH-UHFFFAOYSA-N 3-chloro-1-methylpyrrole-2,5-dione Chemical compound CN1C(=O)C=C(Cl)C1=O VCJAXUAZKWUPSH-UHFFFAOYSA-N 0.000 description 1
- OJFAUFIUKJGVOF-UHFFFAOYSA-N 3-chloropyrrole-2,5-dione Chemical compound ClC1=CC(=O)NC1=O OJFAUFIUKJGVOF-UHFFFAOYSA-N 0.000 description 1
- GUHKPMIZBDIPIT-UHFFFAOYSA-N 3-fluoro-1-methylpyrrole-2,5-dione Chemical compound CN1C(=O)C=C(F)C1=O GUHKPMIZBDIPIT-UHFFFAOYSA-N 0.000 description 1
- QAVUFFJVZGZJMO-UHFFFAOYSA-N 3-methyl-1-phenylpyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1=CC=CC=C1 QAVUFFJVZGZJMO-UHFFFAOYSA-N 0.000 description 1
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical class OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008055 alkyl aryl sulfonates Chemical class 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000001687 destabilization Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 230000000051 modifying effect Effects 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 102000004196 processed proteins & peptides Human genes 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229940080236 sodium cetyl sulfate Drugs 0.000 description 1
- GGHPAKFFUZUEKL-UHFFFAOYSA-M sodium;hexadecyl sulfate Chemical compound [Na+].CCCCCCCCCCCCCCCCOS([O-])(=O)=O GGHPAKFFUZUEKL-UHFFFAOYSA-M 0.000 description 1
- YWPOLRBWRRKLMW-UHFFFAOYSA-M sodium;naphthalene-2-sulfonate Chemical compound [Na+].C1=CC=CC2=CC(S(=O)(=O)[O-])=CC=C21 YWPOLRBWRRKLMW-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は耐熱樹脂の製造にあたり、使用し得るマレイミ
ド組成物に関し、更に詳細には貯蔵安定性に優れ、ポン
プ輸送が可能であり、また、エチレン性不飽和単量体の
乳化及び懸濁重合の際に共重合可能なマレイミドとして
N−置換マレイミドを含む耐熱樹脂用高安定性マレイミ
ド組成物に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a maleimide composition that can be used in the production of heat-resistant resins, and more specifically, a maleimide composition that has excellent storage stability, can be transported by pump, and The present invention relates to a highly stable maleimide composition for heat-resistant resins containing an N-substituted maleimide as a copolymerizable maleimide during emulsion and suspension polymerization of ethylenically unsaturated monomers.
〈従来の技術およびその問題点〉
N−置換マレイミドは一般に常温で固体であるため、従
来、粉体、含水粉体又はフレーク状態等にて用いられて
いる。しかしながら、作業時において、N−置換マレイ
ミドが粉体であることは。<Prior art and its problems> Since N-substituted maleimide is generally solid at room temperature, it has conventionally been used in the form of powder, water-containing powder, or flakes. However, during operation, the N-substituted maleimide is a powder.
計量及び仕込みの際1作業工数を増し、作業性を悪化さ
せる原因となる。またN−置換マレイミドは、一般に昇
華性を有しているので衛生的にも欠点がある。これ等の
欠点を解決するために、例え゛ば特開昭54−3015
7号公報において、マレイミドの水性懸濁液が開示され
ている。This increases the number of man-hours required for weighing and preparing, and causes a deterioration in work efficiency. Furthermore, since N-substituted maleimides generally have sublimation properties, they are also disadvantageous in terms of hygiene. In order to solve these drawbacks, for example, JP-A-54-3015
No. 7 discloses an aqueous suspension of maleimide.
