JP7354296B2 - display device - Google Patents

Description

The present disclosure relates to a display device.

An example of the prior art is described in Patent Document 1.

JP2017-009725A

The display device of the present disclosure is a substrate having an insulating layer laminate on a first surface, a first region that is a central region of the upper surface of the insulating layer laminate and a display area , and a first region surrounding the first region. , a second region that is a peripheral region of the upper surface of the insulating layer laminate and a frame region;
a plurality of pixels arranged in a matrix in the first region, each pixel having an electrode pad and a light emitting diode element connected to the electrode pad;
a protrusion that is disposed at a position closer to the second region than the center of the first region in plan view and that protrudes more than the electrode pad in a direction away from the substrate ;
The first region has a rectangular shape in plan view,
The protrusions are arranged at four corners of the first region, respectively, in a plan view, thereby surrounding the entire plurality of pixels.

FIG. 1 is a block circuit diagram schematically showing an example of a display device according to an embodiment. 1 is a cross-sectional view schematically showing a part of an example of a display device according to an embodiment. 1 is a cross-sectional view schematically showing a part of an example of a display device according to an embodiment. 1 is a plan view schematically showing a part of an example of a display device according to an embodiment. 5 is a cross-sectional view taken along section line A1-A2 in FIG. 4. FIG. FIG. 5 is an enlarged plan view of main parts of the display device shown in FIG. 4. FIG. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment. FIG. 7 is a plan view schematically showing a part of a modification of the display device according to the embodiment.

As a configuration of a display device that is the basis of the display device of the present disclosure, a display device including a plurality of pixels including a light emitting element such as a light emitting diode and an electrode pattern connected to the light emitting element is known. In such a display device, pixels are arranged in a matrix in a display area on one main surface of the substrate, and a plurality of connection pads used to drive each pixel are arranged in a frame area surrounding the display area. ing.

In the display device that is the basis of the display device of the present disclosure, in its manufacturing process, the electrode pattern of the pixel located in the center of the display area and the electrode pattern of the pixel located in the outer periphery of the display area are formed into the same pattern. There was something I couldn't do. For example, an insulating layer laminate is formed by laminating a plurality of insulating layers on a substrate such as a glass substrate, and in which wiring and the like are arranged between the layers, by a photolithography method. The upper surface of this insulating layer stack becomes a display area. In the manufacturing process, as the insulating layer stack having the display area on the upper surface is stacked up, the height difference between the display area and the non-display area becomes higher. Therefore, when a photoresist is applied to the upper surface of the insulating layer stack, the thickness of the photoresist becomes non-uniform. That is, the thickness of the photoresist at the peripheral portion of the upper surface of the insulating layer laminate is thinner than the thickness of the photoresist at the center portion of the upper surface of the insulating layer laminate. As a result, there is a problem in that the shape of the electrode pattern of the pixel located at the outer periphery of the display area is deformed or distorted. Therefore, the yield in manufacturing the display device may be reduced, or the power supply voltage may not be applied evenly to a plurality of pixels, resulting in deterioration of the display quality of the display device.

Hereinafter, a display device according to an embodiment of the present disclosure will be described using the drawings. Note that each figure referred to below shows main constituent members of a display device according to an embodiment of the present disclosure. Therefore, the display device according to the embodiment of the present disclosure may include a well-known structure such as a circuit board, a wiring conductor, a control IC, an LSI, etc., which are not shown. Note that the display device may be used with either direction upward or downward, but in this specification, for convenience, an orthogonal coordinate system (X, Y, Z) is defined, and Terms such as upper surface or lower surface are used with the positive direction of the Z-axis direction being upward.

FIG. 1 is a block circuit diagram of a display device according to an embodiment of the present disclosure, FIG. 2 is a sectional view showing a schematic configuration of a display device according to an embodiment of the present disclosure, and FIG. 3 is a block circuit diagram of a display device according to an embodiment of the present disclosure. 1 is a cross-sectional view showing a schematic configuration of a display device according to an embodiment.

The display device 1 of this embodiment includes a substrate 2, a plurality of pixels 3, and a protrusion 9.

The substrate 2 is, for example, a transparent or opaque glass substrate, a plastic substrate, a ceramic substrate, or the like. The substrate 2 has a rectangular plate shape, for example, and has a first surface 2a, a second surface 2b opposite to the first surface 2a, and a side surface 2c connecting the first surface 2a and the second surface 2b. .

The first surface 2a has a first area (so-called display area) 2d and a second area (so-called frame area) 2e. The first region 2d includes the center of the first surface 2a. In this embodiment, for example, as shown in FIG. 1, the first region 2d is a rectangular region. The second region 2e includes the periphery of the first surface 2a and surrounds the first region 2d. The first region 2d corresponds to the upper surface of an insulating layer laminate that is constructed by laminating a plurality of insulating layers made of SiO ₂ , Si ₃ N ₄ , SiON, acrylic resin, polycarbonate, etc., and has wiring, etc. arranged between the layers. . The insulating layer stack is produced by a photolithography method using a photoresist, and the electrode pad 31 of each pixel 3 is formed on the upper surface of the insulating layer stack at the final stage of production.

The plurality of pixels 3 are arranged in the first region 2d. The plurality of pixels 3 are arranged in a matrix over the entire first region 2d.

Each pixel 3 includes an electrode pad 31 and a light emitting diode (LED) element 32 connected to the electrode pad 31.

The electrode pad 31 has a positive electrode 311 and a negative electrode 312. The positive electrode 311 and the negative electrode 312 are made of, for example, Al, Al/Ti, Ti/Al/Ti, Mo, Mo/Al/Mo, MoNd/AlNd/MoNd, Cu, Cr, Ni, Ag, or the like. Here, "Al/Ti" indicates a stacked structure in which a Ti layer is stacked on an Al layer. The same applies to others. The surfaces of the positive electrode 311 and the negative electrode 312 may be coated with a transparent conductive layer 34 made of indium tin oxide (ITO), indium zinc oxide (IZO), or the like. Furthermore, as shown in FIG. 2, for example, an insulating layer 334 made of SiO ₂ , Si ₃ N ₄ , a polymer material, or the like may be disposed around the positive electrode 311 and the negative electrode 312 .

