JP7513228B1 - CAN type optical module and optical transceiver - Google Patents

Abstract

The CAN-type optical module of the present disclosure comprises a stem, a lead pin penetrating the stem, a support portion provided on a main surface of the stem, a submount supported by the support portion and provided with a mounting surface perpendicular to the main surface of the stem, a semiconductor optical integrated device provided on the mounting surface of the submount and having a semiconductor laser portion and an optical modulator portion, a series circuit including a matching resistor and a capacitor connected in series with each other, connected in parallel with the optical modulator portion, and a protective resistor connected in parallel with the series circuit.

Description

This disclosure relates to a CAN-type optical module and an optical transceiver.

Patent document 1 discloses a CAN-type optical module. This optical module has a semiconductor optical element. The semiconductor optical element monolithically integrates a semiconductor laser, an optical modulator, and an optical amplifier.

JP 2022-99537 A

When a DC bias is applied to the anode of the optical modulator, a DC bias is also applied to the matching resistor connected to the optical modulator. This can lead to increased power consumption due to heat generation in the matching resistor. In the CAN-type optical module of Patent Document 1, a capacitor is connected between the matching resistor and GND to reduce power consumption. In this case, the optical modulator can easily become charged, which can cause a surge and lead to failure of the optical modulator.

The present disclosure aims to obtain a CAN-type optical module and optical transceiver that can suppress failures in the optical modulator section.

A CAN-type optical module according to the present disclosure includes a support portion including a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface , a first submount provided so that a mounting surface is perpendicular to the main surface of the stem, a temperature control module mounted on the main surface of the stem, and a first support block mounted on the temperature control module on the side opposite to the main surface of the stem and supporting the first submount, a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser section and an optical modulator section, a second support block provided on the main surface of the stem, a second submount mounted on a side of the second support block , and a matching resistor and an optical modulator section connected in series to each other. the second submount has a first signal line and a first GND pattern formed thereon, the first submount has a second signal line connecting the optical modulator section and the first signal line and a second GND pattern formed thereon, the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern, the first support block has a first portion supporting the first submount and a second portion provided on the temperature control module and protruding to an opposite side to the first submount with respect to the first portion, and a wire is provided connecting an upper surface of the second support block and the second portion .
A CAN-type optical module according to the present disclosure includes a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a first submount provided so that a mounting surface is perpendicular to the main surface of the stem, a temperature control module mounted on the main surface of the stem, and a first support block mounted on the temperature control module on the side opposite to the main surface of the stem and supporting the first submount, a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser section and an optical modulator section, a second support block provided on the main surface of the stem, a second submount mounted on a side of the second support block, a matching resistor and a capacitor for the optical modulator section connected in series to each other, the second submount has a first signal line and a first GND pattern formed thereon, the first submount has a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern formed thereon, the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern, the first support block has a first portion supporting the first submount and a second portion provided on the temperature control module and protruding from the first portion towards the first submount, and has at least one of a wire connecting the second portion and the stem and a wire connecting the second portion and the GND pattern of the second submount.
A CAN-type optical module according to the present disclosure includes a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a support portion provided on the main surface of the stem, a first submount supported by the support portion and provided such that a mounting surface is perpendicular to the main surface of the stem, a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion, an optical amplifier portion, and an optical modulator portion, a second submount provided on the main surface of the stem, a matching resistor and a capacitor for the optical modulator portion connected in series with each other, and a series circuit connected in parallel with the optical modulator portion, and the second submount is provided with a first signal line and a first GND pattern, the first submount is provided with a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern is formed on the first submount, the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern, and the capacitor for the semiconductor laser section, the capacitor for the optical amplifier section, and the capacitor for the optical modulator section are mounted in an aligned manner on the support section.

