JP7446538B1 - Multi-wire electric discharge machine, machining control device, machining condition generation device, electric discharge machining system, electric discharge machining method, and thin plate manufacturing method - Google Patents

Abstract

A multi-wire electric discharge machine consists of a cutting wire section in which wire electrodes are wound around multiple guide rollers and arranged in parallel to face the workpiece, and a drive section that adjusts the distance between the workpiece and the cutting wire section. , a processing power supply that applies a pulse voltage between the workpiece and the cutting wire section, a processing control device (9) that controls the drive section and the processing power supply, and a processing control device (9) that controls the cutting wire section when processing the workpiece. A processing condition generation device (30) that generates applied processing conditions that are processing conditions to be applied to the next processing based on the measurement results of the thickness at each processing position in the processing surface of the cut thin plate, The processing condition generation device (30) corrects the basic processing conditions, which are the basic processing conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate at each processing position, and the measurement result. The processing control device (9) generates the conditions and controls at least one of the drive unit and the processing power source using the applied processing conditions during the next processing.

Description

The present disclosure relates to a multi-wire electrical discharge machine that cuts a workpiece into a plurality of thin plates using a plurality of wires, a processing control device, a processing condition generation device, an electrical discharge machining system, an electrical discharge machining method, and a thin plate manufacturing method.

A multi-wire electric discharge machine is a device that cuts out a plurality of thin plates from a workpiece by applying a pulse voltage between a plurality of wires and a columnar workpiece.

The multi-wire electric discharge machine described in Patent Document 1 outputs a command to apply a pulse voltage according to machining conditions to avoid wire electrode breakage to a machining power source when a value indicating a machining state exceeds a threshold value. This increases processing speed while avoiding wire breakage.

Patent No. 6991414

However, in the technique of Patent Document 1, due to the influence of assembly variations of parts of the multi-wire electric discharge machine or parts caused by the assembler, even if the same machining conditions are applied to workpieces made of the same material. There was a problem in that the error in the thickness of the machined thin plate from the standard value varied within the machined surface depending on the multi-wire electrical discharge machine.

The present disclosure has been made in view of the above, and is a multi-wire electrical discharge machine that can suppress variations in the thickness of a machined thin plate from a reference value within a machined surface for each multi-wire electrical discharge machine. The purpose is to obtain.

In order to solve the above-mentioned problems and achieve the purpose, the multi-wire electrical discharge machine of the present disclosure includes a cutting wire section in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel to face a workpiece; It includes a drive section that adjusts the distance between the workpiece and the cutting wire section. Further, the multi-wire electric discharge machine of the present disclosure includes a machining power source that applies a pulse voltage between the workpiece and the cutting wire section, and a machining control device that controls the drive section and the machining power source. Furthermore, the multi-wire electrical discharge machine of the present disclosure is based on the measurement result of the thin plate thickness, which is the thickness at each processing position within the processing surface of the thin plate cut out in the past by the cutting wire part processing the workpiece. , a machining condition generation device that generates applied machining conditions that are machining conditions to be applied to the next machining. The machining condition generation device generates applicable machining conditions by correcting the basic machining conditions, which are the basic machining conditions, based on the difference between the target value, which is the standard value of the thickness of the thin plate at each machining position, and the measurement result. do. The processing control device controls at least one of the drive unit and the processing power source using the applied processing conditions during the next processing.

The multi-wire electrical discharge machine according to the present disclosure has the effect of suppressing variations in the thickness of a machined thin plate from a reference value within a machined surface for each multi-wire electrical discharge machine.

A diagram showing the configuration of a multi-wire electric discharge machine according to Embodiment 1. A diagram showing the configuration of a processing condition generation device according to Embodiment 1. A diagram for explaining the thin plate thickness collected by the machining result collection unit of the machining condition generation device according to the first embodiment A diagram showing the configuration of a processing condition generator according to Embodiment 1 Flowchart showing the procedure of processing executed by the multi-wire electric discharge machine according to the first embodiment A diagram showing another configuration example of the machining control device included in the multi-wire electric discharge machine according to the first embodiment. A diagram showing an example of a hardware configuration for realizing the processing condition generation device according to the first embodiment. A diagram showing the configuration of an electric discharge machining system according to a second embodiment

Hereinafter, a multi-wire electric discharge machine, a machining control device, a machining condition generation device, an electric discharge machining system, an electric discharge machining method, and a thin plate manufacturing method according to embodiments of the present disclosure will be described in detail based on the drawings.

Embodiment 1.
FIG. 1 is a diagram showing the configuration of a multi-wire electrical discharge machine according to a first embodiment. In the following description, the vertical direction will be referred to as the Z-axis direction, and two axes in the horizontal plane that are orthogonal to each other will be referred to as the X-axis and the Y-axis. That is, the X-axis, Y-axis, and Z-axis are three axes that are perpendicular to each other. Among the directions of each axis, the direction of the arrow is defined as a positive direction, and the direction opposite to the arrow is defined as a negative direction. The plus Z direction is the vertically upward direction, and the minus Z direction is the vertically downward direction.

The multi-wire electrical discharge machine 1 is a device that electrical discharge cuts a columnar workpiece 2 into a plurality of pieces (a plurality of thin plates). The multi-wire electric discharge machine 1 runs a wire electrode 6 around a plurality of times, and cuts between each of a plurality of cutting wire parts 6a, which are parts of the wire electrode 6 that run parallel to each other, and the workpiece 2. Electric discharge machining of the workpiece 2 is performed by applying a pulse voltage to the workpiece 2. The multi-wire electric discharge machine 1 manufactures a plurality of thin plates by cutting out a plurality of thin plates from a workpiece 2 at the same time. The multi-wire electric discharge machine 1 performs electric discharge machining by controlling the voltage application by the machining power supply 7 while preventing the wire electrode 6 from being cut due to instability of the machining process or mechanical aging.

The multi-wire electrical discharge machine 1 includes a wire bobbin 4 that supplies a wire electrode 6 and a wire bobbin drive section 17 that rotationally drives the wire bobbin 4. The multi-wire electrical discharge machine 1 also includes a wire discharge roller 5 for discharging the wire electrode 6 to the outside of the multi-wire electrical discharge machine 1, guide rollers 3a to 3d for appropriately running the wire electrode 6, and guide rollers 3a to 3d for appropriately running the wire electrode 6. 3a.

