JP7386275B2 - Solution processing equipment and solution processing method - Google Patents

Description

The present disclosure relates to a solution processing device and a solution processing method for processing a solution containing proteins made of blood.

Patent Document 1 discloses a method for treating an aqueous protein solution. In the treatment method disclosed in Patent Document 1, a protein is mixed with an aqueous solvent to create a protein aqueous solution, and a protein film is manufactured by irradiating this protein aqueous solution with plasma generated by a plasma generator. .

JP2015-218245A

In the processing method disclosed in Patent Document 1, plasma is generated by boosting an AC voltage from a commercial AC power supply, that is, a general AC voltage such as a sine wave and applying it between electrodes. However, in Patent Document 1, when a general protein solution is irradiated, the exchange of charged particles due to plasma irradiation is uneven, which causes them to be diffused as an electric current into the deep part of the solution and substances in contact with the solution, and converted into thermal energy. This may cause protein denaturation. In addition, in this method, when the surface layer side of the solution should be selectively aggregated, energy loss is likely to occur due to the current flowing deep into the solution.
Furthermore, the treatment method of Patent Document 1 does not take into account the charging characteristics of proteins and plasma, and if the polarity of the protein and the polarity of the plasma are the same, there is a possibility that aggregation may be inhibited. In particular, protein solutions consisting of blood components, that is, proteins contained in unprocessed human blood and human serum, contain a large amount of red blood cells, hemoglobin, and albumin, and these proteins are negatively charged, so they are negatively charged. There is a possibility that the formation of efficient coagulated membranes consisting of proteins with biased charges may be inhibited.

In order to solve at least part of the above-mentioned problems, the present disclosure provides a technology that can aggregate a solution containing blood proteins and easily prevents current from flowing too deep into the solution. With the goal.

A solution processing apparatus according to one embodiment of the present disclosure includes:
A main body portion including a gas discharge port and a gas flow path for causing the gas to flow toward the discharge port, a dielectric layer, and a first electrode and a second electrode disposed opposite to each other with the dielectric layer interposed therebetween. a discharge section that generates plasma discharge in the gas flow path; and a power supply section that applies a voltage between the first electrode and the second electrode. A solution processing device that irradiates a solution containing plasma with plasma,
The power supply unit periodically applies an alternating current voltage between the first electrode and the second electrode, and in the waveform of the current flowing through the solution, a waveform of a positive current value and a waveform of a negative current value. The waveform is repeated alternately, the average of the current value becomes substantially 0 in each cycle, and the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. The discharge section is caused to perform a discharge operation.

In the solution processing apparatus described above, proteins made of blood (hereinafter also referred to as blood proteins) can be caused to aggregate in the solution by irradiating the solution with charged plasma and passing a current through the solution. Furthermore, the power supply section can cause the discharge section to perform a discharging operation such that the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. In other words, when a current is passed in a positive direction in a solution based on positively charged charged particles, the current can be passed with a relatively large peak current value and a steep change. Blood proteins can be efficiently aggregated. Such effects are more pronounced, for example, in solutions containing more negatively charged blood proteins than positively charged blood proteins.
However, if the charge imparted to the solution by plasma irradiation is too biased toward either positive or negative, current will tend to flow deep within the solution, which is disadvantageous if it is desired to suppress energization deep within the solution. Therefore, the above-mentioned solution processing apparatus applies a current to the solution so that the average of the current values becomes substantially 0 in each cycle. Such an operation can prevent the current from flowing too deep into the solution.

In this specification, "the average of the current values in each period is substantially 0" means that in each period, the absolute value of the average of the current values is 1/10 or less of the effective value of the current. do. For example, the average current value in a certain first period is substantially 0 means that the absolute value of the average current value in the first period is 1/10 or less of the effective value of the current in the first period. It means that. Similarly, the average of the current values in the second period different from the first period is substantially 0 means that the absolute value of the average of the current values in the second period is equal to that of the current in the second period. This means that it is 1/10 or less of the effective value.

In the solution processing apparatus according to one aspect of the present disclosure, the gas may be a rare gas. This solution processing apparatus can efficiently promote ionization by using a rare gas, and can suitably perform plasma irradiation.

In the solution processing apparatus according to one embodiment of the present disclosure, the gas may be helium gas. By using helium, this solution processing apparatus can promote ionization more efficiently and can perform plasma irradiation more appropriately.

In the solution processing apparatus according to one aspect of the present disclosure, the discharge section has one of the first electrode and the second electrode facing a space in the gas flow path directly or through another member, and the first electrode and the second electrode facing the space in the gas flow path. A configuration may be adopted in which creeping discharge is generated within the gas flow path in response to applying a voltage between the electrode and the gas flow path. Since this solution processing apparatus has a configuration in which the discharge section generates creeping discharge, it is possible to irradiate plasma more efficiently with a lower applied voltage.

The solution processing device according to one embodiment of the present disclosure may further include a container that accommodates the solution. This solution processing device can cause aggregation of proteins made of blood in a solution contained in a container.

In the solution processing apparatus according to one embodiment of the present disclosure, the container has conductivity and may be electrically connected to a ground portion. In this solution processing apparatus, when a solution contained in a container is irradiated with plasma, a current tends to flow through the container to the ground portion side.

