JPH01101366A - Polyphenylene sulfide resin composition for sealing electronic part - Google Patents
Polyphenylene sulfide resin composition for sealing electronic partInfo
- Publication number
- JPH01101366A JPH01101366A JP25857687A JP25857687A JPH01101366A JP H01101366 A JPH01101366 A JP H01101366A JP 25857687 A JP25857687 A JP 25857687A JP 25857687 A JP25857687 A JP 25857687A JP H01101366 A JPH01101366 A JP H01101366A
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene sulfide
- weight
- group
- resin composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004734 Polyphenylene sulfide Substances 0.000 title claims abstract description 22
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims abstract description 22
- 239000011342 resin composition Substances 0.000 title claims description 7
- 238000007789 sealing Methods 0.000 title description 3
- 239000000945 filler Substances 0.000 claims abstract description 14
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 20
- -1 ureidosilane compound Chemical class 0.000 abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 13
- 239000010453 quartz Substances 0.000 abstract description 3
- 239000003566 sealing material Substances 0.000 abstract description 3
- 239000000454 talc Substances 0.000 abstract description 2
- 229910052623 talc Inorganic materials 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 238000002156 mixing Methods 0.000 description 7
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 7
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 239000010425 asbestos Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UOCOIXOFKRMEML-UHFFFAOYSA-N 1-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)C(CC)NC(N)=O UOCOIXOFKRMEML-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000003791 organic solvent mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ウレイドシラン化合物を含有するポリフェニ
レンスルフィド樹脂組成物、特に強度及び耐湿性の優れ
た電子部品封止用樹脂組成物に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polyphenylene sulfide resin composition containing a ureidosilane compound, particularly a resin composition for encapsulating electronic components with excellent strength and moisture resistance. .
′ポリフェニレンスルフィド樹脂（以下ＰＰＳ樹脂と略
す）は、他のエンジニアリングプラスチックに比較して
、優れた耐熱性、耐薬品性、機械的特性、電気的特性を
有しており、自動車部品、事務機器部品、電気部品用途
に幅広く利用されている。更に近年、従来主としてエポ
キシ樹脂で行われていた電子部品、たとえばＩＣ、トラ
ンジスター、ダイオード、コンデンサー等ではそれらを
保護、電気絶縁性の保持；外部雰囲気による特性劣化の
防止の目的で封止をＰＰＳで行うことが提案されている
。しかし、電子部品封止用途に使用するには、通常ケイ
酸質充填材を配合して、機械的強度、耐熱性の向上、線
膨張係数の低下及び耐湿性を向上させることが必須であ
る。'Polyphenylene sulfide resin (hereinafter abbreviated as PPS resin) has superior heat resistance, chemical resistance, mechanical properties, and electrical properties compared to other engineering plastics, and is used in automobile parts and office equipment parts. , and are widely used in electrical component applications. Furthermore, in recent years, electronic components such as ICs, transistors, diodes, capacitors, etc., which were conventionally mainly made of epoxy resin, have been sealed with PPS to protect them, maintain electrical insulation, and prevent characteristic deterioration due to external atmosphere. It is proposed to do so. However, for use in electronic component sealing applications, it is usually necessary to incorporate a silicic acid filler to improve mechanical strength, heat resistance, lower coefficient of linear expansion, and moisture resistance.
ＰＰＳ樹脂とケイ酸質充填材とからなる組成物の機械的
特性及び耐湿性を改善する目的で、米国特許第４３３７
１８２号および４１７６０９８号、特開昭５１−１２８
６１号、特開昭５５−２９５２６号、特開昭５９−３１
５０３号にはアルキル基、エポキシ基、アミン基、ビニ
ル基、メルカプト基を末端に有するシラン化合物をＰＰ
Ｓ樹脂組成物に含有せしめることが示されている。For the purpose of improving the mechanical properties and moisture resistance of compositions consisting of PPS resin and silicic filler, US Pat. No. 4,337
No. 182 and No. 4176098, JP-A-51-128
No. 61, JP-A-55-29526, JP-A-59-31
No. 503 contains a silane compound having an alkyl group, an epoxy group, an amine group, a vinyl group, or a mercapto group at the end.
It has been shown that it can be included in S resin compositions.
