JP7293461B1 - Thermal analysis support device, thermal analysis support method, thermal analysis support program, and recording medium - Google Patents

Abstract

A thermal analysis support device, a thermal analysis support method, a thermal analysis support program, and a recording medium capable of obtaining an index for identifying a bottleneck in an early stage of a design process are provided. Kind Code: A1 A thermal analysis support device for assisting identification of a bottleneck in a heat dissipation path based on a thermal circuit model representing the heat dissipation path, comprising a temperature difference and heat resistance at each thermal resistance in the thermal circuit model. A communication unit 5 (acquisition unit) that acquires each value of the flow rate, an integration calculation unit 30 that calculates the product of each value of the temperature difference and the heat flow rate acquired by the communication unit 5 (acquisition unit) for each thermal resistance, Prepare. [Selection drawing] Fig. 1

Description

Article 30, Paragraph 2 of the Patent Act applies Published at the individual consultation meeting of the 60th Open Seminar of the Thermal Design Anything Counseling Room on December 9, 2021

The present disclosure relates to a thermal analysis support device, a thermal analysis support method, a thermal analysis support program, and a recording medium that support identification of bottlenecks with the lowest heat transfer efficiency in heat dissipation paths of devices such as electronic devices and electronic equipment.

As a method for identifying the bottleneck with the lowest heat transfer efficiency in the heat dissipation path of electronic devices, electronic equipment, etc., it is known to identify the bottleneck based on the product of the magnitude of the heat flux vector and the magnitude of the temperature gradient vector. (See Patent Document 1, for example).

U.S. Patent Application Publication No. 2011/0268147 JP-A-4-7675

By the way, the heat flux is the amount of heat that traverses a unit area in a unit time. If the technique described in Patent Document 1 is to be adopted, it is necessary to grasp the cross-sectional area of each member on the heat dissipation path. . For this reason, there is a problem that the above Patent Document 1 is difficult to apply at an early stage of the design process when the specific shape and the like of the equipment are not determined.

Therefore, the inventor of the present invention focused on the thermal network method (see, for example, Patent Document 2) while searching for a means for solving the above problem. The thermal network method is a thermal analysis method that replaces the heat dissipation path with a thermal circuit composed of thermal resistance, etc., based on the similarity of heat conduction and electrical conduction, and calculates the temperature and heat flow using the heat flow as a conserved quantity. is. The thermal network method is widely used from an early stage of the design process because it does not require a 3D model or the like.

As a result of intensive research, the present inventors have found that bottlenecks can be identified early in the design process by using calculation results obtained from the thermal network method, and have completed the present invention.

The present disclosure has been made to solve the above conventional problems, and is a thermal analysis support device, a thermal analysis support method, and a thermal analysis that can obtain an index for identifying a bottleneck at an early stage of the design process. The purpose is to provide support programs and recording media.

In order to achieve the above object, a thermal analysis support device described in the present application supports identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation path based on a thermal circuit model representing the heat dissipation path. an acquisition unit that acquires each value of the temperature difference and the heat flow in each thermal resistance in the thermal circuit model; and an accumulating unit that calculates for each thermal resistance.

Another thermal analysis support device described in the present application is a thermal analysis support device that supports identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation route based on a thermal circuit model representing the heat dissipation route, a data calculation unit for calculating each value of temperature difference and heat flow in each thermal resistance in the thermal circuit model; and an integration calculation unit for calculating the following.

The thermal analysis support apparatus may further include a display unit that displays, in descending order, the product of each value of the temperature difference and the heat flow calculated for each of the thermal resistances by the integration calculation unit.

In the thermal analysis support device, an index calculated for each thermal resistance as a ratio of the product to the largest product among the products calculated for each thermal resistance by the integration calculation unit as a bottleneck index expressed as a percentage. A calculator may be further provided.

The thermal analysis support apparatus may further include a display unit that displays the bottleneck index calculated for each thermal resistance by the index calculation unit in descending order.

The thermal analysis support apparatus may further include a determination unit that determines a thermal resistance that is a candidate for the bottleneck among the thermal resistances based on the product calculated for each thermal resistance by the integration calculation unit. good.

