JP7398424B2 - Electronic board for information processing equipment - Google Patents

Description

The present invention relates to an electronic board for an information processing device.

Patent Document 1 discloses a structure in which a clip is arranged on a substrate body and a shield can is attached to the clip. A shield can covers electronic components and shields them from electromagnetic waves. According to such a configuration, it is possible to suppress performance deterioration of electronic components caused by (electromagnetic) noise.

Special Publication No. 2011-501477

In recent years, there has been an increasing demand for miniaturization of information processing devices such as notebook computers. In order to realize miniaturization of information processing devices, electronic boards are sometimes miniaturized and electronic components are concentrated in a narrow area. However, in such an arrangement where electronic components are concentrated in a narrow area, it is difficult to arrange a clip for attaching the shield can, making it difficult to adopt the conventional structure as disclosed in Patent Document 1. There was a case.

Further, in the above case, if a configuration in which a shield can is not attached to the board body is adopted, there is a possibility that the performance of adjacent electronic components may be degraded due to noise. In particular, when a communication module such as a WLAN module and a noise source component such as a memory are placed adjacent to each other, the performance of the communication module is likely to deteriorate. Therefore, in conventional electronic boards, it is difficult to arrange the communication module and the noise source component adjacent to each other, which may impede miniaturization of the electronic board.

The present invention has been made in consideration of such circumstances, and an object of the present invention is to provide an electronic board for an information processing device that can suppress the influence of noise even when a noise source component and a communication module are placed adjacent to each other.

In order to solve the above problems, an electronic board for an information processing device according to one aspect of the present invention includes a board main body, a module main body part, a first shielding member that covers the module main body part and blocks electromagnetic waves, and a first shielding member that covers the module main body part and blocks electromagnetic waves. a communication module mounted on the substrate main body; a sheet-shaped second shielding member that covers the non-shielding part and shields electromagnetic waves; a noise source component mounted on a substrate body and not covered by a member that shields electromagnetic waves, the communication module having a first opposing surface;
The noise source component has a second opposing surface, the noise source component and the communication module are adjacent to each other such that the first opposing surface and the second opposing surface face each other, and In the opposing direction in which the first opposing surface and the second opposing surface face each other, no member is disposed between the first opposing surface and the second opposing surface, and when viewed from the opposing direction, the noise The source part and the non-shielding part do not overlap each other.

According to the above aspect of the present invention, the non-shielding portion of the communication module that is particularly vulnerable to noise can be kept away from the noise source component and can be protected by the second shielding member. Thereby, it is possible to arrange the noise source component and the communication module adjacent to each other while suppressing deterioration in the performance of the communication module due to noise.

Here, the second shielding member may be a metal sheet grounded to the substrate body.

In this case, the metal sheet can reflect electromagnetic waves and protect the non-shielded portion from noise.

Further, the second shielding member may be an electromagnetic wave absorbing sheet.

In this case, the electromagnetic wave absorbing sheet can absorb electromagnetic waves and protect the non-shielded portion from noise.

The unshielded portion includes a terminal to which a cable is connected, and the communication module has a rectangular shape when viewed from a direction perpendicular to the board main body, and the communication module has a rectangular shape when viewed from a direction perpendicular to the board main body. , the terminal may be located at a corner of the communication module.

According to the above aspect of the present invention, the cable can be connected to the communication module more easily than, for example, when the terminal is located in the center of the communication module.

The communication module may also support WLAN communication standards.

According to the above aspect of the present invention, even a communication module that is susceptible to noise, such as a WLAN module, can be suitably used by suppressing performance degradation due to noise.

Furthermore, the noise source component may be a memory.

According to the above aspect of the present invention, even a component that easily generates noise, such as a memory, can be suitably used by suppressing deterioration in the performance of the communication module due to noise.

According to the above aspect of the present invention, it is possible to provide an electronic board for an information processing device that can suppress the influence of noise even if the noise source component and the communication module are placed adjacent to each other.

