JP7466017B2 - Imaging device and moving object - Google Patents

Description

The present invention relates to an imaging device and a moving object.

In electronic devices such as vehicle-mounted cameras, there is a demand for miniaturization and the ability to perform a variety of processes at high speed. As circuit boards become more multilayered and highly integrated to achieve miniaturization, the radiation noise and heat generated by the electronic devices on the circuit board increases. As a result, a configuration has been proposed in which the entire side of the circuit board is covered with a shielding material, and the circuit board and the heat transfer material are in contact with each other via a heat transfer material made of a soft material such as silicone gel (see Patent Document 1).

JP 2011-259101 A

However, there is a demand for electronic devices that have a simple structure and can provide shielding against radiated noise.

Therefore, in consideration of the problems with the conventional technology described above, the objective of this disclosure is to provide an imaging device and a moving object that have a simple configuration and are shielded against radiation noise.

In order to solve the above-mentioned problems, an imaging apparatus according to a first aspect of the present invention comprises:
An imaging optical system;
a second substrate on which electronic components are mounted, the second substrate being disposed along an optical axis of the imaging optical system;
a second flat plate portion formed by bending a second metal plate and facing a main surface of the second substrate;
a protrusion formed by bending the second metal plate and between the second plate portion and the second substrate ;
The second metal plate is partially bent to cover a side surface of the second substrate.

Moreover, a moving body according to a second aspect of the present invention is
The imaging device includes an imaging optical system, a second substrate having electronic components mounted thereon and arranged along an optical axis of the imaging optical system, a second flat portion formed by bending a second metal sheet and facing a main surface of the second substrate, and a protrusion formed by bending the second metal sheet and formed between the second flat portion and the second substrate , and a portion of the second metal sheet is bent to cover a side surface of the second substrate.

According to the present disclosure configured as described above, it is possible to provide shielding against radiated noise with a simple configuration.

1 is a layout diagram showing a mounting position of an electronic device according to an embodiment of the present invention on a moving object. 2 is a cross-sectional view showing a schematic configuration of the electronic device of FIG. 1 , taken along the optical axis of an imaging optical system. 3 is a cross-sectional view of the electronic device of FIG. 1 rotated 90° about the optical axis from the cross-section of FIG. 2 . FIG. 4 is a perspective view showing the appearance of the first substrate in FIGS. FIG. 4 is a perspective view showing the appearance of the second substrate and the third substrate of FIGS. FIG. 4 is a perspective view showing the appearance of the first metal plate of FIGS. FIG. 7 is a planar development view of the first metal plate of FIG. 6 . FIG. 4 is a perspective view showing the appearance of the second metal plate of FIGS. FIG. 9 is a planar development of the second metal plate of FIG. 8 . FIG. 4 is a perspective view showing the appearance of the first housing in FIGS. FIG. 4 is a perspective view showing the appearance of the second housing of FIGS. 4A and 4B are diagrams illustrating a method for manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling the second board and the third board to a second metal plate. 4 is a diagram showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating another process for assembling the second board and the third board to the second metal plate. FIG. 4 is a diagram showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating yet another process for assembling the second board and the third board to the second metal plate. FIG. 4A and 4B are diagrams illustrating a method for manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling the second board and the third board to the first metal plate. 4 is a diagram showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating another process for assembling the second board and the third board to the first metal plate. FIG. 4A and 4B are diagrams showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating a step of electrically connecting the first substrate and the second substrate. 4A and 4B are diagrams illustrating a method for manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling a third substrate to a second housing.

Below, an embodiment of a fixing structure to which the present invention is applied will be described with reference to the drawings.

Specifically, an electronic device according to an embodiment of the present disclosure is, for example, an imaging device. As shown in FIG. 1, an electronic device 10 applied to the imaging device according to this embodiment is mounted on, for example, a moving object 11.

