JP7285665B2 - Stick-on biosensor - Google Patents

Description

The present invention relates to a patch-type biosensor.

Conventionally, there is a biosensor using a biocompatible polymer substrate that includes a plate-like first polymer layer, a plate-like second polymer layer, electrodes, and a data acquisition module (see, for example, Patent Document 1). ).

Japanese Unexamined Patent Application Publication No. 2012-010978

A biosensor measures biometric data while attached to a surface of a living body such as the skin with an adhesive layer or the like. Then, when the measurement of the biometric data is completed, it is peeled off from the surface of the living body such as the skin. When the biosensor is peeled off in this manner, the skin or the like is pulled by the adhesive force of the adhesive layer, and the subject may feel pain.

Therefore, it is an object of the present invention to provide a stick-on biosensor that alleviates the pain that a subject feels when it is peeled off.

A patch-type biosensor according to an embodiment of the present invention includes a pressure-sensitive adhesive layer having a sticking surface to be stuck to a subject, an electrode exposed from the sticking surface of the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer. A base layer provided on the opposite side of the sticking surface of the base layer, a first substrate provided on the base layer, and a biosignal obtained via the electrode provided on the first substrate an electronic device to be processed, a battery provided on the first substrate for supplying power to the electronic device, and a cover covering the first substrate, the electronic device, and the battery over the base layer. a state in which one end of a wiring connecting the electrode and the electronic device or the battery is sandwiched between the base material layer and the electrode, and the first substrate has the pressure-sensitive adhesive layer disposed on a horizontal surface ; and the first substrate is located at a second position on the base layer so that the lower surface of the first substrate contacts the upper surface of the base layer, and the pressure-sensitive adhesive layer is peeled off from the subject. It is positioned at a first position spaced apart from the base material layer in the state.

It is possible to provide a stick-on biosensor that alleviates the pain that a subject feels when it is peeled off.

1 is an exploded view showing a patch-type biosensor 100 according to an embodiment; FIG. FIG. 2 is a diagram showing a cross section of a completed state corresponding to the cross section taken along line AA of FIG. 1; 2 is a diagram showing a circuit configuration of a patch-type biosensor 100; FIG. FIG. 4 is a diagram showing a cross section along the longitudinal direction when peeling off the patch-type biosensor 100 from the upper end side; FIG. 4 is a diagram showing a state in which the patch-type biosensor 100 is turned upside down;

Embodiments to which the patch-type biosensor of the present invention is applied will be described below.

<Embodiment>
FIG. 1 is an exploded view showing a patch-type biosensor 100 according to an embodiment. FIG. 2 is a cross-sectional view of a completed state corresponding to the cross-section taken along line AA of FIG. The patch-type biosensor 100 includes a pressure-sensitive adhesive layer 110, a base layer 120, a circuit section 130, a substrate 135, a probe 140, a fixing tape 145, an electronic device 150, a battery 160, and a cover 170 as main components. .

An XYZ coordinate system will be defined and explained below. In the following, for convenience of explanation, the Z-axis negative direction side will be referred to as the lower side or the lower side, and the Z-axis positive direction side will be referred to as the upper side or the upper side, but this does not represent a universal vertical relationship.

In this embodiment, as an example, a sticking-type biosensor 100 that measures biometric information by contacting a living body as a subject will be described. A living body refers to a human body, a living creature other than a human body, and the like, and is applied to the skin, scalp, forehead, or the like thereof. Each member constituting the patch-type biosensor 100 will be described below.

Hereinafter, an electrode that contacts a living body as a subject will be referred to as a probe 140, and a fixing tape 145 will be used as an example of a joint.

The patch-type biosensor 100 is a sheet-like member having a substantially elliptical shape in plan view. The patch-type biosensor 100 is covered with a cover 170 on the upper surface side opposite to the lower surface (the surface on the −Z direction side) that is attached to the skin 10 of the living body. The lower surface of the sticking-type biosensor 100 is the sticking surface.

The circuit section 130 and the substrate 135 are mounted on the top surface of the base layer 120 . Further, the probe 140 is embedded in the pressure-sensitive adhesive layer 110 so as to be exposed from the lower surface 112 of the pressure-sensitive adhesive layer 110 . The lower surface 112 is the adhesive surface of the adhesive biosensor 100 .

The pressure-sensitive adhesive layer 110 is a flat adhesive layer. The pressure-sensitive adhesive layer 110 has a longitudinal direction in the X-axis direction and a lateral direction in the Y-axis direction. Pressure-sensitive adhesive layer 110 is supported by substrate layer 120 and adhered to bottom surface 121 of substrate layer 120 .

The pressure sensitive adhesive layer 110 has a top surface 111 and a bottom surface 112 as shown in FIG. The upper surface 111 and the lower surface 112 are flat surfaces. The pressure-sensitive adhesive layer 110 is a layer with which the patch-type biosensor 100 comes into contact with a living body. The lower surface 112 has pressure sensitive adhesive properties so that it can be attached to the skin 10 of a living body. The lower surface 112 is the lower surface of the patch-type biosensor 100 and can be attached to a biological surface such as the skin 10 .

Moreover, the pressure-sensitive adhesive layer 110 has through holes 113 . The through-hole 113 has the same size and position as the through-hole 123 of the base material layer 120 in plan view, and communicates with the through-hole 123 .

The material of the pressure-sensitive adhesive layer 110 is not particularly limited as long as it has pressure-sensitive adhesive properties, and examples thereof include biocompatible materials. Materials for the pressure-sensitive adhesive layer 110 include acrylic pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and the like. Acrylic pressure-sensitive adhesives are preferred.