FIG. 1 is a diagram illustrating an example of how the electronic board for an information processing device is used according to the first embodiment of the present invention. FIG. 2 is an enlarged view of the electronic board for information processing device shown in FIG. 1 viewed from arrow II. FIG. 1 is a diagram showing an antenna module according to a first embodiment of the present invention. 3 is a sectional view taken along the line IV-IV shown in FIG. 2. FIG. FIG. 3 is a cross-sectional view showing an electronic board for an information processing device according to a second embodiment of the present invention.

(First embodiment)
Hereinafter, an information processing device electronic board 1A according to the first embodiment will be described based on the drawings.
As shown in FIG. 1, an information processing device electronic board 1A according to the present embodiment is incorporated into an information processing device 100 having a housing 110. Hereinafter, the information processing device electronic board 1A may be simply referred to as an electronic board 1A.

The information processing device 100 according to the present embodiment is a so-called clamshell notebook computer, and the housing 110 includes a first housing 111 and a second housing 112 that are rotatably connected to each other. The first housing 111 includes a keyboard, a click pad, and the like. The second housing 112 has a display. The electronic board 1A according to this embodiment is housed in a first housing 111. However, the electronic board 1A may be housed in the second housing 112. Note that the type of information processing device 100 is not limited to a notebook computer. The information processing device 100 may be, for example, a smartphone, a tablet terminal, a game console, or the like. In these cases, the housing 110 may not include the second housing 112, and the first housing 111 may have a display.

As shown in FIG. 2, the electronic board 1A according to the present embodiment includes a board main body 10, a communication module 20, a second shielding member 30, and a noise source component 40. The board body 10 has a mounting surface 10a. The communication module 20 and the noise source component 40 are mounted on the mounting surface 10a of the board body 10.

(direction definition)
Here, in this embodiment, an XYZ orthogonal coordinate system is set to explain the positional relationship of each component. The Z-axis direction is a direction perpendicular to the substrate body 10. The X-axis direction is one direction perpendicular to the Z-axis direction, and is also one direction in which the substrate main body 10 extends. The Y-axis direction is a direction perpendicular to both the Z-axis direction and the X-axis direction, and is also one direction in which the substrate body 10 extends. In this specification, the X-axis direction may be referred to as a first direction X, the Y-axis direction may be referred to as a second direction Y, and the Z-axis direction may be referred to as a perpendicular direction Z. One direction along the first direction X is referred to as the +X direction or the right direction. The direction opposite to the +X direction is referred to as the -X direction or leftward. One direction along the second direction Y is referred to as the +Y direction or upward. The direction opposite to the +Y direction is referred to as the -Y direction or downward direction. The direction from the board main body 10 toward the communication module 20 along the perpendicular direction Z is referred to as the +Z direction or the front side. The direction opposite to the +Z direction is referred to as the -Z direction or the back side. Viewing from the perpendicular direction Z is called planar view.

The board body 10 may be a multilayer board (build-up board) or a single-layer board. Note that the configuration of the substrate body 10 is not particularly limited, and may be appropriately selected from known configurations.

As shown in FIGS. 2 and 3, the communication module 20 according to this embodiment has a rectangular shape in plan view. As shown in FIG. 2, the communication module 20 according to this embodiment has a first opposing surface 20a facing leftward (noise source component 40).

The communication module 20 according to this embodiment includes a module main body portion 21, a first shielding member 22, and a pair of non-shielding portions 23 (see also FIG. 4). The module main body 21 manages electromagnetic waves transmitted and received by antennas 120A and 120B (described later).

The first shielding member 22 shields electromagnetic waves. The first shielding member 22 is made of, for example, a conductive material such as metal. As shown in FIG. 4, the first shielding member 22 according to the present embodiment has a box-like shape that is open toward the substrate body 10, and covers the module body 21 so as to accommodate it. The first shielding member 22 protects the module body 21 from (electromagnetic) noise by shielding electromagnetic waves.

