JP7349705B2 - laser processing equipment - Google Patents

Description

The present invention relates to a laser processing device.

BACKGROUND ART Apparatuses that process objects by irradiating laser beams are conventionally known (for example, see Non-Patent Document 1).
Non-Patent Document 1 Internet <http://www.crystalsys.co.jp/product03.html>

When processing a target object by irradiating it with a laser, if the target object is a compound made of an alloy or the like, it is essential to suppress oxidation of the target object. For this purpose, it is necessary to process the object in a high-purity argon gas environment. In this case, the concentration of oxygen, water, etc. in argon needs to be 1 ppm (1 ppm=0.000001), and depending on the material of the object, it needs to be 1 ppb (1 ppb=0.000000001) or less. In order to obtain such high-purity argon gas, it is necessary to bake the equipment for processing the object before using the high-purity argon gas. The baking process is a process in which water adsorbed within the target apparatus is evaporated and removed by placing the target apparatus in an environment at a predetermined temperature for a predetermined period of time while evacuating the inside of the target apparatus. For example, it is necessary to perform dehydration treatment by heating the target device at 200° C. or higher for 48 hours. If water is adsorbed on the inner surface of the target device, it will evaporate into high purity argon gas. Water easily releases oxygen at high temperatures, making it easier to oxidize alloy materials. Therefore, it is preferable that the target device has a bakeable structure for the baking process.

When processing an alloy, materials contained in the alloy may evaporate near the melting temperature of the alloy. In order to suppress this evaporation, it is effective to process the alloy using high-pressure, high-purity argon gas. High pressure refers to 2 atm or more and 1000 atm.

As described above, it is preferable that the apparatus for processing an alloy by irradiating a laser has the following structure.
1. Structure that can be dehydrated and baked.
2. Structure capable of pressurizing high purity argon gas up to 10 atmospheres.

As an apparatus for processing such a workpiece made of an alloy or the like, a high vacuum floating melt zone single crystal growth apparatus using laser light is known (see Non-Patent Document 1). A processing device with this structure uses a magnetic fluid seal in the seal portion of the shaft to prevent oxygen and water from entering through the shaft seal portion even if the shaft rotates or moves linearly. A magnetic fluid is a highly viscous fluid in which Fe ₃ O ₄ magnetic powder of iron oxide is dispersed in oil. When the fluid oil that is the material of the magnetic fluid seal is heated, the oil evaporates inside the device, which deteriorates the vacuum inside the device. Oil adhering to the inner surface of the device cannot be removed by baking, which causes serious vacuum deterioration. Furthermore, when the magnetic fluid seal is pressurized, the magnetic fluid flows out from the magnetic fluid seal. Therefore, the airtightness of the sealed space cannot be maintained. For this reason, pressurizing the magnetic fluid seal makes it difficult to suppress evaporation of the alloy.

In a first aspect of the present invention, a laser processing apparatus is provided. The laser processing device includes a shaft rod that holds an object, a sealed portion that seals a space in which the shaft rod moves, and a drive portion that is provided outside the sealed portion and drives the shaft rod without contact. The sealing part has a first metal part made of non-magnetic metal. The first metal part surrounds a portion of the space.

The drive part may be arranged on the first metal part.

The drive unit may include a first magnet. The shaft rod may have a second magnet. The drive unit may drive the shaft rod in a non-contact manner using the attraction force between the first magnet and the second magnet.

The drive unit may include a plurality of first magnets. The shaft rod may have the same number of second magnets as the first magnets. The plurality of first magnets may be arranged at equal angles when viewed from the length direction of the shaft rod. The plurality of second magnets may be arranged at equal angles when viewed from the length direction of the shaft rod.

The first magnets may be arranged at a plurality of positions in the length direction of the shaft rod. The second magnets may be arranged at a plurality of positions in the length direction of the shaft rod.

The drive may be movable along the length of the shaft rod. The shaft rod may be longitudinally movable as the drive section moves longitudinally.

The drive unit may be rotatable about a central axis in a direction parallel to the length direction of the shaft rod. The shaft rod may be rotatable about a central axis parallel to the length direction of the shaft rod as the drive unit rotates.

The shaft rod may be provided with a metal object adjacent to the object that absorbs and stores at least one of oxygen or water.

The metal object may be an alloy containing at least one of titanium, vanadium, iron, zirconium, niobium, molybdenum, and tantalum, or a plurality of metals selected from these, or molybdenum-tantalum.

The laser processing device may further include a laser irradiation unit that irradiates the object with laser light.

The sealing portion may further include a transparent portion made of a material that transmits laser light.

The sealing portion is provided at an end of the transparent portion in the length direction of the shaft rod, and is provided at an end of the second metal portion formed of a non-magnetic metal and the first metal portion in the length direction of the shaft rod. , and a holding part that is made of non-magnetic metal and holds the shaft rod. The second metal part and the holding part may be connected with a gasket interposed therebetween.

The sealing part may further include an O-ring provided between the side of the transparent part and the second metal part in the longitudinal direction of the shaft rod.

The holding portion may be provided with a through hole through which the shaft rod passes. The holding portion may include a ball bearing provided between the inner wall of the through hole and the surface of the shaft rod in the radial direction of the shaft rod.

The holding part may include a plurality of ball bearings. The plurality of ball bearings may be arranged at equal angles when viewed from the length of the shaft rod.

The ball bearings may be arranged at a plurality of positions along the length of the shaft rod.

The space may include a gap provided between the inner wall of the through hole and the shaft rod. The void may be pressure resistant to an atmospheric pressure of 5 atmospheres or more.

The holding part, the shaft rod and the driving part may be heat resistant to temperatures of 100° C. or higher.

The laser processing device may include two shaft rods and may include two drive units. The sealing part may have two first metal parts, two second metal parts, and two holding parts. One drive may drive one shaft bar and the other drive may drive the other shaft bar. One first metal part may surround the space in which one of the shaft rods moves, and the other first metal part may surround the space in which the other shaft rod moves. One holding part may hold one shaft bar and the other holding part may hold the other shaft bar. One of the second metal parts may be provided at one end of the transmission part, and the other second metal part may be provided at the other end of the transmission part. One holding part may be provided at one end of the first metal part, and the other holding part may be provided at the other end of the first metal part. One of the second metal parts and one of the holding parts may be connected with a gasket in between, and the other second metal part and the other holding part may be connected with a gasket in between.

When one driving part rotates in one direction when viewed from the one first metal part to the other second metal part, the other driving part rotates in one direction when viewed from the one first metal part to the other second metal part. It can be rotated in any direction.

Note that the above summary of the invention does not list all the necessary features of the invention. Furthermore, subcombinations of these features may also constitute inventions.

1 is a diagram showing an example of a laser processing apparatus 100 according to an embodiment of the present invention. 2 is an enlarged view of a part of the first metal part 22-1, the holding part 25-1, the second metal part 24-1, and the transparent part 23 in FIG. 1. FIG. 2 is an enlarged view of a part of the first metal part 22-1, the holding part 25-1, the second metal part 24-1, and the transparent part 23 in FIG. 1. FIG. 3 is a view of the holding portion 25-1 in FIG. 2 as viewed in the length direction of the shaft rod 10 and in the direction from the end S2 to the end S1. FIG. It is a figure showing another example of laser processing device 100 concerning one embodiment of the present invention. 4 is an enlarged view of the first metal part 22-1 and the holding part 25-1 in FIGS. 1 to 3. FIG. 1 is a diagram showing an example of a top surface of a laser processing apparatus 100 according to an embodiment of the present invention. 8 is an enlarged view of the inner side of the drive unit 30-1 in the XY plane in FIG. 7. FIG. FIG. 3 is a diagram illustrating an example in which a plurality of drive sections 30 are provided for one first metal section 22. FIG. 1 is a diagram showing an example of a laser processing apparatus 100 according to an embodiment of the present invention.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Furthermore, not all combinations of features described in the embodiments are essential to the solution of the invention.

FIG. 1 is a diagram showing an example of a laser processing apparatus 100 according to one embodiment of the present invention. The laser processing apparatus 100 includes a shaft rod 10, a sealing part 20, and a driving part 30. The laser processing device 100 may be fixed to a fixed plate 90. The fixed plate is fixed to a predetermined housing. The drive unit 30 in this example is movable in the length direction of the shaft rod 10. In FIG. 1, the directions in which the drive unit 30 can move are indicated by thick double-headed arrows.

In this specification, technical matters may be explained using orthogonal coordinate axes of the X-axis, Y-axis, and Z-axis. In this specification, the length direction of the shaft rod 10 is defined as the Z axis, and the plane perpendicular to the Z axis is defined as the XY plane. The drive unit 30 of this example is movable in the Z-axis direction. In this specification, a predetermined direction within the XY plane is referred to as the X-axis direction, and a direction perpendicular to the X-axis within the XY plane is referred to as the Y-axis direction.

