JP7259494B2 - Additive manufacturing equipment - Google Patents

Description

The present disclosure relates to an additive manufacturing apparatus.

Patent Literature 1 discloses an apparatus for manufacturing a modeled object. This apparatus obtains a model by irradiating an energy beam to a powder layer as a raw material arranged in layers on a work table to partially melt the powder layer. In such an apparatus, the steps of melting a selected portion of the powder layer, solidifying the melted portion, overlaying a new powder layer on the solidified portion, and removing the selected portion of the new powder layer and a step of melting, are repeated to manufacture a modeled object.

Japanese Patent Publication No. 2003-531034

Melting and solidification of the powder layer is accompanied by thermal deformation due to the material properties of the powder. If this thermal deformation is not allowed, the model will receive unintended thermal stress. As a result, distortion or cracking due to thermal stress is more likely to occur, thereby degrading the modeling accuracy or quality of the model.

Accordingly, the present disclosure describes a layered manufacturing apparatus that suppresses deterioration of manufacturing accuracy or quality.

A layered manufacturing apparatus according to one aspect of the present disclosure includes a substrate including a plurality of split plates that support powder, a powder solidifying unit that hardens the powder on the split plates, and defines the direction of movement and/or deformation of the split plates. a guide including a direction restricting portion.

In this layered manufacturing apparatus, a substrate that supports a modeled object is composed of a plurality of split plates. The directions of movement and/or deformation of these dividing plates are regulated by direction regulating portions. As a result, the substrate can flexibly follow the thermal deformation of the modeled object, so that the thermally deformed modeled object is not subjected to unintended thermal stress. Therefore, it is possible to suppress the deterioration of the modeling accuracy or the quality of the modeled object.

In the layered manufacturing apparatus described above, the split plate may include a support surface that supports the powder, and the shape of the support surface may be rectangular. In this layered manufacturing apparatus, since the substrate is divided into a plurality of rectangular division plates, one division plate is miniaturized. Thereby, installation of the dividing plate can be facilitated. Also, it is easier to maintain flatness and manufacture a small plate than a large plate. This makes it possible to suppress the deterioration of the flatness of the substrate as a whole. As a result, deterioration in modeling accuracy can be further suppressed.

In the layered manufacturing apparatus described above, the plurality of split plates includes a first split plate and a second split plate arranged around the first split plate and provided with a direction restricting portion, and the guide includes a second split plate. It may further include a position restricting portion provided on the one split plate to restrict the position of the first split plate, and the direction restricting portion may allow movement of the second split plate along a movement axis passing through the position restricting portion. According to this configuration, although the movement of the first split plate is restricted, expansion or contraction around the position restriction portion is allowed. On the other hand, the second split plate is allowed to move and/or deform along the axis of motion. Therefore, since the substrate that supports the modeled object can flexibly follow the thermal deformation of the modeled object, it is possible to suppress the deterioration of the modeling accuracy or the quality of the modeled object.

In the above-described layered manufacturing apparatus, the divided plate includes a support surface that supports the powder, and the guide includes an additional direction restricting portion provided on the second divided plate and extending along an additional movement axis that intersects with the movement axis. Further, when each of the plurality of second divided plates is viewed from the normal direction of the support surface, the shape of the direction restricting portion and the additional direction restricting portion may be the same in each of the second divided plates. According to this configuration, since the plurality of second divided plates have the same shape, the degree of freedom in arranging the plurality of second divided plates increases. As a result, it is possible to suppress deterioration in workability when arranging the second split plate.

In the layered manufacturing apparatus described above, the guide may further include a rotation restricting portion provided on the second split plate and extending along an axis parallel to the movement axis. According to this configuration, the rotational movement of the second split plate is restricted. Therefore, unintended movement of the second split plate is further suppressed, so that deterioration of modeling accuracy or quality can be further suppressed.

In the laminate manufacturing apparatus described above, the substrate may include a plurality of divided plates divided along boundary lines extending radially from the base point, and the plurality of divided plates may have the same shape. With this configuration as well, it is possible to suppress a decrease in modeling accuracy or quality and a decrease in workability.

According to the layered manufacturing apparatus of the present disclosure, it is possible to suppress deterioration in modeling accuracy or quality of a modeled object.

