JP7265816B1 - Environment-forming device and program for environment-forming device - Google Patents

Abstract

An object of the present invention is to enable temperature control in consideration of the state of an object to be accommodated. Kind Code: A1 An environment forming device is an environment forming device that sets an indoor temperature of an environment forming chamber in which an object is housed to a target temperature. temperature control means for controlling the indoor temperature to reach the provisional target temperature by adjusting the output of a heating unit that heats changing means for changing the provisional target temperature based on the output of the heating unit so that the temperature approaches the target temperature. [Selection drawing] Fig. 4

Description

The present invention relates to an environment forming device and a program for the environment forming device.

Conventionally, when performing a low temperature test, after sending cold air of a precooling target temperature higher than the low temperature test target temperature to the test chamber, the temperature of the test chamber is set to the low temperature test target temperature. 1).

This environmental test equipment measures the difference between the actual time from the start of control to bring the temperature of the test chamber to the target temperature for the low temperature test until the temperature of the test chamber reaches the target temperature for the low temperature test and the predicted time assumed in advance. It has a function to adjust the precooling target temperature from

JP 2020-134277 A

However, the time required to reach the low temperature test target temperature from the precooling target temperature varies depending on the objects accommodated in the test bath.

Specifically, the time required to reach the low-temperature test target temperature from the precooling target temperature differs between an object with a large heat capacity and an object with a small heat capacity. Further, the time required for reaching the low-temperature test target temperature from the pre-cooling target temperature differs between an object subjected to an energized test that generates heat and an object that is subjected to a non-energized test.

Therefore, even if the next test is performed using the precooling target temperature adjusted in the previous test, if the state of the object to be tested changes, there is a problem that it is not possible to cope with this.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and an object of the present invention is to enable temperature control in consideration of the state of an object to be accommodated.

An environment forming device according to one aspect of the present invention is an environment forming device that sets the room temperature of an environment forming chamber in which an object is housed to a target temperature, wherein the environment forming chamber is cooled with a predetermined cooling capacity while the environment is generated. temperature control means for adjusting the output of a heating unit that heats the inside of the forming chamber to control the room temperature to reach the provisional target temperature; changing means for changing the provisional target temperature based on the output of the heating unit so that the target temperature approaches the target temperature.

According to the above aspect, since the provisional target temperature is changed based on the output of the heating unit that changes according to the object accommodated in the environment generation chamber, it is possible to perform temperature control in consideration of the condition of the object accommodated. Become.

FIG. 1 is a perspective view of an environment forming device according to this embodiment. FIG. 2 is a diagram for explaining the overall configuration of the environment forming device according to this embodiment. FIG. 3 is a diagram illustrating an example of a test performed by the environment forming device according to this embodiment. FIG. 4 is a functional block diagram of the environment forming device according to this embodiment. FIG. 5 is a flow chart showing the operation of the environment forming device according to this embodiment. FIG. 6 is a diagram showing an example of the operation of the environment forming apparatus according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature is higher than the precooling temperature in the control for lowering the temperature of the test chamber. FIG. 7 is a diagram showing an example of the operation of the environment forming apparatus according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature is lower than the precooling temperature in the control for raising the temperature of the test chamber. FIG. 8 is a diagram showing an example of the operation of the environment forming apparatus according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature is lower than the precooling temperature in the control for lowering the temperature of the test chamber. FIG. 9 is a diagram showing an example of the operation of the environment forming apparatus according to this embodiment, and is an explanatory diagram showing a case where the exposure temperature is higher than the precooling temperature in the control for increasing the temperature of the test chamber.

The environment forming device 10 of this embodiment will be described below with reference to the drawings.

The environment forming device 10 is a device that sets the indoor temperature PV of a test chamber 14 as an environment forming chamber in which an object 12 to be tested is housed to a exposure temperature SV as a target temperature. The environment forming device 10 forms an ambient environment (exposure temperature SV) to which the object 12 is exposed in the test chamber 14 .

The environment forming apparatus 10 controls the room temperature PV in the process of making the room temperature PV of the test room 14 the exposure temperature SV so that the room temperature PV becomes the precooling temperature SVn as the provisional target temperature. The precooling temperature SVn is changed stepwise. As a result, the environment forming apparatus 10 gradually brings the room temperature PV of the test room 14 closer to the exposure temperature SV.

Here, the precooling temperature SVn is changed stepwise. Therefore, a different number is substituted for "n" of the precooling temperature SVn for each different value of the precooling temperature SVn.

FIG. 1 is a perspective view of an environment forming device 10 according to this embodiment.

As shown in FIG. 1, the environment forming device 10 includes a housing 16 as a main body. A high-temperature chamber 18, a test chamber 14 as an environment forming chamber, and a low-temperature chamber 20 are sequentially formed in the housing 16 from above (see FIG. 2).

An opening/closing door 22 supported by the housing 16 is provided on the front surface of the test chamber 14 . The opening/closing door 22 opens and closes the front opening of the test chamber 14 . A front panel 24 is provided on the side of the opening/closing door 22 . A power switch 26 and a display panel 28 are provided on the front panel 24 .

The display panel 28 is composed of a touch panel. The display panel 28 has a display function and an input function, and input can be performed by touching display contents displayed on the display panel 28 with a finger. The display panel 28 is connected to a controller 40 which will be described later.

Next, the configuration of the environment forming device 10 will be described in more detail with reference to FIG. FIG. 2 is a diagram illustrating the overall configuration of the environment forming device 10 according to this embodiment.

A heat insulating material is provided along the inner surface of the housing 16 . An upper partition wall 30 that partitions the high temperature chamber 18 and the test chamber 14 and a lower partition wall 32 that partitions the test chamber 14 and the low temperature chamber 20 are provided with heat insulating materials. The environment forming apparatus 10 is provided with a controller 40 that constitutes a computer.

(High temperature room)
Hot room 18 produces hot air for supply to test chamber 14 .

The hot room 18 is provided with a hot room outlet 42 and a hot room inlet 44 . A high temperature room air supply fan 48 is connected to the high temperature room air intake port 44 via a high temperature room air supply switching valve 46 .

The high temperature room supply fan 48 operates upon receiving the high temperature room supply fan motor output from the controller 40 . The high temperature room air supply switching valve 46 operates upon receiving the high temperature room air supply switching valve output from the controller 40 to supply outside air sent from the high temperature room air supply fan 48 to the high temperature room 18 . The air in the high temperature chamber 18 whose internal pressure is increased by the supply of outside air is discharged to the outside through the high temperature chamber exhaust port 42 . Thereby, the temperature in the high temperature chamber 18 can be lowered.

