JPH01100466U - - Google Patents
Info
- Publication number
- JPH01100466U JPH01100466U JP19685387U JP19685387U JPH01100466U JP H01100466 U JPH01100466 U JP H01100466U JP 19685387 U JP19685387 U JP 19685387U JP 19685387 U JP19685387 U JP 19685387U JP H01100466 U JPH01100466 U JP H01100466U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- groove
- location
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19685387U JPH01100466U (en, 2012) | 1987-12-24 | 1987-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19685387U JPH01100466U (en, 2012) | 1987-12-24 | 1987-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100466U true JPH01100466U (en, 2012) | 1989-07-05 |
Family
ID=31487445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19685387U Pending JPH01100466U (en, 2012) | 1987-12-24 | 1987-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100466U (en, 2012) |
-
1987
- 1987-12-24 JP JP19685387U patent/JPH01100466U/ja active Pending