JP7496249B2 - Component mounting board and method for manufacturing the component mounting board - Google Patents

Description

The present invention relates to a component mounting board and a method for manufacturing a component mounting board.

An example of a component mounting board is described in Japanese Patent Laid-Open No. 2003-233696.
The component mounting board of Patent Document 1 (referred to as an RFID tag in the document) includes a mounted component (referred to as an RFIC element in the document) and an antenna wiring section (referred to as an antenna element in the document).
The component mounting board of Patent Document 1 has a wireless communication function and is configured so that when the component mounting board absorbs liquid, the signal strength or communication distance emitted from the component mounting board increases. By detecting the increase in signal strength or communication distance, it is possible to detect the liquid absorption state of the component mounting board.

International Publication No. 2017/065164

According to the inventors' investigations, there is room for improvement in terms of reliability with respect to the structure for detecting changes in the environment in which the component mounting board of Patent Document 1 is placed.

The present invention was made in consideration of the above problems, and provides a component mounting board with a structure that can more reliably detect changes in the environment in which the component mounting board is placed, and a method for manufacturing the component mounting board.

According to the present invention, a first base material layer and a second base material layer each being easily decomposable,
A conductive pattern disposed between the first base material layer and the second base material layer;
a mounting component interposed between the first base layer and the conductive pattern, and the second base layer;
Equipped with
the mounting component has a mounting terminal electrically connected to the conductive pattern,
the conductive pattern is a coating film including a conductive filler and a binder containing a thermoplastic resin,
The conductive pattern includes a relatively wide pattern and a relatively narrow pattern,
the wide pattern has thick film portions at both ends in a width direction, and has a thin film portion in a center portion in the width direction, the thin film portion having a thickness smaller than that of the thick film portion;
The narrow width pattern is provided on a component mounting board having a portion where the film thickness is maximum in the center in the width direction.

The present invention makes it possible to more reliably detect changes in the environment in which a component mounting board is placed.

FIG. 1 is a schematic plan view showing a component mounting board according to a first embodiment. FIG. 2 is an enlarged view of part B in FIG. 1 is a cross-sectional view of a component mounting board according to a first embodiment. 4A to 4E are diagrams showing a series of steps for explaining the method for manufacturing a component mounting board according to the first embodiment. 5A and 5B are diagrams illustrating a series of steps for explaining the method for manufacturing a component mounting board according to the first embodiment. 1 is a schematic development view of a disposable diaper on which a component mounting board according to a first embodiment is attached. FIG. 7 is a cross-sectional view taken along line AA in FIG. 6. FIG. 11 is a cross-sectional view of a component mounting board according to a modified example of the first embodiment. 9A and 9B are diagrams showing a series of steps for explaining a method for manufacturing a component mounting board according to a modified example of the first embodiment. 10(a), 10(b) and 10(c) are a series of process diagrams for explaining a method for manufacturing a component mounting board according to a modified example of the first embodiment. FIG. 11A is a plan view of a component mounting board according to the second embodiment, and FIG. 11B is an enlarged view of portion B in FIG. 11A. FIG. 12A is a plan view of a component mounting board according to a first modified example of the second embodiment, and FIG. 12B is a plan view of a component mounting board according to a second modified example of the second embodiment. 13(a) and 13(b) show a component mounting board according to the third embodiment, in which FIG. 13(a) is a plan view and FIG. 13(b) is an enlarged view of part C in FIG. 13(a). 14(a) and 14(b) show a component mounting board according to the third embodiment, in which FIG. 14(a) is a cross-sectional view taken along line A-A in FIG. 13(a), and FIG. 14(b) is a cross-sectional view taken along line B-B. 15(a), 15(b) and 15(c) are a series of process diagrams for explaining a method for manufacturing a component mounting board according to the third embodiment. Each of FIGS. 16(a), 16(b), 16(c) and 16(d) is a cross-sectional view of a conductive pattern in the third embodiment.

First Embodiment
A first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 7. In all the drawings, the same components are given the same reference numerals, and the description will be omitted as appropriate. In Fig. 2, the laminated section 60, which will be described later, is omitted. Fig. 3 is a cross-sectional view of the component mounting board 100 taken along line A-A in Fig. 2.

As shown in FIG. 3 , the component mounting board 100 according to this embodiment includes a first base layer 10 and a second base layer 20, each of which is easily decomposable, a conductive pattern 30 disposed between the first base layer 10 and the second base layer 20, and a mounting component 40 having a mounting terminal 45 electrically connected to the conductive pattern 30.
At least one of the first substrate layer 10 and the second substrate layer 20 is an adhesive layer made of an adhesive, and the mounting component 40 is interposed between the first substrate layer 10 and the conductive pattern 30, and the second substrate layer 20, with the mounting component 40 in direct contact with the adhesive layer, and the mounting terminal 45 in direct contact with the conductive pattern 30.

Here, "easily degradable" means a property of being decomposed (easily) by a specific change in the environment. In the case of this embodiment, as described later, "easily degradable" means a property of being decomposed (dissolved or dispersed) by contact with a liquid, more specifically, a property of being decomposed (dissolved or dispersed) by contact with water (moisture). However, the present invention is not limited to this example, and the property may be decomposed by a change in temperature (e.g., by becoming high temperature), may be decomposed by exposure to ultraviolet light, or may be biodegraded by microorganisms or the like.
It is preferable that the decomposability of the first substrate layer 10 and the decomposability of the second substrate layer 20 are the same type, so that the first substrate layer 10 and the second substrate layer 20 can be decomposed in response to a common change in the environment.
In addition, when the mounting terminal 45 is in direct contact with the conductive pattern 30, it means that the mounting terminal 45 is in contact with and electrically connected to the conductive pattern 30 without an intervening material such as solder or conductive adhesive.

According to this embodiment, the mounting component 40 is interposed between the first base layer 10 and the conductive pattern 30, and the second base layer 20, and the mounting terminal 45 is in direct contact with the conductive pattern 30. In other words, the mounting component 40 and the conductive pattern 30 are sandwiched and restrained by the first base layer 10 and the second base layer 20. Since the mounting component 40 is in direct contact with the adhesive layer, the positional deviation of the mounting component 40 in the surface direction of the component mounting board 100 is more reliably suppressed by the adhesive layer.
Since the first base layer 10 and the second base layer 20 are each easily decomposable, the first base layer 10 and the second base layer 20 are decomposed due to a specific change in the environment, and the mounting components 40 and the conductive pattern 30 are released from the state of being restrained by the first base layer 10 and the second base layer 20. As a result, the mounting terminal 45 and the conductive pattern 30 can be easily separated (for example, by applying a slight external force). This is because, as described above, the mounting terminal 45 is in direct contact with the conductive pattern 30 without an intermediate material such as solder or conductive adhesive.
When the mounting terminal 45 and the conductive pattern 30 are separated from each other, the electrical connection between the mounting terminal 45 and the conductive pattern 30 is interrupted, and a change in the environment can be detected based on the interruption of the connection.
In this way, when the first substrate layer 10 and the second substrate layer 20 decompose due to a change in the environment, the mounting terminals 45 and the conductive pattern 30 can be easily separated. Therefore, compared to a structure in which the mounting terminals 45 are connected to the conductive pattern 30 by solder, a conductive adhesive, or the like, changes in the environment in which the component mounting board 100 is placed can be detected more reliably.

In this embodiment, since the mounting terminals 45 of the mounting components 40 are in direct contact with the conductive pattern 30, the thermal load on the first base layer 10 and the second base layer 20 can be reduced during the manufacture of the component mounting board 100 compared to the case where the mounting components 40 are fixed to the conductive pattern 30 by soldering. Furthermore, since the mounting components are in contact with the adhesive layer, the mounting components 40 can be fixed to the conductive pattern 30 by the adhesive layer and the restraining force of the first base layer 10 and the second base layer 20 without using solder or conductive adhesive, thereby improving the manufacturability of the component mounting board 100.

In the following, when explaining the positional relationships between the components of the component mounting board 100, the upper side in FIG. 3 will be referred to as the upper side or upward, and the opposite side will be referred to as the lower side or downward. In addition, the direction perpendicular to the up-down direction will be referred to as the horizontal direction. However, these directional definitions are for convenience only, and do not limit the directions during manufacture or use of the component mounting board 100.

1 to 3, the component mounting board 100 is, for example, a laminate formed in a flat plate shape. The planar shape of the component mounting board 100 is not particularly limited, but as an example, it can be a substantially rectangular shape (for example, a rectangular shape with rounded corners) as shown in FIG.
In the case of this embodiment, the mounted component 40 is, for example, an RFID chip, and the component mounting board 100 is an RFID tag.

1 to 3, the mounting component 40 includes a component body 41 and a mounting terminal 45 provided along the lower surface of the component body 41. The component body 41 is formed, for example, by resin-molding an element (not shown), and the element and the mounting terminal 45 are electrically connected to each other inside the resin mold.
The shape of the component body 41 is not particularly limited, but may be, for example, a rectangular parallelepiped shape. The component body 41 is preferably a flat shape in which the thickness dimension is smaller than the planar dimension (the length of one side in a plan view). It is also possible for the component body 41 to be a square shape in which the long and short sides are the same size.
The shape of the mounting terminal 45 is not particularly limited, but may be, for example, a flat plate shape. For example, as shown in Fig. 3, the surface direction of the mounting terminal 45 is arranged along the horizontal direction (the thickness direction of the mounting terminal 45 is arranged along the vertical direction).
The lower surface of the mounting terminal 45 may be disposed flush with the lower surface of the component body 41 , but is preferably located lower than the lower surface of the component body 41 .
The number of mounting terminals 45 included in the mounting component 40 is not particularly limited, but in this embodiment, the mounting component 40 has two mounting terminals 45 (a first mounting terminal 46 and a second mounting terminal 47). Each mounting terminal 45 is electrically connected to the conductive pattern 30.

In this embodiment, the component mounting board 100 includes, for example, a first base material layer 10, a second base material layer 20, a conductive pattern 30, and mounted components 40, as well as a cover layer 70, a retaining film 85, and a release film 95, as shown in FIG.
In this embodiment, the cover layer 70 is laminated directly on the holding film 85, and the first base material layer 10 is laminated directly on the cover layer 70. In addition, the second base material layer 20 is laminated directly on the first base material layer 10, and the release film 95 is laminated directly on the second base material layer 20.
It should be noted that the present invention is not limited to this example, and another layer (preferably an easily decomposable layer) may be interposed between the retaining film 85 and the cover layer 70. Similarly, another layer (preferably an easily decomposable layer) may be interposed between the cover layer 70 and the first base material layer 10. Similarly, another layer (preferably an easily decomposable layer) may be interposed between the second base material layer 20 and the release film 95.
The conductive pattern 30 is formed on the upper surface of the first base layer 10. Hereinafter, the upper surface of the first base layer 10 may be referred to as one surface 10a. Also, the lower surface of the second base layer 20, i.e., the surface in surface contact with the first base layer 10, may be referred to as one surface 20a.
The conductive pattern 30 and the mounted components 40 are disposed, for example, between one surface 10 a of the first base layer 10 and one surface 20 a of the second base layer 20 .
In the present embodiment, the first base layer 10 is an adhesive layer, as described below. For example, as shown in Fig. 3, the conductive pattern 30 is embedded in the first base layer 10, and the upper surface of the conductive pattern 30 is exposed from one surface 10a.
The lower surface of each mounting terminal 45 is in contact with the upper surface of the conductive pattern 30 .
The mounting components 40 and the conductive pattern 30 are sandwiched and restrained from above and below by the upper second base material layer 20 and the lower first base material layer 10. As a result, the mounting terminals 45 are in contact (pressure-welded) with the conductive pattern 30.

In the following, the combined portion of the first base layer 10, the cover layer 70, and the retaining film 85 may be referred to as the support layer 80. In the following, the combined portion of the second base layer 20 and the release film 95 may be referred to as the protective layer 90. In the following, the combined portion of the support layer 80 and the protective layer 90 may be referred to as the laminated portion 60.

The upper surface of the first base layer 10 and the lower surface of the second base layer 20 are in direct contact with each other over substantially the entire surface, except for the area where the mounted components 40 are arranged and the area where the conductive pattern 30 is formed.
The lower surface of the second base layer 20 is in direct contact with the upper surface of the conductive pattern 30 over substantially the entire surface in the region where the conductive pattern 30 is formed and where the conductive pattern 30 is not covered by the mounting components 40. In other words, substantially the entire surface of the upper surface of the conductive pattern 30 that is not covered by the mounting components 40 is in direct contact with the lower surface of the second base layer 20.
The lower surface of the second base layer 20 is in direct contact with the upper surface of the component body 41 over substantially the entire area in the region in which the mounted components 40 are arranged.
The upper surface of the first base layer 10 is in direct contact with the lower surface of the conductive pattern 30 over substantially the entire area in the region where the conductive pattern 30 is formed. In other words, substantially the entire area of the lower surface of the conductive pattern 30 is in direct contact with the upper surface of the first base layer 10.
The lower surface of the second base layer 20 is in direct contact with the component body 41 over substantially the entire area in the region in which the mounted component 40 is arranged.

