JP7299472B2 - Card connector and its manufacturing method - Google Patents

Description

The present invention relates to a card connector and its manufacturing method.

Patent Literature 1 discloses a card connector. In this document, a substrate 30 is provided separately from the case 11, an elastic arm 41 is provided on the substrate 30 to contact the terminals of the second type card, and an elastic arm 41 is provided to contact the terminals of the third type card. 42 (see paragraph 0013 of the same document). Conductive terminals 43 attached to the case 11 are in contact with the terminals of the first type card.

Utility Model Registration No. 3103740

In order to further reduce the thickness of card connectors, it is being considered to reduce the thickness of substrates that support contact terminals. However, when the thickness is reduced, the substrate itself tends to bend, and there is a possibility that sufficient mechanical strength cannot be obtained by itself. Even if a metal reinforcing member is used to compensate for this point, the electrical characteristics of the card connector may be affected, especially in high frequency applications. The inventor of the present application has found a new problem of promoting further thinning of the card connector while avoiding or suppressing deterioration of the electrical characteristics of the card connector.

A card connector according to an aspect of the present disclosure has two or more contact terminals, an insulator supporting the two or more contact terminals, and two or more wires individually connected to the two or more contact terminals. It includes an insulator and a metal cladding at least partially covering the insulator. The metal coating is connected to a predetermined potential and attached to the insulator in such a manner that variations in the distance between the metal coating and the insulator are reduced.

The card connector can be a card connector for one or more memory cards.

In some embodiments, the metal cladding and insulator are joined at multiple joints. Although not necessarily limited to this, the coupling portion is provided in at least one opening provided in one of the metal cladding and the insulator, and is provided in the other of the metal cladding and the insulator, is introduced into the opening, and is introduced into the metal cladding and the insulator. It includes at least one locking portion that is locked by one of the insulators. At least one locking portion is locked by the outer peripheral portion of the opening. Additionally or alternatively, the two or more wires include at least one wire having a protrusion projecting into the opening, the at least one locking portion being locked within the opening by the projection, and the metallization and the wire. are electrically connected. Advantageously, the metallization and the wiring are electrically connected at two or more of the joints included in the plurality of joints.

In a preferred form, the insulator is provided with an opening and the metal cladding is provided with a stop. A locking portion is introduced into the opening and subsequently locked by the insulator or wire depending on the relative displacement between the metal cladding and the insulator.

In some embodiments, the two or more contact terminals include first and second groups of contact terminals, and the plurality of couplings are on axes extending intermediate regions of the first and second groups of contact terminals. It includes one or more joints that are positioned. The plurality of bonds may include two or more bonds positioned to sandwich both the first and second groups of contact terminals. Additionally or alternatively, the plurality of couplings may include two or more couplings positioned to sandwich two or more wires. A metallization may be electrically connected to at least one trace included in the two or more traces.

A method for manufacturing a card connector according to an aspect of the present disclosure includes:
a step of manufacturing, by injection molding, an insulator in which two or more contact terminals and two or more wires individually connected to the two or more contact terminals are embedded;
including the step of attaching a metal cladding to the insulator;
The metal cladding is attached to the insulator in a manner that reduces variations in the spacing between the metal cladding and the insulator.

In some embodiments, the method of manufacturing the card connector further includes electrically connecting the metallization material to at least one wire included in the two or more wires. In some embodiments, the metallization is electrically connected to the at least one wire concurrently with attaching the metallization to the insulator.

According to one aspect of the present disclosure, it is possible to promote further thinning of the card connector while avoiding or suppressing deterioration of the electrical characteristics of the card connector.

