JP7537111B2 - Resin composition, resin film, and touch sensor substrate - Google Patents

Description

The present invention relates to a resin composition, a resin film, and a touch sensor substrate.

In touch sensors, transparent electrodes such as indium-tin oxide (ITO) electrodes formed on a substrate are used as sensors. Transparent resin materials are used as the substrate (touch sensor substrate) to support such transparent electrodes.

For example, Patent Document 1 discloses a photocurable resin composition containing a compound having an epoxy group (a), a photobase generator (b), a curing agent having a thiol group (c), and a compound having at least one of a carboxyl group and a carboxylic anhydride group (d). Patent Document 2 discloses a resin composition containing a cyclic olefin polymer having a protonic polar group (A), a crosslinking agent (B), and an organic solvent containing diethylene glycol ethyl methyl ether (C). Patent Document 3 discloses a negative photosensitive resin composition containing an alkali-soluble resin, a nonionic photoacid generator, and a sensitizer. Patent Document 4 discloses a photoimageable composition containing a) a polymer having one or more first type repeat units and/or second type repeat units and a third type repeat unit, b) a photobase generator, and c) a carrier solvent. Patent Document 5 discloses a photocurable composition that contains a photobase generator (A) that is a salt of a carboxylic acid (a1-1) and a basic compound (a2), and a curable compound (B) that has at least two functional groups in one molecule selected from an epoxy group, a (meth)acryloyl group, an isocyanate group, an acid anhydride group, and an alkoxysilyl group.

JP 2012-159657 A International Publication No. 2017/163981 International Publication No. 2018/155016 Special table 2018-508824 publication Patent No. 5707622

When a transparent electrode such as an ITO electrode is formed on a touch sensor substrate, the transparent electrode on the substrate may wrinkle, for example, due to heating during formation. Therefore, there is a demand for a material suitable for a touch sensor substrate that is excellent in transparency and can suppress the occurrence of wrinkles in the transparent electrode even at high temperatures.

Therefore, the present invention aims to provide a resin composition that can be used as a touch sensor substrate that has excellent transparency and can suppress the occurrence of wrinkles in the transparent electrode on the substrate even at high temperatures, as well as a resin film and a touch sensor substrate that use the resin composition.

Thus, according to the present invention, the following resin composition, resin film, and touch sensor substrate are provided.

〔式（ＩＩ）または式（ＩＩＩ）中、Ｒ^３は置換基を有していても良いアルキル基を示す。〕
で表される化合物である、前記〔１〕に記載の樹脂組成物。
〔３〕前記増感剤（Ｃ）が、９，１０－ビス（オクタノイルオキシ）アントラセン、１，４－ジエトキシナフタレン、またはこれらの混合物である、前記〔１〕又は〔２〕に記載の樹脂組成物。
〔４〕前記光塩基発生剤（Ｂ）が、ノニオン系光塩基発生剤である、前記〔１〕～〔３〕のいずれかに記載の樹脂組成物。
〔５〕前記光塩基発生剤（Ｂ）に対する前記増感剤（Ｃ）の質量比（増感剤（Ｃ）／光塩基発生剤（Ｂ））が、０．５以上１．５以下である、前記〔１〕～〔４〕のいずれかに記載の樹脂組成物。
〔６〕前記〔１〕～〔５〕のいずれかに記載の樹脂組成物を用いた樹脂膜。
〔７〕前記〔６〕に記載の樹脂膜を備えるタッチセンサー基材。 [1] A resin composition comprising a binder resin (A), a photobase generator (B), a sensitizer (C), and an epoxy crosslinking agent (D).
[2] The sensitizer (C) is represented by the following formula (II) or formula (III):

[In formula (II) or (III), ^R3 represents an alkyl group which may have a substituent.]
The resin composition according to the above [1], wherein the compound is represented by the formula:
[3] The resin composition according to [1] or [2], wherein the sensitizer (C) is 9,10-bis(octanoyloxy)anthracene, 1,4-diethoxynaphthalene, or a mixture thereof.
[4] The resin composition according to any one of [1] to [3], wherein the photobase generator (B) is a nonionic photobase generator.
[5] The resin composition according to any one of [1] to [4], wherein the mass ratio of the sensitizer (C) to the photobase generator (B) (sensitizer (C)/photobase generator (B)) is 0.5 or more and 1.5 or less.
[6] A resin film using the resin composition according to any one of [1] to [5] above.
[7] A touch sensor substrate comprising the resin film according to [6].

The present invention provides a resin composition that can be used as a touch sensor substrate that has excellent transparency and is capable of suppressing the occurrence of wrinkles in the transparent electrode on the substrate even at high temperatures, as well as a resin film and a touch sensor substrate that use the resin composition.

The following describes an embodiment of the present invention in detail.

(Resin composition)
The resin composition of the present invention contains a binder resin (A), a photobase generator (B), a sensitizer (C), and an epoxy crosslinking agent (D).

<Binder Resin (A)>
The binder resin (A) is the main component of the resin composition. The binder resin (A) is not particularly limited as long as it is a resinous substance suitable as a material for the touch sensor substrate, but is usually a resinous substance that is solid at room temperature (a temperature of 15°C or more and 35°C or less). In addition, from the viewpoint of being used as a material for the touch sensor substrate, the binder resin (A) is preferably a transparent resinous substance, and more preferably a colorless and transparent resinous substance. In addition, from the viewpoint of being used as a material for the touch sensor substrate, the binder resin (A) is preferably a highly insulating resinous substance. In addition, the binder resin (A) preferably does not contain an epoxy group. In addition, the binder resin (A) preferably has a protic polar group from the viewpoint of increasing heat resistance.

Examples of binder resins (A) include cyclic olefin polymers, polyvinylphenol resins, polyamide-imides, acrylic resins, polyimides, cardo resins, and polysiloxanes.

The binder resin (A) may be used alone or in combination of two or more types.

<<Cyclic olefin polymer>>
The cyclic olefin polymer is not particularly limited as long as it is suitable as a material for the touch sensor substrate. The cyclic olefin polymer is preferably one that satisfies the above-mentioned conditions.

A cyclic olefin polymer is a polymer or copolymer (hereinafter, polymer and copolymer may be collectively referred to as "polymer") that contains monomer units derived from a cyclic olefin monomer. Examples of the cyclic olefin monomer include a cyclic olefin monomer (a) having a protonic polar group, a cyclic olefin monomer (b1) having a polar group other than a protonic polar group, and a cyclic olefin monomer (b2) that does not have a polar group. The cyclic olefin polymer may also be a copolymer that contains a monomer unit other than the cyclic olefin (b3) in addition to the cyclic olefin monomer. Hereinafter, each monomer may be referred to as "monomer (a)", "monomer (b1)", "monomer (b2)", or "monomer (b3)" as appropriate.

In addition, from the viewpoint of increasing heat resistance, the cyclic olefin polymer is preferably a cyclic olefin polymer having a protonic polar group. Examples of the cyclic olefin polymer having a protonic polar group include a polymer of one or more cyclic olefin monomers, or a copolymer of one or more cyclic olefin monomers and a monomer copolymerizable therewith. In the present invention, it is preferable to use at least a cyclic olefin monomer having a protonic polar group as a monomer for forming the cyclic olefin polymer. Examples of the cyclic olefin polymer having a protonic polar group include a polymer or copolymer containing a cyclic olefin monomer (a) having a protonic polar group as a monomer unit. In addition, the cyclic olefin polymer having a protonic polar group may be a copolymer containing, in addition to the cyclic olefin monomer (a) having a protonic polar group, one or more of the following as monomer units: a cyclic olefin monomer (b1) having a polar group other than a protonic polar group, a cyclic olefin monomer (b2) not having a polar group, and a monomer (b3) other than a cyclic olefin.

Here, the protic polar group refers to a group containing an atom in which a hydrogen atom is directly bonded to an atom belonging to Group 15 or 16 of the periodic table. Among the atoms belonging to Group 15 or 16 of the periodic table, an atom belonging to the first or second period of Group 15 or 16 of the periodic table is preferred, more preferably an oxygen atom, a nitrogen atom, or a sulfur atom, and particularly preferably an oxygen atom.

Specific examples of such protic polar groups include polar groups having an oxygen atom such as a hydroxyl group, a carboxyl group (hydroxycarbonyl group), a sulfonic acid group, and a phosphate group; polar groups having a nitrogen atom such as a primary amino group, a secondary amino group, a primary amide group, and a secondary amide group (imide group); and polar groups having a sulfur atom such as a thiol group. Among these, those having an oxygen atom are preferred, and a carboxyl group is more preferred.
In the present invention, there is no particular limitation on the number of protic polar groups bonded to the cyclic olefin resin having a protic polar group, and different types of protic polar groups may be contained.

<<Cyclic olefin monomer (a) having a protic polar group>>
Specific examples of the cyclic olefin monomer (a) having a protic polar group include 2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene, 2-carboxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene, 2,3-dihydroxycarbonylbicyclo[2.2.1]hept-5-ene, 2-hydroxycarbonyl-3-hydroxycarbonylmethylbicyclo[2.2.1]hept-5-ene, 3-methyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene, 3-hydroxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene, 2-hydroxycarbonyltricyclo[5.2.1.0 ^2,6 ] deca-3,8-diene, 4-hydroxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-hydroxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4,5-dihydroxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-carboxymethyl-4-hydroxycarbonyltetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ] dodec-9-ene, N-(hydroxycarbonylmethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(hydroxycarbonylethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(hydroxycarbonylpentyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(dihydroxycarbonylethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(dihydroxycarbonylpropyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(hydroxycarbonylphenethyl)bicyclo[2.2.1]hept-5-ene-2, Carboxy group-containing cyclic olefins such as 3-dicarboximide, N-(hydroxycarbonylphenethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-(4-hydroxyphenyl)-1-(hydroxycarbonyl)ethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(hydroxycarbonylphenyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide; 2-(4-hydroxyphenyl)bicyclo[2.2.1]hept-5-ene, 2-methyl-2-(4-hydroxyphenyl)bicyclo[2.2.1]hept-5-ene, 4-(4-hydroxyphenyl)tetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ]dodec-9-ene, 4-methyl-4-(4-hydroxyphenyl)tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene, 2-hydroxybicyclo[2.2.1]hept-5-ene, 2-hydroxymethylbicyclo[2.2.1]hept-5-ene, 2-hydroxyethylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-hydroxymethylbicyclo[2.2.1]hept-5-ene, 2,3-dihydroxymethylbicyclo[2.2.1]hept-5-ene, 2-(hydroxyethoxycarbonyl)bicyclo[2.2. 1]hept-5-ene, 2-methyl-2-(hydroxyethoxycarbonyl)bicyclo[2.2.1]hept-5-ene, 2-(1-hydroxy-1-trifluoromethyl-2,2,2-trifluoroethyl)bicyclo[2.2.1]hept-5-ene, 2-(2-hydroxy-2-trifluoromethyl-3,3,3-trifluoropropyl)bicyclo[2.2.1]hept-5-ene, 3-hydroxytricyclo[5.2.1.0 ^2,6 ]deca-4,8-diene, 3-hydroxymethyltricyclo[5.2.1.0 ^2,6 ]deca-4,8-diene, 4-hydroxytetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ]dodec-9-ene, 4-hydroxymethyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4,5-dihydroxymethyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-(hydroxyethoxycarbonyl)tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-(hydroxyethoxycarbonyl)tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, N-(hydroxyethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(hydroxyphenyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, and other hydroxyl group-containing cyclic olefins. Among these, carboxyl group-containing cyclic olefins are preferred, and 4-hydroxycarbonyltetracyclo[6.2.1.1 ^3,6 .0 ^2,7 ]dodec-9-ene is particularly preferred, because the resulting resin film has high adhesion. These monomers (a) may be used alone or in combination of two or more.

The content of the monomer (a) units in the cyclic olefin polymer is preferably 10 to 90 mol %, more preferably 20 to 80 mol %, and even more preferably 30 to 70 mol %, based on the total monomer units. By setting the content of the monomer (a) units within the above range, the cyclic olefin polymer can be made sufficiently soluble in organic solvents, while the strength and insulating properties when made into a resin film can be made good.

<<Cyclic Olefin Monomer (b1) Having a Polar Group Other Than a Protic Polar Group>>
Examples of the cyclic olefin monomer (b1) having a polar group other than a protic polar group include cyclic olefins having an N-substituted imido group, ester group, cyano group or halogen atom.

（上記一般式（１）中、Ｒ^１は水素原子もしくは炭素数１～１６のアルキル基またはアリール基を表す。ｎは１ないし２の整数を表す。）

（上記一般式（２）中、Ｒ^２は炭素数１～３の２価のアルキレン基、Ｒ^３は、炭素数１～１０の１価のアルキル基、または、炭素数１～１０の１価のハロゲン化アルキル基を表す。） Examples of the cyclic olefin having an N-substituted imide group include a monomer represented by the following general formula (1) or a monomer represented by the following general formula (2).

(In the above general formula (1), R ¹ represents a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or an aryl group. n represents an integer of 1 or 2.)

(In the above general formula (2), ^R2 represents a divalent alkylene group having 1 to 3 carbon atoms, and ^R3 represents a monovalent alkyl group having 1 to 10 carbon atoms, or a monovalent halogenated alkyl group having 1 to 10 carbon atoms.)