しかしながら、前記マレイミドの水性懸濁液は、貯蔵安
定性が不十分であること、またカチオン系界面活性剤を
重合系内に含有しているために、乳化系及び懸濁系を不
安定にし、その系を破壊する可能性があること、更に第
4級アンモニウム塩及びアミン類は、ラジカル重合開始
剤であるペルオキシドを急激にイオン分解してしまうば
かりでなく、重合体の耐熱性及び電気的性質等を著しく
低下させる可能性があること、更にまた分散させるマレ
イミド化合物の粒径を5μm以下に限定する必要がある
こと等、多くの欠点がいまだ未解決である。However, the aqueous suspension of maleimide has insufficient storage stability and contains a cationic surfactant in the polymerization system, which makes the emulsion system and suspension system unstable. In addition, quaternary ammonium salts and amines not only rapidly ionically decompose peroxide, which is a radical polymerization initiator, but also affect the heat resistance and electrical properties of the polymer. There are still many unresolved drawbacks, such as the possibility of significantly reducing the particle size of the maleimide compound to be dispersed, and the need to limit the particle size of the maleimide compound to be dispersed to 5 μm or less.
〈発明の目的〉
本発明の目的は、貯蔵安定性に優れ、計量、仕込み作業
及び輸送、特にポンプ輸送に好適な耐熱樹脂用高安定性
マレイミド組成物を提供することである。<Objective of the Invention> An object of the present invention is to provide a highly stable maleimide composition for heat-resistant resins that has excellent storage stability and is suitable for measuring, preparation work, and transportation, especially pump transportation.
本発明の別の目的は1重合系内を安定化し、生成重合体
の物性低下を防止する耐熱樹脂用高安定性マレイミド組
成物を提供することである。Another object of the present invention is to provide a highly stable maleimide composition for heat-resistant resins that stabilizes the polymerization system and prevents deterioration of the physical properties of the resulting polymer.
〈問題点を解決するための手段〉
(a)下記一般式(1)
(式中R1,R,は夫々水素原子、ハロゲン原子又はメ
チル基を表わし、R3は炭素数1〜18の無置換又はハ
ロゲン置換直鎖アルキル基1分岐アルキル基、シクロア
ルキル基、アリール基又はアラルキル基を表わす。)
で示されるN−置換マレイミド5〜60重量%と(b)
陰イオン系界面活性剤及び/又は非イオン系界面活性剤
0.1〜20重量%と(C)コロイド保護剤0.1〜5
重量%と(d)水15〜94.8重量%とを含有してな
る耐熱樹脂用高安定性マレイミド組成物が提供される。<Means for solving the problem> (a) The following general formula (1) (wherein R1 and R each represent a hydrogen atom, a halogen atom, or a methyl group, and R3 is an unsubstituted or unsubstituted group having 1 to 18 carbon atoms. 5 to 60% by weight of an N-substituted maleimide represented by a halogen-substituted straight-chain alkyl group, a mono-branched alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; and (b)
Anionic surfactant and/or nonionic surfactant 0.1-20% by weight and (C) colloid protectant 0.1-5%
(d) 15 to 94.8% by weight of water.
以下本発明を更に詳細に説明する。The present invention will be explained in more detail below.
本発明に用いる一般式(1>
鶴
〇
中R1,Rイは夫々水素原子、ハロゲン原子又はメチル
基を表わし、R3は炭素数1〜18の無置換又はハロゲ
ン置換直鎖アルキル基1分岐アルキル基、シクロアルキ
ル基、アリール基又はアラルキル基を表わす、前記R3
の炭素数が19以上の際は、製造が困難であるため使用
することができなL’s
本発明に用いる前記一般式(I)に示されるN−m+換
ママレイミドしては1例えば、N−メチルマレイミド、
N−エチルマレイミド、N−n−プロピルマレイミド、
i’J−n−ブチルマレイミド。General formula used in the present invention (1> R1 and R in the crane 〇 each represent a hydrogen atom, a halogen atom, or a methyl group, and R3 is an unsubstituted or halogen-substituted linear alkyl group having 1 to 18 carbon atoms, a monobranched alkyl group , the above R3 represents a cycloalkyl group, an aryl group or an aralkyl group
When the carbon number of L's is 19 or more, it cannot be used because it is difficult to manufacture. - methylmaleimide,
N-ethylmaleimide, N-n-propylmaleimide,
i'J-n-butylmaleimide.
