JP7356769B1 - Post-processing technology for trivalent chromium plating film - Google Patents
Post-processing technology for trivalent chromium plating film Download PDFInfo
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- JP7356769B1 JP7356769B1 JP2023070823A JP2023070823A JP7356769B1 JP 7356769 B1 JP7356769 B1 JP 7356769B1 JP 2023070823 A JP2023070823 A JP 2023070823A JP 2023070823 A JP2023070823 A JP 2023070823A JP 7356769 B1 JP7356769 B1 JP 7356769B1
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- trivalent chromium
- chromium plating
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- hydrogen peroxide
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- 238000007747 plating Methods 0.000 title claims abstract description 103
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052804 chromium Inorganic materials 0.000 title claims abstract description 81
- 239000011651 chromium Substances 0.000 title claims abstract description 81
- 238000005516 engineering process Methods 0.000 title abstract description 3
- 238000012805 post-processing Methods 0.000 title description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000011282 treatment Methods 0.000 claims abstract description 48
- 239000007864 aqueous solution Substances 0.000 claims abstract description 45
- 230000007797 corrosion Effects 0.000 claims abstract description 37
- 238000005260 corrosion Methods 0.000 claims abstract description 37
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 22
- 239000011574 phosphorus Substances 0.000 claims abstract description 22
- -1 phosphorus compound Chemical class 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 14
- 238000005868 electrolysis reaction Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 5
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 4
- 229910001430 chromium ion Inorganic materials 0.000 claims description 4
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 4
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 4
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 4
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 4
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 4
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 4
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 4
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 3
- 150000003018 phosphorus compounds Chemical class 0.000 claims description 3
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 3
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 239000000243 solution Substances 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 34
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 16
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 235000019832 sodium triphosphate Nutrition 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 2
- 229940048086 sodium pyrophosphate Drugs 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- XMFOQHDPRMAJNU-UHFFFAOYSA-N lead(ii,iv) oxide Chemical compound O1[Pb]O[Pb]11O[Pb]O1 XMFOQHDPRMAJNU-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 208000014451 palmoplantar keratoderma and congenital alopecia 2 Diseases 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
【課題】3価クロムめっき膜に対して、色調変化をより抑えつつ、耐食性をより向上させる技術を提供すること。【解決手段】過酸化水素及びリン化合物を含有する、3価クロムめっき膜の陰極電解処理に用いるための水溶液。【選択図】なしAn object of the present invention is to provide a technology for further improving corrosion resistance of a trivalent chromium plating film while further suppressing color change. [Solution] An aqueous solution containing hydrogen peroxide and a phosphorus compound and used for cathodic electrolytic treatment of a trivalent chromium plating film. [Selection diagram] None
Description
本発明は、3価クロムめっき膜の後処理技術に関する。 The present invention relates to post-treatment technology for trivalent chromium plating films.
自動車の内外装部品や水栓金具部品等の最終表面処理として優れた外観および耐食性を付与するためにクロムめっきが使用されている。従来のクロムめっきは6価クロムを使用したものが一般的であったが、近年ではその有害性から作業環境への悪影響のため6価クロムの使用が制限され始めている。 Chrome plating is used as a final surface treatment for interior and exterior parts of automobiles, faucet metal parts, etc. to give them excellent appearance and corrosion resistance. Conventional chromium plating has generally used hexavalent chromium, but in recent years the use of hexavalent chromium has begun to be restricted due to its toxicity and adverse effects on the working environment.
そこで6価クロムめっきの代替として、3価クロムめっきが開発されている。浴組成によっては6価クロムめっきでは得られないような暗い色調(L*a*b*表色系におけるL*値が70以下)の皮膜を得ることもできるため、暗色系を中心に現在では3価クロムめっきが広まっている。しかしながら、3価クロムめっき膜は6価クロムめっき膜と比較して耐食性が劣る。 Therefore, trivalent chromium plating has been developed as an alternative to hexavalent chromium plating. Depending on the bath composition, it is possible to obtain a film with a dark tone (L* value in the L*a*b* color system is 70 or less) that cannot be obtained with hexavalent chromium plating. Trivalent chromium plating is becoming widespread. However, the trivalent chromium plating film has inferior corrosion resistance compared to the hexavalent chromium plating film.
そのため耐食性の厳しい規格をクリアするためには、3価クロムめっき膜の後処理に6価クロムを使用した電解クロメートを行なうのが現在では一般的である。したがって、実際には6価クロムを使用しないプロセスとはなっておらず、6価クロムを使用しない後処理剤の研究が行われている。 Therefore, in order to meet strict standards for corrosion resistance, it is now common practice to perform electrolytic chromate using hexavalent chromium in the post-treatment of trivalent chromium plating films. Therefore, in reality, there is no process that does not use hexavalent chromium, and research is being conducted on post-treatment agents that do not use hexavalent chromium.
最近では、さまざまなタイプの6価クロムフリーの後処理に関する報告も増え、製品開発もされている。しかし実際の耐食性は6価クロム電解クロメートには及ばず、特に暗い色調の3価クロムめっき膜上では耐食性への効果が弱い。また、6価クロムの有無にかかわらず、後処理により色調が変化すること(L*a*b*表色系における特にb*値の増加)も課題である。 Recently, there has been an increase in reports on various types of hexavalent chromium-free post-treatments, and product development is also underway. However, its actual corrosion resistance is not as good as that of hexavalent chromium electrolytic chromate, and its effect on corrosion resistance is particularly weak on dark-colored trivalent chromium plating films. Another problem is that the color tone changes due to post-treatment regardless of the presence or absence of hexavalent chromium (particularly an increase in the b* value in the L*a*b* color system).