The mobile body 11 may include, for example, vehicles, ships, and aircraft. The vehicles may include, for example, automobiles, industrial vehicles, railroad vehicles, residential vehicles, and fixed-wing aircraft that run on runways. The automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolley buses. The industrial vehicles may include, for example, industrial vehicles for agriculture and construction. The industrial vehicles may include, for example, forklifts and golf carts. The industrial vehicles for agriculture may include, for example, tractors, cultivators, transplanters, binders, combines, and lawnmowers. The industrial vehicles for construction may include, for example, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. The vehicles may include those that run by human power. The classification of vehicles is not limited to the above examples. For example, automobiles may include industrial vehicles that can run on roads. The same vehicle may be included in multiple classifications. The ships may include, for example, marine jets, boats, and tankers. Aircraft may include, for example, fixed-wing aircraft and rotorcraft.

As shown in Figures 2 and 3, the electronic device 10 includes a first substrate 12, a second substrate 13, a third substrate 14, a first metal plate 15, and a second metal plate 16. The electronic device 10 may further include a heat transfer section 17, an imaging optical system 18, a first housing 19, and a second housing 20.

As shown in FIG. 4, the first substrate 12 is flat. The first substrate 12 may be substantially rectangular. As shown in FIGS. 2 and 3, the first substrate 12 is provided with an image sensor 21 as an electronic component on the side opposite to the first flat portion, which will be described later. The image sensor 21 is, for example, a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and generates an image signal by capturing an optical image formed on the light receiving surface. The first substrate 12 may be provided with a first connector 22 for electrically connecting to the second substrate 13 on the back side of the surface on which the image sensor 21 is provided.

As shown in FIG. 5, the second substrate 13 is flat. The second substrate 13 may be substantially rectangular. The second substrate 13 has electronic components 23 mounted on at least one of its main surfaces. The electronic components 23 drive the image sensor 21 or process the image signal generated by the image sensor 21. The second substrate 13 may have a second connector 24 mounted on one of its main surfaces for electrically connecting to the first connector 22.

The third substrate 14 is flat. The third substrate 14 may be substantially rectangular. The third substrate 14 has electronic components 23 mounted on at least one of its main surfaces. The electronic components 23 drive the image sensor 21 or process the image signal generated by the image sensor 21. The third substrate 14 may have a third connector 25 mounted on one of its main surfaces for electrically connecting to the second housing 20.

The third substrate 14 may be electrically connected to the second substrate 13 by a flexible substrate 26. The third substrate 14 may have the second connector 24 and the third connector 25 mounted on the same main surface with the entire flexible substrate 26 extended into a flat plate shape.

As shown in Figures 2 and 3, in electronic device 10, first substrate 12, second substrate 13, and third substrate 14 are positioned in order in the stacking direction so that their respective principal surfaces face each other.

As shown in FIG. 6, the first metal sheet 15 has a first flat portion 27 and a first shielding portion 28. The first metal sheet 15 may further have a third shielding portion 29.

The first flat plate portion 27 is flat. The first flat plate portion 27 may be generally rectangular and wider than the first substrate 12, the second substrate 13, and the third substrate 14. As shown in FIGS. 2 and 3, in the electronic device 10, the first flat plate portion 27 is interposed between the first substrate 12 and the second substrate 13. In the electronic device 10, the main surface of the first flat plate portion 27 may be generally parallel to the main surfaces of the first substrate 12 and the second substrate 13.

In the electronic device 10, the first flat plate portion 27 directly or indirectly contacts the electronic components 23 mounted on the first substrate 12 and the second substrate 13. In the electronic device 10, the first flat plate portion 27 indirectly contacts the image sensor 21, which is an electronic component, via the heat dissipation sheet 30 and the first substrate 12. In the electronic device 10, the first flat plate portion 27 indirectly contacts the electronic components 23 mounted on the second substrate 13 via the heat dissipation sheet 30. The heat dissipation sheet 30 may be made of a material that is soft and has shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

As shown in FIG. 6, an opening op may be formed in the first flat plate portion 27. The opening op may be larger than the first connector 22 when viewed in a direction perpendicular to the main surface of the first substrate 12. As shown in FIG. 2, in the electronic device 10, the first connector 22 may be inserted through the opening op. In the electronic device 10, the second connector 24 may be connected to the first connector 22 inserted through the opening op.