N−1−ブチルマレイミド、N−n−ペンチルマレイミ
ド、M−n−へキシルマレイミド、N−シクロヘキシル
マレイミド、N−n−へブチルマレイミド、N−n−オ
クチルマレイミド、N−2−エチルへキシルマレイミド
、N−n−ドデシルマレイミド、N−ラウリルマレイミ
ド、N−ミリスチルマレイミド、N−ヘキサデシルマレ
イミド。N-1-butylmaleimide, N-pentylmaleimide, M-n-hexylmaleimide, N-cyclohexylmaleimide, N-n-hebutylmaleimide, N-n-octylmaleimide, N-2-ethylhexylmaleimide , N-n-dodecylmaleimide, N-laurylmaleimide, N-myristylmaleimide, N-hexadecylmaleimide.
N−オクタデシルマレイミド、N−フェニルマレイミド
、N−(2−メチル)フェニルマレイミド。N-octadecylmaleimide, N-phenylmaleimide, N-(2-methyl)phenylmaleimide.
N−(3−メチル)フェニルマレイミド、N−(4−メ
チル)フェニルマレイミド、N−(2−エチル)フェニ
ルマレイミド、N−(2−クロロ)フェニルマレイミド
、N−(3−クロロ)フェニルマレイミド、N−(4−
クロロ)フェニルマレイミド、N−(2,4−ジクロロ
)フェニルマレイミド、N−(2−ブロモ)フェニルマ
レイミド、N−(2−フルオロ)フェニルマレイミド、
N−ベンジルマレイミド、N−メチルベンジルマレイミ
ド、N−メチル−α−クロロマレイミド、N−メチル−
α−ブロモマレイミド、N−メチル−α−フルオロマレ
イミド、N−シクロヘキシル−α−クロロマレイミド、
N−シクロヘキシル−α−ブロモマレイミド、N−シク
ロヘキシル−α、β−ジクロロマレイミド、N−シクロ
ヘキシル−α−メチルマレイミド、N−フェニル−α−
クロロマレイミド、N−フェニル−α−メチルマレイミ
ド、N−ベンジル−α−クロロマレイミド、N−ベンジ
ル−α−メチルマレイミド等を好ましく挙げることがで
きる。N−置換マレイミドは単体で用いても、また2種
以上の混合物として用いてもよい。N-(3-methyl)phenylmaleimide, N-(4-methyl)phenylmaleimide, N-(2-ethyl)phenylmaleimide, N-(2-chloro)phenylmaleimide, N-(3-chloro)phenylmaleimide, N-(4-
chloro)phenylmaleimide, N-(2,4-dichloro)phenylmaleimide, N-(2-bromo)phenylmaleimide, N-(2-fluoro)phenylmaleimide,
N-benzylmaleimide, N-methylbenzylmaleimide, N-methyl-α-chloromaleimide, N-methyl-
α-bromomaleimide, N-methyl-α-fluoromaleimide, N-cyclohexyl-α-chloromaleimide,
N-cyclohexyl-α-bromomaleimide, N-cyclohexyl-α, β-dichloromaleimide, N-cyclohexyl-α-methylmaleimide, N-phenyl-α-
Preferred examples include chloromaleimide, N-phenyl-α-methylmaleimide, N-benzyl-α-chloromaleimide, and N-benzyl-α-methylmaleimide. N-substituted maleimide may be used alone or as a mixture of two or more.
本発明において、該N−置換マレイミドの組成物中の含
有割合は、5〜60重量%であり、特に好ましくは10
〜50重量%である。前記含有割合が5重量%未満の場
合は、共重合させる際に十分な改質作用が得られないの
で好ましくない、また前記含有割合が60重量%を超え
る場合は、粘性が著しく高くなり、取り扱いが困難とな
るので好ましくない。In the present invention, the content of the N-substituted maleimide in the composition is 5 to 60% by weight, particularly preferably 10% by weight.