As shown in FIG. 3, the non-shielding portion 23 according to the present embodiment is located at a corner C of the communication module 20 in plan view. Moreover, the non-shielding part 23 according to this embodiment includes a first terminal 23A and a second terminal 23B. The non-shielding portion 23 (terminals 23A, 23B) is not covered by the first shielding member 22 and is exposed to the outside of the communication module 20. A cable 130 is connected to the terminals 23A and 23B. Note that the number of non-shielding portions 23 and terminals 23A, 23B is not limited to the illustrated example, and may be one or three or more. Further, the non-shielding portion 23 and the terminals 23A and 23B do not need to be located at the corner C of the communication module 20.

As shown in FIGS. 1, 2, and 3, the communication module 20 according to the present embodiment is housed in a first housing 111 via a cable 130 connected to a first terminal 23A and a second terminal 23B. The first antenna 120A and the second antenna 120B are electrically connected to each other. The antennas 120A and 120B transmit and receive electromagnetic waves. For example, the first antenna 120A may be a MAIN antenna and the second antenna 120B may be an AUX antenna, or vice versa.

The communication standard supported by the communication module 20 and the antennas 120A and 120B may be, for example, WLAN (Wireless Local Area Network). In other words, the communication module 20 may be a WLAN module. However, the communication standard supported by the communication module 20 and the antennas 120A and 120B is not limited to WLAN, and may be WWAN (Wireless Wide Area Network) or other communication standards.

As shown in FIG. 4, the second shielding member 30 is a sheet-like member and shields electromagnetic waves. The second shielding member 30 according to this embodiment is a metal sheet and reflects electromagnetic waves. The second shielding member 30, which is a metal sheet, is grounded to the substrate body 10 via a grounding member G that projects from the mounting surface 10a. Thereby, charging of the second shielding member 30 is suppressed. Although the material forming the metal sheet is not particularly limited, for example, a copper sheet or an aluminum sheet can be suitably used. Further, the second shielding member 30 may have a mesh structure in which a plurality of metal wires are woven together.

The method of electrically connecting the second shielding member 30 and the grounding member G is not particularly limited, and may be appropriately selected from known methods. Further, the position where the grounding member G is arranged is not limited to the examples shown in FIGS. 2 and 4, and can be changed as appropriate as long as the second shielding member 30 can be grounded to the substrate body 10. Further, the second shielding member 30 may be directly grounded to the substrate body 10. In this case, the grounding member G may not be provided on the mounting surface 10a.

As shown in FIGS. 2 and 4, the second shielding member 30 covers the non-shielding portion 23 of the communication module 20 from the direction Z perpendicular to the plane. Further, the second shielding member 30 according to the present embodiment covers a part of the cable 130. The second shielding member 30 protects the non-shielding portion 23 and the cable 130 from noise by shielding (reflecting) electromagnetic waves. Note that the second shielding member 30 does not need to cover the cable 130.

As shown in FIG. 2, the noise source component 40 is not covered with a member that shields electromagnetic waves and is exposed to the outside of the electronic board 1A. Examples of the noise source component 40 include electronic components such as a memory, a CPU, and an SSD. The shape of the noise source component 40 according to this embodiment is rectangular in plan view. The noise source component 40 has a second opposing surface 40a facing right (towards the communication module 20).

As shown in FIG. 2, the communication module 20 and the noise source component 40 are adjacent to each other in the first direction X. More specifically, the communication module 20 and the noise source component 40 are adjacent to each other such that the first opposing surface 20a of the communication module 20 and the second opposing surface 40a of the noise source component 40 face each other in the first direction It is arranged as follows. That is, in this embodiment, the opposing direction in which the first opposing surface 20a and the second opposing surface 40a are opposed corresponds to the first direction X. Further, when viewed from the first direction X (the opposing direction), the non-shielding portion 23 of the communication module 20 and the noise source component 40 do not overlap with each other. In other words, the communication module 20 is shifted in the +Y direction with respect to the noise source component 40 so that the non-shielding part 23 and the noise source component 40 do not overlap in the first direction X.