Further, the high temperature chamber 18 is provided with a heat storage material 50 , a high temperature chamber heater 52 , a high temperature chamber fan 54 and a high temperature chamber sensor 56 .

The high-temperature chamber heater 52 receives the high-temperature chamber heater output from the controller 40 and generates heat to heat the air in the high-temperature chamber 18 . The heat storage material 50 is warmed by the air in the high temperature chamber 18 and stores heat.

A high temperature room fan 54 is rotated by a high temperature room fan motor 58 to agitate the air in the high temperature room 18 . The high temperature room fan motor 58 operates upon receiving the high temperature room fan motor output from the controller 40 to rotate the high temperature room fan 54 . Hot room sensor 56 outputs a hot room sensor input indicative of the temperature of hot room 18 to controller 40 .

(test room)
Test chamber 14 has a space in which object 12 is housed. The test chamber 14 is provided with a test chamber sensor 60 for measuring the room temperature PV. The test chamber sensor 60 outputs a test chamber sensor input indicative of the temperature of the test chamber 14 to the controller 40 .

(cold room)
A cold room 20 produces cold air for supply to the test chamber 14 .

The low temperature room 20 is provided with an evaporator 62 , a low temperature room heater 64 , a low temperature room fan 66 and a low temperature room sensor 68 .

The evaporator 62 exchanges refrigerant with the binary refrigerator unit 69 to cool the air in the low temperature room 20 . The dual freezer unit 69 operates upon receiving a dual freezer operating output from the controller 40 . The low-temperature room heater 64 receives a low-temperature room heater output DHn from the controller 40 to generate heat, heat the air in the low-temperature room 20 cooled by the evaporator 62 , and adjust the temperature of the air in the low-temperature room 20 .

The low temperature room fan 66 is rotated by a low temperature room fan motor 70 to agitate the air inside the low temperature room 20 . The low temperature room fan motor 70 operates upon receiving the low temperature room fan motor output from the controller 40 to rotate the low temperature room fan 66 . Cold room sensor 68 outputs a cold room sensor input indicative of the temperature of cold room 20 to controller 40 .

A first high temperature passage 80 and a second high temperature passage 82 are provided at the ends of the upper partition wall 30 to communicate the high temperature chamber 18 and the test chamber 14 . A first upper opening/closing portion 84 that opens and closes the first high temperature passage 80 and a second upper opening/closing portion 86 that opens and closes the second high temperature passage 82 are provided on the lower surface of the upper partition wall 30 . The first upper opening/closing part 84 and the second upper opening/closing part 86 operate upon receiving the high temperature chamber damper output from the controller 40 to open and close the first high temperature passage 80 and the second high temperature passage 82 .

A first low-temperature passage 90 and a second low-temperature passage 92 that connect the test chamber 14 and the low-temperature chamber 20 are provided at the ends of the lower partition wall 32 . A first lower opening/closing portion 94 for opening and closing the first low temperature passage 90 and a second lower opening/closing portion 96 for opening and closing the second low temperature passage 92 are provided on the upper surface of the lower partition wall 32 . The first lower opening/closing portion 94 and the second lower opening/closing portion 96 operate upon receiving the low temperature chamber damper output from the controller 40 to open and close the first low temperature passage 90 and the second low temperature passage 92 .

The controller 40 is mainly composed of a processor 100 that constitutes a computer. A storage unit 102 and an interface circuit 104 are connected to the processor 100 .

The storage unit 102 includes a nonvolatile memory (ROM: Read Only Memory), a volatile memory (RAM: Random Access Memory), and the like. The non-volatile memory stores a program for the environment forming device. The non-volatile memory constitutes a storage medium for storing the environment forming device program.

The volatile memory readable and writable stores data used when the processor 100 operates according to the environment forming device program. The data stored in the volatile memory includes data input from the display panel 28, the exposure temperature SV used in each test, the precooling temperature SVn, and the like. The exposure temperature SV and the precooling temperature SVn stored in the volatile memory are determined according to the test details input from the display panel 28 .

Interface circuit 104 relays signals exchanged between processor 100 and devices such as sensors 56 , 60 , 68 . As a result, the processor 100 receives sensor inputs from the sensors 56, 60 and 68 as devices via the interface circuit 104, and outputs control signals and the like to the motors 58 and 70 as devices.

(Composite test example)
A test that can be performed by the environment forming device 10 will be described with reference to FIG. FIG. 3 is a diagram illustrating an example of a test performed by the environment forming device 10 according to this embodiment. In FIG. 3 , the solid line indicates the indoor temperature PV of the test chamber 14 . A dashed line indicates the temperature 110 in the hot chamber 18 . A two-dot chain line indicates the temperature 112 in the cold room 20 .

As shown in FIG. 3, the environment forming apparatus 10 performs a temperature cycle test 120 in which the room temperature PV of the test room 14 is alternately set to low and high temperatures, and a program test 122 in which the room temperature PV of the test room 14 is changed according to a program. can be implemented.

The environment forming device 10 can independently perform the temperature cycle test 120 and the program test 122 . Also, the environment forming device 10 can perform a composite test in which the temperature cycle test 120 is followed by the program test 122 .

A specific example of a composite test in which a program test 122 is performed after a temperature cycle test 120 will be described.

In the temperature cycle test 120 of the composite test, the environment forming apparatus 10 opens the low temperature passages 90 and 92 to introduce the "-65 ° C." air pre-cooled in the low temperature chamber 20 into the test chamber 14, The room temperature PV of the test room 14 in which the robot 12 is housed is set to "-40°C". Next, the environment forming apparatus 10 closes the low temperature passages 90 and 92 and opens the high temperature passages 80 and 82, and introduces the "150° C." air preheated in the high temperature chamber 18 into the test chamber 14. to set the room temperature PV of the test chamber 14 to "+125°C". Then, the environment forming apparatus 10 repeats a cycle of changing the room temperature PV of the test room 14 from "-40°C" to "+125°C" multiple times.

The environment generator 10 also closes the hot passages 80 and 82 and opens the cold passages 90 and 92 in the program test 122 of the composite test. Thereby, the environment forming apparatus 10 introduces the "-65.degree. C." air previously cooled in the low-temperature room 20 into the test room 14 to control the indoor temperature PV of the test room 14 to "-40.degree. After maintaining the room temperature PV at "-40°C" for a predetermined time (for example, 30 minutes), the environment forming device 10 controls the dual refrigerator unit 69 and the low temperature room heater 64 to set the low temperature room 20 and the low temperature room 20 The indoor temperature PV of the communicating test chamber 14 is controlled to "-20°C". Then, the environment forming apparatus 10 raises the room temperature PV of the low temperature room 20 and the test room 14 according to a preset program.