1 is a schematic perspective view of a card connector according to one aspect of the present disclosure, also showing a memory card to be inserted into the card connector; FIG. 1 is a schematic exploded perspective view of a card connector according to one aspect of the present disclosure; FIG. The dashed-dotted line indicates the locus of movement of the locking portion of the metal cladding until it is introduced into the opening of the insulator. 1 is a schematic top view of a card connector according to one aspect of the present disclosure; FIG. The dashed line schematically indicates the presence of an insulator wire (note that it does not indicate the shape of the wire). An electrical path from contact terminals in the card connector to external connection terminals is schematically shown. 1 is a schematic perspective view of an insulator according to one aspect of the present disclosure, showing the main outer surface of the insulator; FIG. 1 is a schematic perspective view of an insulator according to one aspect of the present disclosure, showing the main inner surface of the insulator; FIG. 1 is a schematic perspective view of a metal cladding according to one aspect of the present disclosure, showing the major outer surface of the metal cladding; FIG. 1 is a schematic perspective view of a metal cladding according to one aspect of the present disclosure, showing the major inner surface of the metal cladding; FIG. FIG. 12 is a schematic top view of a card connector according to one aspect of the present disclosure, showing the location of the cross-section shown in FIGS. 9-11; FIG. 9 is a schematic cross-sectional view of the card connector along X9-X9 in FIG. 8; FIG. 9 is a schematic cross-sectional view of the card connector along X10-X10 in FIG. 8; FIG. 9 is a schematic cross-sectional view of the card connector along X11-X11 in FIG. 8; FIG. FIG. 11 is a schematic cross-sectional view showing the process of locking the locking portion of the metal covering material with the insulator at the location shown in FIG. 10 ; FIG. 5 is a schematic cross-sectional view showing a state in which the locking portion of the metal covering material is introduced into the opening of the insulator; FIG. 4 is a schematic cross-sectional view showing a state in which the locking portion of the metal covering material is locked by the outer peripheral portion of the opening of the insulator; FIG. 12 is a schematic cross-sectional view showing the process of locking the locking portion of the metal covering material with the insulator at the location shown in FIG. 11; FIG. 5 is a schematic cross-sectional view showing a state in which the locking portion of the metal covering material is introduced into the opening of the insulator; FIG. 4 is a schematic cross-sectional view showing a state in which a locking portion of a metal covering material is locked by a protruding portion of wiring within an opening of an insulator; FIG. 4 is a reference diagram showing that a flat plate portion of an insulator that is convexly warped toward the inside of a card connector is corrected by a metal covering material, and FIG. The previous state is shown, and the same figure (b) shows the state after the metal coating material is attached to the insulator. FIG. 4 is a reference diagram showing that a flat plate portion of an insulator that is convexly warped toward the outside of a card connector is corrected by a metal covering material, and FIG. The previous state is shown, and the same figure (b) shows the state after the metal coating material is attached to the insulator.

Various embodiments and features of the present disclosure are described below with reference to FIGS. 1-19. A person skilled in the art can combine each embodiment and/or each feature without undue explanation, and can also understand the synergistic effect of this combination. Redundant explanations among the embodiments will be omitted in principle. The referenced drawings are primarily for the purpose of describing the invention and are simplified for drawing convenience. Each feature is valid not only for the card connector and its manufacturing method disclosed in this specification, but also for other various card connectors and its manufacturing method not disclosed in this specification. be understood as a characteristic.

FIG. 1 is a schematic perspective view of a card connector 2, shown by way of non-limiting example only, and also shows a memory card 4 inserted into the card connector 2. FIG. FIG. 2 is a schematic exploded perspective view of the card connector 2. FIG. FIG. 3 is a schematic top view of the card connector 2. FIG.

The card connector 2 has a receiving space 2S for receiving the memory card 4, and the memory card 4 inserted in the receiving space 2S is electrically connected to a circuit on a board on which the card connector 2 is mounted, for example, a printed wiring board. Connecting. The memory card 4 is, for example, a non-volatile memory card such as an SD memory card, but should not be limited to these. The card connector 2 is incorporated in various electronic devices such as various personal computers, reader/writers, cameras, and video cameras.

As shown in FIG. 2, the card connector 2 has two or more contact terminals 10, an insulator 40 that supports the two or more contact terminals 10, and a metal coating material 50 that at least partially covers the insulator 40. . Each contact terminal 10 has a contact portion 17 that can elastically contact the terminal 6 of the memory card 4 . The insulator 40 has two or more wires 20 , typically internal wires, individually connected to two or more contact terminals 10 . By attaching the metal coating material 50 to the insulator 40 , the insulator 40 is mechanically supported by the metal coating material 50 . As will be understood from the description below, the metal coating 50 is attached to the insulator 40 in such a manner that variations in the distance between the metal coating 50 and the insulator 40 are reduced.