As shown in FIG. 6, the first shielding portion 28 is erected along the entire outer edge of the first flat plate portion 27 on the main surface side of the first flat plate portion 27 that faces the first substrate 12. As shown in FIGS. 2 and 3, in the electronic device 10, the first shielding portion 28 covers the entire periphery of the side surface of the first substrate 12.

As shown in FIG. 6, the third shielding portion 29 may be erected along two parallel sides of the first flat portion 27 on the side opposite to the main surface on which the first shielding portion 28 of the first flat portion 27 is erected. As shown in FIG. 2, in the electronic device 10, the third shielding portion 29 may cover at least the portions of the side surfaces of the second substrate 13 and the third substrate 14 that are exposed from the second shielding portion described below. In the electronic device 10, the third shielding portion 29 may cover the flexible substrate 26 when viewed from a direction perpendicular to the stacking direction.

The third shielding portion 29 may have a first foot 31 at the end in the stacking direction, in other words, away from the first flat plate portion 27. The first foot 31 may be parallel to the first flat plate portion 27. The first foot 31 may overlap the first flat plate portion 27 when viewed from a direction perpendicular to the first flat plate portion 27. As shown in FIG. 2, within the electronic device 10, the third shielding portion 29 may abut against the heat transfer portion 17 at the first foot 31.

The first metal sheet 15 is formed by bending a predetermined portion of a metal sheet, in other words, a metal flat plate of the desired shape as shown in FIG. 7. In FIG. 7, the straight line that is bent toward the front side is shown by a wavy line, and the straight line that is bent toward the back side is shown by a dashed line. Therefore, by extending the bent portion of the first metal sheet 15 to make it flat, any portion of the first metal sheet 15 is separated from each other without interference. The first metal sheet 15 may be formed from a metal with high thermal conductivity, such as copper.

As shown in FIG. 8, the second metal plate 16 has a second flat portion 32 and a second shielding portion 33.

The second flat plate portion 32 is flat. The second flat plate portion 32 may be generally rectangular, wider than the first substrate 12, the second substrate 13, and the third substrate 14, and slightly narrower than the first flat plate portion 27. As shown in FIGS. 2 and 3, in the electronic device 10, the second flat plate portion 32 is interposed between the second substrate 13 and the third substrate 14. In the electronic device 10, the main surface of the second flat plate portion 32 may be generally parallel to the main surfaces of the second substrate 13 and the third substrate 14.

In the electronic device 10, the second flat plate portion 32 directly or indirectly contacts the electronic components 23 mounted on the second substrate 13 and the third substrate 14. In the electronic device 10, the second flat plate portion 32 indirectly contacts the electronic components 23 mounted on the second substrate 13, for example, via the heat dissipation sheet 30. In the electronic device 10, the second flat plate portion 32 indirectly contacts the electronic components 23 mounted on the third substrate 14, for example, via the heat dissipation sheet 30. The heat dissipation sheet 30 may be formed of a material that is soft and has shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

As shown in FIG. 8, the second shielding portion 33 has a first one-sided shielding portion 34 and a second one-sided shielding portion 35. The first one-sided shielding portion 34 is erected along at least a part of the outer edge of the second flat plate portion 32 on one main surface of the second flat plate portion 32. The second one-sided shielding portion 35 is erected along at least a part of the outer edge of the second flat plate portion 32 on the other main surface of the second flat plate portion 32.