In this embodiment, each of the first substrate layer 10 and the second substrate layer 20 decomposes upon contact with a liquid.
Therefore, when the component mounting board 100 comes into contact with liquid, the first base material layer 10 and the second base material layer 20 are decomposed, and the mounting terminals and the conductive pattern 30 can be easily separated. As a result, RFID communication (NFC communication can also be applied as a similar application) continues as usual before the component mounting board 100 comes into contact with liquid, but once the component mounting board 100 comes into contact with liquid, the RFID communication is interrupted. Therefore, the interruption of RFID communication makes it possible to detect that the component mounting board 100 has come into contact with liquid.
More specifically, in the case of this embodiment, the first base material layer 10 and the second base material layer 20 dissolve when they come into contact with the same type of liquid. Note that in this embodiment, decomposition when they come into contact with a liquid includes dissolving in the liquid to become a solution, as well as dispersing in particulate form in the liquid to become a colloid.
The liquid referred to here is, for example, a liquid containing water (moisture) in this embodiment. That is, the first substrate layer 10 and the second substrate layer 20 are, for example, water-soluble. However, the present invention is not limited to this example, and the first substrate layer 10 and the second substrate layer 20 may be dissolved or dispersed by contact with a liquid such as an organic solvent that does not contain moisture. In addition, the first substrate layer 10 and the second substrate layer 20 may be made of a material that becomes a suspension (suspension) that disperses as solid particles in water or other liquids, or an emulsion (emulsion) that disperses as liquid particles. It is preferable that the first substrate layer 10 and the second substrate layer 20 are both dissolved or dispersed in a common solvent (water, etc.).

As described above, at least one of the first base layer 10 and the second base layer 20 is an adhesive layer. In the present embodiment, the first base layer 10 is an adhesive layer, and the second base layer 20 is a non-adhesive layer having no adhesion. The adhesive strength (peel strength) of the non-adhesive layer is smaller than the adhesive strength of the adhesive layer. However, as described in the modified example described later, the first base layer 10 may be a non-adhesive layer, and the second base layer 20 may be an adhesive layer.
In this manner, one of the first base material layer 10 and the second base material layer 20 is an adhesive layer, and the other is a non-adhesive layer having no adhesive properties.
However, the present invention is not limited to these examples, and both the first base material layer 10 and the second base material layer 20 may be adhesive layers.
The adhesive forming the water-soluble (or aqueous) adhesive layer is not particularly limited, but examples thereof include starch paste, gum arabic paste, and aqueous acrylic emulsion. An example of an aqueous acrylic emulsion is prepared by copolymerizing an acrylic monomer containing a carboxyl group and adding alcohol or polyethylene oxide. The adhesive layer may be configured to include two or more types of water-soluble (or aqueous) adhesives. Of the above, an example of the water-soluble adhesive according to the present invention is an aqueous acrylic emulsion.

In the present embodiment, the non-adhesive layer contains PVA (polyvinyl alcohol), that is, the second base layer 20 contains PVA.
By configuring the non-adhesive layer to contain PVA, it is possible to realize a structure in which the non-adhesive layer (second base layer 20) dissolves well when component mounting board 100 comes into contact with moisture.
However, the non-adhesive layer may be configured to include a water-soluble material, and the material is not limited to PVA and may be, for example, polyvinylpyrrolidone, water-soluble polyester, etc. Furthermore, the non-adhesive layer may be configured to include, for example, two or more types of water-soluble materials.
In addition, since the component mounting substrate 100 according to the present invention may be used as an environmental sensor that detects changes in the environment by taking advantage of its property of being decomposed upon contact with liquid, it is desirable to select a material that has little polluting effect on the environment.

Here, the adhesive layer and the non-adhesive layer can be distinguished by the magnitude of the peel strength in a thermocompression bonded state.
As an example, when non-adhesive layers are thermocompressed together and a peel test is performed according to IPC TM650 2.4.9/sliding plate method, the resulting peel strength is less than 0.147 kN/m. In other words, if two similarly prepared layers are thermocompressed together and the peel strength is less than 0.147 kN/m, the layer can be considered a non-adhesive layer.
On the other hand, when the non-adhesive layer and the adhesive layer are thermocompression-bonded and a peel test is carried out by the IPC TM650 2.4.9/sliding plate method, the obtained peel strength is 0.147 kN/m or more. In other words, if the peel strength of the layer regarded as the non-adhesive layer in the above test results and another layer in a thermocompression-bonded state is 0.147 kN/m or more, the other layer can be regarded as the adhesive layer.
The peel strength between the non-adhesive layers is preferably 0.130 kN/m or less, and also preferably 0.120 kN/m or less, and is preferably 0.050 kN/m or more, and also preferably 0.100 kN/m or more.
IPC TM650 2.4.9/Sliding Plate Method is a method for evaluating the adhesion strength of cover laminates and reinforcing materials for flexible printed circuits (FPCs). While moving the two layers to be measured in the plane direction of these layers (sliding movement using a holding tool), one layer is pulled in the direction perpendicular to the plane by a tensile tester, and the peel strength from the other layer is measured.
In addition, the conditions for thermocompression bonding between the non-adhesive layers and between the non-adhesive layer and the adhesive layer are the same as those for the process of thermocompression bonding between the first base layer 10 and the second base layer 20 described below.

Here, the cover layer 70 is easily decomposable. That is, the cover layer 70 is laminated on the adhesive layer (the first base layer 10 in this embodiment) on the side opposite to the non-adhesive layer (the second base layer 20 in this embodiment), and the cover layer 70 is easily decomposable.
For this reason, the first base material layer 10, the second base material layer 20, and the cover layer 70 are decomposed by a specific change in the environment, and the mounting terminals 45 and the conductive pattern 30 can be easily separated from each other. More specifically, the cover layer 70 covering the adhesive layer is decomposed, so that the adhesive layer is brought into a state in which it can be decomposed more easily, and the adhesive layer is decomposed.
The decomposability of the cover layer 70 is preferably the same type as that of the first base material layer 10 and the second base material layer 20. That is, when the first base material layer 10 and the second base material layer 20 are water-soluble, the cover layer 70 is also preferably water-soluble. In this manner, the first base material layer 10, the second base material layer 20, and the cover layer 70 can be decomposed by a common change in the environment.
The cover layer 70 is non-adhesive, and hereinafter may be referred to as a second non-adhesive layer.
Since the adhesive layer (first base layer 10) is sandwiched between the non-adhesive layer (second base layer 20) and the second non-adhesive layer (cover layer 70), the component mounting board 100 has good handleability.
The material of the second non-adhesive layer (cover layer 70) is similar to the material of the non-adhesive layer.
In this embodiment, the cover layer 70 contains PVA (polyvinyl alcohol) like the non-adhesive layer, and therefore dissolves when it comes into contact with moisture.

The retaining film 85 is laminated on the lower surface side of the cover layer 70 so as to be easily peelable from the cover layer 70 .
Similarly, the release film 95 is laminated on the upper surface side of the second base layer 20 so as to be easily peelable from the second base layer 20 .
The holding film 85 and the release film 95 do not need to be easily decomposable, and in this embodiment, they are made of a material that is not easily decomposable.
When using the component mounting board 100, for example, the holding film 85 is peeled off from the cover layer, and the release film 95 is peeled off from the second base material layer 20. As a result, the easily decomposable second base material layer 20 is exposed on the upper surface side of the component mounting board 100, and the easily decomposable cover layer 70 is exposed on the lower surface side of the component mounting board 100, making it easier to decompose the second base material layer 20 and the cover layer 70 due to changes in the environment.
In the case of the present embodiment, when the component mounting board 100 comes into contact with liquid, the portions of the component mounting board 100 other than the conductive pattern 30 and the mounted components 40 (the first base material layer 10, the second base material layer 20, and the cover layer 70) are decomposed (dissolved), so that the conductive pattern 30 and the mounted components 40 are exposed to the outside of the component mounting board 100. Therefore, the mounting terminals 45 and the conductive pattern 30 can be easily separated from each other due to a change in shape accompanied by contraction caused by an external force or when the component mounting board 100 comes into contact with liquid (absorbs liquid).
Furthermore, prior to use of the first substrate layer 10, the easily decomposable second substrate layer 20 is covered by a release film 95, and the easily decomposable cover layer 70 is covered by a retaining film 85, thereby preventing unintended decomposition of the second substrate layer 20, the cover layer 70, and the first substrate layer 10 before the component mounting board 100 is used for its intended purpose.

It is preferable that the holding film 85 and the release film 95 each have higher rigidity than the non-adhesive layer and the second non-adhesive layer. That is, it is preferable that the holding film 85 and the release film 95 have higher rigidity than the second base layer 20 and the cover layer 70. This improves the handleability during the manufacture of the component mounting board 100 and before use.
Moreover, the non-adhesive layer and the second non-adhesive layer preferably have higher rigidity than the adhesive layer. That is, each of the second base material layer 20 and the cover layer 70 preferably has higher rigidity than the first base material layer 10. This improves the handleability of the component mounting board 100 in a state in which the holding film 85 and the release film 95 are peeled off and removed during use.

The material of each of the holding film 85 and the release film 95 is not particularly limited, but may be PET (polyethylene terephthalate) or paper, or the like.
The material of each of the retaining film 85 and the release film 95 is preferably a water-impermeable material.
The holding film 85 and the release film 95 may be made of the same material, or may be made of different materials.
The heat resistance temperature of each of the holding film 85 and the release film 95 is preferably, for example, 130° C. or higher, and more preferably 150° C. or higher, taking into consideration the thermocompression bonding process described below. The heat resistance temperature of each of the holding film 85 and the release film 95 can be, for example, 350° C. or lower. By setting the heat resistance temperature range in this way, high flexibility in terms of physical properties can be obtained when selecting the holding film 85 and the release film 95, so that when the component mounting board 100 according to the present invention is mass-produced, a roll-to-roll process can be applied, and improvement in productivity can be expected.

The thickness dimension of the adhesive layer (first base layer 10 in this embodiment) is not particularly limited, but is preferably, for example, 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 20 μm or less.
Since the thickness dimension of the adhesive layer is 10 μm or more, the adhesive state between the adhesive layer and the non-adhesive layer, the adhesive state between the adhesive layer and the conductive pattern 30, the adhesive state between the adhesive layer and the mounted component 40, and the adhesive state between the adhesive layer and the cover layer 70 can be satisfactorily achieved at a stage prior to the occurrence of the above-mentioned environmental changes.
By making the thickness dimension of the adhesive layer 20 μm or less, the adhesive layer can be quickly decomposed when the above-mentioned environmental change occurs.

The thickness dimension of the non-adhesive layer (second base layer 20 in this embodiment) is not particularly limited, but is preferably, for example, 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 20 μm or less.
By setting the thickness dimension of the non-adhesive layer to 10 μm or more, the structural strength of the component mounting board 100 can be sufficiently ensured at a stage prior to the occurrence of the above-mentioned environmental changes, and the mounting terminals 45 and the conductive patterns 30 can be maintained in good contact with each other.
By setting the thickness dimension of the non-adhesive layer to 20 μm or less, the non-adhesive layer can be quickly decomposed when the above-mentioned environmental change occurs.

The thickness dimension of the cover layer 70 is not particularly limited, but is preferably, for example, 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 20 μm or less.
Since the thickness dimension of the cover layer 70 is 10 μm or more, the structural strength of the component mounting board 100 can be sufficiently ensured at a stage prior to the occurrence of the above-mentioned environmental changes, and the mounting terminals 45 and the conductive patterns 30 can be maintained in good contact with each other.
By setting the thickness dimension of the cover layer 70 to 20 μm or less, the cover layer 70 can be quickly decomposed when the above-mentioned environmental change occurs.

The thickness of each of the holding film 85 and the release film 95 is not particularly limited, but is preferably, for example, 25 μm or more and 100 μm or less, and more preferably 50 μm or more and 75 μm or less.
By having the thickness dimensions of each of the retaining film 85 and the peeling film 95 be 50 μm or more, the structural strength of the component mounting board 100 can be sufficiently ensured at the stage before the retaining film 85 and the peeling film 95 are peeled and removed, and the component mounting board 100 can be easily handled.