In the above general formula (1), R ¹ is an alkyl group or aryl group having 1 to 16 carbon atoms. Specific examples of the alkyl group include linear alkyl groups such as methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, and n-hexadecyl group; cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, and cyclododecyl group;
Cyclic alkyl groups such as norbornyl, bornyl, isobornyl, decahydronaphthyl, tricyclodecanyl, and adamantyl; branched alkyl groups such as 2-propyl, 2-butyl, 2-methyl-1-propyl, 2-methyl-2-propyl, 1-methylbutyl, 2-methylbutyl, 1-methylpentyl, 1-ethylbutyl, 2-methylhexyl, 2-ethylhexyl, 4-methylheptyl, 1-methylnonyl, 1-methyltridecyl, and 1-methyltetradecyl; and the like. Specific examples of aryl groups include benzyl. Among these, alkyl and aryl groups having 6 to 14 carbon atoms are preferred, and alkyl and aryl groups having 6 to 10 carbon atoms are more preferred, because they have better heat resistance and solubility in polar solvents. If the number of carbon atoms is 4 or less, there is a problem that the solubility in polar solvents is poor, and if the number of carbon atoms is 17 or more, there is a problem that the heat resistance is poor.

Specific examples of the monomer represented by the above general formula (1) include bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-phenyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-ethylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-propylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-butylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-cyclohexylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-cyclohexylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, -dicarboximide, N-adamantylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-ethylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-ethylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide Imide, N-(1-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-butylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-butylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide carboxyimide, N-(3-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(4-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-propylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-propylpentyl)-bicyclo[2.2.1]hept-5-ene-2, 3-dicarboximide, N-(1-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(4-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-ethylheptyl)-bicyclo[2.2.1]hept-5-ene -2,3-dicarboximide, N-(4-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-methylnonyl)-bicyclo[2.2.1]hept-5 -ene-2,3-dicarboximide, N-(4-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(5-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(2-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(3-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(4-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methyldecyl)-bicyclo[2.2.1]hept-5 1-Methyl-2,3-dicarboxyimide, N-(1-methyldodecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylundecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methyldodecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methyltridecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methyltetradecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-(1-methylpentadecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide, N-phenyl-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene-4,5-dicarboximide, N-(2,4-dimethoxyphenyl)-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene-4,5-dicarboximide, etc. These may be used alone or in combination of two or more.

On the other hand, in the above general formula (2), ^R2 is a divalent alkylene group having 1 to 3 carbon atoms, and examples of the divalent alkylene group having 1 to 3 carbon atoms include a methylene group, an ethylene group, a propylene group, and an isopropylene group. Among these, a methylene group and an ethylene group are preferred because of their good polymerization activity.

In the above general formula (2), R ³ is a monovalent alkyl group having 1 to 10 carbon atoms, or a monovalent halogenated alkyl group having 1 to 10 carbon atoms. Examples of the monovalent alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, a hexyl group, and a cyclohexyl group. Examples of the monovalent halogenated alkyl group having 1 to 10 carbon atoms include a fluoromethyl group, a chloromethyl group, a bromomethyl group, a difluoromethyl group, a dichloromethyl group, a difluoromethyl group, a trifluoromethyl group, a trichloromethyl group, a 2,2,2-trifluoroethyl group, a pentafluoroethyl group, a heptafluoropropyl group, a perfluorobutyl group, and a perfluoropentyl group. Among these, a methyl group and an ethyl group are preferred as R ³ because of their excellent solubility in polar solvents.

The monomers represented by the above general formulas (1) and (2) can be obtained, for example, by an amidation reaction between the corresponding amine and 5-norbornene-2,3-dicarboxylic anhydride. The obtained monomers can be efficiently isolated by separating and purifying the reaction solution of the amidation reaction by a known method.

Examples of cyclic olefins having an ester group include 2-acetoxybicyclo[2.2.1]hept-5-ene, 2-acetoxymethylbicyclo[2.2.1]hept-5-ene, 2-methoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-ethoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-propoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-butoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-cyclohexyloxycarbonylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-methoxycarbonylbicyclo[2.2.1]hept-5-ene, ene, 2-methyl-2-ethoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-propoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-butoxycarbonylbicyclo[2.2.1]hept-5-ene, 2-methyl-2-cyclohexyloxycarbonylbicyclo[2.2.1]hept-5-ene, 2-(2,2,2-trifluoroethoxycarbonyl)bicyclo[2.2.1]hept-5-ene, 2-methyl-2-(2,2,2-trifluoroethoxycarbonyl)bicyclo[2.2.1]hept-5-ene, 2-methoxycarbonyltricyclo[5.2.1.0 ^2,6 ] dec-8-ene, 2-ethoxycarbonyltricyclo[5.2.1.0 ^2,6 ] dec-8-ene, 2-propoxycarbonyltricyclo[5.2.1.0 ^2,6 ] dec-8-ene, 4-acetoxytetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methoxycarbonyltetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ] dodec-9-ene, 4-ethoxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^{2,7 ] dodec-9-ene, 4-propoxycarbonyltetracyclo[6.2.1.1 3,6 . 0 2,7 ] dodec} -9-ene, 4-butoxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-methoxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-ethoxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-propoxycarbonyltetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-9-ene, 4-methyl-4-butoxycarbonyltetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ] dodec-9-ene, 4-(2,2,2-trifluoroethoxycarbonyl)tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene, 4-methyl-4-(2,2,2-trifluoroethoxycarbonyl)tetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ]dodec-9-ene, and the like.

Examples of cyclic olefins having a cyano group include 4-cyanotetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene, 4-methyl-4-cyanotetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene, 4,5-dicyanotetracyclo[6.2.1.1 3,6 . ^{0 2,7} ]dodec-9-ene, 2-cyanobicyclo[2.2.1]hept-5-ene, 2-methyl-2-cyanobicyclo[2.2.1]hept-5-ene, and 2,3-dicyanobicyclo[2.2.1]hept-5-ene.

Examples of cyclic olefins having an acid anhydride group include tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ]dodec-9-ene-4,5-dicarboxylic anhydride, bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, and 2-carboxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene anhydride.

Examples of cyclic olefins having halogen atoms include 2-chlorobicyclo[2.2.1]hept-5-ene, 2-chloromethylbicyclo[2.2.1]hept-5-ene,
Examples of such compounds include 2-(chlorophenyl)bicyclo[2.2.1]hept-5-ene, 4-chlorotetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ]dodec-9-ene, and 4-methyl-4-chlorotetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ]dodec-9-ene.

These monomers (b1) may be used alone or in combination of two or more.

<<Cyclic olefin monomer (b2) having no polar group>>
Examples of the cyclic olefin monomer (b2) having no polar group include bicyclo[2.2.1]hept-2-ene (also called "norbornene"), 5-ethyl-bicyclo[2.2.1]hept-2-ene, 5-butyl-bicyclo[2.2.1]hept-2-ene, 5-ethylidene-bicyclo[2.2.1]hept-2-ene, 5-methylidene-bicyclo[2.2.1]hept-2-ene, 5-vinyl-bicyclo[2.2.1]hept-2-ene, tricyclo[5.2.1.0 ^2,6 ]deca-3,8-diene (common name: dicyclopentadiene), tetracyclo[10.2.1.0 ^2,11 . ^{0 4,9} ]pentadeca-4,6,8,13-tetraene, and tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene (also called "tetracyclododecene"); 9-methyl-tetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ] dodec-4-ene; 9-ethyl-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene; 9-methylidene-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene; 9-ethylidene-tetracyclo[6.2.1.1 ^3,6 . ^{0 2,7} ] dodec-4-ene; 9-vinyl-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene; 9-propenyl-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene, pentacyclo[9.2.1.1 ^3,9 . 0 ^2,10 . ^{0 4,8} ] pentadeca-5,12-diene, cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cycloheptene, cyclooctene, cyclooctadiene, indene, 3a,5,6,7a-tetrahydro-4,7-methano-1H-indene, 9-phenyl-tetracyclo[6.2.1.1 ^3,6 . 0 ^2,7 ] dodec-4-ene, tetracyclo[9.2.1.0 ^2,10 . ^{0 3,8} ] tetradeca-3,5,7,12-tetraene, pentacyclo[9.2.1.1 ^3,9 . ^{0 2,10} . 0 ^4,8 ] pentadec-12-ene, and the like.
These monomers (b2) may be used alone or in combination of two or more kinds.

<<Monomer (b3) Other Than Cyclic Olefin>>
Specific examples of the monomer (b3) other than the cyclic olefin include ethylene; propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl- Examples of such α-olefins include those having 2 to 20 carbon atoms, such as 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, and 1-eicosene; non-conjugated dienes, such as 1,5-hexadiene, 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, and 1,7-octadiene, and derivatives thereof; and the like. Among these, α-olefins, particularly ethylene, are preferred.
These monomers (b3) may be used alone or in combination of two or more.

<<Preferred Examples of Monomers and Content Ratio>>
When the cyclic olefin polymer is a cyclic olefin copolymer having a protic polar group, among these monomers (b1) to (b3), from the viewpoint that the effects of the present invention are more remarkable, the cyclic olefin monomer (b1) having a polar group other than a protic polar group is preferred, and a cyclic olefin having an N-substituted imide group is particularly preferred.

When the cyclic olefin polymer is a cyclic olefin copolymer having a protic polar group, the content ratio of the units of the sum of monomers (b1) to (b3) (hereinafter collectively referred to as "copolymerizable monomer (b)") in the cyclic olefin polymer is preferably 10 to 90 mol%, more preferably 20 to 80 mol%, and even more preferably 30 to 70 mol% of the total monomer units. By setting the content ratio of the units of copolymerizable monomer (b) within the above range, the cyclic olefin polymer can be made sufficiently soluble in organic solvents, while the strength and insulating properties when made into a resin film can be improved.

<<Introduction of protic polar groups>>
In the present invention, a cyclic olefin polymer may be obtained by introducing a protic polar group into a cyclic olefin polymer not having a protic polar group using a known modifying agent.
The polymer having no protic polar group can be obtained by polymerizing at least one of the above-mentioned monomers (b1) and (b2) in any combination with the monomer (b3) as necessary.

As a modifying agent for introducing a protic polar group, a compound having a protic polar group and a reactive carbon-carbon unsaturated bond in one molecule is usually used.
Specific examples of such compounds include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, angelic acid, tiglic acid, oleic acid, elaidic acid, erucic acid, brassidic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, atropic acid, and cinnamic acid; and unsaturated alcohols such as allyl alcohol, methylvinylmethanol, crotyl alcohol, methallyl alcohol, 1-phenylethen-1-ol, 2-propen-1-ol, 3-buten-1-ol, 3-buten-2-ol, 3-methyl-3-buten-1-ol, 3-methyl-2-buten-1-ol, 2-methyl-3-buten-2-ol, 2-methyl-3-buten-1-ol, 4-penten-1-ol, 4-methyl-4-penten-1-ol, and 2-hexen-1-ol.
The modification reaction of the polymer using these modifying agents may be carried out according to a conventional method, and is usually carried out in the presence of a radical generator.

<<Polymerization method of cyclic olefin monomer>>
The cyclic olefin polymer used in the present invention may be a ring-opening polymer obtained by ring-opening polymerization of the above-mentioned monomers, or may be an addition polymer obtained by addition polymerization of the above-mentioned monomers. However, in terms of making the effects of the present invention more pronounced, a ring-opening polymer is preferable.

The ring-opening polymer can be produced by ring-opening metathesis polymerization of a cyclic olefin monomer having a protic polar group and a copolymerizable monomer (b) used as needed in the presence of a metathesis reaction catalyst. The production method can be, for example, the method described in paragraphs [0039] to [0079] of WO 2010/110323. On the other hand, the addition polymer can be obtained by polymerizing a cyclic olefin monomer having a protic polar group and a copolymerizable monomer (b) used as needed using a known addition polymerization catalyst, for example, a catalyst consisting of a titanium, zirconium or vanadium compound and an organoaluminum compound.

<<Average molecular weight of cyclic olefin polymer>>
The weight average molecular weight (Mw) of the cyclic olefin polymer used in the present invention is usually in the range of 1,000 to 1,000,000, preferably 1,500 to 100,000, and more preferably 2,000 to 10,000.
The molecular weight distribution of the cyclic olefin polymer, expressed as a ratio of weight average molecular weight/number average molecular weight (Mw/Mn), is usually not more than 4, preferably not more than 3, and more preferably not more than 2.5. The weight average molecular weight (Mw) and molecular weight distribution (Mw/Mn) of the cyclic olefin polymer are values determined as polystyrene equivalent values by gel permeation chromatography (GPC) using a solvent such as tetrahydrofuran as an eluent.

<<Polyvinyl phenol resin>>
The polyvinylphenol resin is not particularly limited as long as it is suitable as a material for a touch sensor substrate. The polyvinylphenol resin is preferably one that satisfies the above-mentioned conditions.
The polyvinylphenol resin used as the binder resin (A) is a polymer having a predetermined monomer unit.

（一般式（Ｉ）中、Ｒ^１は、化学的な単結合、または置換基を有していてもよい炭素数１～６の２価の炭化水素基であり、Ｒ^２は、水素原子、または置換基を有していてもよい炭素数１～６の１価の炭化水素基である。） [Monomer unit]
The monomer unit has a monomer unit represented by the following general formula (I), preferably a vinylphenol monomer unit, and optionally further has a (meth)acrylate monomer unit, an aromatic vinyl monomer unit (excluding a vinylphenol monomer unit), and other monomer units.

(In general formula (I), R ¹ is a chemical single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms which may have a substituent, and R ² is a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms which may have a substituent.)

上記一般式（Ｉ）中、Ｒ^１は、化学的な単結合、または置換基を有していてもよい炭素数１～６の２価の炭化水素基であり、好ましくは、化学的な単結合、または炭素数１～４のアルキレン基（分岐型または直鎖型）であり、より好ましくは、化学的な単結合、または炭素数１～２のアルキレン基である。また、上記一般式（Ｉ）中、Ｒ^２は、水素原子、または置換基を有していてもよい炭素数１～６の１価の炭化水素基であり、好ましくは、水素原子、炭素数１～４のアルキル基、より好ましくは、水素原子、炭素１～２のアルキル基である。 -Monomer unit represented by formula (I)-
The monomer unit represented by the general formula (I) is a structural unit represented by the following general formula (I).

