JP7358004B2 - optical device assembly - Google Patents

Description

FIELD OF THE INVENTION The present invention relates to optical device assemblies, and more particularly to processes for securing optical components having microlens arrays to substrates.

According to embodiments of the invention, an optical device is provided. The optical device includes a substrate that includes multiple waveguide cores that allow light to pass through the multiple waveguide cores. The optical device further includes an optical component provided on the substrate. The optical component includes a plurality of lenses each transmitting light through a corresponding one of the plurality of waveguide cores on the substrate. The optical component includes a body and a protrusion. The main body is provided with a plurality of lenses, and the protrusion protrudes from the side surface of the main body. The protrusion is fixed to the substrate with adhesive.

According to another embodiment of the invention, an optical device is provided. The optical device includes a substrate that includes multiple waveguide cores that allow light to pass through the multiple waveguide cores. The optical device further includes an optical component provided on the substrate. The optical component includes a plurality of lenses each transmitting light through a corresponding one of the plurality of waveguide cores on the substrate. The optical component includes a surface facing the substrate and a recess provided on the surface. The recesses face each other with the plurality of lenses in between. The optical component is secured to the substrate by an adhesive contained in the recess.

According to yet another embodiment of the invention, a device is provided that includes an optical device and an operating unit that operates based on a signal from the optical device. The optical device includes a substrate that includes multiple waveguide cores that allow light to pass through the multiple waveguide cores. The optical device further includes an optical component provided on the substrate. The optical component includes a plurality of lenses each transmitting light through a corresponding one of the plurality of waveguide cores on the substrate. The optical component includes a body and a protrusion. The main body is provided with a plurality of lenses, and the protrusion protrudes from the side surface of the main body. The protrusion is fixed to the substrate with adhesive.

According to yet another embodiment of the invention, a method for making an optical device is provided. The method includes forming a substrate and an optical component. The substrate includes multiple waveguide cores that allow light to pass through the multiple waveguide cores. The optical component is provided on the substrate and includes a plurality of lenses each transmitting light that passes through a corresponding one of the plurality of waveguide cores on the substrate. The optical component includes a body and a protrusion. The main body is provided with a plurality of lenses, and the protrusion protrudes from the side surface of the main body. The method further includes securing the protrusion to the substrate with an adhesive.

According to yet another embodiment of the invention, a method for making a device is provided. The method includes forming a substrate, an optical component, and a device body. The substrate includes multiple waveguide cores that allow light to pass through the multiple waveguide cores. The optical component is provided on the substrate and includes a plurality of lenses each transmitting light that passes through a corresponding one of the plurality of waveguide cores on the substrate. The optical component includes a body and a protrusion. The main body is provided with a plurality of lenses, and the protrusion protrudes from the side surface of the main body. The method further includes securing the protrusion to the substrate with an adhesive. The method includes mounting an optical component secured to a substrate onto a device body.

FIG. 1 is a top view of an optical communication system according to a first embodiment. FIG. 2 is a side view of the multi-chip module according to the first embodiment. (A) is a schematic cross-sectional view taken along line III(A)-III(A) in FIG. 2; (B) It is a top view of the board|substrate side component and waveguide layer by 1st Embodiment. (A), (B), and (C) illustrate a process for securing substrate-side components to a waveguide layer in one example. (A), (B), and (C) illustrate another process for fixing substrate-side components to a waveguide layer in another example. FIG. 3 is a perspective view of a board-side component according to the first embodiment. FIG. 4 is a partial cross-sectional view within circle VII in FIG. 3(A). (A), (B), (C), (D), and (E) show the process for fixing the substrate-side components to the waveguide layer in the first embodiment. FIG. 3 is a top view of board-side components arranged on the main board according to the first embodiment. FIG. 7 is a top view of board-side components arranged on the main board according to the second embodiment. FIG. 7 is a top view of board-side components arranged on a main board according to a third embodiment. (A), (B), and (C) are top views of the board-side components. (A) and (B) are a side view and a top view of a board-side component according to a modified form. 1 is a schematic diagram of a device provided with an optical communication system; FIG.

In the following, exemplary embodiments of the invention will be described in detail with reference to the accompanying drawings.

