JP7407621B2 - Detection circuit equipped with heated sensor - Google Patents

Detection circuit equipped with heated sensor Download PDF

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JP7407621B2
JP7407621B2 JP2020035910A JP2020035910A JP7407621B2 JP 7407621 B2 JP7407621 B2 JP 7407621B2 JP 2020035910 A JP2020035910 A JP 2020035910A JP 2020035910 A JP2020035910 A JP 2020035910A JP 7407621 B2 JP7407621 B2 JP 7407621B2
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洋介 結城
匡弘 武田
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Chino Corp
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Description

本発明は、本体にヒータを搭載し、雰囲気中の物理量(例えば湿度、温度、ガス濃度など)を検出する加熱型センサ搭載検出回路に関するものである。 The present invention relates to a heating type sensor-equipped detection circuit that has a heater mounted on its main body and detects physical quantities in the atmosphere (for example, humidity, temperature, gas concentration, etc.).

従来、結露の発生を防止するセンサとして、例えば下記特許文献1に開示される湿度センサが知られている。特許文献1の湿度センサは、基板の一面側に、感湿膜と湿度センサ電極とからなるセンサ素子が形成され、基板の他面側における、基板を介して感湿膜と対向する部位に発熱体が形成され、この発熱体の端部に発熱体電極が形成されている。発熱体は、到達温度が予め定められており、発熱体を作動させている時は、使用環境において考えられる最高の露点以上の一定温度に湿度センサが保持されるようになっている。 BACKGROUND ART Conventionally, as a sensor for preventing the occurrence of dew condensation, a humidity sensor disclosed in Patent Document 1 listed below, for example, is known. In the humidity sensor of Patent Document 1, a sensor element consisting of a moisture-sensitive film and a humidity sensor electrode is formed on one side of a substrate, and heat is generated in a portion on the other side of the substrate that faces the humidity-sensitive film through the substrate. A heating element electrode is formed at the end of the heating element. The temperature that the heating element reaches is determined in advance, and when the heating element is operated, the humidity sensor is maintained at a constant temperature that is higher than the highest possible dew point in the usage environment.

また、結露の発生を防止する別の構成として、例えば下記特許文献2や特許文献3に開示される半導体装置が知られている。特許文献2の半導体装置では、パッケージ底面に搭載した半導体素子の主面を除きシリカゲル等の乾燥剤と暗色顔料を充填したシリコーン製のゲル状吸湿性樹脂を滴下塗布している。また、特許文献3の半導体装置では、透明窓を有する半導体受光素子の内部に遮光性除湿部材を設けている。 Further, as another structure for preventing the occurrence of dew condensation, semiconductor devices disclosed in, for example, Patent Document 2 and Patent Document 3 listed below are known. In the semiconductor device of Patent Document 2, a gel-like hygroscopic resin made of silicone filled with a desiccant such as silica gel and a dark pigment is applied dropwise to the entire surface of the semiconductor element mounted on the bottom surface of the package except for the main surface. Further, in the semiconductor device of Patent Document 3, a light-shielding dehumidifying member is provided inside a semiconductor light receiving element having a transparent window.

特開2002-039983号公報Japanese Patent Application Publication No. 2002-039983 特開2004-022928号公報JP2004-022928A 特開2011-151412号公報Japanese Patent Application Publication No. 2011-151412

しかしながら、上述した特許文献1に開示される構成では、センサ素子とは別に発熱体や発熱体電極を基板に形成する必要があり、構成部品が増えるだけでなく、発熱体を別途設けるための余分なスペースが必要となる問題がある。 However, in the configuration disclosed in Patent Document 1 mentioned above, it is necessary to form a heating element and a heating element electrode on the substrate separately from the sensor element, which not only increases the number of component parts but also increases the number of components required to separately provide the heating element. The problem is that a large amount of space is required.

また、上述した特許文献2や特許文献3に開示される構成では、経年劣化などにより長期間効果を得るのが難しいという問題がある。 Furthermore, the configurations disclosed in Patent Document 2 and Patent Document 3 described above have a problem in that it is difficult to obtain long-term effects due to aging deterioration and the like.