The thickness dimension of the conductive pattern 30 is not particularly limited, but is preferably, for example, 5 μm or more and 30 μm or less. Note that the thickness dimension of the conductive pattern 30 here refers to the average thickness dimension of the entire conductive pattern 30.

In this embodiment, the conductive pattern 30 has an antenna wiring portion 35 and a component mounting wiring portion 38 .
A mounting component 40 is mounted on the component mounting wiring section 38 .
The antenna wiring section 35 transmits and receives signals to and from, for example, an external device (e.g., an RFID reader/writer) not shown. That is, a signal or radio wave received by the antenna wiring section 35 from the external device is input to the mounted component 40. The mounted component 40 transmits a signal to the external device via the component mounting wiring section 38 and the antenna wiring section 35. Note that a part or the entirety of the component mounting wiring section 38 may also function as an antenna in cooperation with the antenna wiring section 35.
The mounted component 40 is, for example, a passive type that operates by electric power excited from an external device via the antenna wiring portion 35 .

In the present embodiment, when the component mounting board 100 comes into contact with moisture, the second base layer 20, the cover layer 70, and the first base layer 10 decompose, and when the conductive pattern 30 and the mounted component 40 constituting the antenna wiring section 35 are separated from each other by the action of an external force, the electrical connection between the mounted component 40 and the conductive pattern 30 is cut off. This causes the communication function of the component mounting board 100 to be lost. Therefore, by an external device detecting the loss of the communication function, it is possible to detect that the component mounting board 100 has come into contact with moisture. In other words, it is possible to detect a change in the environment in which the component mounting board 100 is placed.

In this embodiment, as shown in any one of Figures 1 to 3, the component mounting board 100 includes, as the conductive pattern 30, a first conductive pattern 31 and a second conductive pattern 32, and includes, as the mounting terminals 45, a first mounting terminal 46 in contact with the first conductive pattern 31, and a second mounting terminal 47 in contact with the second conductive pattern 32.
That is, the mounting component 40 is disposed, for example, straddling the first conductive pattern 31 and the second conductive pattern 32 .
The first conductive pattern 31 and the second conductive pattern 32 are each formed, for example, extending in a straight line and arranged on the same straight line (extension of each other). An end portion of the first conductive pattern 31 on the second conductive pattern 32 side (hereinafter, one end portion 31a) and an end portion of the second conductive pattern 32 on the first conductive pattern 31 side (hereinafter, one end portion 32a) are spaced apart from each other.

In the following description, the extension direction of the first conductive pattern 31 and the second conductive pattern 32 is referred to as the X direction. The X direction is perpendicular to the up-down direction (the direction perpendicular to the surface of the component mounting board 100). The direction perpendicular to both the X direction and the up-down direction is referred to as the Y direction.
The first mounting terminal 46 and the second mounting terminal 47 are arranged side by side, for example, in the X direction, on the lower surface of the component body 41. Note that the planar shape of the component body 41 is, for example, elongated in the X direction.
The planar shape of each of the first mounting terminal 46 and the second mounting terminal 47 is not particularly limited, but is formed, for example, in a rectangular shape that is slightly elongated in the Y direction.
Each of the first mounting terminal 46 and the second mounting terminal 47 is disposed, for example, on the inside of the outline of the mounting component 40 in a plan view. However, in a plan view, the side of the first mounting terminal 46 opposite the second mounting terminal 47 side may be disposed along the outline of the mounting component 40, and the side of the second mounting terminal 47 opposite the first mounting terminal 46 side may be disposed along the outline of the mounting component 40. Note that the plan view here means a view perpendicular to the surface of the component mounting board 100.

The surface (lower surface) of the mounting terminal 45 (first mounting terminal 46 and second mounting terminal 47) facing the conductive pattern 30 may be in contact with the conductive pattern 30 in its entirety, or only a portion of it may be in contact with the conductive pattern 30.
In the case of this embodiment, for example, in the first mounting terminal 46, the underside of the portion (approximately half) farther from the second mounting terminal 47 is in contact (pressed) with one end 31a of the first conductive pattern 31, and the underside of the portion (approximately the remaining half) closer to the second mounting terminal 47 is in contact with the upper surface of the first base layer 10 (adhesive layer).
Similarly, in the second mounting terminal 47, the underside of the portion (approximately half) farther from the first mounting terminal 46 is in contact (pressed) with one end 32a of the second conductive pattern 32, and the underside of the portion closer to the first mounting terminal 46 (approximately the remaining half) is in contact with the upper surface of the first base layer 10 (adhesive layer).
In addition, it is preferable that the area on the lower surface of the component body 41 where the mounting terminals 45 (the first mounting terminal 46 and the second mounting terminal 47) are not formed is in contact with the upper surface of the first base layer 10 (adhesive layer). In this way, the mounting component 40 is more satisfactorily fixed to the support layer 80, and a structure in which the mounting terminals 45 are in better contact (pressure welded) with the conductive pattern 30 can be realized.

Here, it is preferable that the distance L1 (FIG. 2) between the first conductive pattern 31 and the second conductive pattern 32 is longer than the distance L2 (FIG. 2) between the first mounting terminal 46 and the second mounting terminal 47.
By doing so, even if misalignment (misalignment in the horizontal direction) of the mounting terminals 45 (the first mounting terminal 46 and the second mounting terminal 47) with respect to the first conductive pattern 31 and the second conductive pattern 32 occurs when arranging the mounting component 40 with respect to the conductive pattern 30, the first mounting terminal 46 can be arranged on one end 31a of the first conductive pattern 31, and the second mounting terminal 47 can be arranged on one end 32a of the second conductive pattern 32. That is, for example, it is possible to prevent the second mounting terminal 47 from being arranged across the one end 31a of the first conductive pattern 31 and the one end 32a of the second conductive pattern 32.

In addition, it is preferable that the distance L1 between the first conductive pattern 31 and the second conductive pattern 32 is greater than the dimension of the mounting terminal 45 in the X direction. By doing so, it is possible to more reliably prevent the second mounting terminal 47 from being disposed across one end 31a of the first conductive pattern 31 and one end 32a of the second conductive pattern 32.

Here, the conductive pattern 30 is, for example, a coating film that includes a conductive filler and a binder containing a thermoplastic resin.
As a result, when manufacturing the component mounting board 100, by locally heating the portion of the conductive pattern 30 with which the mounting terminal 45 comes into contact, the mounting terminal 45 can be favorably fixed to the conductive pattern 30 by fusion. Therefore, in the component mounting board 100 before contact with liquid, a structure in which the conductive pattern 30 and the mounted components 40 are favorably conductive can be realized.
The conductive filler is made of, for example, gold, silver, copper, carbon, etc. The thermoplastic resin may be, for example, a polyester resin, an acrylic resin, or a urethane resin.

In this embodiment, the antenna wiring portion 35 includes, for example, a first antenna wiring portion 36 arranged on one side in the X direction, and a second antenna wiring portion 37 arranged on the other side in the X direction.
The first antenna wiring portion 36 includes, for example, a first zigzag portion 36b connected to the component mounting wiring portion 38, and a first wide portion 36a connected to the first zigzag portion 36b and formed wider than the first zigzag portion 36b.

As shown in FIG. 1, the first wide portion 36a is formed, for example, in a substantially rectangular shape that is elongated in the Y direction in a plan view.
Moreover, the first zigzag portion 36b extends in the X direction while zigzagging in the Y direction, for example.
The second antenna wiring portion 37 is formed, for example, in an inverted symmetrical shape with respect to the Y-axis with respect to the first antenna wiring portion 36. That is, the second antenna wiring portion 37 includes, for example, a second zigzag portion 37b connected to the component mounting wiring portion 38, and a second wide portion 37a connected to the second zigzag portion 37b and formed wider than the second zigzag portion 37b.

In addition, the component mounting wiring portion 38 includes, for example, a straight portion 38a connecting the first antenna wiring portion 36 and the second antenna wiring portion 37, a ring-shaped portion 38c on which the mounting terminal 45 is mounted, and a connecting portion 38b connecting the straight portion 38a and the ring-shaped portion 38c.
The straight portion 38a extends in the X direction, for example.
The connecting portion 38b extends in the Y direction from the center of the straight portion 38a in the X direction, and the tip of the connecting portion 38b is connected to the annular portion 38c. The connecting portion 38b is, for example, the only conductive path connecting the straight portion 38a and the annular portion 38c.
The annular portion 38c is formed, for example, in a substantially rectangular ring shape in a plan view. One of the four sides constituting the substantially rectangular ring-shaped annular portion 38c has a locally discontinuous portion, so that the annular portion 38c has a shape with an opening (an open ring shape).
On the side of the annular portion 38c on which the opening is formed, the portion on one side separated by the opening is the first conductive pattern 31, and the portion on the other side is the second conductive pattern 32. That is, the gap between one end 31a of the first conductive pattern 31 and one end 32a of the second conductive pattern 32 constitutes the opening of the annular portion 38c.

In this embodiment, the conductive pattern 30 includes a wide pattern 30a having a relatively wide width and a narrow pattern 30b having a relatively narrow width.
More specifically, for example, each of the first wide portion 36a and the second wide portion 37a of the antenna wiring portion 35 is the wide pattern 30a, and the remaining portion of the conductive pattern 30 is the narrow pattern 30b.
That is, the narrow pattern 30b includes a first zigzag portion 36b and a second zigzag portion 37b of the antenna wiring portion 35, and a straight portion 38a, a connecting portion 38b, and a ring-shaped portion 38c of the component mounting wiring portion 38.

Note that the shape of the conductive pattern 30 described here is just one example, and the conductive pattern 30 may be formed in other shapes.

The manufacturing method of the component mounting board 100 according to this embodiment will be described below with reference to Fig. 4(a) to Fig. 5(b). Each of Fig. 4(a) to Fig. 5(b) is a cross-sectional view taken at the same position as Fig. 3.
Of these, Fig. 4(a) shows a pattern-forming substrate 210 on which a conductive pattern 30 is formed. Fig. 4(b) shows a support layer 80 on which a release film 212 is laminated. Fig. 4(c) shows a process of peeling off the release film 212 from the support layer 80. Fig. 4(d) and Fig. 4(e) are explanatory diagrams of a process of transferring the conductive pattern 30 on the pattern-forming substrate 210 to the first base layer 10. Fig. 5(a) shows a process of thermocompression bonding the mounting terminal 45 of the mounting component 40 to the conductive pattern 30. Fig. 5(b) shows a process of thermocompression bonding (thermal lamination) the support layer 80 (first base layer 10) and the protective layer 90 (second base layer 20) to each other.

The manufacturing method for a component-mounted board according to the present embodiment (hereinafter, sometimes referred to as the present method) is a method for manufacturing a component-mounted board 100 comprising a first substrate layer 10 and a second substrate layer 20, each of which is easily decomposable, a conductive pattern 30 disposed between the first substrate layer 10 and the second substrate layer 20, and a mounting component 40 having a mounting terminal 45 electrically connected to the conductive pattern 30, and at least one of the first substrate layer 10 and the second substrate layer 20 being an adhesive layer constituted by an adhesive, and the method includes a step of thermocompression bonding the first substrate layer 10 and the second substrate layer 20 together (see FIG. 5( b )) with the mounting component 40 interposed between the first substrate layer 10 and the conductive pattern 30, and the second substrate layer 20, and the thermocompression bonding step brings the mounting component 40 into direct contact with the adhesive layer and brings the mounting terminal 45 into direct contact with the conductive pattern 30.
According to this method, since the mounting terminal 45 is directly contacted with the conductive pattern 30, it is possible to manufacture a component mounting board 100 having a structure capable of detecting a specific change in the environment more reliably than when the mounting terminal 45 is connected to the conductive pattern 30 by solder or the like. Furthermore, compared to when the mounting terminal 45 is connected to the conductive pattern 30 by solder or the like, it is possible to reduce the thermal load on the first base material layer 10 and the second base material layer 20 during the manufacture of the component mounting board 100. In addition, since the mounting components 40 can be fixed to the conductive pattern 30 and the first base material layer 10 or the second base material layer 20 by a simpler structure using an adhesive layer without using solder or the like, it is possible to improve the manufacturability of the component mounting board 100.

In this method, first, a pattern-forming substrate 210 (FIG. 4(a)) having a conductive pattern 30 formed on one side is prepared by printing the conductive pattern 30 on the pattern-forming substrate 210. The method for printing the conductive pattern 30 can be, for example, screen printing.