特許文献1には、リン酸塩、酸化剤、及び非イオン性界面活性剤を含み、残部が水であることを特徴とする防錆剤が開示されている。しかしながら、この防錆剤は、耐食性の向上効果が不十分である。 Patent Document 1 discloses a rust preventive agent containing a phosphate, an oxidizing agent, and a nonionic surfactant, with the remainder being water. However, this rust preventive agent has insufficient effect on improving corrosion resistance.
本発明は、3価クロムめっき膜に対して、色調変化をより抑えつつ、耐食性をより向上させる技術を提供することを課題とする。 An object of the present invention is to provide a technique for further improving the corrosion resistance of a trivalent chromium plating film while further suppressing color change.
本発明者は上記課題に鑑みて鋭意研究を進めた結果、過酸化水素及びリン化合物を含有する、3価クロムめっき膜の陰極電解処理に用いるための水溶液、により、上記課題を解決できることを見出した。本発明者はこの知見に基づいてさらに研究を進めた結果、本発明を完成させた。即ち、本発明は、下記の態様を包含する。 As a result of intensive research in view of the above problems, the present inventor found that the above problems could be solved by an aqueous solution containing hydrogen peroxide and a phosphorus compound and used for cathodic electrolytic treatment of trivalent chromium plating films. Ta. The present inventor conducted further research based on this knowledge and completed the present invention. That is, the present invention includes the following aspects.
項1. 過酸化水素及びリン化合物を含有する、3価クロムめっき膜の陰極電解処理に用いるための水溶液。 Item 1. An aqueous solution containing hydrogen peroxide and a phosphorus compound for use in cathodic electrolytic treatment of trivalent chromium plating films.
項2. pHが1.5~5.5である、項1に記載の水溶液。 Item 2. Item 1. The aqueous solution according to item 1, which has a pH of 1.5 to 5.5.
項3. 前記過酸化水素の含有量が1g/L以上である、項1に記載の水溶液。 Item 3. Item 2. The aqueous solution according to Item 1, wherein the hydrogen peroxide content is 1 g/L or more.
項4. 前記リン化合物の含有量が1g/L以上である、項1に記載の水溶液。 Item 4. Item 2. The aqueous solution according to Item 1, wherein the content of the phosphorus compound is 1 g/L or more.
項5. 前記過酸化水素の含有量が1~500g/Lであり、且つ前記リン化合物の含有量が1~200g/Lである、項1に記載の水溶液。 Item 5. Item 2. The aqueous solution according to Item 1, wherein the hydrogen peroxide content is 1 to 500 g/L, and the phosphorus compound content is 1 to 200 g/L.
項6. 前記リン化合物がリン酸、リン酸水素二カリウム、リン酸水素二ナトリウム、リン酸二水素カリウム、リン酸二水素ナトリウム、ピロリン酸およびその塩、トリポリリン酸およびその塩、エチドロン酸およびその塩、並びにアミノトリメチレンホスホン酸およびその塩からなる群より選択される少なくとも1種である、項1に記載の水溶液。 Item 6. The phosphorus compound is phosphoric acid, dipotassium hydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, pyrophosphoric acid and its salts, tripolyphosphoric acid and its salts, etidronic acid and its salts, and Item 2. The aqueous solution according to Item 1, which is at least one selected from the group consisting of aminotrimethylenephosphonic acid and salts thereof.
項7. 項1~6のいずれかに記載の水溶液中で3価クロムめっき膜を陰極電解することを含む、耐食性3価クロムめっき膜の製造方法。 Section 7. Item 7. A method for producing a corrosion-resistant trivalent chromium plating film, the method comprising cathodic electrolyzing the trivalent chromium plating film in the aqueous solution according to any one of Items 1 to 6.
項8. 陰極電流密度が0.01~3A/dm2である、項7に記載の製造方法。 Section 8. Item 8. The manufacturing method according to item 7, wherein the cathode current density is 0.01 to 3 A/dm 2 .
項9. 通電時間が30~1000秒間である、項7に記載の製造方法。 Item 9. Item 7. The manufacturing method according to Item 7, wherein the energization time is 30 to 1000 seconds.
項10. 陰極電解中の浴温が10~50℃である、項7に記載の製造方法。 Item 10. Item 7. The manufacturing method according to Item 7, wherein the bath temperature during cathode electrolysis is 10 to 50°C.
項11. 項1~6のいずれかに記載の水溶液中で3価クロムめっき膜を陰極電解することを含む、3価クロムめっき膜の後処理方法。 Item 11. Item 7. A method for post-treatment of a trivalent chromium plating film, which comprises cathodically electrolyzing the trivalent chromium plating film in the aqueous solution according to any one of Items 1 to 6.
項12. 項7に記載の製造方法によって得られる、耐食性3価クロムめっき膜。 Item 12. Item 7. A corrosion-resistant trivalent chromium plating film obtained by the manufacturing method according to item 7.
項13. 項12に記載の耐食性クロムめっき膜を含む、物品。 Item 13. Item 13. An article comprising the corrosion-resistant chromium plating film according to Item 12.