The LED element 32 has an anode electrode 321 and a cathode electrode 322. The anode electrode 321 is connected to the positive electrode 311 and the cathode electrode 322 is connected to the negative electrode 312. As the LED element 32, for example, a micro LED element can be used. The micro LED element may have a rectangular shape in plan view. In this case, the length of one side of the micro LED element in plan view may be about 1 μm or more and about 100 μm or less, or about 3 μm or more and about 10 μm or less.

Each pixel 3 may include a plurality of positive electrodes 311, a negative electrode 312, and a plurality of LED elements 32. The plurality of LED elements 32 may have different emission wavelengths. The plurality of LED elements 32 may include, for example, an LED element that emits red light, an LED element that emits green light, and an LED element that emits blue light. The anode electrode 321 of each of the plurality of LED elements 32 is connected to the positive electrode 311, respectively. The cathode electrode 322 of each of the plurality of LED elements 32 is connected to the negative electrode 312.

For example, as shown in FIG. 2, each pixel 3 has an insulating layer stack 33 disposed on the first surface 2a. The insulating layer laminate 33 is formed by laminating insulating layers 331, 332, and 333. The insulating layers 331, 332, 333 are made of an insulating material such as SiO ₂ , Si ₃ N ₄ , SiON, or a polymer material.

Although not shown, each pixel 3 includes two thin film transistors (TFTs), a capacitor, and the like. For example, one of the two TFTs is a TFT that functions as a switching element, and the other is a TFT that functions as a driving element. The TFT may be placed between the substrate 2 and the insulating layer 331. The TFT functioning as a driving element may be placed in the middle of a VDD wiring conductor 54 or a VSS wiring conductor 55, which will be described later. A TFT has a semiconductor film made of, for example, amorphous silicon, low-temperature polycrystalline silicon, etc., and has three terminals, which are a gate electrode, a source electrode, and a drain electrode. When the substrate 2 is a glass substrate and the TFT has a semiconductor film made of low-temperature polycrystalline silicon, the TFT can be directly formed on the substrate 2 by a thin film formation method such as a CVD (Chemical Vapor Deposition) method. .

The display device 1 includes a power supply circuit 4 for generating a high potential power supply voltage (hereinafter simply referred to as VDD) and a low potential power supply voltage VSS (hereinafter simply referred to as VSS) to be applied to a plurality of pixels 3. There is. The power supply circuit 4 is arranged, for example, on the second surface 2b of the substrate 2. For example, as shown in FIG. 1, the power supply circuit 4 may be arranged on a region of the second surface 2b that coincides with the first region 2d in plan view.

The power supply circuit 4 includes a control circuit for controlling light emission, non-light emission, light emission intensity, etc. of the LED element 32. The control circuit may include an IC chip. The power supply circuit 4 may be, for example, a thin film circuit formed on the second surface 2b of the substrate 2. In this case, the semiconductor layer constituting the thin film circuit may be, for example, a semiconductor layer made of low-temperature polycrystalline silicon directly formed by a thin film forming method such as a CVD method.

The display device 1 has a wiring conductor 5 for connecting the power supply circuit 4 and the pixel 3, as shown in FIG. The wiring conductor 5 includes a plurality of wiring pads 51, a plurality of backside wiring pads 52, a plurality of side surface conductors 53, a VDD wiring conductor 54, and a VSS wiring conductor 55.

For example, as shown in FIG. 1, the plurality of wiring pads 51 are arranged on the second region 2e of the first surface 2a. A part of the plurality of wiring pads 51 is connected to the VDD wiring conductor 54, and the remaining part is connected to the VSS wiring conductor 55. As shown in FIG. 3, the back wiring pad 52 is arranged on the second surface 2b. The back wiring pad 52 is connected to the power supply circuit 4 via the back wiring conductor 56. The backside wiring pad 52 may be arranged on a region of the second surface 2b that coincides with the second region 2e in plan view. The plurality of wiring pads 51 and the plurality of backside wiring pads 52 may overlap each other in plan view. The side conductor 53 is arranged from the side surface 2c to the first surface 2a and the second surface 2b. The side conductor 53 connects the plurality of wiring pads 51 and the plurality of backside wiring pads 52, respectively. Among the plurality of back wiring pads 52 , the back wiring pads 52 electrically connected to the VDD wiring conductor 54 are connected to the VDD terminal of the power supply circuit 4 via the back wiring conductor 56 . Further, among the plurality of back wiring pads 52 , the back wiring pads 52 that are electrically connected to the VSS wiring conductor 55 are connected to the VSS terminal of the power supply circuit 4 via the back wiring conductor 56 .

Wiring pad 51 and backside wiring pad 52 are made of a conductive material. The wiring pad 51 and the backside wiring pad 52 may be a single metal layer, or may be a stack of a plurality of metal layers. The wiring pad 51 and the backside wiring pad 52 are made of, for example, Al, Al/Ti, Ti/Al/Ti, Mo, Mo/Al/Mo, MoNd/AlNd/MoNd, Cu, Cr, Ni, Ag, or the like. FIG. 3 shows an example in which the wiring pad 51 and the backside wiring pad 52 are made of a single metal layer.

The side conductor 53 is made by applying a conductive paste containing conductive particles such as Ag, Cu, Al, and stainless steel, an uncured resin component, an alcohol solvent, and water from the side surface 2c to the first surface 2a and the second surface 2b. It can be formed by a method such as a heating method, a photocuring method in which it is cured by irradiation with light such as ultraviolet light, or a photocuring heating method after being applied to a desired area. The side conductor 53 can also be formed by a thin film forming method such as a plating method, a vapor deposition method, or a CVD method. Further, a groove may be provided in advance at a portion of the side surface 2c where the side surface conductor 53 is to be formed. This makes it easier to arrange the conductive paste that will become the side conductor 53 at a desired location on the side surface 2c.

Although not shown, the display device 1 includes a plurality of connection pads arranged in the second region 2e of the first surface 2a and connected to a plurality of gate signal lines and a plurality of source signal lines, respectively. The plurality of connection pads are included in the power supply circuit 4 via side conductors arranged from the first surface 2a to the side surfaces 2c and the second surface 2b, back surface connection pads arranged on the second surface 2b, etc. connected to the control circuit.

