JPH01100436U - - Google Patents
Info
- Publication number
- JPH01100436U JPH01100436U JP19687287U JP19687287U JPH01100436U JP H01100436 U JPH01100436 U JP H01100436U JP 19687287 U JP19687287 U JP 19687287U JP 19687287 U JP19687287 U JP 19687287U JP H01100436 U JPH01100436 U JP H01100436U
- Authority
- JP
- Japan
- Prior art keywords
- horizontal grooves
- semiconductor device
- pair
- manufacturing apparatus
- shaped cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19687287U JPH01100436U (no) | 1987-12-24 | 1987-12-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19687287U JPH01100436U (no) | 1987-12-24 | 1987-12-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01100436U true JPH01100436U (no) | 1989-07-05 |
Family
ID=31487462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19687287U Pending JPH01100436U (no) | 1987-12-24 | 1987-12-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01100436U (no) |
-
1987
- 1987-12-24 JP JP19687287U patent/JPH01100436U/ja active Pending