In the solution processing apparatus according to one embodiment of the present disclosure, the container may be made of conductive glass. This solution processing apparatus can ensure a certain degree of resistance in the container, and can control the current flowing to the ground side through the container.

A solution processing method according to the present disclosure includes:
A main body portion including a gas discharge port and a gas flow path for causing the gas to flow toward the discharge port, a dielectric layer, and a first electrode and a second electrode disposed opposite to each other with the dielectric layer interposed therebetween. A solution processing apparatus includes a discharge section that generates plasma discharge in the gas flow path, and a power supply section that applies a voltage between the first electrode and the second electrode. A solution processing method for processing a solution containing a protein consisting of:
an irradiation step of irradiating the solution with plasma by the solution processing device,
In the irradiation step, the power supply section periodically applies an AC voltage between the first electrode and the second electrode, and the waveform of the current flowing through the solution has a positive current value and a negative current value. The waveform of the current value is repeated alternately, the average of the current value becomes substantially 0 in each cycle, and the absolute value of the positive peak current value is greater than the absolute value of the negative peak current value in each cycle. The power supply unit causes the discharge unit to perform a discharge operation so as to have a large waveform.

In the solution processing method described above, aggregation of blood proteins can be caused in the solution by irradiating the solution with charged plasma and passing a current through the solution. Furthermore, the power supply section can cause the discharge section to perform a discharging operation such that the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. In other words, when a current is passed in a positive direction in a solution based on positively charged charged particles, the current can be passed with a relatively large peak current value and a steep change. Blood proteins can be efficiently aggregated. Such effects are more pronounced, for example, in solutions containing more negatively charged blood proteins than positively charged blood proteins.
However, if the charge imparted to the solution by plasma irradiation is too biased toward either positive or negative, current will tend to flow deep within the solution, which is disadvantageous if it is desired to suppress energization deep within the solution. Therefore, the above-mentioned solution processing apparatus applies a current to the solution so that the average of the current values becomes substantially 0 in each cycle. Such an operation can prevent the current from flowing too deep into the solution.

The technology according to the present disclosure can aggregate a solution containing blood proteins, and can easily prevent current from flowing too deep into the solution.

FIG. 1 is a schematic diagram schematically illustrating a solution processing apparatus according to a first embodiment. FIG. 2 is a perspective view conceptually illustrating the main body of the solution processing apparatus of the first embodiment. FIG. 3 is an exploded perspective view of the main body illustrated in FIG. 2 divided into three parts. FIG. 4 is a schematic cross-sectional view of the main body illustrated in FIG. 2 taken at the center position in the third direction (width direction) in a direction perpendicular to the third direction. FIG. 5 is a schematic cross-sectional view of the main body illustrated in FIG. 2 taken at the center position in the first direction in a direction perpendicular to the first direction. FIG. 6 is a schematic cross-sectional view of the main body illustrated in FIG. 2 taken at the center position in the second direction (thickness direction) in a direction perpendicular to the second direction. FIG. 7 is a waveform diagram illustrating the waveform of the voltage applied between the first electrode and the second electrode by the power supply section in the solution processing apparatus according to the first embodiment. FIG. 8 illustrates a waveform of a leakage current leaking from a container when blood proteins in the container are irradiated with plasma generated by applying a voltage waveform as shown in FIG. 7 in the solution processing apparatus according to the first embodiment. FIG. FIG. 9 is a schematic diagram schematically illustrating the solution processing apparatus of the second embodiment.

<First embodiment>
1. Configuration of Solution Processing Apparatus The solution processing apparatus 1 according to the first embodiment has a configuration as shown in FIG. The solution processing device 1 is a device that irradiates a solution containing blood proteins with plasma, and has a function of processing a solution containing blood proteins. The solution processing apparatus 1 mainly includes a plasma irradiation device 2 and a container 80. The plasma irradiation device 2 mainly includes an irradiation unit 3, a gas supply section 7, a control section 5, a power supply section 9, and the like.

Container 80 is a container that contains a solution 90 containing blood proteins. Container 80 has conductivity and is electrically connected to ground section 98 . The ground portion 98 is a conductive portion whose potential is stably maintained near a predetermined ground potential (for example, 0V). The ground portion 98 is made of a conductive material such as a metal material. In the container 80, an inner surface portion 80A that contacts the solution 90 and a ground portion 98 are electrically connected. Therefore, when the potential of the inner surface portion 80A is higher than the potential of the ground portion 98, a current flows from the inner surface portion 80A side to the ground portion 98 side. Conversely, when the potential of the inner surface portion 80A is lower than the potential of the ground portion 98, a current flows from the ground portion 98 side to the inner surface portion 80A.

In the representative example shown in FIG. 1, the container 80 is entirely made of resin. However, a part of the container 80 may be made of a material other than resin (for example, a known metal material or a known non-metal material). In the container 80, an inner surface 80A and an outer surface 80B that come into contact with the solution 90 are electrically connected, and a current can flow between the inner surface 80A and the outer surface 80B. Further, the outer surface portion 80B of the container 80 and the ground portion 98 are short-circuited, so that the outer surface portion 80B is kept at the same potential as the ground portion 98. Therefore, when the potential of the inner surface portion 80A is higher than the potential of the ground portion 98, a current flows from the inner surface portion 80A side to the ground portion 98 side via the outer surface portion 80B.