It should be noted that the invention is not limited to the exemplary embodiments shown below, but may be implemented with various modifications within the scope of the invention. Additionally, the drawings used herein are for illustrative purposes and may not depict actual dimensions.

FIG. 1 is a top view of an optical communication system 1 according to a first embodiment. As shown in the figure, the optical communication system 1 may include two multi-chip modules (MCM) 5. The MCM 5 includes a main board 10, a central processing unit (CPU) 11, a vertical cavity surface emitting laser (VCSEL) chip array 12, and a laser diode driver (LDD). diode driver) chip 13 , a photodiode (PD) chip array 14 , a trans-impedance amplifier (TIA) chip 15 , waveguide layers 161 and 162 , and a fiber connector 17 . Furthermore, as shown, the optical communication system 1 may include fiber cables 181 and 182, each having a number (eg, 12 or 24) of fiber cable cores.

The waveguide layer 161 may include a plurality of waveguide cores WG whose number matches the number of cores of the fiber cable 181 or 182. VCSEL chip array 12 may include a plurality of VCSEL devices whose number matches the number of fiber cores (not shown) in waveguide layer 161. Waveguide layer 162 may include a plurality of waveguide cores WG whose number matches the number of fiber cores (not shown) of fiber cable 181 or 182. PD chip array 14 may include a plurality of PD devices whose number matches the number of cores in waveguide layer 162.

FIG. 2 is a side view of the MCM 5 according to the first embodiment. As shown in the figure, waveguide layer 161 may be formed on the surface of main substrate 10. The waveguide layer 161 may include a waveguide core WG, a cladding layer 160 above the waveguide core WG, and another cladding layer 160 below the waveguide core WG. Waveguide layer 161 may be formed as a polymer waveguide.

A plurality of mirror cavities 165 may be provided in the waveguide layer 161. The mirror cavity 165 is provided at one end (left side in FIG. 2) of the waveguide core WG and faces the VCSEL chip array 12. Each mirror cavity 165 is provided on each waveguide core WG. In other words, the number of mirror cavities 165 matches the number of waveguide cores WG.

A plurality of mirror cavities 167 may also be provided in the waveguide layer 161. The mirror cavity 167 is provided at the other end (on the right side in FIG. 2) of the waveguide core WG and faces the fiber connector 17. Each mirror cavity 167 is provided on each waveguide core WG. In other words, the number of mirror cavities 167 matches the number of waveguide cores WG.

Mirror cavities 165 and 167 may be tilted at an angle of 45° to form a reflective surface (mirror M) on the boundary (interface) between waveguide core WG and mirror cavity 165 or mirror cavity 167. . In this embodiment, the boundary may be provided without a metal coating and the mirror cavities 165 and 167 may be filled with air (atmosphere). This configuration allows mirror M to reflect light by total internal reflection (TIR). More specifically, the mirror M of the mirror cavity 165 reflects the light from the VCSEL chip array 12 to the waveguide core WG by total internal reflection. The mirror M of the mirror cavity 167 reflects the light from the waveguide core WG to the fiber connector 17 by total internal reflection.

In some embodiments, the mirrors M of the mirror cavity 167 are provided at staggered positions in the waveguide core WG to form two rows (see FIG. 3(B)).

Fiber connector 17 may include a fiber side component 180 and a board side component 190. Fiber side component 180 connected to fiber cables 181 and 182 may be mounted on board side component 190. The substrate side component 190 may be mounted directly on the waveguide layer 161 to receive the fiber side component 180.

The substrate side component 190 is bonded onto the waveguide layer 161 using an adhesive 210. Adhesive 210 may be a photocurable material, such as an ultraviolet (UV) curable material (photocurable material) or a thermoset material. Waveguide layer 161 is an example of a claimed substrate. The substrate side component 190 is an example of a claimed optical component. Microlens 193 is an example of a claimed lens.

FIG. 3(A) is a schematic cross-sectional view taken along line III(A)-III(A) in FIG. FIG. 3B is a top view of the substrate side component 190 and the waveguide layer 161 according to the first embodiment.

As shown in FIGS. 3(A) and 3(B), the board-side component 190 may include a body 199 and wings 198 (described below). The substrate side part 190 may be formed as a polymer part. In this embodiment, the board-side component 190 may be constructed as a single piece.