The sealing part 20 seals a space 21 (described later). The sealed portion 20 in this example extends from one end of the laser processing apparatus 100 to the other end. In the Z-axis direction, one end and the other end of the sealed portion 20 are defined as an end S1 and an end S2, respectively. In this specification, the end S1 side in the Z-axis direction is referred to as "upper", and the end S2 side is referred to as "lower". The Z-axis direction may be the direction of gravity. In this specification, a top view refers to a case where the laser processing apparatus 100 is viewed from the end S1 to the end S2 in the Z-axis direction.

The shaft rod 10 may be a cylindrical member whose central axis is in the Z-axis direction. The shaft rod 10 may be made of non-magnetic metal. The non-magnetic metal will be described later.

Shaft rod 10 holds an object 12. The object 12 is, for example, a single crystal rod or a polycrystalline raw material rod. In the longitudinal direction of the shaft rod 10, the end of the shaft rod 10 on the center side of the sealing part 20 is defined as an end ES. The shaft rod 10 may hold an object 12 at the end ES.

The laser processing apparatus 100 of this example includes two shaft rods 10 (shaft rod 10-1 and shaft rod 10-2). In this example, the shaft rod 10-1 and the shaft rod 10-2 are the shaft rods 10 on the end S1 side and the end S2 side in the Z-axis direction, respectively. In this example, the target object 12-1 and the target object 12-2 are the target objects 12 on the end S1 side and the end S2 side in the Z-axis direction, respectively. In this example, the end portion ES1 and the end portion ES2 are end portions ES on the end portion S1 side and the end portion S2 side in the Z-axis direction, respectively.

In this example, the fixed plate 90-1 and the fixed plate 90-2 are the fixed plates 90 on the end S1 side and the end S2 side in the Z-axis direction, respectively. In this example, the space 21-1 is a space 21 located between the fixed plate 90-1 and the end portion S1 in the Z-axis direction. In this example, the space 21-2 is a space 21 located between the fixed plate 90-2 and the end portion S2 in the Z-axis direction. In this example, the space 21-3 is a space 21 located between the fixed plate 90-1 and the fixed plate 90-2 in the Z-axis direction. In this example, the space 21 is one continuous space from end S1 to end S2 in the Z-axis direction. Space 21-1, space 21-2, and space 21-3 are defined separately for convenience of explanation.

The shaft rod 10 moves in the space 21. The shaft rod 10-1 in this example moves in the Z-axis direction through the spaces 21-1 and 21-3. The shaft rod 10-2 in this example moves in the Z-axis direction through the spaces 21-2 and 21-3.

The sealing portion 20 seals a space 21 in which the shaft rod 10 moves. The sealing section 20 of this example seals the space 21-1, the space 21-2, and the space 21-3. The space 21 is a space provided inside the sealed portion 20. The space 21 does not communicate with the outside of the sealed portion 20.

The drive section 30 is provided outside the sealed section 20. The drive unit 30 does not contact the space 21. The drive unit 30 drives the shaft rod 10 in a non-contact manner. The laser processing apparatus 100 of this example includes two drive units 30 (drive unit 30-1 and drive unit 30-2). Drive unit 30-1 and drive unit 30-2 in this example drive shaft rod 10-1 and shaft rod 10-2, respectively.

The sealing part 20 has a first metal part 22 . The first metal part 22 is made of nonmagnetic metal. In this specification, non-magnetic metal refers to a metal that does not have a magnetic moment at room temperature. The non-magnetic metal is, for example, stainless steel. The nonmagnetic metal may be tungsten, molybdenum, or the like. The first metal part 22 surrounds the space 21 in a part of the space 21 . The first metal part 22 in this example surrounds the space 21-1. The first metal part 22 may have a cylindrical shape with the center axis in the Z-axis direction.

The sealing part 20 of this example has two first metal parts 22 (first metal part 22-1 and first metal part 22-2). The first metal part 22-1 and the first metal part 22-2 surround the space 21-1 and the space 21-2, respectively.

The laser processing apparatus 100 may further include a laser irradiation section 40. The laser processing apparatus 100 may include a plurality of laser irradiation units 40. The laser irradiation unit 40 irradiates the target object 12 with laser light. The wavelength band of the laser beam may be an infrared band or a visible band.

The sealed portion 20 may further include a transparent portion 23. The transmitting portion 23 is formed of a material that transmits laser light. The transmitting portion 23 in this example is made of quartz glass with an amorphous structure made of silicon dioxide (SiO ₂ ). In this example, the laser light emitted from the laser irradiation section 40 passes through the transmission section 23 and enters the space 21-3. The transmitting portion 23 may have a cylindrical shape with the Z axis as the central axis.

The transmitting portion 23 in this example may be made of sapphire glass made of alumina oxide (Al ₂ O ₃ ). When the transmission section 23 is made of sapphire glass made of alumina oxide (Al ₂ O ₃ ), the transmission section 23 has the laser beam irradiated from the laser irradiation section 40 as its central axis, and is arranged at a portion through which the laser beam is transmitted. It may have a cylindrical shape. When the transmission part 23 is sapphire glass made of alumina oxide (Al ₂ O ₃ ) and the laser processing apparatus 100 includes a plurality of laser irradiation parts 40 , the sealed part 20 has the same number of cylindrical shapes as the laser irradiation parts 40 . It may have a transparent part 23 of.

The object 12 may be heated by being irradiated with laser light. The laser processing apparatus 100 of this example includes two laser irradiation units 40 (laser irradiation unit 40-1 and laser irradiation unit 40-2). The laser irradiation unit 40-1 and the laser irradiation unit 40-2 of this example are arranged on one side and the other side of the sealed portion 20 in the X-axis direction, respectively. The laser light irradiated from the laser irradiation section 40-1 and the laser light irradiated from the laser irradiation section 40-2 may travel parallel to each other and in opposite directions. In this example, the laser beam irradiated from the laser irradiation section 40-1 travels in one direction in the X-axis direction, and the laser beam irradiated from the laser irradiation section 40-2 travels in the other direction in the X-axis direction. proceed.

The laser processing apparatus 100 may include three or more laser irradiation units 40. Three or more laser irradiation units 40 may be arranged within one XY plane.

The end of the object 12 on the center side of the sealed portion 20 is defined as an end EA. In this example, end portion EA1 and end portion EA2 are end portions EA of object 12-1 and object 12-2, respectively. The laser irradiation unit 40 may irradiate the end EA of the object 12 with laser light. The laser irradiation unit 40 of this example irradiates the end EA1 of the object 12-1 and the end EA2 of the object 12-2 with laser light. The end portion EA1 and the end portion EA2 may be heated by being irradiated with laser light.

Space 21 may be baked. The baking process is a process in which water adsorbed within the target apparatus is evaporated and removed by placing the target apparatus in an environment at a predetermined temperature for a predetermined period of time while evacuating the inside of the target apparatus. In this example, since the space 21 is sealed by the sealing part 20, the space 21 can be made into a vacuum by evacuating the space 21. In this example, the space 21 is placed in an environment at a predetermined temperature for a predetermined time while being evacuated. Space 21 may be heated to the predetermined temperature. The predetermined temperature may be 100°C or more and 400°C or less, or 150°C or more and 300°C or less. The predetermined time may be 12 hours or more, 24 hours or more, or one week. Since the space 21 in this example is sealed by the sealing part 20, by baking the space 21, the water adsorbed inside the space 21 is released to the outside of the space 21.

After the space 21 is baked, high purity Ar (argon) gas may be introduced into the space 21. High-purity Ar (argon) gas is Ar (argon) gas in which the concentration of O ₂ (oxygen), H ₂ O (water), etc. contained in Ar (argon) is 1 ppm or less (1 ppm = 0.000001). refers to By introducing high-purity Ar (argon) gas into the space 21 after the space 21 is baked, the O ₂ (oxygen) partial pressure in the space 21 can be made less than 1×10 ⁻³⁰ atm. Therefore, even if the object 12 is heated by laser light, the object 12 is unlikely to be oxidized.

High purity Ar (argon) gas of 5 atm or more and 100 atm or less may be introduced into the space 21 . Even when the space 21 is pressurized to an atmospheric pressure of 5 atmospheres or more, the sealed portion 20 may have pressure resistance against the atmospheric pressure. Since the sealed portion 20 has the pressure resistance, the laser processing apparatus 100 can heat the object 12 with laser light in the pressurized space 21.

The sealing part 20 may further include a second metal part 24 and a holding part 25. The second metal part 24 may be made of nonmagnetic metal. The sealed portion 20 of this example has two second metal portions 24 (second metal portion 24-1 and second metal portion 24-2). The holding portion 25 may be made of nonmagnetic metal. The holding section 25 of this example includes two holding sections 25 (a holding section 25-1 and a holding section 25-2). The second metal part 24 and the holding part 25 are connected. The connection between the second metal part 24 and the holding part 25 will be described later.