Meanwhile, a support layer 80 ( FIG. 4( b )) is prepared in which a release film 212 is laminated on one surface 10a of the first base layer 10. The release film 212 is easily peelable from the first base layer 10. Then, as shown in FIG. 4( c ), the release film 212 is peeled off from the first base layer 10 to expose one surface 10a of the first base layer 10. The release film 212 is similar to the retaining film 85 and the release film 95, but by setting the adhesion to the first base layer 10 to be lower than that of the retaining film 85 and the cover layer 70, it becomes possible to reliably peel off only the release film 212 without peeling off the retaining film 85.
Also, a protective layer 90 is prepared, which includes a release film (not shown) that is easily peelably laminated on one surface 20a of the second base layer 20. Then, the release film is peeled off from the second base layer 20 to expose one surface 20a of the second base layer 20. In this case, too, by setting the adhesion between the release film and the second base layer 20 to be lower than that between the release film 95 and the second base layer 20, it becomes possible to reliably peel off only the release film without peeling off the release film 95.

Next, as shown in FIG. 4(d), one surface 10a of the first base layer 10 and the surface of the pattern-forming substrate 210 on which the conductive pattern 30 is formed are opposed to each other, and the support layer 80 and the pattern-forming substrate 210 are laminated to each other, and the conductive pattern 30 is placed on one surface 10a of the first base layer 10. Then, the conductive pattern 30 on the pattern-forming substrate 210 is transferred onto the first base layer 10 by thermocompression bonding. The temperature condition of this transfer is, for example, preferably 80° C. or more and 150° C. or less, more preferably 100° C. or more and 130° C. or less. The heating time can be, for example, about 5 to 10 seconds.
4(e), the pattern-forming substrate 210 is peeled off from the support layer 80, whereby the conductive pattern 30 on the pattern-forming substrate 210 can be transferred onto one surface 10a of the first base layer 10. When the conductive pattern 30 is transferred onto the first base layer 10, typically, the upper surface of the conductive pattern 30 (the surface opposite to the first base layer 10 side) is smoother than the lower surface of the conductive pattern 30 (the surface on the first base layer 10 side).

5A, the mounting component 40 is placed on the conductive pattern 30. More specifically, the first mounting terminal 46 is placed on one end 31a of the first conductive pattern 31, and the second mounting terminal 47 is placed on one end 32a of the second conductive pattern 32.
At this time, it is preferable that the portion of the underside of the component body 41 where the mounting terminals 45 (the first mounting terminal 46 and the second mounting terminal 47) are not arranged is brought into contact with the adhesive layer (the first base material layer 10). This allows the mounting component 40 to be fixed (temporarily fixed) to the support layer 80 in a state prior to the step of thermocompression bonding the first base material layer 10 and the second base material layer 20 together.

Here, as shown in FIG. 5A, the present method preferably includes a step of locally applying heat and pressure to the portion of the conductive pattern 30 with which the mounting terminal 45 comes into contact.
In this manner, the mounting components 40 can be fused and fixed to the conductive pattern 30 at a stage before the thermocompression bonding process is performed. Also, before the component mounting board 100 comes into contact with liquid, it is possible to suppress misalignment of the mounting terminals 45 with respect to the conductive pattern 30, and improve the reliability of the electrical connection of the mounting terminals 45 with the conductive pattern 30. Furthermore, since the range of the cover layer 70 that is heated can be limited, it is possible to suppress the entire cover layer 70 from curving (curling) due to shrinkage caused by heating.
5A, the conductive pattern 30 is heated in a state where the mounting terminal 45 is in contact with the conductive pattern 30 while being pressed from above and below by the heating member 250 via the component body 41 and the support layer 80. In this state, for example, the upper heating member 250 is abutted against the upper surface of the component body 41, and the lower heating member 250 is abutted against the holding film 85. As more detailed processing conditions, for example, the heating member 250 is heated in a range of 80° C. to 135° C., the mounting component 40 is pressed in a height range of 50 μm to 100 μm from the height at which the mounting component 40 is placed on the conductive pattern 30 in an unpressurized state, and the mounting component 40 is heated and pressurized to apply a load of 250 g to 400 g to the mounting component 40, so that the conductive pattern 30 and the mounting component 40 are in an ideal close contact (fusion-fixed) state.
Furthermore, since a retaining film 85 is interposed between the cover layer 70 and the heating member 250, the heat from the heating member 250 is not directly transferred to the cover layer 70, so that curvature of the cover layer 70 can be further suppressed, and evaporation of moisture from the adhesive layer (first base material layer 10) and the cover layer 70 can be suppressed, thereby fully maintaining their water solubility.
Here, an example has been described in which the process of locally heating and pressurizing the conductive pattern 30 is performed after the mounting terminal 45 is brought into contact with the conductive pattern 30. However, the mounting terminal 45 may be brought into contact with the conductive pattern 30 after the process of locally heating and pressurizing the conductive pattern 30, or the mounting terminal 45 may be brought into contact with the conductive pattern while the process of locally heating and pressurizing is being performed.

The step of locally heating and pressurizing the conductive pattern 30 is preferably carried out at a temperature equal to or lower than that of the thermocompression bonding step.
In this manner, it is possible to manufacture the component mounting board 100 while suppressing thermal damage to the adhesive layer (first base layer 10) and the cover layer 70. In addition, it is possible to suppress the cover layer 70 from shrinking due to heat.
In this embodiment, the mounting terminal 45 can be fused to the conductive pattern 30 while suppressing evaporation of moisture from each of the adhesive layer (first substrate layer 10) and the cover layer 70 and fully maintaining their water solubility.
The conductive pattern 30 preferably exhibits hot melt properties at a temperature of 50° C. or higher. By using such a conductive pattern 30, the process of locally heating and pressurizing the conductive pattern 30 and fusing the mounting terminals 45 to the conductive pattern 30 can be performed at a lower temperature than the thermocompression bonding process.
As an example, the step of locally heating and pressurizing the conductive pattern 30 is preferably carried out at a temperature of 50° C. or higher and 150° C. or lower, and more preferably at a temperature of 80° C. or higher and 135° C. or lower.

Next, as shown in FIG. 5( b ), one surface 20 a of the second base material layer 20 and one surface 10 a of the first base material layer 10 are opposed to each other, and the protective layer 90 is laminated on the support layer 80 .
Then, in this state, the support layer 80 and the protective layer 90 are thermocompression bonded to each other. That is, the first base material layer 10 and the second base material layer 20 are thermocompression bonded (thermally laminated) to each other. As a result, the second base material layer 20 encloses the component body 41 and is in contact with substantially the entire side peripheral surface of the component body 41.
As an example, the step of thermocompression bonding the first base layer 10 and the second base layer 20 to each other is preferably performed at 80° C. or more and 150° C. or less, more preferably 100° C. or more and 120° C. or less. The heating time can be, for example, about 5 to 10 seconds. The thermocompression bonding step is preferably performed under a pressure condition of 0.3 MPa or more and 3.0 MPa or less, and more preferably under a pressure condition of 1.0 MPa or more and 2.0 MPa or less.
In this manner, the component mounting board 100 according to the present embodiment is obtained.

Thus, the method includes, for example, a step of printing and forming a conductive pattern 30 on a pattern-forming substrate 210 (see FIG. 4(a)), a step of preparing a support substrate (holding film 85) supporting the first substrate layer 10 on one side (see FIGS. 4(b) and 4(c)), and a step of transferring the conductive pattern 30 from the pattern-forming substrate 210 to the first substrate layer 10 on the holding film 85 (see FIGS. 4(d) and 4(e)), and after the transfer step, a thermocompression bonding step is performed.
This prevents the heat applied to the first base layer 10, the second base layer 20, and the cover layer 70 during the formation of the conductive pattern 30, and therefore allows the component mounting board 100 to be manufactured while suppressing damage to the first base layer 10, the second base layer 20, and the cover layer 70. Also, the support layer 80 and the protective layer 90 can be prevented from shrinking due to heat. In the case of this embodiment, the component mounting board 100 can be manufactured while maintaining good water solubility of the first base layer 10, the second base layer 20, and the cover layer 70.

Here, the process of printing and forming the conductive pattern 30 includes a heat treatment process (drying process) performed on the conductive pattern 30 after printing the conductive pattern 30. After printing and before the heat treatment process, the conductive pattern 30 is in a paste state, and is heated in the heat treatment process to become a dried state.
By transferring the conductive pattern 30 as described above, it is possible to prevent heat from being applied to the first base material layer 10, the second base material layer 20, and the cover layer 70 during the drying process of the conductive pattern 30.

Furthermore, the thermocompression bonding is preferably performed at a temperature equal to or lower than the heat treatment step performed on the conductive pattern 30 after printing the conductive pattern 30 .
By doing so, it is possible to manufacture the component mounting board 100 while further suppressing damage to the first base material layer 10, the second base material layer 20, and the cover layer 70.
In addition, the heating time in the thermocompression bonding step is preferably shorter than the heating time in the heat treatment step after printing, for example. In this way, damage to the first base material layer 10, the second base material layer 20, and the cover layer 70 can be further suppressed.
The heating in the heat treatment step can be carried out, for example, at a temperature of preferably 70° C. or higher and 130° C. or lower, more preferably 80° C. or higher and 120° C. or lower, for about 30 minutes.

Furthermore, at least at a stage before the thermocompression bonding process is performed, it is preferable that the distance L1 (FIG. 2) between the first conductive pattern 31 and the second conductive pattern 32 is longer than the distance L2 (FIG. 2) between the first mounting terminal 46 and the second mounting terminal 47.
By doing this, even if the mounting terminals 45 (the first mounting terminal 46 and the second mounting terminal 47) are misaligned with the first conductive pattern 31 and the second conductive pattern 32 when the mounting component 40 is placed on the conductive pattern 30, the first mounting terminal 46 can be placed on one end 31 a of the first conductive pattern 31, and the second mounting terminal 47 can be placed on one end 32 a of the second conductive pattern 32.
Furthermore, even if the one end 31 a of the first conductive pattern 31 and the one end 32 a of the second conductive pattern 32 are softened and made prone to shape changes by the process of locally heating and pressurizing the portion of the conductive pattern 30 with which the mounting terminal 45 comes into contact, or the process of thermocompression bonding, it is possible to prevent the one end 31 a of the first conductive pattern 31 and the one end 32 a of the second conductive pattern 32 from coming into contact with each other (being connected to each other).

As an example, the component mounting board 100 according to the present embodiment is attached to an absorbent article (for example, a paper diaper 300 shown in Figs. 6 and 7) that is configured to be able to absorb liquid. Note that Fig. 6 shows the surface of the paper diaper 300 that comes into contact with the wearer's skin. Also, the upper side (upper side) in Fig. 7 is the side that comes into contact with the wearer's skin, and the lower side (lower side) is the side that is farther from the wearer's skin.
When the wearer urinates into the disposable diaper 300 and the second base material layer 20, the cover layer 70, and the first base material layer 10 are decomposed (dissolved) by the urine, the mounting terminals 45 of the mounted components 40 and the conductive patterns 30 become separated from each other due to the application of a slight external force, etc. When the mounting terminals 45 and the conductive patterns 30 become separated from each other, the communication function of the component mounting board 100 is impaired, and therefore, by detecting the loss of the communication function, it is possible to detect the wearer's urination.

6, the paper diaper 300 includes a rear portion 310 arranged on the back side of the wearer, a front portion 320 arranged on the stomach side of the wearer, a connecting portion 330 connecting the rear portion 310 and the front portion 320, and a plurality of hook-and-loop fastener portions 340 formed on the sides of the rear portion 310. By connecting both side portions of the rear portion 310 and the front portion 320 via the hook-and-loop fastener portions 340, the paper diaper 300 can be put on a wearer.
As shown in FIG. 6, the paper diaper 300 has an absorbent body 350 formed on the surface that comes into contact with the wearer's skin and that is capable of absorbing liquid.
The absorber 350 extends in the front-rear direction across, for example, the rear portion 310 , the front portion 320 , and the connecting portion 330 .
When the paper diaper 300 is worn by a wearer, the absorbent body 350 is positioned in contact with the wearer's excretory area, and when the wearer urinates, the urine is absorbed by the absorbent body 350.
Here, the component mounting board 100 is preferably disposed, for example, on the surface of the absorber 350 that comes into contact with the wearer's skin.
7, the component mounting board 100 is attached to the absorbent body 350 via the water-insoluble adhesive layer 360, with the support layer 80 of the support layer 80 and the protective layer 90 facing the skin. However, the component mounting board 100 may be attached in the opposite direction to this example.
For example, before the component mounting board 100 is attached to the absorber 350, the holding film 85 and the release film 95 are peeled and removed from the cover layer 70 and the second base layer 20, respectively.
In addition, the surface of the component mounting board 100 that is to be contacted with the skin is preferably covered with, for example, a sheet-like absorbent base material 350a. The absorbent base material 350a is made of, for example, a nonwoven fabric having high water absorbency.
As a result, the absorbent base material 350a absorbs the urine of the wearer, and the urine can be brought into good contact with the component mounting board 100. In addition, because the adhesive layer 360 is made of a water-insoluble adhesive, it is possible to prevent the component mounting board 100 from peeling off from the absorbent body 350 of the disposable diaper 300 when the wearer urinates.
Here, an opening 360a penetrating in the vertical direction is preferably formed in the center of the adhesive layer 360. Moreover, in plan view, the mounting component 40 is preferably disposed at a position corresponding to the opening 360a, and in plan view, the mounting component 40 is more preferably contained within the opening 360a.
By doing this, when the wearer urinates, urine can be more reliably distributed to the areas surrounding the mounted components 40 on the component mounting board 100, so that the first base material layer 10, the second base material layer 20 and the cover layer 70 (particularly the second base material layer 20 located on the side opposite the skin) around the mounted components 40 can be more reliably decomposed (dissolved).
Also, for example, a water-absorbing sponge (not shown) may be disposed between the absorbent base material 350 a and the second base material layer 20 .
The absorbent article on which the component mounting board 100 is attached is not limited to the disposable diaper 300, but may be, for example, a urine pad (not shown) attached to underwear.

