JP7422770B2 - ニューロモルフィックmemsデバイス - Google Patents
ニューロモルフィックmemsデバイス Download PDFInfo
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- 230000033001 locomotion Effects 0.000 claims description 64
- 238000007620 mathematical function Methods 0.000 claims description 30
- 230000003534 oscillatory effect Effects 0.000 claims description 15
- 230000004044 response Effects 0.000 claims description 13
- 230000005684 electric field Effects 0.000 claims description 10
- 230000006870 function Effects 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000012549 training Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 238000012886 linear function Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000010801 machine learning Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 238000002120 advanced silicon etching Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000013528 artificial neural network Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 210000002569 neuron Anatomy 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000000306 recurrent effect Effects 0.000 description 1
- 230000010255 response to auditory stimulus Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
- H03H9/02275—Comb electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/044—Recurrent networks, e.g. Hopfield networks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
- G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
- G06N3/065—Analogue means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/088—Non-supervised learning, e.g. competitive learning
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
- H03H9/02362—Folded-flexure
- H03H9/02377—Symmetric folded-flexure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2426—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators in combination with other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/07—Data storage devices, static or dynamic memories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/04—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/03—Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02299—Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/0233—Vibrating means comprising perforations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
- H03H2009/02385—Anchors for square resonators, i.e. resonators comprising a square vibrating membrane
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- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H2009/02464—Pull-in
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/2442—Square resonators
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- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
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- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
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Description
w = y'XT(XXT+λI)-1
にて算出される。ここで、y'はターゲット・ベクトル、Xはマトリックス形式の計測された特徴、λは小さな正規化パラメータ、Iは単位行列である。外部刺激がMEMSデバイスに与えられると、計測された特徴のセットはECU20によって記録することができる。算出された重みは、下記に従って、ベクトルxに位置する1セットの計測された特徴のために、出力yを生成する際に用いることができる。
y = wTx
y = wTX
ここで、wはウエイトのベクトルである。ECU20は、連続して値yをメモリに記録する。ECU20は、ポンプ電圧の振幅をセットすることができる。次に、ECU20は、ポンプ電圧の振幅を、現時点でのバイナリマスクと、過去Mタイムステップで記録された線形結合yの値との積に設定することができる。一例として、値MとNは等しくてもよい。
Claims (26)