In the above general formula (I), R ¹ is a chemical single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms which may have a substituent, preferably a chemical single bond or an alkylene group (branched or linear) having 1 to 4 carbon atoms, more preferably a chemical single bond or an alkylene group having 1 to 2 carbon atoms. In addition, in the above general formula (I), R ² is a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms which may have a substituent, preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms.

The substituents include, for example, halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms; alkoxy groups having 1 to 10 carbon atoms such as methoxy groups, ethoxy groups, and isopropoxy groups; nitro groups; cyano groups; phenyl groups that may have a substituent such as phenyl groups, 4-methylphenyl groups, and 2-chlorophenyl groups; and hydroxyl groups.

Examples of the monomer unit represented by the general formula (I) include (i) a vinylphenol monomer unit described below, and (ii) a monomer unit derived from a monomer such as α-methyl-4-hydroxystyrene, α-methyl-3-hydroxystyrene, α-methyl-2-hydroxystyrene, 4-hydroxyallylbenzene, 3-hydroxyallylbenzene, or 2-hydroxyallylbenzene. Among these, the vinylphenol monomer unit described below is preferred.

ここで、上記構造式（Ｉ）で表される構造単位は、ビニルフェノール単量体に由来する構造単位のみならず、例えば、後述する合成例１で示すように、任意の保護基でフェノール性水酸基が保護された化合物（例えば、ｐ‐ｔｅｒｔ‐ブトキシスチレン）に由来する構造単位を脱保護して得られた構造単位をも含む。
前記ビニルフェノール単量体の具体例としては、例えば、４－ヒドロキシスチレン（ｐ－ビニルフェノール）、３－ヒドロキシスチレン（ｍ－ビニルフェノール）、ｐ－イソプロペニルフェノール、などを挙げることができる。これらの中でも、入手容易性およびコストの観点で、４－ヒドロキシスチレン（ｐ－ビニルフェノール）が、好ましい。
これらのビニルフェノール単量体、および任意の保護基でフェノール性水酸基が保護された化合物は、一種を単独で使用してもよく、二種以上を併用してもよい。 -Vinylphenol monomer unit-
The vinylphenol monomer unit is a structural unit represented by the following structural formula (I).

Here, the structural unit represented by the structural formula (I) includes not only a structural unit derived from a vinylphenol monomer, but also a structural unit obtained by deprotecting a structural unit derived from a compound in which a phenolic hydroxyl group is protected with an arbitrary protecting group (e.g., p-tert-butoxystyrene), as shown in Synthesis Example 1 described later.
Specific examples of the vinylphenol monomer include 4-hydroxystyrene (p-vinylphenol), 3-hydroxystyrene (m-vinylphenol), p-isopropenylphenol, etc. Among these, 4-hydroxystyrene (p-vinylphenol) is preferred from the viewpoints of availability and cost.
These vinylphenol monomers and compounds in which the phenolic hydroxyl group is protected with an arbitrary protecting group may be used alone or in combination of two or more kinds.

The content of the structural unit represented by structural formula (I) in the polymer is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, and is preferably 80% by mass or less, and more preferably 60% by mass or less.
The polymer can be dissolved in an alkaline developer by containing the structural unit represented by structural formula (I) in an amount of 30% by mass or more, while the polymer can have good transparency when formed into a resin film by containing the vinylphenol monomer unit in an amount of 80% by mass or less.

-(Meth)acrylate monomer unit-
The (meth)acrylate monomer unit is a structural unit derived from a (meth)acrylate monomer. The polymer is preferably a copolymer further having a (meth)acrylate monomer unit. If the polymer is a copolymer further having a (meth)acrylate monomer unit, the transparency of the resin film formed can be improved.

The (meth)acrylate monomer is not particularly limited, and examples thereof include (meth)acrylic acid alkyl esters such as methyl acrylate, ethyl acrylate, n-propyl acrylate, n-butyl acrylate, sec-butyl acrylate, n-heptyl acrylate, n-hexyl acrylate, n-octyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, n-butyl methacrylate, n-octyl methacrylate, and n-decyl methacrylate; (meth)acrylic acid alkoxyalkyl esters such as 2-methoxyethyl acrylate, 3-methoxypropyl acrylate, 3-methoxybutyl acrylate, ethoxymethyl acrylate, 2-methoxyethyl methacrylate, 3-methoxypropyl methacrylate, 3-methoxybutyl methacrylate, and ethoxymethyl methacrylate; and the like. Among these, from the viewpoints of availability, cost, and transparency, (meth)acrylic acid alkyl esters are preferred, and methyl methacrylate is more preferred.
These (meth)acrylate monomers may be used alone or in combination of two or more.

The content of the (meth)acrylate monomer unit in the copolymer is not particularly limited, but is preferably 20% by mass or more, more preferably 40% by mass or more, and is preferably 70% by mass or less, and more preferably 50% by mass or less.
The content of the (meth)acrylate monomer unit in the copolymer is 20% by mass or more, so that the transparency of the resin film formed from the copolymer can be improved. On the other hand, the content of the (meth)acrylate monomer unit in the copolymer is preferably 70% by mass or less.

- Aromatic vinyl monomer units (excluding vinylphenol monomer units) -
The aromatic vinyl monomer unit is a structural unit derived from an aromatic vinyl monomer unit.
The aromatic vinyl monomer unit is not particularly limited, but examples thereof include styrene, o, m, p-methylstyrene, p-tert-butylstyrene, ethylstyrene, 2,4-dimethylstyrene, α-methylstyrene, etc. Among these, styrene is preferred from the viewpoints of availability and cost.
These aromatic vinyl monomer units may be used alone or in combination of two or more.

The content of the aromatic vinyl monomer unit in the copolymer is not particularly limited, but is preferably 30% by mass or more, more preferably 40% by mass or more, and is preferably 80% by mass or less, and more preferably 60% by mass or less.
The content of the aromatic vinyl monomer unit in the copolymer is preferably 30% by mass or more. On the other hand, the content of the aromatic vinyl monomer unit in the copolymer is 80% by mass or less, so that the transparency of the resin film formed from the copolymer can be improved.

-Other monomer units-
The other monomer units are structural units derived from other monomers copolymerizable with the above-mentioned monomers, and examples thereof include N-phenylmaleimide and acrylonitrile.
The other monomers are not particularly limited as long as they do not impair the effects of the present invention.

Specific examples of the polymer include vinylphenol/methyl methacrylate copolymer, vinylphenol/styrene copolymer, vinylphenol homopolymer, etc. Among these, vinylphenol/methyl methacrylate copolymer is preferable.
These polymers may be used alone or in combination of two or more.

[Properties of polymer]
- Weight average molecular weight -
When the polymer is a vinylphenol/methyl methacrylate copolymer, the weight average molecular weight (Mw) is preferably 12,000 or less, more preferably 9,900 or less, preferably 8,000 or more, and more preferably 9,600 or more. If the weight average molecular weight (Mw) of the vinylphenol/methyl methacrylate copolymer is 12,000 or less, the solubility in a solvent can be improved. In addition, if the weight average molecular weight (Mw) of the vinylphenol/methyl methacrylate copolymer is 8,000 or more, it is preferable in terms of heat resistance, formation of a coating film, curability after curing, and mechanical strength.
When the polymer is a vinylphenol/styrene copolymer, the weight average molecular weight (Mw) is preferably 5,000 or less, preferably 3,000 or more, and more preferably 4,000 or more. If the weight average molecular weight (Mw) of the vinylphenol/styrene copolymer is 5,000 or less, the solubility in a solvent can be improved. In addition, if the weight average molecular weight (Mw) of the vinylphenol/styrene copolymer is 3,000 or more, it is preferable in terms of heat resistance, formation of a coating film, curability after curing, and mechanical strength.
When the polymer is a vinylphenol homopolymer, the weight average molecular weight (Mw) is preferably 11,000 or less, more preferably 10,000 or less, and preferably 4,000 or more, more preferably 9,000 or more. If the weight average molecular weight (Mw) of the vinylphenol homopolymer is 11,000 or less, the solubility in a solvent can be improved. In addition, if the weight average molecular weight (Mw) of the vinylphenol homopolymer is 4,000 or more, it is preferable in terms of heat resistance, formation of a coating film, curability after curing, and mechanical strength.
The above values are polystyrene equivalents.

- Molecular weight distribution -
The molecular weight distribution (Mw/Mn) of the above-mentioned polymer is preferably 1.5 or more, preferably 5.0 or less, and more preferably 3.0 or less. If the molecular weight distribution (Mw/Mn) of the polymer is 1.5 or more, the ease of production of the polymer can be improved.

<<Polyamideimide>>
The polyamideimide (polyamideimide resin) is not particularly limited as long as it is suitable as a material for a touch sensor substrate. The polyamideimide is preferably one that satisfies the above-mentioned conditions.

The polyamideimide is preferably a polyamideimide having a protic polar group. Examples of the protic polar group include those mentioned above. The polyamideimide may be either a polyamideimide having a branched structure or a polyamideimide having a linear structure, but is preferably a polyamideimide having a branched structure. If the polyamideimide is a polyamideimide having a branched structure, the solubility of the resin composition in a solvent can be improved.

[Polyamide-imide having a branched structure]
Examples of the polyamideimide having a branched structure include a compound having a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2), and having one or more terminal structures represented by the following structural formulas (1), (2) and (3), a compound represented by the following general formula (3), a polyamideimide resin having a branched structure (manufactured by DIC Corporation: Unidic EMG-793), and a polyamideimide resin having a branched structure (manufactured by DIC Corporation: Unidic EMG-1015).

・・・一般式（１）
但し、前記一般式（１）中、Ｒ_１は炭素数６～１３の環式脂肪族構造を有する２価の有機基を表す。

...General formula (1)
In the general formula (1), R ₁ represents a divalent organic group having a cycloaliphatic structure having 6 to 13 carbon atoms.

・・・一般式（２）
但し、前記一般式（２）中、Ｒ_１は炭素数６～１３の環式脂肪族構造を有する２価の有機基を表し、Ｒ_２は数平均分子量が７００～４５００の２価の線状炭化水素構造を表す。

...General formula (2)
In the general formula (2), R ₁ represents a divalent organic group having a cycloaliphatic structure with 6 to 13 carbon atoms, and R ₂ represents a divalent linear hydrocarbon structure having a number average molecular weight of 700 to 4,500.

・・・構造式（１）

...Structural formula (1)

・・・構造式（２）

...Structural formula (2)

・・・構造式（３）

...Structural formula (3)

・・・一般式（３）
但し、前記一般式（３）中、ｎは、２以上２００以下である。

...General formula (3)
In the general formula (3), n is 2 or more and 200 or less.

The compound represented by the general formula (3) can be obtained by reacting isophorone diisocyanate isocyanurate with trimellitic anhydride (see reaction formula (1) below).

・・・反応式（１）
但し、前記反応式（１）中、ｎは２以上２００以下である

...Reaction formula (1)
In the reaction formula (1), n is 2 or more and 200 or less.

In the reaction shown in the above reaction formula (1), a multifunctional polyol containing two or more hydroxyl groups may be added as a chain transfer agent to introduce a moiety having a urethane structure into a partial structure of the above general formula (3). By introducing the moiety having a urethane structure into a partial structure of the above general formula (3), the physical properties of the polyamideimide having a branched structure can be controlled. An example of the moiety having a urethane structure is the moiety represented by the following general formula (4).

・・・一般式（４）
但し、前記一般式（４）中、Ｒ_１は炭素数６～１３の環式脂肪族構造を有する有機基を表し、Ｒ_２は数平均分子量が７００～４，５００の線状炭化水素構造を表す。

...General formula (4)
In the general formula (4), R ₁ represents an organic group having a cyclic aliphatic structure with 6 to 13 carbon atoms, and R ₂ represents a linear hydrocarbon structure having a number average molecular weight of 700 to 4,500.

[Polyamideimide having a linear structure]
Examples of the polyamideimide having a linear structure include a compound represented by the following general formula (3).

・・・一般式（３）
但し、前記一般式（３）中、ｎは２以上４００以下である。

...General formula (3)
In the general formula (3), n is 2 or more and 400 or less.

The compound represented by the general formula (3) can be obtained by reacting trimellitic anhydride with isophorone diisocyanate (see reaction formula (2) below).

・・・反応式（２）
但し、前記反応式（２）中、ｎは２以上４００以下である。

...Reaction formula (2)
In the reaction formula (2), n is 2 or more and 400 or less.

[Properties of polyamideimide]
--Number average molecular weight--
Here, the number average molecular weight (Mn) of the polyamideimide is preferably 30,000 or less, more preferably 8,000 or less, and more preferably 1,000 or more. If the number average molecular weight (Mn) of the polyamideimide is 30,000 or less, the solubility in a solvent can be improved. Also, if the number average molecular weight (Mn) of the polyamideimide is 1,000 or more, the heat resistance and mechanical strength after curing are excellent.

When the polyamideimide has a branched structure, the number average molecular weight (Mn) is preferably 30,000 or less, and more preferably 2,000 or more. If the number average molecular weight (Mn) of the polyamideimide having a branched structure is 30,000 or less, the solubility in a solvent can be improved. If the number average molecular weight (Mn) of the polyamideimide having a branched structure is 2,000 or more, the heat resistance and mechanical strength after curing are excellent.
In addition, when the polyamideimide has a branched structure, the weight average molecular weight (Mw) is preferably 100,000 or less, and more preferably 3,000 or more. If the weight average molecular weight (Mw) of the polyamideimide having a branched structure is 100,000 or less, the solubility in a solvent can be improved. In addition, if the weight average molecular weight (Mw) of the polyamideimide having a branched structure is 3,000 or more, the heat resistance and mechanical strength after curing are excellent.