Body 199 may have a generally rectangular shape. The body 199 may include a substrate-side microlens array 191, a first support portion 194, a second support portion 195, and an alignment hole 197.

Microlens array 191 may include a plurality of microlenses 193. The microlens array 191 is arranged in two columns corresponding to the columns of mirrors M in the mirror cavity 167. In this embodiment, the main body 199 may be provided with an upper surface recess 192 having a generally rectangular parallelepiped shape on the upper surface. Microlens array 191 is provided at the bottom of upper surface recess 192 .

The substrate side component 190 may be placed on the waveguide layer 161 so that each microlens 193 and the corresponding mirror M provided on each waveguide core WG are aligned. In some embodiments, fiber side component 180 may include a fiber side microlens array. Each microlens 193 of the substrate side component 190 is aligned with each fiber side microlens. This configuration allows the light reflected by the mirror M to pass through the microlens 193 of the substrate side component 190 and the corresponding microlens of the fiber side component 180.

The first support portion 194 is a protruding portion on the top surface of the main body 199. The first support portions 194 may be provided on both sides of the main body 199 in the longitudinal direction. A first support portion 194 supports fiber side component 180 . In this embodiment, a microlens array 191 is provided between the first support portions 194. In some embodiments, a top surface recess 192 is provided between the first support portions 194.

The second support portion 195 is a protruding portion on the bottom surface of the body 199. The second support portions 195 may be provided on both sides of the body 199 in the longitudinal direction. A second support portion 195 may rest on the waveguide layer 161. A bottom central region 196 is defined between the second support portions 195 .

The bottom surface of the body 199, more specifically the bottom central region 196, faces the region of the top surface of the waveguide layer 161 in which the mirror cavity 167 is provided. In other words, the substrate side component 190 may cover the mirror cavity 167.

The alignment hole 197 is a through hole that penetrates the main body 199 from the top surface to the bottom surface of the main body 199. When placing the substrate side component 190 on the waveguide layer 161, image recognition of the alignment hole 197 is performed in order to detect the position where the substrate side component 190 will be placed.

In the following description, the direction along the axis of the waveguide core will be referred to as the axial direction. The direction perpendicular to the axial direction along the plane of the waveguide layer 161 is called the width direction. The direction longitudinally perpendicular to both the axial and width directions is called the height direction.

The multi-chip module (MCM) 5 is an assembly manufactured by high-density optical integration. Such high-density optical integration has been the key to faster, lower-cost interconnections for high performance (HPC) systems and high-end servers in data centers, among others. Integration of optical components requires consideration of component alignment, thus creating technical challenges for high throughput or low cost production. In some embodiments, high-density optical integration may require alignment accuracy of less than ±5 um within a few seconds of process time. Misalignment between the substrate-side component 190 and the waveguide layer 161 may result in signal loss of light passing through the microlens 193 of the substrate-side component 190.

4(A), 4(B), and 4(C) illustrate a process for securing substrate side component 1900 to waveguide layer 161 in one example. The substrate side component 1900, which is not provided with the wings 198 of this embodiment, is fixed to the waveguide layer 161 by the following fixing process.

This fixation process may be performed by a pick tool 900. Pick tool 900 may include a base 910, a pick head 930, a holder 950, and an adhesive dispenser 960. Base 910 supports main substrate 10 on which waveguide layer 161 is provided. The pick head 930 selects the board side component 1900. A holder 950, for example a robotic arm, holds and moves the pick head 930. Adhesive dispenser 960 dispenses adhesive 210 in a fluidized state onto waveguide layer 161 . Pick head 930 and holder 950 are examples of claimed moving units.

As shown in FIG. 4A, in the initial state, the main substrate 10 provided with the waveguide layer 161 is placed on the base 910. In the first step, the holder 950 uses the pick head 930 to select the substrate side component 1900 and places the substrate side component 1900 on the waveguide layer 161.

As shown in FIG. 4(B), in a second step, adhesive dispenser 960 dispenses adhesive 210 around all sides of board-side component 1900. In the second step, the pick head 930 is holding the board side component 1900.

As shown in FIG. 4C, in the third step, the adhesive 210 is cured by UV irradiation so that the substrate side component 1900 is fixed to the waveguide layer 161. In the third step, the pick head 930 is holding the board side component 1900.