An acrylic pressure-sensitive adhesive contains an acrylic polymer as a main component.

Acrylic polymers are pressure sensitive adhesive components. The acrylic polymer includes a (meth)acrylic acid ester such as isononyl acrylate and methoxyethyl acrylate as a main component, and a monomer component that optionally contains a monomer that can be copolymerized with a (meth)acrylic acid ester such as acrylic acid. can be used. The content in the monomer component of the main component is 70% by mass to 99% by mass, and the content in the monomer component of the optional component is 1% by mass to 30% by mass. As the acrylic polymer, for example, a (meth)acrylic acid ester-based polymer described in JP-A-2003-342541 can be used.

The acrylic pressure-sensitive adhesive preferably further contains a carboxylic acid ester.

The carboxylic acid ester contained in the acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive strength adjusting agent that reduces the pressure-sensitive adhesive strength of the acrylic polymer and adjusts the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 110 . A carboxylic acid ester is a carboxylic acid ester that is compatible with the acrylic polymer.

Specifically, the carboxylic acid ester is tri-fatty acid glyceryl as an example.

The content of the carboxylic acid ester is preferably 30 parts by mass to 100 parts by mass, more preferably 50 parts by mass to 70 parts by mass or less, relative to 100 parts by mass of the acrylic polymer.

The acrylic pressure-sensitive adhesive may contain a cross-linking agent if necessary. A cross-linking agent is a cross-linking component that cross-links the acrylic polymer. Examples of cross-linking agents include polyisocyanate compounds, epoxy compounds, melamine compounds, peroxide compounds, urea compounds, metal alkoxide compounds, metal chelate compounds, metal salt compounds, carbodiimide compounds, oxazoline compounds, aziridine compounds, or amine compounds. . These cross-linking agents may be used alone or in combination. The cross-linking agent preferably includes a polyisocyanate compound (polyfunctional isocyanate compound).

The content of the cross-linking agent is preferably, for example, 0.001 to 10 parts by mass, more preferably 0.01 to 1 part by mass, with respect to 100 parts by mass of the acrylic polymer.

Pressure sensitive adhesive layer 110 preferably has excellent biocompatibility. For example, when the pressure-sensitive adhesive layer 110 is subjected to a keratin peeling test, the keratin peeling area ratio is preferably 0% to 50%, more preferably 1% to 15%. If the exfoliated area ratio is in the range of 0% to 50%, even if the pressure-sensitive adhesive layer 110 is adhered to the skin 10 (see FIG. 2), the load on the skin 10 (see FIG. 2) can be suppressed. The keratin peeling test is measured by the method described in JP-A-2004-83425.

The moisture permeability of the pressure-sensitive adhesive layer 110 is preferably 300 (g/m ² /day) or more, more preferably 600 (g/m ² /day) or more, and more preferably 1000 (g/m ² /day) or more. day) or more is more preferable. If the pressure-sensitive adhesive layer 110 has a moisture permeability of 300 (g/m ² /day) or more, even if the pressure-sensitive adhesive layer 110 is adhered to the living body 10 (see FIG. 2), the living body 10 (see FIG. 2) load can be suppressed.

The pressure-sensitive adhesive layer 110 satisfies at least one of a keratin peeling area ratio of 50% or less in a keratin peeling test and a moisture permeability of 300 (g/m ² /day) or more. and the pressure sensitive adhesive layer 110 is biocompatible. More preferably, the material of pressure-sensitive adhesive layer 110 satisfies both of the above requirements. This makes the pressure-sensitive adhesive layer 110 more stable and more biocompatible.

The thickness between the upper surface 111 and the lower surface 112 of the pressure-sensitive adhesive layer 110 is preferably 10 μm to 300 μm. When the pressure-sensitive adhesive layer 110 has a thickness of 10 μm to 300 μm, the thickness of the patch-type biosensor 100 can be reduced, and in particular, the area of the patch-type biosensor 100 other than the electronic device 150 can be reduced.

The base layer 120 is a support layer that supports the pressure-sensitive adhesive layer 110 , and the pressure-sensitive adhesive layer 110 is adhered to the lower surface 121 of the base layer 120 . A circuit section 130 and a substrate 135 are arranged on the upper surface side of the base material layer 120 .

The base material layer 120 is a plate-like (sheet-like) member made of an insulator. The shape of the base material layer 120 in plan view is the same as the shape of the pressure-sensitive adhesive layer 110 in plan view, and they are aligned and overlapped in plan view.

Base layer 120 has a bottom surface 121 and a top surface 122 . The lower surface 121 and the upper surface 122 are flat surfaces. The lower surface 121 is in contact (pressure sensitive adhesion) with the upper surface 111 of the pressure sensitive adhesive layer 110 . The base material layer 120 may be made of a flexible resin having appropriate stretchability, flexibility, and toughness, such as polyurethane resin, silicone resin, acrylic resin, polystyrene resin, and vinyl chloride resin. , and a thermoplastic resin such as a polyester resin. The thickness of the base layer 120 is preferably 1 μm to 300 μm, more preferably 5 μm to 100 μm, even more preferably 10 μm to 50 μm.

The circuit section 130 has wiring 131 , a frame 132 and a substrate 133 . The patch-type biosensor 100 includes two such circuit units 130 . The wiring 131 and the frame 132 are provided on the upper surface of the substrate 133 and are integrally formed. The wiring 131 connects the frame 132 with the electronic device 150 and the battery 160 .

The wiring 131 and the frame 132 can be made of copper, nickel, gold, alloys thereof, or the like. The thickness of the wiring 131 and the frame 132 is preferably 0.1 μm to 100 μm, more preferably 1 μm to 50 μm, even more preferably 5 μm to 30 μm.