そこで、本発明は上記問題点に鑑みてなされたものであって、加熱型センサを有効利用してプリント配線板の結露の発生を防止することができる加熱型センサ搭載検出回路を提供することを目的としている。 Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a detection circuit equipped with a heating type sensor that can effectively utilize a heating type sensor to prevent the occurrence of dew condensation on a printed wiring board. The purpose is

上記目的を達成するため、本発明の請求項1に記載された加熱型センサ搭載検出回路は、ヒータを搭載してプリント配線板上に配置され、雰囲気中の湿度を検出する湿度センサを有する加熱型センサと、
前記プリント配線板の温度を検出する監視用温度センサと、
前記湿度センサにて検出した湿度と前記監視用温度センサにて検出した温度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備え
前記監視用温度センサが前記加熱型センサと熱的に分離された状態で前記プリント配線板上に配置されることを特徴とする。
In order to achieve the above object, the heating type sensor equipped detection circuit according to claim 1 of the present invention is provided with a heating type sensor mounted detection circuit equipped with a heater and arranged on a printed wiring board, and which has a humidity sensor for detecting humidity in the atmosphere. type sensor,
a monitoring temperature sensor that detects the temperature of the printed wiring board;
A control means for calculating a dew point temperature based on the humidity detected by the humidity sensor and the temperature detected by the monitoring temperature sensor, and controlling the heater so that the temperature of the printed wiring board becomes higher than the dew point temperature. and
The monitoring temperature sensor is arranged on the printed wiring board in a state that is thermally isolated from the heating type sensor .

本発明の請求項2に記載された加熱型センサ搭載検出回路は、ヒータを搭載してプリント配線板上に配置され、雰囲気中のガスの濃度を検出するガスセンサを有する加熱型センサと、
前記プリント配線板の温度を検出する監視用温度センサと、
前記雰囲気中の湿度を検出する監視用湿度センサと、
前記監視用温度センサにて検出した温度と前記監視用湿度センサにて検出した湿度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備えたことを特徴とする。
The heating type sensor mounting detection circuit according to claim 2 of the present invention includes a heating type sensor equipped with a heater and disposed on a printed wiring board, and having a gas sensor that detects the concentration of gas in the atmosphere.
a monitoring temperature sensor that detects the temperature of the printed wiring board;
a monitoring humidity sensor that detects humidity in the atmosphere;
A dew point temperature is calculated based on the temperature detected by the monitoring temperature sensor and the humidity detected by the monitoring humidity sensor, and the heater is controlled so that the temperature of the printed wiring board becomes higher than the dew point temperature. It is characterized by comprising a control means.

本発明の請求項3に記載された加熱型センサ搭載検出回路は、ヒータを搭載してプリント配線板上に配置され、前記プリント配線板の温度を検出する温度センサを有する加熱型センサと
囲気中の湿度を検出する監視用湿度センサと、
前記温度センサにて検出した温度と前記監視用湿度センサにて検出した湿度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備えたことを特徴とする。
The heating type sensor mounting detection circuit according to claim 3 of the present invention includes a heating type sensor mounted with a heater and disposed on a printed wiring board, and having a temperature sensor for detecting the temperature of the printed wiring board ;
A monitoring humidity sensor that detects humidity in the atmosphere ,
A control means for calculating a dew point temperature based on the temperature detected by the temperature sensor and the humidity detected by the monitoring humidity sensor, and controlling the heater so that the temperature of the printed wiring board becomes higher than the dew point temperature. It is characterized by having the following.

本発明の請求項4に記載された加熱型センサ搭載検出回路は、請求項2の加熱型センサ搭載検出回路において、
前記監視用温度センサが前記加熱型センサと熱的に分離された状態で前記プリント配線板上に配置されることを特徴とする。
The heating-type sensor-equipped detection circuit according to claim 4 of the present invention is the heating-type sensor-equipped detection circuit according to claim 2 , which includes:
The monitoring temperature sensor is arranged on the printed wiring board in a state that is thermally isolated from the heating type sensor.

本発明の請求項5に記載された加熱型センサ搭載検出回路は、請求項1~4の何れかの加熱型センサ搭載検出回路において、
複数の発熱部品を含む回路部品を備え、
前記複数の発熱部品は、前記プリント配線板に対して前記複数の発熱部品の廃熱が均等に伝導するように、当該複数の発熱部品の廃熱の大きさに応じて前記プリント配線上に配置されることを特徴とする。
The heating type sensor mounted detection circuit according to claim 5 of the present invention is the heating type sensor mounted detection circuit according to any one of claims 1 to 4,
Equipped with circuit parts including multiple heat generating parts,
The plurality of heat generating components are arranged on the printed wiring board according to the magnitude of the waste heat of the plurality of heat generating components so that the waste heat of the plurality of heat generating components is evenly conducted to the printed wiring board . It is characterized by being placed.

本発明によれば、従来のような発熱体を別途配置するための余分なスペースを必要とせずに、ヒータを搭載した加熱型センサを有効利用してプリント配線板の結露の発生を防止することができる。 According to the present invention, it is possible to prevent dew condensation on a printed wiring board by effectively utilizing a heating type sensor equipped with a heater without requiring extra space for separately arranging a heating element as in the past. Can be done.