<Modification of the First Embodiment>
Next, a modification of the first embodiment will be described with reference to FIG. 8 to FIG.
The component mounting board 100 according to this modification is different from the component mounting board 100 according to the first embodiment in the points described below, and is otherwise configured similarly to the component mounting board 100 according to the first embodiment. Each of Fig. 8 to Fig. 10(c) is a cross-sectional view at the same position as Fig. 3. Fig. 9(a) shows a process of peeling the release film 212 from the support layer 80. Fig. 9(b) shows a process of peeling the support base material 214 from the protective layer 90. Fig. 10(a) shows a process of printing and forming the conductive pattern 30 on the first base material layer 10, which is a non-adhesive layer. Fig. 10(b) shows a process of temporarily fixing the mounting component 40 to the second base material layer 20, which is an adhesive layer. Fig. 10(c) shows a process of thermocompression bonding the support layer 80 (first base material layer 10) and the protective layer 90 (second base material layer 20) to each other.

In this modified example, the first base layer 10 is a non-adhesive layer, and the second base layer 20 is an adhesive layer. That is, the first base layer 10 is made of the same material as the second base layer 20 in the above-described first embodiment, and the second base layer 20 is made of the same material as the first base layer 10 in the above-described first embodiment.
8, in this modified example, the support layer 80 is composed of a retaining film 85 and a first base material layer 10, and does not include a cover layer 70. That is, the first base material layer 10 is laminated on the retaining film 85.
Moreover, the protective layer 90 includes a cover layer 70 interposed between the second base material layer 20 and a release film 95. That is, the protective layer 90 includes the cover layer 70 laminated on the second base material layer 20, which is an adhesive layer.
Therefore, the component mounting board 100 has a structure in which the support film 85, the first base material layer 10, the second base material layer 20, the cover layer 70, and the release film 95 are laminated in this order from the bottom.
In this modified example, the component mounting board 100 also has a cover layer 70 laminated to the adhesive layer (second base layer 20) on the side opposite the non-adhesive layer (first base layer 10), and the cover layer 70 is easily decomposable.
Also, similarly to the first embodiment, the conductive pattern 30 and the mounted components 40 are disposed between one surface 10 a of the first base layer 10 and one surface 20 a of the second base layer 20 .

In the present modified example, the second base layer 20 also contains the component body 41 and is in contact with the upper surface of the component body 41. Note that a portion of the second base layer 20 may be inserted between the lower surface of the component body 41 and the upper surface of the first base layer 10, or between the lower surface of the mounting terminal 45 and the upper surface of the first base layer 10, thereby bonding the component body 41 and the first base layer 10 to each other, or bonding the mounting terminal 45 and the first base layer 10 to each other.
In the present modified example, for example, the conductive pattern 30 is recessed into the second base layer 20 , and the lower surface of the conductive pattern 30 is exposed from one surface 20 a of the second base layer 20 .
In this modified example, the first base layer 10 is directly laminated on the holding film 85, the cover layer 70 is directly laminated on the second base layer 20, and the release film 95 is directly laminated on the cover layer 70. Note that the present invention is not limited to this example, and another layer (preferably an easily decomposable layer) may be interposed between the holding film 85 and the first base layer 10. Similarly, another layer (preferably an easily decomposable layer) may be interposed between the second base layer 20 and the cover layer 70. Another layer (preferably an easily decomposable layer) may be interposed between the cover layer 70 and the release film 95.

Even with this configuration, when the first substrate layer 10, the second substrate layer 20, and the cover layer 70 decompose due to a change in the environment, the mounting terminals 45 and the conductive pattern 30 can be easily separated. This makes it possible to more reliably detect changes in the environment in which the component mounting board 100 is placed, compared to a structure in which the mounting terminals 45 are connected to the conductive pattern 30 by solder, conductive adhesive, or the like.

Hereinafter, the manufacturing method of the component mounting board 100 according to this modified example will be described with reference to Fig. 9(a) to Fig. 10(c). Note that in Fig. 9(b) and Fig. 10(b), the protective layer 90 is illustrated in a state in which one surface 20a of the second base layer 20 faces upward.
First, a support layer 80 is prepared, which includes a release film 212 (FIG. 9(a)) that is easily peelably laminated on one surface 10a of the first base layer 10.
Similarly, a protective layer 90 is prepared, which includes a support substrate 214 (FIG. 9(b)) that is laminated so as to be easily peelable from one surface 20a of the second substrate layer 20.
9B, the supporting substrate 214 is peeled off from the second substrate layer 20 to expose one surface 20a of the second substrate layer 20. The supporting substrate 214 is similar to the holding film 85 and the release film 95.
9(a), the release film 212 is peeled off from the first base material layer 10 to expose one surface 10a of the first base material layer 10. The release film 212 is similar to the holding film 85 and the release film 95.
10B, the mounting components 40 are placed on one surface 20a of the second base layer 20. In this state, the surface of the component body 41 opposite to the side on which the mounting terminals 45 are placed is in contact with the one surface 20a. This allows the mounting components 40 to be fixed (temporarily fixed) to the protective layer 90 before the step of thermocompression bonding the first base layer 10 and the second base layer 20 together.
Next, as shown in FIG. 10( a ), the release film 212 is peeled off from one surface 10 a of the first base layer 10 , and the conductive pattern 30 is formed on the one surface 10 a .
The method for forming the conductive pattern 30 on the one surface 10a is not particularly limited, and as in the first embodiment, the conductive pattern 30 may be printed on a pattern-forming substrate and then transferred from the pattern-forming substrate to the first substrate layer 10, or the conductive pattern 30 may be printed on the first substrate layer 10.
Next, as shown in Fig. 10(c), one surface 20a of the second base layer 20 and one surface 10a of the first base layer 10 are opposed to each other, and the protective layer 90 is laminated on the support layer 80. At this time, the mounting component 40 is placed on the conductive pattern 30 so that the first mounting terminal 46 is placed on one end 31a of the first conductive pattern 31 and the second mounting terminal 47 is placed on one end 32a of the second conductive pattern 32. Here, as described above, the mounting component 40 is temporarily fixed to the protective layer 90. Therefore, the protective layer 90 has good handleability, and the mounting component 40 can be easily aligned with the conductive pattern 30.
In this state, the support layer 80 and the protective layer 90 are thermocompression bonded to each other, as in the first embodiment. That is, the first base material layer 10 and the second base material layer 20 are thermocompression bonded to each other. As a result, the second base material layer 20 contains the component body 41 and is in contact with the upper surface of the component body 41. Furthermore, it is also preferable that a part of the second base material layer 20 enters between the lower surface of the component body 41 and the upper surface of the first base material layer 10, or between the lower surface of the mounting terminal 45 and the upper surface of the first base material layer 10, to bond the component body 41 and the first base material layer 10 to each other, or to bond the mounting terminal 45 and the first base material layer 10 to each other.
In this manner, component mounting board 100 according to this modified example is obtained.

Second Embodiment
Next, a second embodiment will be described with reference to Figures 11(a) and 11(b), in which the laminated portion 60 is omitted.
The component mounting board 100 of the second embodiment differs from the component mounting board 100 of the first embodiment described above in the respects described below, but in other respects is configured similarly to the component mounting board 100 of the first embodiment described above.

The component mounting board 100 according to this embodiment comprises a first substrate layer 10 and a second substrate layer 20, each of which is easily disassembled, a conductive pattern 30 disposed between the first substrate layer 10 and the second substrate layer 20, and a mounting component 40 interposed between the first substrate layer 10 and the conductive pattern 30 and the second substrate layer 20, wherein the mounting component 40 has a mounting terminal 45 electrically connected to the conductive pattern 30, and the conductive pattern 30 has a narrow portion 39 formed to be narrower than the width dimension (dimension W1 shown in FIG. 11( b ): hereinafter simply referred to as width dimension W1) of the mounting terminal 45.
When the planar shape of the mounting terminal 45 is rectangular, the width dimension W1 of the mounting terminal 45 is, for example, the dimension of the long side of the mounting component 40. Therefore, in the present embodiment, the width dimension W1 of the mounting terminal 45 is the dimension in the Y direction. When the planar shape of the mounting component 40 is circular, the width dimension W1 of the mounting terminal 45 is the diameter of the mounting component 40.

According to this embodiment, the conductive pattern 30 has a narrow portion 39 formed to be narrower than the width dimension W1 of the mounting terminal 45. That is, the conductive pattern 30 has a structure having a portion with locally weak structural strength. Therefore, when a slight external force is applied to the conductive pattern 30 in a state in which the first base layer 10 and the second base layer 20 are decomposed due to a specific change in the environment, the conductive pattern 30 can be easily broken at the narrow portion 39 or a crack can be generated in the narrow portion 39. Then, by detecting the occurrence of the break or crack, a change in the environment can be detected.
Therefore, it becomes possible to more reliably detect changes in the environment in which the component mounting board 100 is placed.

In this embodiment, as described above, the mounted component 40 transmits and receives signals to and from an external device via the conductive pattern 30. Therefore, if the conductive pattern 30 breaks, communication between the mounted component 40 and the external device is cut off. Alternatively, if a crack occurs in the conductive pattern 30, the resistance in the conductive pattern 30 increases, and it is expected that communication between the mounted component 40 and the external device will be cut off. Then, the external device can detect the above-mentioned change in the environment by detecting the cutoff of communication with the component mounting board 100 (mounted component 40).

Furthermore, in the case of this embodiment, in addition to the structure in which the conductive pattern 30 is easily broken at the narrow width portion 39 when the above-mentioned environmental change occurs, the structure also includes the structure in which the mounting terminal 45 and the conductive pattern 30 can be easily separated as described in the first embodiment. Therefore, the above-mentioned environmental change can be detected more reliably.

The component mounting board 100 according to the second embodiment is not limited to a structure based on the configuration described in the first embodiment, and may be a structure that does not based on the configuration described in the first embodiment.
That is, in this embodiment, the mounting terminals 45 and the conductive patterns 30 may be electrically and mechanically connected to each other by, for example, solder or a conductive adhesive.

As described above, the conductive pattern 30 has the antenna wiring portion 35 and the component mounting wiring portion 38 , but in the case of this embodiment, the component mounting wiring portion 38 has the narrow portion 39 .
More specifically, in this embodiment, as shown in FIG. 11B, a narrow width portion 39 is formed in a connecting portion 38b that connects the straight portion 38a and the annular portion 38c.
The connecting portion 38b is the only conductive path connecting both the first antenna wiring portion 36 and the second antenna wiring portion 37 to the annular portion 38c on which the mounted component 40 is mounted. Therefore, when liquid comes into contact with the component mounting board 100, the conductive pattern 30 breaks at the narrow portion 39 (connecting portion 38b) or a crack occurs in the narrow portion 39, so that the communication function of the mounted component 40 via the antenna wiring portion 35 can be more reliably lost.

The connecting portion 38b is formed with, for example, a pair of cutout portions 39a. In the connecting portion 38b, a portion that is narrower in width than a portion adjacent to the pair of cutout portions 39a due to the pair of cutout portions 39a constitutes a narrow width portion 39. The pair of cutout portions 39a are formed, for example, in an inverted symmetrical shape with respect to an axis in the Y direction.
More specifically, each of the pair of cutout shapes 39a is formed, for example, in an approximately semicircular shape when viewed in a plane, and one of the pair of cutout shapes 39a is formed in a shape that is open toward one side in the X direction, and the other cutout shape 39a is formed in a shape that is open toward the other side in the X direction.