~50% by weight. If the content is less than 5% by weight, a sufficient modifying effect cannot be obtained during copolymerization, which is undesirable. If the content is more than 60% by weight, the viscosity becomes extremely high, making it difficult to handle. This is not preferable because it becomes difficult.
本発明に用いる陰イオン系界面活性剤としては。Examples of anionic surfactants used in the present invention include:
例えば、オレイン酸ナトリウム、ひまし油カリセッケン
等の脂肪族塩類、N−アシルアミノ酸塩、アルキルエー
テルカルボン酸塩、アシル化ペプチド、アルキルスルホ
ン酸塩、ドデシルベンゼンスルホン酸ナトリウム等のア
ルキルアリールスルホン酸塩、アルキルナフタレンスル
ホン酸塩、ナフタレンスルホン酸塩類の誘導体、β−ナ
フタレンスルホン酸ホルマリン縮合物のナトリウム塩、
ジアルキルスルホコハク酸塩、α−オレフィンスルホン
酸塩、N−アシルスルホン酸塩、セチル硫酸ナトリウム
等の高級アルコール硫酸エステル塩類。For example, aliphatic salts such as sodium oleate and castor oil soap, N-acylamino acid salts, alkyl ether carboxylates, acylated peptides, alkyl sulfonates, alkylaryl sulfonates such as sodium dodecylbenzenesulfonate, alkylnaphthalenes, etc. sulfonate, derivatives of naphthalene sulfonate salts, sodium salt of β-naphthalene sulfonic acid formalin condensate,
Higher alcohol sulfate ester salts such as dialkyl sulfosuccinates, α-olefin sulfonates, N-acylsulfonates, and sodium cetyl sulfate.
ポリオキシエチレンアルキルエーテル硫酸塩、ポリオキ
シエチレンアルキルフェノールエーテル硫酸塩、アルキ
ルアミド硫酸塩、アルキルリン酸塩、アルキルエーテル
リン酸塩、アルキルアリルエーテルリン酸及びポリカル
ボン酸等の高分子界面活性剤等を好ましく挙げることが
でき、また非イオン系界面活性剤としては1例えばポリ
オキシエチレンステアリルエーテル等のアルキルポリオ
キシエチレンエーテル、ポリオキシエチレンノニルフェ
ノールエーテル等のアルキルアリルポリオキシエチレン
エーテル、アルキルアリルホルムアルデヒド縮合ポリオ
キシエチレンエーテル、ポリオキシプロピレンを親油基
とするブロックポリマー及びグラフトポリマー、グリセ
リンエステルのポリオキシエチレンエーテル、ソルビタ
ンモノオレエート等のソルビタンエステル、ソルビタン
エステルのポリオキシエチレンエーテル、ソルビトール
エステルのポリオキシエチレンエーテル、ポリエチレン
グリコール脂肪酸エステル、グリセリンエステル、ポリ
グリセリンエステル、プロピレングリコールエステル、
ショ糖エステル、脂肪酸アルカノールアミド、ポリオキ
シエチレン脂肪酸アミド等を好ましく挙げることができ
る。Polymer surfactants such as polyoxyethylene alkyl ether sulfates, polyoxyethylene alkylphenol ether sulfates, alkylamide sulfates, alkyl phosphates, alkyl ether phosphates, alkyl allyl ether phosphates, and polycarboxylic acids. Examples of nonionic surfactants include alkyl polyoxyethylene ethers such as polyoxyethylene stearyl ether, alkyl allyl polyoxyethylene ethers such as polyoxyethylene nonylphenol ether, and alkylaryl formaldehyde condensed polyoxy Ethylene ether, block polymers and graft polymers with polyoxypropylene as a lipophilic group, polyoxyethylene ether of glycerin ester, sorbitan ester such as sorbitan monooleate, polyoxyethylene ether of sorbitan ester, polyoxyethylene ether of sorbitol ester , polyethylene glycol fatty acid ester, glycerin ester, polyglycerin ester, propylene glycol ester,
Preferred examples include sucrose ester, fatty acid alkanolamide, polyoxyethylene fatty acid amide, and the like.