It is a sectional view showing a layered manufacturing device concerning one embodiment. FIG. 4 is a perspective view showing a substrate placed on a work table; It is a figure which shows the board|substrate which concerns on embodiment. FIG. 4 is an enlarged cross-sectional view showing a substrate placed in a modeling tank; It is a figure which shows the board|substrate with which the lamination-molding apparatus which concerns on another embodiment is provided. It is a figure which shows the board|substrate with which the lamination-molding apparatus which concerns on another embodiment is provided. FIG. 10 is a diagram showing a substrate including a plurality of split plates according to modification 1; Figure 8 shows the dividing plate of Figure 7; FIG. 11 is a cross-sectional view showing an enlarged substrate of Modification 1; FIG. 10 is a diagram showing a substrate according to modification 2; FIG. 11 is a diagram showing a substrate according to modification 3; FIG. 11 is a diagram showing a substrate according to modification 4;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

The laminate molding apparatus shown in FIG. 1 is a so-called 3D (three-dimensional) printer. In the following description, the layered modeling apparatus is simply referred to as "modeling apparatus 1". The modeling apparatus 1 partially applies energy to the metal powder 2 arranged in layers to sinter or melt the metal powder 2 . The modeling apparatus 1 repeatedly sinters or melts metal powder 2 to manufacture a three-dimensional modeled object 3 .

The modeled object 3 is, for example, a machine part. Note that the modeled object 3 may be another structure. The metal powder 2 is, for example, titanium-based metal powder, Inconel (registered trademark) powder, aluminum powder, stainless steel powder, or the like. The powder that is the material of the modeled object 3 is not limited to metal powder. The powder may include carbon fiber and resin, for example CFRP (Carbon Fiber Reinforced Plastics). The powder may also contain other materials. For example, the powder may include a conductive material having electrical conductivity.

The modeling apparatus 1 includes a vacuum chamber 4 , a work table 5 (elevating section), an elevating device 6 , a powder supply device 7 , an electron beam irradiation device 8 (powder solidification section, energy application section), and a modeling tank 10 . , a controller 18 . The vacuum chamber 4 is a container whose interior can be evacuated (low pressure). A vacuum pump (not shown) is connected to the vacuum chamber 4 . The shape of the work table 5 is, for example, a plate shape. The shape of the work table 5 is, for example, circular in plan view. The shape of the work table 5 is not limited to circular. The shape of the work table 5 may be rectangular. Moreover, the shape of the work table 5 may be other shapes.

A substrate 15 is placed on the work table 5 . A metal powder 2 , which is a material for the modeled object 3 , is placed on the substrate 15 . The metal powder 2 on the substrate 15 is arranged in layers, for example, in multiple layers. The configuration of the substrate 15 will be described later.

The working table 5 and the substrate 15 are arranged in the build tank 10 inside the vacuum chamber 4 . In the modeling tank 10, the work table 5 is movable in the Z direction (vertical direction). Then, the work table 5 is lowered sequentially according to the number of layers of the metal powder 2 . A side wall 10 a of the modeling tank 10 guides movement of the work table 5 . The shape of the side wall 10a corresponds to the outer shape of the work table 5. As shown in FIG. For example, when the work table 5 has a disk shape, the area surrounded by the side wall 10a has a cylindrical shape. Moreover, when the shape of the work table 5 is rectangular, the shape of the area surrounded by the side walls 10a is a rectangular tube. The side wall 10 a of the modeling tank 10 and the working table 5 form a container for accommodating the metal powder 2 and the shaped article 3 . The work table 5 may constitute the bottom of the modeling tank 10 .

The lifting device 6 lifts and lowers the work table 5 . The substrate 15 on the work table 5, the metal powder 2 on the substrate 15, and the modeled object 3 are moved up and down by the lifting device 6 lifting and lowering the work table 5. FIG. The lifting device 6 includes, for example, a rack-and-pinion drive mechanism. These mechanisms allow the lifting device 6 to move the work table 5 in the Z direction. The lifting device 6 includes a vertical member 6a (rack) and a drive source 6b. The vertical member 6a is a rod-shaped member that is connected to the back surface of the work table 5 and extends downward. The drive source 6b drives the vertical member 6a. For example, an electric motor may be used as the drive source 6b. A pinion is provided on the output shaft of the electric motor. A tooth profile that meshes with the pinion is provided on the side surface of the vertical member 6a. When the electric motor is driven, the pinion rotates. Power is transmitted by the rotation of this pinion. As a result, the vertical member 6a moves vertically. When the electric motor stops rotating, the vertical member 6a is positioned. As a result, the position of the work table 5 in the Z direction is determined, so the position of the work table 5 is held. The lifting device 6 is not limited to a rack-and-pinion drive mechanism. For example, the lifting device 6 may include other drive mechanisms such as ball screws and cylinders.

The powder feeder 7 includes a raw material tank 11 . The raw material tank 11 is a reservoir for storing the metal powder 2 as the raw material. A raw material tank 11 is arranged in the vacuum chamber 4 . The raw material tank 11 is arranged above the work table 5 in the Z direction. The raw material tanks 11 are arranged, for example, on both sides of the electron beam irradiation region D of the electron beam irradiation device 8 in the X direction intersecting the Z direction. A discharge port is provided at the bottom of the raw material tank 11 . The ejection ports are continuous in the Y direction, for example. The Y direction is a direction crossing the X direction and the Z direction.

