JP7311326B2 - Film-like baking material with support sheet, roll body, laminate, and manufacturing method of device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a film-like sintering material with a support sheet, a roll body, a laminate, and a method for manufacturing an apparatus.

BACKGROUND ART In recent years, as automobiles, air conditioners, personal computers, and the like have become increasingly high-voltage and high-current, the demand for power semiconductor elements (power devices) to be mounted on these devices is increasing. Power semiconductor devices are characterized by being used under high voltage and high current conditions, so heat generation from the semiconductor devices tends to pose a problem.
Conventionally, in some cases, a heat sink is attached around the semiconductor element to dissipate heat generated from the semiconductor element. However, if the junction between the heat sink and the semiconductor element does not have good thermal conductivity, efficient heat dissipation is hindered.

As a bonding material with excellent thermal conductivity, for example, Patent Document 1 discloses paste-like fine metal particles obtained by mixing specific heat-sinterable metal particles, a specific polymer dispersant, and a specific volatile dispersion medium. A composition is disclosed. Sintering the composition is said to result in a solid metal with excellent thermal conductivity.

However, when the firing material is a paste as in Patent Document 1, it is difficult to make the thickness of the applied paste uniform, and the thickness tends to be poor in stability.

In order to solve the problem of thickness stability, the inventors of the present invention came up with the idea of providing a film-like firing material, which has conventionally been provided as a paste-like composition. In order to form the sintered material in the form of a film, a binder component may be added to the sintered material to form a film.

Such a film-like sintering material can be used, for example, for sintering and bonding chips obtained by dicing a semiconductor wafer into individual pieces and a substrate. Also, if a support sheet is provided on one side (surface) of the film-like baking material, it can be used as a dicing sheet for singulating a semiconductor wafer into chips. Furthermore, by singulating together with the semiconductor wafer using a blade or the like, it can be processed as a film-like sintered material having the same shape as the chip.

Before sintering, the discrete chip with film-like sintering material is separated from the supporting sheet by pushing up the chip from the back surface of the film-like sintering material with support sheet with a push-up pin.

Japanese Unexamined Patent Application Publication No. 2014-111800

On the other hand, in recent years, the thickness of semiconductor chips has been reduced, and it has become necessary to reduce the thickness of wafers, which used to be about 350 μm, to 50 to 100 μm or less. However, as the semiconductor wafer becomes thinner, when picking up individualized diced chips with a film-shaped firing material before firing, if a push-up pin is applied to the film-shaped firing material with a support sheet before sintering to pick it up. There is a risk of deformation such as chip breakage or pin traces.

An object of the present invention is to solve the above problems. It is an object of the present invention to provide a method of manufacturing bodies, laminates, and devices.

The present invention has the following aspects.
[1] A second support sheet having a heat-shrinkable base film on one side of a non-heat-shrinkable base film and a heat-shrinkable base film on the first pressure-sensitive adhesive layer side of the first support sheet having the first pressure-sensitive adhesive layer A film-like sintering material with a supporting sheet, in which a supporting sheet and a film-like sintering material are laminated in this order.
[2] Described in [1], wherein the second support sheet includes a second pressure-sensitive adhesive layer, and the film-like baking material is laminated on the second pressure-sensitive adhesive layer side of the second support sheet. A film-like baking material with a support sheet.
[3] The film-like baking material with a support sheet according to [2], wherein the second pressure-sensitive adhesive layer is energy ray-curable.
[4] The second adhesive layer contains an adhesive resin, and the adhesive resin has an energy ray-polymerizable unsaturated group in its side chain. material.
[5] The film-like baking material with a support sheet according to any one of [1] to [4], wherein the first pressure-sensitive adhesive layer is non-energy ray-curable.
[6] The diameter of the first support sheet is the same as or larger than the diameter of the second support sheet, and the diameter of the second support sheet is the same as that of the film. The film-shaped sintered material with a support sheet according to any one of [1] to [5], which has the same diameter as the sintered material or a diameter larger than that of the film-shaped sintered material.
[7] The support sheet according to any one of [1] to [6], wherein the heat-shrinkable base film is made of at least one selected from the group consisting of oriented polyethylene, oriented polypropylene, and oriented polyethylene terephthalate. A film-like baking material.
[8] The film-shaped firing material with a support sheet according to any one of [1] to [7] is laminated on a long release film with the film-shaped firing material facing inside,
A roll body in which the release film and the film-like baking material with the support sheet are rolled.
[9] The film-shaped baking material with a support sheet according to any one of [1] to [7] is attached to a wafer, and the first support sheet, the second support sheet, and the film-shaped baking material are attached. A laminate in which a sintering material and the wafer are laminated in this order.
[10] The laminate according to [9], wherein the diameter of the film-like sintered material is the same as or larger than the diameter of the wafer.
[11] A method of manufacturing an apparatus in which the following steps (1) to (5) are sequentially performed:
Step (1): A step of dicing the wafer and the film-like sintered material of the laminate according to [9] or [10];
Step (2): a step of heating the diced film-shaped baking material to shrink the second support sheet;
Step (3): A step of peeling the diced film-shaped sintered material and the second support sheet to obtain a chip with a film-shaped sintered material;
Step (4): A step of attaching the film-like firing material of the film-like firing material-attached chip to the surface of a substrate;
Step (5): a step of baking the film-like sintering material of the chip with the film-like sintering material, and bonding the chip and the substrate.

According to the present invention, it is possible to provide a film-like sintering material with a support sheet that can stably pick up diced chips with a film-like sintering material without damaging them.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view schematically showing a film-like sintered material with a support sheet according to one embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a state in which the film-like baking material with a support sheet is attached to a ring frame according to one embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a state in which the film-like baking material with a support sheet is attached to a ring frame according to one embodiment of the present invention. 1 is a perspective view schematically showing a state in which a support sheet-attached film-like baking material is attached to a ring frame according to one embodiment of the present invention. FIG. 1 is a cross-sectional view schematically showing a roll body according to one embodiment of the present invention; FIG. It is a sectional view showing typically a layered product concerning one embodiment of the present invention. 1A to 1D are cross-sectional views schematically showing a method of manufacturing a device according to an embodiment of the present invention; 1A to 1D are cross-sectional views schematically showing a method of manufacturing a device according to an embodiment of the present invention;

An embodiment of the present invention will be described below with reference to the drawings as appropriate.
In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there are cases where the main parts are enlarged for convenience, and the dimensional ratios of each component are the same as the actual ones. not necessarily.

≪Film type baking material with support sheet≫
The film-like baking material with a support sheet of the present embodiment is a first support sheet having a first pressure-sensitive adhesive layer on one side of a non-heat-shrinkable base film, and on the first pressure-sensitive adhesive layer side of the first support sheet, The second supporting sheet having a heat-shrinkable base film and the film-like baking material are laminated in this order to form a film-like baking material with a supporting sheet.

FIG. 1 is a cross-sectional view schematically showing a film-like sintered material with a support sheet according to this embodiment.
The film-like baking material 100 with a support sheet is a first support sheet 6 having a first pressure-sensitive adhesive layer 4 on one side of a non-heat-shrinkable base film 3. On the side of the first pressure-sensitive adhesive layer 4, A second support sheet 2 having a heat-shrinkable base film and a film-like sintered material 1 containing sinterable metal particles 10 and a binder component 20 are laminated in this order. It is preferable that the second support sheet 2 has a second pressure-sensitive adhesive layer, and the film-like baking material is laminated on the second pressure-sensitive adhesive layer side of the second support sheet. The film-like baking material may be provided in direct contact with the second pressure-sensitive adhesive layer, or may be provided in direct contact with the heat-shrinkable base film. The film-like baking material with a support sheet of the present embodiment can be used as a dicing sheet for singulating a semiconductor wafer into chips. In addition, by singulating together with the semiconductor wafer using a blade or the like, it can be processed as a film-like sintering material having the same shape as the chip, and a chip with a film-like sintering material can be manufactured.

An embodiment of the support sheet-attached film-like baking material will be described below. 2 and 3 show schematic cross-sectional views of the support sheet-attached film-like sintered material of this embodiment. As shown in FIGS. 2 and 3, the supporting sheet-attached film-like baking materials 100a and 100b of the present embodiment have a film-like baking material 1 on the inner circumference of a second supporting sheet 2 having an adhesive portion on the outer circumference. is detachably attached temporarily. The second support sheet 2 is, as shown in FIG. The surface of the part is covered with the film-like baking material 1, and the adhesive part is exposed on the outer peripheral part. In this configuration example, the film-like baking material 1 having a diameter smaller than that of the second support sheet 2 is concentrically and releasably laminated on the second adhesive layer 8 of the second support sheet 2. preferable. Moreover, as shown in FIG. 3, the second support sheet 2 may have a configuration in which a ring-shaped second pressure-sensitive adhesive layer 8 is provided on the outer peripheral portion of the heat-shrinkable base film 7 . In the configuration example shown in FIG. 3, a ring-shaped second pressure-sensitive adhesive layer 8 is formed on the outer peripheral portion of the heat-shrinkable base film 7 to serve as the pressure-sensitive adhesive portion.

The film-like sintering material 1 is preferably formed on the inner peripheral portion of the second support sheet 2 in substantially the same shape as the workpiece (wafer or the like) to be attached.

Examples of wafers or chips include semiconductor wafers or semiconductor chips, insulator wafers or insulator chips, conductor wafers or conductor chips, and the like. Examples of insulator wafers include, but are not limited to, glass wafers and sapphire wafers. In the embodiment, a case where a semiconductor wafer or semiconductor chip is used as the wafer or chip will be described.

The outer peripheral portion of the second support sheet 2 has an adhesive portion. In a preferred embodiment, the film-like sintered material 1 having a diameter smaller than that of the second support sheet 2 is concentrically laminated on the circular second support sheet 2 . The adhesive portion on the outer periphery is used for fixing the ring frame 5 as shown.
The support sheet-attached film-like baking material 100 a having the above structure is attached to the ring frame 5 at the second adhesive layer 8 exposed on the outer peripheral portion of the second support sheet 2 .

Further, an annular double-sided tape or an adhesive layer may be separately provided on the adhesive margin for the ring frame (the second adhesive layer exposed on the outer periphery of the adhesive sheet). The double-sided tape has a configuration of adhesive layer/core material/adhesive layer, and the adhesive layer in the double-sided tape is not particularly limited. For example, adhesives such as rubber, acrylic, silicone, and polyvinyl ether are used. . The pressure-sensitive adhesive layer is attached to the ring frame at its outer peripheral portion when manufacturing a chip-equipped substrate, which will be described later. As the core material of the double-sided tape, for example, polyester film, polypropylene film, polycarbonate film, polyimide film, fluororesin film, liquid crystal polymer film and the like are preferably used.

FIG. 4 shows a perspective view of the supporting sheet-attached film-like baking material 100b shown in FIG. At this time, the second adhesive layer 8 may be a single-layer adhesive layer made of the above-mentioned adhesive, or may be obtained by cutting a double-sided adhesive tape including an adhesive layer made of the above-mentioned adhesive into an annular shape. good too. The film-like baking material 1 is releasably laminated on the inner peripheral portion of the heat-shrinkable base film 7 surrounded by the adhesive portion. In this configuration example, the film-like baking material 1 having a diameter smaller than that of the second support sheet 2 is concentrically and detachably laminated on the heat-shrinkable base film 7 of the second support sheet 2 . preferable.