本発明に係る加熱型センサ搭載検出回路の第1実施の形態のブロック構成図である。FIG. 1 is a block configuration diagram of a first embodiment of a heating type sensor mounting detection circuit according to the present invention. 本発明に係る加熱型センサ搭載検出回路の第2実施の形態のブロック構成図である。FIG. 2 is a block configuration diagram of a second embodiment of a heating type sensor mounting detection circuit according to the present invention. 本発明に係る加熱型センサ搭載検出回路の第3実施の形態のブロック構成図である。FIG. 3 is a block configuration diagram of a third embodiment of a heating type sensor mounting detection circuit according to the present invention. (a),(b),(c)本発明に係る加熱型センサ搭載検出回路におけるプリント配線板上の発熱部品の配置例と廃熱による熱伝導の様子を示す平面図である。(a), (b), and (c) are plan views showing an example of the arrangement of heat generating components on a printed wiring board in a heating type sensor mounted detection circuit according to the present invention and a state of heat conduction by waste heat. (a),(b),(c)本発明に係る加熱型センサ搭載検出回路におけるプリント配線板上の発熱部品の他の配置例と廃熱による熱伝導の様子を示す平面図である。(a), (b), and (c) are plan views showing other examples of arrangement of heat-generating components on a printed wiring board in a heating type sensor-mounted detection circuit according to the present invention, and the state of heat conduction by waste heat. 本発明に係る加熱型センサ搭載検出回路において加熱型センサと監視用温度センサとを熱的に分離させた状態の一例を示すプリント配線板の部分平面図である。FIG. 2 is a partial plan view of a printed wiring board showing an example of a state in which a heating sensor and a monitoring temperature sensor are thermally separated in the heating sensor mounting detection circuit according to the present invention.

以下、本発明を実施するための形態について、添付した図面を参照しながら詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the attached drawings.

本発明に係る加熱型センサ搭載検出回路は、雰囲気中の物理量(湿度、ガス濃度、温度など)を検出する回路であり、本体にヒータを搭載した加熱型センサがプリント配線板上に配置され、プリント配線板の温度が露点温度より高くなるようにヒータを制御する機能を有するMEMS(Micro Electro Mechanical Systems)のデバイスとして構成されるものである。加熱型センサ搭載検出回路は、各種センサ(湿度センサ、ガスセンサ、温度センサなど)の筐体内に収容して用いられる。 The heating type sensor mounted detection circuit according to the present invention is a circuit that detects physical quantities in the atmosphere (humidity, gas concentration, temperature, etc.), and a heating type sensor with a heater mounted on the main body is arranged on a printed wiring board, It is configured as a MEMS (Micro Electro Mechanical Systems) device that has a function of controlling a heater so that the temperature of the printed wiring board is higher than the dew point temperature. The heating type sensor-equipped detection circuit is used by being housed in the housing of various sensors (humidity sensor, gas sensor, temperature sensor, etc.).

以下、加熱型センサ搭載検出回路の各実施の形態について図1~図3を参照しながら説明する。なお、図1~図3の各実施の形態において、同一の構成要素には同一番号を付して説明する。 Hereinafter, each embodiment of the heating type sensor mounted detection circuit will be described with reference to FIGS. 1 to 3. In each of the embodiments shown in FIGS. 1 to 3, the same components will be described with the same numbers.

[第1実施の形態]
図1に示すように、第1実施の形態の加熱型センサ搭載検出回路1Aは、加熱型センサ2A、監視用温度センサ4、制御手段5をプリント配線板3上に配置して概略構成される。
[First embodiment]
As shown in FIG. 1, a heating type sensor mounted detection circuit 1A according to the first embodiment is schematically configured by arranging a heating type sensor 2A, a monitoring temperature sensor 4, and a control means 5 on a printed wiring board 3. .

加熱型センサ2Aは、本体にヒータ2aを搭載し、センサが雰囲気中の絶対湿度や相対湿度を検出する湿度センサ2bで構成され、湿度センサ2bにて検出した雰囲気中の湿度情報を制御手段5に出力する。 The heating type sensor 2A includes a heater 2a mounted on the main body and a humidity sensor 2b that detects absolute humidity and relative humidity in the atmosphere, and the humidity information in the atmosphere detected by the humidity sensor 2b is transmitted to the control means 5. Output to.

監視用温度センサ4は、プリント配線板3の温度を検出する温度センサで構成され、検出した温度情報を制御手段5に出力する。 The monitoring temperature sensor 4 is composed of a temperature sensor that detects the temperature of the printed wiring board 3 and outputs detected temperature information to the control means 5.