The minimum value of the width dimension of the narrow portion 39 (dimension W2 shown in FIG. 11B: hereinafter simply width dimension W2) is, for example, preferably 0.1 mm or more and 0.30 mm or less, and more preferably 0.15 mm or more and 0.25 mm or less.
By setting the width dimension W2 of the narrow portion 39 to 0.15 mm or more, the signal transmission of the conductive pattern 30 to the mounted component 40 becomes good.
By setting the width dimension W2 of the narrow portion 39 to 0.25 mm or less, the conductive pattern 30 can be favorably broken at the narrow portion 39 (connecting portion 38b), and stable quality (particularly the width dimension) can be obtained in the pattern printing formation during production.

In addition, in this embodiment, the dimension of narrow portion 39 in the extension direction of conductive pattern 30 at the location where narrow portion 39 is formed (dimension L4 shown in FIG. 11(b)) is smaller than the length dimension of mounted component 40 (dimension L3 shown in FIG. 11(b)).
This makes it possible to limit the range in which the electrical resistance value of the conductive pattern 30 becomes large, so that the desired electrical characteristics of the component mounting board 100 can be easily achieved.
In this embodiment, the dimension L4 is equal to or smaller than the width of the conductive pattern 30 at a portion adjacent to the narrow portion 39 (the dimension W3 shown in FIG. 11B: hereinafter simply referred to as the width W3).
This also makes it possible to limit the range in which the electrical resistance value of the conductive pattern 30 becomes large, and makes it possible to easily achieve the desired electrical characteristics of the component mounting board 100 .
The width W3 is the width W3 of the connecting portion 38b at the boundary between the non-formed region of the cutout portion 39a and the cutout portion 39a.
Furthermore, it is preferable that the dimension L 4 be smaller than the width dimension W 1 of the mounting terminal 45 .
This also makes it possible to limit the range in which the electrical resistance value of the conductive pattern 30 becomes large, so that the desired electrical characteristics of the component mounting board 100 can be easily achieved.
Furthermore, the minimum value of the width dimension of the narrow portion 39 (width dimension W2) is, for example, preferably equal to or less than half the width dimension W3, and also preferably equal to or less than ⅓ of the width dimension W3.
The width dimension W2 is preferably equal to or smaller than the distance L2 between the first mounting terminal 46 and the second mounting terminal 47, for example.
In addition, it is preferable that the width dimension (dimension W4 shown in FIG. 11(b): hereinafter simply referred to as width dimension W4) of the portion of the conductive pattern 30 on which the mounting component 40 is mounted (in this embodiment, the annular portion 38c) is larger than, for example, the width dimension W1 of the mounting terminal 45.

Note that the narrow width portion 39 may be formed in at least one location in the conductive pattern 30. In other words, the number of narrow width portions 39 that the conductive pattern 30 has may be one or more.

<Modification 1 of the second embodiment>
Next, a modified example of the second embodiment will be described with reference to Fig. 12(a). Fig. 12(a) shows the same range as Fig. 11(b), and the laminated portion 60 is omitted in Fig. 12(a).
The component mounting board 100 of this modified example differs from the component mounting board 100 of the second embodiment in the respects described below, but in other respects is configured similarly to the component mounting board 100 of the second embodiment.

In the above second embodiment, an example was described in which one narrow width portion 39 is formed by a pair of cutout shapes 39a. In this modified example, an example is described in which one narrow width portion 39 is formed by a single cutout shape portion 39a.
In the present modified example, as shown in FIG. 12A, a narrow width portion 39 is formed by forming one notch 39a in the annular portion 38c.
The planar shape of the notch 39a is, for example, a V-shape (wedge shape).
In this modified example, the width dimension W2 of the narrow portion 39 is preferably equal to or less than half the width dimension W3 of the portion of the conductive pattern 30 adjacent to the narrow portion 39. It is also preferably equal to or less than ⅓ of the width dimension W3 of the portion of the conductive pattern 30 adjacent to the narrow portion 39.
Also in the case of this modification, similarly to the second embodiment, the narrow width portion 39 may be formed by a pair of cutout portions 39a. That is, the narrow width portion 39 may be formed by a pair of V-shaped cutout portions 39a.
Also in this modified example, the narrow portion 39 may be formed in the connecting portion 38b.

<Modification 2 of the Second Embodiment>
Next, a modified example of the second embodiment will be described with reference to Fig. 12(b) . Note that Fig. 12(b) shows the same range as Fig. 11(b), and in Fig. 12(b) , the laminated portion 60 is omitted.
The component mounting board 100 according to this modified example differs from the component mounting board 100 according to modified example 1 shown in FIG. 12( a) in the respects described below, but is otherwise configured similarly to the component mounting board 100 according to modified example 1.
In this modified example, the planar shape of the cutout portion 39a is formed into a substantially rectangular shape.
In the present modified example, similarly to the second embodiment, the narrow width portion 39 may be formed by a pair of cutout portions 39a. That is, the narrow width portion 39 may be formed by a pair of cutout portions 39a each having a substantially rectangular shape.
Also in this modified example, the narrow portion 39 may be formed in the connecting portion 38b.

Third Embodiment
Next, a third embodiment will be described with reference to Fig. 13(a) to Fig. 16(d). Note that in Fig. 13(b), the laminated portion 60 is omitted.
The component mounting board 100 according to the third embodiment differs from the component mounting board 100 according to the first and second embodiments and their modified examples in the respects described below, but in other respects is configured similarly to the component mounting board 100 according to the first or second embodiment or their modified examples.

The component mounting board 100 according to this embodiment includes a first substrate layer 10 and a second substrate layer 20, each of which is easily decomposable, a conductive pattern 30 disposed between the first substrate layer 10 and the second substrate layer 20, and a mounting component 40 interposed between the first substrate layer 10 and the conductive pattern 30 and the second substrate layer 20. The mounting component 40 has a mounting terminal 45 electrically connected to the conductive pattern 30, and the conductive pattern 30 is a coating film containing a conductive filler and a binder containing a thermoplastic resin. The conductive pattern 30 includes a relatively wide pattern 30a and a relatively narrow pattern 30b. The wide pattern 30a has thick film portions 33 at both ends in the width direction and a thin film portion 34 in the center in the width direction that is thinner than the thick film portion 33. The narrow pattern 30b has a portion in the center in the width direction where the film thickness is maximum.

According to this embodiment, in the conductive pattern 30, the relatively wide pattern 30a has thick film portions 33 at both ends in the width direction, and has a thin film portion 34 in the center in the width direction that is thinner than the thick film portion 33, and the relatively narrow pattern 30b has a portion with a maximum film thickness in the center in the width direction (hereinafter, may be referred to as a maximum film thickness portion 30c). As a result, the wide pattern 30a has a structure in which the structural strength is locally weakened in the center in the width direction.
Therefore, when the first base layer 10 and the second base layer 20 are decomposed due to a change in the environment, the wide pattern 30a can be easily broken or cracked by application of a slight external force. Therefore, by detecting the occurrence of breaks or cracks in the conductive pattern 30, the change in the environment can be detected.
In addition, the end portion of the wide pattern 30 a and the narrow pattern 30 b can have sufficient structural strength, so that the occurrence of breaks or cracks in the conductive pattern 30 can be suppressed before the occurrence of the above-mentioned environmental changes.

In this embodiment, as described above, the mounted component 40 transmits and receives signals to and from an external device via the conductive pattern 30. Therefore, if the wide pattern 30a breaks, communication between the mounted component 40 and the external device is cut off, or communication function is reduced. Alternatively, if a crack occurs in the wide pattern 30a, the resistance in the conductive pattern 30 increases, and it is expected that communication between the mounted component 40 and the external device will be cut off. Then, the external device can detect the above-mentioned change in the environment by detecting the cutoff of communication with the component mounting board 100 (mounted component 40).

Furthermore, in the case of this embodiment, in addition to the structure in which breakage or cracking easily occurs in the wide pattern 30a when the above-mentioned environmental change occurs, the structure also includes the structure in which the mounting terminal 45 and the conductive pattern 30 can be easily separated as described in the first embodiment. Therefore, the above-mentioned environmental change can be more reliably detected.
In this embodiment, it is also preferable that the conductive pattern 30 has a narrow portion 39 as described in the second embodiment, in which case the above-mentioned environmental change can be detected more reliably.

Note that the component mounting board 100 according to the third embodiment is not limited to a structure premised on the configuration described in the first or second embodiment, and may be a structure that does not premise on the configuration described in the first or second embodiment.
That is, in the case of this embodiment, the mounting terminal 45 and the conductive pattern 30 may be electrically and mechanically connected to each other by, for example, solder or a conductive adhesive. Also, in the case of this embodiment, the conductive pattern 30 does not need to have the narrow portion 39.

The width dimension of the wide pattern 30a is, for example, 2 mm or more, and the width dimension of the narrow pattern 30b is, for example, less than 2 mm. The thick film portion 33 is, for example, present within a range of 1 mm from the end portion in the width direction of the wide pattern 30a. If the minimum value of the film thickness of the thin film portion 34 is T1 (see FIG. 14(a)), the maximum value of the film thickness of the thick film portion 33 is T2 (see FIG. 14(a)), and the maximum value of the film thickness of the narrow pattern 30b (the maximum value of the maximum film thickness portion 30c) is T3 (see FIG. 14(b)), then T2>1.5×T1 and T3>1.5×T1 are satisfied.
This allows a locally weak portion of the structural strength to be formed in the center of the wide pattern 30a in the width direction, and the structural strength can be further improved in the end of the wide pattern 30a in the width direction and in each of the narrow patterns 30b. Therefore, before the above-mentioned environmental change occurs, it is possible to more reliably suppress the occurrence of breakage or cracks in the wide pattern 30a, and after the environmental change occurs, it is possible to more reliably cause breakage or cracks in the wide pattern 30a by applying a slight external force to the component mounting board 100. In addition, as in the component mounting board 100 according to the first embodiment (FIGS. 4(a) to 4(e)), when the conductive pattern 30 formed on the pattern-forming base material 210 is transferred to the first base material layer 10, the thick film portion 33 is formed around the wide pattern 30a, so that the conductive pattern can be prevented from being unintentionally broken, improving manufacturing stability.
The minimum film thickness T 1 of the thin film portion 34 is the minimum film thickness in the portion sandwiched between the thick film portions 33 .

In the case of this embodiment, for example, the antenna wiring section 35 includes a wide pattern 30a and a narrow pattern 30b, and the component mounting wiring section 38 is the narrow pattern 30b.
In the antenna wiring portion 35, the wide pattern 30a extends in a direction intersecting the extension direction (direction E shown in Figure 13 (b)) of the narrow pattern 30b near the boundary between the wide pattern 30a and the narrow pattern 30b, and the wide pattern 30a has a thick film portion 33 along the boundary between the wide pattern 30a and the narrow pattern 30b.
As a result, the antenna wiring portion 35 has a structure having a thick film portion 33 with a relatively large film thickness at the boundary between the wide pattern 30a and the narrow pattern 30b, and the structural strength of the boundary portion can be improved.

13A, in the present embodiment, the first wide portion 36a is the wide pattern 30a, and the first zigzag portion 36b is the narrow pattern 30b in the first antenna wiring portion 36. In the first antenna wiring portion 36, the wide pattern 30a (first wide portion 36a) extends in the Y direction, and the narrow pattern 30b (first zigzag portion 36b) extends in the X direction while zigzagging in the Y direction.
As shown in FIG. 13A, one end of the narrow pattern 30b (first zigzag portion 36b) is connected to the side of the first wide portion 36a on the first zigzag portion 36b side.
In the present embodiment, the thick film portion 33 is formed, for example, in a circumferential shape along the periphery of the first wide portion 36a. Note that in Fig. 13B, the area where the thick film portion 33 is formed is shaded with dots.
Similarly, in the second antenna wiring part 37, the second wide portion 37a is the wide pattern 30a, and the second zigzag portion 37b is the narrow pattern 30b. In the second antenna wiring part 37, the wide pattern 30a (second wide portion 37a) extends in the Y direction, and the narrow pattern 30b (second zigzag portion 37b) extends in the X direction while zigzagging in the Y direction.
One end of the narrow pattern 30b (second zigzag portion 37b) is connected to the side of the second wide portion 37a on the second zigzag portion 37b side. The thick film portion 33 is formed, for example, in a circumferential shape along the periphery of the second wide portion 37a.