When the room temperature PV in the test chamber 14 is to be higher than the room temperature, the low temperature passages 90 and 92 are closed and the high temperature passages 80 and 82 are opened to remove the air preheated to +100°C in the high temperature chamber 18. is introduced into the test room 14 to control the room temperature PV of the test room 14 to "+80°C". The environment forming device 10 sets the indoor temperature PV to "+80° C." and maintains it for a predetermined time (for example, 30 minutes). After that, the environment forming apparatus 10 controls the high-temperature chamber heater 52, the high-temperature chamber air supply fan 48, and the high-temperature chamber air supply switching valve 46 to reduce the room temperature PV of the high-temperature chamber 18 and the test chamber 14 communicating with the high-temperature chamber 18. Control to "+125°C". Then, the environment forming apparatus 10 raises the temperature of the high temperature chamber 18 and the test chamber 14 according to a preset program.

Thereby, the environment forming apparatus 10 can perform a composite test in which the temperature cycle test 120 is followed by the program test 122 .

[Function block]
Next, the functions of the environment forming device 10 will be described in detail with reference to FIG.

FIG. 4 is a functional block diagram of the environment forming apparatus 10 according to the present embodiment, and FIG. 4 is a diagram showing an example of functions realized by control of the processor 100 provided in the controller 40 of the environment forming apparatus 10. .

As shown in FIG. 4, the environment forming apparatus 10 includes a temperature control section 130 as temperature control means, a change section 132 as change means, and a temperature difference acquisition section 134 as temperature difference acquisition means. The environment forming apparatus 10 also includes a calculated value acquisition unit 135 as a calculated value acquisition unit and a change prohibition unit 136 as a change prohibition unit. The function of each unit is realized by executing the environment forming apparatus program read from the storage unit 102 by the processor 100 of the environment forming apparatus 10 .

(Temperature control unit)
The temperature control unit 130 adjusts the output of the low temperature room heater 64 as a heating unit that heats the inside of the test chamber 14 while cooling the inside of the test chamber 14 as the environment generation chamber with a predetermined cooling capacity. The indoor temperature PV is controlled to be the precooling temperature SVn as the provisional target temperature.

Specifically, the processor 100 actuates each opener 84,86,94,96 to close each hot aisle 80,82 and open each cold aisle 90,92. Then, the processor 100 controls the binary refrigerator unit 69 and the low-temperature room heater 64 so that the room temperature PV of the low-temperature room 20 and the test room 14 communicating with the low-temperature room 20 becomes the precooling temperature SVn. Thereby, the processor 100 realizes the function as the temperature control section 130 .

The cooling capacity of the dual refrigerator unit 69 is determined based on the exposure temperature SV. The cooling capacity of the dual refrigerator unit 69 is set to a predetermined capacity that allows the low temperature chamber 20 and the test chamber 14 to be slightly lower than the exposure temperature SV.

The output of the low-temperature room heater 64 is controlled to a value such that the room temperature PV of the low-temperature room 20 and the test room 14 cooled by the binary refrigerator unit 69 becomes the precooling temperature SVn. PID control is used to control the output of the low temperature room heater 64 .

The output of the low-temperature room heater 64 is shown as a ratio when the maximum heating capacity of the low-temperature room heater 64 is 100%. For example, when the output of the low temperature room heater 64 is set to 1/4 of the maximum heating capacity of the low temperature room heater 64, the low temperature room heater output DHn indicating the output of the low temperature room heater 64 is set to 25%.

Here, the low-temperature room heater output DHn changes stepwise. Therefore, a different number is substituted for "n" of the low temperature room heater output DHn for each low temperature room heater output DHn having a different value.

(Temperature difference acquisition unit)
The temperature difference acquiring unit 134 acquires the temperature difference Xn between the precooling temperature SVn and the exposure temperature SV when the room temperature PV of the test chamber 14 reaches the precooling temperature SVn.

This calculation formula is shown in the following (Formula 1).

Temperature difference Xn = absolute value of (precooling temperature SVn - exposure temperature SV) (Equation 1)

Here, the temperature difference Xn changes stepwise. Therefore, a different number is substituted for "n" of the temperature difference Xn for each temperature difference Xn having a different value.

Also, the exposure temperature SV indicates the temperature to which the object 12 is exposed for a predetermined period of time in the test. The precooling temperature SVn is a provisional target temperature of the room temperature PV that is a control target in the process of bringing the room temperature PV of the test chamber 14 closer to the exposure temperature SV, and the precooling temperature SVn is changed stepwise. By changing the precooling temperature SVn step by step, the indoor temperature PV is gradually brought closer to the exposure temperature SV.

Specifically, the processor 100 of the controller 40 reads out the currently set exposure temperature SV and precooling temperature SVn from the storage unit 102 when the room temperature PV of the test chamber 14 has reached the precooling temperature SVn. The processor 100 then calculates and acquires the temperature difference Xn between the read precooling temperature SVn and the exposure temperature SV.

For example, if the exposure temperature SV is -40.degree. C. and the precooling temperature SVn is -41.degree. When the exposure temperature SV is -40°C and the precooling temperature SVn is -39°C, the temperature difference Xn between the exposure temperature SV (-40°C) and the precooling temperature SVn (-39°C) is 1°C.

The processor 100 then stores the acquired temperature difference Xn in the storage unit 102 . Thereby, the processor 100 realizes the function as the temperature difference acquisition unit 134 .

(calculated value acquisition unit)
When the room temperature PV of the test chamber 14 reaches the precooling temperature SVn, the calculated value acquisition unit 135 calculates the temperature difference Xn acquired by the temperature difference acquisition unit 134 with respect to the heating capacity of the low-temperature room heater 64 as a heating unit. is multiplied by the ratio of the output of the low-temperature room heater 64 to obtain a multiplied value. Then, the calculated value Yn is obtained by subtracting this multiplied value from the aforementioned temperature difference Xn.

Here, the calculated value Yn changes stepwise according to the temperature difference Xn obtained by the temperature difference obtaining unit 134 and the like. Therefore, a different number is substituted for "n" of the calculated value Yn for each calculated value Yn having a different value.