In this example, it is necessary to dispense the adhesive 210 while the pick tool 900 holds the board-side component 1900 in a certain position by the pick head 930. This would be a challenge due to space considerations. Furthermore, the pick tool 900 is monopolized for a relatively long period of time due to the set of substrate side parts 1900 and the waveguide layer 161. This can increase production costs. If a thermoset material were used as adhesive 210 in this example, pick tool 900 would dominate for an even longer period of time.

5(A), 5(B), and 5(C) illustrate another process for securing the substrate side component 1900 to the waveguide layer 161 in another example.

As shown in FIG. 5A, in the initial state, the main substrate 10 provided with the waveguide layer 161 is placed on the base 910. In the first step, the adhesive dispenser 960 dispenses the adhesive 210 onto the waveguide layer 161 along the outer periphery of the area where the substrate side component 1900 will be placed.

As shown in FIG. 5B, in the second step, the holder 950 uses the pick head 930 to select the substrate side component 1900 and places the substrate side component 1900 onto the waveguide layer 161. In this step, the bottom of the substrate side part 1900 presses the adhesive 210 dispensed onto the waveguide layer 161.

As shown in FIG. 5C, in the third step, the adhesive 210 is cured by UV irradiation so that the substrate side component 1900 is fixed to the waveguide layer 161. In the third step, the pick head 930 is holding the board side component 1900.

In this example, the adhesive 210 is dispensed onto the waveguide layer 161 before the substrate side component 1900 is placed on the waveguide layer 161 so that the substrate side component 1900 presses the adhesive 210 from above. This distributes the adhesive 210 through the gap GP (see FIG. 3(A)). The distributed adhesive 210 flows into the mirror cavity 167. Such flow of adhesive 210 into mirror cavity 167 may reduce the reflectivity of mirror M. To prevent this flow of adhesive 210, very tight control of the size of the gap GP or the amount of adhesive may be required in this example.

Furthermore, the adhesive 210 under the board-side component 1900 needs to be irradiated with UV light that has passed through the board-side component 1900. This can affect yield in the manufacturing process. Furthermore, the degree of solidification of the adhesive 210 under the board-side component 1900 may be uneven. This can also affect the yield in the manufacturing process.

In this embodiment, on the contrary, the substrate-side part 190 is provided with wings 198, thereby allowing preliminary tacking prior to the complete assembly process. This provides precise alignment and fixation in one process, increasing both yield and throughput.

FIG. 6 is a perspective view of the board-side component 190 according to the first embodiment. FIG. 7 is a partial cross-sectional view within circle VII in FIG. 3(A). Wing 198 will be described in detail with reference to FIGS. 6 and 7. Wings 198 are one example of a claimed protrusion.

As shown in FIG. 6, the wings 198 may be provided on each side of the board-side component 190 in the longitudinal direction. In the illustrated embodiment, wings 198 are provided on each side of body 199 in a polymer injection molding process to create substrate side part 190. In some embodiments, the wings 198 are provided at positions facing each other across the region including the waveguide core WG (see FIG. 3(B)).

As mentioned above, body 199 has a generally rectangular shape. The main body 199 has a first surface 1903 facing in one direction along the width direction (to the right in FIG. 6) and a second surface 1903 facing in the opposite direction along the width direction (to the left in FIG. 6). It has a surface 1905. The main body 199 has a rectangular shape when viewed from above. That is, the main body 199 has a short side 1907 and a long side 1909 when viewed from above.

Wings 198 are protrusions on first surface 1903 and second surface 1905, ie, on short side 1907 of body 199. In the illustrated embodiment, wings 198 are provided on diagonal corners of body 199. More specifically, the wings 198 are provided at positions facing each other with the microlens array 191 interposed therebetween. First surface 1903 is an example of a claimed side of the body.

Wings 198 may have the same shape. In the illustrated embodiment, wings 198 are planar members. That is, the wing 198 has a generally rectangular (square) planar shape provided along the upper surface 1611 (see FIG. 7) of the waveguide layer 161. Each wing 198 has a bottom surface 1981 and a top surface 1983. Bottom surface 1981 faces top surface 1611 of waveguide layer 161 . Bottom surface 1981 is an example of a claimed adhesive surface. Top surface 1983 is an example of a claimed opposing surface.