For example, as shown in FIG. 1, the protrusion 9 is arranged at a position closer to the second region 2e than the center on the first region 2d in plan view. Specifically, the protrusion 9 is arranged on the peripheral edge of the first region 2d. More preferably, when the first region 2d has a rectangular shape, the protrusions 9 are arranged on the four corners of the first region 2d. The protrusion 9 protrudes beyond the electrode pad 31 in the direction away from the substrate 2 (positive direction of the Z-axis). Specifically, the height of the protrusion 9 from the first region 2d is higher than the height of the electrode pad 31 from the first region 2d. In this embodiment, the protrusion 9 is arranged on the upper surface 33a of the insulating layer laminate 33 on the side opposite to the substrate 2, and the top surface of the protrusion 9 on the opposite side to the substrate 2 is located on the substrate of the electrode pad 31. 2 is located further away from the first surface 2a than the surface opposite to the first surface 2a. The protrusion 9 is made of, for example, a resin material such as PFA (tetrafluoroethylene-perfluoroalkoxyethylene copolymer resin), or a metal material such as MoAl.

Further, the resin material of the protrusion 9 may be acrylic resin, polycarbonate resin, epoxy resin, polyethylene terephthalate (PET) resin, or the like. The metal material of the protrusion 9 may be Al, Al/Ti, Ti/Al/Ti, Mo, Mo/Al, Mo/Al/Mo, MoNd/AlNd/MoNd, Cu, Cr, Ni, Ag, etc. good. Here, "MoNd" means an alloy of Mo and Nd.

Here, the manufacturing process of the display device 1 includes an electrode pad forming process of forming the electrode pad 31 on the upper surface 33a of the insulating layer stack 33. The protruding portion 9 is formed on the upper surface 33a of the insulating layer stack 33 before performing the electrode pad forming step. The protrusion 9 may be formed, for example, by applying a resin material that will become the protrusion 9 to a desired portion of the upper surface 33a. The protruding part 9 may be formed by joining a precursor of the protruding part 9, which is previously formed into a desired shape using a resin material or a metal material, to a desired part on the upper surface 33a.

In the electrode pad forming step, first, a conductor layer that will become the electrode pad 31 is formed on the exposed portion of the upper surface 33a of the insulating layer laminate 33 using a thin film forming method such as a sputtering method or a CVD method. Next, with the upper surface 33a facing upward in the vertical direction, a photoresist (hereinafter also simply referred to as resist) is coated on the surface of the conductor layer using, for example, a spin coating method. Let the resist dry. Next, exposure and development are performed using a photomask to form a resist pattern in which unnecessary parts of the conductor layer are exposed, and then the unnecessary parts of the conductor layer are removed by etching to form a pattern of electrode pads 31 on the upper surface 33a. form.

Here, if the protruding part 9 is not arranged on the upper surface 33a of the insulating layer laminate 33, in the process of applying resist to the upper surface 33a and drying the resist, the resist applied to the portion of the upper surface 33a near the periphery is removed. It flows out from the upper surface 33a to the second region 2e. For this reason, the thickness of the resist pattern formed near the periphery of the upper surface 33a tends to be thinner than the thickness of the resist pattern formed near the center of the upper surface 33a. As a result, the resist development process after the electrode pattern exposure process for removing unnecessary portions of the conductor layer does not proceed uniformly, and a desired pattern of the electrode pads may not be formed.

Therefore, when the protrusion 9 protrudes beyond the electrode pad 31 in the direction away from the substrate 2, the following effects are achieved. In the process of applying a resist to the upper surface 33a of the insulating layer laminate 33 and drying the resist, it is possible to more effectively prevent the resist applied to a portion of the upper surface 33a near the periphery from flowing out from the upper surface 33a to the second region 2e. can be suppressed to As a result, the thickness of the resist pattern formed near the periphery of the upper surface 33a tends to be the same as the thickness of the resist pattern formed near the center of the upper surface 33a. Therefore, the resist development process after the electrode pattern exposure process for removing unnecessary portions of the conductor layer proceeds uniformly, and a desired patterned electrode pad can be formed. Also, when aligning and connecting the anode electrode 321 and cathode electrode 322 of the light emitting diode element 32 to the electrode pad 31, the lower surface of the plate-shaped jig holding the light emitting diode element 32 is brought into contact with the protrusion 9. This makes it easy to adjust the position. That is, the protrusion 9 can also function as a positioning marker when connecting the light emitting diode element 32 to the electrode pad 31. Note that the plate-shaped jig may include an opening, an adhesive part such as an adhesive sheet, an electromagnet, a suction part such as a vacuum suction part, etc., for holding the light emitting diode element 32.

In the display device 1 of this embodiment, the protrusion 9 is arranged at a position closer to the second region 2e than the center on the first region 2d in plan view, and the protrusion 9 is arranged in a direction away from the substrate 2 from the electrode pad. It stands out even more than 31. The protruding portion 9 can suppress the resist from flowing out from the upper surface 33a to the second region 2e. Therefore, in the electrode pad forming step, the thickness of the resist pattern formed on the upper surface 33a of the insulating layer stack 33 can be made close to uniform. Thereby, the resist development process after the electrode pattern exposure process on the conductive layer can proceed uniformly, and as a result, the desired pattern of the electrode pads 31 can be formed. That is, pattern defects of the electrode pads 31 can be suppressed, and the manufacturing yield of the display device 1 can be improved. Moreover, since pattern defects of the electrode pads 31 can be suppressed, the power supply voltages applied to the plurality of LED elements 32 can be made equal, so that the display quality of the display device 1 can be improved.

Next, the function and effect of the protrusion 9 will be further explained with reference to FIGS. 4 to 6. FIG. 4 is a plan view showing a schematic configuration of a display device according to an embodiment of the present disclosure, FIG. 5 is a cross-sectional view taken along section line A1-A2 in FIG. 4, and FIG. FIG. 4 is an enlarged plan view of essential parts of the display device shown in FIG. 4 to 6, details of the electrode pad 31, the LED element 32, and the pixel 3 are omitted from illustration. Further, in FIG. 6, the protrusion 8 as the protrusion 9 is hatched, and the flow direction of the resist is indicated by an arrow.

In the display device 1, a plurality of pixels 3 as shown in FIG. 2 are arranged over the entire first region 2d. A portion 6 of the plurality of pixels 3 excluding the electrode pads 31 and the LED elements 32 (hereinafter also referred to as a pixel structure) has a generally rectangular plate shape, and one main surface thereof is in contact with the first surface 2a of the substrate 2. ing. An electrode pad 31 is formed on the other main surface (hereinafter also referred to as a mounting surface) 6a of the pixel structure 6, and an LED element 32 is mounted on the electrode pad 31. The pixel structure 6 and the mounting surface 6a of the pixel structure 6 correspond to the insulating layer stack 33 and the upper surface 33a of the insulating layer stack 33, respectively.