A protruding plate 12 is provided below the raw material tank 11 and extends laterally from the upper end portion of the side wall 10 a of the modeling tank 10 . The protruding plate 12 forms a plane that intersects the Z direction around the work table 5 .

The powder supply device 7 includes a powder application mechanism 13 that smoothes the metal powder 2 . The powder coating mechanism 13 has a recoater 13a. The recoater 13a is movable in the X direction above the work table 5 and the projecting plate 12. As shown in FIG. By this movement, the recoater 13 a scrapes the metal powder 2 deposited on the overhang plate 12 onto the work table 5 . Further, the recoater 13a smoothes the surface 2a (upper surface) of the uppermost layer of the laminate of the metal powder 2 on the work table 5 by this movement. Hereinafter, the "layered product of the metal powder 2" will be referred to as a powder bed A. The recoater 13a contacts the surface 2a of the powder bed A to make the height uniform. The shape of the recoater 13a is, for example, a plate shape. The recoater 13a has a predetermined width in the Y direction. The length of the powder coating mechanism in the Y direction corresponds to, for example, the total length of the work table 5 in the Y direction. The powder coating mechanism 13 may be configured to include a roller, a rod-like member, a brush portion, etc. instead of the plate-like recoater 13a.

The powder coating mechanism 13 may include, for example, a rack-and-pinion drive mechanism as a mechanism for moving the recoater 13a. The powder application mechanism 13 may include guide rails, endless belts, ball screws, electric motors, cylinders, and the like.

The electron beam irradiation device 8 includes an electron gun (not shown) that irradiates an electron beam (electron beam) as an energy beam. In FIG. 1, an irradiation area D through which the emitted electron beam passes is indicated by a chain double-dashed line. An electron beam emitted from the electron gun is irradiated into the vacuum chamber 4 . The electron beam heats the metal powder 2 . That is, the electron beam irradiation device 8 applies energy to the metal powder 2 . As a result, the metal powder 2 is heated and melted or sintered. The electron beam irradiation device 8 is a powder solidification unit that solidifies the metal powder 2 of the powder bed A. As shown in FIG. Further, the electron beam irradiation device 8 is an energy application unit that applies energy to the powder bed A. As shown in FIG.

The electron beam irradiation device 8 may include a coil device that controls irradiation of the electron beam. The coil system comprises, for example, aberration coils, focus coils and deflection coils. An aberration coil is installed around the electron beam emitted from the electron gun to converge the electron beam. The focus coil is installed around the electron beam emitted from the electron gun and corrects the deviation of the focus position of the electron beam. A deflection coil is installed around the electron beam emitted from the electron gun and adjusts the irradiation position of the electron beam. A deflection coil performs electromagnetic beam deflection. With electromagnetic beam deflection, the scanning speed during electron beam irradiation is faster than with mechanical beam deflection. The electron gun and coil section are arranged in the upper part of the vacuum chamber 4 . The electron beam emitted from the electron gun is converged by the coil portion, the focal position is corrected, the scanning speed is controlled, and the electron beam reaches the irradiation position of the metal powder 2 .

A controller 18 that is a control unit controls the operation of the entire molding apparatus 1 . The controller 18 is a computer including hardware such as a CPU (Central Processing Unit), ROM (Read Only Memory), and RAM (Random Access Memory), and software such as programs stored in the ROM. The controller 18 includes input signal circuits, output signal circuits, power supply circuits, and the like. The controller 18 includes an arithmetic unit and memory. The controller 18 is electrically connected to the electron beam irradiation device 8 , the powder supply device 7 and the lifting device 6 . The controller 18 can generate various command signals. The memory can store data necessary for various controls.

The controller 18 transmits a command signal to the electron beam irradiation device 8 to control the irradiation timing, irradiation position, etc. of the electron beam (irradiation control). The controller 18 controls irradiation of the electron beam when melting the metal powder 2 . The controller 18 can send command signals to the powder supply device 7 to control the supply timing and supply amount of the metal powder 2 . The controller 18 may transmit a command signal to the powder coating mechanism 13 to control the operation timing of the recoater 13a.

<First Embodiment>
As shown in FIGS. 2 and 3, the substrate 15 is placed on the work table 5. As shown in FIG. The planar shape of the substrate 15 is a square in plan view. Substrate 15 includes a plurality of split plates. Specifically, the substrate 15 includes nine split plates. The substrate 15 includes one central plate 20 (dividing plate), four first peripheral plates 30 (dividing plate, first dividing plate), and four second peripheral plates 40 (dividing plate, second dividing plate). plates) and That is, the substrate 15 includes nine split plates.

