JPH01100469U - - Google Patents

Info

Publication number
JPH01100469U
JPH01100469U JP19525587U JP19525587U JPH01100469U JP H01100469 U JPH01100469 U JP H01100469U JP 19525587 U JP19525587 U JP 19525587U JP 19525587 U JP19525587 U JP 19525587U JP H01100469 U JPH01100469 U JP H01100469U
Authority
JP
Japan
Prior art keywords
ultraviolet lamp
far
air
infrared heater
accommodating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19525587U
Other languages
Japanese (ja)
Other versions
JP2524628Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195255U priority Critical patent/JP2524628Y2/en
Publication of JPH01100469U publication Critical patent/JPH01100469U/ja
Application granted granted Critical
Publication of JP2524628Y2 publication Critical patent/JP2524628Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は一部破断せる本考案硬化装置の正面図を示
す。 １……硬化装置本体、４……接着・硬化部、５
……コンベア、８……プリント基板、９……紫外
線ランプ収納室、１０……遠赤外線ヒータ収納室
、１１……遠赤外線ヒータ、１３……断熱壁、１
４……紫外線ランプ、１６……排気フアン、２１
……空気遮閉体。 The figure shows a partially cutaway front view of the curing device of the present invention. 1... Curing device main body, 4... Adhesion/curing part, 5
... Conveyor, 8 ... Printed circuit board, 9 ... Ultraviolet lamp storage room, 10 ... Far-infrared heater storage room, 11 ... Far-infrared heater, 13 ... Heat insulation wall, 1
4... Ultraviolet lamp, 16... Exhaust fan, 21
...Air barrier.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に紫外線ランプ、遠赤外線ヒータ
により電子部品を接着又は半田付を行なう硬化装
置に於いて、前記遠赤外線ヒータを収納する空間
と紫外線ランプを収納する空間とを仕切る断熱壁
を設けると共に、該断熱壁等により形成される紫
外線ランプ収納室に外気を取り込んで前記ランプ
を冷却した後熱交換後の空気を排気する冷却用フ
アンを設け、また前記ランプと基板搬送用コンベ
アとの間には紫外線を透過させる材料から成る空
気遮閉体を設けたことを特徴とする硬化装置。 In a curing device for bonding or soldering electronic components to a printed circuit board using an ultraviolet lamp and a far-infrared heater, a heat insulating wall is provided to partition a space for accommodating the far-infrared heater and a space for accommodating the ultraviolet lamp. A cooling fan is installed to take in outside air into an ultraviolet lamp storage chamber formed by a heat insulating wall, cool the lamp, and then exhaust the air after heat exchange. A curing device characterized by being provided with an air shield made of a material that transmits.
JP1987195255U 1987-12-23 1987-12-23 Curing equipment Expired - Lifetime JP2524628Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195255U JP2524628Y2 (en) 1987-12-23 1987-12-23 Curing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195255U JP2524628Y2 (en) 1987-12-23 1987-12-23 Curing equipment

Publications (2)

Publication Number Publication Date
JPH01100469U true JPH01100469U (en) 1989-07-05
JP2524628Y2 JP2524628Y2 (en) 1997-02-05

Family

ID=31485941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195255U Expired - Lifetime JP2524628Y2 (en) 1987-12-23 1987-12-23 Curing equipment

Country Status (1)

Country Link
JP (1) JP2524628Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108555410A (en) * 2018-02-28 2018-09-21 君泰创新（北京）科技有限公司 Solar cell series welding mechanism

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181092A (en) * 1983-03-30 1984-10-15 松下電器産業株式会社 Hardening device
JPS60220986A (en) * 1984-04-18 1985-11-05 オリンパス光学工業株式会社 Reinforced board of lead bonding portion of film carrier package and method of producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181092A (en) * 1983-03-30 1984-10-15 松下電器産業株式会社 Hardening device
JPS60220986A (en) * 1984-04-18 1985-11-05 オリンパス光学工業株式会社 Reinforced board of lead bonding portion of film carrier package and method of producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108555410A (en) * 2018-02-28 2018-09-21 君泰创新（北京）科技有限公司 Solar cell series welding mechanism

Also Published As

Publication number Publication date
JP2524628Y2 (en) 1997-02-05

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