Further, in the display device 1, the wiring pad 51 is formed as a wiring structure 7 made of a single metal layer or a plurality of metal layers. The upper surface 7a of the wiring structure 7 on the side opposite to the side in contact with the first surface 2a is located below the mounting surface 6a of the pixel structure 6 and closer to the first surface 2a. Therefore, in the display device 1, as shown in FIGS. 4 and 5, for example, a substantially quadrangular truncated pyramid-shaped structure including a pixel structure 6 and a wiring structure 7 is arranged on the first surface 2a of the substrate 2. It has a similar configuration.

In the display device 1, as shown in FIG. 6, a protrusion 8 as a protrusion 9 in the shape of a rectangular prism or the like protrudes above the electrode pad 31 at a position near the wiring structure 7 on the mounting surface 6a. is located. Therefore, as described above, in the electrode pad forming process, the resist applied to the portion of the mounting surface 6a near the wiring structure 7 is spread from the mounting surface 6a to the upper surface 7a of the wiring structure 7 (hereinafter simply referred to as external). It is possible to suppress the outflow to As a result, the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

The protrusion 9 may include four protrusions 8. For example, as shown in FIG. 4, the four protrusions 8 may be respectively arranged at the four corners 2f of the first region 2d, that is, the four corners 6b of the mounting surface 6a, in a plan view. Each protrusion 8 may have a columnar shape, a pyramidal shape, a truncated pyramid shape, or other shapes. Each protrusion 8 has a shape such as a triangular prism, a triangular pyramid, a truncated triangular pyramid, a square prism, a quadrangular pyramid, a truncated quadrangular pyramid, a cylinder, a cone, a truncated cone, an elliptical cylinder, an elliptical cone, a truncated elliptic cone, and an elongated cylinder. , a long cone or a truncated long cone. Each protrusion 8 may be, for example, a wall-shaped portion erected on the mounting surface 6a. Each protrusion 8 may be, for example, a wall-shaped portion having a substantially L-shape in plan view.

In the electrode pad forming process, the resist applied to the mounting surface 6a is caused by the centrifugal force generated by the movement of the substrate 2 during spin coating and the resist's own weight, for example, as shown by the arrow in FIG. At times, the liquid flows in a direction from the center 6c of the mounting surface 6a toward the first side 6d, second side 6e, and corner 6b of the mounting surface 6a. Note that the resist applied to the mounting surface 6a flows not only in a direction parallel to the mounting surface 6a but also in a direction crossing the mounting surface 6a. shall be expressed in the flow direction of the resist.

Here, the flow direction of the resist near the first side 6d is a direction substantially perpendicular to the first side 6d, and the flow direction of the resist near the second side 6e is a direction substantially perpendicular to the first side 6d. This is a direction substantially perpendicular to the other direction. Therefore, the resist flowing in the direction from the center portion 6c toward the first side portion 6d or the second side portion 6e is suppressed from flowing out to the outside due to its surface tension. On the other hand, the flow direction of the resist near the corner 6b is a direction inclined with respect to the first side 6d and the second side 6e. For this reason, the resist flowing in the direction from the center part 6c to the corner parts 6b is less likely to have an outflow suppressing effect due to surface tension, so the resist flowing in the direction from the center part 6c to the corner parts 6b is directed to the outside. Easy to leak. By arranging the protrusions 8 at each of the four corners 6b of the mounting surface 6a as in the display device 1 of this embodiment, it is possible to effectively suppress the resist from flowing out. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

As shown in FIG. 7A, the protrusion 8 as the protrusion 9 has a wall surface 8s that is substantially perpendicular to the virtual line li connecting the protrusion 8 with the center 6o of the mounting surface 6a as the first region 2d. , preferably facing the center 6o of the mounting surface 6a. In this case, the wall surface 8s can prevent the resist flowing toward the corner 6b from flowing outside. The angle between the virtual line li and the wall surface 8s is not limited to 90°, but may be within a range of about 80° to 100°.

Note that "~" in 80° to 100° means "to", and the same applies hereinafter.

The wall surface 8s of the protrusion 8 is an inclined surface (not shown) whose upper end is located closer to the edge of the substrate 2 than the lower end in plan view, that is, an inclined surface whose upper side is inclined toward the edge of the substrate 2. Good too. In this case, in the electrode pad forming process, if the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large, the excess resist will easily climb over the wall surface 8s. As a result, excess resist can flow out to the outside without remaining around the protrusion 8. The angle of inclination of the inclined surface may be more than 0° and less than about 20°, and may be about 5° to 15°, where 0° is a surface perpendicular to the first surface 2a of the substrate 2. It's okay.

As shown in FIG. 13A, in the configuration of FIG. 7A, the wall surface 8s of the protrusion 8 may have a curved shape convex toward the center 6o of the mounting surface 6a. In this case, in the electrode pad forming process, if the amount of resist flowing in the direction from the center part 6c to the corner part 6b is too large, the excess resist is not retained around the protrusion 8 but flows out to the outside. It becomes easier. The curved surface forming the wall surface 8s may have a partially spherical shape, a partially cylindrical shape, or the like. Further, the curved surface forming the wall surface 8s may have a flat surface at the center and a curved surface at the remaining peripheral portion. In this case, it is possible to allow the resist to remain to some extent at the center of the wall surface 8s, and to make it easier for excess resist to flow out from the periphery of the wall surface 8s. That is, it becomes easy to adjust the retention state and outflow amount of the resist to be optimal according to the characteristics such as the viscosity of the resist.

As shown in FIG. 13B, in the configuration of FIG. 7A, the wall surface 8s of the protrusion 8 may have a protrusion 8sp that protrudes toward the center 6o of the mounting surface 6a. In this case, in the electrode pad forming process, if the amount of resist flowing in the direction from the center part 6c to the corner part 6b is too large, the excess resist is not retained around the protrusion 8 but flows out to the outside. It becomes easier. Further, the protruding portion 8sp may have a sharp spire portion on the side of the center 6o of the mounting surface 6a. In this case, in the electrode pad forming process, if the amount of resist flowing in the direction from the center part 6c to the corner part 6b is too large, the resist does not stay around the protrusion 8 but flows out. It becomes easier.