Each guide roller 3a to 3d has a cylindrical shape. The guide rollers 3a to 3d guide the wire electrode 6 between the wire bobbin 4 and the wire discharge roller 5.

A wire electrode 6 is wound around the guide rollers 3a to 3d a plurality of times at intervals. That is, the four cylindrical guide rollers 3a to 3d have central axes parallel to each other and are arranged parallel to each other in the axial direction and spaced apart from each other. In FIG. 1, the central axis of each guide roller 3a to 3d is parallel to the Y axis. That is, FIG. 1 shows a case where the guide rollers 3a to 3d are arranged to extend in the Y-axis direction.

Furthermore, the four guide rollers 3a to 3d are arranged such that the position of the center axis of each guide roller 3a to 3d is at the vertex of a quadrilateral in a plane perpendicular to the axial direction (in the XZ plane in FIG. 1). There is. That is, the plane perpendicular to the central axis of each of the four guide rollers 3a to 3d is the XZ plane. Specifically, among the four guide rollers 3a to 3d, guide rollers 3a and 3b are provided at the highest position in the Z-axis direction, a guide roller 3c is provided at a position below guide roller 3b, and guide roller 3a and 3b are provided at the highest position in the Z-axis direction. A guide roller 3d is provided below the guide roller 3c. That is, the line connecting guide rollers 3a and 3b and the line connecting guide rollers 3c and 3d are parallel to the X-axis direction, and the line connecting guide rollers 3b and 3c and the line connecting guide rollers 3d and 3a are parallel to each other. is parallel to the Z-axis direction.

Further, on the outer periphery (side surface) of the four guide rollers 3a to 3d, a plurality of guide grooves for guiding the running of the wire electrode 6 are formed at specific intervals in the respective axial directions. That is, in each guide roller 3a to 3d, a plurality of guide grooves are formed at regular intervals in the direction of the central axis. The wire electrode 6 let out from the wire bobbin 4 is wound around each guide roller 3a to 3d along the guide groove. That is, in the illustrated example, the wire electrode 6 is guided into a guide groove provided in each of the guide rollers 3a to 3d, which rotate clockwise when viewed from the minus Y direction.

The wire electrode 6 is discharged by the wire discharge roller 5 after making a plurality of turns around the guide rollers 3a to 3d. That is, the wire electrode 6 is wound multiple times between the four guide rollers 3a to 3d with a specific interval between the guide grooves, and then is sent to the outside of the multi-wire electrical discharge machine 1 by the wire discharge roller 5. It is discharged.

Here, the portions of the wire electrode 6 stretched in parallel between the guide roller 3c and the guide roller 3d become cutting wire portions 6a, respectively. That is, the cutting wire portion 6a is a plurality of cutting wires arranged in parallel to face the workpiece 2 by winding one wire electrode 6 around a plurality of guide rollers 3a to 3d. That is, each of the plurality of cutting wire parts 6a is a part of the wire electrode 6 that is spanned between the guide roller 3c and the guide roller 3d, which are guide rollers. A plurality of mutually parallel cutting wire portions 6a are provided between the guide roller 3c and the guide roller 3d. The plurality of cutting wire portions 6a are portions of the wire electrode 6 that are parallel to each other between the guide roller 3c and the guide roller 3d. In the first embodiment, the second direction, which is the running direction of the wire electrodes 6 in the plurality of cutting wire sections 6a, is the X-axis direction. The cutting wire portion 6a of the wire electrode 6 cuts the workpiece 2. The workpiece 2 has a columnar shape and is arranged so that its axial direction is the Y-axis direction.

The multi-wire electrical discharge machine 1 also includes a feeder 12 that contacts the wire electrode 6 and supplies machining voltage to the wire electrode 6, and a machining stage (not shown) on which the workpiece 2 can be placed. The drive unit 14 is provided with a drive unit 14 for driving in the plus Z direction. The multi-wire electrical discharge machine 1 processes the workpiece 2 by moving the processing stage on which the workpiece 2 is placed in the plus Z direction. That is, the drive unit 14, which is a drive section, moves the processing stage in the Z-axis direction, which is the first direction. The first direction is the direction in which the workpiece 2 moves relative to the plurality of cutting wire parts 6a, and is the direction in which electric discharge machining in the workpiece 2 progresses.

In addition, the multi-wire electric discharge machine 1 is configured to apply a machining pulse voltage (hereinafter referred to as a machining pulse voltage) between each cutting wire portion 6a included in the wire electrode 6 and the workpiece 2 via the feeder 12. ) is provided with a processing power source 7 that applies power. The machining power source 7 applies a machining pulse voltage between each of the plurality of cutting wire parts 6 a and the workpiece 2 . The multi-wire electric discharge machine 1 also includes a cable 11 that connects the machining power source 7 and the workpiece 2. The processing power supply 7 includes a plurality of processing power supply units 8, each of which corresponds one-to-one with the cutting wire portion 6a.

The multi-wire electric discharge machine 1 also includes a machining control device 9 that controls electrical discharge machining, a machining state detection device 15 that detects the machining state of each cutting wire portion 6a, and a machining state detection device 15 that outputs machining conditions to the machining control device 9. The condition generation device 30 is also provided.

In the example shown in FIG. 1, the guide roller drive section 18 rotates the guide roller 3a. Further, the wire bobbin drive section 17 rotates the wire bobbin 4 so that the tension of the wire electrode 6 is constant. The multi-wire electrical discharge machine 1 controls the rotation of the wire bobbin 4 by the wire bobbin drive unit 17 and the rotation of the guide roller 3a by the guide roller drive unit 18 so that the running speed of the wire electrode 6 becomes a desired speed.

The machining state detection device 15 detects the machining state of each cutting wire portion 6a. The machining state detection device 15 is installed on the wiring that connects the feeder 12 and the machining power source 7. The machining state detection device 15 detects the machining voltage, the current, the number of discharges per unit time, the number of short circuits per unit time, and the machining pulse voltage which is the output voltage of the machining power source 7 via the feeder 12. By monitoring the cutting wire portion 6a, the processing state of each cutting wire portion 6a is detected. The inter-mole voltage is a voltage applied between the inter-molar spaces, that is, between the workpiece 2 and each cutting wire portion 6a. The machining state detection device 15 includes a plurality of machining state detection units 16, each of which corresponds one-to-one with the cutting wire portion 6a. The machining state detection device 15 uses each machining state detection unit 16 to detect the machining state of each cutting wire portion 6a.