Solution 90 is a liquid containing blood proteins. The solution 90 may be in any of liquid, jelly, gel, and sol states, and may contain two or more of these states. In other words, the term "solution" as used herein is a concept that includes any of liquid, gel, and sol. Further, the solution 90 includes blood components as blood proteins, and may be blood including plasma, red blood cells, white blood cells, platelets, etc., for example. However, the solution 90 may not contain some components such as white blood cells and platelets. Note that blood proteins refer to proteins that are easily dissolved in water and are present in large quantities in the blood, and include negatively charged proteins such as albumin and hemoglobin, and positively charged proteins such as immunoglobulin.

The gas supply section 7 is a device that supplies an inert gas (hereinafter also simply referred to as gas) such as helium gas or argon gas. An inert gas is supplied to a gas flow path 30, which will be described later, through the pipe line. The gas supply unit 7 includes, for example, a regulator that reduces the pressure of high-pressure gas supplied from a cylinder or the like, and a control unit that controls the flow rate, and the control unit can control the flow rate of the gas flowing through the gas flow path 30. In FIG. 1, illustration of the pipe line, the regulator, the control section, etc. is omitted.

The power supply section 9 is a device that generates a periodic voltage and applies the voltage between two electrodes provided in the irradiation unit 3, which will be described later. The power supply section 9 mainly includes a control section 5 and a power supply circuit 6. The power supply circuit 6 may be any circuit that can generate a high voltage at a high frequency and apply it between conductive parts, and various known power supply circuits may be employed. The control unit 5 may be any device as long as it can control the power supply circuit 6, and is configured by, for example, a control device having an information processing device such as a microcomputer. In the example of FIG. 1, the entire power supply section 9 is provided outside the irradiation unit 3. However, part or all of the power supply section 9 may be provided in the irradiation unit 3. Details of the power supply unit 9 will be described later.

The irradiation unit 3 is a unit that can generate and irradiate plasma. The irradiation unit 3 mainly includes a plasma irradiation section 20 and a holding section 3A that holds the plasma irradiation section 20. The irradiation unit 3 may be configured to be used while being held by the user, may be configured to be movable by means other than the user (for example, a robot, etc.), or may be configured to be movable by means other than the user (for example, a robot etc.), or may be configured to be movable by means other than the user (for example, a robot etc.), or may be configured to be movable by means other than the user (for example, a robot etc.) It may also be configured to be used in an immovable state.

The holding portion 3A is a portion of the plasma irradiation unit 20 to which the main body portion 20A is fixed, and has a function of holding the main body portion 20A. The holding part 3A may be configured to hold the main body part 20A while being placed inside itself, or may be configured to hold the main body part 20A while being placed outside of itself. In the example of FIG. 1, the holding part 3A is configured as a case body, and the main body part 20A is fixed to the holding part 3A while being accommodated inside the holding part 3A.

The plasma irradiation unit 20 is configured as a device that generates dielectric barrier discharge. The plasma irradiation section 20 has an appearance as shown in FIG. 2, and includes a main body section 20A configured as a predetermined three-dimensional shape. In the example of FIG. 2, the main body portion 20A is configured in a plate shape and a rectangular parallelepiped shape. The plasma irradiation unit 20 operates to irradiate plasma P from the discharge port 34 formed at the longitudinal end of the main body 20A. The plasma P is a so-called atmospheric pressure low temperature plasma.

FIG. 3 conceptually shows a configuration in which the main body portion 20A is divided into three parts as an exploded perspective view. In the main body portion 20A, a third dielectric layer 53 is provided at the center in the thickness direction, and a fourth dielectric layer 54 is provided on one side of the third dielectric layer 53 in the thickness direction. Further, in the main body portion 20A, a first dielectric layer 51 and a second dielectric layer 52 are provided on the other side of the third dielectric layer 53 in the thickness direction. A first electrode 42 and a second electrode 44 are embedded inside a dielectric region formed by the first dielectric layer 51 and the second dielectric layer 52. Although FIG. 3 conceptually shows a configuration in which the main body portion 20A is divided into three parts, the actual configuration includes a first dielectric layer 51, a second dielectric layer 52, a third dielectric layer 53, and the fourth dielectric layer 54 are each configured as part of an integral dielectric section 50 (see FIG. 5).

As shown in FIG. 4, the main body portion 20A is provided with a gas flow path 30 configured to flow gas toward the discharge port 34. The gas flow path 30 has an introduction port 32 for introducing gas, a discharge port 34 for releasing the gas, and an intermediate flow path 36 provided between the introduction port 32 and the discharge port 34. The introduction port 32 is an opening that communicates with the inside and outside of the main body 20A on the rear end side of the main body 20A. The discharge port 34 is an opening that communicates with the inside and outside of the main body 20A on the distal end side of the main body 20A. The intermediate flow path 36 is a ventilation path that communicates with the introduction port 32 and the discharge port 34, and is a flow path that allows gas to flow between the introduction port 32 and the discharge port 34. The gas flow path 30 introduces an inert gas supplied from a gas supply section 7 provided outside the irradiation unit 3 through an introduction port 32, and the gas introduced from the introduction port 32 side into an intermediate flow path 36. It serves as a guide path that leads to the discharge port 34 through the space. In FIG. 4, a conduit 7A for guiding the inert gas supplied from the gas supply section 7 to the introduction port 32 is conceptually shown by a two-dot chain line.