In the Z-axis direction, the end of the transmission section 23 is defined as an end ET. In this example, the end portion ET1 and the end portion ET2 are the end portions ET on the end portion S1 side and the end portion S2 side, respectively, in the transparent portion 23. The second metal part 24 is provided at the end ET of the transparent part 23. The second metal portion 24-1 and the second metal portion 24-2 in this example are provided at the end ET1 and the end ET2 of the transparent portion 23, respectively. In other words, the transparent portion 23 is connected to the second metal portion 24-1 and the second metal portion 24-2 at the end portion ET1 and the end portion ET2, respectively. The end portion ET1 may be provided inside the second metal portion 24-1. The end portion ET2 may be provided inside the second metal portion 24-2. The connection between the transparent part 23 and the second metal part 24 will be described later.

In the Z-axis direction, the end portion of the first metal portion 22 on the center side of the transparent portion 23 is defined as an end portion EM. In this example, the end EM1 is the end EM of the first metal part 22-1 on the opposite side to the end S1, and the end EM2 is the end EM of the first metal part 22-2 on the opposite side to the end S2. It is EM. The holding part 25 is provided at the end EM of the first metal part 22. The holding part 25-1 and the holding part 25-2 in this example are provided at the end EM1 of the first metal part 22-1 and the end EM2 of the first metal part 22-2, respectively.

The first metal part 22 and the holding part 25 may be integrally formed. The first metal part 22 and the holding part 25 may be formed of the same non-magnetic metal into one member in which the first metal part 22 and the holding part 25 are joined. When the first metal part 22 and the holding part 25 are formed into one member from the same non-magnetic metal, the first metal part 22 and the holding part 25 are continuous at the end EM. The fact that the first metal part 22 and the holding part 25 are continuous at the end EM means that there is no interface that occurs when the first metal part 22 and the holding part 25, which are formed as different members, are joined together. refers to From the viewpoint of ensuring airtightness of the space 21, it is preferable that the first metal part 22 and the holding part 25 are formed integrally.

The holding part 25 holds the shaft rod 10. Holding section 25-1 and holding section 25-2 in this example hold shaft rod 10-1 and shaft rod 10-2, respectively. Details of the holding section 25 will be described later.

The driving part 30 may be arranged on the first metal part 22 . The drive section 30-1 and the drive section 30-2 in this example are arranged in the first metal section 22-1 and the first metal section 22-2, respectively.

The drive unit 30 may be movable in the length direction of the shaft rod 10 (Z-axis direction). In FIG. 1, directions in which the drive unit 30 can move are indicated by thick double-headed arrows. Further, the drive unit 30 may be rotatable around a central axis in a direction parallel to the length direction (Z-axis direction) of the shaft rod 10. The drive section 30 of this example is rotatable around the first metal section 22. When the first metal part 22 has a cylindrical shape with its central axis in the Z-axis direction, the position of the central axis of the first metal part 22 and the position of the central axis around which the drive part 30 rotates in the XY plane do not match. It's okay to stay.

It is preferable that the holding part 25, the shaft rod 10, and the driving part 30 have heat resistance. In this example, it is preferable that the holding part 25, the shaft rod 10, and the driving part 30 have heat resistance in a temperature range of 100° C. or more and 400° C. or less. The holding part 25, the shaft rod 10, and the driving part 30 having heat resistance means that the holding part 25, the shaft rod 10, and the driving part 30 do not deform or change in quality in the temperature range, and do not evaporate gas, etc. Refers to not generating something.

Since the holding part 25 has heat resistance, the sealing part 20 can ensure the airtightness of the space 21 even when the space 21 is heated to the above-mentioned temperature range. Since the holding part 25 and the shaft rod 10 have heat resistance, the laser processing apparatus 100 can heat the object 12 with laser light in the heated space 21. Since the drive unit 30 has heat resistance, the laser processing device 100 can drive the shaft rod 10 even when the space 21 is heated.

It is preferable that the first metal part 22, the second metal part 24, and the transparent part 23 also have heat resistance. In this example, it is preferable that the first metal part 22, the second metal part 24, and the transmission part 23 have heat resistance in a temperature range of 100° C. or more and 400° C. or less. Since the first metal part 22, the second metal part 24, and the transparent part 23 have heat resistance, the sealed part 20 can ensure the airtightness of the space 21 even when the space 21 is heated to the above-mentioned temperature range. . Since the first metal part 22, the second metal part 24, and the transmission part 23 have heat resistance, the laser processing apparatus 100 can heat the object 12 with laser light in the heated space 21.

Laser processing apparatus 100 may further include a vacuum pump 96 and a gas supply 98, and tubes 72, 74, and 76. The gas supply source 98 is, for example, a gas cylinder. The tube 76 may be provided with a gas outlet 99 .

Pipe 72 connects vacuum pump 96 and space 21 . Pipe 74 connects gas supply source 98 and space 21 . The pipe 76 connects the space 21 and the outside of the sealed portion 20 . The inside of the tube 76 communicates with the space 21 and the outside of the sealed portion 20 .

Tubes 72, 74, and 76 are provided with valves 54, 56, and 58, respectively. Valve 54 opens and closes the connection between vacuum pump 96 and space 21 in pipe 72 . Valve 56 opens and closes the connection between gas supply source 98 and space 21 in pipe 74 . The valve 58 opens and closes the connection between the space 21 in the pipe 76 and the outside of the sealed portion 20 .

The tube 72 and tube 76 in this example are provided in the second metal part 24-1. In the second metal portion 24-1, the tube 72 and the tube 76 may be provided in a direction perpendicular to the extending direction of the shaft rod 10. The valve 54 and the valve 58 may be provided outside the second metal part 24-1. The tube 74 in this example is provided in the second metal part 24-2. In the second metal portion 24-2, the tube 74 may be provided in a direction perpendicular to the extending direction of the shaft rod 10. The valve 56 may be provided outside the second metal part 24-2.

FIG. 2 is an enlarged view of a part of the first metal part 22-1, holding part 25-1, second metal part 24-1, and transmission part 23 in FIG. FIG. 2 shows the first metal part 22-1, the holding part 25-1, the second metal part 24-1, and the transparent part 23 before the second metal part 24-1 and the holding part 25-1 are connected. It shows a part of. However, in FIG. 2, illustration of the pipe 72 and the pipe 76 provided in the second metal part 24-1 is omitted.

The second metal part 24-1 is, for example, a flange. The second metal part 24-1 has an upper surface 27. In this example, the upper surface 27 is a surface parallel to the XY plane. An opening 50 is provided in the second metal portion 24-1. The depth direction of the opening 50 is perpendicular to the upper surface 27 and the direction from the upper surface 27 to the end portion S2 (see FIG. 1). The opening 50 passes through the second metal portion 24-1. The inner wall 36 is the inner wall of the opening 50.

The sealing part 20 (see FIG. 1) may further include an O-ring 29. The side surface of the transparent portion 23 extending in the Z-axis direction inside the second metal portion 24-1 is defined as a side portion 52. The side portion 52-1 and the side portion 52-2 are an inner side surface and an outer side surface of the transparent portion 23, respectively, when viewed from above. The inner O-ring 29 and the outer O-ring 29 of the transparent portion 23 when viewed from above are referred to as an O-ring 29-1 and an O-ring 29-2, respectively. O-ring 29-1 and O-ring 29-2 in this example are in contact with side portion 52-1 and side portion 52-2, respectively.

In this example, since the second metal part 24 does not operate relative to the transmission part 23, an O-ring 29 may be provided between the side part 52 of the transmission part 23 and the second metal part 24-1. . The second metal part 24-1 may be welded to the side part 52 of the transparent part 23. In this case, the O-ring 29 does not need to be provided between the side portion 52 of the transparent portion 23 and the second metal portion 24-1. The O-ring 29 is provided between the side part 52 of the transparent part 23 and the second metal part 24-1, or the second metal part 24-1 is welded to the side part 52 of the transparent part 23. , the airtightness of the space 21 can be easily ensured.

The holding portion 25-1 is, for example, a flange. The holding portion 25-1 has a lower surface 26. In this example, the lower surface 26 is a surface parallel to the XY plane. A through hole 62 is provided in the holding portion 25-1. The through hole 62 passes through the holding portion 25-1 in a direction perpendicular to the lower surface 26 (Z-axis direction). The inner wall 28 is the inner wall of the through hole 62. The inner wall 28 is in contact with the space 21-1. The shaft rod 10-1 passes through the through hole 62.

The holding part 25-1 may include a ball bearing 60. The second metal part 24-1 may include a ball bearing 60.

A gasket 70 may be disposed on the lower surface 26 of the holding portion 25-1. A gasket is a fixing sealing material used to ensure airtightness of an object. The gasket 70 may be arranged on the upper surface 27 of the second metal part 24.

FIG. 3 is an enlarged view of a part of the first metal part 22-1, holding part 25-1, second metal part 24-1, and transmission part 23 in FIG. FIG. 3 shows the first metal part 22-1, the holding part 25-1, the second metal part 24-1, and the transparent part 23 after the second metal part 24-1 and the holding part 25-1 are connected. It shows a part of. However, in FIG. 3, illustration of the pipe 72 and the pipe 76 provided in the second metal part 24-1 is omitted.