The first one-sided shielding portion 34 is erected, for example, on one main surface side (upper side in FIG. 8) along three sides other than one side of the second flat plate portion 32. The second one-sided shielding portion 35 is erected, for example, on the other main surface side (lower side in FIG. 8) along two opposing sides among the three sides along which the first one-sided shielding portion 34 is erected on one main surface side.

As shown in Figures 2 and 3, in electronic device 10, second shielding portion 33 covers at least a portion of the side surfaces of second substrate 13 and third substrate 14. As shown in Figure 2, in electronic device 10, second shielding portion 33 may cover a portion of the side surfaces of second substrate 13 and third substrate 14 and leave another portion exposed without covering it.

As shown in FIG. 8, the second one-sided shielding portion 35 may have a second foot portion 36 on the stacking direction side, in other words, on the end in the direction away from the second flat plate portion 32. The second foot portion 36 may be parallel to the second flat plate portion 32. The second foot portion 36 may overlap the second flat plate portion 32 when viewed from a direction perpendicular to the second flat plate portion 32. As shown in FIG. 3, within the electronic device 10, the second shielding portion 33 may abut against the heat transfer portion 17 at the second foot portion 36.

The second metal sheet 16 is formed by bending a predetermined portion of a metal sheet, in other words, a metal flat plate of the desired shape as shown in FIG. 9. In FIG. 9, the straight line that is bent toward the front side is shown by a wavy line, and the straight line that is bent toward the back side is shown by a dashed line. Therefore, by extending the bent portion of the second metal sheet 16 to make it flat, any portion of the second metal sheet 16 is separated from each other without interference. The second metal sheet 16 may be formed from a metal with high thermal conductivity, such as copper.

As shown in Figures 2 and 3, the second metal plate 16 may be positioned apart from the first metal plate 15 without contacting it on the entire surface.

As shown in Figures 2 and 3, the heat transfer section 17 is located on the stacking direction side of the first substrate 12. The heat transfer section 17 may be located on the stacking direction side of the third substrate 14. In the electronic device 10, the heat transfer section 17 may abut against the first metal plate 15 and the second metal plate 16. As shown in Figure 2, the heat transfer section 17 may abut against the first metal plate 15 at the first foot 31. As shown in Figure 3, the heat transfer section 17 may abut against the second metal plate 16 at the second foot 36.

2 and 3, the heat transfer section 17 may include a third metal plate 37 and a heat dissipation sheet 38. The heat transfer section 17 may abut against the first metal plate 15 and the second metal plate 16 at the heat dissipation sheet 38. The heat dissipation sheet 38 may abut against the third metal plate 37 on a surface other than the surface abutting against the first metal plate 15 and the second metal plate 16. The heat dissipation sheet 38 may be formed of a material that is soft and has shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler. In the electronic device 10, the third metal plate 37 extends toward the stacking direction side from the surface abutting against the first metal plate 15 and the second metal plate 16. The third metal plate 37 may be formed of a metal with high thermal conductivity, such as copper.

The imaging optical system 18 is composed of optical elements such as lenses. The imaging optical system 18 is designed and formed so that its optical characteristics, such as the angle of view and depth of field, are the desired values. The imaging optical system 18 forms a focused subject image on the light receiving surface of the imaging element 21.

As shown in FIG. 10, the first housing 19 may be a cylinder with a rectangular cross section. As shown in FIGS. 2 and 3, the first housing 19 may house the imaging optical system 18 such that the optical axis of the imaging optical system 18 is approximately aligned with the axis of the first housing 19 and the imaging optical system 18 is exposed from one opening. The first housing 19 may house the first substrate 12 such that the imaging element 21 is fixed at a predetermined position and in a predetermined orientation relative to the imaging optical system 18. The first housing 19 may house the second substrate 13, the third substrate 14, the first metal plate 15, and the second metal plate 16 so that the above-mentioned configuration is satisfied for the first substrate 12.