The processing control device 9 controls at least one of the drive unit 14 and the processing power source 7 based on the processing result of the workpiece 2 (thickness at each processing position). Further, the machining control device 9 generates a position command, that is, a feed control command value based on the machining state detected by the machining state detection device 15. Processing control device 9 outputs a position command to drive unit 14 . The drive unit 14 moves the processing stage in the Z-axis direction according to the position command. Thereby, the drive unit 14 changes the relative position of the workpiece 2 and each cutting wire part 6a. In this manner, the multi-wire electrical discharge machine 1 uses the drive unit 14 to adjust the distance between the workpiece 2 and each cutting wire portion 6a.

Furthermore, the machining control device 9 outputs a voltage application command to each machining power supply unit 8 based on the machining state detected by the machining state detection device 15. Each machining power supply unit 8 applies a machining pulse voltage between the cutting wire portion 6a and the workpiece 2. The voltage application command includes command values such as the voltage amplitude, the frequency of the machining pulse voltage, and the on-pulse time of the machining pulse voltage.

The processing control device 9 controls the distance between the workpiece 2 and each cutting wire part 6a by outputting a position command, and also controls the distance between each cutting wire part 6a and the workpiece 2 by outputting a voltage application command. generates a discharge. Thereby, the multi-wire electric discharge machine 1 cuts out a plurality of thin plates from the workpiece 2.

The machining condition generation device 30 includes a machining condition generator 32, which will be described later. A machining condition generator 32, which is a machining condition generating section, is connected to the machining control device 9. The machining condition generator 32 compares the thickness of the thin plate with respect to the position within the plane (in the machining plane) of the thin plate and the machining results acquired by the machining result collection unit 31, which will be described later, and determines the machining conditions to be applied to each machining position. (target voltage, average machining current, etc.). The machining condition generation device 30 instructs the machining control device 9 with the generated machining conditions.

The workpiece 2 is an ingot (such as a semiconductor ingot) that is sliced into a plurality of thin plates. The material of the workpiece 2 is, for example, a metal such as tungsten or molybdenum that serves as a sputtering target, or a ceramic such as polycrystalline silicon carbide that is used as a component of various structures. The workpiece 2 may be single crystal silicon, which is the material of a semiconductor wafer, or may be a semiconductor material such as single crystal silicon carbide, single crystal gallium nitride, single crystal gallium oxide, or single crystal diamond. Further, the workpiece 2 may be a solar cell material such as single crystal silicon or polycrystalline silicon, which is a material for solar cell wafers. An example of the multi-wire electric discharge machine 1 is an apparatus that manufactures a plurality of semiconductor wafers by cutting out a plurality of semiconductor wafers from an ingot. Note that the shape of the workpiece 2 is not limited to a prismatic shape but may be a cylindrical shape.

Among the materials listed as examples of the workpiece 2, metal has a sufficiently low resistivity and there is no problem in applying electrical discharge machining. On the other hand, among semiconductor materials and solar cell materials, materials that can be subjected to electrical discharge machining have a sufficiently low specific resistance of approximately 100 Ωcm or less, and preferably have a specific resistance of 10 Ωcm or less.

Therefore, metal is suitable as the workpiece 2. For materials such as semiconductor materials or solar cell materials, materials having a resistivity in the range from a resistivity equivalent to that of metal to 100 Ωcm are suitable as the workpiece 2. Among materials such as semiconductor materials or solar cell materials, materials whose resistivity is in the range from the same resistivity as metal to 10 Ωcm are more suitable as the workpiece 2.

The multi-wire electrical discharge machine 1 supplies machining fluid to the gap between the workpiece 2 and each cutting wire portion 6a. The multi-wire electric discharge machine 1, like the so-called single-type wire electric discharge machine, sprays the machining liquid or immerses the workpiece 2 in the machining liquid. supply to. Illustration of the configuration for supplying the machining fluid is omitted.

The processing power supply 7 includes a plurality of processing power supply units 8, each of which corresponds one-to-one to the cutting wire section 6a. The machining power source 7 generates a machining pulse voltage to be applied between the machining holes according to a voltage application command from the machining control device 9. The machining power supply 7 generates a machining pulse voltage using, for example, a switching power supply system. The processing power source 7 uses a plurality of processing power supply units 8 to individually apply a processing pulse voltage to each of the plurality of cutting wire portions 6a. The processing power supply 7 includes a ground electrode 10 provided across the plurality of processing power supply units 8. The ground wire of each processing power supply unit 8 is connected to the ground electrode 10 . The ground electrode 10 is connected to a workpiece jig (not shown) by a cable 11. The workpiece 2 is connected to a ground electrode 10 via a workpiece jig and a cable 11. Note that the machining power source 7 can appropriately invert the polarity of the generated machining pulse voltage as necessary.

The feeder 12 includes a plurality of feeder units 13 that are insulated from each other. Each of the plurality of power feeding units 13 corresponds to the power feeding wire portion 6b on a one-to-one basis. In the example shown in FIG. 1, the portions of the wire electrode 6 that are parallel to each other between the guide rollers 3b and 3c (parallel stretched portions) are a plurality of power supply wire portions 6b. A power supply wire portion 6b is slidably in contact with each power supply unit 13. Each power supply unit 13 supplies the power supplied from the processing power supply unit 8 to the power supply wire section 6b. The feeder 12 uses a plurality of feeder units 13 to individually supply power to each of the feeder wire portions 6b. As a result, each machining power supply unit 8 individually applies a machining pulse voltage to each cutting wire portion 6a.

FIG. 2 is a diagram showing the configuration of the processing condition generation device according to the first embodiment. The machining condition generation device 30 includes a machining result collection section 31, a machining condition generator 32, and a subtractor 33. In the machining condition generation device 30 , a machining result collection section 31 is connected to a subtracter 33 , and the subtracter 33 is connected to a machining condition generator 32 . Further, the machining condition generator 32 is connected to the machining control device 9.

The processing result collection unit 31 collects the thickness (thin plate thickness) of the thin plate processed by the cutting wire unit 6 a at each processing position and outputs it to the subtracter 33 . The thickness of the thin plate at each processing position is the thickness at each processing position in the processing direction (Z-axis direction).

FIG. 3 is a diagram for explaining the thin plate thickness collected by the machining result collection unit of the machining condition generation device according to the first embodiment. In FIG. 3, guide rollers 3c and 3d are illustrated to show the relationship between the position where the thickness of the thin plate 2X is measured and the arrangement positions of the guide rollers 3c and 3d. FIG. 3 shows the thin plate 2X and guide rollers 3c and 3d when viewed from the Y-axis direction. Here, a case will be described in which the workpiece 2 is cylindrical and the thin plate 2X is disc-shaped.