As shown in FIG. 4, the plasma irradiation section 20 is provided with a discharge section 40. The discharge section 40 is a part that generates plasma discharge within the gas flow path 30. The discharge section 40 includes a dielectric section 50 , a first electrode 42 , and a second electrode 44 , with the first electrode 42 and the second electrode 44 forming a first dielectric layer 51 that is part of the dielectric section 50 . They are arranged opposite to each other through. The discharge section 40 is configured as a creeping discharge section, and generates an electric field based on the potential difference between the first electrode 42 and the second electrode 44 within the gas flow path 30 to generate atmospheric pressure low-temperature plasma due to the creeping discharge along the inner wall surface. to occur.

In this specification, the direction in which the gas flow path 30 extends in the plasma irradiation part 20 is the first direction, the thickness direction of the dielectric part 50 is the second direction among the directions perpendicular to the first direction, and the first direction is the direction in which the gas flow path 30 extends. A direction perpendicular to the direction and the second direction is the third direction. In the example of FIG. 4, the dielectric portion 50, the first electrode 42, and the second electrode 44 are integrally provided to constitute the main body portion 20A, and the longitudinal direction of the main body portion 20A is the first direction. As shown in FIG. 5, the second direction is the lateral direction of the main body 20A on a cut surface taken in a plane direction perpendicular to the first direction, and the height direction and thickness of the main body 20A. It is the direction. The third direction is the longitudinal direction of the main body 20A at a cross section of the main body 20A cut in a plane direction perpendicular to the first direction, and is the width direction of the main body 20A. In this specification, the discharge port 34 side is the front end side of the main body 20A in the first direction, and the inlet port 32 side is the rear end side of the main body 20A in the first direction.

As shown in FIG. 5, the dielectric section 50 includes a first dielectric layer 51, a second dielectric layer 52, a third dielectric layer 53, and a fourth dielectric layer 54, and the main body section 20A is entirely It is constructed in a hollow shape. The first dielectric layer 51 is disposed on the other side in the second direction (thickness direction) with respect to the space within the intermediate flow path 36, and is configured such that the second electrode 44 is embedded therein. That is, the first electrode 42 and the second electrode 44 are opposed to each other with the first dielectric layer 51 in between. The second dielectric layer 52 is a ceramic protective layer configured to cover the first electrode 42 using a ceramic material, and covers the first electrode 42 on the space side of the intermediate flow path 36 relative to the first dielectric layer 51. It is arranged like this. The first dielectric layer 51 and the second dielectric layer 52 constitute an inner wall portion of the intermediate flow path 36 on the other side in the second direction. The fourth dielectric layer 54 is disposed on one side in the second direction (thickness direction) with respect to the space of the intermediate flow path 36 and forms an inner wall portion of the intermediate flow path 36 on one side in the second direction. The third dielectric layer 53 is disposed between the first dielectric layer 51 and the fourth dielectric layer 54 in the second direction, and has a side wall portion on one side in the third direction in the intermediate flow path 36 and a side wall portion on the other side in the third direction. It constitutes the side wall part of the side. That is, the intermediate flow path 36 is defined by the first dielectric layer 51 , the second dielectric layer 52 , the third dielectric layer 53 , and the fourth dielectric layer 54 . As the material of the first dielectric layer 51, the second dielectric layer 52, the third dielectric layer 53, and the fourth dielectric layer 54, ceramics such as alumina, glass materials, and resin materials can be suitably used. . If alumina, which has high mechanical strength, is used as a dielectric in the dielectric portion 50, the discharge portion 40 can be easily miniaturized.

As shown in FIG. 5, the first electrode 42 faces the space within the intermediate flow path 36 via a second dielectric layer 52 that is a part of the dielectric section 50. As shown in FIG. The second electrode 44 is provided on the opposite side of the intermediate flow path 36 with respect to the first electrode 42 . The second electrode 44 is arranged parallel to the first electrode 42 and is further away from the intermediate flow path 36 than the first electrode 42 in the second direction. As shown in FIG. 6, the first electrode 42 extends linearly in a first direction along the intermediate flow path 36, and has a first width and a first thickness in a first region in the first direction. It is located. The second electrode 44 extends linearly in the first direction along the intermediate flow path 36, and is disposed in a second region in the first direction with a second width and a second thickness. The thickness, width, and arrangement of the first electrode 42 and the second electrode 44 are not particularly limited. One or both of the width and thickness of the first electrode 42 and the second electrode 44 may be the same or different.

The discharge section 40 configured in this manner generates a creeping discharge within the intermediate flow path 36 when a periodically changing voltage is applied between the first electrode 42 and the second electrode 44 . The plasma generated by the creeping discharge is discharged to the outside through the discharge port 34 by the gas supplied into the intermediate flow path 36 from the gas supply section 7 . In the example of FIG. 6, the intermediate flow path 36 has a constant width in the region AR1 in the first direction, and in the region AR2, the width of the intermediate flow path 36 decreases toward the tip side, and the discharge port 34 The structure is such that the gas flow rate can be increased in the vicinity. Therefore, the plasma generated in the intermediate flow path 36 can easily reach further distances.