In the thermal analysis support device, the determination unit may determine, as the bottleneck candidate, a thermal resistance corresponding to a relatively large product among the products calculated for each of the thermal resistances by the integration calculation unit. .

The thermal analysis support apparatus may further include a display unit for emphasizing and displaying the thermal resistance determined as the bottleneck candidate by the determination unit on the thermal circuit model.

The thermal analysis support method described in the present application is a thermal analysis support method for a thermal analysis support device that supports identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation path based on a thermal circuit model representing the heat dissipation path. an acquisition step in which the acquisition unit of the thermal analysis support device acquires each value of the temperature difference and the heat flow rate at each thermal resistance in the thermal circuit model; and an integration calculation step of calculating a product of the acquired values of the temperature difference and the heat flow for each of the thermal resistances.

In the thermal analysis support method, the determination unit of the thermal analysis support device determines thermal resistances that are candidates for bottlenecks among the thermal resistances based on the products calculated for the respective thermal resistances in the cumulative calculation step. A determination step of determining may be further included.

A thermal analysis support program described in the present application causes a computer to execute the thermal analysis support method.

A recording medium described in the present application is characterized by recording the thermal analysis support program.

The present disclosure provides indicators for identifying bottlenecks early in the design process.

1 is a block diagram showing a thermal analysis support device according to Embodiment 1; FIG. It is a figure which shows an example of a thermal circuit model. It is a figure which shows an example of thermal resistance data. It is a figure which shows an example of temperature data. It is a figure which shows an example of heat flow data. 4 is a flow chart showing an example of a processing procedure by the thermal analysis support device according to the first embodiment; FIG. 10 is a diagram showing an example of a result displayed on the display unit according to the first embodiment; FIG. FIG. 8 is a block diagram showing a thermal analysis support device according to Embodiment 2; 9 is a flow chart showing an example of a processing procedure by a thermal analysis support device according to Embodiment 2; FIG. 10 is a diagram showing an example of a result displayed on the display unit according to the second embodiment; FIG. FIG. 11 is a block diagram showing a thermal analysis support device according to Embodiment 3; 14 is a flow chart showing an example of a processing procedure by a thermal analysis support device according to Embodiment 3. FIG. FIG. 12 is a diagram showing an example of results displayed on the display unit according to the third embodiment; FIG. 11 is a block diagram showing a thermal analysis support device according to Embodiment 4; FIG. 20 is a diagram showing part of an example of results displayed on the display unit according to the fourth embodiment;

Embodiments of the present disclosure will be described below with reference to the accompanying drawings. In addition, the same code|symbol is attached|subjected to the same component among each embodiment described below, and the description which overlaps with these components is abbreviate|omitted.

(Embodiment 1)
FIG. 1 is a block diagram showing an example of a thermal analysis support device 1. As shown in FIG.

The thermal analysis support device 1 described in the present application supports identification of the "bottleneck" where the heat transfer efficiency is the lowest in the heat dissipation path of equipment such as electronic devices and electronic equipment. Specifically, the thermal analysis support device 1 calculates indices used by other devices, other programs, users (persons), and the like to identify bottlenecks in heat dissipation paths of devices.

In this embodiment, the thermal analysis support device 1 is configured using a desktop computer, notebook computer, tablet computer, or the like. The thermal analysis support device 1 is communicably connected to the information processing device 2 (see FIG. 1).

The information processing device 2 is, for example, a known circuit simulator or the like used for electric circuit analysis, and uses a known thermal circuit network method, in accordance with Kirchhoff's law, from a thermal circuit model 20 and thermal resistance data 21 to be described below. By constructing and solving simultaneous equations, temperature difference data 22 and heat flow data 23, which will also be described below, are calculated.

FIG. 2 is a diagram showing an example of the thermal circuit model 20. As shown in FIG.

The thermal circuit model 20 is a circuit model representing a heat radiation path in a device, and includes thermal resistances C1, C2, C3, . are connected to each other (see FIG. 2). The thermal circuit model 20 is a model in which a heat dissipation path is modeled after an electric circuit based on the similarity between heat conduction and electric conduction. Hereinafter, for convenience of explanation, the member represented as the thermal resistance in the thermal circuit model 20 may be referred to as "thermal resistance (member)".