The two circuit sections 130 are provided corresponding to the two through holes 113 and 123 of the pressure-sensitive adhesive layer 110 and the base layer 120, respectively. Wiring 131 is connected to electronic device 150 and terminal 135 A for battery 160 via wiring of substrate 135 . The frame 132 is a rectangular annular conductive member that is larger than the opening of the through hole 123 of the base material layer 120 .

The substrate 133 is an example of a second substrate. The substrate 133 has the same shape as the wiring 131 and the frame 132 in plan view. A portion of the substrate 133 where the frame 132 is provided has a rectangular annular shape that is larger than the opening of the through hole 123 of the base material layer 120 . The frame 132 and the rectangular annular portion of the substrate 133 where the frame 132 is provided are provided so as to surround the through hole 123 on the upper surface of the base layer 120 . The substrate 133 may be made of an insulator, and for example, a flexible substrate such as a polyimide substrate or film can be used.

Substrate 133 is simply laid over top surface 122 of substrate layer 120 and is not adhered. As for the base layer 120, the substrate 133 is arranged on the upper surface of the base layer 120 when the patch-type biosensor 100 is horizontally arranged. The horizontal placement of the patch-type biosensor 100 means that the flat-plate-like patch-type biosensor 100 is horizontally placed, and the XY plane in FIG. 2 is parallel to the horizontal plane.

The positions of the wiring 131 and the substrate 133 at this time are an example of a fourth position. Since the base material layer 120 is not adhered to the upper surface 122 of the base material layer 120, the cover 170 is pulled to form the concave portion 170C with the patch-type biosensor 100 attached to the skin 10 and standing substantially vertically. Substrate 133 moves away from substrate layer 120 as the inner space expands.

The reason why the substrate 133 is not adhered to the upper surface 122 of the base material layer 120 is to achieve a configuration capable of alleviating pain experienced by the subject when peeling the patch-type biosensor 100 from the surface of the skin 10 . By separating the substrate 133 from the base material layer 120 when peeling, there is an effect that excessive stress concentration on the substrate 133 can be avoided, and the substrate 133 can be peeled without damage. The details of the configuration capable of alleviating the pain caused when the patch-type biosensor 100 is peeled off will be described later.

The substrate 135 is an example of a first substrate. The substrate 135 is an insulating substrate on which the electronic device 150 and the battery 160 are mounted, and is provided on the upper surface 122 of the base layer 120 . Substrate 135 is simply laid over top surface 122 of substrate layer 120 and is not adhered.

As the substrate 135, for example, a polyimide substrate or film can be used. Wiring and terminals 135A for the battery 160 are provided on the upper surface 135TS of the substrate 135 . The wiring of the substrate 135 is connected to the electronic device 150 and the terminals 135A, and is also connected to the wiring 131 of the circuit section 130 .

Since the base layer 120 is not adhered, the substrate 135 is placed on the upper surface 122 of the base layer 120 when the biosensor 100 is placed on a horizontal surface. In this state, the entire bottom surface 135BS of the substrate 135 is in contact with the top surface 122 of the base material layer 120 . The position of the substrate 135 at this time is an example of the second position. With the patch-type biosensor 100 attached to the skin 10 and standing substantially vertically, the substrate 135 is separated from the base layer 120 when the cover 170 is pulled to expand the space in the recess 170</b>C.

The reason why the substrate 135 is not adhered to the upper surface 122 of the base layer 120 is to realize a configuration that can alleviate the pain that the subject feels when the patch biosensor 100 is peeled off from the surface of the skin 10 . By separating the substrate from the base material layer when peeling, there is an effect that excessive stress concentration on the substrate can be avoided, and the substrate can be peeled without damaging the substrate. The details of the configuration capable of alleviating the pain when peeling off will be described later.

The probe 140 is an electrode that contacts the subject, and more specifically, an electrode that contacts the skin 10 when the pressure-sensitive adhesive layer 110 is attached to the skin 10 and detects a biological signal. A biological signal is, for example, an electrical signal representing an electrocardiographic waveform, an electroencephalogram, a pulse, or the like.

The electrode used as the probe 140 is produced using a conductive composition containing at least a conductive polymer and a binder resin as described later. Also, the electrode is produced by punching a sheet-like member obtained using a conductive composition with a mold or the like, and used as a probe.

The probe 140 has holes 140A which are rectangular in plan view, are larger than the through holes 113 and 123 of the pressure-sensitive adhesive layer 110 and the base layer 120, and are arranged in a matrix. Ladder-shaped sides of the probe 140 may protrude from the ends (four corners) of the probe 140 in the X and Y directions. The electrodes used as probes 140 may have a predetermined pattern shape. Examples of the predetermined electrode pattern shape include a mesh shape, a stripe shape, and a shape in which electrodes are exposed at a plurality of locations from the attachment surface.

The fixing tape 145 is an example of the joining portion of this embodiment. The fixing tape 145 is, for example, a copper tape and has a rectangular annular shape in plan view. The fixing tape 145 has an adhesive applied to its lower surface. The fixing tape 145 is provided on the frame 132 so as to surround the four sides of the probe 140 outside the openings of the through holes 113 and 123 in plan view, and fixes the probe 140 to the frame 132 . The fixing tape 145 may be a metal tape other than copper.

The fixing tape 145 may be a non-conductive tape such as a resin tape composed of a non-conductive resin base material and an adhesive other than a tape having a metal layer such as a copper tape. A conductive tape such as a metal tape is preferable because it can join (fix) the probe 140 to the frame 132 of the circuit section 130 and electrically connect it.