In the film-shaped baking material with a support sheet of the present embodiment, the surface of one or both of the film-shaped baking material and the adhesive part is provided with surface protection to avoid contact with the outside until it is used. A release film may be provided for the purpose.

The surface protective film (release film) is obtained by subjecting the surface of the substrate film such as polyethylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polypropylene to the release treatment described above using a release agent. can also Examples of the release agent used in the release treatment include the release agents exemplified above in the description of the base film.

The thickness of the film-like sintered material with a support sheet is preferably 1 to 500 μm, more preferably 5 to 300 μm, even more preferably 10 to 200 μm.

(Film-like baking material)
The film-like sintered material 1 contains sinterable metal particles 10 and a binder component 20, as shown in FIG.

The film-like sintered material may consist of one layer (single layer), or may consist of two or more layers. When the film-like baking material consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.
In this specification, not only in the case of a film-shaped firing material, "a plurality of layers may be the same or different" means "all the layers may be the same, or all the layers may be the same. may be different, and only some of the layers may be the same", and further, "multiple layers are different from each other" means "the constituent materials of each layer, the compounding ratio of the constituent materials, and the thickness at least one of which is different from each other”.

The thickness of the film-shaped sintered material before sintering is not particularly limited, but is preferably 10 to 200 μm, more preferably 20 to 150 μm, and even more preferably 30 to 90 μm. Here, the "thickness of the film-shaped sintered material" means the thickness of the entire film-shaped sintered material. means the total thickness of the layers of

As used herein, the term “thickness” can be obtained by using a constant pressure thickness gauge according to JIS K7130 as a value represented by the average of thickness measured at five arbitrary points.

(Release film)
The film-like sintered material can be provided with a release film laminated thereon. When using, the release film may be peeled off and the film-like sintered material may be placed on an object to be sinter-bonded. The release film also has a function as a protective film for preventing the film-shaped baked material from being damaged or soiled. The release film may be provided on at least one side of the film-shaped baked material.

Examples of release films include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, and polyurethane. Film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine resin A transparent film such as a film is used. Crosslinked films of these are also used. Furthermore, a laminated film of these may be used. In addition, a colored film, an opaque film, or the like can be used. Examples of release agents include silicone-based, fluorine-based, olefin-based, alkyd-based, and long-chain alkyl group-containing carbamate release agents.

The thickness of the release film is usually about 10-500 μm, preferably about 15-300 μm, particularly preferably about 20-250 μm.

<Sinterable metal particles>
The sinterable metal particles are metal particles that can be melted and bonded together to form a sintered body by being heat-treated at a temperature equal to or higher than the melting point of the metal particles as the firing of the film-like firing material. By forming a sintered body, it is possible to sinter-bond the film-like sintered material and the sintered article in contact therewith. Specifically, it is possible to sinter-bond the chip and the substrate via the film-like sintering material.

Metal species of the sinterable metal particles include silver, gold, copper, iron, nickel, aluminum, silicon, palladium, platinum, titanium, barium titanate, oxides or alloys thereof, and the like. is preferred. Only one type of sinterable metal particles may be blended, or a combination of two or more types may be blended.

The sinterable metal particles are preferably silver nanoparticles, which are nano-sized silver particles.

The particle size of the sinterable metal particles contained in the film-like sintered material is not particularly limited as long as it can exhibit the above sinterability. Well, it may be 30 nm or less. In addition, the particle diameter of the metal particles contained in the film-shaped sintered material is defined as the projected area circle equivalent diameter of the particle diameter of the metal particles observed with an electron microscope. Metal particles belonging to the above particle size range are preferable because they are excellent in sinterability.
The particle diameter of the sinterable metal particles contained in the film-shaped fired material is the number average of the particle diameters of the metal particles observed with an electron microscope, which are obtained for particles having a projected area circle equivalent diameter of 100 nm or less. , 0.1-95 nm, 0.3-50 nm, or 0.5-30 nm. In addition, 100 or more metal particles to be measured are randomly selected for one film-shaped baked material.

Prior to mixing the sinterable metal particles with the binder component and other additive components, the sinterable metal particles are pre-dispersed in a solvent with a high boiling point such as isobornylcyclohexanol or decyl alcohol in order to eliminate agglomerates. You may let The boiling point of the high boiling point solvent may be, for example, 200 to 350°C. At this time, if a high-boiling solvent is used, it hardly volatilizes at room temperature, so that the concentration of the sinterable metal particles is prevented from increasing, and workability is improved. Reaggregation is also prevented, and the quality is improved. Dispersion methods include kneaders, three rolls, bead mills and ultrasonic waves.

In addition to metal particles (sinterable metal particles) having a particle size of 100 nm or less, non-sinterable metal particles having a particle size of more than 100 nm may be added to the film-like sintered material. The particle size of non-sintered metal particles with a particle size exceeding 100 nm is the particle size of the metal particles observed with an electron microscope, the number of particle sizes obtained for particles with a projected area circle equivalent diameter exceeding 100 nm. The average may be greater than 150 nm and no greater than 50000 nm, may be between 150 and 10000 nm, and may be between 180 and 5000 nm.

Examples of the metal species of the non-sinterable metal particles having a particle diameter exceeding 100 nm include the same metal species as the metal species of the sinterable metal particles, and silver, copper, and oxides thereof are preferred. .
The metal particles with a particle size of 100 nm or less and the non-sinterable metal particles with a particle size of more than 100 nm may be of the same metal species or different metal species. For example, the metal particles with a particle size of 100 nm or less may be silver particles, and the non-sinterable metal particles with a particle size of more than 100 nm may be silver or silver oxide particles. For example, the metal particles with a particle size of 100 nm or less may be silver or silver oxide particles, and the non-sinterable metal particles with a particle size of more than 100 nm may be copper or copper oxide particles.

In the film-shaped sintered material, the content of the sinterable metal particles may be 10 to 100% by mass or 20 to 95% by mass with respect to the total mass (100% by mass) of all metal particles. good.

The surfaces of the sinterable metal particles and/or the non-sinterable metal particles may be coated with an organic substance. Having an organic coating improves the compatibility with the binder component, prevents the particles from aggregating with each other, and enables the particles to be uniformly dispersed.
When the surface of the sinterable metal particles and/or non-sinterable metal particles is coated with an organic substance, the mass of the sinterable metal particles and non-sinterable metal particles includes the coating. do.

<Binder component>
By blending the binder component, the fired material can be formed into a film, and adhesiveness can be imparted to the film-shaped fired material before firing. The binder component may be thermally decomposable so as to be thermally decomposed by being heat-treated as the firing of the film-shaped firing material.
The binder component is not particularly limited, but a suitable example of the binder component is a resin. Examples of resins include acrylic resins, polycarbonate resins, polylactic acid, polymers of cellulose derivatives, and the like, and acrylic resins are preferred. Acrylic resins include homopolymers of (meth)acrylate compounds, copolymers of two or more (meth)acrylate compounds, and copolymers of (meth)acrylate compounds and other copolymerizable monomers. included.

As used herein, the term "derivative" means a compound obtained by substituting one or more hydrogen atoms of the original compound with a group (substituent) other than a hydrogen atom.

In the resin constituting the binder component, the content of the structural unit derived from the (meth)acrylate compound is preferably 50 to 100% by mass, preferably 80 to 100%, based on the total mass (100% by mass) of the structural units. % by mass is more preferred, and 90 to 100% by mass is even more preferred.
The term "derived" as used herein means that the monomer has undergone a structural change necessary for polymerization.

Specific examples of (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate ) alkyl (meth)acrylates such as acrylates, isostearyl (meth)acrylates;
Hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate hydroxyalkyl (meth)acrylates such as acrylates;
phenoxyalkyl (meth)acrylates such as phenoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate;
Alkoxyalkyl (meth)acrylate such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-propoxyethyl (meth)acrylate, 2-butoxyethyl (meth)acrylate, 2-methoxybutyl (meth)acrylate, etc. ) acrylates;
Polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene polyalkylene glycol (meth)acrylates such as glycol (meth)acrylates, ethoxypolypropylene glycol (meth)acrylates, nonylphenoxypolypropylene glycol (meth)acrylates;
cyclohexyl (meth)acrylate, 4-butylcyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, bornyl (meth)acrylate, isobornyl ( Cycloalkyl (meth)acrylates such as meth)acrylates and tricyclodecanyl (meth)acrylates;
Benzyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and the like can be mentioned. Alkyl (meth)acrylates or alkoxyalkyl (meth)acrylates are preferred, and particularly preferred (meth)acrylate compounds include butyl (meth)acrylate, ethylhexyl (meth)acrylate, lauryl (meth)acrylate, isodecyl (meth)acrylate, 2- Ethylhexyl (meth)acrylate and 2-ethoxyethyl (meth)acrylate may be mentioned.

As used herein, "(meth)acrylate" is a concept that includes both "acrylate" and "methacrylate".
Methacrylate is preferred as the acrylic resin. Since the binder component contains a methacrylate-derived structural unit, it can be fired at a relatively low temperature, and the conditions for obtaining sufficient adhesive strength after sintering can be easily satisfied.

In the resin constituting the binder component, the content of the methacrylate-derived structural unit is preferably 50 to 100% by mass, more preferably 80 to 100% by mass, relative to the total mass (100% by mass) of the structural units. is more preferable, and 90 to 100% by mass is even more preferable.

The other copolymerizable monomer is not particularly limited as long as it is a compound copolymerizable with the (meth)acrylate compound. Examples include (meth)acrylic acid, vinyl benzoic acid, maleic acid, and vinyl phthalic acid. Unsaturated carboxylic acids; vinyl group-containing radically polymerizable compounds such as vinylbenzyl methyl ether, vinyl glycidyl ether, styrene, α-methylstyrene, butadiene and isoprene.

The weight average molecular weight (Mw) of the resin constituting the binder component is preferably 1,000 to 1,000,000, more preferably 10,000 to 800,000. When the mass-average molecular weight of the resin is within the above range, it becomes easy to develop sufficient film strength as a film and impart flexibility.
In this specification, unless otherwise specified, the term "mass average molecular weight" is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method.

The glass transition temperature (Tg) of the resin constituting the binder component can be obtained by calculation using the Fox formula shown below, and is preferably −60 to 50° C., and −30 to 10° C. more preferably -20°C or more and less than 0°C. When the Tg of the resin obtained from Fox's formula is equal to or less than the above upper limit, the adhesive strength between the film-like sintered material and the adherend (eg, chip, substrate, etc.) before sintering is improved. In addition, the flexibility of the film-shaped baked material is enhanced. On the other hand, when the Tg of the resin obtained from the Fox's formula is equal to or higher than the above lower limit, the film shape can be maintained, and the film-like fired material can be easily separated from the support sheet or the like.
1/Tg=(W1/Tg1)+(W2/Tg2)+...+(Wm/Tgm) (wherein Tg is the glass transition temperature of the resin constituting the binder component, and Tg1, Tg2,... Tgm are the binder It is the glass transition temperature of the homopolymer of each monomer that is the raw material of the resin constituting the component, and W1, W2, ... Wm is the mass fraction of each monomer, where W1 + W2 + ... + Wm = 1 .)
For the glass transition temperature of the homopolymer of each monomer in the Fox formula, values described in the Polymer Data Handbook or Adhesive Handbook can be used.