Specifically, the processor 100 of the controller 40 controls the heating power of the low-temperature room heater 64 from the low-temperature room heater output DHn output to the low-temperature room heater 64 in a state where the room temperature PV of the test chamber 14 has reached the pre-cooling temperature SVn. Obtain the ratio of the output of the cold room heater 64 to the capacity. For example, when the output of the low temperature room heater 64 is 1/4 of the maximum heating capacity of the low temperature room heater 64, the low temperature room heater output DHn output to the low temperature room heater 64 is obtained as 25%. This causes the processor 100 to obtain 25% (0.25) based on this cold room heater output DHn.

Then, the processor 100 multiplies the temperature difference Xn acquired by the temperature difference acquisition unit 134 by 25% (0.25) acquired based on the low-temperature room heater output DHn to acquire a multiplied value, and uses this multiplied value as the temperature. A calculated value Yn is obtained by subtracting from the temperature difference Xn obtained by the difference obtaining unit 134 .

This calculation formula is shown in the following (Formula 2).

Calculated value Yn={temperature difference Xn−(temperature difference Xn×low temperature room heater output DHn)} (Formula 2)

For example, when the temperature difference Xn obtained by the temperature difference obtaining unit 134 is 1° C. and the output of the low temperature room heater 64 based on the low temperature room heater output DHn is 25% (0.25), the calculated value Yn is {temperature difference Xn (1° C.)−(temperature difference Xn (1° C.)×low-temperature room heater output DHn (0.25))} gives 0.75.

The processor 100 then stores the obtained calculated value Yn in the storage unit 102 . Thereby, the processor 100 realizes the function as the calculated value acquisition unit 135 .

(change part)
In a state where the room temperature PV of the test chamber 14 is controlled to be the precooling temperature SVn as the provisional target temperature, the changing unit 132 adjusts the precooling temperature SVn so that the precooling temperature SVn approaches the exposure temperature SV as the target temperature. is changed based on the output of the low-temperature room heater 64 as the heating unit.

Here, when the exposure temperature SV is higher than the precooling temperature SVn, the room temperature PV is increased stepwise to approach the exposure temperature SV. Further, when the exposure temperature SV is lower than the precooling temperature SVn, the indoor temperature PV is lowered stepwise to approach the exposure temperature SV. Therefore, the change of the precooling temperature SVn will be described separately for the case where the exposure temperature SV is higher than the precooling temperature SVn and the case where the exposure temperature SV is lower than the precooling temperature SVn.

If the exposure temperature SV is higher than the precooling temperature SVn (exposure temperature SV>precooling temperature SVn), the provisional target temperature is calculated based on the value obtained by subtracting the calculated value Yn obtained by the calculated value obtaining unit 135 from the exposure temperature SV as the target temperature. change the precooling temperature SVn as .

Specifically, the processor 100 reads the exposure temperature SV and the precooling temperature SVn stored in the storage unit 102 and compares the exposure temperature SV and the precooling temperature SVn. When processor 100 determines that exposure temperature SV is higher than precooling temperature SVn, processor 100 changes precooling temperature SVn based on a value obtained by subtracting calculated value Yn obtained by calculated value obtaining unit 135 from exposure temperature SV.

This calculation formula is shown in the following (Formula 3).

Changed pre-cooling temperature SVn=Exposure temperature SV−Calculated value Yn=Exposure temperature SV−{Temperature difference Xn−(Temperature difference Xn×Low temperature room heater output DHn)} (Formula 3)

For example, if the exposure temperature SV is −40° C. and the precooling temperature SVn is −41° C., the processor 100 determines that the exposure temperature SV (−40° C.) is higher than the precooling temperature SVn (−41° C.). When the calculated value Yn obtained by the calculated value obtaining unit 135 is "0.75", the value obtained by subtracting the calculated value Yn (0.75) from the exposure temperature SV (-40°C) (-40.75°C) The precooling temperature SVn is changed based on Here, in the present embodiment, the value (-40.75°C) obtained by subtracting the calculated value Yn (0.75) from the exposure temperature SV (-40°C) is taken as the precooling temperature SVn (-40.75°C).

When the exposure temperature SV as the target temperature is lower than the precooling temperature SVn as the provisional target temperature (exposure temperature SV<precooling temperature SVn), the changing unit 132 sets the exposure temperature SV to the calculated value Yn obtained by the calculated value obtaining unit 135. is added to change the precooling temperature SVn.

Specifically, the processor 100 reads the exposure temperature SV and the precooling temperature SVn stored in the storage unit 102 and compares the exposure temperature SV and the precooling temperature SVn. When the processor 100 determines that the exposure temperature SV is lower than the precooling temperature SVn, the processor 100 changes the precooling temperature SVn based on the value obtained by adding the calculated value Yn obtained by the calculated value obtaining unit 135 to the exposure temperature SV.

This calculation formula is shown in the following (Formula 4).

Changed precooling temperature SVn=Exposure temperature SV+Calculated value Yn=Exposure temperature SV+{Temperature difference Xn−(Temperature difference Xn×Low temperature room heater output DHn)} (Formula 4)

For example, if the exposure temperature SV is −40° C. and the precooling temperature SVn is −39° C., the processor 100 determines that the exposure temperature SV (−40° C.) is lower than the precooling temperature SVn (−39° C.). When the calculated value Yn obtained by the calculated value obtaining unit 135 is 0.75, the value (-39.25°C) obtained by adding the calculated value Yn (0.75) to the exposure temperature SV (-40°C) is to change the precooling temperature SVn. Here, in the present embodiment, the value (-39.25° C.) obtained by adding the calculated value Yn (0.75) to the exposure temperature SV (-40° C.) is defined as the precooling temperature SVn (-39.25° C.).

Further, the changing unit 132 repeats changing the precooling temperature SVn until the room temperature PV of the test chamber 14 reaches within the temperature range determined based on the exposure temperature SV.

Specifically, the processor 100 determines that the indoor temperature PV indicated by the test room sensor input from the test room sensor 60 is within the temperature range of the exposure temperature SV (-40°C) ±0.3°C (-40.3 or higher). The change of the precooling temperature SVn is repeated until it reaches -39.7°C or less. Thereby, the processor 100 realizes the function as the changing unit 132 . Here, the temperature range described above is not limited to the range of the exposure temperature SV (-40°C) ±0.3°C, and can be changed.

(Prohibition of change)
After the change unit 132 changes the precooling temperature SVn, the change prohibition unit 136 prohibits the change by the change unit 132 until the room temperature PV of the test chamber 14 reaches the precooling temperature SVn.