Further, no member is disposed between the communication module 20 (first opposing surface 20a) and the noise source component 40 (second opposing surface 40a) in the first direction X. More specifically, no member is placed in area A shown in FIG. Here, region A is located between the communication module 20 (first opposing surface 20a) and the noise source component 40 (second opposing surface 40a) in the first direction It is defined as an area that overlaps both the communication module 20 and the noise source component 40. Note that examples of "members" that are not placed in area A include electronic components such as integrated circuits and wiring, shielding members that shield electromagnetic waves, and the like.

Next, the operation of the electronic board 1A for an information processing device configured as above will be explained.

In recent years, there has been an increasing demand for miniaturization of information processing devices such as notebook computers. In order to realize miniaturization of information processing devices, electronic boards are sometimes miniaturized and electronic components are concentrated in a narrow area. However, in such an arrangement where electronic components are concentrated in a narrow area, it may be difficult to arrange clips for attaching the shield can, making it difficult to adopt the conventional structure of attaching the shield can to the board body. Ta.

Further, in the above case, if a configuration in which a shield can is not attached to the board body is adopted, there is a possibility that the performance of adjacent electronic components may be degraded due to noise. In particular, when a communication module such as a WLAN module and a noise source component such as a memory are placed adjacent to each other, the performance of the communication module is likely to deteriorate. Therefore, in conventional electronic boards, it is difficult to arrange the communication module and the noise source component adjacent to each other, which may impede miniaturization of the electronic board.

In contrast, in the electronic board 1A for an information processing device according to the present embodiment, the non-shielding portion 23, which is a part of the communication module 20 that is particularly susceptible to noise, is moved away from the noise source component 40, and the second shielding member 30 is moved away from the noise source component 40. can be protected by Thereby, while the noise source component 40 and the communication module 20 are placed adjacent to each other, it is possible to suppress deterioration in the performance of the communication module 20 due to noise.

As described above, the electronic board 1A for an information processing device according to the present embodiment includes the board main body 10, the module main body 21, the first shielding member 22 that covers the module main body 21 and shields electromagnetic waves, and the first a sheet-shaped second shielding member 30 that has a non-shielding portion 23 that is not covered by the shielding member 22, covers the communication module 20 mounted on the board body 10, and the non-shielding portion 23 and shields electromagnetic waves; and a noise source component 40 that is mounted on the board body 10 and is not covered by a member that shields electromagnetic waves, the communication module 20 has a first opposing surface 20a, and the noise source component 40 has a first opposing surface 20a. , a second opposing surface 40a, the noise source component 40 and the communication module 20 are adjacent to each other such that the first opposing surface 20a and the second opposing surface 40a face each other; In the facing direction (first direction X) in which the second facing surface 40a faces, no member is disposed between the noise source component 40 and the communication module 20, and As seen, the noise source component 40 and the non-shielding portion 23 do not overlap with each other.

With this configuration, it is possible to arrange the noise source component 40 and the communication module 20 adjacent to each other, while suppressing deterioration in the performance of the communication module 20 due to noise.

Further, the second shielding member 30 is a metal sheet grounded to the substrate body 10. With this configuration, the metal sheet can reflect electromagnetic waves and protect the non-shielding portion 23 from noise.

Further, the unshielded portion 23 includes terminals 23A and 23B to which the cable 130 is connected, and the shape of the communication module 20 is rectangular when viewed from the perpendicular direction Z. 23A and 23B are located at the corner C of the communication module 20. With this configuration, the cable 130 can be connected to the communication module 20 more easily than, for example, when the terminals 23A and 23B are located in the center of the communication module 20.

Communication module 20 may also support WLAN communication standards. According to the electronic board 1A for an information processing device according to the present embodiment, even if the communication module 20 is sensitive to noise, such as a WLAN module, performance deterioration due to noise can be suppressed and the communication module 20 can be suitably used.

