JP7634684B2 - 材料を分離するためのデバイス及び方法 - Google Patents

材料を分離するためのデバイス及び方法 Download PDF

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Publication number
JP7634684B2
JP7634684B2 JP2023536975A JP2023536975A JP7634684B2 JP 7634684 B2 JP7634684 B2 JP 7634684B2 JP 2023536975 A JP2023536975 A JP 2023536975A JP 2023536975 A JP2023536975 A JP 2023536975A JP 7634684 B2 JP7634684 B2 JP 7634684B2
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Japan
Prior art keywords
workpiece
laser
laser beam
axis
intensity distribution
Prior art date
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Active
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JP2023536975A
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English (en)
Japanese (ja)
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JP2024500757A (ja
Inventor
フラム ダニエル
クライナー ヨナス
カイザー ミリアム
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Trumpf Laser und Systemtechnik GmbH
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Trumpf Laser und Systemtechnik GmbH
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Publication of JP2024500757A publication Critical patent/JP2024500757A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

Landscapes

  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Robotics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
JP2023536975A 2020-12-18 2021-11-03 材料を分離するためのデバイス及び方法 Active JP7634684B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020134198.9A DE102020134198A1 (de) 2020-12-18 2020-12-18 Vorrichtung und Verfahren zum Trennen eines Materials
DE102020134198.9 2020-12-18
PCT/EP2021/080502 WO2022128241A1 (de) 2020-12-18 2021-11-03 Vorrichtung und verfahren zum trennen eines materials

Publications (2)

Publication Number Publication Date
JP2024500757A JP2024500757A (ja) 2024-01-10
JP7634684B2 true JP7634684B2 (ja) 2025-02-21

Family

ID=78592858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536975A Active JP7634684B2 (ja) 2020-12-18 2021-11-03 材料を分離するためのデバイス及び方法

Country Status (7)

Country Link
US (1) US20230356331A1 (de)
EP (1) EP4263114A1 (de)
JP (1) JP7634684B2 (de)
KR (1) KR102872771B1 (de)
CN (1) CN116847941A (de)
DE (1) DE102020134198A1 (de)
WO (1) WO2022128241A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023117393A1 (de) 2023-06-30 2025-01-02 TRUMPF Laser SE Verfahren zum Trennen einer Faser

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015123482A (ja) 2013-12-27 2015-07-06 東芝機械株式会社 レーザダイシング装置およびレーザダイシング方法
JP2017511777A (ja) 2013-12-17 2017-04-27 コーニング インコーポレイテッド エッジ面取り加工方法
JP2017122046A (ja) 2012-11-14 2017-07-13 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 透明ワークを分離する方法
US20200361037A1 (en) 2019-05-17 2020-11-19 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100800565B1 (ko) * 2006-08-31 2008-02-04 동일파텍주식회사 고속 파이버레이저 가공장치
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
WO2015113026A2 (en) 2014-01-27 2015-07-30 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
CN107073641B (zh) * 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
CN107148324A (zh) * 2014-08-28 2017-09-08 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
DE102014116958B9 (de) * 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
JP2018521941A (ja) 2015-05-15 2018-08-09 コーニング インコーポレイテッド レーザ切断された縁を有するガラス物品およびその製造方法
DE102015111491A1 (de) * 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum Abtrennen von Glas- oder Glaskeramikteilen
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
EP3597353A1 (de) 2016-09-30 2020-01-22 Corning Incorporated Vorrichtungen zur laserbearbeitung von transparenten werkstücken mittels nichtachsensymmetrischen strahlflecken
DE102019217021A1 (de) * 2019-11-05 2021-05-06 Photon Energy Gmbh Laserschneidverfahren und zugehörige Laserschneidvorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017122046A (ja) 2012-11-14 2017-07-13 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 透明ワークを分離する方法
JP2017511777A (ja) 2013-12-17 2017-04-27 コーニング インコーポレイテッド エッジ面取り加工方法
JP2015123482A (ja) 2013-12-27 2015-07-06 東芝機械株式会社 レーザダイシング装置およびレーザダイシング方法
US20200361037A1 (en) 2019-05-17 2020-11-19 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces

Also Published As

Publication number Publication date
CN116847941A (zh) 2023-10-03
WO2022128241A1 (de) 2022-06-23
KR20230117243A (ko) 2023-08-07
US20230356331A1 (en) 2023-11-09
JP2024500757A (ja) 2024-01-10
EP4263114A1 (de) 2023-10-25
DE102020134198A1 (de) 2022-06-23
KR102872771B1 (ko) 2025-10-16

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