しかしながら、このように官能基を有するシラン化合物
をＰＰＳに混合する方法においては、アルキル基、ビニ
ル基、メルカプト基を有するものでは耐湿性は向上する
が、強度の向上が見られない。また、エポキシ基又はア
ミノ基を有するものでは強度は向上するが耐湿性の向上
刃；見られないといったように十分な性能を得るに至っ
ていない。さらにまた、ビニル基とアミノ基の両者を有
するカップリング剤で塩酸塩の形をしたものも提示され
ているが、このものは金型の腐食や封圧材として使用す
る場合のリードフレームの変色をもたらす欠点を有して
いた。However, in such a method of mixing a silane compound having a functional group with PPS, those having an alkyl group, a vinyl group, or a mercapto group improve moisture resistance, but no improvement in strength is observed. In addition, those having an epoxy group or an amino group have improved strength, but have not yet achieved sufficient performance, as no improvement in moisture resistance has been observed. Furthermore, a coupling agent containing both vinyl and amino groups in the form of a hydrochloride has been proposed, but this may cause corrosion of molds and discoloration of lead frames when used as a sealing material. It had the disadvantage of causing
そこで本発明者らは、上記の如き状況に鑑み鋭意検討し
た結果、ＰＰＳとケイ酸質充填材とか゛らなる組成物に
対して、ウレイドシラン化合物を含有せしめることによ
り機械的特性及び耐湿性の向上に著しい効果があること
を見出し本発明に到達した。Therefore, as a result of intensive studies in view of the above-mentioned situation, the inventors of the present invention have found that mechanical properties and moisture resistance can be improved by incorporating a ureidosilane compound into a composition consisting of PPS and a silicic acid filler. We have discovered that this has a significant effect and have arrived at the present invention.
すなわち本発明は、（イ）ポリフェニレンスルフィド３
０〜９０重世％、（ロ））ケイ酸質充填材７０〜１０重
量％および（ハ）一般式
ＮＨ２−Ｃ−ＮＨ−Ｒ，−５ｉ−Ｘ３（ただしＲ，は炭
素Ｉ
数１〜１５のアルキレン基又は−Ｒ２，Ｙ Ｒｚ−１
Ｒ２は炭素数１−１４のアルキレン基、Ｙは−ＮＲ３−
１−Ｓ−１−ＳＯ−１−５Ｏ２−または−〇−１Ｒ３は
Ｈまたは炭素数１〜１０のアルキル基、Ｘは炭素数１−
１０のフルコキシ基またはハロゲン基を示す）で表わさ
れるウレイドシラン化合物０．０１〜１０重量％からな
ることを特徴とする電子部品封止用ポリフェニレンスル
フィド樹脂組成物を提供するものである。That is, the present invention provides (a) polyphenylene sulfide 3
(b) 70 to 10% by weight of silicic acid filler and (c) General formula NH2-C-NH-R, -5i-X3 (where R, is carbon I, number 1 to 15) alkylene group or -R2,Y Rz-1
R2 is an alkylene group having 1-14 carbon atoms, Y is -NR3-
1-S-1-SO-1-5O2- or -〇-1R3 is H or an alkyl group having 1 to 10 carbon atoms, and X is 1-
The present invention provides a polyphenylene sulfide resin composition for encapsulating electronic components, which is characterized by comprising 0.01 to 10% by weight of a ureidosilane compound represented by a ureidosilane compound (representing a flukoxy group or a halogen group of 10).
で示される繰返し単位を７０モル％以上、好ましくは９
０モル％以上を含む重合体であり、上記繰返し単位が７
０モル％未満では耐熱性が損なわれるため好ましくない
。70 mol% or more of the repeating unit represented by, preferably 9
It is a polymer containing 0 mol% or more, and the above repeating unit is 7
If it is less than 0 mol%, heat resistance will be impaired, which is not preferable.
またＰＰＳはその繰返し単位の３０モル％未満を、下記
の構造式を有する繰返し単位等で構成することが可能で
ある。Further, less than 30 mol% of the repeating units of PPS can be composed of repeating units having the following structural formula, etc.