An optical transceiver according to the present disclosure includes a CAN type optical module, a flexible printed circuit board connecting the CAN type optical module and a transceiver board, and a protective resistor, the CAN type optical module including a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface , a first submount provided such that a mounting surface is perpendicular to the main surface of the stem, a temperature control module mounted on the main surface of the stem, and a support portion including a first support block mounted on the temperature control module on the side opposite to the main surface of the stem and supporting the first submount , and a semiconductor laser unit and an optical modulator provided on the mounting surface of the first submount. a second support block provided on the main surface of the stem; a second sub-mount mounted on a side of the second support block; and a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series to each other and connected in parallel to the optical modulator section, wherein the protective resistor is connected in parallel to the series circuit and is provided on the flexible printed circuit board or the transceiver board , the first support block has a first portion supporting the first sub-mount and a second portion provided on the temperature control module and protruding to an opposite side to the first sub-mount with respect to the first portion, and the CAN-type optical module includes a wire connecting the upper surface of the second support block and the second portion .
An optical transceiver according to the present disclosure includes a CAN type optical module, a flexible printed circuit board connecting the CAN type optical module and a transceiver board, and a protective resistor, the CAN type optical module including a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a first submount provided such that a mounting surface is perpendicular to the main surface of the stem, a temperature control module mounted on the main surface of the stem, and a support portion including a first support block mounted on the temperature control module on the side opposite to the main surface of the stem and supporting the first submount, a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion, the CAN-type optical module comprises a second support block provided on the main surface of the stem, a second submount mounted on a side of the second support block, and a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series to each other and connected in parallel to the optical modulator section, the protective resistor is connected in parallel to the series circuit and is provided on the flexible printed circuit board or the transceiver board, the first support block has a first portion supporting the first submount and a second portion provided on the temperature control module and protruding from the first portion toward the first submount, and the CAN-type optical module comprises at least one of a wire connecting the second portion and the stem and a wire connecting the second portion and a GND pattern of the second submount.
An optical transceiver according to the present disclosure includes a CAN type optical module, a flexible printed circuit board connecting the CAN type optical module and a transceiver board, and a protective resistor. The CAN type optical module includes a stem having a main surface and a surface opposite to the main surface, a lead pin penetrating the stem from the main surface to the surface opposite to the main surface, a support portion provided on the main surface of the stem, a first submount supported by the support portion and provided such that a mounting surface thereof is perpendicular to the main surface of the stem, and a semiconductor laser unit, an optical amplifier unit, and a semiconductor laser diode unit, which are provided on the mounting surface of the first submount. the semiconductor laser section is connected to the semiconductor laser section, and the optical amplifier section is connected to the optical amplifier section, and the protective resistor is connected in parallel to the series circuit and is provided on the flexible printed circuit board or the transceiver board, and the capacitor for the semiconductor laser section, the capacitor for the optical amplifier section, and the capacitor for the optical modulator section are mounted in an aligned manner on the support section.

In the CAN-type optical module and optical transceiver disclosed herein, even if a surge is input, current flows through the protective resistor, thereby preventing failure of the optical modulator section.

1 is a perspective view of a CAN type optical module according to a first embodiment; 1A and 1B are diagrams illustrating a configuration of a semiconductor optical integrated device according to a first embodiment. 1 is a perspective view of the CAN-type optical module according to the first embodiment, seen from a different angle. FIG. 2 is a diagram for explaining a circuit formed by an optical modulator section, a matching resistor, a capacitor, and a protective resistor according to the first embodiment; FIG. 10A and 10B are diagrams illustrating protective resistors according to a second embodiment. 11A and 11B are diagrams illustrating the reflection characteristics of a CAN-type optical module according to a second embodiment. FIG. 11 is a perspective view of an optical transceiver according to a third embodiment. 13A and 13B are diagrams illustrating protective resistors according to a third embodiment. 13A to 13C are diagrams illustrating the reflection characteristics of an optical transceiver according to a third embodiment. 13A and 13B are diagrams illustrating protective resistors according to a fourth embodiment. 13 is a diagram illustrating a protective resistor according to a fifth embodiment. FIG. FIG. 13 is a perspective view of an optical transceiver according to a sixth embodiment. 13 is a diagram illustrating a protective resistor according to a sixth embodiment. FIG. FIG. 23 is a perspective view of a CAN type optical module according to a seventh embodiment. FIG. 23 is a perspective view of a CAN type optical module according to an eighth embodiment. 13 is a diagram illustrating the transmission characteristics of a CAN-type optical module according to an eighth embodiment. FIG.

The CAN-type optical module and optical transceiver relating to each embodiment will be described with reference to the drawings. The same or corresponding components will be given the same reference numerals, and repeated explanations may be omitted.

Embodiment 1.
1 is a perspective view of a CAN-type optical module 100 according to a first embodiment. The CAN-type optical module 100 includes a stem 1 having a main surface 1a and a surface opposite to the main surface 1a. The stem 1 is, for example, circular in a plan view. The diameter of the stem is, for example, 5.6 mm. The stem 1 is made of metal. The stem 1 is formed by applying Au plating or the like to the surface of a material with high thermal conductivity, such as Cu.