The thickness of the thin plate 2X cut out from the workpiece 2 is measured at various positions in the processing direction. In the first embodiment, the thickness is measured at a plurality of positions on a processing path passing through the center of the thin plate 2X in a direction parallel to the Z-axis direction of the thin plate 2X when the thin plate 2X is processed.

For example, if the positions where the thickness is measured are Z1 to Zn (n is a natural number of 2 or more) and the measurement results of the thin plate thickness are At1 to Atn, the measurement results of the thin plate thickness for each processing position where the thickness is measured are as follows. The measurement results are shown as (Z1, At1), (Z2, At2), ..., (Zn, Atn). The positions Z1 to Zn are the positions Z1, Z2, . . . , Zn in order of increasing coordinates in the Z-axis direction.

The processing result collection unit 31 collects the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) measured by a thickness measuring device (not shown) and sends them to the subtractor 33. Output to.

The subtractor 33 receives the measurement results (processing results) of the thin plate thickness for each processing position from the processing result collection unit 31 . Further, the subtracter 33 receives a target value (reference value) of the thin plate thickness for each machining position, which is stored in advance in a storage device (not shown) of the multi-wire electrical discharge machine 1 or the like. Assuming that the target values of the thin plate thickness are A1 to An, the target values of the thin plate thickness for each processing position where the thickness is measured are the target values (Z1, A1), (Z2, A2), ..., (Zn, An). ). The subtractor 33 calculates a difference by subtracting the measurement result of the thin plate thickness for each processing position from the target value of the thin plate thickness for each processing position, and sends the difference in thickness to the processing condition generator 32. Note that the target values A1 to An of the thin plate thickness may be the same value. That is, A1=A2=,...,=An may be satisfied.

The machining condition generator 32 corrects the basic machining conditions stored in advance in the storage device of the multi-wire electric discharge machine 1 based on the difference in thickness. Assuming that the basic processing conditions are processing conditions C1 to Cn, the processing conditions for each processing position where the thickness is measured are shown as processing conditions (Z1, C1), (Z2, C2), ..., (Zn, Cn). It will be done.

The processing condition generator 32 corrects the basic processing conditions with a correction value according to the difference in thickness. That is, the machining condition generator 32 generates the target values (Z1, A1), (Z2, A2), ..., (Zn, An) of the thin plate thickness for each machining position and the measurement results of the thin plate thickness for each machining position. (Z1, At1), (Z2, At2), . . . , (Zn, Atn) are compared, and the basic machining conditions are corrected for each machining position based on the difference in thickness that is the comparison result.

For example, when m is a natural number from 2 to n, the machining section from position Z (m-1) to position Zm is machined under the machining conditions of position Z (m-1). Therefore, the machining condition generator 32 corrects the basic machining conditions for each machining section. Note that the machining section from position Z (m-1) to position Zm may be machined using an intermediate value between the machining conditions at position Z (m-1) and the machining conditions at position Zm. In the following description, a case will be described in which the machining condition generator 32 corrects the basic machining conditions for each machining section.

For example, for the thin plate 2X, the first processing section is from position Z1 to Z2, the second processing section is from position Z2 to Z3, and the (n-1)th processing section is from position Z(n-1) to Zn. The machining section is set. The machining condition generator 32 corrects the basic machining conditions for each set machining section.

The machining condition generator 32 generates applied machining conditions by correcting the basic machining conditions so that the difference in thickness becomes smaller in the next machining. The applied processing conditions are processing conditions used in subsequent processing control. The machining condition generator 32 sends the applied machining conditions, which are the corrected machining conditions, to the machining control device 9. Thereby, the machining control device 9 uses the applied machining conditions in the next machining.

The basic processing conditions and the applied processing conditions include, for example, at least one of a target voltage, an average processing current, the number of openings, and an opening voltage. The target voltage is an average value of processing pulse voltages applied between the cutting wire portion 6a and the workpiece 2 per unit time. The average machining current is the average value of the current per unit time that is passed between the cutting wire portion 6a and the workpiece 2. The number of times of opening is the number of times that electric discharge is not performed per unit time during electric discharge machining. The open circuit voltage is the average value of voltage per unit time when the battery is open (not discharging).

In this manner, in the first embodiment, the machining condition generator 32 generates applicable machining conditions according to the machining position (machining section) and outputs the generated machining conditions to the machining control device 9. That is, the machining condition generator 32 generates applicable machining conditions such as a voltage application command corresponding to the target voltage for each machining section, and outputs the generated machining conditions to the machining control device 9. Note that the processing result collection unit 31 may acquire measurement result data measured by a thickness measuring device or the like via an existing information communication device, or may acquire measurement results manually input by an operator. You may. The measurement results collected by the processing result collection unit 31 may be acquired by any method as long as the information can specify the thickness of the thin plate 2X at each processing position.

Processing control device 9 controls at least one of drive unit 14 and processing power source 7 based on applied processing conditions. The machining control device 9 controls at least one of the drive unit 14 and the machining power source 7 so that the target voltage, average machining current, number of openings, or opening voltage is achieved as defined by the applied machining conditions.

FIG. 4 is a diagram showing the configuration of the processing condition generator according to the first embodiment. A machining condition generating device 30 including a machining condition generator 32 handles the thin plate thickness measurement results (At1, At2, . . . , Atn) for each machining position as one group of data. Further, the machining condition generation device 30 handles the target values (A1, A2, . . . , An) of the thin plate thickness for each machining position as one group of data.

The subtracter 33 calculates the difference between the target value of the thin plate thickness for each processing position (A1, A2, . . . , An) and the measurement result of the thin plate thickness for each processing position (At1, At2, . . . , Atn). The difference e is calculated and sent to the machining condition generator 32.

The processing condition generator 32 receives the difference e, which is the difference in thickness, from the subtractor 33. The machining condition generator 32 calculates the difference e[i] inputted this time (i-th (i is a natural number)) and the difference e[i-1] inputted last time ((i-1)th). is used to generate the current machining condition correction amount u[i].

Specifically, the machining condition generator 32 uses the following equation (1), which is obtained by multiplying the current difference e[i] and the previous difference e[i-1] by coefficients K1 and K2, to calculate the current difference e[i] and the previous difference e[i-1]. A processing condition correction amount u[i] is generated.