The protrusion 8 may have a configuration in which the lower end (end on the substrate 2 side) is thicker than the upper end (end on the opposite side to the substrate 2). That is, the protruding portion 9 may have a configuration in which the thickness of the root portion is thicker than the thickness of the tip portion. Note that the thickness may be defined by the cross-sectional area in the cross section or the length in the circumferential direction. In this case, in the electrode pad forming process, if the amount of resist flowing in the direction from the center part 6c to the corner part 6b is too large, the excess resist is not retained around the protrusion 8 but flows out to the outside. be able to. The shape of the protrusion 8 in this case may be any of the above-mentioned conical shapes, truncated conical shapes, and the like.

Note that when the protrusion 8 has a columnar or frustum-like shape, the top surface of the protrusion 8 on the side opposite to the substrate 2 side may have a curved shape that is convexly curved upward. . As a result, in the electrode pad forming process, when the amount of resist flowing in the direction from the center part 6c to the corner part 6b is too large, the resist does not stay around the protrusion 8 but flows out. can. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process on the conductive layer can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

The protrusion 8 may be composed of a plurality of protrusion pieces 80 arranged at intervals, as shown in FIG. 7B. In this case, it is possible to effectively prevent the resist from flowing out from the mounting surface 6a, and also to prevent the resist from flowing in the direction from the center portion 6c to the corner portions 6b in an excessive amount in the electrode pad forming process. , the excess resist can flow out to the outside without being retained around the protrusion 8. That is, the excess resist easily flows out from the space between adjacent projection pieces 80.

As shown in FIG. 14, the protrusion 8 is composed of a plurality of protrusion pieces 80 arranged at intervals, and the plurality of protrusion pieces 80 are mounted as the protrusion 8 and the first region 2d. Three or more protruding pieces 80 are arranged in a direction substantially perpendicular to the virtual line li connecting the center 6o of the surface 6a, and the protruding piece 80 located at the center of the arrangement is closer to the center 6o of the mounting surface 6a than the remaining protruding pieces 80. The configuration may be in a position. In this case, it is possible to effectively prevent the resist from flowing out from the mounting surface 6a, and also to prevent the resist from flowing in the direction from the center portion 6c to the corner portions 6b in an excessive amount in the electrode pad forming process. , the excess resist can flow out to the outside without being retained around the protrusion 8. That is, the excess resist is guided from the protrusion piece 80 located at the center of the array to the remaining protrusion pieces 80, and easily flows out from the space between adjacent protrusion pieces 80. In FIG. 14, the symbol lip indicates a line segment parallel to a direction substantially orthogonal to the virtual line li. The angle between the virtual line li and the line segment lip is not limited to 90°, but may be within a range of approximately 80° to 100°.

In the configuration of FIG. 14, four or more protrusions 80 may be arranged, and there may be a plurality of protrusions 80 located at the center of the arrangement and close to the center 6o of the mounting surface 6a.

The display device 1 may include four protrusions 8 and a plurality of protrusions 89 spaced apart from each other. The plurality of protrusions 89 may extend along the periphery of the first region 2d in plan view. In this case, it is possible to effectively prevent the resist flowing in the direction from the center portion 6c toward the first side portion 6d and the second side portion 6e from flowing outside, and Outflow to the outside via the two side portions 6e can be effectively suppressed. As a result, the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Specifically, the first region 2d may have a rectangular shape in plan view, and the protruding portions 89 may be arranged on each of the four sides of the first region 2d. In this case, it is possible to prevent the resist from flowing out from the four sides of the first region 2d.

Note that the top surface of the protruding portion 89 on the side opposite to the substrate 2 side may have a curved shape that is convexly curved upward. As a result, when the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large in the electrode pad forming process, the resist does not stay around the protruding portions 89 and flows out. I can do it. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Modifications of the display device according to the embodiment of the present disclosure will be described below.

FIG. 7A is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 7A corresponds to the plan view shown in FIG. 6.

The protrusion 8 may have the shape of a triangular prism, a triangular pyramid, or a truncated triangular pyramid. The bottom surface of the protrusion 8 may be in contact with the mounting surface 6a. Further, as shown in FIG. 7A, for example, the shape of the protrusion 8 in a cross section parallel to the mounting surface 6a (hereinafter also referred to as a cross section) is a right triangle with the hypotenuse 8a facing the center portion 6c of the mounting surface 6a. It's okay. Thereby, the flow of the resist from the center portion 6c toward the corner portions 6b can be effectively suppressed by the wall surface 8s of the protrusion 8 facing the center portion 6c.

The cross section of the protrusion 8 may have an outer shape of a right isosceles triangle. In the cross section of the protrusion 8, the two sides sandwiching the right-angled portion 8b may be parallel to the first side 6d and the second side 6e, respectively. Thereby, the flow of the resist near the protrusion 8 can be made equal between the first side 6d and the second side 6e. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 7B is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 7B corresponds to the plan view shown in FIG. 7A.

The protrusion 8 may be composed of a plurality of protrusion pieces arranged at intervals, for example, as shown in FIG. 7B. The plurality of protrusion pieces may be a plurality of protrusion pieces 80 arranged parallel to the first side 6d and a plurality of protrusion pieces 80 arranged parallel to the second side 6e. Each protruding piece 80 may have the shape of a triangular prism, a triangular pyramid, or a truncated triangular pyramid. Furthermore, the bottom surface of each protruding piece 80 may be in contact with the mounting surface 6a. For example, as shown in FIG. 8A, the cross-sectional shape of each protruding piece 80 may be a right triangle with the oblique side 80a facing the center portion 6c of the mounting surface 6a. Thereby, the flow of the resist from the center portion 6c toward the first side portion 6d, second side portion 6e, and corner portion 6b can be effectively suppressed by the wall surface of each projection piece 80 facing the center portion 6c.