In this embodiment, the portion of the narrow pattern 30b where the mounting terminal 45 is located is, for example, crushed by the mounting terminal 45 and is essentially flat, but in other portions, the film thickness in the center in the width direction is at its maximum.
The narrow pattern 30b may include a plurality of portions having different widths, each of which preferably has a maximum thickness portion 30c at the center in the width direction, and each of the maximum thickness portions 30c preferably has the same thickness (maximum value T3).
Here, the thickness dimensions of the maximum thickness parts 30c being equal to each other means that the difference between the dimensions is within ±25%, and more preferably within ±20%.
In the present embodiment, as an example, in the component mounting wiring portion 38 (narrow pattern 30b), the width dimension of the straight portion 38a is set to be smaller than the width dimension of the annular portion 38c and the width dimension of the connecting portion 38b. However, the width dimension of the straight portion 38a may be equal to the width dimension of the annular portion 38c and the width dimension of the connecting portion 38b.

In this embodiment, as shown in FIG. 14( a), it is preferable that the inclination angle from the end of the wide-width pattern 30a in the width direction to the maximum thickness portion 33a in the thick film portion 33 is gentler than the inclination angle from the maximum thickness portion 33a to the minimum thickness portion 34a in the thin film portion 34.
In this way, the thick film portion 33 is closer to the end of the wide pattern 30a in the width direction, so that the width dimension of the thin film portion 34 of the wide pattern 30a can be sufficiently secured. Therefore, when a slight external force is applied, breakage or cracks can be more reliably generated in the wide pattern 30a.

Also in this embodiment, similarly to the second embodiment, the narrow pattern 30 b may have a narrow portion 39 formed to be narrower than the width dimension W 1 of the mounting terminal 45 .
In this way, a portion with locally weak structural strength can be formed in the narrow pattern 30b, so that when a slight external force is applied, at least one of the wide pattern 30a and the narrow pattern 30b is broken or cracked, so that the above-mentioned change in the environment can be detected more reliably.
In addition, when the narrow pattern 30b has a narrow portion 39, the film thickness of the narrow portion 39 is not necessarily uniform throughout, and typically becomes gradually smaller toward the portion of the narrow portion 39 with the smallest width dimension (the portion with width dimension = width dimension W2).

15(a) to 15(c), a method for manufacturing the component mounting board 100 according to the third embodiment will be described below. The method for manufacturing the component mounting board 100 according to the third embodiment differs from the method for manufacturing the component mounting board 100 according to the first embodiment in the points described below, but is similar to the method for manufacturing the component mounting board 100 according to the first embodiment in other points.
15(a) to 15(c) show the screen plate 430 and the pattern forming substrate 210 in cross-sectional views. More specifically, each of the wide pattern 30a and the narrow pattern 30b is shown in a schematic cross-sectional view along a direction perpendicular to the extension direction of each of them. Note that the positional relationship between the wide pattern 30a and the narrow pattern 30b in Fig. 15(a) to 15(c) does not necessarily coincide with the positional relationship between the wide pattern 30a and the narrow pattern 30b in Fig. 13(a).
In the following description, in Figs. 15(a) to 15(c), the upper side in each figure will be referred to as the upper side (upper side), and the lower side in each figure will be referred to as the lower side (lower side).

In the case of this embodiment, in the process of forming the conductive pattern 30, the conductive pattern 30 is formed to include a relatively wide pattern 30a and a relatively narrow pattern 30b, and the conductive pattern 30 is formed so that the wide pattern 30a has a smaller film thickness at the center in the width direction than at both ends in the width direction, and the narrow pattern 30b has a portion in the center in the width direction where the film thickness is maximum.
This makes it possible to form a relatively weak portion in the center of the wide pattern 30a in the width direction, and also improves the structural strength in each of the ends of the wide pattern 30a and the narrow pattern 30b.

More specifically, in the step of forming the conductive pattern 30, the conductive pattern 30 is formed by, for example, screen printing.
15(a) to 15(c), a screen plate 430 is prepared. Then, the pattern forming substrate 210 is placed below the screen plate 430.
The screen plate 430 includes, for example, a mesh 440 formed by intersecting warp and weft threads and weaving them in a flat shape, an emulsion layer 450 formed so as to cover the openings of the mesh 440, and openings 470 (areas where no emulsion layer is formed) formed by vertically penetrating the emulsion layer 450 and into which a conductive paste 460 is filled.
As shown in FIG. 15A, the upper surface of the emulsion layer 450 is approximately flush with the upper surface of the mesh 440, and the lower surface of the emulsion layer 450 is located lower than the lower surface of the mesh 440 (protruding from the lower surface of the mesh 440).
Here, in the emulsion layer 450 , the portion above the lower surface of the mesh 440 is designated as a first emulsion layer 451 , and the portion below the lower surface of the mesh 440 is designated as a second emulsion layer 452 .
The planar shape of the opening 470 is formed to be substantially the same as the planar shape of the conductive pattern 30, and the conductive pattern 30 is formed by printing a portion of the conductive paste 460 filled in the opening 470 onto the pattern forming substrate 210.

Next, as shown in FIG. 15( b ), a paste-like conductive paste 460 is supplied onto the screen plate 430, and the scraper 420 is moved along the upper surface of the screen plate 430 while the tip of the scraper 420 is in contact with the upper surface of the screen plate 430, thereby filling the inside of the opening 470 with the conductive paste 460.
Next, as shown in FIG. 15( c ), while the top surface of the screen plate 430 filled with the conductive paste 460 is pressed downward (towards the pattern forming substrate 210) with the tip of the squeegee 410, the squeegee 410 is moved along the top surface of the screen plate 430, thereby pushing out the conductive paste 460 filled in the openings 470 onto the pattern forming substrate 210, and the conductive pattern 30 can be printed on the pattern forming substrate 210.
More specifically, the squeegee 410 moves while bringing the lower surface of the pressing portion of the screen plate 430 into close contact with the upper surface of the pattern-forming substrate 210. Then, the lower surface of the portion of the screen plate 430 that the squeegee 410 has passed through is released from the pressure of the squeegee 410 and moves away from the upper surface of the pattern-forming substrate 210. At this time, a part of the conductive paste 460 that had been in close contact with the pattern-forming substrate 210 is peeled off from the screen plate 430 by the adhesion force with the pattern-forming substrate 210 and remains on the pattern-forming substrate 210. Meanwhile, as shown in FIG. 15C, the remaining part of the conductive paste 460 remains inside the opening 470 while adhering to the emulsion layer 450 and the mesh 440.

Here, the opening 470 includes a first opening 471 which is a portion where the wide pattern 30a of the conductive pattern 30 is formed, and a second opening 472 which is a portion where the narrow pattern 30b of the conductive pattern 30 is formed.
In this embodiment, it is preferable that the width dimension of first opening 471 (dimension W5 shown in FIGS. 15(a) to 15(c) or simply width dimension W5) is 2 mm or more. Also, it is preferable that the width dimension of second opening 472 (dimension W6 shown in FIGS. 15(a) to 15(c) or simply width dimension W6) is less than 2 mm.
By doing this, it is possible to preferably form a wide pattern 30a having thick film portions 33 at both ends in the width direction and a thin film portion 34 having a smaller thickness than the thick film portion 33 in the center in the width direction, and it is also possible to preferably form a narrow pattern 30b having a portion where the thickness is maximum in the center in the width direction.
More specifically, a portion of the conductive paste 460 filled in the opening 470 that is located near the emulsion layer 450 remains attached to the emulsion layer 450 as the screen plate 430 moves away from the pattern forming substrate 210.

Here, first, a printing operation in the case where the width dimension W5 of the first opening 471 is 2 mm or more will be described. In this case, when the conductive paste 460 is printed on the pattern forming base material 210, most of the conductive paste 460 filled in the first opening 471 located at the center in the width direction of the first opening 471 is scraped off (gouged out) by the squeegee 410 as it approaches the center of the first opening 471. This is because when the squeegee 410 moves on the screen plate 430 with a constant pressure, it causes the mesh 440 at the center of the first opening 471 to bend downward. On the other hand, in the vicinity of the emulsion layer 450 (the peripheral portion of the first opening 471), the amount of the conductive paste 460 scraped off by the squeegee 410 is less than that at the center of the first opening 471 due to the interference of the squeegee 410 with the emulsion layer 450. Therefore, in the conductive paste 460 filled in the first opening 471, the portion located near the emulsion layer 450 can be adhered to the pattern forming substrate 210 more than the portion located in the center of the first opening 471.
This allows the wide pattern 30a to be formed appropriately.

Next, a printing operation will be described when the width dimension W6 of the second opening 472 is less than 2 mm. In this case, since the interval of the emulsion layer 450 is narrow when the screen plate 430 is pressed by the squeegee 410, the penetration depth of the squeegee 410 into the second opening 472 can be kept shallow (the behavior of bending the mesh 440 downward is reduced), so that the amount of conductive paste 460 scraped off by the squeegee 410 at the center of the second opening 472 can be reduced. Therefore, the conductive paste 460 filled in the second opening 472 will be separated from the pattern forming substrate 210 together with the screen plate 430 in a state where the conductive paste 460 adheres to the emulsion layer 450 more in the portion located near the emulsion layer 450. In addition, the conductive paste 460 will adhere to the pattern forming substrate 210 more in the portion located at the center of the second opening 472.
This allows the narrow pattern 30b to be suitably formed.

Furthermore, in this embodiment, the thickness dimension of the mesh 440 (dimension T4 shown in Figs. 15(a) to 15(c)) is preferably 25 μm to 60 μm, and more preferably 25 μm to 30 μm. The thickness dimension of the second emulsion layer 452 (dimension T5 shown in Figs. 15(a) to 15(c)) is preferably 10 μm to 25 μm, and more preferably 15 μm to 20 μm.
In this manner, the thickness T1 of the thick film portion 33, the maximum thickness T2 of the thin film portion 34, and the maximum thickness T3 of the narrow pattern 30b can each be formed to a desired thickness.

Then, similarly to the method for manufacturing the component mounting board 100 according to the first embodiment described above, a heat treatment process (drying process) is performed on the conductive pattern 30 after printing the conductive pattern 30, and then the conductive pattern 30 is transferred from the pattern forming substrate 210 to the first substrate layer 10 on the supporting substrate 214.
In the present embodiment, the relatively wide pattern 30a in the conductive pattern 30 has thick film portions 33 at both ends in the width direction, and has a thin film portion 34 in the center in the width direction that is thinner than the thick film portion 33, while the relatively narrow pattern 30b has a portion in the center in the width direction where the film thickness is maximum. Therefore, sufficient structural strength can be ensured at each of the ends of the wide pattern 30a and the narrow pattern 30b.
This makes it possible to suppress breakage or the like of the wide pattern 30a when transferring the conductive pattern 30 from the pattern forming substrate 210 to the first base layer 10, compared to when the wide pattern 30a is made uniformly thin.

The thickness profile of the conductive pattern 30 (wide pattern 30a and narrow pattern 30b) before transfer is maintained even after transfer. The thickness profile here means the thickness profile between both ends of the conductive pattern 30 in the width direction (change in thickness according to position in the width direction), and does not necessarily mean that the cross-sectional shape of the conductive pattern 30 is the same before and after transfer.

Next, the second base material layer 20 of the protective layer 90 and the first base material layer 10 of the support layer 80, which have been separately prepared, are placed opposite each other, and the support layer 80 and the protective layer 90 are thermocompression-bonded to each other. That is, the first base material layer 10 and the second base material layer 20 are thermocompression-bonded to each other.
In this manner, the component mounting board 100 according to the present embodiment is obtained.

In this manner, the present method is a method for manufacturing a component mounting board 100 comprising, for example, a first substrate layer 10 and a second substrate layer 20, each of which is easily decomposable, a conductive pattern 30 disposed between the first substrate layer 10 and the second substrate layer 20, and a mounting component 40 interposed between the first substrate layer 10 and the conductive pattern 30 and the second substrate layer 20, the mounting component 40 having a mounting terminal 45 electrically connected to the conductive pattern 30, and comprises a step of forming the conductive pattern 30 by a coating film comprising a conductive filler and a binder containing a thermoplastic resin.
In the process of forming the conductive pattern 30, the conductive pattern 30 is formed to include a relatively wide pattern 30a and a relatively narrow pattern 30b, and the conductive pattern 30 is formed so that the wide pattern 30a has a smaller film thickness at the center in the width direction than at both ends in the width direction, and the narrow pattern 30b has a portion in the center in the width direction where the film thickness is maximum.