The contact terminal 10 is made of a conductive material, for example, one or more metals such as gold, silver, copper, and aluminum, and at least the surface of the contact terminal 10 is plated. The insulator 40 is made of a material having an appropriate dielectric constant, and includes one or more plastic materials such as phenol resin, epoxy resin, fluororesin, and polyolefin resin. Metal cladding 50 is made of one or more metals such as copper, copper alloys, aluminum, aluminum alloys, iron, and stainless steel.

In this embodiment, the contact terminals 10 are embedded in the insulator 40 by molding. , or may be glued together. The insulator 40 can optionally also support the external connection terminals 30 . As with the contact terminals 10, the external connection terminals 30 are embedded in the insulator 40, press-fitted, or adhered with an adhesive. Since the insulator 40 supports the contact terminals 10 and has the wiring 20 connected to the contact terminals 10, it can also be called a wiring substrate.

FIG. 3 schematically shows an electrical path from the contact terminal 10 to the external connection terminal 30 in the card connector 2. As shown in FIG. In the figure, dashed lines schematically indicate the existence of the wiring 20 of the insulator 40, especially the internal wiring. Note, however, that the dashed lines do not indicate the shape of the internal wiring. In order to distinguish each contact terminal 10, the reference numeral 10 is appended with a to q. The wiring 20 and the external connection terminals 30 are also the same. The contact terminal 10a is connected to the external connection terminal 30a through the wiring 20a. The same applies to contact terminals 10b-10q, wirings 20b-20q, and external connection terminals 30b-30q.

It should be noted that the number of terminals provided on the card connector 2 is not limited to 17 in the illustrated example, but varies according to the type of memory card 4 and the number of memory cards 4 inserted into the card connector 2. Although FIG. 1 illustrates the card connector 2 adapted for one memory card 4, a configuration in which the card connector 2 is adapted for two or more memory cards 4 is also envisioned. In some cases, at least two memory cards are inserted into card connector 2 . In this case, two memory cards are inserted into the card connector 2 in such a manner that the card surfaces provided with the terminals face opposite sides in the thickness direction of the card connector 2 .

4 and 5 are schematic perspective views of insulator 40 showing major outer surface 41 of insulator 40 and major inner surface 42 of insulator 40, respectively. 6 and 7 are schematic perspective views of metal cladding 50 showing major outer surface 51 and major inner surface 52 of metal cladding 50, respectively. FIG. 8 is a schematic top view of the card connector 2, showing the position of the cross section shown in FIGS. 9-11. 9 is a schematic cross-sectional view of the card connector 2 taken along line X9-X9 in FIG. 8. FIG. 10 is a schematic cross-sectional view of the card connector along X10-X10 in FIG. 8. FIG. 11 is a schematic cross-sectional view of the card connector along X11-X11 in FIG. 8. FIG.

In this specification, the side closer to the receiving space 2S of the card connector 2 is the inner side, and the side farther from the receiving space 2S of the card connector 2 is the outer side. Similarly, the inside of the card connector means the direction toward the receiving space 2S of the card connector 2. As shown in FIG. The card connector outside means the direction away from the receiving space 2S of the card connector 2. As shown in FIG.

In order to more accurately describe the structure of the card connector 2, and in short the insulator 40 and the metallization 50, the directions are defined as shown in FIG. A double-headed arrow extending between letters T and B indicates the thickness direction (or vertical direction). A double-headed arrow extending between letters L and Ri indicates the width direction (or left-right direction). A double-headed arrow extending between letters F and Re indicates the insertion/removal direction (or the front-rear direction). Note that each direction can be redefined based on other descriptions in this specification.

The insulator 40 has a flat plate portion 40a and one or more side wall portions 40b. In the illustrated example, the insulator 40 has two side wall portions 40b extending in the insertion/removal direction, and a plurality of external connection terminals 30 are embedded in each side wall portion 40b. The insulator 40 has one side wall portion 40b extending in the width direction, and a plurality of external connection terminals 30 are also embedded in this side wall portion 40b. The thickness of the flat plate portion 40a is defined by a main outer surface 41 and a main inner surface 42 perpendicular to the thickness direction.