The probe 140 is fixed to the frame 132 by a fixing tape 145 overlying the four end portions with the four end portions disposed on the frame 132 . The fixing tape 145 is adhered to the frame 132 through gaps such as the hole 140A of the probe 140. As shown in FIG.

With the four ends of the probe 140 fixed to the frame 132 with the fixing tape 145 in this way, the pressure-sensitive adhesive layer 110A and the base layer 120A are overlaid on the fixing tape 145 and the probe 140 to form a pressure-sensitive adhesive layer. When 110A and base layer 120A are pressed downward, probe 140 is pushed along the inner walls of through-holes 113 and 123, and pressure-sensitive adhesive layer 110A is pushed into hole 140A of probe 140. FIG.

The probe 140 is pushed down to a position where the central portion is substantially flush with the lower surface 112 of the pressure-sensitive adhesive layer 110 while the four ends are fixed to the frame 132 by the fixing tapes 145 . Therefore, when the probe 140 is brought into contact with the skin 10 of the living body (see FIG. 2), the pressure-sensitive adhesive layer 110A is adhered to the skin 10 and the probe 140 can be brought into close contact with the skin 10 .

The thickness of probe 140 is preferably less than the thickness of pressure sensitive adhesive layer 110 . The thickness of the probe 140 is preferably 0.1 μm to 100 μm, more preferably 1 μm to 50 μm.

A peripheral portion (rectangular annular portion) surrounding the central portion of the pressure-sensitive adhesive layer 110</b>A in plan view is located on the fixing tape 145 . Although the upper surface of the pressure-sensitive adhesive layer 110A is substantially flat in FIG. 2, the central portion may be recessed below the surrounding portions. A substrate layer 120A overlies the substantially flat upper surface of the pressure sensitive adhesive layer 110A.

The pressure-sensitive adhesive layer 110A and the base layer 120A may be made of the same material as the pressure-sensitive adhesive layer 110 and the base layer 120, respectively. Moreover, the pressure-sensitive adhesive layer 110A may be made of a material different from that of the pressure-sensitive adhesive layer 110 . Moreover, the base layer 120A may be made of a material different from that of the base layer 120 .

Although the thickness of each part is exaggerated in FIG. 2, the actual thickness of the pressure-sensitive adhesive layers 110 and 110A is 10 μm to 300 μm, and the thickness of the base layers 120 and 120A is 1 μm to 300 μm. is. The wiring 131 has a thickness of 0.1 μm to 100 μm, the substrate 133 has a thickness of several hundred μm, and the fixing tape 145 has a thickness of 10 μm to 300 μm.

Further, when the probe 140 and the frame 132 are in direct contact with each other to ensure electrical connection as shown in FIG. good.

2, the fixing tape 145 covers the side surfaces of the frame 132 and the substrate 133 in addition to the probes 140, and reaches the upper surface of the base material layer 120. As shown in FIG. However, since the fixing tape 145 only needs to join the probes 140 and the frame 132 , it does not have to reach the upper surface of the base material layer 120 or cover the side surfaces of the substrate 133 . It does not have to be covered.

Also, the substrate 133 and the two substrates 135 may be integrated into one substrate. In this case, wiring 131, two frames 132, and terminals 135A are provided on the surface of one substrate, and electronic device 150 and battery 160 are mounted.

The electrode used as the probe 140 is preferably produced by thermosetting and molding the following conductive composition. The conductive composition contains a conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

As the conductive polymer, for example, polythiophene, polyacetylene, polypyrrole, polyaniline, polyphenylenevinylene, or the like can be used. These may be used individually by 1 type, and may be used together 2 or more types. Among these, it is preferable to use a polythiophene compound. PEDOT/PSS in which poly3,4-ethylenedioxythiophene (PEDOT) is doped with polystyrene sulfonic acid (poly4-styrene sulfonate; PSS) from the viewpoint of lower contact impedance with the living body and high conductivity. is more preferred.

The content of the conductive polymer is preferably 0.20 parts by mass to 20 parts by mass with respect to 100 parts by mass of the conductive composition. When the content is within the above range, excellent conductivity, toughness and flexibility can be imparted to the conductive composition. The content of the conductive polymer is more preferably 2.5 parts by mass to 15 parts by mass, more preferably 3.0 parts by mass to 12 parts by mass, relative to the conductive composition.

A water-soluble polymer, a water-insoluble polymer, or the like can be used as the binder resin. As the binder resin, it is preferable to use a water-soluble polymer from the viewpoint of compatibility with other components contained in the conductive composition. The water-soluble polymer includes a polymer that is completely insoluble in water and has hydrophilicity (hydrophilic polymer).

A hydroxyl group-containing polymer or the like can be used as the water-soluble polymer. Sugars such as agarose, polyvinyl alcohol (PVA), modified polyvinyl alcohol, copolymers of acrylic acid and sodium acrylate, and the like can be used as the hydroxyl group-containing polymer. These may be used individually by 1 type, and may be used together 2 or more types. Among these, polyvinyl alcohol or modified polyvinyl alcohol is preferable, and modified polyvinyl alcohol is more preferable.

Examples of modified polyvinyl alcohol include acetoacetyl group-containing polyvinyl alcohol, diacetone acrylamide modified polyvinyl alcohol, and the like. As the diacetoneacrylamide-modified polyvinyl alcohol, for example, a diacetoneacrylamide-modified polyvinyl alcohol resin (DA PVA resin) described in JP-A-2016-166436 can be used.