Here, the cross-sectional shapes of the conductive pattern 30 actually obtained are shown in Fig. 16(a) to Fig. 16(d). Of these, Fig. 16(a) shows the narrow pattern 30b corresponding to the second opening 472 having a width dimension W6 of 0.5 mm, and Fig. 16(b) shows the narrow pattern 30b corresponding to the second opening 472 having a width dimension W6 of 1.0 mm. Fig. 16(c) shows the wide pattern 30a corresponding to the first opening 471 having a width dimension W5 of 2.0 mm, and Fig. 16(d) shows the wide pattern 30a corresponding to the first opening 471 having a width dimension W5 of 4.0 mm.
Moreover, the cross-sectional shapes shown in FIGS. 16A to 16D are created based on the average value of film thickness profiles obtained from 20 samples of the conductive patterns 30, respectively.

When the width dimension W6 of the second opening 472 was set to 0.5 mm, the average of the maximum film thicknesses T3 of the 20 narrow patterns 30b actually obtained was 24.2 μm.
When the width dimension W6 of the second opening 472 was set to 1.0 mm, the average of the maximum film thicknesses T3 of the 20 narrow patterns 30b actually obtained was 26.8 μm.
Furthermore, when the width dimension W5 of the first opening 471 was set to 2.0 mm, the average value of the minimum film thickness value T1 in the thin film portion 34 of the 20 wide patterns 30a actually obtained was 13.5 μm, and the average value of the maximum film thickness value T2 in the thick film portion 33 of the wide pattern 30a was 23.1 μm.
When the width dimension W5 of the first opening 471 was set to 4.0 mm, the average value of the minimum film thickness value T1 in the thin film portion 34 of the 20 wide patterns 30a actually obtained was 11.4 μm, and the average value of the maximum film thickness value T2 in the thick film portion 33 of the wide pattern 30a was 20.1 μm.
When the width dimension W5 of the first opening 471 is set to 2.0 mm and the width dimension W6 of the second opening 472 is set to 0.5 mm, 1.5 times T1 (13.5 μm) is 20.25, which is smaller than T2 (23.1 μm) and smaller than T3 (24.2 μm).
Furthermore, when the width dimension W5 of the first opening 471 is set to 2.0 mm and the width dimension W6 of the second opening 472 is set to 1.0 mm, 1.5 times T1 (13.5 μm) is 20.25, which is smaller than T2 (23.1 μm) and smaller than T3 (26.8 μm).
Furthermore, when the width dimension W5 of the first opening 471 is set to 4.0 mm and the width dimension W6 of the second opening 472 is set to 0.5 mm, 1.5 times T1 (11.4 μm) is 17.1, which is smaller than T2 (20.1 μm) and smaller than T3 (24.2 μm).
Furthermore, when the width dimension W5 of the first opening 471 is set to 4.0 mm and the width dimension W6 of the second opening 472 is set to 1.0 mm, 1.5 times T1 (11.4 μm) is 17.1, which is smaller than T2 (20.1 μm) and smaller than T3 (26.8 μm).
That is, according to the method for manufacturing a component mounting board according to this embodiment, it is possible to obtain a conductive pattern 30 that satisfies T2>1.5×T1 and T3>1.5×T1.

Each embodiment has been described above with reference to the drawings, but these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

For example, in the above description, an example was described in which the mounted component 40 was an RFID chip, but the present invention is not limited to this example, and the mounted component 40 may be other electronic components, such as a capacitor or resistor. Furthermore, the component mounting board 100 may be used not only for RFID tag applications, but also for NFC (Near Field Communication).

In the above, an example was described in which the component mounting board 100 is attached to the disposable diaper 300, and therefore the component mounting board 100 is used with the retaining film 85 and the release film 95 peeled off and removed. However, the present invention is not limited to this example, and the retaining film 85 and the release film 95 may not be peeled off when the component mounting board 100 is in use, and the retaining film 85 and the release film 95 may be peeled off and removed after the component mounting board 100 is used (after the intended purpose of use is achieved), thereby making the first base layer 10 and the second base layer 20 (and the cover layer 70) easily disassembled.

The present embodiment encompasses the following technical ideas.
(1) a first substrate layer and a second substrate layer, each of which is easily decomposable;
A conductive pattern disposed between the first base material layer and the second base material layer;
a mounting component interposed between the first base layer and the conductive pattern, and the second base layer;
Equipped with
the mounting component has a mounting terminal electrically connected to the conductive pattern,
the conductive pattern is a coating film including a conductive filler and a binder containing a thermoplastic resin,
The conductive pattern includes a relatively wide pattern and a relatively narrow pattern,
the wide pattern has thick film portions at both ends in a width direction, and has a thin film portion in a center portion in the width direction, the thin film portion having a thickness smaller than that of the thick film portion;
The narrow pattern has a portion where the film thickness is maximum at the center in the width direction of the component mounting board.
(2) the width dimension of the wide pattern is 2 mm or more;
The narrow pattern has a width dimension of less than 2 mm;
the thick film portion is present within a range of 1 mm from an end portion in a width direction of the wide pattern,
If the minimum value of the film thickness in the thin film portion is T1, the maximum value of the film thickness in the thick film portion is T2, and the maximum value of the film thickness of the narrow pattern is T3, then
The component mounting board according to (1), wherein T2>1.5×T1 and T3>1.5×T1 are satisfied.
(3) The component mounting board according to (1) or (2), wherein each of the first base material layer and the second base material layer decomposes upon contact with a liquid.
(4) A component mounting board described in any one of (1) to (3), in which one of the first base material layer and the second base material layer is an adhesive layer made of an adhesive, and the other is a non-adhesive layer having no adhesive properties.
(5) A cover layer is provided on the adhesive layer on the opposite side to the non-adhesive layer,
The component mounting board according to (4), wherein the cover layer is easily decomposable.
(6) The component mounting board according to any one of (1) to (5), wherein the conductive pattern exhibits hot melt properties at 50° C. or higher.
(7) The component mounting board according to any one of (1) to (6), wherein the conductive pattern has an antenna wiring portion and a component mounting wiring portion, the antenna wiring portion includes the wide pattern and the narrow pattern, and the component mounting wiring portion is the narrow pattern.
(8) The wide pattern extends in a direction intersecting an extending direction of the narrow pattern in the vicinity of a boundary between the wide pattern and the narrow pattern,
The component mounting board according to any one of (1) to (7), wherein the wide pattern has the thick film portion along a boundary between the wide pattern and the narrow pattern.
(9) A component mounting board described in any one of (1) to (8), in which the inclination angle from the maximum thickness portion to the minimum thickness portion in the thin film portion is gentler than the inclination angle from the end of the wide pattern in the width direction to the maximum thickness portion in the thick film portion.
(10) The component mounting board according to any one of (1) to (9), wherein the narrow pattern has a narrow portion formed to be narrower than a width dimension of the mounting terminal.
(11) A method for manufacturing a component-mounted board comprising a first base layer and a second base layer, each of which is easily decomposable, a conductive pattern disposed between the first base layer and the second base layer, and a mounting component interposed between the first base layer, the conductive pattern, and the second base layer, the mounting component having a mounting terminal electrically connected to the conductive pattern, the method comprising:
forming the conductive pattern by a coating film containing a conductive filler and a binder containing a thermoplastic resin;
a conductive pattern forming step of forming the conductive pattern including a wide pattern having a relatively wide width and a narrow pattern having a relatively narrow width, the wide pattern having a smaller thickness at a central portion in the width direction than at both ends in the width direction, and the narrow pattern having a portion in the central portion in the width direction where the thickness is maximum, the conductive pattern being formed in the conductive pattern.
(12) The step of forming the conductive pattern includes:
A step of printing the conductive pattern on a pattern forming substrate;
providing a support substrate supporting the first substrate layer on one surface thereof;
transferring the conductive pattern from the pattern-forming substrate to the first substrate layer on the supporting substrate;
The method for manufacturing a component mounting board according to (11) above,

10 First base layer 10a One surface 20 Second base layer 20a One surface 30 Conductive pattern 30a Wide pattern 30b Narrow pattern 30c Maximum thickness portion 31 First conductive pattern 31a One end 32 Second conductive pattern 32a One end 33 Thick portion 33a Maximum thickness portion 34 Thin portion 34a Minimum thickness portion 34a
35 Antenna wiring section 36 First antenna wiring section 36a First wide section 36b First zigzag section 37 Second antenna wiring section 37a Second wide section 37b Second zigzag section 38 Mounting component wiring section 38a Straight section 38b Connecting section 38c Annular section 39 Narrow section 39a Cutout section 40 Mounting width component 41 Component body 45 Mounting terminal 46 First mounting terminal 47 Second mounting terminal 60 Lamination section 70 Cover layer 80 Support layer 85 Holding film 90 Protective layer 95 Release film 100 Component mounting board 210 Pattern forming substrate 212 Release film 214 Support substrate 250 Heating member 300 Disposable diaper 310 Rear section 320 Front section 330 Connecting section 340 Hook-and-loop fastener section 350 Absorber 410 Squeegee 420 Scraper 430 Screen plate 440 Mesh 450 Emulsion layer 451 First emulsion layer 452 Second emulsion layer 460 Conductive paste 470 Opening 471 First opening 472 Second opening

Claims (12)

A first base material layer and a second base material layer, each of which is easily decomposable;
A conductive pattern disposed between the first base material layer and the second base material layer;
a mounting component interposed between the first base layer and the conductive pattern, and the second base layer;
Equipped with
the mounting component has a mounting terminal electrically connected to the conductive pattern,
the conductive pattern is a coating film including a conductive filler and a binder containing a thermoplastic resin,
The conductive pattern includes a relatively wide pattern and a relatively narrow pattern,
the wide pattern has thick film portions at both ends in a width direction, and has a thin film portion in a center portion in the width direction, the thin film portion having a thickness smaller than that of the thick film portion;
The narrow pattern has a portion where the film thickness is maximum at the center in the width direction of the component mounting board. The width dimension of the wide pattern is 2 mm or more,
The narrow pattern has a width dimension of less than 2 mm;
the thick film portion is present within a range of 1 mm from an end portion in a width direction of the wide pattern,
If the minimum value of the film thickness in the thin film portion is T1, the maximum value of the film thickness in the thick film portion is T2, and the maximum value of the film thickness of the narrow pattern is T3, then
2. The component mounting board according to claim 1, wherein T2>1.5×T1 and T3>1.5×T1 are satisfied. The component mounting substrate according to claim 1 or 2, wherein each of the first base material layer and the second base material layer dissolves upon contact with a liquid. The component mounting substrate according to any one of claims 1 to 3, wherein one of the first base material layer and the second base material layer is an adhesive layer made of an adhesive, and the other is a non-adhesive layer. a cover layer laminated on the adhesive layer on the opposite side of the adhesive layer to the non-adhesive layer,
The component mounting board according to claim 4 , wherein the cover layer is easily disassembled. The component mounting substrate according to any one of claims 1 to 5, wherein the conductive pattern exhibits hot melt properties at 50°C or higher. the conductive pattern has an antenna wiring portion and a component mounting wiring portion,
the antenna wiring portion includes the wide pattern and the narrow pattern,
The component mounting board according to claim 1 , wherein the component mounting wiring portion is the narrow pattern. the wide pattern extends in a direction intersecting with a direction in which the narrow pattern extends in the vicinity of a boundary between the wide pattern and the narrow pattern,
The component mounting board according to claim 1 , wherein the wide pattern has the thick film portion along a boundary between the wide pattern and the narrow pattern. The component mounting board according to any one of claims 1 to 8, wherein the inclination angle from the maximum thickness portion to the minimum thickness portion of the thin film portion is gentler than the inclination angle from the end of the wide pattern in the width direction to the maximum thickness portion of the thick film portion. The component mounting board according to any one of claims 1 to 9, wherein the narrow pattern has a narrow portion formed narrower than the width dimension of the mounting terminal. A method for manufacturing a component-mounted board comprising: a first base layer and a second base layer, each of which is easily decomposable; a conductive pattern disposed between the first base layer and the second base layer; and a mounting component interposed between the first base layer, the conductive pattern, and the second base layer, the mounting component having a mounting terminal electrically connected to the conductive pattern, the method comprising the steps of:
forming the conductive pattern by a coating film containing a conductive filler and a binder containing a thermoplastic resin;
a conductive pattern forming step of forming the conductive pattern including a wide pattern having a relatively wide width and a narrow pattern having a relatively narrow width, the wide pattern having a smaller thickness at a central portion in the width direction than at both ends in the width direction, and the narrow pattern having a portion in the central portion in the width direction where the thickness is maximum, the conductive pattern being formed in the conductive pattern. The step of forming a conductive pattern includes:
A step of printing the conductive pattern on a pattern forming substrate;
providing a support substrate supporting the first substrate layer on one surface thereof;
transferring the conductive pattern from the pattern-forming substrate to the first substrate layer on the supporting substrate;
The method for manufacturing a component mounting board according to claim 11 , further comprising:

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