The planar shapes of the central plate 20, the first peripheral plate 30, and the second peripheral plate 40 are each square in plan view. The shape here means the planar shape of the central plate main surface 20a, the first peripheral plate main surface 30a, and the second peripheral plate main surface 40a. A planar view means a view from the normal direction of each principal surface. The central plate main surface 20a, the first peripheral plate main surface 30a, and the second peripheral plate main surface 40a cooperate to form a support surface S. The first peripheral plate 30 is arranged to face each side of the central plate 20 . The second peripheral plates 40 are arranged on a diagonal line of the central plate 20 so as to sandwich the central plate 20 . This arrangement can also be said to be an arrangement of three rows and three columns.

As shown in FIG. 4, the central plate rear surface 20b, the first peripheral plate rear surface 30b, and the second peripheral plate rear surface 40b (see FIG. 2) face the worktable main surface 5a. Supports 16 are arranged between the central plate rear surface 20b, the first peripheral plate rear surface 30b, the second peripheral plate rear surface 40b, and the main surface 5a of the work table. Each of the central plate 20 , first peripheral plate 30 and second peripheral plate 40 is supported by four posts 16 . The struts 16 form gaps between the central plate rear surface 20b, the first peripheral plate rear surface 30b, the second peripheral plate rear surface 40b, and the main surface 5a of the work table. The post 16 is fixed to any one of the central plate back surface 20b, the first peripheral plate back surface 30b, the second peripheral plate back surface 40b, or the main surface 5a of the work table. Note that the central plate 20, the first peripheral plate 30, and the second peripheral plate 40 need only be movable relative to the main surface 5a of the work table. Therefore, the configuration and number of struts 16 are not limited to the above example. Also, the strut 16 may be omitted.

As described above, the central plate 20, the first peripheral plate 30 and the second peripheral plate 40 are movable relative to the work table main surface 5a. In addition, the movement of the central plate 20, the first peripheral plate 30, and the second peripheral plate 40 relative to the work table main surface 5a includes a mode in which the entire plate moves with respect to the work table main surface 5a. Furthermore, the relative movement involves a portion of the plate not changing its position with respect to the work table main surface 5a, but another portion of the plate changing its position with respect to the work table main surface 5a, i.e. deformation of the plate. A mode in which the position with respect to the main surface 5a of the work table partially changes due to the relative movement is also included in the relative movement.

First, the center plate 20 has a center plate main surface 20 a and a center guide 21 . The central guide 21 is a bottomed hole that opens to the central plate rear surface 20b. That is, the central guide 21 is not a through hole. The planar shape of the central guide 21 is, for example, circular, but is not limited to circular. A central guide 21 is provided in the center of the central plate 20 . For example, it can be said that the central guide 21 is provided at a position where diagonal lines of the central plate 20 intersect.

A central pin 22 is inserted into the central guide 21 . The central pin 22 is fixed to the worktable main surface 5a and extends from the worktable main surface 5a toward the central plate 20 . Central pin 22 is taller than strut 16 . Moreover, the cross-sectional shape of the center pin 22 may be any shape as long as it can be inserted into the center guide 21 . For example, when the central guide 21 has a circular cross-sectional shape, the central pin 22 may have a circular cross-sectional shape. For example, when the cross-sectional shape of the central guide 21 is rectangular, the cross-sectional shape of the central pin 22 may be rectangular or circular.

The central guide 21 and the central pin 22 cooperate to form a position restricting portion 23 . The position restricting portion 23 constitutes a guide G together with a first direction restricting portion 33 and a second direction restricting portion 44 which will be described later. The position regulating portion 23 regulates the position of the central plate 20 . More specifically, the position restricting portion 23 does not move the central plate 20 as a whole with respect to the main surface 5a of the work table. Therefore, the position restricting portion 23 can suppress unintended displacement of the central plate 20 and arrange the central plate 20 at a desired position. On the other hand, the position restricting portion 23 allows deformation such as expansion or contraction of the central plate main surface 20 a due to thermal expansion or thermal contraction of the central plate 20 .

Next, the first peripheral plate 30 has a first peripheral plate major surface 30 a and a first peripheral guide 31 . The first peripheral guide 31 is a slotted hole having a bottom and opening to the first peripheral plate rear surface 30b. That is, the first peripheral guide 31 is not a through hole. The planar shape of the first peripheral guide 31 is, for example, an oval. The direction in which the first peripheral guide 31 extends is parallel to the first movement axis L31. The first movement axis L31 is a direction in which movement of the first peripheral plate 30 is permitted. In other words, the first peripheral plate 30 cannot be translated in a direction obliquely crossing or perpendicular to the first movement axis L31.