The content of the binder resin is preferably 5 parts by mass to 140 parts by mass with respect to 100 parts by mass of the conductive composition. When the content is within the above range, excellent conductivity, toughness and flexibility can be imparted to the conductive composition. The content of the binder resin is more preferably 10 parts by mass to 100 parts by mass, more preferably 20 parts by mass to 70 parts by mass, relative to the conductive composition.

Cross-linking agents and plasticizers have the function of imparting toughness and flexibility to the conductive composition. A stretchable electrode was obtained by imparting flexibility to the molded body of the conductive composition. Thereby, the probe 140 having stretchability can be produced.

In addition, toughness is a property that achieves both excellent strength and elongation. Toughness does not include properties in which one of strength and elongation is remarkably excellent but the other is remarkably low, and includes properties in which both strength and elongation are well-balanced.

Flexibility is a property that can suppress the occurrence of damage such as breakage at the bent portion after the molded body (electrode sheet) of the conductive composition is bent.

The cross-linking agent cross-links the binder resin. By including the cross-linking agent in the binder resin, the toughness of the conductive composition can be improved. The cross-linking agent preferably has reactivity with hydroxyl groups. If the cross-linking agent has reactivity with hydroxyl groups, when the binder resin is a hydroxyl group-containing polymer, the cross-linking agent can react with the hydroxyl groups of the hydroxyl group-containing polymer.

Examples of cross-linking agents include zirconium compounds such as zirconium salts; titanium compounds such as titanium salts; borides such as boric acid; isocyanate compounds such as blocked isocyanate; aldehyde compounds such as dialdehydes such as glyoxal; containing compounds and the like. These may be used individually by 1 type, and may be used together 2 or more types. Among them, a zirconium compound, an isocyanate compound, or an aldehyde compound is preferable from the viewpoint of reactivity and safety.

The content of the cross-linking agent is preferably 0.2 parts by mass to 80 parts by mass with respect to 100 parts by mass of the conductive composition. When the content is within the above range, excellent toughness and flexibility can be imparted to the conductive composition. The content of the cross-linking agent is more preferably 1 part by mass to 40 parts by mass, more preferably 3.0 parts by mass to 20 parts by mass.

A plasticizer improves the tensile elongation and flexibility of the conductive composition. Plasticizers include glycerin, ethylene glycol, propylene glycol, sorbitol, polyol compounds such as these polymers N-methylpyrrolidone (NMP), dimethylformaldehyde (DMF), NN'-dimethylacetamide (DMAc), dimethylsulfoxide and aprotic compounds such as (DMSO). These may be used individually by 1 type, and may be used together 2 or more types. Among these, glycerin is preferable from the viewpoint of compatibility with other components.

The content of the plasticizer is preferably 0.2 parts by mass to 150 parts by mass with respect to 100 parts by mass of the conductive composition. When the content is within the above range, excellent toughness and flexibility can be imparted to the conductive composition. The content of the plasticizer is more preferably 1.0 to 90 parts by mass, more preferably 10 to 70 parts by mass with respect to 100 parts by mass of the conductive polymer.

At least one of the cross-linking agent and the plasticizer should be included in the conductive composition. By including at least one of the cross-linking agent and the plasticizer in the conductive composition, the molded article of the conductive composition can be improved in toughness and flexibility.

When the conductive composition contains a cross-linking agent but does not contain a plasticizer, the molded article of the conductive composition can have improved toughness, that is, both tensile strength and tensile elongation, and can be flexible. can improve sexuality.

When the conductive composition contains a plasticizer but does not contain a cross-linking agent, the tensile elongation of the molded body of the conductive composition can be improved, so that the molded body of the conductive composition as a whole has toughness. can be improved. In addition, the flexibility of the molded body of the conductive composition can be improved.

Both a crosslinker and a plasticizer are preferably included in the conductive composition. By including both the cross-linking agent and the plasticizer in the electrically conductive composition, the molded article of the electrically conductive composition is imparted with even better toughness.

In addition to the above components, the conductive composition optionally contains a surfactant, a softening agent, a stabilizer, a leveling agent, an antioxidant, an anti-hydrolysis agent, a swelling agent, a thickener, a coloring agent, or Various known additives such as fillers can be appropriately contained in arbitrary proportions. Examples of surfactants include silicone-based surfactants.

The electrically conductive composition is prepared by mixing the components described above in the proportions described above.

The conductive composition can contain a solvent in any suitable proportion, if necessary. Thus, an aqueous solution of the conductive composition (aqueous conductive composition solution) is prepared.

An organic solvent or an aqueous solvent can be used as the solvent. Examples of organic solvents include ketones such as acetone and methyl ethyl ketone (MEK); esters such as ethyl acetate; ethers such as propylene glycol monomethyl ether; and amides such as N,N-dimethylformamide. Examples of aqueous solvents include water; alcohols for methanol, ethanol, propanol, isopropanol, and the like. Among these, it is preferable to use an aqueous solvent.

Any one or more of the conductive polymer, the binder resin, and the cross-linking agent may be used as an aqueous solution dissolved in a solvent. In this case, the solvent is preferably the above aqueous solvent.

The electronic device 150 is installed on the upper surface 122 of the base material layer 120 and electrically connected to the wiring 131 . The electronic device 150 has a rectangular shape in a cross-sectional view. A terminal is provided on the bottom surface (−Z direction) of the electronic device 150 . Materials for the terminals of the electronic device 150 include solder, conductive paste, and the like.

As shown in FIG. 1, the electronic device 150 includes, for example, an ASIC (application specific integrated circuit) 150A, an MPU (Micro Processing Unit) 150B, a memory 150C, and a wireless communication unit 150D. 130 to probe 140 and battery 160 .