Note that z ^-1 shown in FIG. 4 corresponds to the (i-1)th difference e[i-1]. The machining condition generator 32 generates the current applied machining conditions to be output to the machining control device 9 by adding the machining condition correction amount u[i] to the basic machining conditions.

The multi-wire electric discharge machine 1 repeats machining by applying the applicable machining conditions generated by the machining condition generator 32 described above, so that the thickness of the machined thin plate 2X at each machining position is equal to the thickness of the reference thin plate 2X ( target value). Thereby, the multi-wire electric discharge machine 1 can reduce variations in the thickness of the thin plate 2X from the reference value.

When a plurality of multi-wire electrical discharge machines 1 cut out the thin plate 2X, each multi-wire electrical discharge machine 1 cuts out the thin plate 2X using common basic processing conditions. Thereby, the thicknesses of the thin plates 2X cut out by each multi-wire electric discharge machine 1 become the same thickness, and the grinding and polishing of the thin plates 2X becomes easy.

The machining condition generator 32, for example, obtains the thickness of the processed thin plate 2X at each machining position from the machining result collection unit 31 for each machining process, and generates new applied machining conditions. The thickness for each processing position may be collected for a plurality of thin plates 2X cut out in one processing. In this case, the processing result collection unit 31 collects the average value of the thicknesses of the plurality of thin plates 2X as the thickness for each processing position of the thin plate 2X.

Note that the processing condition generator 32 acquires the thickness of the thin plate 2 Processing conditions may also be generated. The number of times (generation frequency) that the machining condition generator 32 generates applied machining conditions with respect to the number of machining operations is not limited.

FIG. 5 is a flowchart illustrating a processing procedure executed by the multi-wire electric discharge machine according to the first embodiment. The machining result collection unit 31 of the multi-wire electric discharge machine 1 collects the measurement results of the thin plate thickness, which are the machining results, for each machining position (step S10).

The subtracter 33 calculates the error in the thin plate thickness from the reference value for each processing position (step S20). Specifically, the subtracter 33 calculates the difference obtained by subtracting the processing result of the thin plate thickness from the target value (reference) of the thin plate thickness for each processing position as the error of the thin plate thickness from the reference value.

The machining condition generator 32 corrects the basic machining conditions for each machining section (step S30). Specifically, the machining condition generator 32 calculates the machining condition correction amount for each machining section using the error in the thin plate thickness from the reference value. Further, the machining condition generator 32 calculates applied machining conditions for each machining section by correcting the basic machining conditions with the machining condition correction amount for each machining section. The machining condition generator 32 outputs the applied machining conditions for each machining section to the machining control device 9.

In the multi-wire electrical discharge machine 1, the processing control device 9 controls at least one of the drive unit 14 and the processing power source 7, thereby processing the workpiece 2 under the applied processing conditions for each processing section (step S40). The thickness of the thin plate 2X obtained by processing the workpiece 2 is measured at each processing position using a thickness measuring device or the like. This thickness is sent to the processing result collection section 31 as a measurement result of the thin plate thickness. The multi-wire electrical discharge machine 1 repeats calculation processing of applied machining conditions based on the measurement results of the thin plate thickness and processing of the workpiece 2 using the applied machining conditions.

By the way, in the process of slicing the workpiece 2, reducing processing variations in the sliced thin plate 2X is important for reducing the load on the subsequent grinding process and polishing process and improving the yield. Suppose that the error from the standard value of the thickness of the machined thin plate 2X is within the plane for each multi-wire electrical discharge machine due to assembly variations in the parts of the multi-wire electrical discharge machine or parts caused by the assembly worker. If there are variations, in order to reduce the variations, it is necessary for a skilled operator to adjust the machining conditions for each multi-wire electric discharge machine, which requires a great deal of experience and significant time.

On the other hand, in the multi-wire electric discharge machine 1 according to the first embodiment, the error from the reference value of the thickness of the machined thin plate 2X does not vary within the plane, so there is no need for the operator to adjust the machining conditions.

In addition, if the thickness error of the processed thin plate 2X from the standard value varies within the plane, the amount of grinding and polishing of the thin plate 2X must be adjusted in order to absorb the processing variation of the thin plate 2X. Must be. Therefore, the load in the grinding process and polishing process increases.

On the other hand, in the multi-wire electric discharge machine 1 of the first embodiment, the error from the reference value of the thickness of the machined thin plate 2X does not vary within the plane, so it is possible to keep the load in the grinding process and polishing process small. can.

Note that the machining condition generation device 30 may be placed within the machining control device 9. FIG. 6 is a diagram showing another configuration example of the machining control device included in the multi-wire electrical discharge machine according to the first embodiment.

The processing control device 9A includes a processing condition generation device 30 and a control section 35. The control unit 35 has the same functions as the processing control device 9. The multi-wire electric discharge machine 1 performs the same processing even when the machining condition generation device 30 is placed inside the machining control device 9 as when the machining condition generation device 30 is placed outside the machining control device 9. Execute.

Here, the hardware configurations of the machining condition generation device 30 and the machining control devices 9 and 9A will be explained. Note that since the machining condition generation device 30 and the machining control devices 9 and 9A have similar hardware configurations, the hardware configuration of the machining condition generation device 30 will be described here.

FIG. 7 is a diagram illustrating an example of a hardware configuration for realizing the machining condition generation device according to the first embodiment. The processing condition generation device 30 can be realized by an input device 300, a processor 100, a memory 200, and an output device 400. An example of the processor 100 is a CPU (Central Processing Unit, also referred to as a central processing unit, processing unit, arithmetic unit, microprocessor, microcomputer, or DSP (Digital Signal Processor)) or a system LSI (Large Scale Integration). Examples of the memory 200 are RAM (Random Access Memory) and ROM (Read Only Memory).

The machining condition generation device 30 is realized by the processor 100 reading and executing a computer-executable processing program stored in the memory 200 for executing the operations of the machining condition generation device 30. The processing program, which is a program for executing the operations of the machining condition generation device 30, can also be said to cause a computer to execute the procedure or method of the machining condition generation device 30.

The processing program executed by the machining condition generation device 30 has a module configuration including the function of the machining result collection section 31, the function of the machining condition generator 32, and the function of the subtractor 33. The function, the function of the machining condition generator 32, and the function of the subtractor 33 are loaded onto the main memory, and the function of the machining result collection unit 31, the function of the machining condition generator 32, and the function of the subtracter 33 are loaded onto the main memory. generated on the device.