An extension line of the first movement axis L31 passes through the position restricting portion 23, for example. Also, the first movement axis L31 is parallel to the sides of the first peripheral plate 30 . The length of the first peripheral guide 31 may be, for example, approximately half the length of one side of the first peripheral plate 30 .

The first peripheral guide 31 is provided on the central axis of the first peripheral guide 31 . This central axis is an axis that bisects the side that intersects with the first movement axis L31. In addition, since the 1st peripheral guide 31 should just be extended in parallel with the 1st movement axis L31, the position in which the 1st peripheral guide 31 is provided is not limited on a central axis.

A first peripheral pin 32 is inserted into the first peripheral guide 31 . The first peripheral pin 32 is fixed to the work table main surface 5 a and extends from the work table main surface 5 a toward the first peripheral plate 30 . The first peripheral pin 32 is taller than the post 16 . Moreover, the cross-sectional shape of the first peripheral pin 32 may be any shape as long as it can be inserted into the first peripheral guide 31 .

The first peripheral guide 31 and the first peripheral pin 32 cooperate to form a first direction restricting portion 33 . The first direction regulating portion 33 regulates the movable direction of the first peripheral plate 30 . More specifically, the first direction restricting portion 33 allows the entire first peripheral plate 30 to move with respect to the main surface 5a of the work table. Therefore, the first direction restricting portion 33 can suppress movement of the first peripheral plate 30 in an unintended direction. Further, the first direction restricting portion 33, like the position restricting portion 23, is deformed such that the first peripheral plate main surface 30a expands or contracts due to thermal expansion or thermal contraction of the first peripheral plate 30. allow.

Furthermore, the second peripheral plate 40 has a second peripheral plate main surface 40 a and a second peripheral guide 41 . The second peripheral guide 41 is an elongated hole having a bottom and is open to the second peripheral plate rear surface 40b. That is, the second peripheral guide 41 is not a through hole. The planar shape of the second peripheral guide 41 is, for example, an oval. The direction in which the second peripheral guide 41 extends is parallel to the second movement axis L41. The second movement axis L41 is a direction in which movement of the second peripheral plate 40 is allowed. In other words, the second peripheral plate 40 cannot move in a direction obliquely crossing or perpendicular to the second movement axis L41.

The second movement axis L41 is parallel to the diagonal line of the second peripheral plate 40 . An extension line of the second movement axis L41 passes through the position restricting portion 23, for example. An extension line of the second movement axis L41 intersects the first movement axis L31 at the position regulating portion 23 . The angle between the first movement axis L31 and the second movement axis L41 may be 45 degrees. The length of the second peripheral guide 41 may be, for example, approximately half the length of one side of the second peripheral plate 40 .

The second peripheral guide 41 is provided on the diagonal line of the second peripheral plate 40 . In addition, since the second peripheral guide 41 only needs to extend parallel to the second movement axis L41, the position where the second peripheral guide 41 is provided is not limited to the diagonal line.

A second peripheral pin 42 is inserted into the second peripheral guide 41 . The second peripheral pin 42 is fixed to the work table main surface 5 a and extends from the work table main surface 5 a toward the second peripheral plate 40 . The second peripheral pin 42 is taller than the post 16 . Moreover, the cross-sectional shape of the second peripheral pin 42 may be any shape as long as it can be inserted into the second peripheral guide 41 .

The second peripheral guide 41 and the second peripheral pin 42 cooperate to form a second direction restricting portion 44 . The second direction restricting portion 44 restricts the direction in which the second peripheral plate 40 can move. More specifically, the second direction restricting portion 44 allows the entire second peripheral plate 40 to move with respect to the main surface 5a of the work table. Therefore, the second direction restricting portion 44 can suppress movement of the second peripheral plate 40 in an unintended direction. Further, the second direction restricting portion 44, like the position restricting portion 23, is deformed such that the second peripheral plate main surface 40a expands or contracts due to thermal expansion or thermal contraction of the second peripheral plate 40. allow.

In this modeling apparatus 1 , a substrate 15 that supports a modeled object 3 is composed of a central plate 20 , a first peripheral plate 30 and a second peripheral plate 40 . The directions of movement and/or deformation of the first peripheral plate 30 and the second peripheral plate 40 are restricted by the first direction restricting portion 33 and the second direction restricting portion 44 . As a result, the substrate 15 can flexibly follow the thermal deformation of the modeled object 3, so that the thermally deformed modeled object 3 is not subjected to unintended thermal stress. Therefore, it is possible to suppress the occurrence of distortion in the modeled object due to thermal stress. Therefore, it is possible to suppress the deterioration of the modeling accuracy of the modeled object. Alternatively, cracks due to thermal stress can be suppressed from occurring in the modeled object. Therefore, deterioration of the quality of the model can be suppressed. That is, it is possible to suppress either one or both of a decrease in modeling accuracy and a decrease in quality of the modeled object.