As shown in FIG. 11, the second housing 20 may have a shape having a flat portion and a square prism extending perpendicularly to the main surface of the flat portion. The second housing 20 may have a third metal plate 37 as the heat transfer section 17. The second housing 20 may have a fourth connector 39 that can be mated with the third connector 25. As shown in FIGS. 2 and 3, the flat portion of the second housing 20 may be sealed to an opening at the end of the first housing 19 opposite the end exposing the imaging optical system 18.

Next, the manufacturing method of the electronic device 10 will be described below.

As shown in FIG. 12, the third substrate 14 is inserted into the space sp1 defined by the second flat plate portion 32 and the second one-sided shielding portion 35 of the second metal sheet 16. The third substrate 14 is inserted into the space sp1 from the outer edge side of the second flat plate portion 32 where the first one-sided shielding portion 34 is not provided. The third substrate 14 is inserted so that the main surface opposite the main surface on which the third connector 25 is provided faces the second flat plate portion 32. The third substrate 14 is inserted into the space sp1 from the side opposite the side on which the flexible substrate 26 is provided.

As shown in FIG. 13, the third substrate 14 is attached to the second flat portion 32 in an inserted state. A heat dissipation sheet 30 may be used to attach the third substrate 14 to the second flat portion 32. As shown in FIG. 14, the flexible substrate 26 is folded back, and the second substrate 13 is attached to the second flat portion 32. A heat dissipation sheet 30 may be used to attach the second substrate 13 to the second flat portion 32.

As shown in FIG. 15, the second metal sheet 16 to which the second substrate 13 and the third substrate 14 are attached is inserted into the space sp2 defined by the first flat portion 27 and the third shielding portion 29 of the first metal sheet 15. The second metal sheet 16 is inserted so that the second substrate 13 faces the first flat portion 27.

As shown in FIG. 16, the second metal plate 16 is attached to the first flat plate portion 27 via the second substrate 13 with the second connector 24 of the second substrate 13 inserted through the opening op of the first flat plate portion 27. A heat dissipation sheet 30 may be used to attach the second substrate 13 to the first flat plate portion 27.

As shown in FIG. 17, the second board 13 attached to the first metal sheet 15 and the second metal sheet 16 is connected to the first board 12 by fitting the second connector 24 into the first connector 22. Before connection, the first board 12 is fixed to the lens barrel 40 housing the imaging optical system 18, with a heat transfer member 41 such as a metal sheet interposed therebetween. The first board 12 is fixed to the lens barrel 40 by, for example, bonding with an adhesive or fastening with screws.

As shown in FIG. 18, with the second board 13 connected to the first board 12, the third board 14 is connected to the second housing 20 by fitting the third connector 25 into the fourth connector 39. The first housing 19 is then placed over the imaging optical system 18, the first board 12, the second board 13, the third board 14, the first metal plate 15, and the second metal plate 16. With the first housing 19 placed, the first housing 19 is fixed to the second housing 20, thereby manufacturing the electronic device 10. The first housing 19 and the second housing 20 can be fixed, for example, by welding, bonding with an adhesive, or fastening with screws.

The electronic device 10 of the present embodiment configured as described above has a first flat plate portion 27 that is interposed between the first substrate 12 and the second substrate 13 and indirectly abuts against the image sensor 21 mounted on the first substrate 12 and the electronic components 23 mounted on the second substrate 13. With this configuration, the electronic device 10 has the image sensor 21 mounted on the first substrate 12 and the electronic components 23 mounted on the second substrate 13, which are heat sources, in close proximity to the first flat plate portion 27, which generally has a higher thermal conductivity than the heat dissipation sheet 30, and therefore improves heat dissipation compared to a configuration in which only the heat dissipation sheet 30 is interposed. The electronic device 10 also has a second flat plate portion 32 that is interposed between the second substrate 13 and the third substrate 14 and indirectly abuts against the electronic components 23 mounted on each of the second substrate 13 and the third substrate 14. With this configuration, the electronic device 10 has the heat source, the electronic components 23 mounted on the second board 13 and the third board 14, in close proximity to the second flat plate portion 32, which generally has higher thermal conductivity than the heat dissipation sheet 30, improving heat dissipation compared to a configuration in which only the heat dissipation sheet 30 is interposed.