Openings, for example, openings 40p and 40q, are formed in the flat plate portion 40a to avoid interference with the contact terminals 10 that are displaced as the memory card 4 is inserted into and removed from the card connector 2. As shown in FIG. Each contact terminal 10 is separated from the flat plate portion 40a and the main inner surface 42 as it extends in the insertion/removal direction. The contact portion 17 of the contact terminal 10 is spaced apart from the main inner surface 42 of the insulator 40, so that contact with the terminal 6 of the memory card 4 can be ensured (see FIG. 9). Each contact terminal 10 is elastically deformable, displaces from the initial position to the displacement position when the memory card 4 is inserted, and displaces from the displacement position to the initial position when the memory card 4 is pulled out.

As shown in FIG. 5 , the contact terminals 10 include a first group 11 , a second group 12 and a third group 13 of contact terminals 10 . In other words, the contact terminals 10 are divided into a first group 11, a second group 12 and a third group 13. As shown in FIG. The first group 11 and the second group 12 are arranged symmetrically. The number of contact terminals 10 included in the first group 11 is equal to the number of contact terminals 10 included in the second group 12, but is not necessarily limited to this. The number of contact terminals 10 included in the third group 13 is greater than the number of contact terminals 10 included in each of the first group 11 and the second group 12 .

The external connection terminals 30 include a first group 31 , a second group 32 and a third group 33 of the external connection terminals 30 similarly to the contact terminals 10 . The wires 20 of the insulator 40 similarly include a first group 21, a second group 22 and a third group 23 of wires 20 (see FIG. 3). The first group 31 and the second group 32 of the external connection terminals 30 are provided on the side wall portion 40b provided so as to sandwich the memory card 4 in the width direction. A third group 33 of the external connection terminals 30 is provided on the side wall portion 40b extending in the width direction orthogonal to the insertion direction of the memory card 4. As shown in FIG.

The metal coating material 50 has a flat plate portion 50a and one or more side wall portions 50b. Typically, the metal coating material 50 is manufactured by punching and bending a metal plate. A metal coating material 50 is provided on the outside of the insulator 40 and covers the main outer surface 41 thereof. A configuration is also envisioned in which the metal coating 50 is provided inside the insulator 40 and covers the main inner surface 42 thereof. The thickness of the flat plate portion 50a is defined by a main outer surface 51 and a main inner surface 52 perpendicular to the thickness direction. Openings, for example, openings 50p and 50q, are formed in the flat plate portion 50a to avoid interference with the contact terminals 10 that are displaced as the memory card 4 is inserted into and removed from the card connector 2 (see FIGS. 6 and 7).

The metallization material 50 is not floating but is connected to a predetermined potential, typically ground potential. The ground potential is typically the ground potential of the board on which the card connector 2 is mounted, but is not limited to this, and may be the ground potential of another device or board. Advantageously, metallization 50 is electrically connected to at least one ground wire included in two or more wires 20 . Thereby, the ground level is stabilized, and the quality of the signal (for example, high frequency signal) transmitted through the wiring 20 is improved. Metallization 50 may serve as a microstrip line ground plane for signal traces included in two or more traces 20 . Additionally or alternatively, metal cladding 50 may function as an electromagnetic shield. In FIG. 3, contact terminals 10a, 10d, 10e, 10h, etc. are connected to the ground potential. Wirings 20a, 20d, 20e, and 20h are also connected to the ground potential. External connection terminals 30a, 30d, 30e, and 30h are also connected to the ground potential. The wirings 20b, 20c, 20f, and 20g are signal wirings and are bent at one point.

When the metal coating material 50 is connected to a predetermined potential, typically ground potential, the signal wires 20b, 20c, 20f, and 20g included in the insulator 40 are connected to the signal wires 20b, 20c, 20f, and 20g and the metal coating. A parasitic capacitance corresponding to the spacing of the members 50 is connected. A change in the value of the parasitic capacitance along the length direction of the signal wiring, which is a distributed constant line, may result in failure to achieve a target return loss for a specific frequency in the transmission of high frequency signals.

In this embodiment, the metal coating 50 is attached to the insulator 40 in such a manner that variations in the distance between the metal coating 50 and the insulator 40 are reduced. As a result, it is possible to achieve the target electrical characteristics of the card connector 2 while promoting the thickness reduction of the card connector 2 . For example, a targeted return loss can be achieved in the transmission of high frequency signals. It should be noted that reducing the variation in the distance between the metal coating material 50 and the insulator 40 is equivalent to attaching the metal coating material 50 to the insulator 40 along the main outer surface 41 of the insulator 40 . The distance between the metal cladding 50 and the insulator 40 typically means the distance between the main outer surface 41 of the insulator 40 and the main inner surface 52 of the metal cladding 50, but is not limited to this.