In this example, the second metal part 24-1 and the holding part 25-1 are connected with a gasket 70 in between. The gasket 70 of this example is sandwiched between the upper surface 27 (see FIG. 2) of the second metal portion 24-1 and the lower surface 26 (see FIG. 2) of the holding portion 25-1 in the Z-axis direction. By connecting the second metal part 24-1 and the holding part 25-1 with the gasket 70 in between, the airtightness of the space 21 can be easily ensured.

The gap between the inner wall 28 of the through hole 62 and the shaft rod 10-1 is defined as a gap 64. Space 21 includes a void 64. The gap 64 is a gap between the inner wall 28 and the shaft rod 10-1 in the XY plane. The void 64 surrounds the shaft rod 10-1 in the XY plane.

The gap between the inner wall 36 of the opening 50 and the shaft rod 10-1 is defined as a gap 66. Space 21 includes a void 66. The gap 66 is a gap between the inner wall 36 and the shaft rod 10-1 in the XY plane. The void 66 surrounds the shaft rod 10-1 in the XY plane.

In this example, ball bearings 60 are provided in gaps 64 and 66. In the holding portion 25-1, the ball bearing 60 may be in contact with the inner wall 28 and the surface of the shaft rod 10. In the second metal portion 24-1, the ball bearing 60 may be in contact with the inner wall 36 and the surface of the shaft rod 10. Since the holding portion 25-1 of this example includes the ball bearing 60 provided between the inner wall 28 and the surface of the shaft rod 10, the shaft rod 10 can easily move in the space 21 in the Z-axis direction. Further, since the second metal part 24-1 of this example includes a ball bearing 60 provided between the inner wall 36 and the surface of the shaft rod 10, the shaft rod 10 can easily move in the space 21 in the Z-axis direction. Become.

The voids 64 and 66 may have pressure resistance to an atmospheric pressure of 5 atmospheres or more. The air gap 64 and the air gap 66 have pressure resistance against an air pressure of 5 atmospheres or more. This means that even when the air gap 64 and the air gap 66 are pressurized to 5 atmospheres or more, the shaft rod in the space 21 10 in the Z-axis direction can be ensured.

The ball bearings 60 may be arranged at a plurality of positions in the length direction (Z-axis direction) of the shaft rod 10, respectively. In this example, the ball bearings 60 are arranged at four positions in the Z-axis direction.

FIG. 4 is a view of the holding portion 25-1 in FIG. 2 viewed in the length direction (Z-axis direction) of the shaft rod 10 and in the direction from the end S2 (see FIG. 1) to the end S1. FIG. 4 is an XY cross section at a position passing through the ball bearing 60 in the Z-axis direction. In FIG. 4, illustration of the gasket 70 is omitted.

The holding part 25 may have a plurality of ball bearings 60. The holding portion 25-1 of this example has eight ball bearings 60 in the XY cross section in FIG. The plurality of ball bearings 60 may be arranged at equal angles when viewed from the length direction (Z-axis direction) of the shaft rod 10. Let the center of the shaft rod 10 in the XY cross section be the center D. In this example, one ball bearing 60 is designated as ball bearing 60-1, and another ball bearing 60 adjacent to one ball bearing 60 is designated as ball bearing 60-2. The angle between the straight line connecting the ball bearing 60-1 and the center D and the straight line connecting the ball bearing 60-2 and the center D is defined as an angle θ. The angle θ may be equal across all ball bearings 60. In this example, the angle θ is 45 degrees across eight ball bearings 60. Note that the straight line connecting the ball bearing 60 and the center D may be a straight line connecting the center of the ball bearing 60 in the XY plane and the center D.

FIG. 5 is a diagram showing another example of the laser processing apparatus 100 according to one embodiment of the present invention. The laser processing apparatus 100 of this example differs from the laser processing apparatus 100 shown in FIG. 1 in that a metal object 13 is further provided on the shaft rod 10-2. The metal object 13 may be provided adjacent to the target object 12-2. The metal object 13 may be rod-shaped. When the metal object 13 is rod-shaped, one end of the metal object 13 may be connected to the shaft rod 10-2, and the other end of the metal object 13 may be connected to the object 12-2.

The metal object 13 absorbs and stores at least one of O ₂ (oxygen) or H ₂ O (water). The metal object 13 may be a so-called getter metal. A getter metal is a metal that can adsorb gas remaining in a vacuum. The metal object 13 is provided in the space 21.

The metal object 13 may be at least one of Ti (titanium), V (vanadium), Fe (iron), Zr (zirconium), Nb (niobium), Mo (molybdenum), and Ta (tantalum). The metal object 13 is an alloy containing a plurality of metals selected from Ti (titanium), V (vanadium), Fe (iron), Zr (zirconium), Nb (niobium), Mo (molybdenum), and Ta (tantalum). There may be.

The metal object 13 may be fixed by a rod 15. Rod 15 may be made of platinum (Pt). The rod 15 may be wire-shaped. The length direction of the wire may be the Z-axis direction. The diameter of the wire is, for example, 0.3 mm. Rod 15 may be fixed to shaft rod 10-2. A plurality of wire rods 15 may be fixed to the shaft rod 10-2. The plurality of wire-shaped rods 15 may be provided so as to surround the metal object 13 when viewed from above. In this example, the metal object 13 is fixed to a plurality of wire-shaped rods 15 made of platinum.

The space 21 may be baked by heating the metal object 13 with laser light. The laser beam may be irradiated by the laser irradiation section 40. By heating the metal object 13 with laser light while evacuating the space 21, the laser processing apparatus 100 removes at least one of O ₂ (oxygen) or H ₂ O (water) remaining in the space 21 from the metal object. 13 can be absorbed and stored. Therefore, the laser processing apparatus 100 can improve the degree of vacuum in the space 21.

FIG. 6 is an enlarged view of the first metal part 22-1 and the holding part 25-1 in FIGS. 1 to 3. In FIG. 6, the transparent portion 23 and second metal portion 24-1 in FIGS. 2 and 3 are omitted.

The laser processing apparatus 100 of this example further includes a control section 80 that controls movement and rotation of the drive section 30. The control section 80 of this example includes a guide 82, a fixed section 84, a connecting section 85, a pedestal 86, and a moving section 88.

The guide 82 may be a rod-shaped member. The length direction of the guide 82 may be parallel to the length direction of the shaft rod 10 (Z-axis direction).

The fixing part 84 connects the guide 82 and the first metal part 22. The control section 80 of this example has two fixing sections 84 (fixing section 84-1 and fixing section 84-2). The fixing portion 84-1 and the fixing portion 84-2 in this example are provided on the end S1 side and the end S2 side (see FIG. 1), respectively, in the Z-axis direction. The guide 82 is fixed by a fixing part 84 so that its position relative to the first metal part 22 does not change.

The moving part 88 is provided on the guide 82. The moving part 88 is provided so as to be movable along the length direction of the guide 82. The moving unit 88 in this example is movable in the Z-axis direction.

The pedestal 86 may be provided on the first metal part 22. The bottom surface of the pedestal 86 (a surface parallel to the XY plane) may be provided with an opening through which the first metal part 22 passes. The first metal portion 22 may pass through the opening of the pedestal 86 in the length direction of the shaft rod 10 (Z-axis direction). The drive unit 30 is provided on the pedestal 86 . The drive unit 30 may be provided above the pedestal 86 so as to be rotatable in the XY plane.

The connecting portion 85 connects the base 86 and the moving portion 88 . The pedestal 86 is fixed by the connecting part 85 so that its position relative to the moving part 88 does not change.

The control unit 80 controls movement of the moving unit 88 along the guide 82 . The control unit 80 controls the movement of the drive unit 30 in the longitudinal direction of the shaft rod 10 by controlling the movement. The control unit 80 further controls the rotation of the drive unit 30 in the XY plane.

The driving part 30 may be arranged on the first metal part 22 . The drive section 30-1 in this example is arranged in the first metal section 22-1. Further, as shown in FIG. 1, the driving section 30-2 of this example is arranged in the first metal section 22-2.

The drive unit 30 may include a first magnet 32 . The drive unit 30 may include a plurality of first magnets 32. The drive unit 30 of this example includes two first magnets 32 (first magnet 32-1 and first magnet 32-2). The first magnet 32-1 and the first magnet 32-2 may be provided so as to sandwich the first metal part 22-1 in the XY plane. When the first metal part 22-1 is cylindrical, the first magnet 32-1 and the first magnet 32-2 may be provided facing the side surface of the cylinder of the first metal part 22-1. The side surface is a surface parallel to the Z-axis direction. The first magnet 32-1 and the first magnet 32-2 in this example are provided so as to sandwich the first metal part 22-1 in the X-axis direction. In other words, the first magnet 32-1 and the first magnet 32-2 of this example are provided on one side and the other side of the first metal part 22-1, respectively, in the X-axis direction.