The binder component may be thermally decomposable so as to be thermally decomposed by being heat-treated as the firing of the film-shaped firing material. Thermal decomposition of the binder component can be confirmed by the mass reduction of the binder component due to firing. In addition, most of the components blended as the binder component may be thermally decomposed by firing, but the total mass of the components blended as the binder component may not be thermally decomposed by firing.
The binder component may have a mass of 10% by mass or less after firing, or 5% by mass or less, relative to the total mass of the binder component before firing (100% by mass). % by mass or less.

In addition to the above-mentioned sinterable metal particles, non-sinterable metal particles and binder components, the film-shaped firing material contains sinterable metal particles and non-sinterable metal particles within a range that does not impair the effects of the present invention. It may contain metal particles and other additives not applicable to the binder component.

Other additives that may be contained in the film-shaped baked material include solvents, dispersants, plasticizers, tackifiers, storage stabilizers, antifoaming agents, thermal decomposition accelerators, and antioxidants. . Only one kind of additive may be contained, or two or more kinds thereof may be contained. These additives are not particularly limited, and those commonly used in this field can be appropriately selected.

Since the binder component is preferably thermally decomposed by heat treatment as firing of the film-shaped firing material, the content of the thermosetting resin such as epoxy resin is 10% by mass or less with respect to 100% by mass of the binder component. is preferably , more preferably 5% by mass or less, and further preferably contains substantially no thermosetting resin.
From the same point of view, in the resin constituting the binder component, the content of the acrylate-derived structural units among "acrylate" and "methacrylate" is 10 with respect to the total mass (100% by mass) of the structural units. It is preferably not more than 5% by mass, more preferably not more than 5% by mass, and further preferably does not substantially contain acrylate-derived structural units.

<Composition>
The film-shaped sintered material may consist of sinterable metal particles, a binder component, and other additives, and the sum of these contents (% by mass) may be 100% by mass. When the film-shaped sintered material contains non-sinterable metal particles, the film-shaped sintered material consists of sinterable metal particles, non-sinterable metal particles, binder components, and other additives. The sum of these contents (% by mass) may be 100% by mass.

In the film-shaped sintered material, the content of the sinterable metal particles is preferably 15 to 98% by mass with respect to the total mass (100% by mass) of all components other than the solvent (hereinafter referred to as "solid content"). , more preferably 15 to 90% by mass, more preferably 20 to 80% by mass. When the content of the sinterable metal particles is equal to or less than the above upper limit, the content of the binder component can be sufficiently ensured, so that the film shape can be easily maintained. On the other hand, when the content of the sinterable metal particles is at least the above lower limit, the sinterable metal particles or the sinterable metal particles and the non-sinterable metal particles are fused during firing. It is also possible to obtain the effect of exhibiting high joint adhesive strength (shear adhesive strength) later.

When the film-shaped fired material contains non-sinterable metal particles, the total content of sinterable metal particles and non-sinterable metal particles with respect to the total mass (100% by mass) of the solid content in the film-shaped fired material is preferably 50 to 98% by mass, more preferably 70 to 95% by mass, even more preferably 80 to 95% by mass.

The content of the binder component is preferably 2 to 50% by mass, more preferably 5 to 30% by mass, and even more preferably 5 to 20% by mass with respect to the total mass (100% by mass) of the solid content in the film-shaped fired material. When the content of the binder component is equal to or less than the above upper limit, the content of the sinterable metal particles can be sufficiently ensured, so that the bonding strength between the film-like sintered material and the adherend is further improved. On the other hand, when the content of the binder component is at least the above lower limit, the film shape can be easily maintained.

In the film-shaped sintered material, the mass ratio of the sinterable metal particles and the binder component (sinterable metal particles:binder component) is preferably 50:1 to 1:5, more preferably 20:1 to 1:2. , 10:1 to 1:1 are more preferred. When the film-shaped firing material contains non-sinterable metal particles, the mass ratio of the sinterable metal particles and the non-sinterable metal particles to the binder component ((sinterable metal particles + non-sinterable (metal particles):binder component) is preferably 50:1 to 1:1, more preferably 20:1 to 2:1, even more preferably 9:1 to 4:1.

The film-like sintered material may contain a high boiling point solvent used when mixing sinterable metal particles, non-sinterable metal particles, binder components and other additive components. The content of the high-boiling solvent is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, relative to the total mass (100% by mass) of the film-shaped sintered material.

[Method for producing film-shaped sintered material]
A film-like sintered material can be formed using a sintered material composition containing its constituent materials. For example, a firing material composition containing each component and a solvent for forming the film firing material is coated or printed on the surface to be formed of the film firing material, and the solvent is volatilized as necessary to achieve the desired effect. A film-shaped sintered material can be formed on the site to be.
The target surface for forming the film-shaped baked material includes the surface of the release film.

When the firing material composition is applied, the solvent preferably has a boiling point of less than 200°C, such as n-hexane (boiling point: 68°C), ethyl acetate (boiling point: 77°C), 2-butanone (boiling point: 80°C, ° C.), n-heptane (boiling point: 98° C.), methylcyclohexane (boiling point: 101° C.), toluene (boiling point: 111° C.), acetylacetone (boiling point: 138° C.), n-xylene (boiling point: 139° C.) and dimethylformamide (boiling point: 153°C). These may be used alone or in combination.

Coating of the sintering material composition may be performed by a known method such as an air knife coater, blade coater, bar coater, gravure coater, comma coater (registered trademark), roll coater, roll knife coater, curtain coater, and die coater. , a knife coater, a screen coater, a Meyer bar coater, a kiss coater and the like.

When the sintering material composition is printed, any solvent can be used as long as it can be volatilized and dried after printing, and preferably has a boiling point of 65 to 350°C. Examples of such solvents include solvents having a boiling point of less than 200° C., isophorone (boiling point: 215° C.), butyl carbitol (boiling point: 230° C.), 1-decanol (boiling point: 233° C.), butyl carbitol, and Toll acetate (boiling point: 247°C), isobornylcyclohexanol (boiling point: 318°C), and the like.
If the boiling point exceeds 350°C, it becomes difficult to volatilize the solvent during evaporative drying after printing, making it difficult to secure the desired shape, or the solvent remains in the film during baking, resulting in poor bonding adhesion. may deteriorate. If the boiling point is lower than 65° C., it may volatilize during printing, resulting in loss of thickness stability. If a solvent having a boiling point of 200 to 350° C. is used, it is possible to suppress an increase in viscosity due to volatilization of the solvent during printing, and printability can be obtained.

Printing of the firing material composition can be performed by a known printing method. Examples include methods such as screen printing and printing using various printers such as inkjet printers.

The shape of the film-like sintered material may be appropriately set according to the shape of the object to be sinter-bonded, and is preferably circular or rectangular. A circle is a shape corresponding to the shape of a semiconductor wafer. The rectangle has a shape corresponding to the shape of the chip. The corresponding shape may be the same shape or substantially the same shape as the shape to be sinter-bonded.
When the film-like sintered material is circular, the area of the circle may be 3.5-1,600 cm ² , and may be 85-1,400 cm ² . When the film-like sintered material is rectangular, the area of the rectangle may be 0.01-25 cm ² , and may be 0.25-9 cm ² . In particular, by printing the sintering material composition, it is easy to form a film-like sintering material having a desired shape.

The drying conditions for the calcined material composition are not particularly limited, but when the calcined material composition contains a solvent, it is preferably dried by heating. It is preferable to dry under conditions of 10 seconds to 10 minutes.

(First support sheet)
<Non-heat-shrinkable base film>
In the film-like baking material with a support sheet of this embodiment, the first support sheet 6 has a non-heat-shrinkable base film 3 .
A non-heat-shrinkable base film is usually a film having a heat shrinkage of less than 10%. Here, the heat shrinkage rate is calculated based on the dimensions before and after heating the film to 110° C., and is calculated based on the following formula from the dimensions before heat shrinkage and after heat shrinkage.

The non-heat-shrinkable base film 3 is not particularly limited as long as it is a film having a heat shrinkage of less than 10%. For example, low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), ethylene/propylene Copolymer, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene/vinyl acetate copolymer, ethylene/(meth)acrylic acid copolymer, ethylene/methyl (meth)acrylate copolymer, ethylene/(meth)acrylate Films made of ethyl acrylate copolymer, polyvinyl chloride, vinyl chloride/vinyl acetate copolymer, polyurethane film, ionomer and the like are used. In addition, in this specification, "(meth)acryl" is used in a sense including both acryl and methacryl.
When higher heat resistance is required for the first support sheet 6, the non-heat-shrinkable base film 3 may be a polyester film such as polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate, polypropylene, poly Examples include polyolefin films such as methylpentene. In addition, these crosslinked films and films modified by radiation, discharge, or the like can also be used. The non-heat-shrinkable base film may be a laminate of the above films.

Two or more of these films can be laminated or used in combination. Further, colored or printed films of these films can also be used. In addition, the film may be a sheet formed by extruding a thermoplastic resin, or may be a stretched one. may be broken.

The thickness of the non-heat-shrinkable base film is not particularly limited, and is preferably 30-300 μm, more preferably 50-200 μm. By setting the thickness of the non-heat-shrinkable base film within the above range, the non-heat-shrinkable base film is less likely to tear even when notches are made by dicing. In addition, since sufficient flexibility is imparted to the film-like sintering material with the support sheet, it exhibits good adhesion to a work (for example, a semiconductor wafer, etc.).

The non-heat-shrinkable base film can also be obtained by applying a release agent to the surface and performing a release treatment. Alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based release agents are used as release agents for release treatment. It is preferable because it has

In order to release the surface of the non-heat-shrinkable base film using the above-mentioned release agent, the release agent can be used as it is without a solvent, diluted with a solvent, or emulsified, and then treated with a gravure coater, Meyer bar coater, or air knife coater. , Applying with a roll coater or the like, subjecting the non-heat-shrinkable base film coated with the release agent to room temperature or heating, or curing with an electron beam, wet lamination, dry lamination, hot melt lamination, A laminate may be formed by melt extrusion lamination, co-extrusion processing, or the like.

(First adhesive layer)
The first adhesive layer 4 is sheet-like or film-like, and can contain an adhesive. The first pressure-sensitive adhesive layer may be energy ray-curable or non-energy ray-curable, but is preferably non-energy ray-curable.

As used herein, the term "energy ray" means an electromagnetic wave or charged particle beam that has an energy quantum, and examples thereof include ultraviolet rays, radiation, electron beams, and the like.
Ultraviolet rays can be applied by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet light source. The electron beam can be generated by an electron beam accelerator or the like.
As used herein, "energy ray-curable" means the property of curing by irradiation with energy rays, and "non-energy ray-curable" means the property of not curing even when irradiated with energy rays. do.

The first support sheet 6 has the first adhesive layer 4 on the entire upper surface of the non-heat-shrinkable base film 3, as shown in FIG. In the support sheet having the configuration shown in FIG. If desired, the surface on which the is provided may be roughened by sandblasting or solvent treatment, or oxidized by corona discharge treatment, electron beam irradiation, plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, etc. Processing and the like can be applied. A primer treatment can also be applied.

Although the thickness of the first adhesive layer is not particularly limited, it is preferably 1 to 100 μm, more preferably 2 to 80 μm, particularly preferably 3 to 50 μm.

The first pressure-sensitive adhesive layer may consist of one layer (single layer), or may consist of two or more layers. When the first pressure-sensitive adhesive layer consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.