Furthermore, the electronic device 10 according to this embodiment has a first shielding portion 28 that covers the entire periphery of the side surface of the first substrate 12. With this configuration, the electronic device 10 can have shielding properties against radiation noise from the first substrate 12 or the electronic components 23 mounted on the first substrate 12. The electronic device 10 also has a second shielding portion 33 that covers at least a portion of the side surfaces of the second substrate 13 and the third substrate 14. With this configuration, the electronic device 10 can have shielding properties against radiation noise from the electronic components 23 mounted on the second substrate 13 and the third substrate 14.

Furthermore, in the electronic device 10 according to this embodiment, the first metal sheet 15 has a first flat plate portion 27 and a first shielding portion 28. Also, in the electronic device 10, the second metal sheet 16 has a second flat plate portion 32 and a second shielding portion 33. With this configuration, in the electronic device 10, the first flat plate portion 27 and the first shielding portion 28 having the above-mentioned configuration, and the second flat plate portion 32 and the second shielding portion 33 having the above-mentioned configuration can be manufactured with a simple configuration without going through a process such as welding.

Therefore, as described above, the electronic device 10 according to this embodiment can further improve heat dissipation with a simple configuration while providing shielding against radiation noise.

In addition, in the electronic device 10 according to this embodiment, the first metal plate 15 and the second metal plate 16 are positioned apart. With this configuration, the electronic device 10 can reduce heat transfer between the first metal plate 15 and the second metal plate 16 compared to a configuration in which the first metal plate 15 and the second metal plate 16 are in contact with each other. Therefore, in a configuration in which one of the first metal plate 15 and the second metal plate 16 is close to a component that is highly affected by high temperatures, even if the other becomes hot, the electronic device 10 can reduce heat transfer from the other to the other.

In addition, in the electronic device 10 according to this embodiment, the second shielding portion 33 covers a portion of the side surfaces of the second substrate 13 and the third substrate 14, and covers at least the portion of the third shielding portion 29 of the first metal plate 15 that is exposed from the second shielding portion 33. With this configuration, the electronic device 10 can easily attach the second substrate 13 and the third substrate 14 to the second metal plate 16 while providing shielding against radiation noise from the electronic components 23 mounted on each of the second substrate 13 and the third substrate 14, even in a configuration in which the second substrate 13 and the third substrate 14 are connected by wiring such as a flexible substrate 26 extending from the side surfaces of each of the second substrate 13 and the third substrate 14.

In addition, in the electronic device 10 according to this embodiment, the flexible substrate 26 connecting the second substrate 13 and the third substrate 14 is covered by the third shielding portion 29. With this configuration, the electronic device 10 can suppress a decrease in the shielding ability against radiation noise of the electronic components 23 mounted on each of the second substrate 13 and the third substrate 14, while using the flexible substrate 26 that contributes to easier manufacturing and reduced manufacturing costs.

The electronic device 10 according to this embodiment also includes a heat transfer section 17 located further in the stacking direction than the first substrate 12 and in contact with the first metal plate 15 and the second metal plate 16. With this configuration, the electronic device 10 can transfer heat generated in the electronic components 23 mounted on each of the first substrate 12, the second substrate 13, and the third substrate 14 in the stacking direction. Therefore, even if the electronic device 10 is configured to position components that are greatly affected by high temperatures, such as the resin imaging optical system 18, in the opposite direction to the stacking direction, it can suppress overheating of the components.