Next, the dimensions of body 199 and wings 198 will be described. In the illustrated embodiment, the body 199 has a width (see length B1) of 6 mm, a depth (see length B2) of 5 mm, and a height (see length B3) of 1 mm. Wing 198 has a width (see length W1) of 1 mm, a depth (see length W2) of 1 mm, and a height (thickness) (see length W3) of 0.5 mm.

The thickness of the wings 198 is less than the height of the body 199. More specifically, the thickness of wings 198 may be less than or equal to half the thickness of body 199. The thickness of the wings 198 is selected to provide sufficient mechanical strength, manufacturability with molds, and sufficient light transmission for rapid UV tacking (described below).

As shown in FIG. 7, each wing 198 is provided on the main body 199 at a position where a gap CL is formed between the bottom surface 1981 of the wing 198 and the top surface 1611 of the waveguide layer 161. The gap CL is smaller than the thickness of the wing 198. More specifically, the gap CL may be less than half the thickness of the wing 198. In the illustrated embodiment, the gap CL may be about 0.07 mm (see length C1 in FIG. 7).

The gap CL is selected based on the adhesive area size (i.e., the area of the bottom surface 1981), the height of the droplet of adhesive 210 (described below), and the height of the waveguide structure, e.g., alignment marker AM. It will be done. In some embodiments, alignment marker AM is a raised mark for machine vision provided on waveguide layer 161. Photolithography may be used to pattern the waveguide core WG and to form alignment markers AM on the waveguide layer 161. Gap CL may be greater than the height of alignment marker AM and prevents wing 198 from contacting alignment marker AM.

Wings 198 provide adhesive areas on the outside of body 199 to prevent adhesive 210 from interfering with the optical path and microlenses 193. In the illustrated embodiment, bottom surface 1981 is adhered to top surface 1611 of waveguide layer 161 using adhesive 210, more specifically tacking adhesive 210A.

The gap CL can be regarded as a space for accommodating the tacking adhesive 210A. This space prevents tacking adhesive 210A from flowing into mirror cavity 167. Further, a portion of the first surface 1903 or the second surface 1905 facing this space rises from the upper surface 1611 of the waveguide layer 161. In other words, these portions may be perpendicular to the top surface 1611 of the waveguide layer 161. This also allows first surface 1903 and second surface 1905 to prevent tacking adhesive 210A from flowing into mirror cavity 167. Furthermore, this space is open except for the bottom surface 1981 of the wing 198, the top surface 1611 of the waveguide layer 161, and the sides of the first surface 1903 or second surface 1905 of the body 199. This allows tacking adhesive 210A to flow in a direction other than toward mirror cavity 167.

The tacking adhesive 210A is cured by UV light irradiated from above the wing 198. Here, in the illustrated embodiment, the top surface 1983 is a flat surface. This allows the entire tacking adhesive 210A to be illuminated with a uniform intensity of UV light. Additionally, the relatively small thickness of the wings 198 may increase the UV light intensity on the tacking adhesive 210A. In some embodiments, the wings 198 (substrate side parts 190) may be made from a transparent material that is transparent to UV light.

In some embodiments, the wings 198 are provided on the outside of the body 199 so that the size or shape of the wings 198 can be designed independently from the size or shape of the body 199.

8(A), 8(B), 8(C), 8(D), and 8(E) illustrate the process for fixing the substrate side component 190 to the waveguide layer 161 in the first embodiment. show. The fixing process in the first embodiment will be described in detail with reference to FIGS. 8(A) to 8(E).

As shown in FIG. 8A, in the initial state, the main substrate 10 provided with the waveguide layer 161 is placed on the base 910. In a first step, adhesive dispenser 960 dispenses adhesive 210 onto waveguide layer 161. In this step, a droplet of tacking adhesive 210A, which is UV curable, is dispensed onto the area where the wings 198 will be placed. That is, the tacking adhesive 210A is applied to two locations facing each other with the area on which the board-side component 190 will be placed (see FIG. 3(B)) interposed therebetween.