Lead pins 2a to 2f penetrate stem 1 from main surface 1a to the surface opposite main surface 1a. Glass 3 is generally used to fix lead pins 2a to 2f to stem 1. If impedance mismatch occurs, multiple reflections of the signal will degrade the frequency response characteristics, making high-speed modulation difficult. Therefore, glass 3 is made of a material with a low dielectric constant.

A support portion is provided on the main surface 1a of the stem 1. The support portion includes, for example, a temperature control module 10 mounted on the main surface 1a of the stem 1, and a first support block 20 mounted on the temperature control module 10 on the side opposite the main surface 1a of the stem 1. The first support block 20 is also called a carrier. The first support block 20 supports a first submount 30.

In the temperature control module 10, multiple thermoelectric elements made of a material such as BiTe are sandwiched between a lower substrate and an upper substrate made of a material such as AlN. The lower substrate of the temperature control module 10 has a protruding portion that protrudes further than the upper substrate in a direction parallel to the main surface 1a of the stem 1. An electrode pattern for supplying power to the thermoelectric elements is provided on this protruding portion. The electrode pattern is electrically connected to the lead pins 2d, 2e. The temperature control module 10 may be omitted.

A first support block 20 is mounted on the top surface of the temperature control module 10. The bottom surface of the first support block 20 and the top surface of the temperature control module 10 are joined by solder or the like. The first support block 20 is made of metal. The first support block 20 is formed by applying Au plating or the like to the surface of a material with high thermal conductivity, such as Cu. The stem 1 and the support part may be separate components or may be a single component.

The first submount 30 is supported by a support and is arranged so that the mounting surface is perpendicular to the main surface 1a of the stem 1. Specifically, the first submount 30 is mounted on the side of the first support block 20. The first submount 30 is, for example, a dielectric substrate. The first submount 30 is made of a ceramic material such as AlN, and has electrical insulation and heat transfer functions. A metal pattern is formed on the mounting surface of the first submount 30.

Figure 2 is a diagram illustrating the configuration of a semiconductor optical integrated device 50 according to the first embodiment. A semiconductor laser section 50a, an optical modulator section 50b, and an optical amplifier section 50c are provided on the mounting surface of the first submount 30. In this embodiment, an example is shown in which the semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c are integrated in the semiconductor optical integrated device 50, but the optical modulator section 50b and the optical amplifier section 50c may be provided separately. The optical amplifier section 50c may also be omitted. As shown in Figure 1, the semiconductor optical integrated device 50 is mounted at an angle with respect to the direction perpendicular to the main surface 1a of the stem 1.

The semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c are electrically insulated from each other by a semi-insulating substrate such as Fe-doped InP, and current can flow independently. This improves the controllability of the current. The semiconductor laser section 50a, the optical modulator section 50b, and the optical amplifier section 50c share a common GND.

The oscillation wavelength of the semiconductor optical integrated element 50 varies with changes in temperature. For this reason, it is necessary to keep the temperature of the semiconductor optical integrated element 50 as constant as possible. When the temperature of the semiconductor optical integrated element 50 rises, the temperature control module 10 cools it, whereas when the temperature of the semiconductor optical integrated element 50 drops, the temperature control module 10 generates heat. This makes it possible to keep the temperature of the semiconductor optical integrated element 50 constant. Furthermore, the heat generated by the semiconductor optical integrated element 50 is absorbed by the temperature control module 10 and dissipated via the stem 1 to the back side of the stem 1.

A thermistor 55 is provided on the second portion 22 of the first support block 20. The lead pin 2a is electrically connected to the thermistor 55. The thermistor 55 indirectly measures the temperature of the semiconductor optical integrated device 50 and feeds it back to the temperature control module 10. The temperature control module 10 controls the temperature of the semiconductor optical integrated device 50 based on the temperature measured by the thermistor 55.

Capacitors C0, C1, and C2 are aligned and mounted on the side of the first support block 20 on which the first submount 30 is mounted. Capacitors C0, C1, and C2 may be mounted on the support section or on the temperature control module 10. Capacitor C0 is a capacitor for the semiconductor laser section, and electrically connects the anode of the semiconductor laser section 50a to the lead pin 2b. Capacitor C1 is a capacitor for the optical modulator section. A series circuit of capacitor C1 and matching resistor R1 is connected in parallel with the optical modulator section 50b. Capacitor C2 is a capacitor for the optical amplifier section, and electrically connects the anode of the optical amplifier section 50c to the lead pin 2c.

Capacitors C0 and C2 can cut power supply noise. Capacitor C1 can cut the DC component flowing through matching resistor R1 to provide an AC coupling method. As shown in FIG. 1, by placing capacitor C1 near the optical modulator section 50b, the wire between capacitor C1 and optical modulator section 50b can be shortened. This can prevent deterioration of high frequency characteristics.