2. Details of Power Supply Section The power supply section 9 applies a periodically changing voltage at a high frequency between the first electrode 42 and the second electrode 44. In the first embodiment and any embodiment other than the first embodiment described below, the frequency of the voltage applied by the power supply section 9 between the first electrode 42 and the second electrode 44 is in the range of 20 kHz to 300 kHz. It is desirable that it be within In addition, in any embodiment other than the first embodiment and the first embodiment described later, the voltage applied by the power supply unit 9 between the first electrode 42 and the second electrode 44 is It is desirable that the maximum value of the potential difference with the second electrode 44 is adjusted to be within the range of 0.5 kV to 10 kV. The power supply section 9 may employ various known alternating current or direct current circuits as long as they are capable of generating such high frequency and high voltage. Note that in this specification, the applied voltage applied between the first electrode 42 and the second electrode 44 is the relative magnitude of the potential of the first electrode 42 with respect to the potential of the second electrode 44. When the potential of the first electrode 42 is V1 and the potential of the second electrode 44 is V2, the applied voltage is V1-V2.

In any embodiment other than the first embodiment and the first embodiment described later, the waveform of the voltage applied by the power supply unit 9 between the first electrode 42 and the second electrode 44 may be a convex waveform, for example. This is a waveform that changes periodically so that concave waveforms are alternately repeated. This voltage waveform may be a curved waveform such as a sine wave, a rectangular waveform, a triangular waveform, or the like.

FIG. 7 illustrates a voltage waveform employed by the power supply unit 9 in the solution processing apparatus 1 of the first embodiment. In the graph of FIG. 7, the vertical axis corresponds to the applied voltage applied between the first electrode 42 and the second electrode 44, and the horizontal axis corresponds to time (elapsed time). FIG. 7 shows the change over time of the applied voltage (V1-V2) applied by the power supply section 9. In FIG. 7, a convex waveform is a waveform that is convex toward one side of the vertical axis (specifically, the side where the voltage is larger). The concave waveform is a waveform that is concave toward one side of the vertical axis and convex toward the other side of the vertical axis (specifically, the side where the voltage is smaller). In the waveform of the applied voltage shown in FIG. 7, the convex waveform and the concave waveform are included in one period T from time t1 to time t2, and the voltage waveform of one period T is periodically distributed over multiple periods. Repeated. The power supply section 9 applies an AC voltage between the first electrode 42 and the second electrode 44 over a plurality of cycles so that the waveform of one cycle T becomes the waveform shown in FIG. Note that the specific values of the applied voltage and the specific values of the time (elapsed time) shown in FIG. 7 are only a preferred example, and the present invention is not limited thereto.

In the waveform of the applied voltage shown in FIG. 7, the convex waveform in each period is a voltage waveform that includes the maximum voltage value (peak voltage value) in each period, and the voltage remains until the maximum voltage value in each period. It becomes a rising waveform in which the voltage increases, and after the time when the voltage reaches the maximum voltage value, it becomes a falling waveform in which the voltage falls. The rising waveform of the convex waveform may include a waveform in which the voltage temporarily decreases, and the falling waveform of the convex waveform may include a waveform in which the voltage temporarily increases. The positive peak voltage value in each period is the difference between the maximum voltage value in each period and 0V (specifically, the value obtained by subtracting 0V from the maximum voltage value). In FIG. 7, the voltage value Va1 is illustrated as the positive peak voltage value of the period T. The voltage value Va1 is a positive value. The concave waveform in each period is a voltage waveform that includes the minimum voltage value in each period, and becomes a falling waveform in which the voltage decreases until the time when the voltage value reaches the minimum voltage value in each period, and after the time when the voltage value reaches the minimum voltage value, it becomes a falling waveform. The voltage becomes a rising waveform. The falling waveform of the concave waveform may include a waveform in which the voltage temporarily increases, and the rising waveform of the concave waveform may include a waveform in which the voltage temporarily decreases. The negative peak voltage value in each period is the difference between the minimum voltage value in each period and 0V (specifically, the value obtained by subtracting 0V from the minimum voltage value). In FIG. 7, the voltage value Vb1 is illustrated as the negative peak voltage value of the period T. Voltage value Vb1 is a negative value.

As shown in FIG. 7, the waveform of the applied voltage that the power supply section 9 applies between the first electrode 42 and the second electrode 44 is the average of the positive peak voltage value and the negative peak voltage value in each period. This is a positive deflection waveform in which the average value is positive. In the example of FIG. 7, the value of (Va1+Vb1)/2 is positive. For example, when applying an applied voltage having a waveform as shown in FIG. 7 between the first electrode 42 and the second electrode 44 over a predetermined period (for example, a predetermined number of cycles), the positive If the average value of peak voltage values is Av1, and the average value of negative peak voltage values in this predetermined period is Av2, then the total value of Av1 and Av2 is also positive.