As shown in FIG. 8B, in the second step, the holder 950 uses the pick head 930 to select the substrate side component 190 and places the substrate side component 190 on the waveguide layer 161. In this step, wings 198 are placed over the areas where tacking adhesive 210A has been dispensed. That is, the bottom surface 1981 of the wing 198 presses the tacking adhesive 210A. In the second step, the pick head 930 is holding the board side component 190.

As shown in FIG. 8C, in the third step, the tacking adhesive 210A is cured by UV irradiation so that the substrate-side component 190 is tacked to the waveguide layer 161. In some embodiments, the UV light is applied at 400 mW/ ^cm for 30 seconds. In the third step, the pick head 930 is holding the board side component 190.

As shown in FIG. 8(D), in the fourth step, the holder 950 selects the substrate-side component 190 tacked to the waveguide layer 161 from the base 910, and hardens the substrate-side component 190 and the waveguide layer 161. Place it on the base 970. In other words, holder 950 transfers them from base 910 to hardening base 970. In this step, the tacking adhesive 210A is further cured by UV radiation to complete the UV curing process. In some embodiments, the UV light is applied at 1500 mW/cm for ² minutes. Since the substrate-side component 190 was tacked to the waveguide layer 161 in the third step (see FIG. 8(C)), the pick head 930 does not need to hold the substrate-side component 190 in the fourth step.

As shown in FIG. 8(E), in the fifth step, holder 950 transfers substrate side component 190 and waveguide layer 161 from hardening base 970 to heating plate 990. In this step, adhesive dispenser 1960 dispenses sidefill adhesive 210B, which may be thermosetting or UV curable. In some embodiments, the side fill adhesive 210B must not flow under the substrate side component 190 to remain on the outer periphery of the waveguide layer 161. Side fill adhesive 210B is then cured by heating plate 990. That is, thermal tacking is performed in the fifth step. Furthermore, in the fifth step, it is not necessary for the pick head 930 to hold the board-side component 190. Heating plate 990 is one example of a claimed support base.

In this manner, substrate side component 190 is attached to waveguide layer 161 in an automated attachment process. In this process, substrate side component 190 may first be tacked to waveguide layer 161 using wings 198 and tacking adhesive 210A in a third step. This reduces the time during which the board-side component 190 monopolizes the pick tool 900.

In the illustrated embodiment, substrate side component 190 may be secured to waveguide layer 161 by a combination of tacking adhesive 210A and side fill adhesive 210B. Furthermore, as shown in FIG. 3(B), each wing 198 is provided axially between the side fill adhesives 210B. Side fill adhesive 210B may prevent wings 198 from moving axially. Tacking adhesive 210A is an example of a claimed adhesive. Sidefill adhesive 210B is an example of another claimed adhesive.
(Arrangement of board side components 190)

FIG. 9 is a top view of the board-side components 190 arranged on the main board 10 according to the first embodiment.

As shown in FIG. 9, a plurality of board-side components 190 are arranged on the main board 10. As shown in FIG. In the illustrated embodiment, four board-side components 190 are arranged along the width direction. Each board-side component 190 is provided with a wing 198 diagonally opposite the main body 199. In other words, the wings 198 are provided in asymmetric positions. This allows wings 198 to be arranged in staggered positions. This arrangement allows the space S1 between the bodies 199 to be reduced to at most the width of the wings 198 (see length W1). In other words, the asymmetric arrangement allows multiple board-side components 190 to be placed closely together without obstruction between the wings 198 of adjacent board-side components 190.

FIG. 10A is a top view of board-side components 290A arranged on the main board 10 according to the second embodiment. FIG. 10B is a top view of board-side components 290B arranged on the main board 10 according to the third embodiment. In FIGS. 10A and 10B, the same parts as in the first embodiment shown in FIGS. 1-3 and 6-9 are represented by the same reference numerals and a detailed description thereof is omitted.

A board-side component 290A according to the second embodiment will be described with reference to FIG. 10A. In the first embodiment described above, the board-side part 190 is provided with wings 198 mounted in an asymmetrical arrangement on the outside of the main body 199. The arrangement of wings 198 is not limited to this. In some embodiments, as shown in FIG. 10A, the board side piece 290A is provided with wings 298A mounted on the outside of the body 199 in a symmetrical arrangement. This arrangement requires a space S2 in the width direction between the bodies 199, which is at least the width of the two wings 298A or more.