A second support block 79 and a second submount 80 are provided on the main surface 1a of the stem 1. The second submount 80 is mounted on the side of the second support block 79. The second submount 80 is, for example, a dielectric substrate. The second submount 80 is formed of a ceramic material such as AlN. A signal line 80a and a GND pattern 80b are formed on the second submount 80. In addition, a signal line 30a that connects the optical modulator section 50b and the signal line 80a via a wire, and a GND pattern 30b are formed on the first submount 30. The GND pattern 30b is connected to the GND pattern 80b via a wire. The lead pin 2f is connected to the signal line 80a of the second submount 80. In other words, the lead pin 2f is electrically connected to the optical modulator section 50b via the signal line 80a and the signal line 30a. The lead pin 2f is an RF power supply lead pin.

Figure 3 is an oblique view of the CAN-type optical module 100 according to embodiment 1, seen from a different angle. In order to strengthen the GND potential of the first support block 20, it is desirable to electrically connect the first support block 20 and the second support block 79 with a wire W0 or the like. The first support block 20 has, for example, a first portion 21 and a second portion 22. The first portion 21 supports the first submount 30. The second portion 22 is provided on the temperature control module 10, and protrudes from the first portion 21 on the opposite side to the first submount 30.

For example, when connecting a wire between the second support block 79 and the first portion 21, it is necessary to ensure the wire loop height from the first portion 21. For this reason, if a cap is mounted on the CAN-type optical module 100, it is necessary to increase the height of the cap's inner wall so that the wire loop and the cap do not interfere with each other. In contrast, in this embodiment, the upper surface of the second support block 79 and the second portion 22 are connected by wire W0. Since the second portion 22 is lower than the first portion 21, there is no need to consider the wire loop height. Therefore, it is possible to strengthen the GND potential of the first support block 20 and improve the high-frequency characteristics while reducing the height of the CAN-type optical module 100.

The first support block 20 has the role of transferring heat generated by the semiconductor optical integrated device 50 to the temperature control module 10, and it is necessary to reduce the thermal resistance of the first support block 20 as much as possible. If the height of the second portion 22 is too low, the thermal resistance will increase, and there is a risk that the power consumption of the temperature control module 10 will increase. For this reason, it is desirable to make the second portion 22 high enough so that the height of the wire W0 does not exceed the first portion 21.

Figure 4 is a diagram illustrating the circuit formed by the optical modulator section 50b, matching resistor R1, capacitor C1, and protective resistor R2 according to embodiment 1. In Figure 4, the optical modulator section 50b is depicted as a diode D1. As described above, a series circuit including the matching resistor R1 and capacitor C1 connected in series with each other is connected in parallel with the optical modulator section 50b. A protective resistor R2 is connected in parallel with this series circuit.

The resistance value of the matching resistor R1 is, for example, 50 Ω or 40 Ω. The capacitance of the capacitor C1 is, for example, 1 to 10 nF. The resistance value of the protective resistor R2 is, for example, 1000 Ω. These resistance values and capacitances are not limited to the above values. It is preferable that the resistance value of the matching resistor R1 is less than the resistance value of the protective resistor R2.

In this embodiment, the protective resistor R2 is connected between the signal line 30a and the GND pattern 30b of the first submount 30. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed or attached on the first submount 30.

In the CAN-type optical module 100 according to this embodiment, the protective resistor R2 connected between the anode of the optical modulator section 50b and GND can suppress charging of the optical modulator section 50b. Even if a surge is input, a current flows through the protective resistor R2. This can suppress failure of the optical modulator section 50b.

Note that the number of wires connecting the patterns, the arrangement of capacitors C0 to C2, and the structure of the support part are not limited to those shown in the figure and can be changed as appropriate.

The above-mentioned modifications can be applied as appropriate to the CAN-type optical modules and optical transceivers according to the following embodiments. Note that the CAN-type optical modules and optical transceivers according to the following embodiments have many points in common with the first embodiment, so the following description will focus on the differences from the first embodiment.

Embodiment 2.
5 is a diagram for explaining the protective resistor R2 according to the second embodiment. In the CAN-type optical module 200 of the second embodiment, the position of the protective resistor R2 is different from that of the CAN-type optical module 100 of the first embodiment. The other structures are similar to those of the first embodiment. The protective resistor R2 of this embodiment is connected between the signal line 80a and the GND pattern 80b of the second submount 80. This results in a circuit as shown in FIG. 4. The protective resistor R2 is, for example, a thin-film resistor formed or attached on the second submount 80.

