JPH01100456U - - Google Patents

Info

Publication number
JPH01100456U
JPH01100456U JP19548387U JP19548387U JPH01100456U JP H01100456 U JPH01100456 U JP H01100456U JP 19548387 U JP19548387 U JP 19548387U JP 19548387 U JP19548387 U JP 19548387U JP H01100456 U JPH01100456 U JP H01100456U
Authority
JP
Japan
Prior art keywords
view
lead frame
lead
semiconductor device
surface mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19548387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19548387U priority Critical patent/JPH01100456U/ja
Publication of JPH01100456U publication Critical patent/JPH01100456U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19548387U 1987-12-23 1987-12-23 Pending JPH01100456U (US07579456-20090825-P00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19548387U JPH01100456U (US07579456-20090825-P00002.png) 1987-12-23 1987-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19548387U JPH01100456U (US07579456-20090825-P00002.png) 1987-12-23 1987-12-23

Publications (1)

Publication Number Publication Date
JPH01100456U true JPH01100456U (US07579456-20090825-P00002.png) 1989-07-05

Family

ID=31486161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19548387U Pending JPH01100456U (US07579456-20090825-P00002.png) 1987-12-23 1987-12-23

Country Status (1)

Country Link
JP (1) JPH01100456U (US07579456-20090825-P00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764287A (zh) * 2020-06-02 2021-12-07 三菱电机株式会社 半导体装置的制造方法以及半导体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764287A (zh) * 2020-06-02 2021-12-07 三菱电机株式会社 半导体装置的制造方法以及半导体装置
JP2021190607A (ja) * 2020-06-02 2021-12-13 三菱電機株式会社 半導体装置の製造方法、および、半導体装置
US11894291B2 (en) 2020-06-02 2024-02-06 Mitsubishi Electric Corporation Manufacturing method of semiconductor device and semiconductor device

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