制御手段5は、例えばCPU、ROM、RAM、計測回路などを含むマイクロコンピュータなどで構成され、露点温度算出部5aとヒータ制御部5bを備える。露点温度算出部5aは、加熱型センサ2Aの湿度センサ2bからの湿度情報と監視用温度センサ4からの温度情報に基づいて露点温度を算出する。また、ヒータ制御部5bは、監視用温度センサ4にて検出されるプリント配線板3の温度が露点温度算出部5aにて算出した露点温度より高くなるように加熱型センサ2Aのヒータ2aを制御する。 The control means 5 is composed of, for example, a microcomputer including a CPU, ROM, RAM, measurement circuit, etc., and includes a dew point temperature calculation section 5a and a heater control section 5b. The dew point temperature calculation unit 5a calculates the dew point temperature based on the humidity information from the humidity sensor 2b of the heating type sensor 2A and the temperature information from the monitoring temperature sensor 4. Furthermore, the heater control unit 5b controls the heater 2a of the heating type sensor 2A so that the temperature of the printed wiring board 3 detected by the monitoring temperature sensor 4 is higher than the dew point temperature calculated by the dew point temperature calculation unit 5a. do.

[第2実施の形態]
図2に示すように、第2実施の形態の加熱型センサ搭載検出回路1Bは、加熱型センサ2B、監視用温度センサ4、監視用湿度センサ6、制御手段5をプリント配線板3上に配置して概略構成される。
[Second embodiment]
As shown in FIG. 2, the heating type sensor mounted detection circuit 1B of the second embodiment includes a heating type sensor 2B, a monitoring temperature sensor 4, a monitoring humidity sensor 6, and a control means 5 arranged on a printed wiring board 3. It is roughly configured as follows.

加熱型センサ2Bは、本体にヒータ2aを搭載し、センサが雰囲気中のガス(例えば水素、酸素、二酸化炭素など)の濃度を検出するガスセンサ2cで構成され、ガスセンサ2cにて検出した雰囲気中のガス濃度情報を制御手段5に出力する。 The heating type sensor 2B includes a heater 2a mounted on the main body and a gas sensor 2c that detects the concentration of gas (for example, hydrogen, oxygen, carbon dioxide, etc.) in the atmosphere. The gas concentration information is output to the control means 5.

監視用温度センサ4は、プリント配線板3の温度を検出する温度センサで構成され、検出した温度情報を制御手段5に出力する。 The monitoring temperature sensor 4 is composed of a temperature sensor that detects the temperature of the printed wiring board 3 and outputs detected temperature information to the control means 5.

監視用湿度センサ6は、雰囲気中の湿度(相対湿度)を検出する湿度センサで構成され、検出した湿度情報を制御手段5に出力する。 The monitoring humidity sensor 6 is composed of a humidity sensor that detects the humidity (relative humidity) in the atmosphere, and outputs the detected humidity information to the control means 5.

制御手段5は、例えばCPU、ROM、RAM、計測回路などを含むマイクロコンピュータなどで構成され、露点温度算出部5aとヒータ制御部5bを備える。露点温度算出部5aは、監視用温度センサ4からの温度情報と監視用湿度センサ6からの湿度情報に基づいて露点温度を算出する。また、ヒータ制御部5bは、監視用温度センサ4にて検出されるプリント配線板3の温度が露点温度算出部5aにて算出した露点温度より高くなるように加熱型センサ2Bのヒータ2aを制御する。 The control means 5 is composed of, for example, a microcomputer including a CPU, ROM, RAM, measurement circuit, etc., and includes a dew point temperature calculation section 5a and a heater control section 5b. The dew point temperature calculation unit 5a calculates the dew point temperature based on the temperature information from the monitoring temperature sensor 4 and the humidity information from the monitoring humidity sensor 6. Furthermore, the heater control unit 5b controls the heater 2a of the heating type sensor 2B so that the temperature of the printed wiring board 3 detected by the monitoring temperature sensor 4 is higher than the dew point temperature calculated by the dew point temperature calculation unit 5a. do.

[第3実施の形態]
図3に示すように、第3実施の形態の加熱型センサ搭載検出回路1Cは、加熱型センサ2C、監視用湿度センサ6、制御手段5をプリント配線板3上に配置して概略構成される。
[Third embodiment]
As shown in FIG. 3, a heating type sensor mounted detection circuit 1C according to the third embodiment is schematically configured by arranging a heating type sensor 2C, a monitoring humidity sensor 6, and a control means 5 on a printed wiring board 3. .

加熱型センサ2Cは、本体にヒータ2aを搭載し、センサがプリント配線板3の温度を検出する温度センサ2dで構成され、温度センサ2dにて検出したプリント配線板3の情報を制御手段5に出力する。 The heating type sensor 2C includes a heater 2a mounted on the main body and a temperature sensor 2d that detects the temperature of the printed wiring board 3, and transmits information about the printed wiring board 3 detected by the temperature sensor 2d to the control means 5. Output.