The input device 300 receives measurement results (Z1, At1), (Z2, At2), . . . , (Zn, Atn) from the thickness measuring device and sends them to the processor 100. Memory 200 stores processing programs and the like. Furthermore, the memory 200 is used as a temporary memory when the processor 100 executes various processes. The output device 400 outputs the applied machining conditions to the machining control device 9.

The processing program may be provided as a computer program product by being stored in a computer readable storage medium in an installable or executable format file. Further, the processing program may be provided to the processing condition generation device 30 via a network such as the Internet. Note that some of the functions of the machining condition generation device 30 may be realized by dedicated hardware such as a dedicated circuit, and some may be realized by software or firmware.

In this way, in the first embodiment, the machining condition generation device 30 corrects the basic machining conditions based on the difference between the target value, which is the standard thickness value for each machining position of the thin plate 2X, and the thickness measurement result. This generates the applicable machining conditions. The processing control device 9 controls at least one of the drive unit 14 and the processing power source 7 using the applied processing conditions during the next processing. Thereby, the multi-wire electrical discharge machine 1 can suppress variations in the thickness of the machined thin plate 2X from the reference value within the plane.

Further, the machining condition generation device 30 generates a multi-wire electric discharge machine based on the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) of the thin plate 2X machined with the multi-wire electrical discharge machine 1. Machining conditions applicable to the wire electrical discharge machine 1 are calculated. As a result, even if there are multiple multi-wire electrical discharge machines 1, the error from the reference value of the thickness of the thin plate 2X machined by each multi-wire electrical discharge machine 1 is within the plane of each multi-wire electrical discharge machine Variations can be suppressed.

Embodiment 2.
Next, Embodiment 2 will be described using FIG. 8. In the second embodiment, applicable machining conditions are generated for a plurality of multi-wire electrical discharge machines.

FIG. 8 is a diagram showing the configuration of an electrical discharge machining system according to the second embodiment. The electrical discharge machining system 50 includes a plurality of multi-wire electrical discharge machines 1X ₁ to 1X _N (N is a natural number of 2 or more) of the same model and a host controller 40.

Each of the multi-wire electrical discharge machines 1X ₁ to 1X _N includes components other than the machining condition generation device 30 among the components included in the multi-wire electrical discharge machine 1 described in FIG. That is, each of the multi-wire electric discharge machines 1X ₁ to 1X _N includes a cutting wire section 6a, guide rollers 3a to 3d, a drive unit 14, a machining power source 7, a machining control device 9, and the like.

In the second embodiment, the multi-wire electrical discharge machine 1X ₁ is the first multi-wire electrical discharge machine, and the multi-wire electrical discharge machines 1X ₂ to 1X _N are the second multi-wire electrical discharge machines. The workpiece 2 machined by the multi-wire electrical discharge machine 1X ₁ is the first workpiece, and the workpiece 2 machined by the multi-wire electrical discharge machine 1X ₂ to 1X _N is the second workpiece. .

The cutting wire section _6a , guide rollers 3a to 3d, drive unit 14, machining power source 7, and machining control device 9 of the multi-wire electrical discharge machine 1X 1 are connected to the first cutting wire section, the first guide roller, and the first guide roller, respectively. They are a first drive unit, a first processing power source, and a first processing control device.

The cutting wire portion 6a, guide rollers 3a to 3d, drive unit 14, machining power source 7, and machining control device 9 of the multi-wire electric discharge machine 1X ₂ to 1X _N are the second cutting wire portion and the second guide, respectively. They are a roller, a second drive unit, a second processing power source, and a second processing control device.

For example, semiconductor wafers are sometimes produced on a scale of tens of thousands per month. However, since the size of a semiconductor ingot is limited, only tens to hundreds of semiconductor wafers can be cut from one ingot. Therefore, in order to process the target production quantity, semiconductor ingots must be processed by multiple multi-wire electrical discharge machines 1X ₁ to 1X _N in the semiconductor wafer slicing process to ensure monthly production volume. be done. Even when a plurality of multi-wire electrical discharge machines 1X ₁ to 1X _N are used, it is desirable to reduce variations in the thickness of the thin plate 2X from a reference value for each processing position.

In the second embodiment, when a plurality of multi-wire electrical discharge machines 1X ₁ to 1X _N are used, the host controller 40 calculates applicable machining conditions for each multi-wire electrical discharge machine 1X ₁ to 1X _N. This also reduces the thickness variation from the reference value for each processing position of the thin plate 2X.

The host controller 40 is connected to the multi-wire electrical discharge machines 1X ₁ to 1X _N. The upper controller 40 includes machining condition generation devices 30 ₂ to 30 _N and a machining condition distribution section 43.

Each of the machining condition generation devices 30 ₂ to 30 _N has the same function as the machining condition generation device 30. That is, each of the machining condition generation devices 30 ₂ to 30 _N includes a machining result collection section 31, a machining condition generator 32, and a subtractor 33.

The machining condition generating devices 30 ₂ to 30 _N are connected to the multi-wire electrical discharge machines 1X ₁ to 1X _N , respectively. The multi-wire electric discharge machine 1X ₁ processes the workpiece 2 using basic processing conditions. Therefore, the host controller 40 does not include the machining condition generation device 30 ₁ .

The machining condition generation devices 30 ₂ to 30 _N collect the thin plate thickness for each processing position of the thin plate 2X machined by the multi-wire electric discharge machine 1X ₁ , and set this thin plate thickness as the target value of the thin plate thickness.

Further, the machining condition generation devices 30 ₂ to 30 _N collect the thin plate thickness for each machining position of the thin plate 2X machined by the multi-wire electrical discharge machines 1X ₂ to _{1X N} , and Calculate the applicable processing conditions for each _N. That is, the machining condition generation device 30 _M (M is a natural number from 2 to N) collects the thin plate thickness for each machining position of the thin plate 2X machined by the multi-wire electrical discharge machine 1X _M , _and Calculate the applicable processing conditions used. The machining condition generation device _30M sets the thin plate thickness at each machining position of the thin plate 2X machined by the multi-wire electric discharge machine _1X1 as a target value of the thin plate thickness, and sets the thin plate thickness at each machining position of the thin plate 2X machined by the multi-wire electric discharge machine _1XM . The applicable processing conditions are calculated using the thickness of each thin plate as the measurement result.