本発明によれば、3価クロムめっき膜に対して、色調変化をより抑えつつ、耐食性をより向上させる技術を提供することができる。より具体的には、本発明によれば、3価クロムめっき膜の陰極電解処理に用いるための水溶液、耐食性3価クロムめっき膜の製造方法、3価クロムめっき膜の後処理方法、耐食性3価クロムめっき膜、耐食性3価クロムめっき膜を含む物品等を提供することができる。 According to the present invention, it is possible to provide a technique for further improving corrosion resistance of a trivalent chromium plating film while further suppressing color change. More specifically, the present invention provides an aqueous solution for use in cathodic electrolytic treatment of a trivalent chromium plating film, a method for producing a corrosion-resistant trivalent chromium plating film, a post-treatment method for a trivalent chromium plating film, and a corrosion-resistant trivalent chromium plating film. It is possible to provide articles containing a chromium plating film, a corrosion-resistant trivalent chromium plating film, and the like.
本明細書中において、「含有」及び「含む」なる表現については、「含有」、「含む」、「実質的にからなる」及び「のみからなる」という概念を含む。 In this specification, the expressions "contain" and "including" include the concepts of "containing", "comprising", "consisting essentially" and "consisting only".
1.水溶液
本発明は、その一態様において、過酸化水素及びリン化合物を含有する、3価クロムめっき膜の陰極電解処理に用いるための水溶液(本明細書において、「本発明の水溶液」と示すこともある。)、に関する。
1. Aqueous solution In one aspect, the present invention provides an aqueous solution containing hydrogen peroxide and a phosphorus compound for use in cathodic electrolytic treatment of a trivalent chromium plating film (herein also referred to as "aqueous solution of the present invention"). ).
過酸化水素は、本発明の水溶液において酸化剤として作用する。過酸化水素により、3価クロムめっき膜上に酸化皮膜及び/又はリンと共にリン酸皮膜を形成させることができる。また、陽極素材によっては、過酸化水素により、陽極の溶解を抑制することもできる。 Hydrogen peroxide acts as an oxidizing agent in the aqueous solution of the present invention. Hydrogen peroxide can form a phosphoric acid film together with an oxide film and/or phosphorus on the trivalent chromium plating film. Further, depending on the anode material, hydrogen peroxide can also suppress dissolution of the anode.
過酸化水素の含有量は、特に制限されないが、耐食性の向上、陽極の溶解抑制等の観点から、好ましくは1g/L以上、より好ましくは2g/L以上、さらに好ましくは5g/L以上、よりさらに好ましくは7g/L以上、特に好ましくは10g/L以上である。過酸化水素の含有量の上限は、特に制限されず、例えば500g/Lである。当該上限は、コストの観点から、好ましくは300g/L、より好ましくは200g/L、さらに好ましくは150g/Lよりさらに好ましくは120g/Lである。過酸化水素の含有量の範囲は、上記下限及び上記上限の任意の組合せであることができるが、例えば1~500g/L、好ましくは2~300g/L、より好ましくは5~200g/L、さらに好ましくは5~150g/Lである。 The content of hydrogen peroxide is not particularly limited, but from the viewpoint of improving corrosion resistance, suppressing dissolution of the anode, etc., it is preferably 1 g/L or more, more preferably 2 g/L or more, even more preferably 5 g/L or more, and more. More preferably, it is 7 g/L or more, particularly preferably 10 g/L or more. The upper limit of the content of hydrogen peroxide is not particularly limited, and is, for example, 500 g/L. From the viewpoint of cost, the upper limit is preferably 300 g/L, more preferably 200 g/L, still more preferably 150 g/L, and even more preferably 120 g/L. The range of the content of hydrogen peroxide can be any combination of the above lower limit and the above upper limit, for example, 1 to 500 g/L, preferably 2 to 300 g/L, more preferably 5 to 200 g/L, More preferably, it is 5 to 150 g/L.
リン化合物により、3価クロムめっき膜上に形成される皮膜の最表層にリン酸皮膜を形成させることができる。また、リン化合物により、過酸化水素の分解を抑制することもできる。 The phosphorus compound allows a phosphoric acid film to be formed on the outermost layer of the film formed on the trivalent chromium plating film. Further, the phosphorus compound can also suppress the decomposition of hydrogen peroxide.
リン化合物としては、リンを含有する化合物である限り特に制限されず、めっき後処理に添加し得る無機化合物及び有機化合物のいずれも使用することができる。無機リン化合物としては、好ましくはリン酸、リン酸水素二カリウム、リン酸水素二ナトリウム、リン酸二水素カリウム、リン酸二水素ナトリウム、ピロリン酸およびその塩(例えば、ピロリン酸カリウム、ピロリン酸ナトリウム等)、トリポリリン酸およびその塩(例えば、トリポリリン酸カリウム、トリポリリン酸ナトリウム等)等が挙げられる。有機リン化合物としては、好ましくはエチドロン酸およびその塩、アミノトリメチレンホスホン酸およびその塩等が挙げられる。 The phosphorus compound is not particularly limited as long as it is a phosphorus-containing compound, and both inorganic and organic compounds that can be added to post-plating treatment can be used. Inorganic phosphorus compounds are preferably phosphoric acid, dipotassium hydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, pyrophosphoric acid and its salts (e.g., potassium pyrophosphate, sodium pyrophosphate). etc.), tripolyphosphoric acid and its salts (eg, potassium tripolyphosphate, sodium tripolyphosphate, etc.). Preferable examples of the organic phosphorus compound include etidronic acid and its salts, aminotrimethylenephosphonic acid and its salts, and the like.
リン化合物は、一種単独で、又は二種以上を混合して用いることができる。 The phosphorus compounds can be used alone or in combination of two or more.