監視用湿度センサ6は、雰囲気中の湿度(相対湿度)を検出する湿度センサで構成され、検出した湿度情報を制御手段5に出力する。 The monitoring humidity sensor 6 is composed of a humidity sensor that detects the humidity (relative humidity) in the atmosphere, and outputs the detected humidity information to the control means 5.

制御手段5は、例えばCPU、ROM、RAM、計測回路などを含むマイクロコンピュータなどで構成され、露点温度算出部5aとヒータ制御部5bを備える。露点温度算出部5aは、加熱型センサ2Cの温度センサ2dからの温度情報と監視用湿度センサ6からの湿度情報に基づいて露点温度を算出する。また、ヒータ制御部5bは、加熱型センサ2Cの温度センサ2dにて検出されるプリント配線板3の温度が露点温度算出部5aにて算出した露点温度より高くなるように加熱型センサ2Cのヒータ2aを制御する。 The control means 5 is composed of, for example, a microcomputer including a CPU, ROM, RAM, measurement circuit, etc., and includes a dew point temperature calculation section 5a and a heater control section 5b. The dew point temperature calculating section 5a calculates the dew point temperature based on the temperature information from the temperature sensor 2d of the heating type sensor 2C and the humidity information from the monitoring humidity sensor 6. Further, the heater control unit 5b controls the heater of the heating type sensor 2C so that the temperature of the printed wiring board 3 detected by the temperature sensor 2d of the heating type sensor 2C is higher than the dew point temperature calculated by the dew point temperature calculation unit 5a. 2a.

以上説明した第1乃至第3実施の形態の加熱型センサ搭載検出回路1A,1B,1Cのプリント配線板3上には、共通の構成として、複数の発熱部品7a(例えば電源、CPUなどのIC)を含む回路部品7が配置される。 On the printed wiring board 3 of the heating type sensor mounted detection circuits 1A, 1B, 1C of the first to third embodiments described above, a plurality of heat generating parts 7a (for example, a power supply, an IC such as a CPU, etc. ) are arranged.

ここで、加熱型センサ2A,2B,2Cや各発熱部品7aの廃熱の大きさが略同等であれば、図4(a)~(c)に示すように、加熱型センサ2A,2B,2Cや各発熱部品7aをプリント配線板3の長手方向に等間隔に配置するのが好ましい。これに対し、加熱型センサ2A,2B,2Cや各発熱部品7aの廃熱の大きさが異なる場合には、図5(a)~(c)に示すように、プリント配線板3に対して加熱型センサ2A,2B,2Cや各発熱部品7aの廃熱が均等に伝導するように、加熱型センサ2A,2B,2Cや各発熱部品7aの廃熱の大きさに応じてプリント配線板3上に加熱型センサ2A,2B,2Cや各発熱部品7aを配置する間隔を決めるのが好ましい。これにより、加熱型センサ2A,2B,2Cや発熱部品7aの廃熱によりプリント配線板3全体を満遍なく加熱することができる。また、加熱型センサ2A,2B,2Cや発熱部品7Aの廃熱によってプリント配線板3を加熱する際に、プリント配線板3上の導体(配線やアースなどの導体)を利用すれば、より早く加熱型センサ2A,2B,2Cや発熱部品7Aの廃熱をプリント配線板3全体に広げることができ、より効果的である。 Here, if the magnitude of waste heat of the heating type sensors 2A, 2B, 2C and each heat generating component 7a is approximately the same, as shown in FIGS. 4(a) to (c), the heating type sensors 2A, 2B, 2C, 2C and each heat generating component 7a are preferably arranged at equal intervals in the longitudinal direction of the printed wiring board 3. On the other hand, when the magnitude of waste heat of the heating type sensors 2A, 2B, 2C and each heat generating component 7a is different, as shown in FIGS. 5(a) to 5(c), In order to evenly conduct the waste heat of the heating type sensors 2A, 2B, 2C and each of the heat generating parts 7a, the printed wiring board 3 is adjusted according to the size of the waste heat of the heating type sensors 2A, 2B, 2C and each of the heat generating parts 7a. It is preferable to decide the intervals at which the heating type sensors 2A, 2B, 2C and each heat generating component 7a are arranged above. Thereby, the entire printed wiring board 3 can be heated evenly by the waste heat of the heating type sensors 2A, 2B, 2C and the heat generating component 7a. Furthermore, when heating the printed wiring board 3 using the waste heat of the heating type sensors 2A, 2B, 2C and the heat generating parts 7A, it is possible to heat the printed wiring board 3 more quickly by using the conductors (conductors such as wiring and grounding) on the printed wiring board 3. The waste heat from the heating type sensors 2A, 2B, 2C and the heat generating component 7A can be spread over the entire printed wiring board 3, which is more effective.