The thin plate 2X machined by the multi-wire electric discharge machine 1X _M is the first thin plate, and the thin plate 2X machined by the multi-wire electric discharge machine 1X ₁ is the second thin plate. In addition, the first measurement result is the measurement result of the thin plate thickness at each processing position of the thin plate 2X machined by the multi-wire electrical discharge machine _{1X M.} The measurement result of the thin plate thickness is the second measurement result.

The machining condition distribution unit 43 transmits the applicable machining conditions calculated by the machining condition generation device _30M to the multi-wire electrical discharge machine _1XM . Note that a configuration may also be adopted in which the upper controller 40 includes one machining result collection section 31 and each of the machining condition generation devices 30 ₂ to 30 _N does not include the machining result collection section 31. In this case, one machining result collection unit 31 collects the thin plate thickness for each machining position of the thin plate 2X machined by the multi-wire electric discharge machines 1X ₁ to 1X _N , and sends it to each machining condition generation device 30 ₂ to 30 _N. Send. That is, when the machining result collection unit 31 collects the thin plate thickness for each machining position of the thin plate 2X machined by the multi-wire electric discharge machine 1X _M , the machining result collection unit 31 uses this thin plate thickness to generate machining conditions corresponding to the multi-wire electric discharge machine 1X _M. Send to device _30M . Further, when the machining result collection unit 31 collects the thin plate thickness for each machining position of the thin plate _2X machined by the multi-wire electric discharge machine ₁ Send.

In this way, in the second embodiment, the target value (reference value) of the thin plate thickness used by the machining condition generation devices 30 ₂ to 30 _N is set for each machining position of the thin plate 2X machined by the multi-wire electrical discharge machine 1X ₁ . The thickness of the plate is thin. That is, the measurement results of the thin plate thickness for each processing position of the thin plate 2X processed by the processing condition generation device 30 ₁ are the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn). In some cases, the machining condition generation devices 30 ₂ to 30 _N convert the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) into target values (Z1, A1), (Z2 , A2), ..., (Zn, An).

As a result, the thickness of the thin plate 2X processed by the multi-wire electrical discharge machine 1X ₂ to 1X _N at each processing position approaches the thickness of the thin plate 2X processed at each processing position by the multi-wire electrical discharge machine 1X _1. . In this way, the electrical discharge machining system 50 applies the machining result of one multi-wire electrical discharge machine 1X ₁ among the plurality of multi-wire electrical discharge machines 1X ₁ to 1X _N as the thickness of the thin plate 2X serving as a reference. The machining results of multiple multi-wire electrical discharge machines 1X ₁ to 1X _N approach the machining results of the standard multi-wire electrical discharge machine 1X ₁ . That is, it is possible to reduce variations in thickness from the reference value of the thin plate 2X machined by a plurality of multi-wire electrical discharge machines 1X ₁ to 1X _N.

Note that, like the multi-wire electrical discharge machine ₁ , the multi-wire electrical discharge machine 1 Based on this, the applicable processing conditions may be calculated. In this case, the machining results of the multi-wire electric discharge machines 1X ₁ to 1X _N approach the target values (Z1, A1), (Z2, A2), . . . , (Zn, An).

Even when multiple multi-wire electrical discharge machines 1X ₁ to 1X _N cut out a thin plate 2X, the thickness variation from the standard value of the thin plate 2X machined by the multi-wire electrical discharge machines 1X ₁ to 1X _N can be reduced. It is no longer necessary for a skilled worker to adjust the machining conditions for each multi-wire electrical discharge machine 1X ₁ to 1X _N. Further, since the error from the standard value of the thickness of the thin plate 2X machined by the multi-wire electric discharge machines 1X ₁ to 1X _N does not vary within the plane, the load in the grinding process and polishing process can be kept small.

Note that the processing condition generation device 30 may be placed outside the upper controller 40. For example, the machining result collection unit 31 and the machining condition generator 32 may be arranged in each of the multi-wire electrical discharge machines 1X ₂ to 1X _N. Further, the machining result collection unit 31 may be disposed in the host controller 40, and the machining condition generator 32 may be disposed in each of the multi-wire electrical discharge machines 1X ₂ to 1X _N.

As described above, according to the second embodiment, the machining result of one multi-wire electrical discharge machine 1X 1 among the plurality of multi-wire electrical discharge machines 1X ₁ to _{1X N} is applied as the thickness of the thin plate 2X serving as the reference. Even when a plurality of multi-wire electric discharge machines 1X ₁ to 1X _N cut out the thin plate 2X, it is possible to suppress variations in the thickness of the machined thin plate 2X from the reference value within the plane.

The configurations shown in the embodiments above are merely examples, and can be combined with other known techniques, or can be combined with other embodiments, within the scope of the gist. It is also possible to omit or change part of the configuration.

1, 1X ₁ to 1X _N multi-wire electric discharge machine, 2 workpiece, 2X thin plate, 3a to 3d guide roller, 4 wire bobbin, 5 wire discharge roller, 6 wire electrode, 6a cutting wire section, 6b power supply wire section, 7 Processing power supply, 8 Processing power supply unit, 9, 9A Processing control device, 10 Ground electrode, 11 Cable, 12 Power supply, 13 Power supply unit, 14 Drive unit, 15 Processing state detection device, 16 Processing state detection unit, 17 Wire bobbin drive part, 18 guide roller drive unit, 30, 30 ₁ to 30 _N machining condition generation device, 31 machining result collection unit, 32 machining condition generator, 33 subtractor, 35 control unit, 40 host controller, 43 machining condition distribution unit, 50 electrical discharge machining system, 100 processor, 200 memory, 300 input device, 400 output device.

