JP7707239B2 - ロボット及び基板搬送装置 - Google Patents
ロボット及び基板搬送装置 Download PDFInfo
- Publication number
- JP7707239B2 JP7707239B2 JP2023111681A JP2023111681A JP7707239B2 JP 7707239 B2 JP7707239 B2 JP 7707239B2 JP 2023111681 A JP2023111681 A JP 2023111681A JP 2023111681 A JP2023111681 A JP 2023111681A JP 7707239 B2 JP7707239 B2 JP 7707239B2
- Authority
- JP
- Japan
- Prior art keywords
- flange
- link
- hand
- base
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J17/00—Joints
- B25J17/02—Wrist joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/007—Means or methods for designing or fabricating manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023111681A JP7707239B2 (ja) | 2023-07-06 | 2023-07-06 | ロボット及び基板搬送装置 |
| CN202410885998.1A CN119275166A (zh) | 2023-07-06 | 2024-07-03 | 机器人以及基板输送装置 |
| US18/762,675 US20250010461A1 (en) | 2023-07-06 | 2024-07-03 | Robot and electronic substrate transfer device |
| KR1020240088490A KR102920427B1 (ko) | 2023-07-06 | 2024-07-04 | 로봇 및 기판 반송 장치 |
| JP2025112595A JP2025129313A (ja) | 2023-07-06 | 2025-07-02 | ロボット及び基板搬送装置 |
| KR1020260015023A KR20260033493A (ko) | 2023-07-06 | 2026-01-26 | 로봇 및 기판 반송 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023111681A JP7707239B2 (ja) | 2023-07-06 | 2023-07-06 | ロボット及び基板搬送装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025112595A Division JP2025129313A (ja) | 2023-07-06 | 2025-07-02 | ロボット及び基板搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025008999A JP2025008999A (ja) | 2025-01-20 |
| JP7707239B2 true JP7707239B2 (ja) | 2025-07-14 |
Family
ID=94104730
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023111681A Active JP7707239B2 (ja) | 2023-07-06 | 2023-07-06 | ロボット及び基板搬送装置 |
| JP2025112595A Pending JP2025129313A (ja) | 2023-07-06 | 2025-07-02 | ロボット及び基板搬送装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025112595A Pending JP2025129313A (ja) | 2023-07-06 | 2025-07-02 | ロボット及び基板搬送装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250010461A1 (https=) |
| JP (2) | JP7707239B2 (https=) |
| KR (2) | KR102920427B1 (https=) |
| CN (1) | CN119275166A (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020188218A (ja) | 2019-05-17 | 2020-11-19 | 東京エレクトロン株式会社 | 真空搬送装置 |
-
2023
- 2023-07-06 JP JP2023111681A patent/JP7707239B2/ja active Active
-
2024
- 2024-07-03 US US18/762,675 patent/US20250010461A1/en active Pending
- 2024-07-03 CN CN202410885998.1A patent/CN119275166A/zh active Pending
- 2024-07-04 KR KR1020240088490A patent/KR102920427B1/ko active Active
-
2025
- 2025-07-02 JP JP2025112595A patent/JP2025129313A/ja active Pending
-
2026
- 2026-01-26 KR KR1020260015023A patent/KR20260033493A/ko active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020188218A (ja) | 2019-05-17 | 2020-11-19 | 東京エレクトロン株式会社 | 真空搬送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250008004A (ko) | 2025-01-14 |
| US20250010461A1 (en) | 2025-01-09 |
| KR20260033493A (ko) | 2026-03-10 |
| JP2025129313A (ja) | 2025-09-04 |
| JP2025008999A (ja) | 2025-01-20 |
| KR102920427B1 (ko) | 2026-01-29 |
| CN119275166A (zh) | 2025-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| A61 | First payment of annual fees (during grant procedure) |
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