Figure 6 is a diagram explaining the reflection characteristic S11 of the CAN-type optical module 200 of embodiment 2. Looking at the part indicated by the arrow in the figure, it can be seen that in embodiment 2, the electromagnetic field resonance that occurs in embodiment 1 does not occur, and the reflection characteristic is improved. In other words, better high-frequency characteristics can be obtained by placing the protective resistor R2 on the second submount 80 rather than on the first submount 30.

In the first embodiment, the GND pattern 30b of the first submount 30 is hollowed out to form the protective resistor R2. This may have caused the GND potential to become unstable, causing a slight impedance change in the GSG line of the first submount 30, and deteriorating the characteristics. In contrast, the line of the second submount 80 is a microstrip line, and there is no need to hollow out the GND pattern to form the protective resistor R2 as in the first embodiment. This is thought to have suppressed the impedance change and resulted in good high frequency characteristics. The second submount 80 may be a coplanar line.

In addition, the protective resistor R2 is not limited to being connected between the signal line 80a and the upper GND pattern 80b. It may also be connected between the signal line 80a and the lower GND pattern.

Embodiment 3.
7 is a perspective view of an optical transceiver 1000 according to a third embodiment. The optical transceiver 1000 includes a CAN-type optical module 101 and a flexible printed circuit board 70 that connects the CAN-type optical module 101 to a transceiver board, which will be described later. The CAN-type optical module 101 can have the same structure as the CAN-type optical modules 100 and 200, except for the arrangement of the protective resistor R2.

In the CAN-type optical module 101, a lens cap 91 is provided on the stem 1. The lens cap 91 is omitted in Fig. 1. The flexible printed circuit board 70 is attached to the side of the stem 1 opposite to the main surface 1a.

Figure 8 is a diagram explaining protective resistor R2 according to embodiment 3. Figure 8 is a diagram showing flexible printed circuit board 70 viewed from the back side. In this embodiment, protective resistor R2 is provided on flexible printed circuit board 70. Lead pins 2a to 2f protrude from the back side of flexible printed circuit board 70. Of these, lead pin 2f is an RF power supply lead pin electrically connected to optical modulator section 50b.

On the side of the flexible printed circuit board 70 opposite the stem 1, a signal line 70a connected to the lead pin 2f and a GND pattern 70b electrically connected to the back surface of the stem 1 are formed. The protective resistor R2 connects the signal line 70a and the GND pattern 70b of the flexible printed circuit board 70. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed on the flexible printed circuit board 70.

Figure 9 is a diagram explaining the reflection characteristic S11 of the optical transceiver 1000 of embodiment 3. Looking at the part indicated by the arrow in the figure, it can be seen that the reflection characteristic of embodiment 3 is improved compared to embodiment 1. The line of the flexible printed circuit board 70 is also a microstrip line, and there is no need to hollow out the GND pattern to form the protective resistor R2. It is believed that this makes it possible to suppress impedance changes and obtain good high frequency characteristics.

Embodiment 4.
FIG. 10 is a diagram for explaining a protective resistor R2 according to the fourth embodiment. In the optical transceiver 2000 according to the present embodiment, the type of the protective resistor R2 is different from that of the optical transceiver 1000 according to the third embodiment. The protective resistor R2 according to the present embodiment is a chip resistor. The other configurations are the same as those of the third embodiment. Depending on the manufacturer, it may be difficult to form a thin-film resistor. In addition, if the precision of the resistance value of the thin-film resistor is increased by laser trimming, the manufacturing cost may increase. According to the present embodiment, the manufacturer can provide the protective resistor R2 by purchasing and joining a chip resistor. Therefore, the manufacturing process can be simplified and the cost can be reduced.

Embodiment 5.
11 is a diagram for explaining the protective resistor R2 according to the fifth embodiment. In the CAN type optical module 300 of this embodiment, the type of the protective resistor R2 is different from that of the CAN type optical module 200 of the second embodiment. The protective resistor R2 of this embodiment is a chip resistor. The other configurations are the same as those of the second embodiment. As in the fourth embodiment, the manufacturing process can be simplified and costs can be reduced in this embodiment. The protective resistor R2 of the first embodiment may be replaced with a chip resistor.