リン化合物の含有量は、特に制限されないが、耐食性の向上、過酸化水素の消耗抑制等の観点から、好ましくは1g/L以上、より好ましくは2g/L以上、さらに好ましくは3g/L以上、よりさらに好ましくは5g/L以上、とりわけ好ましくは7g/L以上、特に好ましくは10g/L以上である。リン化合物の含有量の上限は、特に制限されず、例えば200g/Lである。当該上限は、陽極へのアタックの抑制、廃液処理の容易化等の観点から、好ましくは150g/L、より好ましくは100g/L、さらに好ましくは80g/Lよりさらに好ましくは60g/Lである。リン化合物の含有量の範囲は、上記下限及び上記上限の任意の組合せであることができるが、例えば1~200g/L、好ましくは2~150g/L、より好ましくは3~100g/L、さらに好ましくは5~80g/Lである。 The content of the phosphorus compound is not particularly limited, but from the viewpoint of improving corrosion resistance, suppressing consumption of hydrogen peroxide, etc., it is preferably 1 g/L or more, more preferably 2 g/L or more, even more preferably 3 g/L or more, It is even more preferably 5 g/L or more, particularly preferably 7 g/L or more, particularly preferably 10 g/L or more. The upper limit of the content of the phosphorus compound is not particularly limited, and is, for example, 200 g/L. The upper limit is preferably 150 g/L, more preferably 100 g/L, still more preferably 80 g/L, and even more preferably 60 g/L from the viewpoint of suppressing attack on the anode and facilitating waste liquid treatment. The range of the content of the phosphorus compound can be any combination of the above lower limit and the above upper limit, for example, 1 to 200 g/L, preferably 2 to 150 g/L, more preferably 3 to 100 g/L, and Preferably it is 5 to 80 g/L.
過酸化水素とリン化合物とが組み合わされていることにより、本発明の水溶液を後述の陰極電解処理に供することによって、3価クロムめっき膜に対して、色調変化をより抑えつつ、耐食性をより向上させることができる。 Due to the combination of hydrogen peroxide and a phosphorus compound, by subjecting the aqueous solution of the present invention to the cathodic electrolytic treatment described below, it is possible to further improve the corrosion resistance of trivalent chromium plating films while further suppressing color changes. can be done.
本発明の水溶液のpHは、耐食性の観点から、好ましくは1.5以上である。また、当該pHは、過酸化水素の分解抑制の観点から、好ましくは5.5以下である。当該pHは、上記2つの観点から、好ましくは1.5~5.5、より好ましくは2.0~5.0である。 The pH of the aqueous solution of the present invention is preferably 1.5 or higher from the viewpoint of corrosion resistance. Further, the pH is preferably 5.5 or less from the viewpoint of suppressing decomposition of hydrogen peroxide. From the above two viewpoints, the pH is preferably 1.5 to 5.5, more preferably 2.0 to 5.0.
本発明の水溶液は、バッファーとして機能させる目的で、例えば有機酸を含むことができる。有機酸としては、好ましくはクエン酸、コハク酸、酢酸、ギ酸、シュウ酸等が挙げられる。 The aqueous solution of the present invention can contain, for example, an organic acid for the purpose of functioning as a buffer. Preferred organic acids include citric acid, succinic acid, acetic acid, formic acid, and oxalic acid.
有機酸は、一種単独で、又は二種以上を混合して用いることができる。 The organic acids can be used alone or in combination of two or more.
有機酸の含有量は、例えば0~100g/L、好ましくは0~30g/Lである。 The content of organic acid is, for example, 0 to 100 g/L, preferably 0 to 30 g/L.
本発明の水溶液は、金属に依拠せずに、耐食性を向上させることができる。この観点から、本発明の水溶液の金属イオンの含有量は、例えば0~0.5g/L、好ましくは0~0.2g/L、より好ましくは0~0.1g/L、さらに好ましくは0~0.01g/L、よりさらに好ましくは0~0.001g/L、特に好ましくは0g/Lである。 The aqueous solution of the present invention can improve corrosion resistance without relying on metals. From this point of view, the metal ion content of the aqueous solution of the present invention is, for example, 0 to 0.5 g/L, preferably 0 to 0.2 g/L, more preferably 0 to 0.1 g/L, and even more preferably 0. ~0.01 g/L, more preferably 0 ~ 0.001 g/L, particularly preferably 0 g/L.
本発明の水溶液は、6価クロムに依拠せずに、耐食性を向上させることができる。この観点から、本発明の水溶液の6価クロムイオンの含有量は、例えば0~0.1g/L、好ましくは0~0.05g/L、より好ましくは0~0.02g/L、さらに好ましくは0~0.01g/L、よりさらに好ましくは0~0.001g/L、特に好ましくは0g/Lである。 The aqueous solution of the present invention can improve corrosion resistance without relying on hexavalent chromium. From this point of view, the content of hexavalent chromium ions in the aqueous solution of the present invention is, for example, 0 to 0.1 g/L, preferably 0 to 0.05 g/L, more preferably 0 to 0.02 g/L, and even more preferably is 0 to 0.01 g/L, even more preferably 0 to 0.001 g/L, particularly preferably 0 g/L.
本発明の水溶液の用途は、3価クロムめっき膜の陰極電解処理に用いることである。本発明者は、本発明の水溶液を3価クロムめっき膜の陰極電解処理に用いると3価クロムめっき膜の色調変化をより抑えつつ耐食性をより向上させることができるという新たな知見に基づいて、本発明の水溶液が上記用途に適することを見出した。 The aqueous solution of the present invention is used for cathodic electrolytic treatment of trivalent chromium plating films. Based on the new finding that when the aqueous solution of the present invention is used for cathodic electrolytic treatment of a trivalent chromium plating film, it is possible to further improve the corrosion resistance while further suppressing color change of the trivalent chromium plating film. It has been found that the aqueous solution of the present invention is suitable for the above uses.