- 構造に与えられた外部刺激に応答して、慣性要素が当該構造に対し相対的に変形もしくは移動するように、フレキシブル接続によって前記構造に結合されるよう構成された慣性要素と;
前記構造または少なくとも一つの共振モードを有する慣性要素に結合されるよう適合された少なくとも一つの共振要素と;
少なくとも一つの共振要素の前記慣性要素および/または構造に対する振動運動を計測するための少なくとも一つの伝達ユニットと;
前記共振モードにおける前記少なくとも一つの共振要素に、静電気力の強度の非線形関数である振動運度を引き起こすように、静電気力のポンプを印加するための電子制御ユニットと;
を備えた微少電子機械システム(MEMS)であって、
外部刺激による前記慣性要素の変形および/または移動が、前記ポンプの強度を変化させるように、前記少なくとも一つの共振要素は、前記慣性要素および/または前記構造に結合するよう構成されており、
前記電子制御ユニットは、計測された振動運動の数学関数である出力信号を生成して出力するよう構成されていることを特徴とする微少電子機械システム(MEMS)デバイス。 - 請求項1のMEMSデバイスにおいて、
前記少なくとも一つの共振要素は、その両端もしくは両端近傍にて挟まれたビームであることを特徴とするMEMSデバイス。 - 請求項2のMEMSデバイスにおいて、
前記慣性要素は、バネによって支持された慣性プルーフ質量であり、前記ビームからギャップを隔てて設けられていることを特徴とするMEMSデバイス。 - 請求項3のMEMSデバイスにおいて、
慣性プルーフ質量は、前記ビームに向かう方向および離れる方向である単一の並進自由度にて動くことを特徴とするMEMSデバイス。 - 請求項2~4のいずれかのMEMSデバイスにおいて、
前記ポンプは、前記少なくとも一つの共振要素および慣性要素の間の交流電界であり、当該電界は、前記少なくとも一つの共振要素と慣性要素との間に交流電圧差を印加することで生成されることを特徴とするMEMSデバイス。 - 請求項2~5のいずれかのMEMSデバイスにおいて、
計測された振動運動は、N等間隔の時間にて計測された前記ビームの振動の振幅を含むことを特徴とするMEMSデバイス。 - 請求項1のMEMSデバイスにおいて、
前駆少なくとも一つの共振要素は、その両端が慣性要素に結合されたビームであることを特徴とするMEMSデバイス。 - 請求項7のMEMSデバイスにおいて、
前記慣性要素は、その周辺部において前記構造とフレキシブルに結合されたプレートを有することを特徴とするMEMSデバイス。 - 請求項8のMEMSデバイスにおいて、
前記構造は、ギャップによって前記少なくとも一つの共振要素から分離され、前記少なくとも一つの共振要素と結合された電極を有することを特徴とするMEMSデバイス。 - 請求項7~9のいずれかのMEMSデバイスにおいて、
前記ポンプは、前記少なくとも一つの共振要素と前記電極との間の交流電界であり、当該電界は、前記少なくとも一つの共振要素と前記慣性要素との間に交流電圧差を印加することによって生成されることを特徴とするMEMSデバイス。 - 請求項1~10のいずれかのMEMSデバイスにおいて、
前記数学的関数はパラメータを有し、当該パラメータは、トレーニング段階において、出力信号とターゲット信号との間の平均誤差を最小化することで算出され、各刺激がターゲット信号に対応するような、複数の外部刺激が連続して印加されることを特徴とするMEMSデバイス。 - 請求項1~11のいずれかのMEMSデバイスにおいて、
前記数学的関数は、現在におけるまたは過去の時点からの前記振動運動のN個の計測特徴の線形結合であることを特徴とするMEMSデバイス。 - 請求項1~12のいずれかのMEMSデバイスにおいて、
前記ポンプの強度は、現在におけるまたは過去の時点からの前記出力信号の数学的関数であることを特徴とするMEMSデバイス。 - 請求項1~13のいずれかのMEMSデバイスにおいて、
前記伝達ユニットは、前記少なくとも一つの共振要素に結合されたピエゾ抵抗歪みンゲージを含むことを特徴とするMEMSデバイス。 - 請求項1~14のいずれかのMEMSデバイスにおいて、
前記ポンプは、前記少なくとも一つの共振要素と前記慣性要素の間の力であって、当該力は、振幅および周波数が時間的に正弦波的に変化することを特徴とするMEMSデバイス。 - 請求項15のMEMSデバイスにおいて、
前記正弦波的な力は、繰り返しマスクパターンにしたがう時間によって変化することを特徴とするMEMSデバイス。 - 請求項15または16のMEMSデバイスにおいて、
前記周波数は、前記少なくとも一つ共振要素の共振モードにおける固有振動数に近接した周波数であることを特徴とするMEMSデバイス。 - 外部刺激に晒されるMEMSデバイスのためのニューロモルフィック出力を生成するためのシステムにおいて、
プロセシングユニットと;
プロセシングユニットによって実行可能なコンピュータ可読プログラム指令を備え、前記プロセシングユニットに通信可能に接続された非一時的コンピュータ可読メモリとを備え、前記コンピュータ可読プログラム指令は、
前記MEMSデバイスの少なくとも一つの共振要素の、静電気力のポンプ強度の非線形関数である振動運動を引き起こすために、静電気力のポンプを印加し、
外部刺激に応答する慣性要素の変形および/または動きがポンプ強度を変化させるように、前記少なくとも一つの共振要素を、前記MEMSデバイスの慣性要素および/または構造に結合し、
前記少なくとも一つの共振要素の振動運動を計測し、
計測された振動運動の数学的関数である出力信号を生成して出力するためのものである。 - 請求項18のシステムにおいて、
静電気力のポンプの印加は、前記少なくとも一つの共振要素と前記慣性要素の間への交流電圧差の印加を含むことを特徴とするシステム。 - 請求項18のシステムにおいて、
静電気力のポンプの印加は、前記少なくとも一つの共振要素と前記構造の間への交流電圧差の印加を含むことを特徴とするシステム。 - 請求項18~20のいずれかのシステムにおいて、
前記少なくとも一つの共振要素はビームであり、振動運動の計測は、N等間隔の時間における当該ビームの振動強度の計測を含むことを特徴とするシステム。 - 請求項18~21のいずれかのシステムにおいて、
計測された振動運動の数学的関数である出力信号の生成および出力は、各刺激がターゲット信号に対応するような複数の外部刺激が連続して与えられるトレーニング期間において、出力信号とターゲット信号の間の平均誤差を最小化することによる数学的関数のパラメータの算出を含むことを特徴とするシステム。 - 請求項18~22のいずれかのシステムにおいて、
計測された振動運動の数学的関数は、1組のウエイトによって算出される、N個の振動運動の計測特徴の線形結合であることを特徴とするシステム。 - 請求項18~23のいずれかのシステムにおいて、
前記ポンプの強度は、現時点でのもしくは現在より過去の時点からの前記出力信号の数学的関数であることを特徴とするシステム。 - 請求項18~24のいずれかのシステムにおいて、
静電気力のポンプを印加することは、振幅および周波数が時間とともに正弦波的に変化する力の印加を含むことを特徴とするシステム。 - 請求項25のシステムにおいて、
前記周波数は、前記少なくとも一つの共振要素の共振モードにおける固有振動数に近接した周波数であることを特徴とするシステム。
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