<Adhesive composition>
The first adhesive layer can be formed using an adhesive composition containing an adhesive. For example, the pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition to the surface to be formed of the first pressure-sensitive adhesive layer and drying it as necessary. A more specific method for forming the first pressure-sensitive adhesive layer will be described later in detail together with methods for forming other layers. The content ratio of the components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the content ratio of the components in the first pressure-sensitive adhesive layer.

Coating of the pressure-sensitive adhesive composition may be performed by a known method, for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater. , Meyer bar coater, kiss coater and the like.

Drying conditions for the pressure-sensitive adhesive composition are not particularly limited, but when the pressure-sensitive adhesive composition contains a solvent to be described later, it is preferable to dry by heating. The solvent-containing pressure-sensitive adhesive composition is preferably dried, for example, at 70 to 130° C. for 10 seconds to 5 minutes.

When the first pressure-sensitive adhesive layer 4 is non-energy ray-curable, examples of the non-energy ray-curable pressure-sensitive adhesive composition include the pressure-sensitive adhesive composition (I- 4) and the like.

In this specification, the term "adhesive resin" is a concept that includes both a resin having adhesiveness and a resin having adhesiveness. , resins that exhibit adhesiveness when used in combination with other components such as additives, and resins that exhibit adhesiveness due to the presence of a trigger such as heat or water.

The adhesive resin (I-1a) is preferably an acrylic resin.
Examples of the acrylic resin include acrylic polymers having at least structural units derived from alkyl (meth)acrylates.
The structural units of the acrylic resin may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the adhesive resin constituting the first adhesive layer, the content of structural units derived from the (meth)acrylate compound is 50 to 100% by mass with respect to the total mass (100% by mass) of the structural units. is preferred, 80 to 100 mass % is more preferred, and 90 to 100 mass % is even more preferred.
The term "derived" as used herein means that the monomer has undergone a structural change necessary for polymerization.

Specific examples of the (meth)acrylate compound include those exemplified in the above binder component.

The adhesive strength of the adhesive resin strengthens the adhesion between the non-heat-shrinkable base film 3 and the first adhesive layer 4, and makes it possible to stably pick up the diced chip with the film-shaped firing material. The adhesive strength to the SUS plate at 23° C. is preferably 5 N/25 mm or more.

It is preferable that the acrylic polymer further has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the alkyl (meth)acrylate.
As the functional group-containing monomer, for example, the functional group reacts with a cross-linking agent described later to become a starting point for cross-linking, or the functional group reacts with an unsaturated group in the unsaturated group-containing compound described later. and those capable of introducing an unsaturated group into the side chain of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include hydroxyl group, carboxyl group, amino group, epoxy group and the like.
That is, examples of functional group-containing monomers include hydroxyl group-containing monomers, carboxy group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (meth) Hydroxyalkyl (meth)acrylates such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; Saturated alcohol (that is, unsaturated alcohol having no (meth)acryloyl skeleton) and the like can be mentioned.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids (i.e., monocarboxylic acids having an ethylenically unsaturated bond) such as (meth)acrylic acid and crotonic acid; fumaric acid, itaconic acid, and maleic acid; , ethylenically unsaturated dicarboxylic acids (i.e., dicarboxylic acids having an ethylenically unsaturated bond) such as citraconic acid; anhydrides of said ethylenically unsaturated dicarboxylic acids; carboxyalkyl (meth)acrylates such as 2-carboxyethyl methacrylate Ester etc. are mentioned.

The functional group-containing monomers constituting the acrylic polymer may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the content of structural units derived from functional group-containing monomers is preferably 1 to 35% by mass, more preferably 2 to 32% by mass, based on the total amount of structural units. , 3 to 30% by mass.

In the adhesive composition (I-4), the content ratio of the adhesive resin (I-1a) with respect to the total mass of the adhesive composition (I-4) is preferably 5 to 99% by mass. , more preferably 10 to 95% by mass, particularly preferably 15 to 90% by mass.

In the adhesive composition (I-4), the content ratio of the adhesive resin (I-1a) with respect to the total mass of the adhesive composition (I-4) is preferably 5 to 99% by mass. , more preferably 10 to 95% by mass, particularly preferably 15 to 90% by mass.

In the adhesive composition (I-4), the ratio of the content of the adhesive resin (I-1a) to the total content of all components other than the solvent (i.e., in the first adhesive layer, the first adhesive The ratio of the content of the adhesive resin (I-1a) to the total mass of the agent layer) is preferably 50 to 100% by mass, for example, may be 65 to 99% by mass, and may be 80 to 98% by mass. % by mass.

[Crosslinking agent]
As the adhesive resin (I-1a), in addition to the structural unit derived from the alkyl (meth) acrylate, when using the acrylic polymer having a structural unit derived from a functional group-containing monomer, the adhesive composition (I- 4) preferably further contains a cross-linking agent.

The cross-linking agent is, for example, one that reacts with the functional group to cross-link the adhesive resins (I-1a).
Examples of cross-linking agents include isocyanate-based cross-linking agents such as tolylene diisocyanate (TDI), hexamethylene diisocyanate (HDI), xylylene diisocyanate (XDI), and adducts of these diisocyanates (i.e., cross-linking having an isocyanate group). agent); epoxy-based cross-linking agents such as organic polyvalent isocyanate-based cross-linking agents and ethylene glycol glycidyl ether (that is, cross-linking agents having a glycidyl group); Aziridine-based cross-linking agent (i.e., cross-linking agent having an aziridinyl group); Metal chelate-based cross-linking agent such as aluminum chelate (i.e., cross-linking agent having metal chelate structure); Isocyanurate-based cross-linking agent (i.e., cross-linking having isocyanuric acid skeleton agent) and the like.
The cross-linking agent is preferably an isocyanate-based cross-linking agent because it improves the cohesive force of the pressure-sensitive adhesive to improve the adhesive strength of the pressure-sensitive adhesive layer and is easily available.

As the organic polyvalent isocyanate compound, more specifically, for example, 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylylene diisocyanate; 4,4'-diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; Compounds in which one or more of tolylene diisocyanate, hexamethylene diisocyanate and xylylene diisocyanate are added to all or part of the hydroxyl groups of polyols such as methylolpropane; lysine diisocyanate and the like.

The pressure-sensitive adhesive composition (I-4) may contain one type of cross-linking agent, or two or more types thereof.

[Other additives]
The pressure-sensitive adhesive composition (I-4) may contain other additives that do not fall under any of the above-described components, as long as they do not impair the effects of the present invention.
Examples of other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers. , a reaction retardant, a cross-linking accelerator (catalyst), and other known additives.
The reaction retarder is, for example, an unintended cross-linking reaction in the PSA composition (I-4) during storage due to the action of a catalyst mixed in the PSA composition (I-4). It suppresses progression. Examples of the reaction retarder include those that form a chelate complex by chelating the catalyst, more specifically those having two or more carbonyl groups (-C(=O)-) in one molecule. mentioned.

The other additives contained in the pressure-sensitive adhesive composition (I-4) may be of one type or two or more types, and when there are two or more types, their combination and ratio can be arbitrarily selected.

When other additives are used, the content of the other additives in the pressure-sensitive adhesive composition (I-4) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive composition (I-4) may contain a solvent. Since the pressure-sensitive adhesive composition (I-4) contains a solvent, the coating suitability to the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters such as ethyl acetate (e.g., carboxylic acid esters); ethers such as tetrahydrofuran and dioxane; Aliphatic hydrocarbons such as hexane; aromatic hydrocarbons such as toluene and xylene; and alcohols such as 1-propanol and 2-propanol.

As the solvent, for example, the solvent used in the production of the adhesive resin (I-1a) may be used as it is in the adhesive composition (I-4) without removing it from the adhesive resin (I-1a). However, a solvent of the same or different type as that used in the production of the adhesive resin (I-1a) may be added separately in the production of the adhesive composition (I-4).

The solvent contained in the pressure-sensitive adhesive composition (I-4) may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

When using a solvent, the content of the solvent in the pressure-sensitive adhesive composition (I-4) is not particularly limited, and may be adjusted as appropriate.

[Method for producing pressure-sensitive adhesive composition]
The pressure-sensitive adhesive composition is obtained by blending the pressure-sensitive adhesive and, if necessary, each component for constituting the pressure-sensitive adhesive composition, such as components other than the pressure-sensitive adhesive.
There are no particular restrictions on the order of addition of each component when blending, and two or more components may be added at the same time.
When a solvent is used, the solvent may be mixed with any compounding component other than the solvent and used by diluting this compounding component in advance, or any compounding component other than the solvent may be diluted in advance. You may use by mixing a solvent with these compounding ingredients, without preserving.
The method of mixing each component at the time of blending is not particularly limited, and may be selected from known methods such as a method of mixing by rotating a stirrer or stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves. It can be selected as appropriate.
The temperature and time at which each component is added and mixed are not particularly limited as long as each compounded component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30°C.

(Second support sheet)
<Heat shrinkable base film>
In the film-like baking material with a support sheet of this embodiment, the second support sheet 2 has a heat-shrinkable base film 7 .

The shrinkage rate of the heat-shrinkable base film is preferably 10-90%, more preferably 20-80%. Note that the shrinkage ratio is calculated based on the above formula.

Various types of heat-shrinkable base films have been known in the art, but in the present invention, any type of heat-shrinkable base film can be used as long as it does not adversely affect the material to be cut, such as ion contamination. can be used. Specific examples include biaxially oriented films such as polyethylene terephthalate, polyethylene, polystyrene, polypropylene, nylon, urethane, polyvinylidene chloride, and polyvinyl chloride.

The thickness of the heat-shrinkable base film as described above is preferably 5 to 300 μm, more preferably 10 to 200 μm.

As the heat-shrinkable base film, a stretched film such as a uniaxially stretched film or a biaxially stretched film can be used, but from the viewpoint of peelability, it is preferable to use a biaxially stretched film. Examples of biaxially oriented films include oriented polyethylene, oriented polypropylene, and oriented polyethylene terephthalate.

The base material of the heat-shrinkable base film may be composed of a single layer of the heat-shrinkable film, or may be a base material composed of multiple layers. That is, it may be a combination of one or more heat-shrinkable base films, or a combination of a heat-shrinkable base film and the non-heat-shrinkable base film. good.

The difference between the heat-shrinkable base film and the non-heat-shrinkable base film used in the present invention lies in their shrinkage ratios. For example, when producing a polyethylene film, it is possible to produce two types of polyethylene films having different shrinkage rates by appropriately setting the production conditions and the like.

<Second adhesive layer>
The second adhesive layer 8 is sheet-like or film-like, and can contain an adhesive.
The second support sheet 2 has an adhesive portion at least on its outer periphery. The adhesive portion has a function of temporarily fixing the ring frame 5 on the outer peripheral portion of the film-like baking material 100a with the support sheet, and it is preferable that the ring frame 5 can be peeled off after the required steps. Therefore, for the second pressure-sensitive adhesive layer 8, a weakly adhesive layer may be used, or an energy ray-curable layer whose adhesive strength is reduced by energy ray irradiation may be used. The second pressure-sensitive adhesive layer may be energy ray-curable or non-energy ray-curable.

The second support sheet 2 has a second adhesive layer 8 on the entire upper surface of the heat-shrinkable base film 7, as shown in FIG. As the second pressure-sensitive adhesive layer 8, a weakly-adhesive one or an energy ray-curable pressure-sensitive adhesive may be used in the same manner as described above.