In this modeling apparatus 1, the substrate 15 is divided into the central plate 20, the first peripheral plate 30 and the second peripheral plate 40, so that one plate is miniaturized. Accordingly, installation of the central plate 20, the first peripheral plate 30 and the second peripheral plate 40 can be facilitated. Also, it is easier to maintain flatness and manufacture a small plate than a large plate. This makes it possible to suppress the deterioration of the flatness of the substrate 15 as a whole. As a result, deterioration in modeling accuracy can be further suppressed.

Although the central plate 20 is restricted in movement, it is allowed to expand or contract around the position restricting portion 23 . On the other hand, the first peripheral plate 30 and the second peripheral plate 40 are allowed to move and/or deform along the first movement axis L31 and the second movement axis L41. Therefore, since the substrate 15 that supports the modeled object 3 can flexibly follow the thermal deformation of the modeled object 3, deterioration of modeling accuracy or quality can be suppressed.

<Second embodiment>
By the way, the substrate 15 of the first embodiment includes three different types of plates, the central plate 20 , the first peripheral plate 30 and the second peripheral plate 40 . Each of these plates has a predetermined position. For example, when arranging in three rows and three columns, the center plate 20 is arranged at a position where it can be inserted into the center pin 22 . Then, with the central plate 20 as a reference, the first peripheral plates 30 are arranged so as to face each side of the central plate 20 . Furthermore, a second peripheral plate 40 is arranged at a position corresponding to the corner of the substrate 15 .

For example, as shown in FIG. 5, substrate 15A has central plate 20 and third peripheral plate 50A. The third peripheral plate 50A is arranged so as to correspond to the positions where the first peripheral plate 30 and the second peripheral plate 40 in the first embodiment are arranged. That is, the third peripheral plate 50A has both the functions of the first peripheral plate 30 and the second peripheral plate 40 . The third peripheral plate 50A has a first peripheral guide 31 and a second peripheral guide 41 . The first peripheral guide 31 or the second peripheral guide 41 functions depending on the position where the third peripheral plate 50A is arranged. The state in which this function is performed means either the state in which the first peripheral pin 32 is inserted into the first peripheral guide 31 or the state in which the second peripheral pin 42 is inserted into the second peripheral guide 41 . The first peripheral guide 31 and the second peripheral guide 41 in which neither the first peripheral pin 32 nor the second peripheral pin 42 is arranged constitute the additional direction restricting portion 19 in the present disclosure. The first movement axis L31 and the second movement axis L41 set in the first peripheral guide 31 and the second peripheral guide 41 that constitute the additional direction restricting portion 19 are the additional movement axes L31a and L41a in the present disclosure. .

According to this configuration, since the plurality of third peripheral plates 50A have the same shape, the degree of freedom in arrangement of the plurality of third peripheral plates 50A increases. Thereby, it is possible to suppress deterioration of workability when arranging the third peripheral plate 50A.

<Third Embodiment>
In the substrate 15 of the first embodiment and the substrate 15A of the second embodiment, each plate has its movement direction regulated by one pin. When the movement direction of one plate is restricted by one pin, the rotational movement around the pin is not restricted. Therefore, the substrate 15B of the third embodiment restricts the rotational movement of each plate while permitting movement along the first movement axis L31 or the second movement axis L41.

As shown in FIG. 6, the substrate 15B of the third embodiment has a central plate 20B and a fourth peripheral plate 50B. The central plate 20B has four guide holes 24 in the central plate 20 of the first embodiment. A guide hole 24 is provided on each of the four sides of the central plate 20 . The guide holes 24 are provided on the axes L21X and L21Y passing through the position regulating portion 23. As shown in FIG.

A guide pin 45 , which will be described later, is inserted into the guide hole 24 . The guide hole 24 and the guide pin 45 constitute a rotation restricting portion 46 . According to this configuration, the central plate 20B is allowed to deform in directions along the axes L21X and L21Y. On the other hand, the central plate 20</b>B is not allowed to rotate about the position restricting portion 23 as the central axis by the rotation restricting portion 46 .

The fourth peripheral plate 50B is obtained by providing guide pins 45 and guide grooves 47 to the third peripheral plate 50A. The guide pin 45 is provided on the first movement axis L31 or the additional movement axis L31a. For example, the guide pins 45 are provided at positions sandwiching the center of the fourth peripheral plate 50B in cooperation with the first peripheral guides 31 . The guide pin 45 protrudes from the side along the first movement axis L31. The guide groove 47 is provided on a side adjacent to the side on which the guide pin 45 is provided. The depth of the guide groove 47 is greater than the projection length of the guide pin 45 . The guide groove 47 extends in the direction along the first movement axis L31. Therefore, even when the guide pin 45 is inserted into the guide groove 47, movement in the first movement direction is allowed.