A board-side component 290B according to the third embodiment will be described with reference to FIG. 10B. As shown in FIG. 10B, the board-side component 290B is provided with wings 298B mounted in a symmetrical arrangement on its long side 1909. This arrangement can reduce the space S3 between the bodies 199 in the width direction. This arrangement requires space between body 199 and adjacent components to avoid interference between wing 298B and other components.

11(A), 11(B), and 11(C) are top views of board side components 390A, 390B, and 390C. With reference to FIGS. 11(A) to 11(C), modifications of the board-side component 190 will be described. In the embodiments described above, wings 198, 298A, and 298B have a generally rectangular planar shape. The shapes of wings 198, 298A, and 298B are not limited thereto, and the shapes of wings 198, 298A, and 298B can be determined based on application requirements. Wings 198, 298A, and 298B can be hemispherical or cylindrical, such as cylindrical or prismatic.

In some embodiments, as shown in FIG. 11(A), wings 3981 and 3982 provided on substrate side component 390A may have a generally triangular planar shape. Wings 3981 and 3982 may be oppositely oriented.

Furthermore, as shown in FIG. 11(B), the wings 3983 and 3984 provided on the board-side component 390B may have a generally semicircular planar shape. In other words, wings 198, 298A, and 298B may have rounded corners.

Furthermore, the number of wings 198, 298A, and 298B provided on a single body 199 is not limited to two. As shown in FIG. 11(C), three wings 3985, 3986, and 3987 may be provided on the single body 199 of the board side component 390C. Further, the number of wings 198, 298A, and 298B on opposite sides of body 199 need not be equal to each other. In some embodiments, two wings 3985 and 3986 may be provided on one side of the body 199 and one wing 3987 may be provided on the other side of the body 199, as shown in FIG. may be provided. Alternatively, only one wing 198 may be provided on a single body 199.

Additionally, in the above description with reference to FIGS. 8(A)-8(E), tacking adhesive 210A is dispensed under wing 198 for tacking to waveguide layer 161. Wings 198 can also be tacked to waveguide layer 161 with adhesive 210 dispensed around the sides of wings 198 instead of tacking adhesive 210A.

12(A) and 12(B) are side and top views of a board-side component 490 according to yet another modification. In the embodiments described above, board-side components 190, 290A, and 290B have wings 198, 298A, and 298B, respectively. However, a gap CL (see FIG. 7) is formed between the bottom surface of the substrate side component 190, 290A, or 290B and the top surface 1611 of the waveguide layer 161 on at least one side surface of the substrate side component 190, 290A, or 290B. As long as the substrate side parts 190, 290A, and 290B do not have wings.

In some embodiments, as shown in FIGS. 12(A) and 12(B), the board-side component 490 is provided with recessed regions 498 on both sides of the bottom surface of the board-side component 490 in the vertical direction. The recessed region 498 makes it possible to form a gap CL for accommodating the tacking adhesive 210A (see FIG. 7). Recessed region 498 is an example of a claimed recess.

FIG. 13 is a schematic diagram of a device 100 provided with an optical communication system 1.

The optical communication system 1 described above may be provided on the device 100. Apparatus 100 may be any device, such as a high-performance (HPC) system, high-end server, computer, or automobile. As shown, the apparatus 100 may include an operating unit 101, such as a display or monitor, and a device body 103. The operation unit 101 may operate based on signals from the optical communication system 1 described above. The optical communication system 1 and the operation unit 101 may be mounted on the device body 103. That is, in the manufacturing process of the device 100, the substrate side component 190 fixed to the waveguide layer 161 is placed on the device body 103. Optical communication system 1 is an example of a claimed optical device. Apparatus 100 is an example of a claimed device.

Although descriptions of various embodiments of the invention have been presented for purposes of illustration, they are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is used to best explain the principle, practical application, or technical improvement of the embodiments over technology found in the marketplace, or to explain the embodiments disclosed herein in other contexts. It was chosen to help traders understand it.