本発明で用いられるＰＰＳのメルトフロー指数（ＡＳＴ
Ｍ法Ｄ−１２３８−７４、温度３１６℃、荷重５ ｋｇ
ｆの測定値）は、１０００Ｆ、’１０分以上、好まし
くは５０００Ｆ／１０分以上が適当である。メルトフロ
ー値１０００１ ／ＩＯ分以下のものは、組成物の溶融
粘度が高くなり、成形時の流動性が悪化して、電子部品
を損傷するので適切でない。Melt flow index (AST) of PPS used in the present invention
M method D-1238-74, temperature 316°C, load 5 kg
The measured value of f) is suitably 1000F/10 minutes or more, preferably 5000F/10 minutes or more. A melt flow value of less than 10001/IO min is not suitable because the melt viscosity of the composition becomes high, the fluidity during molding deteriorates, and electronic parts are damaged.
本発明の全組成物中に占めるＰＰＳの割合は、３０〜９
０重量％、好ましくは３５〜６０重量％が適当である。The proportion of PPS in the total composition of the present invention is 30 to 9
0% by weight, preferably 35-60% by weight is suitable.
３０重量％未満では封止成形時における流動性が悪くな
るので適切でない。If it is less than 30% by weight, the fluidity during sealing molding will deteriorate, so it is not suitable.
また９０重量％を超えると充填材含有量が過少になるた
め封止成形品の線膨張係数が大きくなり好ましくない。Moreover, if it exceeds 90% by weight, the filler content becomes too small and the coefficient of linear expansion of the encapsulated molded product increases, which is not preferable.
本発明で用いられるケイ酸質充填材とは、シリカを主体
とした非繊維状の無機質充填剤であって、石英、タルク
、カオリンなどが挙げられ、好ましくは石英、より好ま
し≦は９９％以上の純度を有する市販の溶融シリカ、結
晶性シリカ、合成シリカの粉砕品および球状のものが挙
げられる。本発明の全組成物中に占めるケイ酸質充填材
の配合割合は７０〜１０重量％、好ましくは６５〜４０
重量％の範囲が選択される。１０重量％゛未満では強度
及び耐湿性の改善効果が不十分であり、７０重量％を超
えると流動性が悪くなるため好ましくない。The siliceous filler used in the present invention is a non-fibrous inorganic filler mainly composed of silica, and includes quartz, talc, kaolin, etc., preferably quartz, and more preferably ≦99% Commercially available fused silica, crystalline silica, pulverized synthetic silica and spherical silica having the above purity may be used. The proportion of the siliceous filler in the entire composition of the present invention is 70 to 10% by weight, preferably 65 to 40% by weight.
A weight percent range is selected. If it is less than 10% by weight, the effect of improving strength and moisture resistance will be insufficient, and if it exceeds 70% by weight, fluidity will deteriorate, which is not preferable.
本発明で用いるウレイドシランは、一般式ＮＨ２−Ｃ−
ＮＨ−Ｒ，−５ｉ−Ｘ３（ただしＲ，は炭素数１−１５
のフルキレン基又は−Ｒ２−Ｙ −Ｒ２−１Ｒ２は炭素
数１〜１４のアルキレン基、Ｙは−ＮＲ３−１−Ｓ−１
−ＳＯ−１−ＳＯ２−または−〇−１Ｒ３はＨまたは炭
素数ｌ〜１０のアルキル基、Ｘは炭素数ｌ〜１０のアル
コキシ基またはハロゲン基を示す）で表わされる化合物
であり、たとえばγ−ウレイドプロピルトリエトキシシ
ラノ、γ−ウレイドプロピルトリメトキシシラン、γ−
ウレイドメチルトリメトキシシラン、γ−ウレイドメチ
ルトリエトキシシラン、γ−ウレイドエチルトリントキ
ンンラン、γ−ウレイドエチルトリエトキンシラン、ｒ
−ウレイドプロピル１−リクロルンラン、ｒ−ウレイド
ブチルトリメトキンシラン、γ−（ウレイドメチル）ア
ミノプロピルトリメトキシシラン、ｒ−（３−ウレイド
プロピルコアミノプロピルトリメトキシシラン、γ−（
２−ウレイドエチル）アミノプロピルトリエトキシシラ
ン、γ−（２−ウレイドエチル）アミノプロピルトリク
ロルシランなどが挙げられる。これらのウレイドシラン
は、１種または２種以上で使用される。The ureidosilane used in the present invention has the general formula NH2-C-
NH-R, -5i-X3 (where R is carbon number 1-15
fullkylene group or -R2-Y -R2-1R2 is an alkylene group having 1 to 14 carbon atoms, Y is -NR3-1-S-1
-SO-1-SO2- or -0-1R3 is a compound represented by H or an alkyl group having 1 to 10 carbon atoms, and X is an alkoxy group or halogen group having 1 to 10 carbon atoms, such as γ- ureidopropyltriethoxysilano, γ-ureidopropyltrimethoxysilane, γ-
ureidomethyltrimethoxysilane, γ-ureidomethyltriethoxysilane, γ-ureidoethyltriethoxysilane, γ-ureidoethyltriethoxysilane, r
-Ureidopropyl 1-lychlorane, r-ureidobutyltrimethoxysilane, γ-(ureidomethyl)aminopropyltrimethoxysilane, r-(3-ureidopropylcoaminopropyltrimethoxysilane, γ-(
Examples include 2-ureidoethyl)aminopropyltriethoxysilane and γ-(2-ureidoethyl)aminopropyltrichlorosilane. These ureidosilanes may be used alone or in combination of two or more.