In the solution processing apparatus 1, the power supply section 9 applies an applied voltage having a positive deflection waveform as shown in FIG. 7 to the first electrode 42 and the second electrode 44, thereby causing the discharge section 40 to perform a discharge operation (plasma irradiation operation) A current having a waveform as shown in FIG. 8 is caused to flow through the solution 90.

The graph in FIG. 8 shows that a solution 90 (specifically, a solution containing blood proteins) in a container 80 is irradiated with plasma generated by applying a voltage (AC voltage) with a waveform as shown in FIG. 7 to the discharge unit 40. It shows the change over time in the leakage current leaking from the solution 90 to the ground side via the container 80. In FIG. 8, the vertical axis corresponds to the value of the leakage current, and the horizontal axis corresponds to time (elapsed time). Regarding the direction of the leakage current leaking from the solution 90 to the ground part 98 side via the container 80, the direction from the container 80 toward the ground part 98 is a positive direction. Time t1 in FIG. 8 corresponds to time t1 in FIG. 7, and time t2 in FIG. 8 corresponds to time t2 in FIG. When the applied voltage is applied as shown in FIG. 7 during the period T from time t1 to time t2, the waveform of the leakage current in the period T is the waveform from time t1 to time t2 in FIG. 8. Note that the specific values and time (elapsed time) of the leakage current shown in FIG. 8 are only a preferred example, and the content is not limited thereto.

As shown in FIG. 8, the waveform of the current flowing through the solution 90 (specifically, the leakage current flowing from the solution 90 to the ground portion 98) during the predetermined period (for example, a predetermined number of periods T) is as follows: This is a waveform in which a positive current value waveform and a negative current value waveform are alternately repeated. Furthermore, the waveform of the current flowing through the solution 90 during the predetermined period is such that the average of the current values in each period is substantially zero. Specifically, in any period of the predetermined period, the average absolute value of the current value in the period of interest is 1/10 or less of the effective value of the current in the period of interest. For example, in the period T shown in FIG. 8, the average absolute value of the current value during the period T is 1/10 or less of the effective value of the current during the period T. Furthermore, the waveform of the current flowing through the solution 90 during the predetermined period is such that the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in any period. For example, in the period T shown in FIG. 8, a current value Ia1 is exemplified as a positive peak current value, and a voltage value Ib1 is exemplified as a negative peak current value. Ia1 is a positive value, Ib1 is a negative value, and the absolute value of Ia1 is larger than the absolute value of Ib1. The power supply unit 9 causes the discharge unit 40 to perform a discharge operation so that the waveform of the current flowing through the solution 90 during the predetermined period has such a waveform.

3. Operation of Solution Processing Apparatus The above-described solution processing apparatus 1 shown in FIG. 1 can be used in the solution processing method described below. This solution processing method is a method of processing a solution 90 containing blood proteins using the solution processing apparatus 1, and mainly includes a preparation step and an irradiation step.

The preparation step is a step of preparing a solution 90 containing blood proteins. Specifically, in the preparation step, the above-described plasma irradiation device 2, a container 80, and a solution 90 containing blood proteins are prepared, and preparations are made to accommodate the solution 90 containing blood proteins in the container 80. This is the process of For example, an operator can prepare the plasma irradiation device 2, the container 80, and the solution 90. The operator can also perform the work of preparing the solution 90 to be contained in the container 80. Note that part or all of the preparation process may be performed mechanically by a device. Further, the solution 90 may be prepared by any method.

The irradiation process is a process in which the solution 90 prepared in the preparation process is irradiated with plasma by the solution processing apparatus 1. In the irradiation process, the plasma irradiation section 20 is arranged so that the discharge port 34 is directed toward the solution 90 in the container 80, and in this state, the plasma irradiation section 20 irradiates the solution 90 with a characteristic plasma.

In the irradiation step, an inert gas is supplied from the gas supply unit 7 so that the inert gas (for example, a rare gas such as helium gas) flows through the space within the gas flow path 30 . In the irradiation step, with the inert gas flowing in the gas flow path 30 in this manner, the power supply unit 9 is configured to cause the leakage current to flow in the above-mentioned voltage waveform and in the above-mentioned current waveform. A voltage is periodically applied between the first electrode 42 and the second electrode 44. The above-mentioned voltage waveform is the above-mentioned "plus deflection waveform" as illustrated in FIG. The above-mentioned current waveform refers to the waveform of the current flowing through the solution 90 as exemplified in FIG. 8, in which a positive current value waveform and a negative current value waveform are alternately repeated, , the average of the current values is substantially 0, and the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. In this way, when a periodic voltage having the above voltage waveform is applied between the first electrode 42 and the second electrode 44 while the inert gas is flowing in the gas flow path 30, the gas flow path A creeping discharge occurs in the space within 30. Plasma generated by this creeping discharge is emitted from the ejection port 34 toward the solution 90. In this creeping discharge, for example, the amount of positively charged plasma generated is equal to the amount of negatively charged plasma generated in each period of the periodically applied alternating current voltage.