ASIC 150A includes an A/D (Analog to digital) converter. Electronic device 150 is driven by power supplied from battery 160 and acquires biosignals measured by probe 140 . The electronic device 150 performs processing such as filter processing and digital conversion on the biological signal, and the MPU 150B obtains an average value of the biological signal acquired over a plurality of times and stores it in the memory 150C. The electronic device 150 can continuously acquire biosignals for 24 hours or more, as an example. Since the electronic device 150 may measure biological signals over a long period of time, it is devised to reduce power consumption.

The wireless communication unit 150D is a transceiver used when the test apparatus for the evaluation test reads the biological signal stored in the memory 150C in the evaluation test by wireless communication, and performs communication at 2.4 GHz, for example. The evaluation test is, for example, a test according to JIS 60601-2-47. The evaluation test is a test for confirming the operation after completion of a biosensor that detects biosignals as a medical device. Evaluation tests require that the attenuation rate of the biosignal taken out from the biosensor with respect to the biosignal input to the biosensor be less than 5%. This evaluation test is performed on all finished products.

The battery 160 is provided on the upper surface 122 of the base layer 120, as shown in FIG. As the battery 160, a lead-acid battery, a lithium-ion secondary battery, or the like can be used. Battery 160 may be of the button cell type. Battery 160 is an example of a battery. The battery 160 has terminals provided on its lower surface. Two terminals of the battery 160 are connected to the probe 140 and the electronic device 150 through the circuit section 130 . The capacity of the battery 160 is set, for example, so that the electronic device 150 can measure biosignals for 24 hours or longer.

The cover 170 covers the base layer 120 , the circuit section 130 , the substrate 135 , the probes 140 , the fixing tape 145 , the electronic device 150 and the battery 160 . The cover 170 has a base portion 170A and a projecting portion 170B projecting in the +Z direction from the center of the base portion 170A. The base portion 170A is a portion located around the cover 170 in plan view and is a portion lower than the projecting portion 170B. A recess 170C is provided below the projection 170B. The cover 170 is adhered to the upper surface 122 of the base material layer 120 at the lower surface of the base portion 170A. The substrate 135, the electronic device 150, and the battery 160 are accommodated in the recess 170C. The cover 170 is adhered to the upper surface 122 of the base material layer 120 with the electronic device 150, the battery 160, etc. housed in the recess 170C.

The Z-direction height of the space between the recess 170C and the upper surface 122 of the base layer 120 is matched to the total height of the substrate 135, the electronic device 150 and the battery 160, and the cover 170 is positioned between the base layer 120 and the base layer 120. The substrate 135, the electronic device 150, and the battery 160 are prevented from moving (rattling) while being adhered to the upper surface 122 of the .

The cover 170 serves as a cover to protect the circuit section 130, the electronic device 150, and the battery 160 on the base layer 120, and also protects the internal components from the impact applied to the patch-type biosensor 100 from the upper surface side. It acts as a protective shock-absorbing layer. As the cover 170, for example, silicone rubber, soft resin, urethane, or the like can be used. The cover 170 has elasticity.

FIG. 3 is a diagram showing the circuit configuration of the patch-type biosensor 100. As shown in FIG. Each probe 140 is connected to the electronic device 150 and the battery 160 via the wiring 131 and wiring 135B of the substrate 135 . Two probes 140 are connected in parallel to the electronic device 150 and the battery 160 .

Next, a description will be given of the operation when the user who has attached the patch-type biosensor 100 to the skin 10 peels off the patch-type biosensor 100 .

Using the patch-type biosensor 100 as an example, an electrocardiographic waveform is continuously measured for 24 hours. When the measurement is completed, the user removes the patch-type biosensor 100 from the skin 10 by himself/herself.

When peeling the patch-type biosensor 100 from the skin 10 , it is easiest to peel off the upper end or the lower end in the longitudinal direction from the skin 10 . Compared to peeling from the end of the patch-type biosensor 100 in the short direction or from the middle point in the longitudinal direction, the number of parts to be peeled off at one time is smaller, and the patch-type biosensor 100 is preferably peeled off in the longitudinal direction. This is because it is easy to apply a force to peel off the film.

FIG. 4 is a diagram showing a cross section along the longitudinal direction when peeling off the patch-type biosensor 100. FIG.

In FIG. 4, the user pulls the cover 170 at the longitudinal end of the patch-type biosensor 100 with the thumb, index finger, middle finger, and ring finger of the right hand in the direction of arrow A, and the patch-type biosensor 100 is pulled on the skin. 10 is peeled off. In this state, the stretchable cover 170 is pulled, and therefore, in the longitudinal direction of the patch-type biosensor 100, the section S1 where the pressure-sensitive adhesive layer 110 is peeled off and the pressure-sensitive adhesive layer 110 adhere to the skin 10. There is an angle difference θ in the lower surface 112 of the pressure-sensitive adhesive layer 110 between the section S2 and the section S2.

Here, the greater the angular difference θ during peeling of the patch-type biosensor 100 from the skin 10 , the more pain the subject feels from the skin 10 . This is because the larger the angle difference θ, the smaller the stress applied to the skin 10 and the narrower the range of pain. If the angle difference θ is small, the stress applied to the skin 10 will be large, and pain will be felt in a wider range. Therefore, it is desirable to increase the angle difference θ during peeling of the patch-type biosensor 100 from the skin 10 as much as possible.