Moreover, the noise source component 40 may be a memory. According to the electronic board 1A for an information processing device according to the present embodiment, even if an electronic component, such as a memory, is likely to generate noise, it is possible to suppress the performance deterioration of the communication module 20 due to noise, and to use it suitably. .

(Second embodiment)
Next, a second embodiment will be described, which has the same basic configuration as the first embodiment. Therefore, similar configurations will be given the same reference numerals and their explanations will be omitted, and only the different points will be explained.

In the electronic board 1B for an information processing device according to this embodiment, the second shielding member 30 is an electromagnetic wave absorbing sheet. Furthermore, as shown in FIG. 5, a grounding member G for grounding the second shielding member 30 to the substrate body 10 is not provided on the mounting surface 10a.

The second shielding member 30, which is an electromagnetic wave absorbing sheet, shields electromagnetic waves by absorbing and attenuating the electromagnetic waves. Thereby, the second shielding member 30 can protect the non-shielding portion 23 and the cable 130 from noise.

Therefore, the electronic board 1B for an information processing device according to the present embodiment, like the electronic board 1A for an information processing device according to the first embodiment, has the noise source component 40 and the communication module 20 adjacent to each other, and the noise source component 40 and the communication module 20 are adjacent to each other. Deterioration in the performance of the module 20 can be suppressed.

Further, since the communication module 20 is an electromagnetic wave absorbing sheet, there is no need to provide a structure (for example, a grounding member G, etc.) for grounding the communication module 20 to the substrate body 10 on the mounting surface 10a. Therefore, the configuration of the information processing device electronic board 1B can be made simpler.

Note that the technical scope of the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention.

For example, the direction in which the first facing surface 20a of the communication module 20 and the second facing surface 40a of the noise source component 40 face each other may be inclined with respect to the first direction X.

In addition, the components in the above-described embodiments may be replaced with well-known components as appropriate without departing from the spirit of the present invention, and the above-described embodiments and modifications may be combined as appropriate.

1A, 1B... Electronic board (electronic board for information processing device) 10... Board body 20... Communication module 20a... First opposing surface 21... Module main body part 22... First shielding member 23... Non-shielding part 23A... First terminal ( Terminal) 23B...Second terminal (terminal) 30...Second shielding member 40...Noise source component 40a...Second opposing surface 130...Cable C...Corner part

Claims (6)

The board body,
A communication module that includes a module main body, a first shielding member that covers the module main body and shields electromagnetic waves, and a non-shielding part that is not covered by the first shielding member, and that is mounted on the substrate main body. and,
a sheet-shaped second shielding member that covers the non-shielding portion and shields electromagnetic waves;
a noise source component mounted on the substrate body and not covered by a member that shields electromagnetic waves;
The communication module has a first opposing surface,
The noise source component has a second opposing surface,
The noise source component and the communication module are adjacent to each other such that the first opposing surface and the second opposing surface face each other,
In the opposing direction in which the first opposing surface and the second opposing surface face each other, no member is disposed between the first opposing surface and the second opposing surface,
The electronic board for an information processing device, wherein the noise source component and the non-shielding part do not overlap each other when viewed from the opposing direction. The electronic board for an information processing device according to claim 1, wherein the second shielding member is a metal sheet grounded to the board main body. The electronic board for an information processing device according to claim 1, wherein the second shielding member is an electromagnetic wave absorbing sheet. The unshielded portion includes a terminal to which a cable is connected,
The communication module has a rectangular shape when viewed from a direction perpendicular to the substrate main body,
The electronic board for an information processing device according to any one of claims 1 to 3, wherein the terminal is located at a corner of the communication module when viewed from a direction perpendicular to the board main body. The electronic board for an information processing device according to any one of claims 1 to 4, wherein the communication module supports WLAN communication standards. The electronic board for an information processing device according to any one of claims 1 to 5, wherein the noise source component is a memory.

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