Acrylic and silicone adhesives are preferably used as weakly adhesive adhesives.

In the support sheet having the structure shown in FIG. 2, the heat-shrinkable base film 7 is provided with the second pressure-sensitive adhesive layer 8 in order to strengthen the adhesion between the heat-shrinkable base film 7 and the second pressure-sensitive adhesive layer 8. If desired, the surface to be treated may be roughened by sandblasting or solvent treatment, or oxidized by corona discharge treatment, electron beam irradiation, plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, etc. can be applied. A primer treatment can also be applied.

Although the thickness of the second pressure-sensitive adhesive layer is not particularly limited, it is preferably 2 to 50 μm, particularly preferably 3 to 20 μm.

The second pressure-sensitive adhesive layer may consist of one layer (single layer) or may consist of two or more layers. When the second pressure-sensitive adhesive layer consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.

<Adhesive composition>
The second adhesive layer can be formed using an adhesive composition containing an adhesive. For example, the pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition to the surface on which the second pressure-sensitive adhesive layer is to be formed, and drying it as necessary. A more specific method for forming the second pressure-sensitive adhesive layer is the same as the method for forming the first pressure-sensitive adhesive layer described above. The content ratio of the components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the content ratio of the components in the pressure-sensitive adhesive layer.

The coating and drying conditions for the adhesive composition in the second adhesive layer are the same as those for the adhesive composition in the first adhesive layer.

When the second pressure-sensitive adhesive layer 8 is energy ray-curable, the pressure-sensitive adhesive composition containing the energy ray-curable pressure-sensitive adhesive, that is, the energy ray-curable pressure-sensitive adhesive composition includes, for example, non-energy ray-curable adhesive resin (I-1a) (hereinafter sometimes abbreviated as “adhesive resin (I-1a)”) and an energy ray-curable compound (I-1 ); an energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of a non-energy ray-curable adhesive resin (I-1a) (hereinafter referred to as “adhesive resin (I- 2a)”); a pressure-sensitive adhesive composition (I-2) containing the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound (I -3) and the like.

When the second pressure-sensitive adhesive layer 8 is non-energy ray-curable, the non-energy ray-curable pressure-sensitive adhesive composition includes, for example, the pressure-sensitive adhesive composition containing the pressure-sensitive adhesive resin (I-1a) ( I-4) and the like.

Among the adhesive compositions (I-1) to (I-4) shown above, the adhesive composition ( I-2) is preferred.

As the adhesive composition used for the second adhesive layer, the adhesive composition (I-1) may be used, but as described above, it is more preferable to use the adhesive composition (I-2). The reason is that the adhesive composition (I-2) can exhibit energy ray curability without using an energy ray curable compound, and even if the adhesive resin has low compatibility with the energy ray curable compound, , can be used without problems.
For example, in the adhesive composition (I-1), a highly polar adhesive resin may be selected in order to enhance compatibility with the energy ray-curable compound. However, with a highly polar adhesive resin, the adhesive strength tends to increase over time after application.
Adhesive resins containing structural units derived from (meth)acrylates having side chain alkoxy groups with 8 to 18 carbon atoms are less likely to increase in adhesive strength with the passage of time after application, but are compatible with energy ray-curable compounds. May have low compatibility. However, when the adhesive resin is contained in the adhesive composition (I-2) and has an energy ray-polymerizable unsaturated group in its side chain, the problem of compatibility with the energy ray-curable compound is considered. It is possible to achieve both energy ray curability and adhesion reduction at a high level.

When the second pressure-sensitive adhesive layer is energy ray-curable, the pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition (I-2) contains an adhesive resin, and the adhesive resin is Those having an energy ray-polymerizable unsaturated group in the side chain can be exemplified.

The adhesive layer contains an adhesive resin, the adhesive resin has an energy ray-polymerizable unsaturated group in its side chain, and the adhesive resin has an alkoxy group having a carbon number in the side chain of Examples include those containing 8 to 18 structural units derived from (meth)acrylate.

<Adhesive composition (I-1)>
As described above, the adhesive composition (I-1) contains the non-energy ray-curable adhesive resin (I-1a) and an energy ray-curable compound.

Among (meth)acrylate compounds, the adhesive resin (I-1a) preferably contains a structural unit derived from an alkyl (meth)acrylate, and the alkoxy group in the side chain has 8 to 18 carbon atoms (meth ) It preferably contains a structural unit derived from an acrylate, and more preferably contains a structural unit derived from an alkyl (meth)acrylate having a side chain alkoxy group with 8 to 18 carbon atoms. The number of carbon atoms in the side chain alkoxy group is preferably 8 to 18, more preferably 8 to 12, and even more preferably 8 to 10. The side chain alkoxy group may be linear or branched. Adhesion at the interface between the second adhesive layer and the film-like baking material is enhanced by the adhesive resin containing a structural unit derived from a (meth)acrylate having 8 to 18 carbon atoms in the alkoxy group in the side chain. By reducing the force, it is possible to more stably pick up the diced chip with the film-shaped firing material.

In the adhesive resin constituting the adhesive layer, the content of structural units derived from (meth)acrylic acid esters having 8 to 18 carbon atoms in the side chain alkoxy group is the total weight of the structural units (100% by mass). is preferably 50 to 100% by mass, more preferably 60 to 95% by mass, and even more preferably 70 to 90% by mass.

It is preferable that the acrylic polymer further has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the alkyl (meth)acrylate.
As the functional group-containing monomer, for example, the functional group reacts with a cross-linking agent described later to become a starting point for cross-linking, or the functional group reacts with an unsaturated group in the unsaturated group-containing compound described later. and those capable of introducing an unsaturated group into the side chain of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include hydroxyl group, carboxyl group, amino group, epoxy group and the like.
That is, examples of functional group-containing monomers include hydroxyl group-containing monomers, carboxy group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (meth) Hydroxyalkyl (meth)acrylates such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; Saturated alcohol (that is, unsaturated alcohol having no (meth)acryloyl skeleton) and the like can be mentioned.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids (i.e., monocarboxylic acids having an ethylenically unsaturated bond) such as (meth)acrylic acid and crotonic acid; fumaric acid, itaconic acid, and maleic acid; , ethylenically unsaturated dicarboxylic acids (i.e., dicarboxylic acids having an ethylenically unsaturated bond) such as citraconic acid; anhydrides of said ethylenically unsaturated dicarboxylic acids; carboxyalkyl (meth)acrylates such as 2-carboxyethyl methacrylate Ester etc. are mentioned.

In the adhesive resin, from the viewpoint of further reducing the adhesive force with the film-shaped sintered material containing sinterable metal particles, the total mass (100% by mass) of the constituent units of the adhesive resin, (meta) The content of the structural unit derived from acrylic acid is preferably 10% by mass or less, more preferably 5% by mass or less, and further preferably 2% by mass or less. It is particularly preferred to contain substantially no structural units.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxy group-containing monomer, more preferably a hydroxyl group-containing monomer.
Hydroxyalkyl (meth)acrylates are preferred as hydroxyl group-containing monomers.

The functional group-containing monomers constituting the acrylic polymer may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the content of structural units derived from functional group-containing monomers is preferably 1 to 35% by mass, more preferably 2 to 32% by mass, based on the total amount of structural units. , 3 to 30% by mass.

The acrylic polymer can be used as the above non-energy ray-curable adhesive resin (I-1a).
On the other hand, the functional group in the acrylic polymer is reacted with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group), and the above-mentioned energy ray-curable adhesive It can be used as resin (I-2a).

The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) may be of only one type, or may be of two or more types. You can choose.

In the adhesive composition (I-1), the content ratio of the adhesive resin (I-1a) with respect to the total mass of the adhesive composition (I-1) is preferably 5 to 99% by mass. , more preferably 10 to 95% by mass, particularly preferably 15 to 90% by mass.

[Energy ray-curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) include monomers or oligomers having energy ray-polymerizable unsaturated groups and curable by energy ray irradiation.
Among energy ray-curable compounds, monomers include, for example, trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4 -polyvalent (meth)acrylates such as butylene glycol di(meth)acrylate, 1,6-hexanediol (meth)acrylate; urethane (meth)acrylates; polyester (meth)acrylates; polyether (meth)acrylates; meth)acrylate and the like.
Among energy ray-curable compounds, oligomers include, for example, oligomers obtained by polymerizing the above-exemplified monomers.
Urethane (meth)acrylates and urethane (meth)acrylate oligomers are preferred as the energy ray-curable compound because they have a relatively large molecular weight and are unlikely to reduce the storage modulus of the pressure-sensitive adhesive layer.

The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .

In the pressure-sensitive adhesive composition (I-1), the content ratio of the energy ray-curable compound with respect to the total weight of the pressure-sensitive adhesive composition (I-1) is preferably 1 to 95% by mass, It is more preferably 5 to 90% by mass, particularly preferably 10 to 85% by mass.

[Crosslinking agent]
As the adhesive resin (I-1a), in addition to the structural unit derived from the alkyl (meth) acrylate, when using the acrylic polymer having a structural unit derived from a functional group-containing monomer, the adhesive composition (I- 1) preferably further contains a cross-linking agent.

Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-1) include the same cross-linking agents as in the pressure-sensitive adhesive composition (I-4).
The pressure-sensitive adhesive composition (I-1) may contain one type of cross-linking agent, or two or more types thereof.

The pressure-sensitive adhesive composition (I-1) may contain one type of cross-linking agent, or two or more types thereof.

When a cross-linking agent is used, the content of the cross-linking agent in the adhesive composition (I-1) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (I-1a). , more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.

[Photoinitiator]
The adhesive composition (I-1) may further contain a photopolymerization initiator. The adhesive composition (I-1) containing a photopolymerization initiator undergoes a sufficient curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-1) include the same photopolymerization initiators as in the pressure-sensitive adhesive composition (I-4).

The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-1) may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

When a photopolymerization initiator is used, the content of the photopolymerization initiator in the adhesive composition (I-1) is 0.01 to 20 parts by mass with respect to 100 parts by mass of the energy ray-curable compound. parts, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-described components, as long as they do not impair the effects of the present invention.
Examples of the other additives in the adhesive composition (I-1) include the same additives as the other additives in the adhesive composition (I-4).
The other additives contained in the pressure-sensitive adhesive composition (I-1) may be of one type or two or more types, and when two or more types are used, their combination and ratio can be arbitrarily selected.

When other additives are used, the content of the other additives in the pressure-sensitive adhesive composition (I-1) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive composition (I-1) may contain a solvent for the same purpose as the adhesive composition (I-4).
Examples of the solvent in the adhesive composition (I-1) include the same solvents as in the adhesive composition (I-4).
The pressure-sensitive adhesive composition (I-1) may contain only one kind of solvent, or two or more kinds of solvents.
When using a solvent, the content of the solvent in the pressure-sensitive adhesive composition (I-1) is not particularly limited, and may be adjusted as appropriate.

<Adhesive composition (I-2)>
As described above, the pressure-sensitive adhesive composition (I-2) is an energy-ray-curable adhesive resin in which an unsaturated group is introduced into the side chain of the non-energy-ray-curable adhesive resin (I-1a). Contains (I-2a).