By the way, since the substrate 135 on which the electronic device 150 and the battery 160 are mounted is harder than the pressure-sensitive adhesive layer 110, the base material layer 120, and the cover 170, when the substrate 135 is adhered to the top surface 122 of the base material layer 120, a sticking type The rigidity in the longitudinal direction of the biosensor 100 increases, and the angle difference θ becomes relatively small. This is because the substrate 135 is stretched. The same applies to the substrate 133, but the substrate 135 has higher flexural rigidity than the substrate 133 due to the fact that the electronic device 150 and the battery 160 are mounted on the substrate 135, and is significantly stretched.

On the other hand, when the substrate 135 is not adhered to the upper surface 122 of the base material layer 120, the substrate 135 can be separated from the upper surface 122 of the base material layer 120, and the rigidity in the longitudinal direction of the patch-type biosensor 100 becomes low. A large angular difference θ is obtained. This is because the substrate 135 is less likely to be stretched than when the substrate 135 is adhered to the upper surface 122 of the base material layer 120 . Note that this also applies to the substrate 133 .

For the reasons described above, the substrate 135 is simply placed on the upper surface 122 of the base material layer 120 without bonding. Similarly, substrate 133 is simply placed on top surface 122 of substrate layer 120 without bonding.

In a situation where an angle difference θ occurs between the section S1 where the cover 170 is pulled and the pressure-sensitive adhesive layer 110 is peeled off and the section S2 where the pressure-sensitive adhesive layer 110 is adhered to the skin 10 as described above. 2, the space between the concave portion 170C of the cover 170 and the base layer 120 expands from the state shown in FIG. 2, and the substrate 135 in FIG. The upper end 135U side of 135 is separated from the upper surface 122 of the base material layer 120 .

Also, in such a situation, the cover 170 is stretched in an oblique direction (in the direction of arrow A in FIG. 4) having an angle with respect to the longitudinal direction so that the probe 140 fixed to the base material layer 120 is And the wiring 131 is pulled by the frame 132, and the substrate 135 having the wiring connected to the wiring 131 is also pulled in the direction of the arrow A. As a result, the upper end 135U side of the substrate 135 in FIG. 4 is separated from the upper surface 122 of the base layer 120 .

The position of the substrate 135 with respect to the base material layer 120 at this time is different from the state in which the entire lower surface 135BS of the substrate 135 is in contact with the upper surface 122 of the base material layer 120 as shown in FIG. The position of substrate 135 relative to base layer 120 shown in FIG. 4 is an example of a first position.

Here, the upper end 135U side of the substrate 135 is separated from the upper surface 122 of the base material layer 120, and the lower end 135L side of the substrate 135 is in contact with the upper surface 122 of the base material layer 120. Further pulling in the direction may cause the entire bottom surface 135BS of the substrate 135 to separate from the top surface 122 of the substrate layer 120 .

The reason why the substrate 135 is separated from the base material layer 120 is as follows. The substrate 135 is not adhered to the base material layer 120, and is positioned with both sides in the X direction connected to the wiring 131 in the state shown in FIG. Therefore, when the space between the base material layer 120 and the cover 170 expands with the patch-type biosensor 100 attached to the skin 10 as shown in FIG. 150 and the weight of the battery 160).

Also, when the substrate 135 is separated from the top surface 122 of the base layer 120 as shown in FIG. At 4 , the base layer 120 on the upper side is also spaced from the top surface 122 . Since the wiring 131 provided on the substrate 133 connects the frame 132 fixed to the probes 140 and the wiring of the substrate 135, the substrate 133 is pulled by the substrate 135 and the substrate 133 is pulled to the upper surface 122 of the base material layer 120. This is because it separates from Thus, the position of the wiring 131 and the substrate 133 when the substrate 133 is separated from the upper surface 122 of the base material layer 120 is an example of the third position.

Here, the case where the cover 170 at the upper end in the longitudinal direction of the patch-type biosensor 100 is pulled in the direction of the arrow A was explained, but the cover 170 and the pressure-sensitive adhesive layer 110 were pulled in the state shown in FIG. Again, substrate 135 separates from substrate layer 120 . As shown in FIG. 4, between the section S1 where the pressure-sensitive adhesive layer 110 is peeled off and the section S2 where the pressure-sensitive adhesive layer 110 is adhered to the skin 10, the lower surface 112 of the pressure-sensitive adhesive layer 110 has an angle difference θ. is generated, the cover 170 is stretched and deformed, and the space between the concave portion 170C of the cover 170 and the base layer 120 expands more than the state shown in FIG. Moreover, at this time, the substrate 133 is similarly separated from the base material layer 120 .

Also, here, the case where cover 170 at the upper end in the longitudinal direction of patch-type biosensor 100 is pulled in the direction of arrow A has been described, but the same applies to the case where cover 170 at the lower end in the longitudinal direction of patch-type biosensor 100 is pulled. Substrate 135 then separates from substrate layer 120 , and substrate 133 also separates from substrate layer 120 .

Also, here, the case where the patch-type biosensor 100 is attached to the skin 10 of the chest and then peeled off has been described. Similarly away from the top surface 122 of the substrate layer 120 . The same applies to the substrate 133 as well.

As described above, since the substrates 135 and 133 are not adhered to the upper surface 122 of the base material layer 120, the longitudinal ends (upper end or lower end in FIG. 4) of the patch biosensor 100 are pulled from the skin 10. During the peeling, the substrate 135 is separated from the top surface 122 of the base layer 120, and the feeling in the section S1 where the pressure sensitive adhesive layer 110 is peeled off and the section S2 where the pressure sensitive adhesive layer 110 is adhered to the skin 10. The angle difference θ of the bottom surface 112 of the pressure-bonding layer 110 is greater than when the bottom surface 135BS of the substrate 135 is bonded to the top surface 122 of the base layer 120 .