Various coupling means can be employed, such as fasteners (e.g., bolts, nuts, screws, etc.), adhesives (UV curable resins, thermosetting resins, etc.), and mechanical couplings (such as a combination of protrusions and recesses). . For example, the flat plate portion 50a of the metal coating material 50 and the flat plate portion 40a of the insulator 40 are joined at two or more points by one or two or more suitable joining or joining techniques, thereby Variation in the distance between the insulator 40 and the metal coating material 50 is reduced. Whether the insulator 40 follows the metal cladding 50 or the metal cladding 50 follows the insulator 40 or both depends on the flexibility of the insulator 40 and the flexibility of the metal cladding 50. depends on the relative relationship of Again, the combination of insulator 40 and metallization 50 provides the required mechanical strength.

Although not necessarily limited to this, the metal covering material 50 and the insulator 40 are joined at a plurality of joints 70, and variations in the distance between the metal covering material 50 and the insulator 40 are reduced. Mechanical coupling may be employed to improve manufacturing efficiency, reduce material costs, or for other purposes. Advantageously, the joint 70 is provided in at least one opening 71 in one of the metallization 50 and the insulator 40 and in the other of the metallization 50 and the insulator 40 and is introduced into the opening 71, It includes at least one locking portion 73 that is locked by one of the metal cladding 50 and the insulator 40 .

A locking portion 73 is introduced into the opening 71 and subsequently locked by the insulator 40 upon relative displacement between the cladding 50 and the insulator 40 . The locking portion 73 is locked by the outer peripheral portion 72 (see FIG. 10) of the opening 71 . Additionally or alternatively, the locking portion 73 is locked by the protruding portion 26 (see FIG. 11) of the wiring 20 that protrudes into the opening 71, so that the metal coating material 50 and the wiring 20 (typically ground wiring) are connected. electrically connected. It should be noted that locking the locking portion 73 by the insulator 40 includes locking the locking portion 73 by the wiring 20 .

In addition to the form in which the insulator 40 is provided with the opening 71 and the metal coating material 50 is formed with the engaging portion 73, there is also the form in which the metal coating material 50 is formed with an opening and the insulator 40 is formed with the engaging portion. is assumed. In addition to the mechanical coupling between the metal coating material 50 and the insulator 40 at the coupling portion 70 , the metal coating material 50 and the insulator 40 and, in short, the wiring 20 can be electrically coupled. Advantageously, the metallization 50 and the wiring 20 (typically the ground wiring) are electrically connected at two or more joints 70 . Various aspects are assumed for the electrical connection between the metal coating material 50 and the wiring 20 (typically ground wiring). A form in which a concave portion is formed in the insulator 40 to locally expose the wiring 20 and ensure contact with the metal coating material 50 is assumed. For mechanical and electrical connection between the metallization 50 and the wiring 20 at the joint 70 , it is advantageous for the wiring 20 to have a protrusion 26 protruding into the opening 71 of the insulator 40 .

FIG. 12 is a schematic cross-sectional view showing the process of locking the locking portion 73 of the metal coating material 50 with the insulator 40 in the coupling portion 70 shown in FIG. FIG. 13 is a schematic cross-sectional view showing a state in which the engaging portion 73 of the metal coating material 50 is introduced into the opening 71 of the insulator 40. As shown in FIG. FIG. 14 is a schematic cross-sectional view showing a state in which the locking portion 73 of the metal coating material 50 is locked by the outer peripheral portion 72 of the opening 71 of the insulator 40. As shown in FIG. 15A and 15B are schematic cross-sectional views showing the process of locking the locking portion 73 of the metal covering material 50 by the insulator 40 in the connecting portion 70 shown in FIG. FIG. 16 is a schematic cross-sectional view showing a state in which the engaging portion 73 of the metal coating material 50 is introduced into the opening 71 of the insulator 40. As shown in FIG. FIG. 17 is a schematic cross-sectional view showing a state in which locking portion 73 of metal coating material 50 is locked by projecting portion 26 of wiring 20 in opening 71 of insulator 40 .