[Adhesive resin (I-2a)]
The adhesive resin (I-2a) is obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound is capable of bonding with the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group. It is a compound having a group.
Examples of the energy ray polymerizable unsaturated group include (meth)acryloyl group, vinyl group (alias: ethenyl group), allyl group (alias: 2-propenyl group) and the like, and (meth)acryloyl group is preferred. .
Groups capable of bonding with functional groups in the adhesive resin (I-1a) include, for example, an isocyanate group and a glycidyl group capable of bonding with a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding with a carboxy group or an epoxy group. etc.

Examples of the unsaturated group-containing compound include (meth)acryloyloxyethyl isocyanate, (meth)acryloylisocyanate, glycidyl (meth)acrylate, and the like.

The pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) may be of only one type, or may be of two or more types. You can choose.

In the adhesive composition (I-2), the content ratio of the adhesive resin (I-2a) with respect to the total mass of the adhesive composition (I-2) is preferably 5 to 99% by mass. , more preferably 10 to 95% by mass, particularly preferably 10 to 90% by mass.

In the adhesive composition (I-2), the ratio of the content of the adhesive resin (I-1a) to the total content of all components other than the solvent (i.e., in the second adhesive layer, the second adhesive The content ratio of the adhesive resin (I-1a) to the total weight of the agent layer) is preferably 50 to 100% by weight, and may be, for example, 65 to 99% by weight.

[Crosslinking agent]
As the adhesive resin (I-2a), for example, when using the acrylic polymer having the same structural unit derived from a functional group-containing monomer as in the adhesive resin (I-1a), the adhesive composition ( I-2) may further contain a cross-linking agent.

Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) include the same cross-linking agents as in the pressure-sensitive adhesive composition (I-4).
The pressure-sensitive adhesive composition (I-2) may contain one type of cross-linking agent, or two or more types thereof.

When a cross-linking agent is used, the content of the cross-linking agent in the adhesive composition (I-2) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (I-2a). , more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 3 parts by mass.

[Photoinitiator]
The adhesive composition (I-2) may further contain a photopolymerization initiator. The adhesive composition (I-2) containing a photopolymerization initiator undergoes a sufficient curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiators as in the pressure-sensitive adhesive composition (I-4).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-2) may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When using a photopolymerization initiator, the content of the photopolymerization initiator in the adhesive composition (I-2) is 0.01 to 0.01 with respect to 100 parts by mass of the content of the adhesive resin (I-2a). It is preferably 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components, as long as they do not impair the effects of the present invention.
Examples of the other additives in the adhesive composition (I-2) include the same additives as those in the adhesive composition (I-4).
The other additives contained in the pressure-sensitive adhesive composition (I-2) may be of one type or two or more types, and when there are two or more types, their combination and ratio can be arbitrarily selected.

When other additives are used, the content of the other additives in the pressure-sensitive adhesive composition (I-2) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive composition (I-2) may contain a solvent for the same purpose as the adhesive composition (I-4).
Examples of the solvent in the adhesive composition (I-2) include the same solvents as in the adhesive composition (I-4).
The pressure-sensitive adhesive composition (I-2) may contain only one kind of solvent, or two or more kinds of solvents.
When using a solvent, the content of the solvent in the pressure-sensitive adhesive composition (I-2) is not particularly limited, and may be adjusted as appropriate.

<Adhesive composition (I-3)>
The adhesive composition (I-3) contains the adhesive resin (I-2a) and an energy ray-curable compound, as described above.

In the adhesive composition (I-3), the content ratio of the adhesive resin (I-2a) to the total mass of the adhesive composition (I-3) is preferably 5 to 99% by mass. , more preferably 10 to 95% by mass, particularly preferably 15 to 90% by mass.

[Energy ray-curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) include monomers and oligomers that have an energy-ray-polymerizable unsaturated group and can be cured by irradiation with an energy ray. The same energy ray-curable compound contained in the product (I-1) can be mentioned.
The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .

In the adhesive composition (I-3), the content of the energy ray-curable compound is 0.01 to 300 parts by mass with respect to 100 parts by mass of the adhesive resin (I-2a). preferably 0.03 to 200 parts by mass, particularly preferably 0.05 to 100 parts by mass.

[Photoinitiator]
The adhesive composition (I-3) may further contain a photopolymerization initiator. The adhesive composition (I-3) containing a photopolymerization initiator undergoes a sufficient curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiators as in the pressure-sensitive adhesive composition (I-4).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-3) may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

When a photopolymerization initiator is used, the content of the photopolymerization initiator in the adhesive composition (I-3) is 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable compound. is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components, as long as they do not impair the effects of the present invention.
Examples of the other additives include the same as the other additives in the adhesive composition (I-4).
The other additives contained in the pressure-sensitive adhesive composition (I-3) may be of one type or two or more types, and when two or more types are used, their combination and ratio can be selected arbitrarily.

When other additives are used, the content of the other additives in the pressure-sensitive adhesive composition (I-3) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive composition (I-3) may contain a solvent for the same purpose as the adhesive composition (I-4).
Examples of the solvent in the adhesive composition (I-3) include the same solvents as in the adhesive composition (I-4).
The pressure-sensitive adhesive composition (I-3) may contain only one kind of solvent, or two or more kinds of solvents.
When using a solvent, the content of the solvent in the pressure-sensitive adhesive composition (I-3) is not particularly limited, and may be adjusted as appropriate.

<Adhesive Compositions Other than Adhesive Compositions (I-1) to (I-3)>
So far, the adhesive composition (I-1), the adhesive composition (I-2) and the adhesive composition (I-3) have been mainly described, but the components described as these components are A general adhesive composition other than these three adhesive compositions (herein referred to as "adhesive compositions other than adhesive compositions (I-1) to (I-3)") But you can use it as well.

The pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) include not only energy-ray-curable pressure-sensitive adhesive compositions but also non-energy-ray-curable pressure-sensitive adhesive compositions.
Examples of non-energy ray-curable adhesive compositions include non-energy ray-curable adhesive compositions such as acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, and ester resins. and the adhesive composition (I-4) containing the adhesive resin (I-1a), preferably containing an acrylic resin.

[Method for producing pressure-sensitive adhesive composition]
The pressure-sensitive adhesive compositions (I-1) to (I-3) can be produced in the same manner as the pressure-sensitive adhesive composition (I-4).

[Manufacturing method of film-shaped sintered material with support sheet]
The support sheet-attached film-like baking material of the present embodiment can be produced by sequentially laminating the above-described layers so as to have corresponding positional relationships.
For example, on the first pressure-sensitive adhesive layer of the first support sheet in which the first pressure-sensitive adhesive layer is laminated on the non-heat-shrinkable base film, the second pressure-sensitive adhesive is applied on the heat-shrinkable base film. When laminating the second support sheet in which layers are laminated, first, on the release film, a pressure-sensitive adhesive composition containing components and a solvent for constituting the first pressure-sensitive adhesive layer is applied, By drying and evaporating the solvent as necessary to form a film, the first adhesive layer is formed in advance on the release film, and the release film of the already formed first adhesive layer and the release film are formed. The exposed surface opposite to the contacting side is laminated to the surface of the non-heat-shrinkable base film to produce a first support sheet with a release film. Similarly, a pressure-sensitive adhesive composition containing components and a solvent for constituting the second pressure-sensitive adhesive layer is applied on the release film, and dried as necessary to volatilize the solvent to form a film. Then, a second pressure-sensitive adhesive layer is formed in advance on the release film, and the exposed surface of the formed second pressure-sensitive adhesive layer opposite to the side in contact with the release film is heat-shrunk. A second support sheet with a release film is produced by bonding to the surface of the flexible base film. Next, the release film on the first pressure-sensitive adhesive layer of the first support sheet is removed, and the first pressure-sensitive adhesive layer is attached onto the heat-shrinkable base film of the second support sheet. The release film of the second support sheet may be removed as necessary after forming the laminated structure.

Next, on the first adhesive layer of the first support sheet in which the first adhesive layer is laminated on the non-heat-shrinkable base film, the second adhesive is applied on the heat-shrinkable base film. A support sheet obtained by laminating a heat-shrinkable base film of a second support sheet laminated with an agent layer, and further laminating a film-like baking material on the second pressure-sensitive adhesive layer of the second support sheet. Film-like baking material with attached (the first support sheet is a laminate of a non-heat-shrinkable base film and a first pressure-sensitive adhesive layer, and the second support sheet is a heat-shrinkable base film and a second pressure-sensitive adhesive layer In the case of producing a film-shaped sintered material with a support sheet that is a laminate of layers), first, on a non-heat-shrinkable base film, a first adhesive layer, a heat-shrinkable base material A film and a second adhesive layer are laminated in this order. Next, separately, a firing material composition containing components and a solvent for constituting a film-shaped firing material is coated or printed on the peeling film, and dried as necessary to volatilize the solvent to form a film. Thus, a film-like sintering material is formed on the release film, and the exposed surface of the film-like sintering material is attached to the exposed surface of the second adhesive layer laminated on the heat-shrinkable base film. In addition, by laminating the film-shaped sintered material on the second adhesive layer, the film-shaped sintered material with the support sheet can be obtained. When forming a film-like sintered material on a release film, the sintered material composition is preferably applied or printed on the release-treated surface of the release film, and the release film can be removed as necessary after the laminated structure is formed. Just do it.

In this way, all of the layers other than the non-heat-shrinkable base film and the heat-shrinkable base film that constitute the film-like sintered material with a support sheet are formed in advance on the release film. Since it can be laminated by a method of bonding to the surface, it is possible to produce a film-like sintered material with a support sheet by appropriately selecting a layer that employs such a process as necessary.

In addition, after providing all the necessary layers, the film-shaped baking material with a support sheet may be stored in a state in which a release film is attached to the surface of the outermost layer opposite to the first support sheet.

≪Roll body≫
As one embodiment of the present invention, the film-shaped firing material with a support sheet is laminated on a long release film with the film-shaped firing material facing inside,
A roll body is provided in which the release film and the film-like baking material with the support sheet are rolled.

FIG. 5 is a cross-sectional view schematically showing a roll body according to one embodiment of the present invention, showing a state in which the roll is unwound and partially spread. In the roll body 110, two or more units of the film-like baking material 100 with a support sheet processed into a predetermined shape are laminated on the release film 15 with the film-like baking material facing inside. The release film 15 and the film-like baking material 100 with the supporting sheet are rolled so that the side on which the film-like baking material 100 with the supporting sheet is laminated faces the center side. The roll winding direction is the longitudinal direction of the long release film 15 .

One unit of the film-shaped sintered material with the support sheet may be a part of the film-shaped sintered material with the support sheet that is used once or for one sticking object. can be part of the inclusion. In FIG. 4, one film-like baking material 1 is included for each unit P, and two or more units P are continuously arranged at predetermined intervals. The supporting sheet-attached film-like baking materials contained in each unit P may be processed into the same shape. A preferred shape of the film-like sintering material with a support sheet is that in which a circular support sheet and a circular film-like sintering material having a diameter smaller than that of the support sheet are concentrically laminated.

The film-like baking material 1 can be easily attached to a semiconductor wafer or the like (object to be attached), and has adhesiveness. It is suitable for storage as a roll by setting it as the structure.
A roll body is also suitable as a form of distribution of the film-shaped baking material with a support sheet.

The roll body can be produced by laminating the support sheet-attached film-like sintering material and the release film so as to have a corresponding positional relationship.

≪Laminate≫
As one embodiment of the present invention, there is provided a laminate in which the support sheet-attached film-like sintering material and a wafer are attached, and the support sheet, the film-like sintering material, and the wafer are laminated in this order.
The laminate can be used as an intermediate in the method of manufacturing the device described below.