Claims (17)

An optical device,
a substrate including a plurality of waveguide cores; and an optical component provided on the substrate, the optical component including a plurality of lenses, each of the plurality of lenses corresponding to one of the plurality of waveguide cores on the substrate. The optical component transmits the light passing through the optical component,
The optical component includes a main body and a protrusion, the main body is provided with the plurality of lenses, and the protrusion protrudes from a side surface of the main body,
the protrusion is fixed to the substrate with an adhesive;
optical device. The protrusion includes an adhesive surface facing the upper surface of the substrate, and the adhesive surface is fixed to the substrate with the adhesive that connects the adhesive surface of the protrusion and the upper surface of the substrate. Item 1. The optical device according to item 1. a gap is formed between the adhesive surface of the protrusion and the upper surface of the substrate;
the gap is smaller than the thickness of the protrusion;
The optical device according to claim 2. The optical device according to claim 2 or 3, wherein the protrusion includes a facing surface provided on a side opposite to the adhesive surface of the protrusion. 5. The optical device according to claim 1, wherein the protrusion is a planar member having a planar shape, and the planar member is provided along the upper surface of the substrate. The optical device according to any one of claims 1 to 5, wherein the optical component is provided with a plurality of the protrusions, and the plurality of protrusions are provided at positions facing each other with the plurality of lenses in between. . Any one of claims 1 to 5, wherein the optical component is provided with a plurality of the protrusions, and the plurality of protrusions are provided at positions facing each other across a region including the plurality of waveguide cores. Optical device described in. The optical device according to claim 7, comprising a plurality of said optical components, wherein said plurality of said optical components are arranged on said substrate along a direction perpendicular to a direction along said plurality of waveguide cores. The optical device according to claim 8, wherein the plurality of protrusions are provided at different positions in the direction along the plurality of waveguide cores. The optical component is fixed to the substrate with another adhesive provided along the side surface of the main body, and the another adhesive joins the side surface of the main body and the top surface of the substrate. 10. The optical device according to any one of 1 to 9. 11. The optical device according to claim 10, wherein the other adhesive bonds a side surface of the protrusion and the top surface of the substrate. the adhesive comprises a photocurable material;
the other adhesive comprises a thermosetting material or a UV curable material;
The optical device according to claim 10 or 11. The optical device according to any one of claims 1 to 12, wherein the thickness of the protrusion is less than half the thickness of the body. An optical device,
a substrate including a plurality of waveguide cores; and an optical component provided on the substrate, the optical component including a plurality of lenses , each of the plurality of lenses corresponding to one of the plurality of waveguide cores on the substrate. The optical component includes a surface facing the substrate and a recess provided on the surface, the recesses face each other with the plurality of lenses in between, and the optical component is in the recess. the optical component fixed to the substrate by an adhesive contained in the optical component;
An optical device comprising: A device comprising an optical device and an operation unit that operates based on a signal from the optical device, the optical device comprising:
A substrate including a plurality of waveguide cores, the substrate allowing light to pass through the plurality of waveguide cores; and an optical component provided on the substrate, the substrate including a plurality of lenses. , each of the plurality of lenses transmits light passing through a corresponding one of the plurality of waveguide cores on the substrate, the optical component includes a body and a protrusion, and the body includes a plurality of lenses. is provided, the protrusion protrudes from a side surface of the main body, and the protrusion is fixed to the substrate with an adhesive.
device. A method for making an optical device, the method comprising:
forming a substrate and an optical component, the substrate including a plurality of waveguide cores, the plurality of waveguide cores allowing light to pass through the plurality of waveguide cores; is provided on the substrate, and the optical component includes a plurality of lenses, each of the plurality of lenses transmitting light passing through a corresponding one of the plurality of waveguide cores on the substrate. operable, the optical component comprising a body and a protrusion, the body being provided with the plurality of lenses, and the protrusion protruding from a side of the body;
and securing the protrusion to the substrate with an adhesive. A method for making a device, the method comprising:
forming a substrate, an optical component, and a device body, the substrate including a plurality of waveguide cores, the plurality of waveguide cores allowing light to pass through the plurality of waveguide cores; The optical component is provided on the substrate, and the optical component includes a plurality of lenses, each of the plurality of lenses transmitting light passing through a corresponding one of the plurality of waveguide cores on the substrate. , the optical component includes a main body and a protrusion, the main body is provided with the plurality of lenses, and the protrusion protrudes from a side surface of the main body;
fixing the protrusion to the substrate with an adhesive;
placing the optical component fixed to the substrate on the device body.

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