When the polyamideimide has a linear structure, the number average molecular weight (Mn) is preferably 20,000 or less, and more preferably 1,000 or more. If the number average molecular weight (Mn) of the polyamideimide having a linear structure is 20,000 or less, the solubility in solvents can be improved. Furthermore, if the number average molecular weight (Mn) of the polyamideimide having a linear structure is 1,000 or more, the heat resistance and mechanical strength after curing are excellent.

<<Acrylic resin>>
The acrylic resin used in the present invention is not particularly limited, but is preferably a homopolymer or copolymer containing, as an essential component, at least one selected from the group consisting of a carboxylic acid having an acrylic group, a carboxylic acid anhydride having an acrylic group, and an oxetane group-containing acrylate compound.

Specific examples of carboxylic acids having an acrylic group include (meth)acrylic acid (meaning acrylic acid and/or methacrylic acid. Hereinafter, the same applies to methyl (meth)acrylate, etc.), crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, glutaconic acid, mono-(2-((meth)acryloyloxy)ethyl phthalate), N-(carboxyphenyl)maleimide, and N-(carboxyphenyl)(meth)acrylamide.
Specific examples of carboxylic acid anhydrides having an acrylic group include maleic anhydride and citraconic anhydride.
Specific examples of the oxetane group-containing acrylate compound include (3-methyloxetan-3-yl)methyl (meth)acrylate, (3-ethyloxetan-3-yl)methyl (meth)acrylate, (3-methyloxetan-3-yl)ethyl (meth)acrylate, (3-ethyloxetan-3-yl)ethyl (meth)acrylate, (3-chloromethyloxetan-3-yl)methyl (meth)acrylate, (oxetane-2-yl)methyl (meth)acrylate, and (3-methyloxetan-3-yl)ethyl (meth)acrylate. (1-methyl-1-oxetanyl)-2-phenyl-3-(meth)acrylate, (1-methyl-1-oxetanyl)-2-trifluoromethyl-3-(meth)acrylate, and (1-methyl-1-oxetanyl)-4-trifluoromethyl-2-(meth)acrylate.
Of these, (meth)acrylic acid, maleic anhydride, glycidyl (meth)acrylate, and the like are preferred.

The acrylic resin (A2) may be a copolymer of at least one selected from unsaturated carboxylic acids and unsaturated carboxylic anhydrides with other acrylate monomers or copolymerizable monomers other than acrylates.

Other acrylate monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, Alkyl (meth)acrylates such as decyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, and isostearyl (meth)acrylate; hydroxyalkyl (meth)acrylates such as hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; phenoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, and ) acrylate and other phenoxyalkyl (meth)acrylates; alkoxyalkyl (meth)acrylates such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-propoxyethyl (meth)acrylate, 2-butoxyethyl (meth)acrylate, and 2-methoxybutyl (meth)acrylate; polyethylene glycol mono(meth)acrylate, ethoxydiethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, and nonylphenoxypolyethylene glycol (meth)acrylate. polyalkylene glycol (meth)acrylates such as polypropylene glycol mono(meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolypropylene glycol (meth)acrylate, and nonylphenoxypolypropylene glycol (meth)acrylate; cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, 4-butylcyclohexyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl (meth)acrylate, tricyclo[5.2.1.0]acrylate, Cycloalkyl (meth)acrylates ^such as tricyclo[5.2.1.0 ^2,6 ]-3-decen-8-yl (meth)acrylate, tricyclo[5.2.1.0 ^2,6 ]-3-decen-9-yl (meth)acrylate, bornyl (meth)acrylate, and isobornyl (meth)acrylate; phenyl (meth)acrylate, naphthyl (meth)acrylate, biphenyl (meth)acrylate, benzyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 5-tetrahydrofurfuryloxycarbonylpentyl (meth)acrylate, vinyl (meth)acrylate, allyl (meth)acrylate, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, 2-[tricyclo[5.2.1.0 ^2,6 ] decan-8-yloxy] ethyl (meth) acrylate, 2-[tricyclo[5.2.1.0 ^2,6 ]-3-decen-8-yloxy] ethyl (meth) acrylate, 2-[tricyclo[5.2.1.0 ^2,6 ]-3-decen-9-yloxy]ethyl (meth)acrylate, γ-butyrolactone (meth)acrylate, maleimide, N-methylmaleimide, N-ethylmaleimide, N-butylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, N-(2,6-diethylphenyl)maleimide, N-(4-acetylphenyl)maleimide, N-(4-hydroxyphenyl)maleimide, N-(4-acetoxyphenyl)maleimide, N-(4-dimethylamino-3,5-dinitrophenyl)maleimide, N-(1-anilinonaphthyl-4)maleimide, N-[4-(2-benzoxazolyl)phenyl]maleimide, N-(9-acridinyl)maleimide, and the like.
Of these, methyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, benzyl (meth)acrylate, tricyclo[5.2.1.0 ^2,6 ]decan-8-yl (meth)acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, and the like are preferred.

The copolymerizable monomer other than acrylate is not particularly limited as long as it is a compound copolymerizable with the above-mentioned carboxylic acid having an acrylic group or carboxylic acid anhydride having an acrylic group, and examples thereof include radical polymerizable compounds such as vinylbenzyl methyl ether, vinyl glycidyl ether, styrene, α-methylstyrene, vinyl toluene, indene, vinyl naphthalene, vinyl biphenyl, chlorostyrene, bromostyrene, chloromethylstyrene, p-tert-butoxystyrene, p-hydroxystyrene, p-hydroxy-α-methylstyrene, p-acetoxystyrene, p-carboxystyrene, 4-hydroxyphenyl vinyl ketone, acrylonitrile, methacrylonitrile, (meth)acrylamide, isobutene, norbornene, butadiene, and isoprene.
These compounds may be used alone or in combination of two or more.
The polymerization method of the above monomers may be a conventional method, for example, suspension polymerization, emulsion polymerization, solution polymerization, etc.

<<Polyimide>>
The polyimide (A3) used in the present invention can be obtained by heat-treating a polyimide precursor obtained by reacting a tetracarboxylic anhydride with a diamine. Examples of precursors for obtaining polyimides include polyamic acid, polyamic acid ester, polyisoimide, and polyamic acid sulfonamide.

The polyimide (A3) used in the present invention is synthesized by a known method, such as by selectively combining a tetracarboxylic dianhydride with a diamine and reacting them in a polar solvent such as N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, dimethylsulfoxide, hexamethylphosphorotriamide, γ-butyrolactone, or cyclopentanone.

When an excess of diamine is used for polymerization, the terminal amino groups of the resulting polyimide (A3) can be reacted with a carboxylic acid anhydride to protect the terminal amino groups. Also, when an excess of tetracarboxylic acid anhydride is used for polymerization, the terminal acid anhydride groups of the resulting polyimide (A3) can be reacted with an amine compound to protect the terminal acid anhydride groups.

Examples of such carboxylic acid anhydrides include phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, itaconic anhydride, and tetrahydrophthalic anhydride, and examples of amine compounds include aniline, 2-hydroxyaniline, 3-hydroxyaniline, 4-hydroxyaniline, 2-ethynylaniline, 3-ethynylaniline, and 4-ethynylaniline.

<<Cardo Resin>>
The cardo resin (A4) used in the present invention is a resin having a cardo structure, i.e., a skeleton structure in which two ring structures are bonded to a quaternary carbon atom constituting a ring structure. A typical cardo structure is one in which a fluorene ring is bonded to a benzene ring.
Specific examples of a skeletal structure in which two cyclic structures are bonded to a quaternary carbon atom constituting a cyclic structure include a fluorene skeleton, a bisphenolfluorene skeleton, a bisaminophenylfluorene skeleton, a fluorene skeleton having an epoxy group, and a fluorene skeleton having an acrylic group.
The cardo resin (A4) used in the present invention is formed by polymerization of the backbone having the cardo structure through a reaction between the functional groups bonded to the backbone. The cardo resin (A4) has a structure (cardo structure) in which the main chain and the bulky side chains are connected by one element, and has a cyclic structure in a direction almost perpendicular to the main chain.

（上記一般式（３）中、ｍは０～１０の整数である。） As an example of the cardo structure, an example of a cardo structure having an acrylate structure is shown in the following general formula (3).

(In the above general formula (3), m is an integer from 0 to 10.)

Examples of monomers having a cardo structure include bis(glycidyloxyphenyl)fluorene type epoxy resins; condensates of bisphenolfluorene type epoxy resins and acrylic acid; bisphenols containing a cardo structure, such as 9,9-bis(4-hydroxyphenyl)fluorene and 9,9-bis(4-hydroxy-3-methylphenyl)fluorene; 9,9-bis(cyanoalkyl)fluorenes, such as 9,9-bis(cyanomethyl)fluorene; and 9,9-bis(aminoalkyl)fluorenes, such as 9,9-bis(3-aminopropyl)fluorene.
The cardo resin (A4) is a polymer obtained by polymerizing a monomer having a cardo structure, but it may be a copolymer with other copolymerizable monomers.
The polymerization method of the above monomers may be a conventional method, for example, a ring-opening polymerization method or an addition polymerization method.

<<Polysiloxane>>
The polysiloxane (A5) used in the present invention is not particularly limited, but preferably includes a polymer obtained by mixing and reacting one or more organosilanes represented by the following general formula (4).
(R ⁴ ) _p -Si-(OR ⁵ ) _4-p (4)

In the above general formula (4), R ⁴ is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms, and a plurality of R ^4s may be the same or different. These alkyl groups, alkenyl groups, and aryl groups may all have a substituent, or may be unsubstituted without a substituent, and can be selected according to the properties of the composition. Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an n-hexyl group, an n-decyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 3,3,3-trifluoropropyl group, a 3-glycidoxypropyl group, a 2-(3,4-epoxycyclohexyl)ethyl group, a 3-aminopropyl group, a 3-mercaptopropyl group, and a 3-isocyanatopropyl group. Specific examples of the alkenyl group include a vinyl group, a 3-acryloxypropyl group, and a 3-methacryloxypropyl group. Specific examples of the aryl group include a phenyl group, a tolyl group, a p-hydroxyphenyl group, a 1-(p-hydroxyphenyl)ethyl group, a 2-(p-hydroxyphenyl)ethyl group, a 4-hydroxy-5-(p-hydroxyphenylcarbonyloxy)pentyl group, and a naphthyl group.

In the above general formula (4), R ⁵ is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 1 to 6 carbon atoms, or an aryl group having 6 to 15 carbon atoms, and a plurality of R ^5s may be the same or different. These alkyl groups and acyl groups may have a substituent or may be unsubstituted without a substituent, and can be selected according to the properties of the composition. Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group. Specific examples of the acyl group include an acetyl group. Specific examples of the aryl group include a phenyl group.

In addition, in the above general formula (4), p is an integer from 0 to 3, and when p = 0, it is a tetrafunctional silane, when p = 1, it is a trifunctional silane, when p = 2, it is a difunctional silane, and when p = 3, it is a monofunctional silane.

Specific examples of organosilanes represented by the above general formula (4) include tetrafunctional silanes such as tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane, and tetraphenoxysilane; methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltri-n-butoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane, ethyltri-n-butoxysilane, and n-propyltrimethoxysilane; n-propyltriethoxysilane, n-butyltrimethoxysilane, n-butyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, decyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, p- Trifunctional silanes such as hydroxyphenyltrimethoxysilane, 1-(p-hydroxyphenyl)ethyltrimethoxysilane, 2-(p-hydroxyphenyl)ethyltrimethoxysilane, 4-hydroxy-5-(p-hydroxyphenylcarbonyloxy)pentyltrimethoxysilane, trifluoromethyltrimethoxysilane, trifluoromethyltriethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane; bifunctional silanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldiacetoxysilane, di-n-butyldimethoxysilane, and diphenyldimethoxysilane; and monofunctional silanes such as trimethylmethoxysilane and tri-n-butylethoxysilane.
Among these organosilanes, trifunctional silanes are preferred from the viewpoint of the crack resistance and hardness of the resulting resin film. These organosilanes may be used alone or in combination of two or more.

The polysiloxane (A4) used in the present invention is obtained by hydrolyzing and partially condensing the above-mentioned organosilane. A general method can be used for the hydrolysis and partial condensation. For example, a solvent, water, and optionally a catalyst are added to the mixture, and the mixture is heated and stirred. During stirring, hydrolysis by-products (alcohols such as methanol) and condensation by-products (water) may be removed by distillation as necessary.

The weight average molecular weight (Mw) of the binder resin (A) used in the present invention is usually in the range of 1,000 to 1,000,000, preferably 1,500 to 100,000, and more preferably 2,000 to 30,000.
The molecular weight distribution of the binder resin (A), in terms of the ratio of weight average molecular weight/number average molecular weight (Mw/Mn), is usually 4 or less, preferably 3 or less, and more preferably 2.5 or less.
The weight average molecular weight (Mw) and molecular weight distribution (Mw/Mn) of the binder resin (A) are values determined as polystyrene equivalent values by gel permeation chromatography (GPC) using a solvent such as tetrahydrofuran as an eluent.

<Photobase Generator (B)>
The photobase generator (B) functions as an initiator. The resin composition containing the photobase generator (B) as an initiator is effective for providing a resin composition that can be used as a touch sensor substrate having excellent transparency, and a resin film and a touch sensor substrate using the resin composition. The photobase generator (B) is not particularly limited as long as it is a compound that generates a base by irradiation with active energy rays such as visible light and ultraviolet light. Examples of the photobase generator (B) include nonionic photobase generators and ionic photobase generators.

<<Nonionic Photobase Generator>>
Examples of nonionic photobase generators include compounds that generate a base upon irradiation with active energy rays, such as amine compounds (noncyclic amine compounds, heterocyclic amine compounds) and guanidine compounds.