The guide pin 45 of the fourth peripheral plate 50B arranged at the same position as the first peripheral plate 30 is inserted into the guide hole 24 of the central plate 20B. The guide pin 45 of the fourth peripheral plate 50B arranged at the same position as the second peripheral plate 40 is inserted into the guide groove 47 of the adjacent fourth peripheral plate 50B.

This configuration restricts the rotational movement of the central plate 20B and the fourth peripheral plate 50B. Therefore, unintended movement of the central plate 20B and the fourth peripheral plate 50B is further suppressed, so that deterioration of modeling accuracy or quality can be further suppressed. Also in this configuration, as shown in FIG. 6, the plurality of fourth peripheral plates 50B may have the same shape. Also in this case, the degree of freedom in arranging the plurality of fourth peripheral plates 50B is increased. Thereby, it is possible to suppress deterioration of workability when arranging the fourth peripheral plate 50B.

The present disclosure is not limited to the embodiments described above, and various modifications such as those described below are possible without departing from the gist of the present disclosure.

<Modification 1>
Next, the substrate 60 will be described with reference to FIGS. 7, 8 and 9. FIG. As shown in FIG. 7, the substrate 60 includes a plurality of split plates 61 radially split around the base point O. As shown in FIG. The substrate 60 is divided along multiple boundary lines L62. The boundary line L62 passes through the base point O and extends radially. The boundary line L62 extends in the radial direction of the virtual circle centered on the base point O. As shown in FIG. The substrate 60 is divided around the base point O in the circumferential direction of the virtual circle. The base point O is, for example, the center point of the substrate 60 . The shapes of the plurality of dividing plates 61 are the same as each other. The substrate 60 is divided into 8 equal parts around the base point O. As shown in FIG. That is, the substrate 60 has eight division plates 61 . The eight division plates 61 are arranged to form an octagon. The outer shape of the substrate 60 is not limited to an octagon. The outer shape of the substrate 60 may be circular, rectangular, or other polygonal shape. For example, stainless steel may be used as the material of the substrate 60 . The material of the substrate 60 is not limited to stainless steel, and other materials may be used.

As shown in FIGS. 7 and 8, the shape of one split plate 61 is, for example, triangular in plan view. The split plate 61 includes a pair of oblique sides 62 and a base 63 . The oblique side 62 is along the boundary line L62. A vertex that is an intersection point of the pair of oblique sides 62 is arranged on the base point O. As shown in FIG. The base 63 forms a side of an octagon.

As shown in FIG. 9, the split plate 61 includes a main surface 61a and a back surface 61b facing each other in the plate thickness direction. The main surface 61a is the upper surface, and is the surface on which the metal powder 2 is placed. The back surface 61b is a lower surface. Divider plate 61 includes sides along oblique side 62 and sides along base 63 . The side surface along the oblique side 62 and the side surface along the bottom side 63 are surfaces along the plate thickness direction between the main surface 61a and the back surface 61b.

The split plate 61 is provided with a guide (concavo-convex shape) that guides the extension direction and/or the movement direction of the split plate 61 . The guide guides the extending direction and/or the moving direction of the split plate 61 in the radial direction with the base point O as the center. A radial direction is a radial direction of a virtual circle centered on the base point O. FIG. The guide includes a central guide (positioning portion) 64 and a guide groove 65 formed on the rear surface 61 b of the split plate 61 . The center guide 64 is arranged at the top of the split plate 61 on the base point O side. A set of central guides 64 of a plurality of split plates 61 forms one circular hole. The center guide 64 is a concave portion that is recessed in the plate thickness direction. The set of central guides 64 is not limited to being circular, but may be rectangular or other shapes.

As shown in FIG. 8, the guide groove 65 extends along a normal line L63 extending from the central portion of the base 63 toward the vertex (base point O). The guide groove 65 extends linearly in plan view. The guide groove 65 is a concave portion recessed in the plate thickness direction. The length of the guide groove 65 is set, for example, in consideration of the amount of deformation due to thermal expansion of the split plate 61 . The width of the guide groove 65 corresponds to the diameter of the guide pin 67, which will be described later.

