JP7418327B2 - 高温耐性ニッケル合金接合部を備えた半導体処理装置及びその製造方法 - Google Patents

高温耐性ニッケル合金接合部を備えた半導体処理装置及びその製造方法 Download PDF

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JP7418327B2
JP7418327B2 JP2020529568A JP2020529568A JP7418327B2 JP 7418327 B2 JP7418327 B2 JP 7418327B2 JP 2020529568 A JP2020529568 A JP 2020529568A JP 2020529568 A JP2020529568 A JP 2020529568A JP 7418327 B2 JP7418327 B2 JP 7418327B2
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ブレント ディー エイ エリオット
グライド フッセン
ジェイソン スティーブンズ
マイケル パーカー
アルフレッド グラント エリオット
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ワトロー エレクトリック マニュファクチャリング カンパニー
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    • C04B2237/76Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2020529568A 2017-11-29 2018-11-29 高温耐性ニッケル合金接合部を備えた半導体処理装置及びその製造方法 Active JP7418327B2 (ja)

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PCT/US2018/063169 WO2019108858A1 (en) 2017-11-29 2018-11-29 Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

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TW202335174A (zh) * 2022-02-15 2023-09-01 美商瓦特洛威電子製造公司 針對半導體夾盤及加熱器之製造的固態接合方法
JP7813203B2 (ja) * 2022-08-12 2026-02-12 日本特殊陶業株式会社 保持装置
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US20250050439A1 (en) 2025-02-13
KR20230155594A (ko) 2023-11-10
US20230278123A1 (en) 2023-09-07
KR20210003079A (ko) 2021-01-11
EP3718131A4 (en) 2021-11-24
US11648620B2 (en) 2023-05-16
US20190291199A1 (en) 2019-09-26
EP3718131A1 (en) 2020-10-07
TWI825045B (zh) 2023-12-11
TW201927726A (zh) 2019-07-16
US12128494B2 (en) 2024-10-29

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