Specifically, the processor 100 obtains the room temperature PV of the test chamber 14 from the test chamber sensor input from the test chamber sensor 60 after the change unit 132 changes the precooling temperature SVn. Then, the processor 100 prohibits change by the changing unit 132 until the room temperature PV of the test chamber 14 reaches the precooling temperature SVn, and does not change the precooling temperature SVn by the changing unit 132 . Thereby, the processor 100 realizes the function as the change prohibition unit 136 .

On the other hand, processor 100 allows changing unit 132 to change precooling temperature SVn when room temperature PV of test chamber 14 reaches precooling temperature SVn after changing unit 132 changes precooling temperature SVn.

(Description of operation)
An example of performing the program test 122 in the environment forming apparatus 10 will be described with reference to FIGS.

FIG. 5 is a flow chart showing the operation of the environment forming device 10 according to this embodiment. FIG. 6 is a diagram showing an example of the operation of the environment forming apparatus 10 according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature SV is higher than the precooling temperature SVn in the control for lowering the temperature of the test chamber 14. . FIG. 7 is a diagram showing an example of the operation of the environment forming apparatus 10 according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature SV is lower than the precooling temperature SVn in the control for raising the temperature of the test chamber 14. is.

FIG. 8 is a diagram showing an example of the operation of the environment forming apparatus 10 according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature SV is lower than the precooling temperature SVn in the control for lowering the temperature of the test chamber 14. . FIG. 9 is a diagram showing an example of the operation of the environment forming apparatus 10 according to the present embodiment, and is an explanatory diagram showing a case where the exposure temperature SV is higher than the precooling temperature SVn in the control for increasing the temperature of the test chamber 14. .

Here, FIG. 6 shows an example in which the room temperature PV of the test chamber 14 is once set to a precooling temperature SV1 lower than the exposure temperature SV, and then the room temperature PV is increased to approach the exposure temperature SV. This reduces the time required for the indoor temperature PV to reach the exposure temperature SV.

FIG. 7 shows an example in which the room temperature PV of the test chamber 14 is once set to a precooling temperature SV1 higher than the exposure temperature SV, and then the room temperature PV is decreased to approach the exposure temperature SV. This reduces the time required for the indoor temperature PV to reach the exposure temperature SV.

FIG. 8 shows an example in which the room temperature PV of the test chamber 14 is once set to a precooling temperature SV1 higher than the exposure temperature SV, and then the room temperature PV is decreased to approach the exposure temperature SV. As a result, the room temperature PV is gradually brought closer to the exposure temperature SV.

FIG. 9 shows an example in which the room temperature PV of the test chamber 14 is once set to a precooling temperature SV1 lower than the exposure temperature SV, and then the room temperature PV is increased to approach the exposure temperature SV. As a result, the room temperature PV is gradually brought closer to the exposure temperature SV.

6 and 9 coincide in that the exposure temperature SV is higher than the precooling temperature SV1, and similar temperature control is performed in FIGS. 7 and 8 are identical in that the exposure temperature SV is lower than the precooling temperature SV1, and similar temperature control is performed in FIGS. 6 and 9. FIG.

When the program test 122 is started, the environment forming apparatus 10 controls the test chamber 14 to the preset exposure temperature SV. The exposure temperature SV is lower than the room temperature, and the high temperature passages 80 and 82 are closed by the opening/closing portions 84, 86, 94 and 96 and the low temperature passages 90 and 92 are opened. In this state, it is assumed that the indoor temperature PV of the low temperature chamber 20 and the test chamber 14 is controlled by the dual refrigerator unit 69 and the low temperature chamber heater 64 .

As shown in FIG. 5, when the processor 100 of the controller 40 executes the environment forming apparatus program stored in the storage unit 102, a program test is called from the main routine. Then, the processor 100 reads the exposure temperature SV, which is the target temperature, and the precooling temperature SV1 (initial value), which is the provisional target temperature, from the storage unit 102 (step S10).

Processor 100 then determines whether or not precooling temperature SVn and exposure temperature SV are the same (step S12).

If it is determined in step S12 that the precooling temperature SVn and the exposure temperature SV are the same, the processor 100 branches to step S50 to perform normal temperature control. On the other hand, when determining that the precooling temperature SVn and the exposure temperature SV are different, the processor 100 starts control to the precooling temperature SV1 (initial value) (step S14).

Here, for example, as shown in FIGS. 6 and 9, when the exposure temperature SV is set to −40° C. and the precooling temperature SV1 is set to −41° C., the processor 100 sets the precooling temperature SV1 and It is determined that the temperature is different from the exposure temperature SV, and control to the precooling temperature SV1 is started.

In controlling the precooling temperature SV1, the processor 100 maintains the cooling capacity of the binary refrigerator unit 69 at a predetermined value based on the precooling temperature SV1, and PID-controls the low-temperature room heater 64 to control the room temperature of the test chamber 14. The PV is controlled to be the precooling temperature SV1.

Processor 100 then determines whether or not room temperature PV has reached precooling temperature SV1 (step S16), and waits until room temperature PV reaches precooling temperature SV1.

When determining in step S16 that the room temperature PV has reached the precooling temperature SV1, the processor 100 maintains the room temperature PV at the precooling temperature SV1 (step S18). Processor 100 then starts counting precooling holding time t2 (step S20) and determines whether or not precooling holding time t2 has elapsed (step S22). The pre-cooling holding time t2 is set to 10 minutes, for example. The precooling holding time t2 is not limited to 10 minutes, and the precooling holding time t2 may be set to another time such as 30 minutes.

If it is determined in step S22 that the precooling holding time t2 has elapsed, the processor 100 calculates and obtains the temperature difference Xn between the exposure temperature SV and the precooling temperature SVn (step S24).

Specifically, the temperature difference X1 (1° C.) is the absolute value of (precooling temperature SV1 (−41° C.)−exposure temperature SV (−40° C.)). Thus, the processor 100 obtains the temperature difference X1 (1° C.) between the exposure temperature SV (−40° C.) and the precooling temperature SV1 (−41° C.).

In addition, the processor 100 acquires the low temperature room heater output DHn to the low temperature room heater 64 under PID control while maintaining the room temperature PV at the precooling temperature SVn (-41° C.). Thereby, the processor 100 calculates the ratio of the output of the low-temperature room heater 64 to the heating capacity of the low-temperature room heater 64 (step S26). Specifically, if the cold room heater output DH1 to cold room heater 64 is 25%, processor 100 obtains 25% (0.25).