In addition, in the electronic device 10 according to this embodiment, the third shielding portion 29 and the second shielding portion 33 abut against the heat transfer portion 17 at the first foot portion 31 and the second foot portion 36, respectively. With this configuration, the electronic device 10 according to this embodiment can increase the contact area between the heat transfer portion 17 and each of the first metal plate 15 and the second metal plate 16. Therefore, the electronic device 10 can improve the heat transfer to the heat transfer portion 17 of heat generated in the electronic components 23 mounted on each of the first board 12, the second board 13, and the third board 14.

In addition, in the electronic device 10 according to this embodiment, the first board 12 and the second board 13 are electrically connected via the first connector 22 and the second connector 24 that pass through the opening op drilled in the first flat plate portion 27. With this configuration, the electronic device 10 can be allowed to form a first shielding portion 28 and a third shielding portion 29 that cover the entire side surface of at least one of the first board 12 and the second board 13. Therefore, the electronic device 10 can cover the entire periphery of at least one of the side surfaces of the first board 12 and the second board 13 using a single first metal plate 15 without using multiple metal plates.

Although the present invention has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and corrections based on this disclosure. Therefore, it should be noted that these modifications and corrections are included in the scope of the present invention.

For example, in this embodiment, the second substrate 13 and the third substrate 14 are connected via the flexible substrate 26, but an opening may be drilled in the second flat plate portion 32 and the second substrate 13 and the third substrate 14 may be connected via a connector through the opening. In such a configuration, the second shielding portion 33 may cover the entire periphery of the side surfaces of the second substrate 13 and the third substrate 14. Since the side surfaces of the second substrate 13 and the third substrate 14 are covered over the entire periphery, the third shielding portion 29 does not need to cover a part of the side surfaces of the second substrate 13 and the third substrate 14. In this way, an electronic device having a plurality of substrates arranged in the stacking direction, a flat plate portion interposed between two adjacent substrates among the plurality of substrates, and a sheet metal having a shielding portion covering the side surfaces of the two substrates over the entire periphery can further improve heat dissipation with a simple configuration while having shielding properties against radiation noise, as described above.

LIST OF SYMBOLS 10 Electronic device 11 Moving object 12 First substrate 13 Second substrate 14 Third substrate 15 First metal plate 16 Second metal plate 17 Heat transfer section 18 Imaging optical system 19 First housing 20 Second housing 21 Imaging element 22 First connector 23 Electronic component 24 Second connector 25 Third connector 26 Flexible substrate 27 First flat plate portion 28 First shielding portion 29 Third shielding portion 30 Heat dissipation sheet 31 First foot portion 32 Second flat plate portion 33 Second shielding portion 34 First one-side shielding portion 35 Second one-side shielding portion 36 Second foot portion 37 Third metal plate 38 Heat dissipation sheet 39 Fourth connector 40 Lens barrel 41 Heat transfer member op Opening sp1 space defined by the second flat plate portion and the second one-sided shielding portion; space defined by the first flat plate portion and the third shielding portion;

Claims (6)

An imaging optical system;
a second substrate on which electronic components are mounted, the second substrate being disposed along an optical axis of the imaging optical system;
a second flat plate portion formed by bending a second metal plate and facing a main surface of the second substrate;
a protrusion formed by bending the second metal plate and between the second plate portion and the second substrate ,
The second metal plate is partially bent to cover a side surface of the second substrate.
Imaging device. a third substrate on which electronic components are mounted, the third substrate being disposed opposite the second substrate across the second flat plate portion;
The imaging device according to claim 1 , further comprising: a second one- sided shielding portion formed of a metal plate covering a side surface of the third substrate. The imaging device according to claim 2 , wherein the second one-side shielding portion is formed by bending the second metal plate. The imaging device according to claim 3 , further comprising a first metal plate on which a third shielding portion is formed to define a space for accommodating the second metal plate. a flexible substrate electrically connecting the second substrate and the third substrate;
The imaging device according to claim 4 , wherein the third shielding portion covers the flexible substrate. A moving object equipped with an imaging device according to any one of claims 1 to 5.

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