本発明において、該陰イオン系界面活性剤及び/又は該
非イオン系界面活性剤の耐熱樹脂用高安定性マレイミド
組成物中の含有割合は、0.1〜20重量%であり、特
に好ましくは0.2〜10重量%である。前記含有割合
が0.1重量%未満の場合は、N−置換マレイミドの分
散性が著しく低下するので好ましくない、また前記含有
量が20重量%を超えても分散性能が向上しないので不
経済となり好ましくない、更に該陰イオン系界面活性剤
及び/又は該非イオン系界面活性剤は、前記組成物の粘
性及び貯蔵安定性により1種又は2種以上を適宜選択す
ることができる。In the present invention, the content of the anionic surfactant and/or nonionic surfactant in the highly stable maleimide composition for heat-resistant resin is 0.1 to 20% by weight, particularly preferably 0. .2 to 10% by weight. If the content is less than 0.1% by weight, the dispersibility of the N-substituted maleimide will be markedly reduced, which is undesirable, and if the content exceeds 20% by weight, the dispersion performance will not improve, making it uneconomical. One or more of the undesirable anionic surfactants and/or nonionic surfactants can be selected depending on the viscosity and storage stability of the composition.
本発明に用いるコロイド保護剤としては、例えば、メチ
ルセルロース又はカルボキシメチルセルロース等の水溶
性セルロース誘導体、部分又は完全けん化ポリ酢酸ビニ
ル等を好ましく挙げることができる。Preferred examples of the colloid protective agent used in the present invention include water-soluble cellulose derivatives such as methylcellulose or carboxymethylcellulose, partially or completely saponified polyvinyl acetate, and the like.
本発明において、該コロイド保護剤の耐熱樹脂用高安定
性マレイミド組成物中の含有割合は。In the present invention, the content ratio of the colloidal protective agent in the highly stable maleimide composition for heat-resistant resin is as follows.
0.1〜5重量%である。前記含有割合が0.1重量%
未満の場合は、保護剤としての効果が得られないので好
ましくない、また前記含有量が5重量%を超える場合は
、前記組成物の粘性が著しく高くなり、取り扱いが困難
となるので好ましくない。It is 0.1 to 5% by weight. The content ratio is 0.1% by weight
If the content is less than 5% by weight, it is undesirable because no effect as a protective agent can be obtained, and if the content exceeds 5% by weight, the viscosity of the composition becomes extremely high, making it difficult to handle.
本発明では前記N−置換マレイミドと陰イオン系界面活
性剤及び/又は非イオン系界面活性剤とコロイド保護剤
との残部として、水を用い、該水の耐熱樹脂用高安定性
マレイミド組成物中含有割合を15〜94.8重量%と
する。In the present invention, water is used as the remainder of the N-substituted maleimide, the anionic surfactant and/or the nonionic surfactant, and the colloidal protective agent, and the water is used in the highly stable maleimide composition for heat-resistant resins. The content ratio is 15 to 94.8% by weight.
本発明において、耐熱樹脂用高安定性マレイミド組成物
の調整法としては、例えば容器中に水を所定量仕込み、
次いでコロイド保護剤、界面活性剤を混合攪拌し、分散
させる。その後N−置換マレイミドを加える等の方法に
よって調製することができる。この際の混合攪拌方法と
しては、例えば、通常の攪拌器、コロイドミル、高速せ
ん断器。In the present invention, as a method for preparing a highly stable maleimide composition for heat-resistant resin, for example, a predetermined amount of water is charged into a container,
Next, the colloid protective agent and the surfactant are mixed and stirred to be dispersed. It can be prepared by a method such as adding N-substituted maleimide after that. Examples of mixing and stirring methods at this time include a normal stirrer, a colloid mill, and a high-speed shearer.