また他のシラン化合物と併用することも可能である。It is also possible to use it in combination with other silane compounds.
これらのウレイドシランを配合する方法とし−では、一
定ｐＨに調整されたウレイドシランの溶液（水溶液、水
／有機溶媒混合溶液）にケイ酸質充填材を浸漬後乾燥す
る方法、あるいはヘンシェル混合機などのミキサーによ
り、ケイ酸質充填材あるいはＰＰＳとケイ酸質充填材と
ウレイドシランを混合し、配合する方法などがあるが、
これらは特に限定はない。Methods for blending these ureidosilanes include immersing the silicic acid filler in a ureidosilane solution (aqueous solution, water/organic solvent mixture) adjusted to a constant pH, and then drying it, or using a Henschel mixer, etc. There is a method of mixing and blending a silicic acid filler or PPS, a silicic acid filler, and ureido silane using a mixer.
These are not particularly limited.
本発明の全組成物中に占めるウレイドシランの配合割合
は、０．０１〜１０重量％が適切である。０．０１重量
％未満では、十分な機械的特性、＃４湿性の改良効果が
発現せず、１０重量％を超えると上記改良効果が飽和に
達して経済的に不利になるばかりでなく、組成物の流動
性を損うので好ましくない。The appropriate proportion of ureidosilane in the entire composition of the present invention is 0.01 to 10% by weight. If it is less than 0.01% by weight, sufficient mechanical properties and #4 wettability improvement effect will not be exhibited, and if it exceeds 10% by weight, the above-mentioned improvement effect will reach saturation and not only will it be economically disadvantageous, but also the composition This is not preferable because it impairs the fluidity of the product.
本発明の組成物の調製方法は、一般的な方法が用いられ
特に限定されるものでない。例えば、室温においてリボ
ン羽根型混合機、ドラム型回転混合機を用いて各成分を
一緒に混合した後、単軸押出機、多軸押出機またはニー
ダ−などにより溶融混線を行い、ペレット化される。゛
本発明の組成物に４０重１％未満の量で次のような補強
材を添加配合することも可能であり、補強材としてたと
えばガラス繊維、カーボン繊維、ボロン繊維、炭化ケイ
素繊維、カーボンウィスカー、アスベスト繊維、石綿な
どが挙げられる。これらの補強材を使用することにより
強度が向上し、好ましい結果が得られる。The method for preparing the composition of the present invention is not particularly limited and may be a general method. For example, each component is mixed together at room temperature using a ribbon blade type mixer or a drum type rotating mixer, and then melted and mixed using a single screw extruder, multi-screw extruder, or kneader, and then pelletized. .゛It is also possible to add the following reinforcing materials to the composition of the present invention in an amount of less than 1% by weight, such as glass fibers, carbon fibers, boron fibers, silicon carbide fibers, carbon whiskers, etc. , asbestos fibers, asbestos, etc. The use of these reinforcements increases strength and provides favorable results.