The locking portion 73 is introduced into the opening 71, and then the metal coating material 50 is slid against the insulator 40 in the insertion/removal direction. The material 50 is slid. Thereby, the metal coating material 50 is attached to the insulator 40 . In other words, the insulator 40 and the metal coating material 50 are joined at the plurality of joints 70 . Note that the opening 71 and the locking portion 73 extend in the insertion/removal direction.

As shown in FIG. 14, when the outer peripheral portion 72 and the locking portion 73 are overlapped in the thickness direction, the locking portion 73 does not protrude from the main inner surface 42 of the insulator 40 into the receiving space 2S. This is because the outer peripheral portion 72 is thinned and a space 76 for receiving the engaging portion 73 is formed in the insulator 40 . This space 76 is in spatial communication with the receiving space 2S. The thickness of the laminated portion of the outer peripheral portion 72 and the locking portion 73 is within the thickness range of the insulator 40 . The features described in this paragraph naturally contribute to making the card connector 2 thinner.

As shown in FIG. 17, when the projecting portion 26 and the engaging portion 73 are overlapped in the thickness direction, the engaging portion 73 does not protrude from the main inner surface 42 of the insulator 40 into the receiving space 2S. This is because the tip portion 26p of the projecting portion 26 is displaced from the main inner surface 42 of the insulator 40 toward the main outer surface 41 side, and accordingly, the space 76 for receiving the locking portion 73 is formed.

Each of the projecting portion 26 and the locking portion 73 is a metal portion and has an elastic force. Therefore, when the projecting portion 26 and the engaging portion 73 are overlapped, they are in elastic contact with each other. Specifically, the projecting portion 26 pushes the locking portion 73 toward the inside of the card connector along the thickness direction, and the locking portion 73 pushes the projecting portion 26 toward the outside of the card connector. The insulator 40 follows the protrusion 26 and is pushed toward the metal coating material 50 (outside the card connector) around the contact point between the protrusion 26 and the locking part 73 , and the metal coating material 50 contacts the locking part 73 . It is subsequently pushed toward the insulator 40 (inside the card connector). In this way the gap (potentially) existing between the insulator 40 and the metal cladding 50 is reduced. Optionally, for this purpose or for more reliable electrical contact, a protrusion 77 may be formed on the contact surface of the locking portion 73 as shown in FIG.

By increasing the number of joints 70, adhesion between the metal coating material 50 and the insulator 40 is promoted. However, the coupling portion 70 cannot be freely arranged within the limited size of the card connector 2 . There are various restrictions in terms of thinning the card connector 2 and securing its functions. Therefore, it is advantageous to provide the joint 70 in a location that effectively reduces any warping or bending that may occur in the insulator 40 or the cladding 50 .

A locking portion 73 of the metal coating material 50 is locked by an outer peripheral portion 72 of an opening 71 of the insulator 40 at one connecting portion 70 indicated by a dotted line circle in the center of FIG. 8 (see FIG. 10). At five coupling portions 70 indicated by dashed circles in FIG. 8, locking portions 73 of the metal coating material 50 are locked in openings 71 of the insulator 40 by the protruding portions 26 of the ground wiring (see FIG. 11). Two coupling portions 70 are provided on an axis AX extending through the intermediate regions of the first and second groups 11 and 12 of the contact terminals 10 . It is possible to cope with the case where the degree of warpage of the insulator 40 is large on the central side of the insulator 40 in the plane orthogonal to the thickness direction. Advantageously, a joint 70 is also provided at a location that flanks both the first and second groups 11, 12 of contact terminals. It is also advantageous to provide the coupling portion 70 at a position sandwiching two or more wirings 20 . For example, referring to FIG. 3, wires 20b, 20c are bent between contact terminals 10b, 10c and external connection terminals 30b, 30c. The straight lines of the wires 20b and 20c on the side of the external connection terminals 30b and 30c are sandwiched between the coupling portions 70b and 70c shown in FIG.

Without connecting the metal coating material 50 to the ground wiring of the wiring 20, while setting the metal coating material 50 to a predetermined potential, for example, the ground potential by another method, the distance between the insulator 40 and the metal coating material 50 is increased. A form that reduces variation is also envisioned.