FIG. 6 is a cross-sectional view schematically showing a laminate according to one embodiment of the present invention. The laminate 120 is obtained by laminating the film-like baking material 100 with the supporting sheet and the semiconductor wafer 18, and laminating the first supporting sheet 6, the second supporting sheet 2, the film-like baking material 1, and the semiconductor wafer 18 in this order. It is a thing. The semiconductor wafer 18 may be provided in direct contact with the film-like baking material 1 .

The semiconductor wafer may be a silicon wafer, a silicon carbide wafer, or a compound semiconductor wafer such as gallium arsenide. A circuit may be formed on the surface of the semiconductor wafer. A circuit can be formed on the wafer surface by various methods including conventionally used methods such as an etching method and a lift-off method. The opposite surface (back surface) of the semiconductor wafer to the circuit surface may be ground by known means using a grinder or the like. During back grinding, an adhesive sheet called a surface protection sheet can be attached to the circuit surface in order to protect the circuit on the surface. The back side of the wafer can be ground with a grinder while the circuit side (that is, the surface protection sheet side) of the wafer is fixed on a chuck table or the like and the back side on which the circuit is not formed is ground. Although the thickness of the wafer after grinding is not particularly limited, it is usually about 20 to 500 μm. After that, if necessary, the crushed layer generated during back grinding is removed. The fracture layer can be removed by chemical etching, plasma etching, or the like. After grinding, the back surface may be provided with a metal film, which may be a single film or multiple films. Various methods such as electrolytic or electroless plating and sputtering can be used to form the metal film.

The shape of the workpiece (wafer, etc.) to be pasted is usually circular, and therefore the film-like baking material 1, the first support sheet 6, and the second support sheet 2 should also be circular. is preferred.

In the laminated body 120 , the diameter of the film-like baking material 1 is preferably the same as or larger than the diameter of the semiconductor wafer 18 .
More specifically, the difference in diameter between the film-like sintered material and the wafer (the diameter of the film-like sintered material - the diameter of the wafer) is preferably 0 to 20 mm, more preferably 1 to 15 mm. When the above diameter difference is equal to or greater than the above lower limit, the effect of suppressing chip flying is excellent. When the above diameter difference is equal to or less than the above upper limit value, an excellent effect of preventing wafer contamination is exhibited.

In the laminate 120 , the diameter of the second support sheet 2 is preferably the same as or larger than the diameter of the film-shaped sintered material 1 . Also, the diameter of the first support sheet 6 is preferably the same as or larger than the diameter of the second support sheet 2 .

The laminate can be produced by laminating the film-shaped baking material with the support sheet and the wafer so that they have a corresponding positional relationship.

≪Manufacturing method of the device≫
Next, a method of using the film-shaped sintered material with a support sheet of the present embodiment will be described by taking as an example a case where a semiconductor wafer is used as the wafer and the sintered material is applied to the manufacture of a semiconductor device.

As one embodiment of the present invention, a method for manufacturing a semiconductor device using a film-shaped sintered material with a support sheet is a method for manufacturing a semiconductor device using a film-shaped sintered material with a support sheet according to the present invention, comprising the following steps. In this method, steps (1) to (5) are performed sequentially.

Step (1): a step of dicing the semiconductor wafer (workpiece) of the laminate and the film-shaped firing material;
Step (2): a step of heating the diced film-shaped baking material to shrink the second support sheet;
Step (3): A step of peeling the diced film-shaped sintered material and the second support sheet to obtain a chip with the film-shaped sintered material;
Step (4): A step of attaching the film-like firing material of the film-like firing material-attached chip to the surface of a substrate;
Step (5): a step of baking the film-like sintering material of the chip with the film-like sintering material, and bonding the chip and the substrate.

The steps (1) to (5) of the semiconductor device manufacturing method will be described below with reference to FIGS. 7A and 7B.

・Process (1)
In the step (1), as shown in FIG. 7A(a), the film-like baking material 1 of the film-like baking material with the support sheet is attached to the semiconductor wafer 18, and the support sheet 2, the film-like baking material 1, and the semiconductor A laminate 120 in which wafers 18 are laminated in this order is used.

Then, the semiconductor wafer is diced. Dicing of the semiconductor wafer can be performed by a known method, and is not particularly limited.
For example, dicing of a semiconductor wafer includes a method using a blade (i.e., blade dicing), a method performed by laser irradiation (i.e., laser dicing), and a method performed by spraying water containing an abrasive (i.e., water dicing). It can be performed by a method of cutting a semiconductor wafer.

Here, as shown in FIG. 7A(b), a case of dicing the semiconductor wafer 18 and the film-like baking material 1 of the laminate 120 from the semiconductor wafer 18 side using a dicing blade is illustrated. Dicing cuts both the semiconductor wafer 18 and the film-like baking material 1 by forming the cuts C, divides the semiconductor wafer, and forms the semiconductor chips 19 . The cut C preferably reaches the first pressure-sensitive adhesive layer 4 , but does not have to reach the non-heat-shrinkable base film 3 .

In addition, individualized pieces (chips) of a semiconductor wafer having a circuit formed on the surface thereof are particularly referred to as elements or semiconductor elements.

In dicing, the rotational speed of the dicing blade is preferably 10,000 to 60,000 rpm, more preferably 20,000 to 50,000 rpm. Also, the moving speed of the dicing blade is preferably 20 to 80 mm/s, more preferably 40 to 60 mm/s.
Also, when the dicing blade is in operation, it is preferable to flow cutting water at a rate of, for example, about 0.5 to 1.5 L/min to the portion where dicing is being performed.

・Process (2)
In step (2), the diced film material is heated to shrink the second support sheet 2 .
As shown in FIG. 7A(c), when the heat-shrinkable base film 7 of the second support sheet 2 shrinks by heating the diced film-like baked material, the second support sheet 2 formed thereon shrinks. Since the second adhesive layer 8 is also deformed with the shrinkage of the heat-shrinkable base film, the bonding area between the semiconductor chip 19 and the second adhesive layer 8 is reduced.

・Process (3)
In step (3), the diced film-like sintering material 1 and the second support sheet 2 are peeled off to obtain chips 130 with film-like sintering material.
As shown in FIG. 7B(d), the semiconductor chip 19 is placed on the laminate 120 after the cut C is formed, together with the diced film sintered material 1, by a lifter 71 to form a second support sheet. It can be separated (picked up) from the second adhesive layer 8 to obtain a chip 130 with a film-like baking material.

Here, as one embodiment, a chip 130 with a film-like sintering material including a semiconductor chip 19 and a film-like sintering material 1 can be manufactured.

In step (2), the second pressure-sensitive adhesive layer 8 formed on the heat-shrinkable base film 7 of the second support sheet 2 is deformed as the heat-shrinkable base film 7 shrinks, Since the bonding area between the semiconductor chip 19 and the second adhesive layer 8 is reduced, for example, as shown in FIG. By pulling up in the indicated direction, the semiconductor chip 19 can be easily picked up.

The method for pulling up the semiconductor chip 19 may be a known method, for example, a method in which the surface of the semiconductor chip 19 is sucked by a vacuum collet and pulled up.

In addition, when the second adhesive layer 8 has curability such as energy beam curability, after dicing and before peeling (picking up) the film-like baking material 1 and the second support sheet 2, The adhesive force of the second adhesive layer 8 can be reduced by curing the second adhesive layer 8 by irradiation with energy rays or the like. As a result, during dicing, chips are prevented from scattering due to the high adhesive strength, and during pick-up, the adhesive strength is reduced due to curing, so that the film-like baking material 1 can be more easily peeled off (picked up) from the second support sheet. can.

According to the film-shaped baking material with a support sheet of the present embodiment, by using a heat-shrinkable base film for the second support sheet, by heating the diced film-shaped baking material, the heat-shrinkable The base film shrinks, the contact surface between the second support sheet and the film-shaped sintered material can be reduced, and the diced chip with the film-shaped sintered material can be stably picked up.

Moreover, in the laminated body 120, the diameter of the film-like sintered material 1 is the same as or larger than the diameter of the semiconductor wafer 18, so chip flying is effectively prevented.

・Process (4)
Subsequently, in step (4), as shown in FIG. 7B(e), the film sintering material 1 of the chip 130 with film sintering material is attached to the surface of the substrate 9 . As a result, the chip 19 is attached to the substrate 9 via the film-like baking material 1 . The substrate 9 also includes lead frames, heat sinks, and the like. According to the film-shaped baking material with a support sheet of the present embodiment, it is expected that adhesive strength is exhibited between the film-shaped baking material and the substrate. Even in a state where the chip and the substrate are temporarily fixed with the film-like sintering material before sintering, it is possible to prevent the chip from being misaligned during transportation.

・Process (5)
Next, in step (5), the film-like sintering material is sintered, and the chip 19 and the substrate 9 are sinter-bonded (FIG. 7B(f)). The exposed surface of the film-like sintering material 1 of the chip 130 with film-like sintering material is attached to the substrate 9 , and the substrate 9 and the chip 19 can be sinter-bonded via the film-like sintering material 1 . By firing, the sinterable metal particles of the film-like firing material 1 are melted and bonded together to form the sintered body 11, and the chip 19 and the substrate 9 are sintered and joined to obtain the semiconductor device 140. FIG.

The heating temperature for baking the film-shaped baking material may be appropriately determined in consideration of the type of the film-shaped baking material, etc., but is preferably 100 to 600°C, more preferably 150 to 550°C, and further preferably 250 to 500°C. preferable. The heating time may be appropriately determined in consideration of the type of film-like baking material, etc., but is preferably 5 seconds to 60 minutes, more preferably 5 seconds to 30 minutes, and even more preferably 10 seconds to 10 minutes.

Baking of the film-shaped baking material may be carried out by pressurized baking in which pressure is applied to the film-shaped baking material. As an example, the pressurizing condition can be about 1 to 50 MPa.

In the above embodiment, the sintering bonding between the chip of the film-shaped fired material and its substrate was exemplified, but the object of sintering and bonding of the film-shaped fired material is not limited to the above examples, and the film-shaped fired material Sinter bonding is possible for a variety of articles that have been sintered in contact with materials.

Further, in the above embodiment, by singulating together with the semiconductor wafer using a blade or the like, it can be processed as a film-like firing material having the same shape as the chip, and a chip with a film-like firing material can be manufactured. can. That is, in the chip with the film-like sintering material, the contact surface of the film-like sintering material and the contact surface of the chip have the same size (area), but they may be different. For example, in a state in which the contact surface of the film-like sintering material is larger than the contact surface of the chip, the substrate and the chip may be bonded via the film-like sintering material. Specifically, a film-shaped sintered material having a desired size may be placed on a substrate, and a chip having a smaller contact surface than the film-shaped sintered material may be attached onto the film-shaped sintered material.

According to the device manufacturing method of the embodiment, the device can be manufactured with high efficiency by using the support sheet-attached film-like sintered material that is excellent in dicing aptitude.

EXAMPLES Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples.