The length L1 of the protrusion 8 in the direction parallel to the first side 6d and the length L2 of the protrusion 8 in the direction parallel to the second side 6e may be, for example, about 100 μm to 500 μm. The length L1 and the length L2 may be equal to each other. Thereby, the flow of the resist near the protrusion 8 can be made equal between the first side 6d and the second side 6e. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

The interval between adjacent protruding pieces 80 may be such that the resist can be prevented from flowing out through the gap between the protruding pieces 80 due to the surface tension of the resist. That is, the distance between adjacent projection pieces 80 may be such that the resist does not flow out through the gap between the projection pieces 80 due to capillary action. The distance between adjacent projection pieces 80 may be, for example, about 100 μm or less, or about 1 μm to 50 μm.

FIG. 8A is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 8A corresponds to the plan view shown in FIG. 6.

The protrusion 8 may have the shape of a quadrangular prism, a quadrangular pyramid, or a truncated quadrangular pyramid. The bottom surface of the protrusion 8 may be in contact with the mounting surface 6a. Further, as shown in FIG. 8A, for example, the cross-sectional shape of the protrusion 8 may be a square with one side 8c facing the center portion 6c of the mounting surface 6a. Thereby, the resist flowing in the direction from the center portion 6c toward the corner portions 6b can be effectively suppressed from flowing out to the outside by the wall surface of the protrusion 8 facing the center portion 6c.

The cross section of the protrusion 8 may have a square outer shape with curved corners. In this case, when the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large, the resist can flow out to the outside without being retained around the protrusion 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 8B is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 8B corresponds to the plan view shown in FIG. 8A.

The protrusion 8 may have the shape of a quadrangular prism, a quadrangular pyramid, or a truncated quadrangular pyramid. The bottom surface of the protrusion 8 may be in contact with the mounting surface 6a. Further, as shown in FIG. 8B, for example, the cross-sectional shape of the protrusion 8 may be a rectangle with one long side 8d facing the central portion 6c. Thereby, the resist flowing in the direction from the center portion 6c toward the corner portions 6b can be effectively suppressed from flowing out to the outside by the wall surface of the protrusion 8 facing the center portion 6c.

The cross section of the projection 8 may have a rectangular outer shape with curved corners. In this case, when the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large, the resist can flow out to the outside without being retained around the protrusion 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 9A is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 9A corresponds to the plan view shown in FIG. 6.

The protrusion 8 may have a first wall portion 81 and a second wall portion 82 . The first wall portion 81 may have a rectangular shape in which the longitudinal direction is parallel to the first side portion 6d in plan view. The second wall portion 82 may have a rectangular shape whose longitudinal direction is parallel to the second side portion 6e in plan view. For example, as shown in FIG. 9A, the protrusion 8 may have an L-shape in which one end of the first wall portion 81 and one end of the second wall portion 82 are connected. . As a result, the resist flowing in the direction from the center portion 6c to the first side portion 6d, second side portion 6e, and corner portion 6b is prevented from flowing out to the outside by the wall surface of the first wall portion 81 facing the center portion 6c. This can be effectively suppressed by the wall surface of the second wall portion 82 facing the central portion 6c.

The length L1 of the first wall portion 81 in the direction parallel to the first side portion 6d and the length L2 of the second wall portion 82 in the direction parallel to the second side portion 6e are, for example, about 100 μm to 500 μm. It is. The length L1 of the first wall portion 81 and the length L2 of the second wall portion 82 may be different from each other or may be equal to each other. When the length L1 of the first wall portion 81 and the length L2 of the second wall portion 82 are equal to each other, the flow of the resist near the protrusion 8 is controlled between the first side portion 6d side and the second side portion. It can be made equal to the 6e side. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 9B is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 9B corresponds to the plan view shown in FIG. 9A.

The protrusion 8 may have a modified L-shape in plan view. The protrusion 8 may have a first wall portion 81, a second wall portion 82, and a third wall portion 83, as shown in FIG. 9B, for example. The first wall portion 81 may have a rectangular outer shape whose longitudinal direction is parallel to the first side portion 6d in plan view. The second wall portion 82 may have a rectangular outer shape whose longitudinal direction is parallel to the second side portion 6e in plan view. The third wall portion 83 has a substantially rectangular outer shape whose longitudinal direction is non-parallel to both the first side portion 6d and the second side portion 6e in plan view, and has one end of the first wall portion 81. and one end of the second wall portion 82 may be connected. In this case, the resist flowing in the direction from the center portion 6c toward the first side portion 6d is suppressed from flowing out to the outside by the wall surface facing the center portion 6c in the first wall portion 81, and from the center portion 6c to the second side portion 6d. The resist flowing in the direction 6e can be prevented from flowing out to the outside by the wall surface facing the central portion 6c of the second wall portion 82. Further, the resist flowing in the direction from the center portion 6c toward the corner portions 6b can be prevented from flowing out to the outside by the wall surface of the third wall portion 83 facing the center portion 6c. Therefore, the protrusion 8 shown in FIG. 9B effectively prevents the resist flowing in the direction from the center portion 6c toward the first side portion 6d, second side portion 6e, and corner portion 6b from flowing out. Therefore, the thickness of the resist film in the display area can be made uniform.

The length L1 of the first wall portion 81 in the direction parallel to the first side portion 6d and the length L2 of the second wall portion 82 in the direction parallel to the second side portion 6e are, for example, about 100 μm to 200 μm. It is. The length L3 of the third wall portion 83 in the direction connecting one end portion of the first wall portion 81 and one end portion of the second wall portion 82 is, for example, approximately 100 μm to 400 μm. In plan view, the angle θ1 formed by the longitudinal direction of the first wall portion 81 and the longitudinal direction of the third wall portion 83 may be, for example, about 120° to 150°, or about 130° to 140°. The angle may be approximately 135°. Further, in plan view, the angle θ2 formed by the longitudinal direction of the second wall portion 82 and the longitudinal direction of the third wall portion 83 may be, for example, about 120° to 150°, or about 130° to 140°. It may be about 135° or about 135°.

FIG. 10 is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 10 corresponds to the plan view shown in FIG. 6.

The protrusion 8 may have a first wall portion 81 and a second wall portion 82 . In the projection 8, one end portion of the first wall portion 81 and one end portion of the second wall portion 82 may be connected to each other. The first wall portion 81 may have a rectangular outer shape whose longitudinal direction is non-parallel to the first side portion 6d and the second side portion 6e in plan view. The second wall portion 82 may have a rectangular outer shape whose longitudinal direction extends in a second direction non-parallel to the first side portion 6d and the second side portion 6e in plan view. In plan view, the angle θ3 formed by the longitudinal direction of the first wall portion 81 and the longitudinal direction of the second wall portion 82 may be, for example, more than 90° and less than 180°. As a result, the resist flowing in the direction from the center portion 6c to the first side portion 6d, second side portion 6e, and corner portion 6b is prevented from flowing out to the outside by the wall surface of the first wall portion 81 facing the center portion 6c. This is effectively suppressed by the wall surface of the second wall portion 82 facing the central portion 6c, and therefore the resist film thickness of the display portion can be made uniform.