Thus, in the irradiation step, the plasma irradiation section 20 applies a voltage with a characteristic voltage waveform between the electrodes to generate plasma, and irradiates the solution 90 with plasma having characteristic characteristics according to the voltage waveform. The plasma irradiated onto the solution 90 is electrically charged plasma. When irradiating plasma over the above-mentioned predetermined period (for example, multiple cycles) in the irradiation process, the amount of positively charged plasma generated and the amount of negatively charged plasma generated in each period are equal, and even during the entire predetermined period, the amount of positively charged plasma generated is equal to the amount of negatively charged plasma generated in each period. It is assumed that the amount of charged plasma generated is equal to the amount of negatively charged plasma generated. When the solution 90 is irradiated with the charged plasma, a current (the above-mentioned leakage current) flows between the solution 90 and the ground section 98 in accordance with the flow of the charged particles. Note that the direction of the leakage current changes depending on whether a plasma with a predominant positive charge is irradiated or a plasma with a predominant negative charge is irradiated. Such current flow can cause aggregation of blood proteins within the solution 90.

The power supply section 9 performs a discharging operation on the discharging section 40 so that the waveform has a waveform in which the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. In other words, when a current is passed in a positive direction in the solution 90 based on positively charged charged particles, the current can be passed with a relatively large peak current value and a steep change. Charged blood proteins can be efficiently aggregated. Such effects are more pronounced, for example, in solutions containing more negatively charged blood proteins than positively charged blood proteins.

However, if the charge applied to the solution 90 by plasma irradiation is too biased towards either the positive or negative side, the current will tend to flow deep within the solution 90, which is disadvantageous when it is desired to suppress energization in the deep part. Therefore, the solution processing apparatus 1 causes current to flow through the solution 90 so that the average of the current values becomes substantially 0 in each cycle. Such an operation can prevent the current from flowing too deep into the solution 90. When such an operation is performed, for example, the surface layer of the solution 90 is selectively agglomerated and solidified, and the aggregation of the deep part of the solution 90 (a region deeper than the region to be agglomerated) is suppressed or prevented. Processing is also possible.

In the solution processing apparatus 1, one of the first electrode 42 and the second electrode 44 (the first electrode 42 in the example of FIG. 5) is connected to the inside of the gas flow path 30 via another member (the second dielectric layer 52). This is a configuration in which creeping discharge is generated within the gas flow path 30 in response to applying a voltage between the first electrode 42 and the second electrode 44 facing the space. In this way, since the discharge section 40 is configured to generate creeping discharge, plasma can be irradiated more efficiently with a lower applied voltage.

<Second embodiment>
The following description relates to the solution processing apparatus 201 of the second embodiment illustrated in FIG. The solution processing apparatus 201 of FIG. 9 differs from the solution processing apparatus 1 of the first embodiment in that it includes a resistance element 202 and that the material of the container 80 is different, and the other points are the solution processing apparatus 1 of the first embodiment. is the same as Therefore, below, content regarding the resistance element 202 will be mainly explained with emphasis.

The plasma irradiation device 2 used in the solution processing device 201 has the same configuration as the plasma irradiation device 2 in the solution processing device 1 of the first embodiment, and performs the same operation as the first embodiment.

The container 80 used in the solution processing apparatus 201 has the same configuration as the container 80 in the solution processing apparatus 1 of the first embodiment. However, the container 80 of the second embodiment is made of conductive glass. Therefore, the solution processing apparatus 201 can ensure a certain degree of resistance in the container 80 and can control the current flowing through the container 80 to the ground section 98 side. The solution 90 contained in the container 80 may be any of the specific examples of the solution 90 exemplified in the first embodiment.

In the solution processing apparatus 201, the container 80 is connected to the ground section 98 via the resistive element 202. Resistance element 202 has a function of offsetting the potential of container 80 from the potential of ground section 98 . Specifically, the resistance element 202 includes a variable resistance 202A. A variable resistor 202A is interposed between the outer surface portion 80B of the conductive container 80 and the ground portion 98. When the potential of the outer surface portion 80B is higher than the potential of the ground portion 98, a current flows from the outer surface portion 80B through the variable resistor 202A. In this example, when current flows from the container 80 to the ground section 98 via the variable resistor 202A, the potential of the container 80 is set higher than that of the ground section 98 based on the voltage drop that occurs across the variable resistor 202A.

The solution processing apparatus 201 can produce the same effects as the solution processing apparatus 1 of the first embodiment. Furthermore, the solution processing apparatus 201 can control the current flowing to the ground section 98 side due to the presence of the resistance element 202.

<Other embodiments>
The present disclosure is not limited to the embodiments described above and illustrated in the drawings. The features of the embodiments described above or below can be combined in any way as long as they do not contradict each other. Furthermore, any feature of the embodiments described above or below may be omitted unless explicitly stated as essential. Furthermore, the features of the embodiments described above may be modified as follows.

In the solution processing apparatus of the above embodiment, as shown in FIG. 42 may face the space within the gas flow path 30 without intervening other members. In other words, the first electrode 42 may be exposed to the space within the gas flow path 30 and may form part of the inner wall of the gas flow path 30 .

In the above example, the first electrode faces the space within the gas flow path directly or through another member, but the second electrode may face the space within the gas flow path directly or through another member. . For example, the second electrode may be covered with a dielectric layer which is an "other member" and may face the space in the gas flow path through the dielectric layer. Alternatively, the second electrode may be exposed to a space within the gas flow path, and the second electrode may form part of the inner wall of the gas flow path. In either case, the first electrode only needs to be placed farther away from the gas flow path than the second electrode.