A supplementary description will be made with reference to FIGS. 18 and 19. FIG. FIG. 18 is a reference diagram showing that the flat plate portion 40a of the insulator 40 which is warped in a convex shape toward the inside of the card connector is corrected by the metal coating material 50. As shown in FIG. FIG. 19 is a reference diagram showing that the flat plate portion 40a of the insulator 40 that is convexly warped toward the outside of the card connector is corrected by the metal coating material 50. As shown in FIG. As can be seen from FIGS. 18 and 19, after the metal coating material 50 is attached to the insulator 40, the flat plate portion 40a of the insulator 40 and the flat plate portion 50a of the metal coating material 50 are not necessarily completely flat. No need. A mode in which the flat plate portion 40a of the insulator 40 and the flat plate portion 50a of the metal coating material 50 are slightly curved after the metal coating material 50 is attached to the insulator 40 is also conceivable. Even in such a form, the gap between the insulator 40 and the metal coating material 50 remains the same in the plane intersecting the thickness direction. It should be noted that the form of initial warpage that occurs in the insulator 40 is not limited to the form shown in FIGS.

Insulator 40 can be manufactured by injection molding to reduce the thickness of insulator 40 . Advantageously, the contact terminals 10 and the wirings 20 (and optionally the external connection terminals 30) are embedded in the insulator 40 by insert molding. Advantageously, metal cladding 50 is electrically connected to at least one wire 20 (typically a ground wire) at the same time as the step of attaching metal cladding 50 to insulator 40 . A method of manufacturing a card connector according to the present disclosure will be clearly and fully understood by those skilled in the art in light of the above description and appended claims, and therefore redundant description will be omitted.

Various modifications to the embodiments can be made by those skilled in the art in light of the above teachings. Reference signs in the claims are for reference only and should not be construed for the purpose of limiting the scope of the claims.

2 Card connector 4 Memory card 10 Contact terminal 17 Contact part 20 Wiring 30 External connection terminal 40 Insulator 50 Metal covering material

Claims (11)