Embodiment 6.
12 is a perspective view of an optical transceiver 3000 according to a sixth embodiment. In this embodiment, the arrangement of the protective resistor R2 is different from that of the third embodiment. The other configurations are the same as those of the third embodiment. In the optical transceiver 3000, a receptacle 102 for fixing an optical fiber is attached to a CAN type optical module 101. A transceiver board 60 on which an integrated circuit for driving the CAN type optical module 101 and the optical receiver module 106 is mounted is connected to the CAN type optical module 101 and the optical receiver module 106 via a flexible printed circuit board 70. In the optical transceiver 3000, the CAN type optical module 101, the optical receiver module 106, the flexible printed circuit board 70, the receptacle 102, and the transceiver board 60 are housed in a case 105.

In order to increase the amount of heat transfer between the CAN type optical module 101 and the case 105, it is advisable to attach a heat dissipation block 103 between the CAN type optical module 101 and the case 105. It is desirable that the heat dissipation block 103 has a semicircular structure that allows the CAN type optical module 101 to be fixed over the entire length of the side. Furthermore, a heat dissipation block 104 may be attached to the CAN type optical module 101. Like the heat dissipation block 103, the heat dissipation block 104 has a semicircular structure that allows the CAN type optical module 101 to be fixed over the entire length of the side. Furthermore, the heat dissipation block 104 has a fin-shaped side opposite the CAN type optical module 101.

Figure 13 is a diagram illustrating a protective resistor R2 according to embodiment 6. Figure 13 is an enlarged view of area A1 in Figure 12. The protective resistor R2 of this embodiment is provided on a transceiver board 60. The transceiver board 60 is provided with a plurality of electrodes 61 each connected to a signal line 70a and a GND pattern 70b of a flexible printed circuit board 70. The protective resistor R2 connects between the plurality of electrodes 61. This results in a circuit as shown in Figure 4. The protective resistor R2 is, for example, a thin-film resistor formed on the transceiver board 60. The protective resistor R2 may be a chip resistor.

In this embodiment, even if a surge is input, a current flows through the protective resistor R2. This prevents the optical modulator section 50b from failing.

Embodiment 7.
14 is a perspective view of a CAN-type optical module 400 according to the seventh embodiment. The CAN-type optical module 400 includes a wire W1 that connects a GND pattern 10a formed on the surface of the temperature control module 10 on which the first support block 20 is provided, and a stem 1. The upper surface of the temperature control module 10 is electrically connected to the GND patterns of the first support block 20 and the first submount 30, and is at GND potential. By connecting the upper surface of the temperature control module 10 and the stem 1 with the wire W1, the GND on the upper surface side of the temperature control module 10 can be strengthened, and the high frequency characteristics can be further improved.

Embodiment 8.
15 is a perspective view of a CAN-type optical module 500 according to the eighth embodiment. In this embodiment, the shape of the first support block 520 and the position of the wire for strengthening the GND are different from those of the seventh embodiment. The other configurations are the same as those of the seventh embodiment. The first support block 520 has a first portion 521 that supports the first submount 30, and a second portion 522 that is provided on the temperature control module 10 and protrudes from the first portion 521 toward the first submount 30. The first support block 520 can also be said to be inverted T-shaped.

The CAN type optical module 500 includes a wire W2 that connects the second portion 522 of the first support block 520 to the stem 1. The CAN type optical module 500 also includes a wire W3 that connects the second portion 522 of the first support block 520 to the GND pattern 80c of the second submount 80. In this embodiment, too, the GND on the upper surface side of the temperature control module 10 can be strengthened, and the high frequency characteristics can be further improved. Note that only one of the wires W2 and W3 or both may be provided.

Figure 16 is a diagram explaining the transmission characteristic S21 of the CAN type optical module 500 relating to embodiment 8. The solid line shows the case where wires W2 and W3 are present, and the dashed line shows the case where wires W2 and W3 are not present. Looking at the part indicated by the arrow in the figure, it can be seen that resonance of the transmission characteristic can be suppressed by providing wires W2 and W3.

14 and 15, the protective resistor R2 is provided at the position of the second embodiment, but the wires W1, W2, and W3 may be provided in any of the embodiments. Also, the wire W0 described in the first embodiment may be combined with at least one of the wires W1, W2, and W3 and applied to each embodiment. For example, the first support block 520 may be provided on the temperature control module 10 and have a third portion 523 that protrudes from the first portion 521 to the opposite side to the first submount 30, and the upper surface of the second support block 79 and the third portion 523 may be connected by the wire W0.

The technical features described in each embodiment may be used in any suitable combination.