なお、図4(a)~(c)および図5(a)~(c)の斜線部分は、プリント配線板3上の加熱型センサ2A,2B,2Cや発熱部品7aによる加熱箇所である。また、加熱型センサ2A,2B,2Cや発熱部品7aによる廃熱の伝導の推移を図4(a)→図4(b)→図4(c)、図5(a)→図5(b)→図5(c)で概略的に示している。 Note that the shaded areas in FIGS. 4(a) to 4(c) and FIGS. 5(a) to 5(c) are locations heated by the heated sensors 2A, 2B, 2C and the heat generating component 7a on the printed wiring board 3. In addition, the transition of waste heat conduction by the heating type sensors 2A, 2B, 2C and the heat generating component 7a is shown in FIG. 4(a) → FIG. 4(b) → FIG. 4(c), FIG. 5(a) → FIG. )→Schematically shown in FIG. 5(c).

また、加熱型センサ2A,2B,2Cは、図4(a)~(c)ではプリント配線板3の中央に配置し、図5(a)~(c)ではプリント配線板3の端部に配置しているが、配置位置が限定されるものではなく、加熱型センサ2A,2B,2Cや各発熱部品7aの廃熱の大きさや発熱部品7aを含む回路部品7との兼ね合いでプリント配線板3の最適な位置に配置される。 In addition, the heated sensors 2A, 2B, and 2C are arranged at the center of the printed wiring board 3 in FIGS. 4(a) to (c), and at the ends of the printed wiring board 3 in FIGS. 5(a) to (c). However, the placement position is not limited, and the size of the waste heat of the heating type sensors 2A, 2B, 2C and each heat generating component 7a, and the circuit components 7 including the heat generating component 7a are taken into consideration on the printed wiring board. It is placed in the optimal position of 3.

さらに、第1実施の形態の加熱型センサ2A(湿度センサ2b)や第2実施の形態の加熱型センサ2B(ガスセンサ2c)を用いる場合には、加熱型センサ2A,2Bと監視用温度センサ4とを熱的に分離させた状態でプリント配線板3上に配置する。具体的には、図6に示すように、加熱型センサ2A,2Bの周囲のプリント配線板3にコ字状の切欠き8を形成して加熱型センサ2A,2Bと監視用温度センサ4とを熱的に分離させた状態でプリント配線板3上に配置する。これにより、加熱型センサ2A,2Bの熱が監視用温度センサ4に直接伝導されるのを低減することができる。 Furthermore, when using the heating type sensor 2A (humidity sensor 2b) of the first embodiment or the heating type sensor 2B (gas sensor 2c) of the second embodiment, the heating type sensors 2A, 2B and the monitoring temperature sensor 4 are used. are arranged on the printed wiring board 3 in a state where they are thermally separated from each other. Specifically, as shown in FIG. 6, U-shaped notches 8 are formed in the printed wiring board 3 around the heating sensors 2A, 2B to connect the heating sensors 2A, 2B and the monitoring temperature sensor 4. are placed on the printed wiring board 3 in a thermally isolated state. Thereby, direct conduction of heat from the heating type sensors 2A and 2B to the monitoring temperature sensor 4 can be reduced.

[具体例]
湿度センサ2bを用いた加熱型センサ2Aでは、外形寸法20mm×90mm×1.6mmのプリント配線板3を使用した場合、加熱型センサ2Aが最大500℃程度に加熱され、プリント配線板3の加温状態は周囲温度によっても変わるが、プリント配線板3上のセンサ周辺の温度を概ね周囲温度+5℃~+15℃に保つことができる。
[Concrete example]
In the heating type sensor 2A using the humidity sensor 2b, when a printed wiring board 3 with external dimensions of 20 mm x 90 mm x 1.6 mm is used, the heating type sensor 2A is heated to a maximum of about 500°C, and the printed wiring board 3 is heated. Although the temperature condition varies depending on the ambient temperature, the temperature around the sensor on the printed wiring board 3 can be maintained at approximately +5° C. to +15° C. above the ambient temperature.