Here, the room temperature PV of the test chamber 14 is determined by the cooling capacity of the dual refrigerator unit 69 , the heating capacity of the low-temperature room heater 64 , and the heat emitted from the object 12 . The heat emitted from the object 12 includes heat accumulated in the object 12 and heat generated in the object 12 during, for example, an electrical test.

When the heat accumulated in the object 12 is higher than the room temperature PV, the heat accumulated in the object 12 raises the room temperature PV. When the heat accumulated in the object 12 is lower than the room temperature PV, the heat accumulated in the object 12 lowers the room temperature PV. The heat accumulated in object 12 is determined by the heat capacity of object 12 . Also, the heat generated by the object 12 raises the indoor temperature PV.

In this way, the room temperature PV of the test chamber 14 cooled by the binary refrigerator unit 69 varies depending on the state of the object 12 accommodated in the test chamber 14, but the temperature PV from the PID-controlled low-temperature room heater 64 is The heat keeps the room temperature PV at the precooling temperature SV1.

As such, the heat from the cold room heater 64 varies with the heat emitted from the object 12 . As a result, the output from the low-temperature room heater 64 reflects the state of heat release from the object 12 .

Further, the processor 100 subtracts the multiplied value obtained by multiplying the temperature difference Xn between the exposure temperature SV and the precooling temperature SVn by the low-temperature room heater output DHn from the temperature difference Xn to obtain a calculated value Yn (step S28).

Specifically, using the above-mentioned (Equation 2), the calculated value Y1 (0.75)=temperature difference X1 (1° C.)−{temperature difference X1 (1° C.)×low temperature room heater output DH1 (0.25 )}. Thus, the processor 100 multiplies the temperature difference X1 (1° C.) between the exposure temperature SV (−40° C.) and the precooling temperature SV1 (−41° C.) by the low temperature room heater output DH1 (25%: 0.25). A calculated value Yn is obtained by subtracting the multiplied value from the temperature difference X1 (1° C.).

Here, when the room temperature PV is maintained at the pre-cooling temperature SV1 and the low-temperature room heater output DH1 indicating the output of the low-temperature room heater 64 is 25%, the output of the low-temperature room heater 64 has a reserve power of 75%. can be assumed. Therefore, the product value obtained by multiplying the temperature difference X1 by 25% is subtracted from the temperature difference X1 between the exposure temperature SV and the precooling temperature SV1 to obtain the calculated value Y1. By calculating the precooling temperature SV2 using the calculated value Y1, it is possible to obtain the precooling temperature SV2 based on the remaining power of the low-temperature room heater 64. FIG.

Processor 100 then determines whether exposure temperature SV is higher than precooling temperature SVn (step S30).

Here, in FIGS. 6 and 9, the room temperature PV is raised from the precooling temperature SV1 lower than the exposure temperature SV to bring the room temperature PV closer to the exposure temperature SV. Therefore, in step S30, it is determined that the exposure temperature SV is higher than the precooling temperature SVn (exposure temperature SV>precooling temperature SVn).

In this case, the processor 100 changes the precooling temperature SVn based on the value obtained by subtracting the calculated value Yn obtained in step S28 from the exposure temperature SV (step S32).

As an example, the exposure temperature SV is -40°C. The precooling temperature SV1 is -41°C. A temperature difference X1 between the exposure temperature SV and the precooling temperature SV1 is 1°C. The cold room heater output DH1 is 25% (0.25) (see FIGS. 6 and 9).

In this case, the current precooling temperature SV1 of "-41°C" is changed to the post-change precooling temperature SV2 of "40.75°C" (see Figs. 6 and 9).

Specifically, using the above-mentioned (Equation 3), precooling temperature SV2 after change (-40.75°C) = exposure temperature SV (-40°C) - calculated value Y1 (0.75) = exposure temperature SV (−40° C.)−{temperature difference X1 (1° C.)−(temperature difference X1 (1° C.)×low temperature room heater output DH1 (0.25))}.

In this way, the changed precooling temperature SV2 is determined based on the output of the low-temperature room heater 64, so that the changed precooling temperature SV2 reflects the state of the accommodated object 12. FIG.

At this time, the post-change precooling temperature SV2 (-40.75°C) is higher than the pre-change precooling temperature SV1 (-41°C). Therefore, the low-temperature room heater output DHn of the low-temperature room heater 64 temporarily becomes 100% in order to raise the room temperature PV (see FIGS. 6 and 9).

On the other hand, in FIGS. 7 and 8, the room temperature PV is lowered from the precooling temperature SV1 higher than the exposure temperature SV to bring the room temperature PV closer to the exposure temperature SV. Therefore, in step S30, it is determined that the exposure temperature SV is lower than the precooling temperature SVn (exposure temperature SV<precooling temperature SVn).

In this case, the processor 100 changes the precooling temperature SVn based on the value obtained by adding the calculated value Yn obtained in step S28 to the exposure temperature SV (step S34).

As an example, the exposure temperature SV is -40°C. The precooling temperature SV1 is -39°C. A temperature difference X1 between the exposure temperature SV and the precooling temperature SV1 is 1°C. The cold room heater output DH1 is 25% (0.25) (see FIGS. 7 and 8).

In this case, the current precooling temperature SV1 of "-39°C" is changed to "-39.25°C" of the post-change precooling temperature SV2 (see Figs. 7 and 8).

Specifically, using the above-mentioned (Equation 4), precooling temperature SV2 after change (-39.25°C) = exposure temperature SV (-40°C) + calculated value Y1 (0.75°C) = exposure temperature SV (−40° C.)+{temperature difference X1 (1° C.)−(temperature difference X1 (1° C.)×low temperature room heater output DH1 (0.25))}.

In this way, the changed precooling temperature SV2 is determined based on the output of the low-temperature room heater 64, so that the changed precooling temperature SV2 reflects the state of the accommodated object 12. FIG.

At this time, the post-change precooling temperature SV2 (-39.25°C) is lower than the pre-change precooling temperature SV1 (-39°C). Therefore, the low-temperature room heater output DHn of the low-temperature room heater 64 temporarily becomes 0% in order to lower the room temperature PV (see FIGS. 7 and 8).

Then, the processor 100 waits until the indoor temperature PV reaches the precooling temperature SVn (step S36).

If it is determined in step S36 that the indoor temperature PV has reached the precooling temperature SVn, the processor 100 determines whether the indoor temperature PV has reached the temperature range determined based on the exposure temperature SV (step S38). ). Specifically, it is determined whether the indoor temperature PV has reached the temperature range of ±0.3°C (-40.3°C or higher and -39.7°C or lower) of the exposure temperature SV (-40°C). do.