FIG. 3 is a diagram showing an example of the thermal resistance data 21. As shown in FIG.

The thermal resistance data 21 is data indicating the thermal resistance value of each thermal resistance in the thermal circuit model 20 (see FIG. 2). The item "thermal resistance Cn" in the thermal resistance data 21 indicates the thermal resistances C1, C2, C3, . The thermal resistance values .theta.1, .theta.2, .theta.3, . The thermal resistance data 21 can be obtained, for example, by calculating using the thermal conductivity of each member in the device, or by measuring the thermal resistance value of each member using a known measuring device. .

FIG. 4A is a diagram showing an example of the temperature difference data 22. FIG.

The temperature difference data 22 is data indicating the value of the temperature difference at each thermal resistance in the thermal circuit model 20 (see FIG. 2). The temperature difference refers to the temperature difference between both ends of the thermal resistance (member). For example, the temperature difference T1 at the thermal resistance C1 is the value obtained by subtracting the temperature at the node N1 from the temperature at the node N2, and the temperature difference T3 at the thermal resistance C3 is the value obtained by subtracting the temperature at the node N2 from the temperature at the node N3. be. The item "thermal resistance Cn" in the temperature difference data 22 indicates the thermal resistances C1, C2, C3, . T2, T3, . . . are shown in units of degrees Celsius (see FIG. 4A).

FIG. 4B is a diagram showing an example of the heat flow data 23. As shown in FIG.

The heat flow data 23 is data indicating the value of the heat flow at each thermal resistance in the thermal circuit model 20 (see FIG. 2). Heat flow refers to the amount of heat that flows per unit time. The item "thermal resistance Cn" in the heat flow data 23 indicates the thermal resistances C1, C2, C3, . , P2, P3, . . . are shown in units of W (see FIG. 4B).

The thermal analysis support device 1 includes a processing unit 3, a storage unit 4, a communication unit 5 (acquisition unit), and a display unit 6 (see FIG. 1).

The processing unit 3 is implemented by, for example, a CPU (Central Processing Unit). Each part of the processing unit 3 is a part of the program 40 stored in the storage unit 4 and is read out under the control of the processing unit 3 to execute processing. In this embodiment, the processing unit 3 has an integration calculation unit 30 (see FIG. 1). The processing by the integration calculator 30 will be described later with reference to a flowchart.

The storage unit 4 is implemented by a memory such as an SSD (Solid State Drive) or HDD (Hard Disk Drive). A program 40 is stored in the storage unit 4 . The storage unit 4 also temporarily stores the output data output by the processing unit 3 . Note that the program 40 is not limited to this, and may be downloaded from a network such as a LAN (Local Area Network).

The communication unit 5 acquires the temperature difference data 22 and the heat flow data 23 from the information processing device 2, and is realized by, for example, a network adapter.

The display unit 6 displays the result of processing, and is realized by, for example, a liquid crystal display.

Next, a processing procedure by the thermal analysis support device 1 according to this embodiment will be described.

FIG. 5 is a flow chart showing an example of a processing procedure by the thermal analysis support device 1. As shown in FIG.

First, in step ST1 (see FIG. 5), the processing unit 3 of the thermal analysis support device 1 acquires the temperature difference data 22 (see FIG. 4A) from the information processing device 2 via the communication unit 5. FIG.

Next, in step ST2 (see FIG. 5), the processing unit 3 acquires heat flow data 23 (see FIG. 4B) from the information processing device 2 via the communication unit 5. FIG.

In step ST3 (see FIG. 5), the integration calculation unit 30 of the processing unit 3 calculates the temperature difference data 22 (see FIG. 4A) acquired in step ST1 and the heat flow data 23 (see FIG. 4B) acquired in step ST2. ), the product (multiplication) of each value of the temperature difference and the heat flow is calculated for each thermal resistance. For example, the integration calculation unit 30 calculates the product (=T1*P1) of the temperature difference T1 and the heat flow rate P1 for the first thermal resistance C1 in the thermal circuit model 20. The product (=T2*P2) of the temperature difference T2 and the heat flow rate P2 is calculated for the th thermal resistance C2.