[Example 1]
<Production of first support sheet>
(Production of adhesive composition A)
Acrylic polymer (100 parts by mass, solid content), and tolylene diisocyanate adduct of trimethylolpropane ("Coronate L" manufactured by Tosoh Corporation) (2.5 parts by mass (solid content)), and further as a solvent A non-energy ray-curable pressure-sensitive adhesive composition A containing a mixed solvent of methyl ethyl ketone, toluene and ethyl acetate and having a solid concentration of 30% by mass was produced. The acrylic polymer is a copolymer having a weight average molecular weight of 800,000, which is obtained by copolymerizing butyl acrylate (BA) (91 parts by mass) and acrylic acid (AA) (9 parts by mass).

(Manufacture of first support sheet)
Using a release film ("SP-PET381031" manufactured by Lintec Co., Ltd., thickness 38 μm) in which one side of a polyethylene terephthalate film is release-treated by silicone treatment, the pressure-sensitive adhesive composition A obtained above is applied to the release-treated surface. was applied and dried by heating at 120° C. for 2 minutes to form a non-energy ray-curable pressure-sensitive adhesive layer. At this time, the conditions were set so that the thickness of the adhesive layer was 10 μm, and the adhesive composition was applied. A first support sheet was obtained by laminating a polyethylene-methacrylic acid (EMAA) film having a thickness of 80 μm as a substrate on the exposed surface of the pressure-sensitive adhesive layer.

<Production of second support sheet>
(Production of adhesive composition B)
Energy ray-curable acrylic polymer (100 parts by mass, solid content), and tolylene diisocyanate adduct of trimethylolpropane ("Coronate L" manufactured by Tosoh Corporation) (1 part by mass (solid content)), photopolymerization initiator (OMNIRAD184 manufactured by IGM Resins) in 2.5 parts by mass, and further containing a mixed solvent of methyl ethyl ketone, toluene and ethyl acetate as a solvent, and having a solid content concentration of 30% by mass. manufactured. The acrylic polymer is a copolymer obtained by copolymerizing 2-ethylhexyl acrylate (2EHA) (80 parts by mass) and 2-hydroxyethyl acrylate (HEA) (20 parts by mass) and having a weight average molecular weight of 600,000. It is a coalescence obtained by reacting 100 g of a copolymer with 21.5 g of methacryloyloxyethyl isocyanate.

(Manufacture of second support sheet)
Using a release film ("SP-PET381031" manufactured by Lintec Co., Ltd., thickness 38 μm) in which one side of a polyethylene terephthalate film is release-treated by silicone treatment, the pressure-sensitive adhesive composition B obtained above is applied to the release-treated surface. was applied and dried by heating at 100° C. for 2 minutes to form an energy ray-curable pressure-sensitive adhesive layer. At this time, the conditions were set so that the thickness of the adhesive layer was 10 μm, and the adhesive composition was applied. A heat-shrinkable polyethylene terephthalate film having a thickness of 50 μm (shrinkage ratio: 50%) was adhered as a substrate to the exposed surface of the pressure-sensitive adhesive layer to obtain a second support sheet.

<Production of firing material composition>
The components used to produce the sintered material composition are shown below. Here, metal particles having a particle size of 100 nm or less are referred to as "sinterable metal particles".
(Paste material containing sinterable metal particles)
・ Alconano silver paste ANP-4 (organic coated composite silver nanopaste, manufactured by Applied Nanoparticle Research Institute: alcohol derivative coated silver particles, metal content of 80% by mass or more, average particle size of 100 nm or less silver particles (sinterable metal Particles) 25% by mass or more)
(binder component)
・Acrylic polymer 1 (2-ethylhexyl methacrylate polymer, weight average molecular weight 260,000, Tg: -10°C)
The Tg of the acrylic polymer 1 is a calculated value using the Fox formula.

86.8 parts by mass of the sinterable metal particle-containing paste material and 13.2 parts by mass of the binder component were mixed to obtain a firing material composition. Since the sinterable metal particle-containing paste material is sold containing a high boiling point solvent, and this remains in the film-like firing material after coating or drying, the components of the sinterable metal particle-containing paste material includes these. Considering that the solvent in the binder component evaporates during drying, it represents the solid content mass part excluding the solvent component.

<Production of film-shaped sintered material>
On one side of a 230 mm wide release film (thickness 38 μm, SP-PET381031, manufactured by Lintec), the firing material composition obtained above was printed so as to have a coating diameter of 155 mm, and dried at 150 ° C. for 10 minutes. , a 40 μm-thick film-like fired material was obtained.

<Production of film-shaped sintered material with support sheet>
A film-like baking material printed in a circular shape with a diameter of 205 mm is attached to the pressure-sensitive adhesive layer surface of the second support sheet (after peeling off the release film), and the second support sheet is concentrically formed with a diameter of 210 mm as a base material. A second support in which a circular film-like firing material and a release film are laminated on a second support sheet cut from the side and having a second adhesive layer on a heat-shrinkable base film A film-like fired material with a sheet was obtained.
The film-like baking material with the second support sheet is attached to the pressure-sensitive adhesive layer surface of the first support sheet (after peeling off the release film), and the first support sheet is placed on the substrate side in a concentric circle with a diameter of 270 mm. A second support sheet, a circular film-like baking material, and a release film were laminated on a first support sheet having a first pressure-sensitive adhesive layer on a non-heat-shrinkable base film. A film-shaped sintered material with a support sheet was obtained.

Table 1 shows the configurations of the first support sheet and the second support sheet.

[Example 2]
As the base material of the second support sheet, a heat-shrinkable polyethylene film with a thickness of 25 μm (shrinkage ratio: 40%) is used instead of a heat-shrinkable polyethylene terephthalate film with a thickness of 50 μm (shrinkage ratio: 50%). Except for this, in the same manner as in Example 1 above, a film-like sintered material with a support sheet of Example 2 was obtained.

[Comparative Example 1]
A film-like baking material printed in a circular shape with a diameter of 205 mm is attached to the pressure-sensitive adhesive layer surface of the first support sheet (after peeling off the release film), and the first support sheet is attached to the substrate in a concentric shape with a diameter of 270 mm. A support of Comparative Example 1 in which a circular film-shaped firing material and a release film were laminated on a first support sheet cut from the film side and having a first pressure-sensitive adhesive layer on a non-heat-shrinkable base film. A film-like fired material with a sheet was obtained.

≪Pickup Evaluation≫
Using a wafer sticking device RAD-2500m/12 (manufactured by Lintec Co., Ltd.), the film-shaped sintered material with a support sheet obtained in each of the above examples and comparative examples was subjected to a diameter It was attached to the back surface of a 200 mm, 100 μm thick silicon wafer, stretched on a SUS ring frame, and subjected to the following dicing.

Using a blade dicer DFD6362 (manufactured by Disco), dicing was performed under the following conditions.
・Dicing conditions: Implemented so that each chip has a size of 5 mm × 5 mm ・Blade thickness: 25 μm width (27 HECC)
・Blade rotation speed: 30000 rpm
・Cutting conditions: from the side of the film-shaped baked material, the first base film is cut to a depth of 20 μm ・Cutting speed: 30 mm / s
・Cut range: Wafer diameter + 20 mmφ
・Cutting water volume: 1.5 L/min ・Cutting water temperature: 24°C

A chip having a size of 5 mm × 5 mm obtained by the above dicing was heated on a heating table at 110 ° C. for 60 seconds, then fixed on a suction table, and a suction collet was used to suction from the chip surface to pick up at a speed of 5 mm /. Five chips were continuously picked up under the condition of s.
If you can pick up 5 chips without problems, ○,
△, when only 4 to 3 chips could be picked up without any problem because some of the film-shaped baked materials remained on the second support sheet, or could be picked up.
A case in which no chips could be picked up, or a problem in which some of the film-like baked materials remained on the second support sheet although they could be picked up occurred, and no more than 2 chips could be picked up without any problems was judged to be x.

The above evaluation results are shown in Table 1 below.

As shown in Table 1, on the side of the first adhesive layer of the first support sheet having the first adhesive layer on one side of the non-heat-shrinkable substrate film, the heat-shrinkable substrate Pick-up defects were suppressed in the film-like firing materials with support sheets of Examples 1 and 2 in which the second support sheet having a film and the film-like firing material were laminated in this order. On the other hand, the first support sheet does not have a second support sheet having a heat-shrinkable base film and has a first pressure-sensitive adhesive layer on one surface of a non-heat-shrinkable base film. The film-like baking material with a support sheet of Comparative Example 1, in which the film-like baking material was directly laminated on the pressure-sensitive adhesive layer side of No. 1, had pick-up defects.

Each configuration and combination thereof in each embodiment is an example, and addition, omission, replacement, and other modifications of the configuration are possible without departing from the scope of the present invention. Moreover, the present invention is not limited by each embodiment, but is limited only by the scope of the claims.

DESCRIPTION OF SYMBOLS 1... Film-like baking material, 2... 2nd support sheet, 3... Non-heat-shrinkable base film, 4... 1st adhesive layer, 5... Ring frame, 6... 1st support sheet, 7... Heat Shrinkable base film 8 Second adhesive layer 9 Substrate 10 Sinterable metal particles 11 Sintered body 15 Release film 18 Wafer 19 Chip 20 Binder component , 71... Lifting part 100... Film-like baking material with supporting sheet 100a... Film-like baking material with supporting sheet 110... Roll body 120... Laminated body 130... Chip with film-like baking material 140... Semiconductor device, P...Unit, C...Notch

Claims (7)

A second support sheet having a heat-shrinkable base film on the first pressure-sensitive adhesive layer side of a first support sheet having a first pressure-sensitive adhesive layer on one side of a non-heat-shrinkable base film , and a film-shaped firing material with a support sheet laminated in this order,
The second support sheet includes a second adhesive layer, and the film-like baking material is laminated on the second adhesive layer side of the second support sheet,
the second pressure-sensitive adhesive layer is energy ray-curable,
the first pressure-sensitive adhesive layer is non-energy ray-curable,
A film-like sintered material with a support sheet, wherein the diameter of the first support sheet is larger than the diameter of the second support sheet, and the diameter of the second support sheet is larger than the diameter of the film-like sintered material. . 2. The film-like baking material with a support sheet according to claim 1 , wherein said second adhesive layer contains an adhesive resin, and said adhesive resin has an energy ray-polymerizable unsaturated group in its side chain. 3. The film-like baking material with a support sheet according to claim 1 or 2 , wherein said heat-shrinkable base film is made of at least one selected from the group consisting of oriented polyethylene, oriented polypropylene, and oriented polyethylene terephthalate. The film-shaped firing material with a support sheet according to any one of claims 1 to 3 is laminated on a long release film with the film-shaped firing material facing inside,
A roll body in which the release film and the film-like baking material with the support sheet are rolled. The film-like baking material with a supporting sheet according to any one of claims 1 to 3 and a wafer are attached, and the first supporting sheet, the second supporting sheet, the film-like baking material, and the A laminate in which wafers are stacked in this order. 6. The laminate according to claim 5 , wherein the diameter of the film-like sintered material is the same as or larger than the diameter of the wafer. A method for manufacturing a device in which the following steps (1) to (5) are sequentially performed:
Step (1): a step of dicing the wafer and the film-like sintered material of the laminate according to claim 6 ;
Step (2): a step of heating the diced film-shaped baking material to shrink the second support sheet;
Step (3): A step of peeling the diced film-shaped sintered material and the second support sheet to obtain a chip with a film-shaped sintered material;
Step (4): A step of attaching the film-like firing material of the film-like firing material-attached chip to the surface of a substrate;
Step (5): a step of baking the film-like sintering material of the chip with the film-like sintering material, and bonding the chip and the substrate.

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