An example of a nonionic photobase generator that generates an amine compound upon irradiation with active energy rays is a compound having the structure shown in the following formula.

In the formula, Ar is an aromatic hydrocarbon group which may be substituted. Examples of the aromatic hydrocarbon group include phenyl, naphthyl, and anthralyl. Examples of the substituents which may substitute the aromatic hydrocarbon group include alkyl, alkenyl, hydroxy, carboxy, acyl, nitro, amino, cyano, and oxo. The number of the substituents which may substitute the aromatic hydrocarbon group may be 1 or more (e.g., 1, 2, 3, 4, and 5).
Examples of the optionally substituted phenyl include phenyl, hydroxyphenyl, and nitrophenyl.
The optionally substituted naphthyl includes, for example, naphthyl, hydroxynaphthyl, and nitronaphthyl.
Examples of the optionally substituted anthralyl include anthralyl, hydroxyanthraryl, nitroanthraryl, and anthraquinonyl (anthracene-9,10-dione-yl).
Ar is preferably optionally substituted phenyl or optionally substituted anthralyl, more preferably optionally substituted anthralyl, further preferably anthralyl or anthraquinonyl, and even more preferably anthralyl.

In the formula, L is a divalent linker. Examples of the divalent linker include linear or branched alkylene, optionally substituted cycloalkylene, linear or branched alkenylene, optionally substituted cycloalkenylene, oxy, carbonyl, and combinations thereof.
The linear or branched alkylene is preferably a linear or branched alkylene having 1 to 6 carbon atoms, and examples thereof include methylene, ethylene, propanediyl, butanediyl, pentanediyl, hexanediyl, and methylmethylene.
The cycloalkylene is preferably a cycloalkylene having 3 to 6 carbon atoms, and examples thereof include cyclopropanediyl, cyclobutanediyl, cyclopentanediyl, and cyclohexanediyl.
The linear or branched alkenylene is preferably a linear or branched alkenylene having from 2 to 6 carbon atoms, and examples thereof include ethenediyl, propenediyl, butenediyl, pentenediyl, and hexenediyl.
The cycloalkenylene is preferably a cycloalkenylene having 3 to 6 carbon atoms, and examples thereof include cyclopropenediyl, cyclobutenediyl, cyclopentenediyl, and cyclohexenediyl.
Examples of the combination of the above divalent groups include linear or branched alkyleneoxy (eg, methyleneoxy, ethyleneoxy, methylmethyleneoxy).
L is preferably linear or branched alkyleneoxy and linear or branched alkenylene, more preferably methyleneoxy, methylmethyleneoxy, or ethenediyl.

In the formula, the R ^b1 -N-R ^b2 moiety forms an amine (acyclic amine, heterocyclic amine), where R ^b1 and R ^b2 may each independently be any substituent, or may together form a ring structure.

When R ^b1 and R ^b2 are each independently any substituent, the R ^b1 -N-R ^b2 moiety forms an acyclic amine. Examples of such R ^b1 and R ^b2 include hydrocarbon groups. Examples of the hydrocarbon group include linear or branched alkyl, linear or branched alkenyl, cycloalkyl, cycloalkenyl, aromatic hydrocarbon groups, and groups in which these are further substituted with a hydrocarbon group.
The straight-chain or branched alkyl is preferably a straight-chain or branched alkyl having 1 to 6 carbon atoms, and examples thereof include methyl, ethyl, propyl (e.g., n-propyl, isopropyl), butyl (e.g., n-butyl, isobutyl, sec-butyl, tert-butyl), pentyl (e.g., n-pentyl, neopentyl, tert-pentyl), and hexyl (e.g., n-hexyl, isohexyl).
The straight-chain or branched alkenyl is preferably a straight-chain or branched alkenyl having from 2 to 6 carbon atoms, and examples thereof include ethenyl, allyl, propenyl (1-propenyl, isopropenyl), butenyl, pentenyl, and hexenyl.
The cycloalkyl is preferably a cycloalkyl having 3 to 6 carbon atoms, and examples thereof include cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl.
The cycloalkenyl is preferably a cycloalkenyl having 3 to 6 carbon atoms, and examples thereof include cyclopropenyl, cyclobutenyl, cyclopentenyl, and cyclohexenyl.
The aromatic hydrocarbon group is preferably an aromatic hydrocarbon group having 6 to 10 carbon atoms, and examples thereof include phenyl and naphthyl.
When R ^b1 and R ^b2 are each independently any substituent, R ^b1 and R ^b2 are preferably linear or branched alkyl having 1 to 6 carbon atoms, more preferably linear alkyl having 1 to 6 carbon atoms, and further preferably ethyl.

When R ^b1 and R ^b2 together form a ring structure, the R ^b1 -N-R ^b2 moiety forms a heterocyclic amine. Such heterocyclic amines include optionally substituted non-aromatic nitrogen-containing heterocycles and optionally substituted aromatic nitrogen-containing heterocycles. Examples of non-aromatic nitrogen-containing heterocycles include pyrrolidine, piperidine, piperazine, and morpholine. Examples of aromatic nitrogen-containing heterocycles include pyrrole, pyrazole, imidazole, pyridine, pyridazine, pyrimidine, pyrazine, oxazole, and thiazole.
Examples of the substituents substituting the non-aromatic nitrogen-containing heterocycle or aromatic nitrogen-containing heterocycle include hydrocarbon groups, hydroxy, acyl, carboxy, nitro, amino, cyano, and oxo, which may be substituted with a substituent (e.g., hydrocarbon group, hydroxy, acyl, carboxy, nitro, amino, cyano, and oxo). Examples of the hydrocarbon group include the above-mentioned alkyl and alkenyl. Examples of the acyls include saturated acyls such as formyl, acetyl, and propionyl, and unsaturated acyls such as acryloyl and methacryloyl. Examples of the carboxyl groups include saturated carboxyls such as acetoxy and propionyloxy, and unsaturated carboxyls such as acryloyloxy and methacryloyloxy.
When R ^b1 and R ^b2 together form a ring structure, the R ^b1 -NR ^b2 moiety is preferably an optionally substituted piperidine or imidazole.

Commercially available nonionic photobase generators that generate amine compounds may be used. Commercially available products include, for example, WPBG-015 (piperidine-1-carboxylate 9-anthrylmethyl), WPBG-018 (9-anthrylmethyl N,N-diethylcarbamate), WPBG-025 ((E)-N-cyclohexyl-3-(2-hydroxyphenyl)acrylamide), WPBG-027 ((E)-1-piperidino-3-(2-hydroxyphenyl)-2-propen-1-one), WPBG-041 (9-anthrylmethyl N-cyclohexylcarbamate), WPBG-140 (1-(anthraquinone-2-yl)ethyl imidazole carboxylate), WPBG-158 (4-hydroxypiperidine-1-carboxylate (2-nitrophenyl)methyl), and WPBG-165 (2-nitrophenyl methyl 4-methacryloyloxy) piperidine-1-carboxylate), WPBG-166 (N,N-dicyclohexylcarbamate 1-(anthraquinone-2-yl)ethyl), WPBG-172 (N,N-dicyclohexylcarbamate 9-anthrylmethyl), WPBG-174 (N-cyclohexylcarbamate 1-(anthraquinone-2-yl)ethyl) and other WPBG series.

Other nonionic photobase generators are not particularly limited as long as they are compounds capable of generating a base upon irradiation with active energy rays, and known photobase generators can be used. Examples of component (B) include imidazole derivatives such as N-(2-nitrobenzyloxycarbonyl)imidazole, N-(3-nitrobenzyloxycarbonyl)imidazole, N-(4-nitrobenzyloxycarbonyl)imidazole, N-(4-chloro-2-nitrobenzyloxycarbonyl)imidazole, N-(5-methyl-2-nitrobenzyloxycarbonyl)imidazole, and N-(4,5-dimethyl-2-nitrobenzyloxycarbonyl)imidazole; N-(2-methyl-2-phenylpropionyloxy)-N-cyclohexylamine; and the like.

The method for preparing the nonionic photobase generator is not particularly limited, and known methods can be used. For example, a synthesis method can be used in which a nitrobenzyl alcohol derivative is used as a raw material and reacted with carbonyldiimidazole. Alternatively, the nonionic photobase generator can be prepared according to the method described in Nishikubo, T. et al., Polym. J., 26(7), 864 (1994).

<<Ionic Photobase Generator>>
The ionic photobase generator is a salt that dissociates a strongly basic cation upon irradiation with active energy rays, such as a salt of a strongly basic cation and a photoreactive weakly acidic anion.

Examples of strong basic cations include cations containing a guanidine structure, cations containing an amine structure, and cations containing an amidine structure.

Examples of guanidine structure-containing cations include the cations shown in the following formula:

In the formula, R ^b11 to R ^b16 are each independently any substituent. R ^b11 to R ^b16 are each independently preferably the above-mentioned hydrocarbon group, more preferably linear or branched alkyl, or cycloalkyl, and further preferably methyl, isopropyl, or cyclohexyl.

Examples of photoreactive weakly acidic anions include anions containing one or more (preferably two or more) aromatic hydrocarbon rings and an anion-forming moiety. Examples of aromatic hydrocarbon rings include an optionally halogenated benzene ring, a naphthalene ring, and an anthracene ring, and an optionally halogenated benzene ring is preferred. Examples of anion-forming moieties include a boron anion center and a carboxylate ion.

The ionic photobase generator that generates guanidine structure-containing cations may be a commercially available product. Examples of commercially available products include the WPBG series, such as WPBG-082 (guanidinium 2-(3-benzoylphenyl)propionate), WPBG-266 (1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium 2-(3-benzoylphenyl)propionate), WPBG-300 (1,2-dicyclohexyl-4,4,5,5-tetramethylbiguanidinium n-butyltriphenylborate), and WPBG-345 ((Z)-{[bis(dimethylamino)methylidene]amino}-N-cyclohexyl(cyclohexylamino)methaniminium tetrakis(3-fluorophenyl)borate), manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.

Examples of ionic photobase generators that generate amine structure-containing cations upon irradiation with active energy rays include WPBG-167 (dicyclohexylammonium 2-(3-benzoylphenyl)propionate) and WPBG-168 (cyclohexylammonium 2-(3-benzoylphenyl)propionate), both of which are products of Fujifilm Wako Pure Chemical Industries, Ltd.

An example of an ionic photobase generator that generates an amidine structure-containing cation upon irradiation with active energy rays is WPBG-246 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.).

<<Preferable Examples of Photobase Generator (B)>>
From the viewpoint of promoting the curing reaction, the photobase generator (B) is preferably a compound having absorption at g-line (436 nm), h-line (405 nm), or i-line (365 nm), and more preferably a compound having absorption at i-line (365 nm).
In addition, the photobase generator (B) is preferably a nonionic photobase generator from the viewpoint of obtaining high compatibility with the binder resin (A). Among nonionic photobase generators, the photobase generator (B) is more preferably a compound having an anthracene (e.g., anthracene, anthraquinone (anthracene-9,10-dione)) skeleton which may be substituted, and even more preferably a compound having an anthracene skeleton. By increasing the compatibility between the binder resin (A) and the photobase generator (B), the occurrence of cracks in the resin film after molding is suppressed, and the transparency and durability of the resin film after molding are improved.

<<Amount of Photobase Generator (B)>>
The amount of the photobase generator (B) is not particularly limited and may be adjusted appropriately. The amount of the photobase generator (B) is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more, relative to 100 parts by mass of the binder resin (A) from the viewpoint of promoting the curing reaction. In addition, the amount of the photobase generator (B) is preferably 60 parts by mass or less, more preferably 40 parts by mass or less, and even more preferably 20 parts by mass or less, relative to 100 parts by mass of the binder resin (A) from the viewpoint of maintaining high compatibility of the blended components.

〔式（ＩＩ）または式（ＩＩＩ）中、Ｒ^３は置換基を有していても良いアルキル基を示す。〕 <Sensitizer (C)>
The sensitizer (C) has a function of improving the sensitivity of the curing reaction. The resin composition containing the sensitizer (C) is effective for providing a resin composition that can be used as a touch sensor substrate capable of suppressing the occurrence of wrinkles in a transparent electrode on a substrate even at high temperatures, and a resin film and a touch sensor substrate using the resin composition. The sensitizer (C) is not particularly limited as long as it is a substance that can transfer stimuli such as heat and light to other substances, and can be any known sensitizer. In particular, as the sensitizer, a sensitizer containing a naphthalene structure or an anthracene structure is preferred, and a compound represented by the following general formula (II) or formula (III) is more preferred. The sensitizer can be used alone or in a mixture of two or more types.

[In formula (II) or (III), ^R3 represents an alkyl group which may have a substituent.]

The "alkyl group" in the alkyl group which may have a substituent, which is R ³ in the above formula (II) or formula (III), is preferably an alkyl group having 2 or more carbon atoms. The "alkyl group" is preferably an alkyl group having 12 or less carbon atoms. Furthermore, the "alkyl group" is more preferably a linear alkyl group. The substituent of R ³ includes a carbonyl group and an alkoxy group, and a carbonyl group is preferable. From the viewpoint of further improving the sensitivity of the obtained resin film, R ³ is preferably an unsubstituted linear alkyl group. The two R ³ included in the above formula (II) or formula (III) may be the same or different from each other, but it is preferable that they are the same.

Examples of ^R3 include alkyl groups such as methyl, ethyl, propyl (n-propyl, isopropyl), butyl (e.g., n-butyl, isobutyl, sec-butyl, tert-butyl), pentyl (e.g., n-pentyl, neopentyl, tert-pentyl), hexyl (e.g., n-hexyl, isohexyl), heptyl, octyl, nonyl, decyl, undecyl, and dodecyl; alkyl groups having a carbonyl group such as formyl, acetyl, propionyl, butanoyl, pentanoyl, hexanoyl, heptanoyl, octanoyl, nonanoyl, decanoyl, undecanoyl, and dodecanoyl; and alkyl groups having an alkoxy group such as methoxymethyl and methoxyethyl.