超音波ホモジナイザー、3本ロールミル又はボールミル
等を用いることにより混合攪拌することができる。Mixing and stirring can be carried out using an ultrasonic homogenizer, a three-roll mill, a ball mill, or the like.
〈発明の効果〉
本発明の耐熱樹脂用高安定性マレイミド組成物は1次に
示すような利点を有している。第1に貯蔵安定性に優れ
た懸濁液であるので計量及び仕込み等の取り扱い及び輸
送、特にポンプ輸送に適していること、第2にカチオン
系の成分を含まないため、該組成物のまま塩化ビニル、
酢酸ビニル、スチレン、アクリル酸及びメタクリル酸と
のエステル類との懸濁及び乳化共重合用コモノマーとし
て用いることが可能であり、重合系の不安定化及び生成
重合体の物性低下を起こさないこと。以上のように本発
明により工業的に優れた耐熱樹脂用高安定性マレイミド
組成物を提供することができる。 −
〈実施例〉
次に本発明を実施例及び比較例により具体的に説明する
。但し1本発明は以下の実施例に限定されるものではな
い。<Effects of the Invention> The highly stable maleimide composition for heat-resistant resins of the present invention has the following advantages. Firstly, since it is a suspension with excellent storage stability, it is suitable for handling such as measuring and preparing, and transportation, especially pump transportation.Secondly, it does not contain cationic components, so the composition remains unchanged. vinyl chloride,
It can be used as a comonomer for suspension and emulsion copolymerization with esters of vinyl acetate, styrene, acrylic acid, and methacrylic acid, and does not cause destabilization of the polymerization system or deterioration of the physical properties of the resulting polymer. As described above, the present invention can provide an industrially excellent highly stable maleimide composition for heat-resistant resins. - <Examples> Next, the present invention will be specifically explained using Examples and Comparative Examples. However, the present invention is not limited to the following examples.
去1m
211のビーカーに水を680g仕込み、次いで「ニュ
ーレックス」R(ドデシルベンゼンスルホン酸ナトリウ
ム、日本油脂■製)をLogと「ゴーセノールJKH1
7(部分ケン化ポリ酢酸ビニル、日本合成化学工業■製
)10gを仕込みボールミルにて攪拌し分散させた。次
いで、N−シクロヘキシルマレイミドの粉末300gを
加え15分間攪拌した。この乳白色混合物を常温でボー
ルミルにより30分間均質化処理をし、N−シクロヘキ
シルマレイミド含有組成物を得た。その組成を表1に示
す。Pour 680g of water into a 1m211 beaker, then add "Newrex" R (sodium dodecylbenzenesulfonate, manufactured by NOF) to Log and "GOHSENOL JKH1".
7 (partially saponified polyvinyl acetate, manufactured by Nippon Gosei Kagaku Kogyo ■) was charged and dispersed by stirring in a ball mill. Next, 300 g of N-cyclohexylmaleimide powder was added and stirred for 15 minutes. This milky white mixture was homogenized using a ball mill at room temperature for 30 minutes to obtain an N-cyclohexylmaleimide-containing composition. Its composition is shown in Table 1.
去1」しL二ュ」工
用いたN−置換マレイミドの種類とその使用量、界面活
性剤およびコロイド保護剤の種類とその使用量、また均
質化に用いた装置を代えた以外は実施例1と同様な方法
によって、N−置換マレイミド含有組成物を製造した。Example except that the type and amount of N-substituted maleimide used, the type and amount of surfactant and colloid protectant used, and the equipment used for homogenization were changed. An N-substituted maleimide-containing composition was produced by the same method as in Example 1.