The product of the values of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculator 30 is a value that serves as an index for identifying the "bottleneck" in the heat dissipation path represented by the thermal circuit model 20. . The reason is as follows.

A bottleneck is a point in a device where the heat transfer efficiency is the lowest. Therefore, improving the heat transfer efficiency of the thermal resistance (member) at the bottleneck contributes to improving the heat radiation efficiency of the entire device. In other words, it can be said that the thermal resistance (member) that contributes to the improvement of the heat radiation efficiency of the entire device by improving the heat transfer efficiency is the bottleneck.

At first glance, it seems that a member having a larger thermal resistance value than other members is suitable as a bottleneck. However, if the thermal resistance value of a member is relatively large but the heat flow is relatively small, even if the heat transfer efficiency of the member is improved, the heat dissipation efficiency of the entire device cannot be expected to be improved. This is analogous to the fact that even if the traffic congestion on back roads, where the traffic volume is low in the first place, is improved, it cannot contribute to the improvement of traffic congestion on main roads.

Similarly, at first glance, it seems that a member having a large temperature difference compared to other members is suitable as a bottleneck. However, if the heat flow is relatively small even if the temperature difference in the member is relatively large, even if the heat transfer efficiency of the member is improved, the heat dissipation efficiency of the entire device cannot be expected to be improved.

On the other hand, if both the temperature difference and the heat flow in a member are relatively large, it can be expected that the heat dissipation efficiency of the entire device can be improved by improving the heat transfer efficiency of the member. From this, it can be said that a thermal resistance (member) with a relatively large temperature difference and a relatively large heat flow rate is suitable as a bottleneck. Therefore, the integration calculation unit 30 calculates the product of each value of the temperature difference and the heat flow rate for each thermal resistance as an index for identifying the bottleneck.

In this way, the integration calculation unit 30 calculates the product of the temperature difference and the heat flow for each thermal resistance using the temperature difference data 22 and the heat flow data 23, thereby providing an index for identifying the bottleneck. Obtainable. The thermal circuit model 20 is data that can be acquired early in the design process of the device, and the temperature difference data 22 and the heat flow data 23 derived from the thermal circuit model 20 are also data that can be acquired early in the design process. Therefore, the integration calculator 30 can use the temperature difference data 22 and the heat flow data 23 to calculate the product of each value of the temperature difference and the heat flow for each thermal resistance. This provides an index for identifying bottlenecks early in the design process.

FIG. 6 is a diagram showing an example of results displayed on the display unit 6 according to the first embodiment. In FIG. 6, the item "thermal resistance Cn" indicates the thermal resistances C1, C2, C3, . The products of the values of the temperature difference and the heat flow corresponding to the thermal resistance are sorted in descending order.

In step ST4 (see FIG. 5), the display unit 6 displays the products of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculation unit 30 in descending order (see FIG. 6). Thereby, it is possible to easily visually grasp the thermal resistance in which both the temperature difference and the heat flow are relatively large.

It should be noted that the order of steps ST1 and ST2 is irrelevant.

It should be noted that the thermal circuit model 20 is not limited to the example described above, and may represent the members and the like of the device as thermal resistance and thermal capacity.

Note that the thermal resistance data 21, the temperature difference data 22, the heat flow data 23, and the results displayed on the display unit 6 are not limited to the examples described above, and the thermal resistances C1, C2, C3, . It may be associated with a name or the like.

For example, instead of the temperature difference data 22, the information processing device 2 uses data (nodal temperature data) indicating temperature values at each node in the thermal circuit model 20 (see FIG. 2). ) may be calculated, and in this case, the thermal analysis support device 1 obtains the temperature difference data 22 by calculating the value of the temperature difference in each thermal resistance based on the nodal point temperature data obtained from the information processing device 2. can.

Note that the thermal analysis support device 1 may output the product of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculator 30 to an external device via the communication unit 5 or the like.

(Embodiment 2)
In the following, only the points of the second embodiment of the present disclosure that are different from the first embodiment will be described.

FIG. 7 is a block diagram showing the thermal analysis support device 1 according to the second embodiment. FIG. 8 is a flow chart showing an example of a processing procedure by the thermal analysis support device 1 according to the second embodiment.