two or more contact terminals (10);
An insulator (40) supporting the two or more contact terminals (10) and having two or more internal wirings (20) individually connected to the two or more contact terminals (10) ( 40) and
A metallic cladding (50) for at least partially covering the insulator (40), the metallic cladding comprising at least a pair of side walls (50b) and a flat plate (50a) provided therebetween. A card connector (2) comprising (50),
The metallic covering (50) is connected to a predetermined potential, and the insulator (40) is connected in such a manner that variations in the distance between the metallic covering (50) and the insulator (40) are reduced. are attached to each other by a plurality of joints (70), and the plurality of joints (70) are provided at different positions in the plane of the flat plate portion (50a) of the metal covering (50). ,
each joint (70) of the plurality of joints (70),
at least one opening (71) in one of said metallic cladding (50) and said insulator (40);
provided on the other of said metallic covering (50) and said insulator (40), introduced into said opening (71) and locked by one of said metallic covering (50) and said insulator (40) including at least one locking portion (73) that is
The two or more internal wirings (20) include at least one internal wiring (20) having a projection (26) projecting into the opening (71),
Said at least one locking portion (73) is locked by said protrusion (26) in said opening (71) so that said metal covering (50) and said at least one internal wiring (20) are electrically connected. card connector . two or more contact terminals (10);
An insulator (40) supporting the two or more contact terminals (10) and having two or more internal wirings (20) individually connected to the two or more contact terminals (10) ( 40) and
A metallic cladding (50) for at least partially covering the insulator (40), the metallic cladding comprising at least a pair of side walls (50b) and a flat plate (50a) provided therebetween. A card connector (2) comprising (50),
The metallic covering (50) is connected to a predetermined potential, and the insulator (40) is connected in such a manner that variations in the distance between the metallic covering (50) and the insulator (40) are reduced. are attached to each other by a plurality of joints (70), and the plurality of joints (70) are provided at different positions in the plane of the flat plate portion (50a) of the metal covering (50). ,
A card connector, wherein the metal covering material (50) and the internal wiring (20) are electrically connected at two or more joints (70) included in the plurality of joints (70). two or more contact terminals (10);
An insulator (40) supporting the two or more contact terminals (10) and having two or more internal wirings (20) individually connected to the two or more contact terminals (10) ( 40) and
A metallic cladding (50) for at least partially covering the insulator (40), the metallic cladding comprising at least a pair of side walls (50b) and a flat plate (50a) provided therebetween. A card connector (2) comprising (50),
The metallic covering (50) is connected to a predetermined potential, and the insulator (40) is connected in such a manner that variations in the distance between the metallic covering (50) and the insulator (40) are reduced. are attached to each other by a plurality of joints (70), and the plurality of joints (70) are provided at different positions in the plane of the flat plate portion (50a) of the metal covering (50). ,
The two or more internal wirings (20) include a pair of signal wirings (20b, 20c, 20f, 20g) and a pair of ground wirings (20a) sandwiching the pair of signal wirings (20b, 20c, 20f, 20g). , 20d, 20e, 20h),
The plurality of coupling portions (70) sandwich a total of four internal wirings consisting of the pair of signal wirings (20b, 20c, 20f, 20g) and the pair of ground wirings (20a, 20d, 20e, 20h). A card connector comprising at least two mating portions (70) positioned on the . The two or more contact terminals (10) comprise a first group of contact terminals (11), a second group of contact terminals (12) and a third group of contact terminals (13), wherein the first group of contacts The terminals (11) and the second group of contact terminals (12) are individually connected to the pair of signal wirings (20b, 20c, 20f, 20g) and the pair of ground wirings (20a, 20d, 20e, 20h), respectively. including four contact terminals connected to
4. The plurality of coupling portions (70) are not provided so as to sandwich the third group of contact terminals (13) and/or the internal wiring connected to the third group of contact terminals (13). card connector described in . the two or more contact terminals (10) comprise first and second groups of contact terminals (11, 12);
The plurality of coupling portions (70) includes one or more coupling portions (70) positioned on an axis (AX) extending through an intermediate region of the first and second groups of contact terminals (11, 12). Item 5. The card connector according to any one of Items 1 to 4 . two or more contact terminals (10);
An insulator (40) supporting the two or more contact terminals (10) and having two or more internal wirings (20) individually connected to the two or more contact terminals (10) ( 40) and
A metallic cladding (50) for at least partially covering the insulator (40), the metallic cladding comprising at least a pair of side walls (50b) and a flat plate (50a) provided therebetween. A card connector (2) comprising (50),
The metallic covering (50) is connected to a predetermined potential, and the insulator (40) is connected in such a manner that variations in the distance between the metallic covering (50) and the insulator (40) are reduced. are attached to each other by a plurality of joints (70), and the plurality of joints (70) are provided at different positions in the plane of the flat plate portion (50a) of the metal covering (50). ,
the two or more contact terminals (10) comprise first and second groups of contact terminals (11, 12) arranged adjacently;
A card connector, wherein the plurality of coupling portions (70) includes two or more coupling portions (70) positioned to sandwich both the first and second groups of contact terminals (11, 12). said plurality of coupling portions (70) further comprising one or more coupling portions (70) positioned on an axis (AX) extending through an intermediate region of said first and second groups of contact terminals (11, 12); A card connector according to claim 6 . each joint (70) of the plurality of joints (70),
at least one opening (71) in one of said metallic cladding (50) and said insulator (40);
provided on the other of said metallic covering (50) and said insulator (40), introduced into said opening (71) and locked by one of said metallic covering (50) and said insulator (40) A card connector according to any one of claims 2-4, 6 and 7 , comprising at least one locking portion (73) which 9. The card connector according to claim 8 , wherein said at least one locking portion (73) is locked by an outer peripheral portion (72) of said opening (71). A method for manufacturing a card connector (2), comprising:
An insulator (40) in which two or more contact terminals (10) and two or more internal wires (20) individually connected to the two or more contact terminals (10) are embedded is manufactured by injection molding. process and
attaching a metallic cladding (50) comprising at least a pair of side walls (50b) and a flat plate (50a) therebetween to said insulator (40);
A step of electrically connecting the metallic covering material (50) to at least one internal wiring (20) included in the two or more internal wirings (20);
The metallic cladding (50) is provided with a plurality of joints (70) to the insulator (40) in a manner that reduces variations in spacing between the metallic cladding (50) and the insulator (40). ), and the plurality of coupling portions (70) are provided at different positions within the plane of the flat plate portion (50a) of the metal covering member (50). electrically connecting the metallic cladding (50) to the at least one internal wiring (20) concurrently with the step of attaching the metallic cladding (50) to the insulator (40); The manufacturing method of the card connector according to claim 10 .

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