Therefore, when the patch-type biosensor 100 is peeled off the skin 10, the pulling force on the surface of the skin 10 is alleviated, and the pain when the patch-type biosensor 100 is peeled off the skin 10 can be alleviated.

Therefore, it is possible to provide the patch-type biosensor 100 that alleviates pain when peeled off from the skin 10 .

In the above description, the height in the Z direction of the space between the concave portion 170C and the upper surface 122 of the base material layer 120 is adjusted to the total height of the substrate 135, the electronic device 150, and the battery 160. bottom. However, the Z-direction height of the space between the recess 170C and the top surface 122 of the base layer 120 may be higher than the total height of the substrate 135 and the electronic device 150 and battery 160 .

Since the substrate 135 is fixed to the probe 140 via the circuit portion 130, the height in the Z direction of the space between the concave portion 170C and the upper surface 122 of the base layer 120 is , the total height of the substrate 135 and the electronic device 150 and battery 160 .

In such a case, the first position of the substrate 135 with respect to the base layer 120 and the third position of the wiring 131 and the substrate 133 when the substrate 133 is separated from the top surface 122 of the base layer 120 described above are shown in FIG. as shown in

FIG. 5 is a diagram showing a state in which the patch-type biosensor 100 is turned upside down. Upside down means that the pressure-sensitive adhesive layer 110 is positioned in the +Z direction, as opposed to the state in which the pressure-sensitive adhesive layer 110 is positioned in the -Z direction and the cover 170 is positioned in the +Z direction as shown in FIG. side, and the cover 170 is positioned on the -Z direction side.

Since the height in the Z direction of the space between the concave portion 170C and the upper surface 122 of the base material layer 120 is higher than the total height of the substrate 135, the electronic device 150 and the battery 160, as shown in FIG. When the sensor 100 is placed upside down, the electronic device 150 and the battery 160 are in contact with the inner surface of the recess 170C of the cover 170, and the substrate 135 is separated from the base layer 120. FIG. In FIG. 5, the position where the substrate 135 is separated from the base material layer 120 in this manner is an example of the first position.

5, the substrate 133 is also separated from the base material layer 120. As shown in FIG. In FIG. 5, the position where the substrate 133 is separated from the base material layer 120 in this manner is an example of the third position.

The height in the Z direction of the space between the recess 170C and the upper surface 122 of the base material layer 120 is higher than the total height of the substrate 135, the electronic device 150, and the battery 160. and the top surface 122 of the base material layer 120 is aligned with the total height of the substrate 135, the electronic device 150 and the battery 160 in the Z direction. Since the adhesive biosensor 100 can be peeled off from the skin 10, the pain caused when the patch biosensor 100 is peeled off from the skin 10 can be similarly alleviated.

In the above description, the substrate 133 is not adhered to the upper surface 122 of the base material layer 120. However, the substrate 135 may be adhered as long as it does not interfere with the movement of the substrate 135 from the second position to the first position. good.

Although a patch-type biosensor according to an exemplary embodiment of the present invention has been described above, the present invention is not limited to the specifically disclosed embodiments and departs from the scope of the claims. Various modifications and changes are possible.

REFERENCE SIGNS LIST 100 stick-on biosensor 110 pressure-sensitive adhesive layer 120 base layer 130 circuit section 140 probe 150 electronic device 160 battery 170 cover

Claims (6)

a pressure-sensitive adhesive layer having a sticking surface that sticks to a subject;
an electrode exposed from the attachment surface of the pressure-sensitive adhesive layer;
a base layer provided on the surface opposite to the attachment surface of the pressure-sensitive adhesive layer;
a first substrate provided on the base layer;
an electronic device provided on the first substrate for processing biosignals acquired through the electrodes;
a battery provided on the first substrate for supplying power to the electronic device;
a cover covering the first substrate, the electronic device, and the battery over the base layer;
one end of a wiring connecting the electrode and the electronic device or the battery is sandwiched between the base material layer and the electrode;
The first substrate is arranged on the base material layer such that the lower surface of the first substrate contacts the upper surface of the base material layer while the pressure-sensitive adhesive layer is arranged on a horizontal surface. A stick-on biosensor positioned at position 2 and positioned at a first position spaced apart from the base material layer in a state where the pressure-sensitive adhesive layer is peeled off from the subject. The cover has stretchability, and in a state in which the base layer and the first substrate are placed in an upright position and the cover is pulled to separate the pressure-sensitive adhesive layer from the subject, the pressure-sensitive adhesive layer is removed from the subject. 2. The patch-type biosensor according to claim 1 , wherein said first substrate is positioned at said first position when said cover is stretched to widen the space between said base layer and said cover. the height between the cover and the base layer is higher than the total height of the first substrate and the electronic device and the battery provided on the first substrate;
3. The patch-type biosensor according to claim 1, wherein said first substrate is positioned at said first position when said substrate layer and said first substrate are turned upside down so that the positional relationship between said substrate layer and said first substrate is reversed. The patch-type biosensor according to any one of claims 1 to 3 , wherein said first substrate is not adhered to said base material layer. a circuit unit that connects the electrode and the electronic device or the battery;
a second substrate holding the circuit unit,
The patch-type biosensor according to any one of claims 1 to 4 , wherein the second substrate is positioned at a third position separated from the base material layer when the first substrate is at the first position. when the first substrate is in a second position disposed above the base layer with the pressure sensitive adhesive layer disposed on a horizontal surface;
6. The patch-type biosensor according to claim 5 , wherein said second substrate is positioned at a fourth position on said base material layer.

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