In Embodiment 2, the processing unit 3 further includes a BN index calculator 31 (index calculator) (see FIG. 7). Processing by the BN index calculator 31 will be described below with reference to the flowchart of FIG. The processes of steps ST1 to ST3 in the second embodiment are the same as those in the first embodiment (see FIG. 5).

In step ST4 (see FIG. 8), the BN index calculation unit 31 calculates the temperature difference and the temperature difference for the largest product among the products of the values of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculation unit 30 in step ST3. The ratio of the products of the heat flow values is calculated for each thermal resistance as the BN index (bottleneck index) expressed in percentage. For example, if the largest product among the products calculated for each thermal resistance by the integration calculator 30 is the product (=T35*P35) for the 35th thermal resistance C35 in the thermal circuit model 20, the thermal resistance The BN index at C1 is [(T1*P1)/(T35*P35)*100]. Similarly, the BN index for thermal resistance C2 is [(T2*P2)/(T35*P35)*100].

By calculating the BN index for each thermal resistance by the BN index calculator 31 in this way, it is possible to easily compare an index for identifying a bottleneck between thermal resistances.

FIG. 9 is a diagram showing an example of results displayed on the display unit 6 according to the second embodiment. In FIG. 9, the item "thermal resistance Cn" indicates the thermal resistances C1, C2, C3, . are sorted in descending order.

In step ST5 (see FIG. 8), the display unit 6 displays the BN indices calculated for each thermal resistance by the BN index calculator 31 in descending order (see FIG. 9). Thereby, it is possible to easily visually grasp the thermal resistance in which both the temperature difference and the heat flow are relatively large.

Note that the thermal analysis support device 1 may output the BN index calculated for each thermal resistance by the BN index calculator 31 to an external device via the communication unit 5 or the like.

(Embodiment 3)
The third embodiment of the present disclosure will be described below only with respect to the differences from the above-described second embodiment.

FIG. 10 is a block diagram showing the thermal analysis support device 1 according to the third embodiment. FIG. 11 is a flow chart showing an example of a processing procedure by the thermal analysis support device 1 according to the third embodiment.

In Embodiment 3, the processing unit 3 of the thermal analysis support device 1 further has a determination unit 32 (see FIG. 7). Processing by the determination unit 32 will be described below with reference to the flowchart of FIG. 11 . The processes of steps ST1 to ST4 in the third embodiment are similar to those in the second embodiment (see FIG. 8).

In step ST5 (see FIG. 11), the determination unit 32 determines the thermal resistances C1, C2, and C3 based on the product of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculation unit 30 in step ST3. . . , the thermal resistance (member) that is a bottleneck candidate is determined. As a result, when another device, another program, a user (person), or the like identifies a bottleneck, the range to be identified can be narrowed down.

In the present embodiment, the determination unit 32 determines the thermal resistance (member) corresponding to a relatively large product among the products of the temperature difference and the heat flow calculated for each thermal resistance by the cumulative calculation unit 30 as the bottleneck. Judged as a candidate. For example, the determination unit 32 determines a thermal resistance (member) corresponding to a relatively large BN index among the BN indices calculated for each thermal resistance by the BN index calculation unit 31 as a bottleneck candidate. More specifically, the determining unit 32 determines the thermal resistance (in the present embodiment, the figure below) corresponding to the BN index that is equal to or greater than a predetermined threshold value (60 in the present embodiment) among the BN indices corresponding to the respective thermal resistances. 12) are determined as bottleneck candidates.

A thermal resistance (member) where the product of the temperature difference and the heat flow is relatively large is the place where the improvement of the heat dissipation efficiency of the entire device can be most expected by improving the heat transfer efficiency, and it can be said that it is a suitable candidate for the bottleneck. In this manner, the determination unit 32 determines the thermal resistance (member) corresponding to a relatively large product of the products of the temperature difference and the heat flow as a bottleneck candidate, thereby identifying the bottleneck. The range can be narrowed down precisely.

It should be noted that the above threshold value for the BN index is an example and is not limited to this numerical value, and a value of 5 to 100 can be adopted as the threshold value.