<<Specific examples of sensitizer (C)>>
Sensitizer (C) may be a commercially available product from the viewpoint of availability. Examples of commercially available products include 9,10-bis(octanoyloxy)anthracene (manufactured by Kawasaki Chemical Industries, product name "UVS-581"), 1,4-diethoxynaphthalene (manufactured by Kawasaki Chemical Industries, product name "UVS-2171"), 9,10-dibutoxyanthracene (manufactured by Kawasaki Chemical Industries, product name "UVS-1331"), and 9,10-diethoxyanthracene (manufactured by Kawasaki Chemical Industries, product name "UVS-1101"). Sensitizer (C) is preferably 9,10-bis(octanoyloxy)anthracene, 1,4-diethoxynaphthalene, or a mixture thereof from the viewpoint of improving the wrinkle suppression performance of transparent electrodes such as ITO at high temperatures.

<<Amount of Sensitizer (C)>>
The amount of the sensitizer (C) is not particularly limited and may be adjusted as appropriate. The amount of the sensitizer (C) is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, and even more preferably 1.0 parts by mass or more, relative to 100 parts by mass of the binder resin (A) from the viewpoint of increasing the activity of the photobase generator. In addition, the amount of the sensitizer (C) is preferably 60 parts by mass or less, more preferably 40 parts by mass or less, and even more preferably 20 parts by mass or less, relative to 100 parts by mass of the binder resin (A) from the viewpoint of maintaining high compatibility of the blended components.

<<Mixing ratio of sensitizer (C) to photobase generator (B)>>
The mass blending ratio of the sensitizer (C) to the photobase generator (B) (sensitizer (C)/photobase generator (B)) is preferably 0.1 or more, more preferably 0.2 or more, and even more preferably 0.5 or more, from the viewpoint of enhancing the activity of the photobase generator. Moreover, the mass blending ratio of the photobase generator (B) to the sensitizer (C) (sensitizer (C)/photobase generator (B)) is preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less, from the viewpoint of maintaining high compatibility of the blended components.

<Epoxy Crosslinking Agent (D)>
The epoxy crosslinking agent (D) has a function of crosslinking and curing the binder resin (A). Examples of the epoxy crosslinking agent (D) include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, polyphenol type epoxy resins, cyclic aliphatic epoxy resins, aliphatic glycidyl ethers, and epoxy acrylate polymers.

Specific examples of epoxy crosslinking agents (D) include a trifunctional epoxy compound with a dicyclopentadiene backbone (trade name "XD-1000" manufactured by Nippon Kayaku Co., Ltd.), a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)1-butanol (a 15-functional alicyclic epoxy resin having a cyclohexane backbone and terminal epoxy groups. Trade name "EHPE3150" manufactured by Daicel Chemical Industries, Ltd.), and epoxidized 3-cyclohexene-1,2-dicarboxylate bis(3-cyclohexenylmethyl)-modified ε-caprolactone (an aliphatic cyclic trifunctional epoxy resin. Trade name " Epolead GT301, manufactured by Daicel Chemical Industries, Ltd.), epoxidized butanetetracarboxylic acid tetrakis(3-cyclohexenylmethyl) modified ε-caprolactone (aliphatic cyclic tetrafunctional epoxy resin. Trade name: Epolead GT401, manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl acrylate (Trade name: Cyclomer A400, manufactured by Daicel Chemical Industries, Ltd.), 1,2,8,9-diepoxylimonene (Trade name: Celloxide 3000, manufactured by Daicel Chemical Industries, Ltd.), (3',4'-epoxycyclohexane) methyl 3,4-epoxycyclohexane carboxylate (Trade name: epoxy compounds having an alicyclic structure such as 1,2-epoxy-4-vinylcyclohexane (trade name "Celloxide 2021" manufactured by Daicel Chemical Industries, Ltd.), 1,2-epoxy-4-vinylcyclohexane (trade name "Celloxide 2000" manufactured by Daicel Chemical Industries, Ltd.); aromatic amine type multifunctional epoxy compound (trade name "H-434" manufactured by Tohto Kasei Kogyo Co., Ltd.), cresol novolac type multifunctional epoxy compound (trade name "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd.), phenol novolac type multifunctional epoxy compound (Epikote 152, 154 manufactured by Japan Epoxy Resins Co., Ltd.), and naphthalene skeleton-containing multifunctional epoxy compound (trade name EXA-4700 manufactured by Dai Nippon Ink Co., Ltd.) Examples of epoxy compounds that do not have an alicyclic structure include epoxy compounds having a chain alkyl polyfunctional epoxy compound (product name "SR-TMP" manufactured by Sakamoto Pharmaceutical Co., Ltd.), polyfunctional epoxy polybutadiene (product name "Epolead PB3600" manufactured by Daicel Chemical Industries, Ltd.), glycidyl polyether compound of glycerin (product name "SR-GLG" manufactured by Sakamoto Pharmaceutical Co., Ltd.), diglycerin polyglycidyl ether compound (product name "SR-DGE" manufactured by Sakamoto Pharmaceutical Co., Ltd.), polyglycerin polyglycidyl ether compound (product name "SR-4GL" manufactured by Sakamoto Pharmaceutical Co., Ltd.) and the like.

The epoxy crosslinking agent (D) can be used alone or in combination of two or more.

The molecular weight of the epoxy crosslinking agent (D) is not particularly limited, but is usually 100 to 100,000, preferably 500 to 50,000, and more preferably 1,000 to 10,000.

<<Amount of epoxy crosslinking agent (D)>>
The amount of epoxy crosslinking agent (D) is not particularly limited and may be adjusted appropriately. The amount of epoxy crosslinking agent (D) is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 5 parts by mass or more, relative to 100 parts by mass of binder resin (A). The amount of epoxy crosslinking agent (D) is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, and even more preferably 100 parts by mass or less, relative to 100 parts by mass of binder resin (A). If the amount of epoxy crosslinking agent (D) is within this range, sufficient heat resistance can be obtained, which is preferable.

<Other compounding agents>
Furthermore, the resin composition of the present invention may contain other compounding agents, such as an antioxidant, a surfactant, a coupling agent, etc., if desired, so long as the effects of the present invention are not impaired.

<<Antioxidants>>
The antioxidant is not particularly limited, and examples of the antioxidant that can be used include phenol-based antioxidants, phosphorus-based antioxidants, sulfur-based antioxidants, amine-based antioxidants, lactone-based antioxidants, etc., which are used in ordinary polymers. By incorporating an antioxidant, the light resistance and heat resistance of the resulting resin film can be improved.

As the phenol-based antioxidant, conventionally known compounds can be used, such as acrylate compounds described in JP-A-63-179953 and JP-A-1-168643, such as 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate and 2,4-di-t-amyl-6-[1-(3,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate; 2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-4-ethylphenol, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,2'-methylene-bis(4-methyl-6-t -butylphenol), 4,4'-butylidene-bis(6-t-butyl-m-cresol), 4,4'-thiobis(3-methyl-6-t-butylphenol), bis(3-cyclohexyl-2-hydroxy-5-methylphenyl)methane, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane, 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, pentaerythritol-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], triethylene glycol Alkyl-substituted phenolic compounds such as bis[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate] and tocopherol; triazine group-containing phenolic compounds such as 6-(4-hydroxy-3,5-di-t-butylanilino)-2,4-bis-octylthio-1,3,5-triazine, 6-(4-hydroxy-3,5-dimethylanilino)-2,4-bis-octylthio-1,3,5-triazine, 6-(4-hydroxy-3-methyl-5-t-butylanilino)-2,4-bis-octylthio-1,3,5-triazine, and 2-octylthio-4,6-bis-(3,5-di-t-butyl-4-oxyanilino)-1,3,5-triazine; and the like can be used.

There are no particular limitations on the phosphorus-based antioxidants, so long as they are those commonly used in the general resin industry, and examples thereof include triphenyl phosphite, diphenyl isodecyl phosphite, phenyl diisodecyl phosphite, tris(nonylphenyl) phosphite, tris(dinonylphenyl) phosphite, tris(2,4-di-t-butylphenyl) phosphite, tris(2-t-butyl-4-methylphenyl) phosphite, tris(cyclohexylphenyl) phosphite, 2,2'-methylene biphenyl phosphite, and the like. monophosphite compounds such as bis(4,6-di-t-butylphenyl)octyl phosphite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene; di-tridecyl phosphite), 4,4'-isopropylidene-bis[phenyl-di-alkyl (C12-C15) phosphite], 4,4'-isopropylidene-bis[diphenyl monoalkyl (C12-C15) phosphite], 1,1,3-tris(2-methyl-4-di-tridecyl phosphite-5-t-butylphenyl)butane, tetrakis(2,4-di-t-butylphenyl)-4,4'-biphenylene diphosphite, cyclic neopentane tetrayl bis(octadecyl phosphite Diphosphite compounds such as cyclic neopentane tetrayl bis(isodecyl phosphite), cyclic neopentane tetrayl bis(nonylphenyl phosphite), cyclic neopentane tetrayl bis(2,4-di-t-butylphenyl phosphite), cyclic neopentane tetrayl bis(2,4-dimethylphenyl phosphite), and cyclic neopentane tetrayl bis(2,6-di-t-butylphenyl phosphite) can be used. Among these, monophosphite compounds are preferred, and tris(nonylphenyl) phosphite, tris(dinonylphenyl) phosphite, tris(2,4-di-t-butylphenyl) phosphite, etc. are particularly preferred.

Examples of sulfur-based antioxidants that can be used include dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearyl 3,3'-thiodipropionate, laurylstearyl 3,3'-thiodipropionate, pentaerythritol-tetrakis-(β-lauryl-thio-propionate), 3,9-bis(2-dodecylthioethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane, and the like.

Of these, phenol-based antioxidants are preferred, and pentaerythritol-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] is more preferred.
These antioxidants may be used alone or in combination of two or more kinds.

The content of the antioxidant in the resin composition of the present invention is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more, and preferably 10 parts by mass or less, more preferably 5 parts by mass or less, per 100 parts by mass of the binder resin (A). When the content of the antioxidant is within the above range, the light resistance and heat resistance of the obtained resin film can be made good.

<<Surfactants>>
The surfactant is used for the purpose of preventing striations (streaks left after application), etc. Examples of the surfactant include silicone-based surfactants, fluorine-based surfactants, polyoxyalkylene-based surfactants, methacrylic acid copolymer-based surfactants, and acrylic acid copolymer-based surfactants.

Examples of silicone surfactants include "SH28PA", "SH29PA", "SH30PA", "ST80PA", "ST83PA", "ST86PA", "SF8416", "SH203", "SH230", "SF8419", "SF8422", "FS1265", "SH510", "SH550", "SH710", "SH8400", "SF8410", "SH8700", and "SF8427" (all manufactured by Dow Corning Toray Co., Ltd.), product names "KP-321", "KP-323", "KP-324", "KP-340", and "KP-341" (all manufactured by Shin-Etsu Chemical Co., Ltd.), product names "TSF400", "TSF Examples include "BYK401", "TSF410", "TSF4440", "TSF4445", "TSF4450", "TSF4446", "TSF4452", and "TSF4460" (all manufactured by Momentive Performance Materials Japan LLC), and product names "BYK300", "BYK301", "BYK302", "BYK306", "BYK307", "BYK310", "BYK315", "BYK320", "BYK322", "BYK323", "BYK331", "BYK333", "BYK370", "BYK375", "BYK377", and "BYK378" (all manufactured by BYK Japan).

Examples of fluorine-based surfactants include Fluorinert "FC-430" and "FC-431" (all manufactured by Sumitomo 3M Limited), Surflon "S-141", "S-145", "S-381", and "S-393" (all manufactured by Asahi Glass Co., Ltd.), F-top (registered trademark) "EF301", "EF303", "EF351", and "EF352" (all manufactured by JEMCO Corporation), and Megafac (registered trademark) "F171", "F172", "F173", and "R-30" (all manufactured by DIC Corporation).
Examples of polyoxyalkylene surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, and polyoxyethylene nonylphenyl ether; polyethylene glycol dilaurate; and polyethylene glycol distearate polyoxyethylene dialkyl esters.
These surfactants may be used alone or in combination of two or more.

The content of the surfactant in the resin composition of the present invention is preferably 0.01 parts by mass or more, more preferably 0.02 parts by mass or more, and preferably 0.5 parts by mass or less, more preferably 0.2 parts by mass or less, per 100 parts by mass of the binder resin (A). When the content of the surfactant is within the above range, the effect of preventing striations (coating streaks) can be further improved.

<<Coupling Agent>>
The coupling agent has the effect of further increasing the adhesion of the resin film derived from the resin composition. As the coupling agent, a compound having one atom selected from a silicon atom, a titanium atom, an aluminum atom, and a zirconium atom and having a hydrocarbyloxy group or a hydroxy group bonded to the atom can be used.