The N pole and S pole of the first magnet 32 may be arranged on one side and the other side in the Z-axis direction, respectively. The N pole of the first magnet 32-1 and the N pole of the first magnet 32-2 may be arranged at opposite positions in the Z-axis direction. The S pole of the first magnet 32-1 and the S pole of the first magnet 32-2 may be arranged at opposite positions in the Z-axis direction. In this example, the N pole and S pole of the first magnet 32-1 are arranged on the end S1 side and the end S2 (see FIG. 1) side in the Z-axis direction, respectively. Further, in this example, the N pole and S pole of the first magnet 32-2 are arranged on the end S2 (see FIG. 1) side and the end S1 side in the Z-axis direction, respectively.

The shaft rod 10 may have a second magnet 14 . When the shaft rod 10 is cylindrical, the second magnet 14 may be provided so as to be exposed on the side surface of the column of the shaft rod 10, or may be provided on the side surface. The side surface is a surface parallel to the Z-axis direction. The shaft rod 10 may have a plurality of second magnets 14. The shaft rod 10 of this example has two second magnets 14 (second magnet 14-1 and second magnet 14-2). The second magnet 14-1 and the second magnet 14-2 may be provided to sandwich the shaft rod 10 in the XY plane. The second magnet 14-1 and the second magnet 14-2 in this example are provided so as to sandwich the shaft rod 10-1 in the X-axis direction. In other words, the second magnet 14-1 and the second magnet 14-2 of this example are provided on one side and the other side of the shaft rod 10-1, respectively, in the X-axis direction.

The N pole and S pole of the second magnet 14 may be arranged on one side and the other side in the Z-axis direction, respectively. The N pole of the second magnet 14-1 and the N pole of the second magnet 14-2 may be arranged at opposite positions in the Z-axis direction. The S pole of the second magnet 14-1 and the S pole of the second magnet 14-2 may be arranged at opposite positions in the Z-axis direction. In this example, the N pole and S pole of the second magnet 14-1 are arranged on the end S2 (see FIG. 1) side and the end S1 side in the Z-axis direction, respectively. Further, in this example, the N pole and S pole of the second magnet 14-2 are arranged on the end S1 side and the end S2 (see FIG. 1) side in the Z-axis direction, respectively.

The N pole of the first magnet 32 and the S pole of the second magnet 14 may be arranged on one side in the Z-axis direction. The S pole of the first magnet 32 and the N pole of the second magnet 14 may be arranged on the other side in the Z-axis direction. In this example, the N pole of the first magnet 32-1 and the S pole of the second magnet 14-1 are arranged on the end S1 side in the Z-axis direction, and the S pole of the first magnet 32-1 and the S pole of the second magnet 14-1 The N pole of the two magnets 14-1 is arranged on the end S2 (see FIG. 1) side in the Z-axis direction. Further, in this example, the N pole of the first magnet 32-2 and the S pole of the second magnet 14-2 are arranged on the end S2 (see FIG. 1) side in the Z-axis direction, and the first magnet 32 The S pole of -2 and the N pole of the second magnet 14-2 are arranged on the end S1 side in the Z-axis direction.

By arranging the first magnet 32 and the second magnet 14 as described above, an attractive force is generated between the first magnet 32 and the second magnet 14. In this example, since the first metal part 22 is formed of a non-magnetic metal, the first metal part 22 does not easily interfere with the attraction force between the first magnet 32 and the second magnet 14. Therefore, the drive unit 30 can drive the shaft rod 10 without contact due to the attraction force between the first magnet 32 and the second magnet 14. Therefore, the control unit 80 can control the movement and rotation of the shaft rod 10 in a non-contact manner by controlling the movement and rotation of the drive unit 30.

It is preferable that the first magnet 32 and the second magnet 14 are rare earth magnets. Examples of rare earth magnets include samarium cobalt magnets (SmCo ₅ , Sm ₂ Co ₁₇ ), neodymium magnets (Nd ₂ Fe ₁₄ B), and the like. Rare earth magnets have a higher saturation magnetic flux density than transition metal magnets. Therefore, by using rare earth magnets as the first magnet 32 and the second magnet 14, it is easy to improve the driving accuracy of the shaft rod 10 by the driving section 30.

The moving part 88 may be movable within a predetermined range in the length direction (Z-axis direction) of the shaft rod 10. In FIG. 6, the movable range of the moving unit 88 is indicated by double-headed arrows. The boundary position on the end S1 side in the movable range may be determined in a range where the upper end of the shaft rod 10-1 on the end S1 side does not collide with the end S1. The boundary position on the end S2 side (see FIG. 1) in the movable range may be, for example, the position of the fixed part 84-2 in the Z-axis direction.

FIG. 7 is a diagram showing an example of the top surface of the laser processing apparatus 100 according to one embodiment of the present invention. FIG. 7 is a top view of the laser processing apparatus 100 shown in FIGS. 1 to 4. However, the control section 80 is omitted in FIG. 7. Note that FIGS. 1 to 4 are cross-sectional views taken along an XZ cross section passing through center C (described later) in FIG.

Laser processing apparatus 100 includes a sealing section 20 and a driving section 30. The sealed portion 20 includes a first metal portion 22-1, a transparent portion 23, a second metal portion 24-1, and a holding portion 25. The first metal part 22-1, second metal part 24-1, and holding part 25 of this example have a circular shape when viewed from above.

The center of the first metal portion 22-1 in a top view is defined as a center C. The center positions of the second metal part 24-1 and the holding part 25 in a top view may be equal to the position of the center C. That is, the first metal part 22-1, the second metal part 24-1, and the holding part 25 may be arranged concentrically with the center C as the center when viewed from above. Note that in the XY plane, the position of the center C may be equal to the position of the center D (see FIG. 4).

In FIG. 7, the position of the transparent portion 23 when viewed from above is indicated by a broken line. In FIG. 7, dashed lines on the inner and outer circumferential sides indicate the positions of the inner and outer surfaces of the transparent portion 23, respectively. The inner surface and the outer surface of the transparent portion 23 may be circular when viewed from above. The center position of the circle on the inner surface and the outer surface of the transparent part 23 may be equal to the position of the center C.

The drive unit 30 may have a circular shape when viewed from above. The center position of the drive unit 30 when viewed from above may be equal to the center C position. The drive unit 30 of this example has a plurality of first magnets 32 in the XY cross section of FIG. The drive unit 30-1 of this example includes four first magnets 32 (first magnets 32-1 to 32-4).

The plurality of first magnets 32 may be arranged at equal angles when viewed from the length direction (Z-axis direction) of the shaft rod 10. In this example, one first magnet 32 is referred to as a first magnet 32-1, and another first magnet 32 adjacent to one first magnet 32 is referred to as a first magnet 32-3. The angle between the straight line connecting the first magnet 32-1 and the center C and the straight line connecting the first magnet 32-3 and the center C is defined as an angle θ'. The angle θ' may be equal across all first magnets 32. In this example, the angle θ' is 45 degrees across the four first magnets 32.

The first magnet 32-1 and the first magnet 32-2 in this example are provided so as to sandwich the first metal part 22-1 in the X-axis direction. One pole of the first magnet 32-1 and the other pole of the first magnet 32-2 may be arranged on both sides of the first metal part 22-1 in the X-axis direction. In this example, the N pole of the first magnet 32-1 and the S pole of the first magnet 32-2 are arranged on both sides of the first metal part 22-1 in the X-axis direction, respectively.

The first magnet 32-3 and the first magnet 32-4 in this example are provided so as to sandwich the first metal part 22-1 in the Y-axis direction. One pole of the first magnet 32-3 and the other pole of the first magnet 32-4 may be arranged on both sides of the first metal part 22-1 in the Y-axis direction, respectively. In this example, the N pole of the first magnet 32-3 and the S pole of the first magnet 32-4 are arranged on both sides of the first metal part 22-1 in the Y-axis direction, respectively.

The drive section 30 may be rotatable around the first metal section 22-1. The drive unit 30 of this example can rotate around the first metal part 22-1 with the center C as the central axis. Further, the drive unit 30 of this example is movable in the Z-axis direction with the center C as the central axis.

FIG. 8 is an enlarged view of the inside of the drive unit 30-1 in the XY plane in FIG. FIG. 8 is an XY cross-sectional view at a position where the first magnet 32 is provided in the Z-axis direction of FIG. In FIG. 8, illustration of the second metal part 24-1, the holding part 25, and the transparent part 23 is omitted.

The shaft rod 10 of this example has a plurality of second magnets 14 in the XY cross section of FIG. The number of second magnets 14 may be the same as the number of first magnets 32. The shaft rod 10-1 of this example has four second magnets 14 (second magnets 14-1 to 14-4).

The plurality of second magnets 14 may be arranged at equal angles when viewed from the length direction (Z-axis direction) of the shaft rod 10. In this example, one second magnet 14 is designated as second magnet 14-1, and another second magnet 14 adjacent to one second magnet 14 is designated as second magnet 14-3. The angle between the straight line connecting the second magnet 14-1 and the center D and the straight line connecting the second magnet 14-3 and the center D may be equal across all the second magnets 14. The angle between the straight line connecting the second magnet 14-1 and the center D and the straight line connecting the second magnet 14-3 and the center D is the angle between the straight line connecting the first magnet 32-1 and the center D, and the straight line connecting the second magnet 14-3 and the center D. It may be equal to the angle θ' between the straight line connecting one magnet 32-3 and the center D. In this example, the angle θ' is 45 degrees across the four second magnets 14.