FIG. 12 is a diagram showing an example of results displayed on the display unit 6 according to the third embodiment.

In step ST6 (see FIG. 11), the display unit 6 displays the BN indices calculated for each thermal resistance by the BN index calculator 31 in descending order (see FIG. 12). In the present embodiment, the display unit 6 makes the columns of the thermal resistances C35, C31, C20, and C32 determined as bottleneck candidates by the determination unit 32 in step ST5 identifiable (for example, by enclosing them with thick frames). )indicate. This makes it possible to visually grasp the bottleneck candidate easily.

Note that the determination unit 32 is not limited to the example described above, and for example, the determination unit 32 may determine the thermal resistance (member) corresponding to the largest product of the products of the temperature difference and the heat flow as a bottleneck candidate. good. In addition, the determination unit 32 may determine the thermal resistance corresponding to the top several products when the products of the temperature difference and the heat flow corresponding to each thermal resistance are sorted in descending order as bottleneck candidates. good.

(Embodiment 4)
In the following, only the points of the fourth embodiment of the present disclosure that are different from the above-described third embodiment will be described.

FIG. 13 is a block diagram showing the thermal analysis support device 1 according to the fourth embodiment.

In the fourth embodiment, the thermal analysis support device 1 further has functions similar to the functions of the information processing device 2 . In other words, the thermal analysis support device 1 according to the fourth embodiment can be realized by incorporating the program 40 for executing the processing of the processing unit 3 including the integration calculation unit 30 described above into a known circuit simulator or the like. .

In Embodiment 4, the thermal analysis support device 1 has an input unit 7 (see FIG. 13). The input unit 7 is an interface that receives various operations from the user, and is implemented by, for example, a keyboard, touch panel, or the like. Input data including thermal resistance data 21 is input to the input unit 7 .

The processing unit 3 further includes a model generation unit 33 and a data calculation unit 34 (see FIG. 13). The model generation unit 33 generates the thermal circuit model 20 using input data input by the user through the input unit 7 . The data calculation unit 34 uses the thermal resistance data 21 input by the input unit 7 and the thermal circuit model 20 generated by the model generation unit 33 to generate simultaneous equations according to Kirchhoff's law using a known thermal network method. Temperature difference data 22 and heat flow data 23 are calculated by assembling and solving. Since the processing by the model generation unit 33 and the data calculation unit 34 is publicly known, detailed description thereof will be omitted.

The processing procedure in the fourth embodiment is the same as the processing procedure in the third embodiment (see FIG. 11) except for the processes of steps ST1, ST2, ST3 and ST6. Therefore, FIG. 11 is used in the following description.

In steps ST1 and ST2 (see FIG. 11), the data calculation unit 34 of the processing unit 3 combines the thermal resistance data 21 pre-inputted by the input unit 7 with the thermal circuit model 20 pre-generated by the model generation unit 33. Based on this, temperature difference data 22 and heat flow data 23 are calculated. That is, step ST1 and step ST2 are executed substantially simultaneously. In step ST3 (see FIG. 11), the integration calculation unit 30 of the processing unit 3 uses the temperature difference data 22 and the heat flow data 23 calculated in steps ST1 and ST2 to calculate the respective values of the temperature difference and the heat flow. The product (multiplication) of is calculated for each thermal resistance.

FIG. 14 is a diagram showing part of an example of results displayed on the display unit 6 according to the fourth embodiment. In addition, in FIG. 14, illustration of the thermal resistance C20 is omitted for convenience.

In step ST6 (see FIG. 11), the display unit 6 emphasizes the thermal resistances C35, C31, C20, and C32 determined as bottleneck candidates by the determination unit 32 in step ST5 on the thermal circuit model 20 (for example, , surrounded by a thick frame, etc.) (see FIG. 14). This makes it possible to easily visually grasp the bottleneck candidate and the location on the thermal circuit model 20 .

In addition, the display unit 6 designates the thermal resistance C35 having the larger product of the temperature difference and the heat flow rate among the thermal resistances C35, C31, C20, and C32 determined as bottleneck candidates as the thermal resistances C31, C20, and C32. It is displayed with more emphasis (for example, by enclosing it in a frame with a thicker line, etc.) in comparison (see FIG. 14). As a result, among the thermal resistances determined as bottleneck candidates, thermal resistances with relatively large temperature differences and relatively large heat flows can be visually grasped easily on the thermal circuit model 20 .