Examples of coupling agents include
tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-i-propoxysilane, and tetra-n-butoxysilane;
Methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, i-propyltrimethoxysilane, i-propyltriethoxysilane, n-butyltrimethoxysilane, n-butyltriethoxysilane, n-pentyltrimethoxysilane, n-hexyltrimethoxysilane, n-heptyltrimethoxysilane, n-octyltrimethoxysilane, n-decyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, cyclohexyltrimethoxysilane, vinyltriethoxysilane, vinyl ... xyltrimethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-chloropropyltriethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, 3,3,3-trifluoropropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 2-hydroxyethyl Trimethoxysilane, 2-hydroxyethyltriethoxysilane, 2-hydroxypropyltrimethoxysilane, 2-hydroxypropyltriethoxysilane, 3-hydroxypropyltrimethoxysilane, 3-hydroxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, trialkoxysilanes such as 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-ethyl(trimethoxysilylpropoxymethyl)oxetane, 3-ethyl(triethoxysilylpropoxymethyl)oxetane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, and bis(triethoxysilylpropyl)tetrasulfide;
Dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, di-n-propyldimethoxysilane, di-n-propyldiethoxysilane, di-i-propyldimethoxysilane, di-i-propyldiethoxysilane, di-n-butyldimethoxysilane, di-n-pentyldimethoxysilane, di-n-pentyldiethoxysilane, di-n-hexyldimethoxysilane, di-n-hexyldiethoxysilane, di-n-heptyldimethoxysilane, di-n-heptyldiethoxysilane, di-n-octyldimethoxysilane, di- In addition to dialkoxysilanes such as n-octyldiethoxysilane, di-n-cyclohexyldimethoxysilane, di-n-cyclohexyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropylmethyldiethoxysilane, and N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane,
Silicon atom-containing compounds such as methyltriacetyloxysilane, dimethyldiacetyloxysilane, trade names X-12-414, KBP-44 (manufactured by Shin-Etsu Chemical Co., Ltd.), 217FLAKE, 220FLAKE, 233FLAKE, and z6018 (manufactured by Dow Corning Toray Co., Ltd.);

Titanium atom-containing compounds such as (tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis(2-ethylhexyloxy)titanium, titanium-i-propoxyoctylene glycolate, di-i-propoxy bis(acetylacetonato)titanium, propanedioxytitanium bis(ethylacetoacetate), tri-n-butoxytitanium monostearate, di-i-propoxytitanium distearate, titanium stearate, di-i-propoxytitanium diisostearate, (2-n-butoxycarbonylbenzoyloxy)tributoxytitanium, di-n-butoxy bis(triethanolaminato)titanium, and the PLENACT series (manufactured by Ajinomoto Fine-Techno Co., Ltd.));
(acetoalkoxyaluminum diisopropylate) and other aluminum atom-containing compounds;
(tetra-normal-propoxy zirconium, tetra-normal-butoxy zirconium, zirconium tetraacetylacetonate, zirconium tributoxy acetylacetonate, zirconium monobutoxy acetylacetonate bis(ethylacetoacetate), zirconium dibutoxy bis(ethylacetoacetate), zirconium tetraacetylacetonate, zirconium tributoxystearate) and other zirconium atom-containing compounds.

The content of the coupling agent (e.g., silane coupling agent) in the resin composition of the present invention is usually 0.01 parts by mass or more, and preferably 10 parts by mass or less, per 100 parts by mass of the binder resin (A).

<Solvent (Solvent)>
The resin composition of the present invention may contain a solvent. The solvent is not particularly limited, and any solvent known as a solvent for resin compositions can be used. Examples of such solvents include linear ketones, alcohols, alcohol ethers, esters, cellosolve esters, propylene glycols, diethylene glycols such as diethylene glycol ethyl methyl ether, saturated γ-lactones, halogenated hydrocarbons, aromatic hydrocarbons, and polar solvents such as dimethylacetamide, dimethylformamide, and N-methylacetamide (see, for example, International Publication No. WO 2015/033901).

The solvent used in the resin composition of the present invention may be an ether-based solvent. Examples of the ether-based solvent include diethylene glycol ethyl methyl ether (HISOLV EDM, manufactured by Toho Chemical Industry Co., Ltd.), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), γ-butyrolactone, 1-methyl-2-pyrrolidone, and mixtures thereof.

These solvents may be used alone or in the form of a mixture of two or more types, but from the viewpoint of ease of recovery and reuse of the solvent, it is preferable that the solvent be a single solvent consisting of a single substance.

<<Amount of Solvent (Solvent)>>
The amount of the solvent is not particularly limited and may be adjusted appropriately. The amount of the solvent is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, relative to 100 parts by mass of the binder resin (A) from the viewpoint of sufficiently dissolving the solid content. In addition, the amount of the solvent is preferably 5000 parts by mass or less, more preferably 1000 parts by mass or less, relative to 100 parts by weight of the binder resin (A) from the viewpoint of facilitating removal of the solvent. In addition, when the resin composition contains a solvent, the solvent is usually removed from the coating film after the resin film is formed.

(Method of preparing resin composition)
The method for preparing the resin composition of the present invention is not particularly limited, and each component constituting the resin composition may be mixed by a known method.
Although the method of mixing is not particularly limited, it is preferable to mix a solution or dispersion obtained by dissolving or dispersing each component constituting the resin composition in a solvent, thereby obtaining the resin composition in the form of a solution or dispersion.

The method for dissolving or dispersing each component constituting the resin composition in a solvent may be a conventional method. Specifically, stirring using a stirrer and a magnetic stirrer, or using a high-speed homogenizer, disperser, planetary stirrer, biaxial stirrer, ball mill, triple roll, etc. may be used. In addition, after dissolving or dispersing each component in a solvent, it may be filtered using a filter with a pore size of about 0.5 μm, for example.

(Uses of resin composition)
The resin composition of the present invention can be used as a component of a product such as an electronic device. Since the resin composition of the present invention has excellent transparency and insulation reliability, it is suitable for use as a component requiring these properties. For example, the resin composition of the present invention is suitable for use as a support substrate for a transparent electrode (touch sensor substrate). Furthermore, the resin composition of the present invention has high wrinkle suppression performance of a transparent electrode such as ITO at high temperatures, so it is suitable for use as a support substrate for a transparent electrode such as an ITO electrode. Furthermore, the resin composition of the present invention is suitable for use as a substrate for a touch sensor using a transparent electrode such as an ITO electrode.

(Cured Resin)
When the resin composition of the present invention is used as a component of a product, the resin composition may be cured by crosslinking to form a resin cured product. As a curing means by crosslinking, for example, photocuring by active energy rays such as visible light, ultraviolet light, near infrared light, far infrared light, and electron beams is preferable, and a heat treatment may be used in combination. Examples of light sources include high pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, gallium lamps, xenon lamps, and carbon arc lamps. For example, the curing of the resin composition can be promoted by heating during the production of the resin film. The wavelength of the light does not need to be a single wavelength, and may be appropriately selected depending on the characteristics of the photobase generator (B) and sensitizer (C) used. The cumulative dose of active energy rays is usually 0.1 mJ/cm ² to 10,000 mJ/cm ² , preferably 1 mJ/cm ² to 4,000 mJ/cm ² , and the wavelength of the active energy rays is preferably 150 to 830 nm. The heating conditions are preferably room temperature to 250°C, more preferably 50 to 200°C, and even more preferably 70 to 150°C. Energy ray irradiation and heating may be performed simultaneously or separately. After energy ray irradiation, curing can be allowed to proceed by leaving the material at room temperature. The irradiation atmosphere may be appropriately selected from vacuum, air, and inert gas such as nitrogen.

The resin film of the present invention is preferably obtained by curing the resin composition of the present invention by irradiating it with light and then further heating it to cure it. Heating promotes the curing of the resin film, increasing the adhesion to a transparent electrode such as an ITO electrode, and providing highly reliable sealing performance.

(Resin film)
The resin film of the present invention can be obtained by using the above-mentioned resin composition of the present invention. As the resin film of the present invention, it is preferable that the resin film is obtained by forming the above-mentioned resin composition of the present invention on a substrate.

The substrate is not particularly limited as long as it is a transparent substrate used in a display device having a touch panel structure, but for example, a soda glass substrate is preferably used.

The method for forming the resin film is not particularly limited, and for example, a coating method or a film lamination method can be used.

The coating method is, for example, a method in which a resin composition is coated and then heated and dried to remove the solvent. Various methods can be used to coat the resin composition, such as spraying, spin coating, roll coating, die coating, doctor blade, rotary coating, bar coating, and screen printing. Heat drying conditions vary depending on the type and blending ratio of each component, but are usually performed at 30 to 150°C, preferably 60 to 120°C, for 0.5 to 90 minutes, preferably 1 to 60 minutes, and more preferably 1 to 30 minutes.

The thickness of the resin film is not particularly limited and may be set appropriately depending on the application, but if the resin film is, for example, a protective film or insulating film for a touch panel structure of a display device equipped with a touch panel structure, the thickness of the resin film is preferably 0.1 to 100 μm, more preferably 0.5 to 50 μm, and even more preferably 0.5 to 30 μm.

The resin film of the present invention may be a patterned resin film.
Examples of methods for patterning a resin film include a method in which a pre-patterned resin film is formed, the pre-patterned resin film is irradiated with active radiation to form a latent image pattern, and then the resin film having the latent image pattern is brought into contact with a developer to make the pattern visible.

The active radiation is not particularly limited as long as it can activate the photobase generator (B) contained in the resin composition and change the alkali solubility of the resin composition. Specifically, ultraviolet rays, g-rays (436 nm), h-rays (405 nm), i-rays (365 nm), and other single-wavelength ultraviolet rays, KrF excimer laser light, ArF excimer laser light, and other light rays; particle beams such as electron beams; and the like can be used. The method of selectively irradiating these active radiations in a pattern to form a latent image pattern may be a conventional method, and for example, a method of irradiating ultraviolet rays, g-rays (436 nm), h-rays (405 nm), i-rays (365 nm), KrF excimer laser light, ArF excimer laser light, and other light rays through a desired mask pattern using a reduced projection exposure device or the like, or a method of drawing with particle beams such as electron beams, and the like can be used. When light is used as the active radiation, it may be single-wavelength light or mixed-wavelength light. Irradiation conditions are appropriately selected depending on the active radiation used, but for example, when a light beam having a wavelength of 200 to 450 nm is used, the irradiation dose is usually in the range of 10 to 1,000 mJ/cm ² , preferably 50 to 500 mJ/cm ² , and is determined depending on the irradiation time and illuminance. After being irradiated with active radiation in this manner, the resin film is heat-treated at a temperature of about 60 to 130° C. for about 1 to 2 minutes, if necessary.

Next, the latent image pattern formed on the resin film before patterning is developed to become visible. As the developer, an aqueous solution of an alkaline compound is usually used. As the alkaline compound, for example, an alkali metal salt, an amine, or an ammonium salt can be used. The alkaline compound may be an inorganic or organic compound. Specific examples of these compounds include alkali metal salts such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, and sodium metasilicate; ammonia water; primary amines such as ethylamine and n-propylamine; secondary amines such as diethylamine and di-n-propylamine; tertiary amines such as triethylamine and methyldiethylamine; quaternary ammonium salts such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide, and choline; alcohol amines such as dimethylethanolamine and triethanolamine; cyclic amines such as pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]undec-7-ene, 1,5-diazabicyclo[4.3.0]non-5-ene, and N-methylpyrrolidone; and the like. These alkaline compounds can be used alone or in combination of two or more.

The aqueous medium of the alkaline aqueous solution may be water or a water-soluble organic solvent such as methanol, ethanol, etc. The alkaline aqueous solution may contain an appropriate amount of a surfactant or the like.
The method of contacting the resin film having the latent image pattern with the developer may be, for example, a paddle method, a spray method, a dipping method, etc. The development is usually carried out at a temperature in the range of 0 to 100° C., preferably 5 to 55° C., more preferably 10 to 30° C., for a time in the range of 30 to 180 seconds, which is appropriately selected.

In this way, the resin film with the desired pattern formed is cleaned using, for example, UV ozone treatment or rinsed using a rinse solution to remove development residues.

In the present invention, the resin film may be subjected to a crosslinking reaction after patterning. The crosslinking may be performed according to the method described above.

(Touch sensor substrate)
The resin film of the present invention can be used as a touch sensor substrate. By using the resin film of the present invention as a touch sensor substrate, it is possible to suppress the occurrence of wrinkles in a transparent electrode such as an ITO electrode on a substrate at high temperatures, and therefore the transparent electrode pattern can be maintained, and the light transmittance of the touch sensor is excellent. In addition, the resin film of the present invention has high light transmittance and high insulation reliability, and is therefore suitable as a material for a touch sensor substrate.

(Electronic Components)
The electronic component of the present invention includes the resin film of the present invention described above. The electronic component of the present invention is not particularly limited, but may include various electronic components, specifically, display devices having a touch panel structure such as a touch palette or a flexible organic EL display.

As an example of an electronic component of the present invention, a display device having a touch panel structure is not particularly limited, but examples include a display device in which an electrode layer consisting of a pair of ITO electrodes or the like is arranged on a soda glass substrate with an insulating film sandwiched therebetween. In this case, the resin film of the present invention described above can be used as an insulating film sandwiched between the electrode layers or a protective film for protecting the touch panel structure.

The present invention will be specifically described below based on examples, but the present invention is not limited to these examples. In the following description, "%" and "parts" expressing amounts are based on mass unless otherwise specified. Furthermore, pressure is gauge pressure.
In the examples and comparative examples, the ITO wrinkle suppression performance, light transmittance, and insulation reliability of the resin film at high temperatures were evaluated using the following methods.