The second magnet 14-1 and the second magnet 14-2 in this example are provided so as to sandwich the center D of the shaft rod 10-1 in the X-axis direction. One pole of the second magnet 14-1 and the other pole of the second magnet 14-2 may be arranged on both sides of the center D in the X-axis direction. In this example, the N pole of the second magnet 14-1 and the S pole of the second magnet 14-2 are arranged on both sides of the center D in the X-axis direction, respectively.

The second magnet 14-3 and the second magnet 14-4 in this example are provided so as to sandwich the center D of the shaft rod 10-1 in the Y-axis direction. One pole of the second magnet 14-3 and the other pole of the second magnet 14-4 may be arranged on both sides of the center D in the Y-axis direction. In this example, the N pole of the second magnet 14-3 and the S pole of the second magnet 14-4 are arranged on both sides of the center D in the Y-axis direction, respectively.

In the XY plane, the first magnet 32 and the second magnet 14 may be arranged to face each other with the first metal part 22 in between. One pole of the first magnet 32 may be opposed to the other pole of the second magnet 14 in the XY plane. In this example, the first magnet 32-1 and the second magnet 14-1 are arranged facing each other with the first metal part 22-1 sandwiched therebetween in the X-axis direction. In this example, the N pole of the first magnet 32-1 faces the S pole of the second magnet 14-1 in the XY plane. Further, in this example, the first magnet 32-3 and the second magnet 14-3 are arranged to face each other with the first metal part 22-1 sandwiched therebetween in the Y-axis direction. In this example, the N pole of the first magnet 32-3 faces the S pole of the second magnet 14-3 in the XY plane.

FIG. 9 is a diagram showing an example in which a plurality of drive parts 30 are provided for one first metal part 22. This example differs from the example shown in FIG. 6 in that a plurality of drive units 30 are provided. In this example, two drive sections 30 (drive section 30-1 and drive section 30-3) are provided for one first metal section 22-1. In this example, the drive section 30-1 is provided closer to the end S1 in the Z-axis direction than the drive section 30-3.

In this example, the first magnet 32 and the second magnet 14 are arranged at a plurality of positions in the length direction (Z-axis direction) of the shaft rod 10. In this example, the first magnet 32-1 and the first magnet 32-2, and the first magnet 32-5 and the first magnet 32-6 are arranged at different positions in the Z-axis direction. In this example, the second magnet 14-1 and the second magnet 14-2, and the second magnet 14-5 and the second magnet 14-6 are arranged at different positions in the Z-axis direction.

In this example, the first magnet 32-1 and the first magnet 32-2, and the second magnet 14-1 and the second magnet 14-2 are arranged at the same position in the Z-axis direction. Further, in this example, the first magnet 32-5 and the first magnet 32-6, and the second magnet 14-5 and the second magnet 14-6 are arranged at the same position in the Z-axis direction.

In this example, the drive unit 30-1 includes a first magnet 32-1 and a first magnet 32-2. Further, in this example, the drive unit 30-2 includes a first magnet 32-5 and a first magnet 32-6.

In this example, the control section 80 includes a plurality of connection sections 85, a plurality of pedestals 86, and a plurality of moving sections 88. The control section 80 of this example includes two connecting sections 85 (connecting sections 85-1 and 85-2), two pedestals 86 (pedestals 86-1 and 86-2), and two moving sections 88 (moving sections 85-1 and 85-2). section 88-1 and moving section 88-2). In this example, the connecting portion 85-1, the pedestal 86-1, and the moving portion 88-1 are located closer to the end portion S1 in the Z-axis direction than the connecting portion 85-2, the pedestal 86-2, and the moving portion 88-2, respectively. It is provided.

The plurality of moving parts 88 are provided on one guide 82. In this example, moving section 88-1 and moving section 88-2 are provided in one guide 82. The moving section 88-1 and the moving section 88-2 are provided so as to be movable along the length direction of the guide 82. The moving unit 88 in this example is movable in the Z-axis direction.

The plurality of pedestals 86 may be provided on one first metal part 22. In this example, pedestal 86-1 and pedestal 86-2 are provided on one first metal portion 22-1. An opening through which the first metal part 22 passes may be provided in the bottom surface (plane parallel to the XY plane) of the pedestal 86-1 and the pedestal 86-2. The first metal portion 22 may pass through the openings of the pedestals 86-1 and 86-2 in the length direction (Z-axis direction) of the shaft rod 10. The pedestal 86-1 and the pedestal 86-2 are provided with a driving section 30-1 and a driving section 30-2, respectively. Drive unit 30-1 and drive unit 30-2 may be provided above pedestal 86-1 and pedestal 86-2, respectively, so as to be rotatable in the XY plane.

The connecting portion 85-1 connects the base 86-1 and the moving portion 88-1. The connecting portion 85-2 connects the base 86-2 and the moving portion 88-2. The pedestal 86-1 is fixed by the connecting portion 85-1 so that its position relative to the moving portion 88-1 does not change. The pedestal 86-2 is fixed by the connecting portion 85-2 so that its position relative to the moving portion 88-2 does not change.

The control unit 80 controls movement of the plurality of moving units 88 along the guide 82. In this example, the control section 80 controls the movement of the moving section 88-1 and the moving section 88-2 along the guide 82. The control unit 80 controls the movement of the drive unit 30-1 and the drive unit 30-2 in the longitudinal direction of the shaft rod 10 by controlling the movement. The control unit 80 further controls the rotation of the drive unit 30-1 and the drive unit 30-2 in the XY plane.

In this example, a plurality of drive parts 30 are provided for one first metal part 22. Therefore, the control unit 80 controls the movement of the moving unit 88 along the guide 82 and the XY In-plane rotation can be controlled more precisely. That is, the control unit can more precisely control the movement of the shaft rod 10 along the Z-axis direction and the rotation of the shaft rod 10 within the XY plane.

FIG. 10 is a diagram showing an example of a single crystal growth apparatus 200 according to one embodiment of the present invention. In this example, a case will be described in which the laser processing apparatus 100 shown in FIGS. 1 to 5 is used as a single crystal growth apparatus 200 using the FZ (Floating Zone) method.

The shaft rod 10-1 of this example holds the raw material rod 16 at the end ES1. The shaft rod 10-2 in this example holds the crystal rod 18 at the end ES2. The crystal rod 18 is a single crystal formed into a rod shape. The raw material rod 16 is a polycrystal sintered into a rod shape. The length direction of the raw material rod 16 and the crystal rod 18 may be the Z-axis direction. The central axis of the raw material rod 16 and the central axis of the crystal rod 18 are arranged at the same position in the XY plane.

The raw material rod 16 is made of the same material as the crystal rod 18. The crystal rod 18 is, for example, a single crystal of Si (silicon). The raw material rod 16 is, for example, polycrystalline Si (silicon).

After the raw material rod 16 is installed on the shaft rod 10-1 and the crystal rod 18 is installed on the shaft rod 10-2, the space 21 is baked. After the space 21 is baked, high-purity Ar (argon) gas is introduced into the space 21. For the baking process of the space 21 and the introduction of Ar (argon) gas into the space 21, please refer to the explanation of FIG. 1.

The control section 80 (see FIG. 6) controls the rotation of the drive section 30-1 and the drive section 30-2. When one driving section 30 rotates in one direction when viewed from one first metal section 22 to the transmission section 23, the other driving section 30 rotates from the transmission section 23 to the other second metal section 24. You can look in one direction and rotate in the other direction. In this example, when the driving part 30-1 rotates in one direction when viewed from the first metal part 22-1 toward the transparent part 23, the driving part 30-2 rotates from the transparent part 23 to the second metal part 23. It rotates in the other direction when viewed in the direction of section 24-2.

In this example, the direction from the first metal part 22-1 to the transparent part 23 is the direction from the end S1 to the end S2 in the Z-axis direction. Further, in this example, the direction from the transparent part 23 to the second metal part 24-2 is the direction from the end S1 to the end S2 in the Z-axis direction. That is, in this example, the direction from the first metal part 22-1 to the transparent part 23 and the direction from the transparent part 23 to the second metal part 24-2 are the same.

In this example, drive unit 30-1 and drive unit 30-2 rotate in opposite directions when viewed from end S1 to end S2. In FIG. 10, the rotation direction of drive section 30-1 and the rotation direction of drive section 30-2 are respectively indicated by black arrows. FIG. 10 is an example in which the drive unit 30-1 rotates clockwise and the drive unit 30-2 rotates counterclockwise when viewed in the relevant direction. Note that the magnitude of the angular velocity of rotation in the drive section 30-1 and the magnitude of the angular velocity of rotation in the drive section 30-2 may be equal.