1 stem, 1a main surface, 2a to 2f lead pins, 3 glass, 10 temperature control module, 10a GND pattern, 20 first support block, 21 first part, 22 second part, 30 first submount, 30a signal line, 30b GND pattern, 50 semiconductor optical integrated element, 50a semiconductor laser section, 50b optical modulator section, 50c optical amplifier section, 55 thermistor, 60 transceiver substrate, 61 electrode, 70 flexible printed circuit board, 70a signal line, 70b GND pattern, 79 second support block, 80 second submount, 80a signal line, 80b, 80c GND pattern, 91 cap, 100, 101 CAN type optical module, 102 receptacle, 103, 104 heat dissipation block, 105 Case, 106 Optical receiver module, 200, 300, 400, 500 CAN type optical module, 520 First support block, 521 First part, 522 Second part, 523 Third part, 1000, 2000, 3000 Optical transceiver, C0, C1, C2 Capacitor, D1 Diode, R1 Matching resistor, R2 Protection resistor, W0 to W3 Wires

Claims (22)

A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface ;
a first submount provided so that a mounting surface is perpendicular to the main surface of the stem;
a support portion including a temperature control module mounted on the main surface of the stem and a first support block mounted on the temperature control module on a side opposite to the main surface of the stem and supporting the first submount;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion;
A second support block provided on the main surface of the stem;
a second submount mounted on a side surface of the second support block ;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
A protective resistor connected in parallel with the series circuit;
Equipped with
a first signal line and a first GND pattern are formed on the second submount;
a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern are formed on the first submount;
the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern ;
The first support block is
a first portion supporting the first submount;
a second portion provided on the temperature control module and protruding from the first portion to a side opposite the first submount;
having
A CAN type optical module comprising a wire connecting an upper surface of the second support block and the second portion . The CAN-type optical module according to claim 1, characterized in that the protective resistor is connected between the first signal line and the first GND pattern of the second submount. The CAN-type optical module according to claim 1, characterized in that the protective resistor is connected between the second signal line of the first submount and the second GND pattern. 4. The CAN type optical module according to claim 1, wherein the protective resistor is a chip resistor . 4. A CAN type optical module as claimed in any one of claims 1 to 3, characterized in that it is provided with a wire connecting the stem to a GND pattern formed on a surface of the temperature control module on which the first support block is provided . A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface;
a first submount provided so that a mounting surface is perpendicular to the main surface of the stem;
a support portion including a temperature control module mounted on the main surface of the stem and a first support block mounted on the temperature control module on a side opposite to the main surface of the stem and supporting the first submount;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion;
A second support block provided on the main surface of the stem;
a second submount mounted on a side surface of the second support block;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
A protective resistor connected in parallel with the series circuit;
Equipped with
a first signal line and a first GND pattern are formed on the second submount;
a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern are formed on the first submount;
the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern;
The first support block is
a first portion supporting the first submount;
a second portion provided on the temperature control module and protruding from the first portion toward the first submount;
having
A CAN type optical module comprising at least one of a wire connecting said second portion and said stem and a wire connecting said second portion and a GND pattern of said second submount. the first support block is provided on the temperature control module and has a third portion protruding from the first portion on a side opposite to the first submount;
7. The CAN-type optical module according to claim 6 , further comprising a wire connecting an upper surface of the second support block and the third portion. 8. The CAN type optical module according to claim 1 , 2, 3, 6, or 7, wherein the semiconductor optical integrated device has an optical amplifier section. 8. The CAN type optical module according to claim 1, wherein the semiconductor optical integrated element is mounted at an angle with respect to a direction perpendicular to the main surface of the stem. 9. The CAN type optical module according to claim 8 , further comprising: a semiconductor laser section capacitor connected to said semiconductor laser section; and an optical amplifier section capacitor connected to said optical amplifier section. A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface;
A support portion provided on the main surface of the stem;
a first submount supported by the support and provided such that a mounting surface is perpendicular to the main surface of the stem;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion, an optical amplifier portion, and an optical modulator portion;
a second submount provided on the main surface of the stem;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
A protective resistor connected in parallel with the series circuit;
a capacitor for the semiconductor laser unit connected to the semiconductor laser unit;
an optical amplifier section capacitor connected to the optical amplifier section;
Equipped with
a first signal line and a first GND pattern are formed on the second submount;
a second signal line connecting the optical modulator section and the first signal line, and a second GND pattern are formed on the first submount;
the protective resistor is connected between the first signal line and the first GND pattern or between the second signal line and the second GND pattern;