<ITO wrinkle prevention performance at high temperatures>
The resin compositions obtained in the examples and comparative examples were applied onto a glass substrate (Corning 1737, manufactured by Corning Incorporated) by spin coating, and the substrate was dried by heating (pre-baking) at 110 ° C. for 2 minutes using a hot plate to form a coating film of the resin composition. Next, exposure was performed at 3000 mJ / cm ² using a high-pressure mercury lamp emitting light of wavelengths of g-line (436 nm), h-line (405 nm), and i-line (365 nm). Next, a resin film having a thickness of 2 μm was formed by heating the substrate at 230 ° C. for 60 minutes in an air atmosphere using an oven, after raising the temperature from 30 ° C. to 230 ° C. at a rate of 10 ° C. / min. On this resin film, an ITO transparent electrode was formed with a thickness of 80 nm using a sputtering device (Shibaura Eletec Corporation, "i-Miller CFS-4EP-LL", stage temperature 30 ° C.) to obtain a laminate with an ITO transparent electrode. The glass substrate of the obtained laminate with ITO transparent electrode was cut into 1.5 cm square to prepare a test piece. The glass substrate side of the prepared test piece was placed on a hot plate heated at 220°C for 5 minutes, and then cooled to room temperature. Next, the ITO transparent electrode side surface of the test piece was observed with an optical microscope (100x), and the ratio of the area of the wrinkled part to the total area (1.5 cm x 1.5 cm) of the resin film surface was calculated and evaluated according to the following criteria. The area of the wrinkled part was extracted by binarizing the image obtained with the optical microscope.
A: No wrinkles were observed on the surface of the resin film.
B: Wrinkles were observed on the surface of the resin film, but the area of the wrinkled parts was less than 1/4 of the total area of the resin film surface.
C: Wrinkles were observed on the surface of the resin film, but the area of the wrinkled parts was ¼ or more of the total area of the resin film surface.

<Light transmittance>
The resin compositions obtained in the examples and comparative examples were applied onto a glass substrate (Corning 1737, manufactured by Corning Incorporated) by spin coating, and dried (prebaked) at 110°C for 2 minutes using a hot plate to form a coating film with a thickness of 2 μm (coating film formation process). Next, exposure was performed at 3000 mJ/ ^cm2 using a high-pressure mercury lamp emitting light with wavelengths of g-line (436 nm), h-line (405 nm), and i-line (365 nm). Next, a laminate consisting of a resin film and a glass substrate was obtained by heating the substrate at 230°C for 60 minutes at 230°C at a rate of 10°C/min in an air atmosphere using an oven (curing process).
The light transmittance (%) of the obtained laminate at a wavelength of 400 nm was measured using a spectrophotometer V-560 (manufactured by JASCO Corporation).
Furthermore, the laminate obtained above was heated (additional heating) at 250° C. for 1 hour in an air atmosphere, and then the light transmittance (%) for light with a wavelength of 400 nm was measured in the same manner as above.
The light transmittance (%) of the resin film was calculated as a converted value assuming that a glass substrate having no resin film was used as a blank and that the thickness of the resin film was 2 μm, and was evaluated according to the following criteria.
A: Light transmittance is 96% or more.
B: Light transmittance is 93% or more and less than 96%.
C: Light transmittance is less than 93%.

<Crack resistance of resin film>
[Crack resistance of pre-baked resin film]
The resin compositions prepared in the Examples and Comparative Examples were applied onto a silicon wafer substrate by spin coating, and then heated and dried (prebaked) for 2 minutes at 110° C. using a hot plate to form a prebaked resin film having a thickness of 2.0 μm, thereby obtaining a laminate consisting of a silicon wafer substrate having a prebaked resin film on its surface. The surface of the laminate was visually observed and the crack resistance was evaluated according to the following criteria.
A: There are no cracks on the surface of the laminate.
B: Cracks were observed on the surface of the laminate.

<Insulation reliability of resin film>
A Cu thin film having a thickness of 100 nm was formed on a glass substrate (Corning, product name: Corning 1737) using a sputtering device. Next, the Cu thin film was patterned using a photoresist to prepare a comb-shaped electrode substrate having a Cu wiring width of 7 μm and a wiring distance of 7 μm. On such a comb-shaped electrode substrate, the resin composition prepared in the examples and comparative examples was applied by spin coating, and the substrate was heated and dried (pre-baked) at 110 ° C. for 2 minutes using a hot plate to form a resin film having a thickness of 2.0 μm. Next, exposure was performed at 3000 mJ / cm ² using a high-pressure mercury lamp that emits light with wavelengths of g-line (436 nm), h-line (405 nm), and i-line (365 nm). Next, the resin film was post-baked in an oven at 230 ° C. for 60 minutes in an air atmosphere to obtain a laminate in which the resin film, Cu wiring, and glass substrate were laminated in this order as a test specimen. The obtained test specimen was then placed in a high-temperature, constant-humidity chamber at a temperature of 85° C. and a humidity of 85% with a voltage of 15 V applied to it. After 500 hours, the test specimen was removed from the high-temperature, constant-humidity chamber, and the Cu wiring provided on the test specimen was observed with a digital microscope (KH-1300, manufactured by Hirox Corporation) to evaluate the insulation reliability of the resin film according to the following criteria.
A: No corrosion was observed in the Cu wiring after 500 hours.
B: Corrosion was observed in the Cu wiring after 500 hours.

(Synthesis Example 1: Synthesis of Cyclic Olefin Polymer (A-1) Having Protic Polar Groups That is Solid at Room Temperature as Binder Resin (A))
As a cyclic olefin polymer (A-1) having a protic polar group, a polymer having a monomer unit which is solid at room temperature and has a protic polar group in an occupancy ratio of 60 mol % was obtained.
100 parts of a monomer mixture consisting of 40 mol% of N-(2-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide as a cyclic olefin having an N-substituted imido group and 60 mol% of 4-hydroxycarbonyltetracyclo[6.2.1.13,6.02,7]dodec-9-ene as a cyclic olefin having a protic polar group, 2 parts of 1,5-hexadiene, 0.02 parts of (1,3-dimesitylimidazolin-2-ylidene)(tricyclohexylphosphine)benzylidene ruthenium dichloride (synthesized by the method described in Org. Lett., Vol. 1, p. 953, 1999), and 200 parts of diethylene glycol ethyl methyl ether were charged into a nitrogen-substituted glass pressure-resistant reactor and reacted at 80° C. for 4 hours with stirring to obtain a polymerization reaction liquid.
The obtained polymerization reaction liquid was then placed in an autoclave and stirred at 150°C under a hydrogen pressure of 4 MPa for 5 hours to carry out a hydrogenation reaction, thereby obtaining a polymer solution containing a hydrogenated polymer as a cyclic olefin polymer (A-1) having a protic polar group. The polymerization conversion rate of the obtained cyclic olefin polymer (A-1) was 99.7%, the weight average molecular weight in terms of polystyrene was 7,150, the number average molecular weight was 4,690, the molecular weight distribution was 1.52, and the hydrogenation rate was 99.7%. The solid content concentration of the obtained polymer solution of the cyclic olefin polymer (A-1) was 34.4% by mass.

(Synthesis Example 2: Synthesis of polyvinylphenol (A-3) as binder resin (A))
50 parts of p-tert-butoxystyrene, 50 parts of methyl methacrylate, and 4 parts of azobisisobutyronitrile as a polymerization initiator were dissolved in 150 parts of propylene glycol monomethyl ether as a solvent, and the reaction temperature was maintained at 70°C under a nitrogen atmosphere, and polymerization was carried out for 10 hours. Then, sulfuric acid was added to the reaction solution, and the reaction temperature was maintained at 90°C for 10 hours, and the p-tert-butoxystyrene monomer units were deprotected and converted to p-vinylphenol monomer units. Then, ethyl acetate was added to the obtained copolymer, and washing with water was repeated five times, and the ethyl acetate phase was separated and the solvent was removed, thereby obtaining a copolymer (A-3) having p-vinylphenol monomer units and methyl methacrylate monomer units. The ratio of each monomer unit in the obtained copolymer (A-3) was p-vinylphenol monomer units: methyl methacrylate monomer units = 50:50 (mass ratio). The weight average molecular weight (Mw) was 9,600 in terms of polystyrene.

Example 1
As the binder resin (A), 291 parts of the solution of the cyclic olefin polymer (A-1) having a protonic polar group obtained in Synthesis Example 1 (100 parts of the cyclic olefin polymer (A-1) in which the proportion of monomer units having a protonic polar group is 51 mol % or more) was used, and as the photobase generator (B), 9-anthrylmethyl 3 parts of N,N-diethyl carbamate (manufactured by Fuji Film Co., Ltd., product name "WPBG-018"), 1.5 parts of 9,10-bis(octanoyloxy)anthracene (manufactured by Kawasaki Chemical Industries, Ltd., product name "UVS-581") as a sensitizer (C), 30 parts of 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)1-butanol (manufactured by Daicel Corporation, product name "EHPE3150") as an epoxy crosslinking agent (D), 0.1 parts of organosiloxane polymer (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KP-341") as a surfactant, 0.2 parts of ethylhexyl ether as an antioxidant ... 2.1 parts of pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (product name "Irganox 1010FF", manufactured by BASF Corporation), 1 part of glycidoxypropyltrimethoxysilane (manufactured by XIAMETER, product name "OFS-6040") as a silane coupling agent, and 41 parts of diethylene glycol ethyl methyl ether (manufactured by Toho Chemical Industry Co., Ltd., product name "EDM-S") as a solvent were mixed and dissolved, and then filtered through a polytetrafluoroethylene filter having a pore size of 0.45 μm to prepare a resin composition.
The resin film formed using the obtained resin composition was subjected to various evaluations as described above. The results are shown in Table 1.

Example 2
A resin composition was prepared in the same manner as in Example 1, except that the sensitizer (C) was changed to 1,4-diethoxynaphthalene (manufactured by Kawasaki Chemical Industries, product name "UVS-2171").

Example 3
A resin composition was prepared in the same manner as in Example 1, except that the sensitizer (C) was changed to 0.75 parts of "UVS-581" manufactured by Kawasaki Chemical Industry Co., Ltd., and 0.75 parts of "UVS-2171" manufactured by Kawasaki Chemical Industry Co., Ltd.

Example 4
A resin composition was prepared in the same manner as in Example 1, except that the sensitizer (C) was changed to 9,10-dibutoxyanthracene (manufactured by Kawasaki Chemical Industries, product name "UVS-1331").

Example 5
A resin composition was prepared in the same manner as in Example 1, except that the sensitizer (C) was changed to 9,10-diethoxyanthracene (manufactured by Kawasaki Chemical Industries, product name "UVS-1101").

Example 6
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to 1-(anthraquinone-2-yl)ethyl imidazole carboxylate (manufactured by Fuji Film Corporation, product name "WPBG-140").

(Example 7)
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to (E)-1-piperidino-3-(2-hydroxyphenyl)-2-propen-1-one (manufactured by Fujifilm Corporation, product name "WPBG-027").

(Example 8)
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to 2-nitrophenyl methyl 4-methacryloyloxy piperidine-1-carboxylate (manufactured by Fuji Film Corporation, product name "WPBG-165").

Example 9
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium 2-(3-benzoylphenyl)propionate (manufactured by Fuji Photo Film Corporation, product name "WPBG-266").

(Example 10)
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to 1,2-dicyclohexyl-4,4,5,5-tetramethylbiguanidium n-butyltriphenylborate (manufactured by Fuji Film Corporation, product name "WPBG-300").

(Example 11)
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) was changed to (Z)-{[bis(dimethylamino)methylidene]amino}-N-cyclohexyl(cyclohexylamino)methaniminium tetrakis(3-fluorophenyl)borate (manufactured by Fuji Film Corporation, product name "WPBG-345").

Example 12
A resin composition was prepared in the same manner as in Example 1, except that the amount of the photobase generator (B) was changed to 9 parts.

(Example 13)
Instead of a predetermined cyclic olefin polymer (A-1), a branched polyamideimide resin (A-2) having a carboxyl group as a protonic polar group was used. A resin composition was prepared in the same manner as in Example 1, except that 229 parts of a solution of polyamideimide resin in a mixed solvent of propylene glycol methyl ether acetate and n-butanol (DIC Corporation, Unidic EMG-793, 100 parts as polyamideimide resin (A-2)) was used as the polyamideimide resin (A-2).

(Example 14)
A resin composition was prepared in the same manner as in Example 1, except that the polyvinylphenol resin (A-3) prepared in Synthesis Example 2 was used instead of the predetermined cyclic olefin polymer (A-1).

(Comparative Example 1)
A resin composition was prepared in the same manner as in Example 1, except that the photobase generator (B) and the sensitizer (C) were not blended.

(Comparative Example 2)
A resin composition was prepared in the same manner as in Example 1, except that the sensitizer (C) was not added.

(Comparative Example 3)
A resin composition was prepared in the same manner as in Example 1, except that a photoacid generator (manufactured by BASF, product name "Irgacure 290") was used instead of the photobase generator (B).

(Comparative Example 4)
A resin composition was prepared in the same manner as in Example 1, except that a thermal acid generator (manufactured by BASF, product name "Irgacure PAG121") was used instead of the photobase generator (B).

According to the present invention, it is possible to provide a resin composition that can be used as a touch sensor substrate, which has excellent transparency and is capable of suppressing the occurrence of wrinkles in a transparent electrode on the substrate even at high temperatures, and a resin film and a touch sensor substrate using the resin composition.

Claims (5)

The composition comprises a binder resin (A), a photobase generator (B), a sensitizer (C), and an epoxy crosslinker (D),
The photobase generator (B) is a nonionic photobase generator,
The sensitizer (C) is represented by the following formula (II) or (III):

[In formula (II) or (III), R3 ^represents an alkyl group which may have a substituent.]
The resin composition for a touch sensor substrate is a compound represented by the formula : 2. The resin composition for touch sensor substrates according to claim 1 , wherein the sensitizer (C) is 9,10-bis(octanoyloxy)anthracene, 1,4-diethoxynaphthalene, or a mixture thereof. 3. The resin composition for touch sensor substrate according to claim 1, wherein the mass ratio of the sensitizer (C) to the photobase generator (B) (sensitizer (C)/photobase generator (B)) is 0.5 or more and 1.5 or less. A resin film using the resin composition for a touch sensor substrate according to any one of claims 1 to 3 . A touch sensor substrate comprising the resin film according to claim 4 .