The end of the raw material rod 16 on the end S2 side is defined as an end EB1. The end of the crystal rod 18 on the end S1 side is defined as an end EB2. The laser irradiation unit 40 irradiates the end EB1 of the raw material rod 16 and the end EB2 of the crystal rod 18 with laser light. The raw material rod 16 is rotating in one direction, and the crystal rod 18 is rotating in the other direction. End portion EB1 and end portion EB2 are heated and melted by laser light irradiation. As a result, a molten zone 19 is generated between the end portion EB1 and the end portion EB2 in the Z-axis direction. The melting zone 19 is supported by the surface tension of the melting zone 19 between the end portion EB1 and the end portion EB2.

The control unit 80 (see FIG. 6) controls movement of the drive unit 30-1 and the drive unit 30-2 in the Z-axis direction. When one drive unit 30 moves in the length direction (Z-axis direction) of the shaft rod 10 and in the direction from one first metal part 22 to the transparent part 23, the other drive part 30 moves in the length direction (Z-axis direction) of the shaft rod 10. It may move in the horizontal direction and in the direction from the transparent part 23 to the other second metal part 24 . In this example, when the driving part 30-1 moves in the Z-axis direction and from the first metal part 22-1 to the transparent part 23, the driving part 30-2 moves in the Z-axis direction and from the transparent part 23 to the second metal part 23. 24-2. Note that the speed at which one drive section 30 moves and the speed at which the other drive section 30 moves may be the same or different.

As described above, the direction from the first metal part 22-1 to the transparent part 23 and the direction from the transparent part 23 to the second metal part 24-2 are the directions from the end S1 to the end S2. That is, in this example, drive section 30-1 and drive section 30-2 move in the same direction in the Z-axis direction. In FIG. 10, the direction of movement of the drive unit 30-1 and the drive unit 30-2 is indicated by thick arrows.

Hereinafter, a single crystal growing process using the single crystal growing apparatus 200 of this example will be explained. The single crystal growth process may include a baking process, a gas introduction process, and an object melting process. The baking process may include a vacuuming process in which the vacuum pump 96 evacuates the space 21 and a heating process in which the space 21 is heated.

In the evacuation step, the vacuum pump 96 evacuates the space 21 with the valve 54 open and the valves 56 and 58 closed. In the heating process, for example, a ribbon heater provided on the shaft rod 10 heats the space 21. Space 21 may be heated to 200°C or higher. The heating step may be performed while the space 21 is evacuated by the vacuum pump 96.

The baking process may further include a gettering process. In the gettering process, the laser irradiation section 40 heats the metal object 13 by irradiating the metal object 13 with a laser beam. In the gettering process, the metal object 13 may be heated to 1000°C.

In the single crystal growth apparatus 200 of this example, the space 21 is sealed by the sealing part 20. Therefore, by performing the baking process, the water adsorbed inside the space 21 can easily escape to the outside of the space 21.

The gas introduction step is performed after the baking step. In the gas introduction step, the gas supply source 98 supplies gas to the space 21 with the valve 54 closed and the valves 56 and 58 open. The gas may be high purity Ar (argon) gas. The gas supplied from the pipe 74 to the space 21 passes through the inside of the transmission section 23 in the Z-axis direction. The gas that has passed through the inside of the transmission section 23 in the Z-axis direction passes through the pipe 76 and is discharged to the outside of the sealed section 20 from the gas outlet 99. By performing the gas introduction step after the baking step, the O ₂ (oxygen) partial pressure in the space 21 can be made to be an extremely low pressure (for example, less than 1×10 ⁻³⁰ atm).

In the gas introduction step, the gas supply source 98 may supply high pressure gas to the space 21 . The pressure of the high pressure gas may be 2 atm or more and 1000 atm or less. In the single crystal growth apparatus 200 of this example, the space 21 is sealed by the sealing part 20, so that the pressure of the gas introduced into the space 21 can be made high.

The object dissolving step may be performed while the gas supply source 98 supplies gas to the space 21 . In the target object melting step, the laser irradiation unit 40 irradiates the raw material rod 16 and the crystal rod 18 with laser light, thereby melting the raw material rod 16 and the crystal rod 18 and generating a molten zone 19. According to the single crystal growth apparatus 200 of this example, the partial pressure of O ₂ (oxygen) in the space 21 can be reduced to an extremely low pressure (for example, less than 1×10 ^-30 atm) through the gas introduction process, so that the molten zone 19 is not oxidized. Hateful.

As explained above, in the single crystal growth apparatus 200 of this example, since the space 21 is sealed by the sealing part 20, the space 21 is baked to reduce the O ₂ (oxygen) partial pressure in the space 21 to an extremely low pressure. In addition, the pressure of the gas (for example, high-purity Ar (argon) gas) introduced into the space 21 can be made high. Therefore, according to the single crystal growth apparatus 200 of this example, a single crystal can be grown in an environment of extremely low oxygen concentration and high pressure gas concentration. Therefore, according to the single crystal growth apparatus 200 of this example, a highly pure single crystal can be grown.

A single crystal growth device in which a shaft rod is moved by a bellows is known. The bellows refers to an expandable member having a bellows structure. In the single crystal growth apparatus, the shaft rod is moved by this expansion and contraction function. However, the airtightness of the bellows tends to be lower than that of the gasket connection. Therefore, in the case of a single crystal growth apparatus using a bellows, it is difficult to reduce the O ₂ (oxygen) partial pressure to an extremely low pressure (for example, less than 1×10 ⁻³⁰ atm) even after baking. In other words, in the case of a single crystal growth apparatus using bellows, O ₂ (oxygen) tends to remain in the space where the single crystal is grown. Therefore, even if high-purity Ar (argon) gas is introduced after the baking process, the Ar (argon) gas is likely to be contaminated due to the presence of residual O ₂ (oxygen). Therefore, it is difficult for the single crystal growth apparatus using bellows to grow a high-purity single crystal compared to the single crystal growth apparatus 200 of this example.

Furthermore, a single crystal growth apparatus is known in which a rotating shaft rod is sealed with a magnetic seal. A magnetic seal is a sealing device that seals between a rotating body and the outside of the rotating body using a magnetic fluid. However, the magnetism of a magnetic seal tends to weaken as the temperature increases, so the airtightness of the space sealed by the magnetic seal tends to deteriorate in a high temperature environment (for example, 200° C. or higher). For this reason, in the case of a single crystal growth apparatus using a magnetic seal, it is difficult to bake the space sealed by the magnetic seal. Therefore, O ₂ (oxygen) tends to remain in the space where the single crystal is grown. Therefore, even if high-purity Ar (argon) gas is introduced after the baking process, the Ar (argon) gas is likely to be contaminated due to the presence of residual O ₂ (oxygen). For this reason, it is difficult for a single crystal growth apparatus using a magnetic seal to grow a high-purity single crystal compared to the single crystal growth apparatus 200 of this example.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the range described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the embodiments described above. It is clear from the claims that such modifications or improvements may be included within the technical scope of the present invention.