In the embodiments described above, the container 80 is made of resin or conductive glass, but the container 80 may be made of other conductive materials (for example, metal materials). Alternatively, the container 80 may be made of a non-conductive material.

Although the above-described embodiment has a configuration in which the solution 90 contained in the container 80 is irradiated with plasma, the present invention is not limited to this example. For example, a solution treatment method may be performed such that "a solution containing blood proteins that is not contained in a container" is irradiated with plasma by the plasma irradiation device 2 described above, and aggregation occurs in this solution. With this method, the plasma irradiation device 2 can function as a solution processing device. In the preparation step, the plasma irradiation device 2 described above is prepared, and a solution containing blood proteins is placed at a position where plasma can be irradiated from the plasma irradiation device 2. Then, in the irradiation step, the plasma irradiation device 2 irradiates the solution with plasma, which is placed at a position where the plasma can be irradiated from the plasma irradiation device 2 . In this example, the "solution containing blood proteins that is not housed in a container" may be a solution that exists on or inside an animal or human body, or it may be another solution that is not housed in a container.

In the solution processing apparatus 201 of the second embodiment, a variable resistor 202A is provided as the resistance element 202, but instead of or in addition to the variable resistor 202A, electric components such as fixed resistors, inductors, capacitors, etc. may be provided as a resistance element. The resistance element 202 is configured such that a current can flow from the container 80 to the ground section 98 via the resistance element 202, and the potential of the container 80 is set higher than the potential of the ground section 98 due to the presence of the resistance element 202. Any configuration is acceptable as long as it is possible. For example, the resistance element 202 may be a voltage generation circuit that maintains the potential of the container 80 at a predetermined potential offset from the potential of the ground portion 98 by a constant value.

In the above-described embodiment, an example as shown in FIG. 7 is shown as a periodic voltage waveform, but the periodic voltage waveform is not limited to these examples. The waveform of the periodic voltage that the power supply unit 9 applies to both electrodes may be a curved waveform such as a sine wave, a rectangular waveform, a triangular waveform, or the like. In either case, any waveform may be used as long as it can cause the discharge section to perform an operation of irradiating blood proteins with more positively or negatively charged plasma than the other charged plasma over a predetermined period of time.

It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be considered restrictive. The scope of the present invention is not limited to the embodiments disclosed herein, and includes all modifications within the scope indicated by the claims or within the scope equivalent to the claims. is intended.

1,201: Solution processing device 5: Control section 9: Power supply section 20A: Main body section 30: Gas flow path 34: Discharge port 40: Discharge section 42: First electrode 44: Second electrode 50: Dielectric layer 80: Container 90: Solution 98: Ground part P: Plasma

Claims (8)

A main body portion including a gas discharge port and a gas flow path for causing the gas to flow toward the discharge port, a dielectric layer, and a first electrode and a second electrode disposed opposite to each other with the dielectric layer interposed therebetween. a discharge section that generates plasma discharge in the gas flow path; and a power supply section that applies a voltage between the first electrode and the second electrode. A solution processing device that irradiates a solution containing plasma with plasma,
The power supply unit periodically applies an alternating current voltage between the first electrode and the second electrode, and in the waveform of the current flowing through the solution, a waveform of a positive current value and a waveform of a negative current value. The waveform is repeated alternately, the average of the current value becomes substantially 0 in each cycle, and the absolute value of the positive peak current value is larger than the absolute value of the negative peak current value in each cycle. The solution processing apparatus causes the discharge section to perform a discharge operation. In the discharge section, one of the first electrode and the second electrode faces the space in the gas flow path directly or through another member, and there is a space between the first electrode and the second electrode. The solution processing apparatus according to claim 1, wherein a creeping discharge is generated within the gas flow path in response to applying the voltage. The solution processing apparatus according to claim 1 , wherein the gas is a rare gas. The solution processing apparatus according to claim 3, wherein the gas is helium gas. The solution processing apparatus according to any one of claims 1 to 4, further comprising a container that accommodates the solution. The solution processing apparatus according to claim 5, wherein the container has conductivity and is electrically connected to a ground section. The solution processing apparatus according to claim 5 or 6, wherein the container is made of conductive glass. A main body portion including a gas discharge port and a gas flow path for causing the gas to flow toward the discharge port, a dielectric layer, and a first electrode and a second electrode disposed opposite to each other with the dielectric layer interposed therebetween. A solution processing apparatus includes a discharge section that generates plasma discharge in the gas flow path, and a power supply section that applies a voltage between the first electrode and the second electrode. A solution processing method for processing a solution containing a protein consisting of:
an irradiation step of irradiating the solution with plasma by the solution processing device,
In the irradiation step, the power supply section periodically applies an AC voltage between the first electrode and the second electrode, and the waveform of the current flowing through the solution has a positive current value and a negative current value. The waveform of the current value is repeated alternately, the average of the current value becomes substantially 0 in each cycle, and the absolute value of the positive peak current value is greater than the absolute value of the negative peak current value in each cycle. A solution processing method, wherein the power supply unit causes the discharge unit to perform a discharge operation so as to have a large waveform.

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