If it is determined in step S38 that the room temperature PV has not reached within the temperature range, the processor 100 branches to step S24 and repeats changing the precooling temperature SVn until the room temperature PV reaches within the temperature range.

Taking FIG. 6 as an example, the exposure temperature SV is -40.degree. C. and the precooling temperature SV2 is -40.75.degree. When explained using the above-mentioned (formula 1), the absolute value of the temperature difference X2 (0.75)=(precooling temperature SV2 (-40.75)-exposure temperature SV (-40.degree. C.)). Further, in a state in which the room temperature PV is maintained at the precooling temperature SV2 (-40.75° C.), the low temperature room heater output DH2 to the low temperature room heater 64 is 60% (0.6) (step S26).

Then, the temperature difference X2 (0.75°C) between the exposure temperature SV (-40°C) and the precooling temperature SV2 (-40.75°C) is multiplied by the low-temperature room heater output DH2 (60%: 0.6). A calculated value Y2 obtained by subtracting the value from the temperature difference X2 (0.75° C.) is 0.3 (step S28). To explain using the above-mentioned (Equation 2), the calculated value Y2 (0.3) = {temperature difference X2 (0.75°C) - (temperature difference X2 (0.75°C) x low temperature room heater output DH2 (0 .6))}.

Then, since the exposure temperature SV (−40° C.) is higher than the precooling temperature SV2 (−40.75° C.) (step S30), the post-change precooling temperature SV3 is obtained using the above-described (Equation 3) (step S32).

Using the above-mentioned (Equation 3), pre-cooling temperature SV3 after change (-40.3°C) = exposure temperature SV (-40°C) - calculated value Y2 (0.3) = exposure temperature SV (-40 C.)-{Temperature difference X2 (0.75.degree. C.)-(Temperature difference X2 (0.75.degree. C.).times.Low temperature room heater output DH2 (0.6))}.

Then, the processor 100 waits until the room temperature PV reaches the precooling temperature SV3 (step S36). After that, the processor 100 continues until the room temperature PV reaches the temperature range of ±0.3° C. (−40.3° C. or more and −39.7° C. or less) of the exposure temperature SV (−40° C.) (step S38). Repeat each step.

On the other hand, if it is determined in step S38 that the indoor temperature PV has reached the temperature range, the processor 100 changes the control target so that the indoor temperature PV reaches the exposure temperature SV (step S40). is started (step S50).

Specifically, the processor 100 maintains the cooling capacity of the binary refrigerator unit 69 at a predetermined value based on the exposure temperature SV, and PID-controls the low-temperature room heater 64 so that the room temperature PV in the test chamber 14 is exposed. The temperature is controlled to SV.

Then, the processor 100 waits until the room temperature PV indicated by the test room sensor input reaches the exposure temperature SV (step S52).

When determining in step S52 that the room temperature PV has reached the exposure temperature SV, the processor 100 maintains the room temperature PV at the exposure temperature SV (step S54). Then, the processor 100 starts counting the preset exposure holding time t1 (step S56), and determines whether or not the exposure holding time t1 has elapsed (step S58). The exposure holding time t1 is set to, for example, 30 minutes.

If it is determined at step S58 that the exposure hold time t1 has elapsed, processor 100 determines whether all preset exposure steps in program test 122 have been completed (step S60).

If at step S60 it is determined that all exposure steps have not been completed, the processor 100 branches to step S10. The processor 100 then reads the exposure temperature SV stored in the storage unit 102 as the next exposure step in the program test 122 together with the precooling temperature SV1 (initial value for the next exposure step) (step S10), and performs the subsequent steps. to implement.

On the other hand, if it is determined in step S60 that all the exposure steps have been completed, processor 100 ends the test start process and returns to the routine that called the test start process.

(Action and effect)
The environment forming device 10 according to the present embodiment described above has the following effects.

The environment forming apparatus 10 of the present embodiment sets the indoor temperature PV of the test chamber 14 as the environment forming chamber in which the object 12 is housed to the exposure temperature SV as the target temperature. The environment forming apparatus 10 cools the inside of the test chamber 14 with a predetermined cooling capacity and adjusts the output of the low-temperature room heater 64, which is a heating unit that heats the inside of the test chamber 14, to pre-cool the room temperature PV to the temporary target temperature. A temperature control unit 130, which is a temperature control means for controlling the temperature SVn, is provided. The environment forming device 10 changes the precooling temperature SVn based on the output of the low-temperature room heater 64 so that the precooling temperature SVn approaches the exposure temperature SV in a state where the indoor temperature PV is controlled to be the precooling temperature SVn. A changing unit 132 is provided.

According to the environment forming apparatus 10 as described above, precooling as a provisional target temperature is performed based on the output of the low-temperature room heater 64 as a heating unit that changes according to the object 12 accommodated in the test chamber 14 as an environment forming chamber. Change the temperature SVn. Therefore, the environment forming device 10 can perform temperature control in consideration of the state of the object 12 to be accommodated.

For this reason, compared to the case where the precooling temperature must be assumed by predicting the state of the object 12 housed in the test chamber 14, and the assumed precooling temperature must be input to the environment forming apparatus 10 before the start of the test, It is possible to simplify preparatory work before testing.

Also, the precooling temperature SVn is changed based on the output of the low-temperature room heater 64 that changes according to the object 12 . Therefore, the environment forming apparatus 10 can set the precooling temperature without performing complicated calculations in consideration of the heat capacity or the heat generation amount of the object 12, unlike the case where the precooling temperature is set by predicting the state of the object 12. SVn can be changed.

Then, compared to the case where the next test is performed using the precooling temperature adjusted based on the previous test result, when the object 12 to be tested is changed, the changed object 12 It is possible to set the precooling temperature SVn accordingly.

Further, the environment forming device 10 of the present embodiment acquires the temperature difference Xn between the exposure temperature SV as the target temperature and the precooling temperature SVn in a state where the room temperature PV reaches the precooling temperature SVn as the provisional target temperature. A temperature difference acquisition unit 134 is provided as acquisition means. When the room temperature PV reaches the precooling temperature SVn, the environment forming device 10 multiplies the temperature difference Xn by the ratio of the output of the low temperature room heater 64 to the heating capacity of the low temperature room heater 64 as a heating unit. A calculated value obtaining unit 135 is provided as a calculated value obtaining means for obtaining a calculated value Yn by subtracting a value from the temperature difference Xn. A changing unit 132 as changing means changes the precooling temperature SVn based on a value obtained by subtracting the calculated value Yn from the exposure temperature SV when the exposure temperature SV is higher than the precooling temperature SVn. If the exposure temperature SV is lower than the precooling temperature SVn, the changing unit 132 changes the precooling temperature SVn based on the addition of the calculated value Yn to the exposure temperature SV.