Further, according to the protrusion 8 shown in FIG. 10, the first wall portion 81 and the second wall portion 82 direct the flow direction of the resist flowing from the center portion 6c toward the corner portion 6b. It can be deflected toward one side 6d or second side 6e. Thereby, when the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large, it is possible to effectively suppress the resist from flowing out through the corner portions 6b. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

The protrusion 8 may have a corner portion of a cross section rounded into a curved shape. In this case, when the amount of resist flowing in the direction from the center portion 6c toward the corner portions 6b is too large, the resist can flow out to the outside without being retained around the protrusion 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, so that the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

11A, 11B, and 11C are plan views schematically showing some modified examples of the display device according to the embodiment. The plan views shown in FIGS. 11A, 11B, and 11C correspond to the plan view shown in FIG. 6.

The protrusion 8 may be composed of a plurality of protrusion pieces 80. The plurality of protruding pieces 80 may be arranged in an overall rectangular shape, as shown in FIG. 11A, for example. In this case, it is possible to prevent the resist from flowing in the direction from the center portion 6c toward the corner portions 6b, and to suppress the resist from flowing to the outside. As a result, in the electrode pad forming process, the thickness of the resist pattern can be made uniform over the entire mounting surface 6a, and the resist development process after the electrode pattern exposure process on the conductive layer can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Further, according to the protrusion 8 shown in FIG. 11A, when the amount of resist flowing in the direction from the center portion 6c toward the corner portion 6b is too large, the resist is not retained around the protrusion 8 and the protrusion It can flow out to the outside through the gap between the 80 pieces. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, and the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 11B is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 11B corresponds to the plan view shown in FIG. 6.

For example, as shown in FIG. 11B, the protrusion 8 includes a plurality of first protrusion pieces 84 arranged parallel to the first side 6d and a plurality of second protrusion pieces arranged parallel to the second side 6e. 85. The plurality of first protruding pieces 84 and the plurality of second protruding pieces 85 may be arranged in an L-shape as a whole. In this case, it is possible to prevent the resist from flowing out from the center 6c of the mounting surface 6a toward the first side 6d, second side 6e, and corner 6b of the mounting surface 6a. As a result, the thickness of the resist pattern can be made uniform over the entire mounting surface 6a, and the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Further, according to the protrusion 8 shown in FIG. 11B, when the amount of resist flowing in the direction from the center portion 6c to the first side portion 6d, second side portion 6e, and corner portion 6b is too large, the resist is It is possible to flow out to the outside through the gap between the protrusion pieces 84 and 85 without being retained around the protrusion 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, and the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

FIG. 11C is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 11C corresponds to the plan view shown in FIG. 6.

For example, as shown in FIG. 11C, the protrusion 8 includes a plurality of first protrusion pieces 84 arranged parallel to the first side 6d and a plurality of second protrusion pieces arranged parallel to the second side 6e. 85 and a plurality of third protruding pieces 86. The plurality of third protrusion pieces 86 are the protrusion piece 84 closest to the corner 6b among the plurality of first protrusion pieces 84, and the protrusion closest to the corner 6b among the plurality of second protrusion pieces 85. They may be arranged non-parallel to both the first side 6d and the second side 6e between the pieces 85. In this case, each projection piece 80 prevents the resist flowing from the center 6c of the mounting surface 6a toward the first side 6d, second side 6e, and corner 6b of the mounting surface 6a to the outside. This can be effectively suppressed on the wall surface facing the central portion 6c, thus making it possible to make the resist film thickness of the display portion uniform.

Further, according to the protrusion 8 shown in FIG. 11C, when the amount of resist flowing in the direction from the center portion 6c toward the first side portion 6d, second side portion 6e, and corner portion 6b is too large, the resist is It is possible to flow out to the outside through the gaps between the protruding pieces 84, 85, and 86 without being retained around the protruding body 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, and the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Note that FIGS. 11A, 11B, and 11C show cases in which the protruding piece 80, the first protruding piece 84, the second protruding piece 85, and the third protruding piece 86 have the shapes of a square prism, a square pyramid, or a truncated square pyramid. However, the shapes of the protrusion piece 80, the first protrusion piece 84, the second protrusion piece 85, and the third protrusion piece 86 are triangular prism, triangular pyramid, truncated triangular pyramid, cylinder, cone, truncated cone, elliptical cylinder, and ellipse. It may be a cone, an elliptical truncated cone, an elongated cylinder, an elongated cone, or an elongated truncated cone.

FIG. 12 is a plan view schematically showing a part of a modification of the display device according to the embodiment. The plan view shown in FIG. 12 corresponds to the plan view shown in FIG.

The protrusion 8 may be composed of a plurality of protrusion pieces. For example, as shown in FIG. 12, the plurality of protrusion pieces include a plurality of fourth protrusion pieces 87 arranged non-parallel to the first side 6d, and a plurality of fourth protrusion pieces 87 arranged non-parallel to the second side 6e. It may be a five-protrusion piece 88. The plurality of fourth protruding pieces 87 and the plurality of fifth protruding pieces 88 may be arranged as a whole in a modified L-shape as shown in FIG. 10 . In this case, the outflow of the resist from the center 6c of the mounting surface 6a toward the first side 6d, second side 6e, and corner 6b of the mounting surface 6a is prevented from occurring at the center of each projection piece 87, 88. It is effectively suppressed by the wall surface facing 6c, and therefore the resist film thickness in the display area can be made uniform.

Further, according to the protrusion 8 shown in FIG. 12, the amount of resist flowing in the direction from the center 6c of the mounting surface 6a toward the first side 6d, second side 6e, and corner 6b of the mounting surface 6a. If there is too much resist, the resist can flow out through the gaps between the protrusions 80 without being retained around the protrusions 8. As a result, deformation such as unevenness on the surface of the resist pattern can be suppressed, and the resist development process after the electrode pattern exposure process can proceed uniformly. Consequently, a desired pattern of the electrode pads 31 can be formed, and the display quality of the display device 1 and the manufacturing yield of the display device 1 can be effectively improved.