このため、本発明は、その一態様において、本発明の水溶液中で3価クロムめっき膜を陰極電解することを含む、耐食性3価クロムめっき膜の製造方法、及び本発明の水溶液中で3価クロムめっき膜を陰極電解することを含む、3価クロムめっき膜の後処理方法、に関する。これら2つの方法をまとめて、「本発明の方法」と示すこともある。 Therefore, in one aspect, the present invention provides a method for producing a corrosion-resistant trivalent chromium plating film, which comprises cathodically electrolyzing a trivalent chromium plating film in the aqueous solution of the present invention, and The present invention relates to a method for post-processing a trivalent chromium plating film, which includes cathodic electrolysis of the chromium plating film. These two methods may be collectively referred to as the "method of the present invention."
3価クロムめっき膜は、3価クロムイオンを含むめっき液により得られためっき膜であって、金属としてクロムを主に含むめっき膜である限り特に制限されず、いわゆる3価クロム合金めっきも包含する。本発明の一態様において、3価クロムめっき膜中のクロム含有量は、金属100at%(原子パーセント)に対して、例えば1at%以上、2at%以上、5at%以上、10at%以上、20at%以上、30at%以上、40at%以上、又は45at%以上であり、また100at%以下、90at%以下、80at%以下、70at%以下、60at%以下、又は50at%以下であることができる。上記上限及び下限は、任意に組み合わせることができる。当該含有量は、エネルギー分散型X線分析(EDX)により測定することができる。3価クロムめっき膜中のクロム以外の金属としては、例えばCо、Fe、Mn、Ni、Zn等が挙げられる。 The trivalent chromium plating film is a plating film obtained using a plating solution containing trivalent chromium ions, and is not particularly limited as long as it is a plating film that mainly contains chromium as a metal, and includes so-called trivalent chromium alloy plating. do. In one aspect of the present invention, the chromium content in the trivalent chromium plating film is, for example, 1 at% or more, 2 at% or more, 5 at% or more, 10 at% or more, 20 at% or more with respect to 100 at% (atomic percent) of the metal. , 30 at% or more, 40 at% or more, or 45 at% or more, and can be 100 at% or less, 90 at% or less, 80 at% or less, 70 at% or less, 60 at% or less, or 50 at% or less. The above upper and lower limits can be arbitrarily combined. The content can be measured by energy dispersive X-ray analysis (EDX). Examples of metals other than chromium in the trivalent chromium plating film include Co, Fe, Mn, Ni, and Zn.
3価クロムめっき膜を形成するためのめっき液は、6価クロムイオンの含有量がより少ないことが好ましく、当該含有量は、例えば0~0.1g/L、好ましくは0~0.05g/L、より好ましくは0~0.02g/L、さらに好ましくは0~0.01g/L、よりさらに好ましくは0~0.001g/L、特に好ましくは0g/Lである。 The plating solution for forming the trivalent chromium plating film preferably has a lower content of hexavalent chromium ions, and the content is, for example, 0 to 0.1 g/L, preferably 0 to 0.05 g/L. L, more preferably 0 to 0.02 g/L, even more preferably 0 to 0.01 g/L, even more preferably 0 to 0.001 g/L, particularly preferably 0 g/L.
3価クロムめっき膜は、白色系(L*a*b*表色系におけるL*値が70以上)及び黒色系(L*a*b*表色系におけるL*値が70以下)のいずれでもあることができる。本発明の方法によれば、従来の6価クロムフリーの後処理による耐食性向上効果が限定的な黒色系3価クロムめっき膜に対しても、耐食性についてより良好な効果を発揮することができる。 Trivalent chromium plating film can be either white (L* value in L*a*b* color system is 70 or more) or black (L* value in L*a*b* color system is 70 or less). It can also be. According to the method of the present invention, even for black trivalent chromium plating films for which the corrosion resistance improvement effect of conventional hexavalent chromium-free post-treatments is limited, it is possible to exhibit better effects on corrosion resistance.
3価クロムめっき膜が形成されている対象物品は、特に制限されず、例えば、自動車部品;成型用金型;各種機械類の摩耗しやすい部品;工具類;印刷、製紙、圧延、フィルム加工、製鉄に用いられるロール、水栓金具、自転車部品、釣り具、携帯電話、カメラ、装飾品、雑貨等が挙げられる。 The target articles on which the trivalent chromium plating film is formed are not particularly limited, and include, for example, automobile parts; molding molds; easily worn parts of various machinery; tools; printing, paper making, rolling, film processing, Examples include rolls used in iron manufacturing, faucet fittings, bicycle parts, fishing gear, mobile phones, cameras, ornaments, and miscellaneous goods.
3価クロムめっき膜は、公知の方法に従って又は準じて形成することができる。 The trivalent chromium plating film can be formed according to or in a similar manner to a known method.
3価クロムめっき膜の陰極電解は、本発明の水溶液に、陰極として3価クロムめっき膜を浸漬し、且つ陽極を浸漬して、電気分解を行うことによって実行される。 Cathode electrolysis of the trivalent chromium plating film is carried out by immersing the trivalent chromium plating film as a cathode and the anode in the aqueous solution of the present invention, and performing electrolysis.