また、ガスセンサ2cを用いた加熱型センサ2Bでは、外形寸法20mm×90mm×1.6mmのプリント配線板3を使用した場合、加熱型センサ2Bが最大700℃程度に加熱され、湿度センサ2bを用いた加熱型センサ2Aと同様に、プリント配線板3の加温状態は周囲温度によっても変わるが、プリント配線板3上のセンサ周辺の温度を概ね周囲温度+5℃~+15℃に保つことができる。 In addition, in the heating type sensor 2B using the gas sensor 2c, when the printed wiring board 3 with external dimensions of 20 mm x 90 mm x 1.6 mm is used, the heating type sensor 2B is heated to a maximum of about 700°C, and the humidity sensor 2b is not used. Similar to the heated sensor 2A, the heating state of the printed wiring board 3 changes depending on the ambient temperature, but the temperature around the sensor on the printed wiring board 3 can be maintained at about +5°C to +15°C.

ところで、上述した各実施の形態において、制御手段5は、温度と湿度(相対湿度)から露点温度に換算する露点温度換算表を予め記憶しておき、各センサ(第1実施の形態では、加熱型センサ2A(湿度センサ2b)と監視用温度センサ4、第2実施の形態では、監視用温度センサ4と監視用湿度センサ5、第3実施の形態では、加熱型センサ2C(温度センサ2d)と監視用湿度センサ6)から得られる温度情報と湿度情報(相対湿度)に対応する露点温度を露点温度換算表から検索するようにしてもよい。 By the way, in each of the embodiments described above, the control means 5 stores in advance a dew point temperature conversion table for converting temperature and humidity (relative humidity) into dew point temperature, and each sensor (in the first embodiment, heating type sensor 2A (humidity sensor 2b) and monitoring temperature sensor 4; in the second embodiment, the monitoring temperature sensor 4 and monitoring humidity sensor 5; in the third embodiment, the heating type sensor 2C (temperature sensor 2d) The dew point temperature corresponding to the temperature information and humidity information (relative humidity) obtained from the monitoring humidity sensor 6) may be searched from a dew point temperature conversion table.

このように、本実施の形態によれば、従来のような発熱体を別途配置するための余分なスペースを必要とせずに、ヒータ2aを搭載した加熱型センサ2A,2B,2Cを有効利用してプリント配線板3の結露の発生を防止することができる。しかも、プリント配線板3を加熱する熱源として、ヒータ2aを搭載した加熱型センサ2A,2B,2Cだけでなく、プリント配線板3上に配置される回路部品7に含まれる発熱部品7aで消費された熱量等の廃熱を利用すれば、新たに加熱用の部品や構造的仕組みを追加することなくプリント配線板3を加熱して結露発生の防止を低コストで実現でき、省エネにもつながる。また、定常的に周囲の空気が飽和空気に近い状態であっても効果が変わらない。 As described above, according to the present embodiment, the heating type sensors 2A, 2B, and 2C equipped with the heater 2a can be effectively used without requiring extra space for separately arranging a heating element as in the conventional case. This makes it possible to prevent dew condensation on the printed wiring board 3. Moreover, the heat source for heating the printed wiring board 3 is consumed not only by the heating type sensors 2A, 2B, and 2C equipped with the heater 2a, but also by the heat generating components 7a included in the circuit components 7 arranged on the printed wiring board 3. By using waste heat such as the amount of heat generated by heating, it is possible to heat the printed wiring board 3 and prevent dew condensation at a low cost without adding new heating parts or structural mechanisms, which also leads to energy savings. Furthermore, the effect remains unchanged even if the surrounding air is constantly close to saturated air.

以上、本発明に係る加熱型センサ搭載検出回路の最良の形態について説明したが、この形態による記述及び図面により本発明が限定されることはない。すなわち、この形態に基づいて当業者等によりなされる他の形態、実施例及び運用技術などはすべて本発明の範疇に含まれることは勿論である。 Although the best mode of the heating type sensor mounted detection circuit according to the present invention has been described above, the present invention is not limited to the description and drawings based on this mode. That is, it goes without saying that all other forms, embodiments, operational techniques, etc. made by those skilled in the art based on this form are included in the scope of the present invention.

1A,1B,1C 加熱型センサ搭載検出回路
2A,2B,2C 加熱型センサ
2a ヒータ
2b 湿度センサ
2c ガスセンサ
2d 温度センサ
3 プリント配線板
4 監視用温度センサ
5 制御手段
5a 露点温度算出部
5b ヒータ制御部
6 監視用湿度センサ
7 回路部品
7a 発熱部品
8 切欠き
1A, 1B, 1C Detection circuit equipped with heating type sensor 2A, 2B, 2C Heating type sensor 2a Heater 2b Humidity sensor 2c Gas sensor 2d Temperature sensor 3 Printed wiring board 4 Monitoring temperature sensor 5 Control means 5a Dew point temperature calculation unit 5b Heater control unit 6 Humidity sensor for monitoring 7 Circuit parts 7a Heat generating parts 8 Notch