According to the environment forming apparatus 10 as described above, the precooling temperature SVn can be changed by calculation. It is possible to reduce the area.

The precooling temperature SVn can be changed even when the exposure temperature SV is higher than the precooling temperature SVn or when the exposure temperature SV is lower than the precooling temperature SVn. Therefore, in both the case where the room temperature PV is increased while approaching the exposure temperature SV and the case where the room temperature PV is decreased and approached with the exposure temperature SV, the temperature control is performed in consideration of the state of the object 12 to be accommodated. It becomes possible.

Further, in the environment forming apparatus 10 of the present embodiment, the changing unit 132, which is changing means, repeats changing the precooling temperature SVn until the room temperature PV reaches within the temperature range determined based on the exposure temperature SV.

According to such an environment forming apparatus 10, the room temperature PV can be brought closer to the exposure temperature SV while changing the precooling temperature SVn in stages. Therefore, compared to the case where the room temperature PV is set to the exposure temperature SV at once, it is possible to suppress the overshoot and undershoot of the room temperature PV that may occur when the exposure temperature SV is reached.

Further, the environment forming apparatus 10 of the present embodiment serves as change prohibition means for prohibiting change by the change unit 132 until the indoor temperature PV reaches the precooling temperature SVn after the change unit 132 changes the precooling temperature SVn. is further provided with a change prohibition unit 136 of

According to such an environment forming device 10, changing the precooling temperature SVn is prohibited until the room temperature PV reaches the precooling temperature SVn. Therefore, it is possible to change the precooling temperature SVn without being affected by the low-temperature room heater output DHn, which may change greatly after changing the precooling temperature SVn.

Although the embodiments of the present invention have been described above, the above embodiments merely show a part of application examples of the present invention, and the technical scope of the present invention is not limited to the specific configurations of the above embodiments. do not have.

For example, each hardware configuration and software configuration of the controller 40 of the environment forming apparatus 10 in the above-described embodiment is one aspect, and can be arbitrarily changed within the technical scope of the present invention. As an example, each hardware configuration and each software configuration of the controller 40 may be implemented by a single computer, or may be implemented as a system that appropriately integrates the functions of multiple computers on a network or the like. Also good.

Further, in the above embodiment, the environment forming apparatus 10 including the high temperature chamber 18, the test chamber 14, and the low temperature chamber 20 has been described as an example, but the present embodiment is not limited to this. For example, the environment forming device 10 may be a device with only one test chamber 14 .

When the environment forming apparatus 10 includes only one test chamber 14, the room temperature PV of the test chamber 14 can be changed from the current temperature to the next precooling or preheating temperature by the temperature control device provided in the environment forming apparatus 10. can. Therefore, the environment forming apparatus 10 can realize the temperature control shown in FIGS. 6 to 9 by operating according to the flowchart of FIG.

The configurations of the above embodiments can be combined with each other within a logically consistent range.

In addition, the processor 100 as a computer adjusts the output of a low-temperature room heater 64 as a heating unit for heating the inside of the test chamber 14 while cooling the inside of the test chamber 14, which is an environment generation chamber, with a predetermined cooling capacity to adjust the room temperature. The PV is controlled so as to reach the precooling temperature SVn as the provisional target temperature. Further, the processor 100 changes the precooling temperature SVn based on the output of the low-temperature room heater 64 so that the precooling temperature SVn approaches the exposure temperature SV in a state where the room temperature PV is controlled to be the precooling temperature SVn. An environment forming device program used in the environment forming device 10 having such a processor 100 is also included in the scope of matters disclosed in the specification of the present application as of the filing.

10 environment forming device 12 object 14 test room 40 controller 60 test room sensor 64 low temperature room heater 69 binary refrigerator unit 70 low temperature room fan motor 100 processor 122 program test 130 temperature control section 132 change section 134 temperature difference acquisition section 135 calculation Value acquisition unit 136 Change prohibition unit SV Exposure temperature PV Room temperature SVn Pre-cooling temperature Xn Temperature difference

Claims (5)

An environment forming device for setting the indoor temperature of an environment forming chamber in which an object is housed to a target temperature,
temperature control means for adjusting the output of a heating unit that heats the inside of the environment creating room while cooling the inside of the environment creating room with a predetermined cooling capacity, thereby controlling the room temperature to reach a temporary target temperature;
changing means for changing the provisional target temperature based on the output of the heating unit so that the provisional target temperature approaches the target temperature in a state in which the indoor temperature is controlled to be the provisional target temperature;
An environment shaping device comprising: The environment forming device according to claim 1,
temperature difference acquisition means for acquiring a temperature difference between the target temperature and the provisional target temperature when the indoor temperature reaches the provisional target temperature;
When the room temperature reaches the temporary target temperature, a calculated value is obtained by subtracting from the temperature difference a multiplied value obtained by multiplying the temperature difference by a ratio of the output to the heating capacity of the heating unit. a calculated value obtaining means;
further comprising
The changing means is
when the target temperature is higher than the provisional target temperature, changing the provisional target temperature based on a value obtained by subtracting the calculated value from the target temperature;
when the target temperature is lower than the provisional target temperature, changing the provisional target temperature based on a value obtained by adding the calculated value to the target temperature;
Environment shaping device. The environment forming device according to claim 1,
The changing means repeats changing the provisional target temperature until the room temperature reaches a temperature range determined based on the target temperature.
Environment shaping device. The environment forming device according to claim 3,
Further comprising change prohibition means for prohibiting change by the change means until the indoor temperature reaches the temporary target temperature after the change means has changed the temporary target temperature.
Environment shaping device. In an environment forming device program used in an environment forming device for setting the indoor temperature of an environment forming chamber in which an object is housed to a target temperature,
to the computer,
adjusting the output of a heating unit that heats the inside of the environment creating room while cooling the inside of the environment creating room with a predetermined cooling capacity so that the room temperature becomes a temporary target temperature;
executing a procedure for changing the provisional target temperature based on the output of the heating unit so that the provisional target temperature approaches the target temperature in a state in which the indoor temperature is controlled to be the provisional target temperature;
A program for an environment generator.

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