陽極としては、特に制限されず、種々の不溶性アノード、または可溶性アノードを使用することができる。 The anode is not particularly limited, and various insoluble anodes or soluble anodes can be used.
不溶性アノードとしては、例えば、カーボン、Ti/Pt(Tiに白金系コーティングを施したもの)、Ti/Ir酸化物(TiにIr酸化物コーティングを施したもの)、Ti/Ru酸化物(TiにRu酸化物コーティングを施したもの)、Ti/Ir酸化物-Ru酸化物(TiにIr酸化物とRu酸化物を混合させてコーティングを施したもの)、Ti/Ir酸化物-Ta酸化物(TiにIr酸化物とTa酸化物を混合させてコーティングを施したもの)、Ti/Pt/Ir酸化物-Ru酸化物(Ti/PtにIr酸化物とRu酸化物を混合させてコーティングを施したもの)、Ti/Pt/Ir酸化物-Ta酸化物(Ti/PtにIr酸化物とTa酸化物を混合させてコーティングを施したもの)、ステンレス、アルミニウム、鉛合金(Pb-Sn合金、Pb-Ag合金、Pb-Sb合金)、鉛酸化物(一酸化鉛、二酸化鉛、三酸化鉛、四酸化三鉛)、鉛、酸化スズ、カーボン、ダイヤモンド電極(窒素やホウ素を含んだダイヤモンドをシリコンやニオブなどの基体に被覆したもの)、ITO電極(インジウムスズ電極)等を挙げることができる。 Examples of insoluble anodes include carbon, Ti/Pt (Ti coated with platinum), Ti/Ir oxide (Ti coated with Ir oxide), Ti/Ru oxide (Ti coated with Ir oxide), and Ti/Ru oxide (Ti coated with Ir oxide). (Ru oxide coating), Ti/Ir oxide-Ru oxide (Ti coated with a mixture of Ir oxide and Ru oxide), Ti/Ir oxide-Ta oxide ( Ti/Pt/Ir oxide-Ru oxide (Ti/Pt coated with a mixture of Ir oxide and Ru oxide) Ti/Pt/Ir oxide-Ta oxide (Ti/Pt coated with a mixture of Ir oxide and Ta oxide), stainless steel, aluminum, lead alloy (Pb-Sn alloy, Pb-Ag alloy, Pb-Sb alloy), lead oxide (lead monoxide, lead dioxide, lead trioxide, trilead tetroxide), lead, tin oxide, carbon, diamond electrode (diamond containing nitrogen or boron) Examples include those coated on a substrate such as silicon or niobium), ITO electrodes (indium tin electrodes), and the like.
可溶性アノードとしては、例えばニッケル、スズ、コバルト、鉄等が挙げられる。 Examples of the soluble anode include nickel, tin, cobalt, iron, and the like.
陽極として、好ましくはニッケル又はステンレスが挙げられる。 As the anode, nickel or stainless steel is preferably used.
陰極電解における浴温は、特に制限されないが、過酸化水素の分解抑制等の観点から、好ましくは10~50℃、より好ましくは15~35℃である。 The bath temperature in cathode electrolysis is not particularly limited, but from the viewpoint of suppressing decomposition of hydrogen peroxide, etc., it is preferably 10 to 50°C, more preferably 15 to 35°C.
陰極電流密度は、特に制限されないが、耐食性の向上、陽極溶解等の観点から、好ましくは0.01~3A/dm2、より好ましくは0.1~1.5A/dm2である。 The cathode current density is not particularly limited, but from the viewpoint of improving corrosion resistance, anodic dissolution, etc., it is preferably 0.01 to 3 A/dm 2 , more preferably 0.1 to 1.5 A/dm 2 .
通電時間は、特に制限されないが、耐食性の向上、コスト等の観点から、好ましくは30~1000秒間、より好ましくは60~600秒間である。 The current application time is not particularly limited, but from the viewpoint of improving corrosion resistance, cost, etc., it is preferably 30 to 1000 seconds, more preferably 60 to 600 seconds.
本発明の方法により、耐食性3価クロムめっき膜、耐食性3価クロムめっき膜を含む物品が得られる。 By the method of the present invention, a corrosion-resistant trivalent chromium plating film and an article containing the corrosion-resistant trivalent chromium plating film can be obtained.
以下に、実施例に基づいて本発明を詳細に説明するが、本発明はこれらの実施例によって限定されるものではない。 The present invention will be described in detail below based on Examples, but the present invention is not limited to these Examples.
試験例1.3価クロムめっき膜の後処理試験
<試験例1-1.3価クロムめっき膜の形成>
5cm×10cmの樹脂プレート上に、厚み20μmの銅めっき膜、厚み8μmの半光沢Niめっき膜、厚み6μmの光沢Niめっき膜、厚み2μmのマイクロポーラスNiめっき膜の順にめっき膜を形成した。さらに、最表面のマイクロポーラスNiめっき膜上に、白色系3価クロムめっき膜、又は黒色系3価クロムめっき膜を形成した。白色系3価クロムめっき膜は、めっき液としてトップファインクロム(奥野製薬工業製)を使用して形成し、黒色系3価クロムめっき膜は、めっき液としてトップファルベBLB Plus(奥野製薬工業製)を使用して形成した。
Test Example 1. Post-treatment test of trivalent chromium plating film <Test Example 1-1. Formation of trivalent chromium plating film>
Plating films were formed on a 5 cm x 10 cm resin plate in the following order: a copper plating film with a thickness of 20 μm, a semi-bright Ni plating film with a thickness of 8 μm, a bright Ni plating film with a thickness of 6 μm, and a microporous Ni plating film with a thickness of 2 μm. Furthermore, a white trivalent chromium plating film or a black trivalent chromium plating film was formed on the outermost microporous Ni plating film. The white trivalent chromium plating film was formed using Top Fine Chrome (manufactured by Okuno Pharmaceutical Industries) as a plating solution, and the black trivalent chromium plating film was formed using Topfalbe BLB Plus (manufactured by Okuno Pharmaceutical Industries) as a plating solution. was formed using.