Claims (9)

a cutting wire section in which wire electrodes are wound around a plurality of guide rollers and arranged in parallel to face the workpiece;
a drive unit that adjusts the distance between the workpiece and the cutting wire unit;
a processing power source that applies a pulse voltage between the workpiece and the cutting wire section;
a processing control device that controls the drive unit and the processing power source;
Processing conditions to be applied to the next processing based on the measurement result of the thin plate thickness, which is the thickness at each processing position in the processing surface of the thin plate cut out in the past by processing the workpiece with the cutting wire part. a machining condition generation device that generates applied machining conditions,
Equipped with
The processing condition generation device corrects the basic processing conditions, which are basic processing conditions, based on the difference between the target value, which is a reference value of the thickness of each processing position of the thin plate, and the measurement result. Generate processing conditions,
The processing control device controls at least one of the drive unit and the processing power source using the applied processing conditions during the next processing.
A multi-wire electrical discharge machine characterized by: The target value is a measurement result of the thickness of a thin plate machined by another multi-wire electrical discharge machine of the same model at each processing position.
The multi-wire electric discharge machine according to claim 1, characterized in that: The basic processing conditions include a target voltage that is an average value of pulse voltage per unit time applied between the cutting wire section and the workpiece, and a voltage between the cutting wire section and the workpiece. the average machining current, which is the average value of the current per unit time that flows through the discharge machining, the number of openings, which is the number of times that discharge does not occur per unit time during electrical discharge machining, and the opening number, which is the average value of the voltage per unit time when opening. including at least one of a voltage;
The processing condition generation device generates the applicable processing conditions by correcting at least one of the target voltage, the average processing current, the number of openings, and the opening voltage included in the basic processing conditions. ,
The multi-wire electric discharge machine according to claim 1 or 2, characterized in that: a drive unit that adjusts a distance between a cutting wire section in which wire electrodes are wound around a plurality of guide rollers and arranged in parallel to face the workpiece, and the workpiece and the cutting wire section; a control unit that controls a processing power source that applies a pulse voltage between the
Processing conditions to be applied to the next processing based on the measurement result of the thin plate thickness, which is the thickness at each processing position in the processing surface of the thin plate cut out in the past by processing the workpiece with the cutting wire part. Equipped with a machining condition generation device that generates applicable machining conditions,
The processing condition generation device corrects the basic processing conditions, which are basic processing conditions, based on the difference between the target value, which is a reference value of the thickness of each processing position of the thin plate, and the measurement result. Generate processing conditions,
The control unit controls at least one of the drive unit and the processing power source using the applied processing conditions during the next processing.
A processing control device characterized by: Thickness at each processing position within the processing surface of a thin plate that has been cut out in the past by processing the workpiece with a cutting wire made by winding wire electrodes around a plurality of guide rollers and arranging them in parallel and facing the workpiece. a processing result collection unit that collects measurement results of a certain thin plate thickness;
a machining condition generator that generates applied machining conditions that are machining conditions to be applied to the next machining based on the measurement results;
Equipped with
The machining condition generator corrects the basic machining conditions, which are the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate at each machining position, and the measurement result, thereby adjusting the application. Generate processing conditions,
A machining condition generation device characterized by: a first multi-wire electrical discharge machine that processes a first workpiece;
a second multi-wire electrical discharge machine that is the same model as the first multi-wire electrical discharge machine and that processes a second workpiece;
Based on the first measurement result of the thickness at each machining position in the machining surface of the first thin plate cut out by machining the second workpiece by the second multi-wire electric discharge machine, a machining condition generation device that generates applied machining conditions that are machining conditions to be applied to the next machining by a second multi-wire electrical discharge machine;
has
The first multi-wire electrical discharge machine includes:
a first cutting wire portion in which a first wire electrode is wound around a plurality of first guide rollers and arranged in parallel to face the first workpiece;
a first drive section that adjusts a distance between the first workpiece and the first cutting wire section;
a first processing power source that applies a pulse voltage between the first workpiece and the first cutting wire section;
a first processing control device that controls the first drive unit and the first processing power source;
Equipped with
The second multi-wire electrical discharge machine includes:
a second cutting wire section in which a second wire electrode is wound around a plurality of second guide rollers and arranged in parallel to face the second workpiece;
a second drive section that adjusts the distance between the second workpiece and the second cutting wire section;
a second processing power source that applies a pulse voltage between the second workpiece and the second cutting wire section;
a second processing control device that controls the second drive unit and the second processing power source;
Equipped with
The processing condition generation device corrects the basic processing conditions, which are the basic processing conditions, based on the difference between the target value, which is the reference value of the thickness of the first thin plate at each processing position, and the first measurement result. By doing so, the applicable processing conditions are generated,
The second processing control device controls at least one of the second drive unit and the second processing power source using the applied processing conditions during the next processing,
The target value is a second measurement result of the thickness at each processing position within the processing surface of the second thin plate cut out by processing the first workpiece with the first cutting wire section. ,
An electrical discharge machining system characterized by: further comprising a host controller connected to the first multi-wire electrical discharge machine and the second multi-wire electrical discharge machine,
The upper controller includes the processing condition generation device,
The machining condition generation device collects a second measurement result from the first multi-wire electrical discharge machine, and transmits the applied machining conditions to the second multi-wire electrical discharge machine.
The electric discharge machining system according to claim 6, characterized in that: a cutting wire section in which wire electrodes are wound around a plurality of guide rollers and arranged in parallel to face a workpiece; a drive section that adjusts a distance between the workpiece and the cutting wire section; and a drive section for adjusting the distance between the workpiece and the cutting wire section; A processing power source that applies a pulse voltage between an object and the cutting wire section, a processing control device that controls the drive section and the processing power source, and a processing control device that controls the cutting wire section when processing the workpiece. A processing condition generation device that generates applied processing conditions, which are processing conditions to be applied to the next processing, based on the measurement results of the thin plate thickness, which is the thickness at each processing position in the processing surface of the cut thin plate. The multi-wire electric discharge machine corrects the basic machining conditions, which are the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate at each machining position, and the measurement result, thereby achieving the application. a machining condition generation step for generating machining conditions;
a control step in which the multi-wire electric discharge machine controls at least one of the drive unit and the machining power source using the applied machining conditions during the next machining;
An electrical discharge machining method characterized by comprising: a cutting wire section in which wire electrodes are wound around a plurality of guide rollers and arranged in parallel to face a workpiece; a drive section that adjusts a distance between the workpiece and the cutting wire section; and a drive section for adjusting the distance between the workpiece and the cutting wire section; A processing power source that applies a pulse voltage between an object and the cutting wire section, a processing control device that controls the drive section and the processing power source, and a processing control device that controls the cutting wire section when processing the workpiece. A processing condition generation device that generates applied processing conditions, which are processing conditions to be applied to the next processing, based on the measurement results of the thin plate thickness, which is the thickness at each processing position in the processing surface of the cut thin plate. The multi-wire electric discharge machine corrects the basic machining conditions, which are the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate at each machining position, and the measurement result, thereby achieving the application. a machining condition generation step for generating machining conditions;
a control step in which the multi-wire electric discharge machine controls at least one of the drive unit and the machining power source using the applied machining conditions during the next machining;
A thin plate manufacturing method characterized by comprising:

Images