その組成を第1表に示す。Its composition is shown in Table 1.
崖豊■上二又
コロイド保護剤としての「ゴーセノールJ KH17を
用いない以外は、実施例1と同様な方法によって、N−
置換マレイミド含有組成物を製造した。その組成を第1
表に示す。N-
A substituted maleimide-containing composition was prepared. The composition is the first
Shown in the table.
崖笠舅旦
界面活性剤としてカチオン系のrカチオンBBJ(日本
油脂−社製)を用い、またコロイド保護剤を用いない以
外は実施例1と同様な方法によって。The same method as in Example 1 was used except that cationic r-cation BBJ (manufactured by NOF Corporation) was used as the Kaikakasa-Kadan surfactant and no colloid protective agent was used.
N−置換マレイミド含有組成物を製造した。その組成を
第1表に示す。An N-substituted maleimide-containing composition was prepared. Its composition is shown in Table 1.
1胤旌よ1
次に実施例1〜12により製造した本発明の組成物及び
比較例1〜3によって製造した組成物について、N−置
換マレイミドの平均粒径と粘度の測定及び貯蔵安定性試
験を下記のように行なった。Next, measurements of the average particle diameter and viscosity of N-substituted maleimide and storage stability tests were performed on the compositions of the present invention produced in Examples 1 to 12 and the compositions produced in Comparative Examples 1 to 3. was carried out as follows.
各組成物中のN−置換マレイミドの平均粒径を粒度分布
測定器(セイシン企業製、ミクロンフォートサイザー5
KC−2000型)にて測定した。The average particle size of the N-substituted maleimide in each composition was measured using a particle size distribution analyzer (Micron Fortsizer 5, manufactured by Seishin Enterprises).
KC-2000 model).
Claims (1)
はメチル基を表わし、R_3は炭素数1〜18の無置換
又はハロゲン置換直鎖アルキル基、分岐アルキル基、シ
クロアルキル基、アリール基又はアラルキル基を表わす
。) で示されるN−置換マレイミド5〜60重量%と(b)
陰イオン系界面活性剤及び/又は非イオン系界面活性剤
0.1〜20重量%と(c)コロイド保護剤0.1〜5
重量%と(d)水15〜94.8重量%とを含有してな
る耐熱樹脂用高安定性マレイミド組成物。[Claims] (a) The following general formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼... (I) (In the formula, R_1 and R_2 each represent a hydrogen atom, a halogen atom, or a methyl group, R_3 represents an unsubstituted or halogen-substituted linear alkyl group, branched alkyl group, cycloalkyl group, aryl group, or aralkyl group having 1 to 18 carbon atoms. )
0.1 to 20% by weight of anionic surfactant and/or nonionic surfactant and (c) 0.1 to 5% of colloidal protective agent.
% by weight and (d) 15 to 94.8% by weight of water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62259594A JPH0780844B2 (en) | 1987-10-16 | 1987-10-16 | Highly stable maleimide composition for heat resistant resins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62259594A JPH0780844B2 (en) | 1987-10-16 | 1987-10-16 | Highly stable maleimide composition for heat resistant resins |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01102060A true JPH01102060A (en) | 1989-04-19 |
JPH0780844B2 JPH0780844B2 (en) | 1995-08-30 |
Family
ID=17336276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62259594A Expired - Fee Related JPH0780844B2 (en) | 1987-10-16 | 1987-10-16 | Highly stable maleimide composition for heat resistant resins |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0780844B2 (en) |
Cited By (1)
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---|---|---|---|---|
WO2023120581A1 (en) * | 2021-12-22 | 2023-06-29 | 東ソー株式会社 | Method for producing polymer, and resin composition |
-
1987
- 1987-10-16 JP JP62259594A patent/JPH0780844B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023120581A1 (en) * | 2021-12-22 | 2023-06-29 | 東ソー株式会社 | Method for producing polymer, and resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPH0780844B2 (en) | 1995-08-30 |
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