JPH01100467U - - Google Patents

Info

Publication number

JPH01100467U

JPH01100467U JP19569687U JP19569687U JPH01100467U JP H01100467 U JPH01100467 U JP H01100467U JP 19569687 U JP19569687 U JP 19569687U JP 19569687 U JP19569687 U JP 19569687U JP H01100467 U JPH01100467 U JP H01100467U

Authority

JP

Japan

Prior art keywords

thick film

pattern lands

integrated circuit

disposed

support protrusions

Prior art date

1987-12-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 2
• 239000002184 metal Substances 0.000 claims 3
• 239000011810 insulating material Substances 0.000 claims 1
• 230000008054 signal transmission Effects 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1

Cited By (2)