本発明の組成物には、本発明の目的を阻害しない範囲で
酸化防止剤、熱安定剤、滑剤、着色剤、紫外線吸収剤、
他種ポリマー等を添加配合するζ、とができる。The composition of the present invention includes antioxidants, heat stabilizers, lubricants, colorants, ultraviolet absorbers, and
It is possible to add and blend other types of polymers.
以下に実施例及び比較例を示して本発明を更に具体的に
説明する。なお、本実施例に示す部及び％はすべで重量
基準である。The present invention will be explained in more detail by showing Examples and Comparative Examples below. Note that all parts and percentages shown in this example are based on weight.
実施例１〜４および比較例１〜３
ＰＰＳ（メルトフロー値６０００ｙ／１０分）と溶融シ
リカ及びシラン化合物を第１表の組成で混合した後、４
０ｆ１０押出機に供給して、処理温度３１０℃で溶融混
練して均一溶融ブレンドペレットを得た。続いて得られ
たペレットを射出成形機（樹脂温度３２０℃、金型温度
１５０℃）にてテストピースを成形し、物性を測定した
ところ第１表のような結果が得られた。Examples 1 to 4 and Comparative Examples 1 to 3 After mixing PPS (melt flow value 6000y/10 min), fused silica, and silane compound in the composition shown in Table 1, 4
The mixture was supplied to an 0f10 extruder and melt-kneaded at a processing temperature of 310° C. to obtain uniform melt-blended pellets. Subsequently, the obtained pellets were molded into test pieces using an injection molding machine (resin temperature: 320°C, mold temperature: 150°C), and the physical properties were measured, and the results shown in Table 1 were obtained.
第１表の結果から判るように、ウレイドシランを含有せ
しめた実施例１〜４の組成物は、他のシラン系カップリ
ング剤を含有させた比較例１〜３の組成物に比べて、曲
げ強度および耐湿性（ＰＣＴ処理後の吸水率、絶縁抵抗
）のすぐれたものであった。As can be seen from the results in Table 1, the compositions of Examples 1 to 4 containing ureidosilane were more flexible than the compositions of Comparative Examples 1 to 3 containing other silane coupling agents. It had excellent strength and moisture resistance (water absorption rate and insulation resistance after PCT treatment).
実施例５〜６
ｐｐｓ（メルトフロー値１００００ｙ／１０分）と溶融
シリカ及びウレイドシラン化合物を第２表に示す割合で
混合した後、実施例１と同様に溶融混練し、射出成形し
てテストピースを作成し、物性測定して第２表の結果を
得た。Examples 5-6 After mixing pps (melt flow value 10000y/10 min), fused silica and ureido silane compound in the proportions shown in Table 2, the mixture was melt-kneaded and injection molded in the same manner as in Example 1 to form test pieces. was prepared, the physical properties were measured, and the results shown in Table 2 were obtained.
本実施例組成物は第２表のように機械的特性及び耐湿性
（ＰＣＴ処理後の吸水率、絶縁抵抗）にすぐれたもので
あった。As shown in Table 2, the composition of this example had excellent mechanical properties and moisture resistance (water absorption rate after PCT treatment, insulation resistance).
実施例７〜８
ＰＰＳ（メルトフロー値１５０００Ｆ／１０分）と充填
材及びウレイドシラン化合物を第３表に示す割合で混合
した後、社施例１と同様に溶融混練し、射出成形してテ
ストピースを作成し、物性測定して第２表の結果を得た
。Examples 7-8 After mixing PPS (melt flow value 15000 F/10 minutes), filler and ureido silane compound in the proportions shown in Table 3, they were melt-kneaded and injection molded in the same manner as in Example 1, and then tested. A piece was prepared and its physical properties were measured to obtain the results shown in Table 2.
本実施例組成物は第２表のように機械的特性及び耐湿性
（ＰＣＴ処理後の吸水率、絶縁抵抗）にすぐれたもので
あった。As shown in Table 2, the composition of this example had excellent mechanical properties and moisture resistance (water absorption rate after PCT treatment, insulation resistance).