The order of execution of each process, such as the operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, specification, and drawings, is specifically defined as "before" or "before". It should be noted that they can be implemented in any order unless the output of the previous process is used in the subsequent process. Even if the claims, specifications, and operational flows in the drawings are explained using "first,""next," etc. for convenience, this does not mean that it is essential to carry out the operations in this order. It's not a thing.
[Item 1]
a shaft rod that holds the object;
a sealing part that seals a space in which the shaft rod moves;
a drive unit that is provided outside the sealed portion and drives the shaft rod in a non-contact manner;
Equipped with
The sealed part has a first metal part made of a non-magnetic metal,
the first metal part surrounds the space in a part of the space;
Laser processing equipment.
[Item 2]
The laser processing device according to item 1, wherein the drive section is disposed on the first metal section.
[Item 3]
The drive unit includes a first magnet,
the shaft rod has a second magnet;
The drive unit drives the shaft rod in a non-contact manner by the attraction force between the first magnet and the second magnet.
The laser processing device according to item 1 or 2.
[Item 4]
The drive unit includes a plurality of the first magnets,
The shaft rod has the same number of second magnets as the first magnets,
The plurality of first magnets are arranged at equal angles when viewed from the length direction of the shaft rod,
The plurality of second magnets are arranged at equal angles when viewed from the length direction of the shaft rod,
The laser processing device according to item 3.
[Item 5]
The first magnets are arranged at a plurality of positions in the length direction of the shaft rod,
The second magnet is arranged at each of the plurality of positions in the longitudinal direction of the shaft rod,
The laser processing device according to item 3 or 4.
[Item 6]
The drive unit is movable in the length direction of the shaft rod,
The shaft rod is movable in the longitudinal direction as the drive section moves in the longitudinal direction.
The laser processing device according to any one of items 3 to 5.
[Item 7]
The drive unit is rotatable about a central axis in a direction parallel to the length direction of the shaft rod,
The shaft rod is rotatable about a central axis parallel to the longitudinal direction of the shaft rod as the drive unit rotates.
The laser processing device according to any one of items 3 to 6.
[Item 8]
8. The laser processing device according to any one of items 1 to 7, wherein the shaft rod is provided with a metal object adjacent to the object that absorbs and stores at least one of oxygen or water.
[Item 9]
The laser processing apparatus according to item 8, wherein the metal object is an alloy containing at least one of titanium, vanadium, iron, zirconium, niobium, molybdenum, and tantalum, or a plurality of metals selected from these.
[Item 10]
The laser processing apparatus according to any one of items 1 to 9, further comprising a laser irradiation unit that irradiates the object with laser light.
[Item 11]
11. The laser processing device according to item 10, wherein the sealed portion further includes a transmitting portion made of a material that transmits the laser beam.
[Item 12]
The sealed portion is
a second metal part provided at an end of the transparent part in the length direction of the shaft rod and formed of a non-magnetic metal;
a holding part that is provided at an end of the first metal part in the longitudinal direction of the shaft rod, is made of a non-magnetic metal, and holds the shaft rod;
It further has
the second metal part and the holding part are connected with a gasket interposed therebetween;
The laser processing device according to item 11.
[Item 13]
13. The laser processing device according to item 12, wherein the sealing part further includes an O-ring provided between a side part of the transparent part and the second metal part in the longitudinal direction of the shaft rod.
[Item 14]
The holding part is provided with a through hole through which the shaft rod passes,
The holding portion includes a ball bearing provided between an inner wall of the through hole and a surface of the shaft rod in a radial direction of the shaft rod.
The laser processing device according to item 12 or 13.
[Item 15]
The holding section includes a plurality of the ball bearings,
The plurality of ball bearings are arranged at equal angles when viewed from the length direction of the shaft rod,
The laser processing device according to item 14.
[Item 16]
16. The laser processing apparatus according to item 14 or 15, wherein the ball bearings are respectively arranged at a plurality of positions in the longitudinal direction of the shaft rod.
[Item 17]
The space includes a gap provided between the inner wall of the through hole and the shaft rod,
The void has pressure resistance against an atmospheric pressure of 2 atmospheres or more,
The laser processing device according to any one of items 14 to 16.
[Item 18]
The laser processing device according to any one of items 12 to 17, wherein the holding part, the shaft rod, and the drive part have heat resistance to temperatures of 100° C. or higher.
[Item 19]
comprising two of the shaft rods,
comprising two of the driving parts,
The sealing part has two of the first metal parts, two of the second metal parts, and two of the holding parts,
One of the drive parts drives one of the shaft rods, the other drive part drives the other shaft rod,
One of the first metal parts surrounds the space in which one of the shaft rods moves, and the other first metal part surrounds the space in which the other shaft rod moves,
One of the holding parts holds one of the shaft rods, the other holding part holds the other shaft rod,
One of the second metal parts is provided at one of the ends of the transmission part, and the other second metal part is provided at the other end of the transmission part,
One of the holding parts is provided at one of the ends of the first metal part, and the other holding part is provided at the other end of the first metal part,
One of the second metal parts and one of the holding parts are connected with a gasket in between, and the other second metal part and the other of the holding parts are connected with a gasket in between.
The laser processing device according to any one of items 12 to 18.
[Item 20]
When one of the driving parts rotates in one direction when viewed from one of the first metal parts to the transmission part, the other of the driving parts rotates from the transmission part to the other of the second metal parts. Look in one direction and rotate in the other direction,
The laser processing device according to item 19.

DESCRIPTION OF SYMBOLS 10... Shaft rod, 12... Object, 13... Metal object, 14... Second magnet, 15... Rod, 16... Raw material rod, 18... Crystal rod, 19 ... Melting zone, 20... Sealing part, 21... Space, 22... First metal part, 23... Transmitting part, 24... Second metal part, 25... Holding part , 26... Lower surface, 27... Upper surface, 28... Inner wall, 29... O ring, 30... Drive unit, 32... First magnet, 36... Inner wall, 40... - Laser irradiation part, 50... Opening, 52... Side part, 54... Valve, 56... Valve, 58... Valve, 60... Ball bearing, 62... Through hole, 64...Gap, 66...Gap, 70...Gasket, 72...Pipe, 74...Pipe, 76...Pipe, 80...Control unit, 82...Guide, 84 ...Fixed part, 85... Connection part, 86... Pedestal, 88... Moving part, 90... Fixed plate, 96... Vacuum pump, 98... Gas supply source, 99... ...Gas outlet, 100...Laser processing device, 200...Single crystal growth device

Claims (18)

two shaft rods that hold objects;
a sealing part that seals a space in which the shaft rod moves;
two driving parts that are provided outside the sealed part and drive the shaft rod in a non-contact manner;
Equipped with
The sealed portion includes two first metal portions made of non-magnetic metal, a transparent portion made of a material that transmits the laser light irradiated onto the object, and a first metal portion made of a material that transmits the laser light irradiated onto the object, and and two second metal parts provided at the ends of the transparent part and made of non-magnetic metal ,
The first metal part surrounds the space in a part of the space,
One of the driving parts drives one of the shaft rods, the other driving part drives the other shaft rod,
One of the first metal parts surrounds the space in which one of the shaft rods moves, and the other first metal part surrounds the space in which the other shaft rod moves,
One of the second metal parts is provided at one of the ends of the transmission part, and the other second metal part is provided at the other end of the transmission part,
When one of the driving parts rotates in one direction when viewed from one of the first metal parts to the transmission part, the other of the driving parts rotates from the transmission part to the other of the second metal parts. Look in one direction and rotate in the other direction,
Laser processing equipment. The sealing part is provided at an end of the first metal part in the longitudinal direction of the shaft rod, is made of a non-magnetic metal, and further includes two holding parts that hold the shaft rod,
One of the holding parts holds one of the shaft rods, the other holding part holds the other shaft rod,
One of the holding parts is provided at one of the ends of the first metal part, and the other holding part is provided at the other end of the first metal part.
Laser processing device according to claim 1. According to claim 2, one of the second metal parts and one of the holding parts are connected with a gasket in between, and the other of the second metal parts and the other of the holding parts are connected with a gasket in between. laser processing equipment . The holding part is provided with a through hole through which the shaft rod passes,
The holding portion includes a ball bearing provided between an inner wall of the through hole and a surface of the shaft rod in a radial direction of the shaft rod.
A laser processing apparatus according to claim 2 or 3 . The holding section includes a plurality of the ball bearings,
The plurality of ball bearings are arranged at equal angles when viewed from the length direction of the shaft rod,
The laser processing device according to claim 4 . 6. The laser processing apparatus according to claim 4 , wherein the ball bearings are arranged at a plurality of positions in the longitudinal direction of the shaft rod. The space includes a gap provided between the inner wall of the through hole and the shaft rod,
The void has pressure resistance against an atmospheric pressure of 2 atmospheres or more,
A laser processing device according to any one of claims 4 to 6 . The laser processing device according to any one of claims 2 to 7 , wherein the holding part, the shaft rod, and the drive part have heat resistance to a temperature of 100° C. or higher. The laser processing apparatus according to any one of claims 1 to 8 , wherein the drive section is arranged at the first metal section. The drive unit includes a first magnet,
the shaft rod has a second magnet;
The drive unit drives the shaft rod in a non-contact manner by the attraction force between the first magnet and the second magnet.
A laser processing device according to any one of claims 1 to 9 . The drive unit includes a plurality of the first magnets,
The shaft rod has the same number of second magnets as the first magnets,
The plurality of first magnets are arranged at equal angles when viewed from the length direction of the shaft rod,
The plurality of second magnets are arranged at equal angles when viewed from the length direction of the shaft rod,
The laser processing device according to claim 10 . The first magnets are arranged at a plurality of positions in the length direction of the shaft rod,
The second magnet is arranged at each of the plurality of positions in the longitudinal direction of the shaft rod,
The laser processing device according to claim 10 or 11 . The drive unit is movable in the length direction of the shaft rod,
The shaft rod is movable in the longitudinal direction as the drive section moves in the longitudinal direction.
The laser processing device according to any one of claims 10 to 12 . The drive unit is rotatable about a central axis in a direction parallel to the length direction of the shaft rod,
The shaft rod is rotatable about a central axis parallel to the longitudinal direction of the shaft rod as the drive unit rotates.
A laser processing device according to any one of claims 10 to 13 . 15. The laser processing apparatus according to claim 1, wherein the shaft rod is provided with a metal object adjacent to the object that absorbs and stores at least one of oxygen and water. The laser processing apparatus according to claim 15 , wherein the metal object is an alloy containing at least one of titanium, vanadium, iron, zirconium, niobium, molybdenum, and tantalum, or a plurality of metals selected from these. The laser processing apparatus according to any one of claims 1 to 16 , further comprising a laser irradiation unit that irradiates the target object with the laser light. 18. The sealing part further includes an O-ring provided between a side part of the transparent part and the second metal part in the longitudinal direction of the shaft rod. The laser processing device described.

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