The above-described embodiments and examples are illustrative in all respects and are not grounds for restrictive interpretation. Therefore, the technical scope of the present disclosure is not to be construed solely by the above-described embodiments and examples, but is defined based on the claims. In addition, all changes within the meaning and range equivalent to the claims are included, and the thermal analysis support device, thermal analysis support method, thermal analysis support program, and thermal analysis support program with such changes are recorded. A recording medium is also included in the technical scope of the present disclosure.

1 thermal analysis support device 2 information processing device 20 thermal circuit model 21 thermal resistance data 22 temperature difference data 23 heat flow data 3 processing unit 30 integration calculation unit 31 BN index calculation unit (index calculation unit)
32 determination unit 33 model generation unit 34 data calculation unit 4 storage unit 40 program 5 communication unit (acquisition unit)
6 display section 7 input section

Claims (12)

A thermal analysis support device that supports identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation path based on a thermal circuit model representing the heat dissipation path,
an acquisition unit that acquires each value of temperature difference and heat flow in each thermal resistance in the thermal circuit model;
A thermal analysis support device, comprising: an integration calculation unit that calculates a product of each value of the temperature difference and the heat flow acquired by the acquisition unit for each of the thermal resistances. A thermal analysis support device that supports identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation path based on a thermal circuit model representing the heat dissipation path,
a data calculation unit that calculates each value of temperature difference and heat flow at each thermal resistance in the thermal circuit model;
A thermal analysis support device, comprising: an integration calculation unit that calculates a product of each value of the temperature difference and the heat flow calculated by the data calculation unit for each of the thermal resistances. The thermal analysis support device according to claim 1 or claim 2,
A thermal analysis support apparatus, further comprising a display unit for displaying, in descending order, the products of the temperature difference and the heat flow calculated for each thermal resistance by the integration calculation unit. The thermal analysis support device according to claim 1 or claim 2,
Further comprising an index calculation unit that calculates, for each thermal resistance, a ratio of the product to the largest product among the products calculated for each thermal resistance by the integration calculation unit as a bottleneck index expressed as a percentage. Characteristic thermal analysis support device. The thermal analysis support device according to claim 4,
A thermal analysis support device, further comprising a display unit that displays the bottleneck index calculated for each thermal resistance by the index calculation unit in descending order. The thermal analysis support device according to claim 1 or claim 2,
A thermal analysis support apparatus, further comprising: a determination unit that determines a thermal resistance that is a candidate for a bottleneck among the thermal resistances based on the product calculated for each thermal resistance by the integration calculation unit. . The thermal analysis support device according to claim 6,
The determination unit is
A thermal analysis support device, wherein a thermal resistance corresponding to a relatively large product among the products calculated for each of the thermal resistances by the integration calculation unit is determined as a candidate for the bottleneck. The thermal analysis support device according to claim 6,
A thermal analysis support device, further comprising a display unit for emphasizing and displaying the thermal resistance determined as the bottleneck candidate by the determination unit on the thermal circuit model. A thermal analysis support method for a thermal analysis support device for supporting identification of a bottleneck with the lowest heat transfer efficiency in a heat dissipation route based on a thermal circuit model representing the heat dissipation route,
an acquisition step in which the acquisition unit of the thermal analysis support device acquires each value of temperature difference and heat flow in each thermal resistance in the thermal circuit model;
and an accumulating step in which the accumulating unit of the thermal analysis support device calculates the product of each value of the temperature difference and the heat flow obtained in the obtaining step for each of the thermal resistances. Analysis support method. The thermal analysis support method according to claim 9,
The determination unit of the thermal analysis support device further includes a determination step of determining a thermal resistance that is a candidate for the bottleneck among the thermal resistances based on the product calculated for each of the thermal resistances in the cumulative calculation step. A thermal analysis support method characterized by: A thermal analysis support program for causing a computer to execute the thermal analysis support method according to claim 9 or 10. A recording medium in which the thermal analysis support program according to claim 11 is recorded.

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