a capacitor for the semiconductor laser section, a capacitor for the optical amplifier section, and a capacitor for the optical modulator section, the capacitor being mounted in alignment on the support section; a CAN type optical module;
a flexible printed circuit board that connects the CAN type optical module and a transceiver board;
A protective resistor,
Equipped with
The CAN type optical module comprises:
A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface ;
a first submount provided so that a mounting surface is perpendicular to the main surface of the stem;
a support portion including a temperature control module mounted on the main surface of the stem and a first support block mounted on the temperature control module on a side opposite to the main surface of the stem and supporting the first submount;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion;
A second support block provided on the main surface of the stem;
a second submount mounted on a side surface of the second support block;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
Equipped with
the protective resistor is connected in parallel with the series circuit and is provided on the flexible printed circuit board or the transceiver board ;
The first support block is
a first portion supporting the first submount;
a second portion provided on the temperature control module and protruding from the first portion to a side opposite the first submount;
having
The optical transceiver , wherein the CAN type optical module includes a wire connecting an upper surface of the second support block and the second portion . the lead pins include an RF power supply lead pin electrically connected to the optical modulator section,
A signal line connected to the RF power supply lead pin and a GND pattern are formed on the flexible printed circuit board,
13. The optical transceiver according to claim 12 , wherein the protective resistor connects the signal line of the flexible printed circuit board to the GND pattern of the flexible printed circuit board. The optical transceiver according to claim 12 , wherein the protective resistor is provided on the transceiver board. 15. The optical transceiver according to claim 12 , wherein the protective resistor is a chip resistor . 15. An optical transceiver as claimed in any one of claims 12 to 14, further comprising a wire connecting the stem to a GND pattern formed on a surface of the temperature control module on which the first support block is provided . a CAN type optical module;
a flexible printed circuit board that connects the CAN type optical module and a transceiver board;
A protective resistor,
Equipped with
The CAN type optical module comprises:
A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface;
a first submount provided so that a mounting surface is perpendicular to the main surface of the stem;
a support portion including a temperature control module mounted on the main surface of the stem and a first support block mounted on the temperature control module on a side opposite to the main surface of the stem and supporting the first submount;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion and an optical modulator portion;
A second support block provided on the main surface of the stem;
a second submount mounted on a side surface of the second support block;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
Equipped with
the protective resistor is connected in parallel with the series circuit and is provided on the flexible printed circuit board or the transceiver board;
The first support block is
a first portion supporting the first submount;
a second portion provided on the temperature control module and protruding from the first portion toward the first submount;
having
The optical transceiver is characterized in that the CAN type optical module is provided with at least one of a wire connecting the second part and the stem and a wire connecting the second part and a GND pattern of the second submount. the first support block is provided on the temperature control module and has a third portion protruding from the first portion on a side opposite to the first submount;
18. The optical transceiver according to claim 17 , wherein the CAN type optical module further comprises a wire connecting an upper surface of the second support block and the third portion. 19. The optical transceiver according to claim 12 , 13, 14, 17, or 18, wherein the semiconductor optical integrated device comprises an optical amplifier section. 19. The optical transceiver according to claim 1 , 2 , 13 , 14 , 17 , or 18 , wherein the semiconductor optical integrated device is mounted at an angle with respect to a direction perpendicular to the main surface of the stem. 20. The optical transceiver according to claim 19 , wherein the CAN type optical module comprises: a semiconductor laser section capacitor connected to the semiconductor laser section; and an optical amplifier section capacitor connected to the optical amplifier section. a CAN type optical module;
a flexible printed circuit board that connects the CAN type optical module and a transceiver board;
A protective resistor,
Equipped with
The CAN type optical module comprises:
A stem having a main surface and a surface opposite to the main surface;
a lead pin penetrating the stem from the main surface to a surface opposite to the main surface;
A support portion provided on the main surface of the stem;
a first submount supported by the support and provided such that a mounting surface is perpendicular to the main surface of the stem;
a semiconductor optical integrated device provided on the mounting surface of the first submount and having a semiconductor laser portion, an optical amplifier portion, and an optical modulator portion;
a series circuit including a matching resistor and a capacitor for an optical modulator section connected in series with each other, the series circuit being connected in parallel with the optical modulator section;
a capacitor for the semiconductor laser unit connected to the semiconductor laser unit;
an optical amplifier section capacitor connected to the optical amplifier section;
Equipped with
the protective resistor is connected in parallel with the series circuit and is provided on the flexible printed circuit board or the transceiver board;
an optical transceiver, wherein the capacitor for the semiconductor laser section, the capacitor for the optical amplifier section, and the capacitor for the optical modulator section are mounted in an aligned manner on the support section.

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