<試験例1-2.3価クロムめっき膜の後処理>
(比較例1)
試験例1-1で得られた3価クロムめっき膜に対して後処理を行わなかった。
<Test Example 1-2. Post-treatment of trivalent chromium plating film>
(Comparative example 1)
No post-treatment was performed on the trivalent chromium plating film obtained in Test Example 1-1.
(比較例2)
処理液(ECB-Y、奥野製薬工業製、pH3.5)に試験例1-1で得られた3価クロムめっき膜を浸漬し、6価クロム電解クロメート処理(条件:陰極電流密度0.5A/dm2、通電時間1分、浴温25℃)を行った。
(Comparative example 2)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (ECB-Y, manufactured by Okuno Pharmaceutical Co., Ltd., pH 3.5), and subjected to hexavalent chromium electrolytic chromate treatment (conditions: cathode current density 0.5 A). /dm 2 , current application time 1 minute, bath temperature 25° C.).
(比較例3)
処理液(エレアップCCS、奥野製薬工業製、pH3.5)に試験例1-1で得られた3価クロムめっき膜を浸漬し、3価クロム電解クロメート処理(条件:陰極電流密度0.5A/dm2、通電時間1分、浴温25℃)を行った。
(Comparative example 3)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (Elup CCS, manufactured by Okuno Pharmaceutical Co., Ltd., pH 3.5), and subjected to trivalent chromium electrolytic chromate treatment (conditions: cathode current density 0.5 A/ dm 2 , current application time 1 minute, bath temperature 25° C.).
(比較例4)
処理液(過酸化水素20g/L及びリン酸水素二ナトリウム40g/Lを含有する水溶液、pH4.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、電解処理せずに5分間静置(浴温25℃)した。
(Comparative example 4)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 20 g/L of hydrogen peroxide and 40 g/L of disodium hydrogen phosphate, pH 4.0) without electrolytic treatment. It was left standing for 5 minutes (bath temperature 25°C).
(比較例5)
処理液(過酸化水素を含有せず、リン酸水素二カリウム60g/Lを含有する水溶液、pH4.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.5A/dm2、通電時間3分、浴温25℃)を行った。
(Comparative example 5)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 60 g/L of dipotassium hydrogen phosphate without hydrogen peroxide, pH 4.0), and the plating film was A cathodic electrolytic treatment (conditions: cathode current density 0.5 A/dm 2 , current application time 3 minutes, bath temperature 25° C.) was performed.
(比較例6)
処理液(過酸化水素20g/Lを含有し、リン化合物を含有しない水溶液、pH4.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.5A/dm2、通電時間3分、浴温25℃)を行った。
(Comparative example 6)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (an aqueous solution containing 20 g/L of hydrogen peroxide and no phosphorus compound, pH 4.0), and the plating film was subjected to cathodic electrolysis treatment. (Conditions: cathode current density 0.5 A/dm 2 , current application time 3 minutes, bath temperature 25° C.).
(実施例1)
処理液(過酸化水素10g/L及びピロリン酸ナトリウム30g/Lを含有する水溶液、pH4.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.5A/dm2、通電時間3分、浴温25℃)を行った。
(Example 1)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 10 g/L of hydrogen peroxide and 30 g/L of sodium pyrophosphate, pH 4.0), and the plating film was subjected to cathodic electrolysis. Treatment (conditions: cathode current density 0.5 A/dm 2 , current application time 3 minutes, bath temperature 25° C.) was performed.
(実施例2)
処理液(過酸化水素30g/L及びリン酸二水素カリウム50g/Lを含有する水溶液、pH3.5)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.2A/dm2、通電時間5分、浴温30℃)を行った。
(Example 2)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 30 g/L of hydrogen peroxide and 50 g/L of potassium dihydrogen phosphate, pH 3.5). Cathode electrolysis treatment (conditions: cathode current density 0.2 A/dm 2 , current application time 5 minutes, bath temperature 30° C.) was performed.
(実施例3)
処理液(過酸化水素100g/L及びエチドロン酸10g/Lを含有する水溶液、pH4.5)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度1A/dm2、通電時間2分、浴温20℃)を行った。
(Example 3)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 100 g/L of hydrogen peroxide and 10 g/L of etidronic acid, pH 4.5), and the plating film was subjected to cathodic electrolysis treatment. (Conditions: cathode current density 1 A/dm 2 , current application time 2 minutes, bath temperature 20° C.).
(実施例4)
処理液(過酸化水素80g/L及びトリポリリン酸ナトリウム20g/Lを含有する水溶液、pH3.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.3A/dm2、通電時間10分、浴温35℃)を行った。
(Example 4)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 80 g/L of hydrogen peroxide and 20 g/L of sodium tripolyphosphate, pH 3.0), and the plating film was subjected to cathodic electrolysis. Treatment (conditions: cathode current density 0.3 A/dm 2 , current application time 10 minutes, bath temperature 35° C.) was performed.