Claims (5)

ヒータを搭載してプリント配線板上に配置され、雰囲気中の湿度を検出する湿度センサを有する加熱型センサと、
前記プリント配線板の温度を検出する監視用温度センサと、
前記湿度センサにて検出した湿度と前記監視用温度センサにて検出した温度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備え
前記監視用温度センサが前記加熱型センサと熱的に分離された状態で前記プリント配線板上に配置されることを特徴とする加熱型センサ搭載検出回路。
a heating type sensor equipped with a heater and arranged on a printed wiring board and having a humidity sensor that detects humidity in the atmosphere;
a monitoring temperature sensor that detects the temperature of the printed wiring board;
A control means for calculating a dew point temperature based on the humidity detected by the humidity sensor and the temperature detected by the monitoring temperature sensor, and controlling the heater so that the temperature of the printed wiring board becomes higher than the dew point temperature. and
A detection circuit equipped with a heating type sensor, wherein the monitoring temperature sensor is arranged on the printed wiring board in a state that is thermally isolated from the heating type sensor.
ヒータを搭載してプリント配線板上に配置され、雰囲気中のガスの濃度を検出するガスセンサを有する加熱型センサと、
前記プリント配線板の温度を検出する監視用温度センサと、
前記雰囲気中の湿度を検出する監視用湿度センサと、
前記監視用温度センサにて検出した温度と前記監視用湿度センサにて検出した湿度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備えたことを特徴とする加熱型センサ搭載検出回路。
a heating type sensor equipped with a heater and arranged on a printed wiring board and having a gas sensor that detects the concentration of gas in the atmosphere;
a monitoring temperature sensor that detects the temperature of the printed wiring board;
a monitoring humidity sensor that detects humidity in the atmosphere;
A dew point temperature is calculated based on the temperature detected by the monitoring temperature sensor and the humidity detected by the monitoring humidity sensor, and the heater is controlled so that the temperature of the printed wiring board becomes higher than the dew point temperature. A detection circuit equipped with a heating type sensor, characterized in that it is equipped with a control means.
ヒータを搭載してプリント配線板上に配置され、前記プリント配線板の温度を検出する温度センサを有する加熱型センサと
囲気中の湿度を検出する監視用湿度センサと、
前記温度センサにて検出した温度と前記監視用湿度センサにて検出した湿度に基づいて露点温度を算出し、前記プリント配線板の温度が前記露点温度より高くなるように前記ヒータを制御する制御手段とを備えたことを特徴とする加熱型センサ搭載検出回路。
a heating type sensor equipped with a heater and disposed on a printed wiring board and having a temperature sensor that detects the temperature of the printed wiring board ;
A monitoring humidity sensor that detects humidity in the atmosphere ,
A control means for calculating a dew point temperature based on the temperature detected by the temperature sensor and the humidity detected by the monitoring humidity sensor, and controlling the heater so that the temperature of the printed wiring board becomes higher than the dew point temperature. A detection circuit equipped with a heating type sensor.
前記監視用温度センサが前記加熱型センサと熱的に分離された状態で前記プリント配線板上に配置されることを特徴とする請求項2に記載の加熱型センサ搭載検出回路。 3. The heating type sensor mounting detection circuit according to claim 2, wherein the monitoring temperature sensor is arranged on the printed wiring board in a state that is thermally isolated from the heating type sensor. 複数の発熱部品を含む回路部品を備え、
前記複数の発熱部品は、前記プリント配線板に対して前記複数の発熱部品の廃熱が均等に伝導するように、当該複数の発熱部品の廃熱の大きさに応じて前記プリント配線上に配置されることを特徴とする請求項1~4の何れかに記載の加熱型センサ搭載検出回路。
Equipped with circuit parts including multiple heat generating parts,
The plurality of heat generating components are arranged on the printed wiring board according to the magnitude of the waste heat of the plurality of heat generating components so that the waste heat of the plurality of heat generating components is evenly conducted to the printed wiring board . The heating type sensor-equipped detection circuit according to any one of claims 1 to 4, characterized in that:
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002039983A (en) 2000-07-21 2002-02-06 Denso Corp Humidity sensor
JP2015045546A (en) 2013-08-28 2015-03-12 富士電機株式会社 Gas detector and gas detection method
JP2016057144A (en) 2014-09-09 2016-04-21 日新電機株式会社 Humidity measuring device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002039983A (en) 2000-07-21 2002-02-06 Denso Corp Humidity sensor
JP2015045546A (en) 2013-08-28 2015-03-12 富士電機株式会社 Gas detector and gas detection method
JP2016057144A (en) 2014-09-09 2016-04-21 日新電機株式会社 Humidity measuring device

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