Although FIG. 12 shows the case where the fourth protruding piece 87 and the fifth protruding piece 88 have the shape of a square prism, a square pyramid, or a truncated square pyramid, the fourth protruding piece 87 and the fifth protruding piece 88 The shape may be a triangular prism, a triangular pyramid, a truncated triangular pyramid, a cylinder, a cone, a truncated cone, an elliptical cylinder, an elliptical cone, a truncated elliptical cone, an elongated cylinder, an elongated cone, or a truncated elongated cone.

The present disclosure allows the following embodiments.

A display device of the present disclosure includes a substrate having a first region and a second region surrounding the first region on a first surface;
a plurality of pixels arranged in a matrix in the first region, each pixel having an electrode pad and a light emitting diode element connected to the electrode pad;
This configuration includes a protrusion that is disposed at a position closer to the second area than the center of the first area in plan view and that protrudes further than the electrode pad in a direction away from the substrate.

According to the display device of the present disclosure, an electrode pad of a pixel located in the center of the display area and an electrode pad of a pixel located in the outer periphery of the display area can be formed in the same pattern. That is, when forming an insulating layer stack that will become a display area on a substrate such as a glass substrate by photolithography, the thickness of the photoresist applied to the upper surface of the insulating layer stack can be made uniform. As a result, the electrode pad of the pixel located at the center of the display area and the electrode pattern of the pixel located at the outer periphery can be formed in the same pattern. Therefore, it is possible to improve the manufacturing yield of the display device, and it is also possible to improve the display quality of the display device.

This disclosure may be embodied in other forms without departing from its spirit or essential characteristics. Therefore, the above-described embodiments are merely illustrative in all respects, and the scope of the present disclosure is indicated by the claims, and is not restricted in any way by the main text of the specification. Furthermore, all modifications and changes that fall within the scope of the claims are intended to be within the scope of this disclosure.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the gist of the present disclosure. be. It goes without saying that all or part of the above embodiments can be combined as appropriate to the extent that they do not contradict each other. Further, the display device of the present disclosure can be applied to various electronic devices. Such electronic devices include, for example, complex and large-sized display devices (multi-displays), automobile route guidance systems (car navigation systems), ship route guidance systems, aircraft route guidance systems, smartphone terminals, mobile phones, tablet terminals, and personal Digital assistants (PDAs), video cameras, digital still cameras, electronic notebooks, electronic dictionaries, personal computers, copiers, game equipment terminals, televisions, product display tags, price display tags, commercial programmable display devices, cars These include audio equipment, digital audio players, facsimile machines, printers, automated teller machines (ATMs), vending machines, digital display watches, smart watches, and information display devices installed at stations, airports, etc.

1 Display device 2 Substrate 2a First surface 2b Second surface 2c Side surface 2d First region 2e Second region 2f Corner 3 Pixel 31 Electrode pad 311 Positive electrode 312 Negative electrode 32 Light emitting diode element 321 Anode electrode 322 Cathode electrode 33 Insulating layer Laminated body 33a Top surface 331, 332, 333, 334 Insulating layer 34 Transparent conductive layer 4 Power circuit 5 Wiring conductor 51 Wiring pad 52 Back wiring pad 53 Side conductor 54 VDD wiring conductor 55 VSS wiring conductor 56 Back wiring conductor 6 Pixel structure 6a Mounting surface 6b Corner 6c Central part 6d First side 6e Second side 7 Wiring structure 7a Top surface 8 Projection 8a Oblique side 8b Right angle part 8c One side 8d Long side 9 Projection 80 Projection piece 80a Oblique side 81 First wall shape Part 82 Second wall portion 83 Third wall portion 84 First protrusion piece 85 Second protrusion piece 86 Third protrusion piece 87 Fourth protrusion piece 88 Fifth protrusion piece 89 Protrusion portion

Claims (14)

A substrate having an insulating layer laminate on a first surface, the first region being a central region of the upper surface of the insulating layer laminate and a display area , and the insulating layer laminate surrounding the first region. a substrate having a second region that is a peripheral region of the top surface and a frame region;
a plurality of pixels arranged in a matrix in the first region, each pixel having an electrode pad and a light emitting diode element connected to the electrode pad;
a protrusion that is disposed at a position closer to the second region than the center of the first region in plan view and that protrudes more than the electrode pad in a direction away from the substrate ;
The first region has a rectangular shape in plan view,
In the display device, the protruding portions are arranged at four corners of the first region, respectively, in a plan view, thereby surrounding the entire plurality of pixels. The display device according to claim 1, wherein the protruding portion protrudes beyond the electrode pad in a direction away from the substrate. The protrusion has a wall surface substantially perpendicular to an imaginary line connecting the protrusion and the center of the first region,
The display device according to claim 1 or 2, wherein the wall surface faces a center side of the first area. 4. The display device according to claim 3, wherein the wall surface is an inclined surface with an upper end located closer to an edge of the substrate than a lower end. 4. The display device according to claim 3, wherein the wall surface has a curved shape convex toward the center of the first region. The display device according to claim 3, wherein the wall surface has a protrusion that protrudes toward the center of the first area. 7. The display device according to claim 1, wherein the protrusion has a lower end thicker than an upper end. The display device according to any one of claims 1 to 7, wherein the protrusion has a curved top surface that is convex upward. 9. The display device according to claim 1, wherein the protrusion has an L-shape extending along two adjacent sides of the first region in plan view. 10. The display device according to claim 1, wherein the protrusion includes a plurality of protrusion pieces arranged at intervals. Three or more of the plurality of protrusion pieces are arranged in a direction substantially perpendicular to a virtual line connecting the protrusion part and the center of the first region, and the protrusion piece located at the center of the arrangement covers the remaining protrusion pieces. 11. The display device according to claim 10, wherein the display device is located closer to the center of the first region than the other half. including a protruding portion disposed in the first region apart from the protruding portion;
The display device according to any one of claims 1 to 11 , wherein the protruding portion extends along a periphery of the first region in plan view. 13. The display device according to claim 12 , wherein the protrusions are arranged on each of four sides of the first region. The display device according to any one of claims 1 to 13 , wherein the light emitting diode element includes a micro light emitting diode.