(実施例5)
処理液(過酸化水素50g/L及びリン酸水素二ナトリウム35g/Lを含有する水溶液、pH2.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度0.1A/dm2、通電時間8分、浴温40℃)を行った。
(Example 5)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 50 g/L of hydrogen peroxide and 35 g/L of disodium hydrogen phosphate, pH 2.0). Cathode electrolytic treatment (conditions: cathode current density 0.1 A/dm 2 , current application time 8 minutes, bath temperature 40° C.) was performed.
(実施例6)
処理液(過酸化水素150g/L及びリン酸二水素ナトリウム55g/Lを含有する水溶液、pH5.0)に試験例1-1で得られた3価クロムめっき膜を浸漬し、当該めっき膜の陰極電解処理(条件:陰極電流密度1.5A/dm2、通電時間4分、浴温15℃)を行った。
(Example 6)
The trivalent chromium plating film obtained in Test Example 1-1 was immersed in a treatment solution (aqueous solution containing 150 g/L of hydrogen peroxide and 55 g/L of sodium dihydrogen phosphate, pH 5.0). Cathode electrolytic treatment (conditions: cathode current density 1.5 A/dm 2 , current application time 4 minutes, bath temperature 15° C.) was performed.
<試験例1-3.耐食性評価>
試験例1-2で得られた後処理後のめっき膜(試験片)の耐食性をCASS試験により評価した。具体的には、50℃の試験槽内に試験片を置き、塩化ナトリウム50g/L及び塩化銅0.205g/Lを含有し、且つ酢酸にてpH3.0に調整された液を噴霧し、一定時間ごとに腐食の程度を確認した。以下の評価基準に従って評価した。
〇:試験開始から48時間後の試験片の腐食面積が1%未満である。
△:試験開始から48時間後の試験片の腐食面積が1%以上10%未満である。
×:試験開始から48時間後の試験片の腐食面積が10%以上である。
<Test Example 1-3. Corrosion resistance evaluation>
The corrosion resistance of the post-treated plating film (test piece) obtained in Test Example 1-2 was evaluated by a CASS test. Specifically, a test piece was placed in a test tank at 50 ° C., and a solution containing 50 g/L of sodium chloride and 0.205 g/L of copper chloride and adjusted to pH 3.0 with acetic acid was sprayed. The degree of corrosion was checked at regular intervals. Evaluation was made according to the following evaluation criteria.
○: The corrosion area of the test piece 48 hours after the start of the test is less than 1%.
Δ: The corrosion area of the test piece 48 hours after the start of the test is 1% or more and less than 10%.
×: The corrosion area of the test piece 48 hours after the start of the test is 10% or more.
<試験例1-4.色調変化の評価>
試験例1-1で得られた3価クロムめっき膜の表面と、試験例1-2で得られた後処理後のめっき膜の表面の色を、色差計(製品名:CM-3700A、コニカミノルタ社製、測定条件:SCI)で測定した。L*a*b*表色系におけるb*値の後処理前後の変化値(=試験例1-2で得られた後処理後のめっき膜のb*値-試験例1-1で得られた3価クロムめっき膜のb*値)を算出し、以下の評価基準に従って評価した。なお、試験例1-1で得られた3価クロムめっき膜の表面のL*値は、白色系は83.5であり、黒色系は58.4であった。
〇:b*値の後処理前後の変化値が0.1未満である。
△:b*値の後処理前後の変化値が0.1以上0.3未満である。
×:b*値の後処理前後の変化値が0.3以上である。
<Test Example 1-4. Evaluation of color tone change>
The color of the surface of the trivalent chromium plating film obtained in Test Example 1-1 and the surface of the post-treated plating film obtained in Test Example 1-2 was measured using a color difference meter (product name: CM-3700A, Konica Manufactured by Minolta, measurement conditions: SCI). Change value of b* value before and after post-treatment in L*a*b* color system (=b* value of plating film after post-treatment obtained in Test Example 1-2 - b* value obtained in Test Example 1-1 b* value) of the trivalent chromium plating film was calculated and evaluated according to the following evaluation criteria. Note that the L* value of the surface of the trivalent chromium plating film obtained in Test Example 1-1 was 83.5 for white and 58.4 for black.
Good: The change in b* value before and after post-processing is less than 0.1.
Δ: Change value of b* value before and after post-processing is 0.1 or more and less than 0.3.
×: The change value of b* value before and after post-processing is 0.3 or more.
<結果>
結果を表1及び表2に示す。
<Results>
The results are shown in Tables 1 and 2.
過酸化水素及びリン化合物を含有する水溶液で3価クロムめっき膜を陰極電解処理すると、色調変化をより抑えつつ、耐食性をより向上させることができることが分かった。 It has been found that when a trivalent chromium plating film is subjected to cathodic electrolysis treatment with an aqueous solution containing hydrogen peroxide and a phosphorus compound, corrosion resistance can be further improved while further suppressing color change.
Claims (11)
前記過酸化水素の含有量が1~500g/Lであり、且つ前記リン化合物の含有量が1~200g/Lであり、
pHが1.5~5.5であり、且つ
金属イオン又はクロムイオンの含有量が0~0.01g/Lである、
3価クロムめっき膜の陰極電解処理に用いるための水溶液。 Contains hydrogen peroxide and phosphorus compounds,
The hydrogen peroxide content is 1 to 500 g/L, and the phosphorus compound content is 1 to 200 g/L,
pH is 1.5 to 5.5, and
The content of metal ions or chromium ions is 0 to 0.01 g/L,
Aqueous solution for use in cathodic electrolytic treatment of trivalent chromium plating films.
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