第 ２ 表
（ａ） １−ウレイドプロピルトリエトキシシラン位
）メルトフロー値１００００Ｆ／１０分（７）ＰＰＳ（
ｈ＞ ／ Ｊｌ／ ） ７０−値１５０００ｆ／１（
１７）ＰＰＳ（ｆ）３１６℃、荷重５ｋｄＬＤメルトフ
ロー値。Table 2 (a) 1-Ureidopropyltriethoxysilane) Melt flow value 10000F/10 minutes (7) PPS (
h>/Jl/) 70-value 15000f/1(
17) PPS (f) 316°C, load 5kdLD melt flow value.
本発明の電子部品封止用ＰＰＳ樹脂組成物は優れた機械
的特性及び耐湿性を有するため、電子部品例えばＩＣ，
）ランシスター、ダイオード、コンデンサー、レジスタ
ーなどの封止用材料として非常に有用である。The PPS resin composition for encapsulating electronic components of the present invention has excellent mechanical properties and moisture resistance, so it can be used for electronic components such as IC,
) It is very useful as a sealing material for Lancistors, diodes, capacitors, resistors, etc.
特許出願人 東 し 株 式 会 社Patent applicant Higashi Shikikai Co., Ltd.
Claims (1)
ロ）ケイ酸質充填材７０〜１０重量％および（ハ）一般
式▲数式、化学式、表等があります▼ Ｒ＿１は炭素数１〜１５のアルキレン基又は−Ｒ＿２−
Ｙ−Ｒ＿２−、Ｒ＿２は炭素数１〜１４のアルキレン基
、Ｙは−ＮＲ＿３−、−Ｓ−、−ＳＯ−、−ＳＯ＿２−
または−Ｏ−、Ｒ＿３はＨまたは炭素数１〜１０のアル
キル基、Ｘは炭素数１〜１０のアルコキシ基またはハロ
ゲン基を示す）で表わされるウレイドシラン化合物０．
０１〜１０重量％からなることを特徴とする電子部品封
止用ポリフェニレンスルフィド樹脂組成物。[Scope of Claims] (a) 30 to 90% by weight of polyphenylene sulfide, (
b) 70 to 10% by weight of siliceous filler and (c) General formula ▲ Numerical formula, chemical formula, table, etc. ▼ R_1 is an alkylene group having 1 to 15 carbon atoms or -R_2-
Y-R_2-, R_2 is an alkylene group having 1 to 14 carbon atoms, Y is -NR_3-, -S-, -SO-, -SO_2-
or -O-, R_3 is H or an alkyl group having 1 to 10 carbon atoms, and X is an alkoxy group having 1 to 10 carbon atoms or a halogen group).
1. A polyphenylene sulfide resin composition for encapsulating electronic components, characterized by comprising 01 to 10% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25857687A JPH01101366A (en) | 1987-10-14 | 1987-10-14 | Polyphenylene sulfide resin composition for sealing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25857687A JPH01101366A (en) | 1987-10-14 | 1987-10-14 | Polyphenylene sulfide resin composition for sealing electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01101366A true JPH01101366A (en) | 1989-04-19 |
Family
ID=17322168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25857687A Pending JPH01101366A (en) | 1987-10-14 | 1987-10-14 | Polyphenylene sulfide resin composition for sealing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01101366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02151657A (en) * | 1988-12-05 | 1990-06-11 | Dainippon Ink & Chem Inc | Polyarylene sulfide ketone composition |
| US5025047A (en) * | 1989-11-20 | 1991-06-18 | Degussa Aktiengesellschaft | Use of N,N'- and N,N',N'-substituted silyl ureas as antidegradation agents and polymer blends which contain them |
| US5086102A (en) * | 1989-07-18 | 1992-02-04 | Bayer Aktiengesellschaft | Mixtures of poly(arylene sulphides), maleamidic acids and glass fibres |
-
1987
- 1987-10-14 JP JP25857687A patent/JPH01101366A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02151657A (en) * | 1988-12-05 | 1990-06-11 | Dainippon Ink & Chem Inc | Polyarylene sulfide ketone composition |
| US5086102A (en) * | 1989-07-18 | 1992-02-04 | Bayer Aktiengesellschaft | Mixtures of poly(arylene sulphides), maleamidic acids and glass fibres |
| US5025047A (en) * | 1989-11-20 | 1991-06-18 | Degussa Aktiengesellschaft | Use of N,N'- and N,N',N'-substituted silyl ureas as antidegradation agents and polymer blends which contain them |
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