As shown in FIG. 9, a plurality of supports 68 may be provided on the main surface 5a of the work table. A plurality of struts 68 protrude upward from the main surface 5a of the work table. The struts 68 support the split plate 61 from below. The main surfaces of the plurality of struts 68 are in contact with the rear surface 61 b of the split plate 61 . The split plate 61 is supported by a plurality of struts 68 to ensure the positional accuracy and flatness of the main surface 61a in the Z direction. In plan view, the plurality of struts 68 are arranged at positions where the central guide 64 is not formed. The outer diameter of the strut 68 may be larger than the width of the guide groove 65 . The strut 68 may be arranged at a position overlapping the guide groove 65 in plan view. The plurality of struts 68 may be spaced apart from each other in the radial direction centered on the base point O. As shown in FIG. A plurality of struts 68 may be arranged on a concentric circle with the base point O as the center. A gap may be formed between the back surface 61b of the split plate 61 and the main surface 5a of the work table. Note that the plurality of struts 68 may be omitted. For example, the main surface 5a of the work table and the rear surface 61b of the split plate 61 may be in contact with each other.

A plurality of positioning pins are provided on the main surface 5a of the work table. The plurality of positioning pins include a center pin (positioning portion) 66 arranged at the base point O and a plurality of guide pins 67 arranged at positions spaced apart from the base point O in the radial direction. The central pin 66 and the plurality of guide pins 67 protrude upward from the main surface 5a of the work table.

A central guide 64 formed in the split plate 61 includes a surface that abuts the central pin 66 . The center guide 64 includes a side wall 64 a that abuts on the side of the top of the center pin 66 . Central guide 64 may include a wall surface that abuts a major surface of central pin 66 . A guide groove 65 formed in the split plate 61 includes a surface that contacts the guide pin 67 . The guide groove 65 includes a pair of side walls 65a that contact the side surfaces of the guide pin 67 at the top. The guide groove 65 may include a wall surface that contacts the main surface of the guide pin 67 . The central guide 64 and the central pin 66 are positioning portions that define the position of the dividing plate 61 on the base point O side.

According to such a substrate 60, a plurality of split plates 61 are arranged and used as shown in FIG. That is, the plurality of split plates 61 are used by being laid out radially. The plurality of dividing plates 61 have the same external shape. The positions and sizes of the central guides 64 and the guide grooves 65 are the same in the plurality of divided plates 61 . Accordingly, the substrate 60 may be formed by arranging the plurality of division plates 61 at any position. Therefore, the operator who arranges the division plate 61 can arrange the division plate 61 without hesitation as to which plate should be arranged where. As a result, it is possible to suppress a decrease in work efficiency when forming the substrate 60 .

A center pin 66 and a guide pin 67 are arranged on the work table 5 . The operator only needs to arrange the central guide 64 of the split plate 61 at the position of the central pin 66 and arrange the guide groove 65 at the position of the guide pin 67 . A worker can use the central pin 66 and the guide pin 67 as marks to arrange the plurality of split plates 61 , thereby suppressing a decrease in work efficiency when forming the substrate 60 .

Since the substrate 60 is divided into a plurality of division plates 61, one division plate 61 is miniaturized. Thereby, installation of the dividing plate 61 can be facilitated.

Moreover, when manufacturing a modeled object using a modeling apparatus having the substrate 60 , the metal powder 2 is supplied onto the substrate 60 . When the metal powder 2 is irradiated with the electron beam, the metal powder 2 is heated and melted. At this time, the heat of the metal powder 2 is transferred to the substrate 60, and the substrate 60 becomes hot and thermally expands. The substrate 60 may be at about 800° C., for example.

Since the substrate 60 is divided along the radially extending boundary lines L62, each divided plate 61 is deformable. Since the side wall of the concave portion of the central guide 64 abuts on the side surface of the central pin 66, the position of the dividing plate 61 on the base point O side is regulated. As a result, the split plate 61 is deformed so as to extend radially outward. The portion of the dividing plate 61 on the side of the base 63 is deformed so as to separate from the base point O. As shown in FIG. Since the guide pin 67 is fitted in the guide groove 65 in the substrate 60 , the extending direction of the split plate 61 is guided by the guide pin 67 and the guide groove 65 . The direction in which the side surface of the guide pin 67 and the side wall of the guide groove 65 abut and the split plate 61 extends is the direction in which the guide groove 65 extends. Thereby, the positions and extending directions of the plurality of division plates 61 can be restricted. Therefore, the modeled object 3 can be manufactured in consideration of the position and extending direction of the dividing plate 61 .

Also, it is easier to maintain flatness and manufacture a small plate than a large plate. This makes it possible to maintain the flatness of the split plate 61 and suppress the deterioration of the flatness of the substrate 60 as a whole. As a result, deterioration in the dimensional accuracy of the modeled object 3 can be suppressed.

<Modification 2>
Next, a substrate 70 according to modification 2 shown in FIG. 10 will be described. A description similar to that of the substrate 60 described above is omitted. The substrate 70 has a circular shape. Substrate 70 includes a central plate 71 and a plurality of split plates 72 . The center plate 71 has a circular shape and is arranged on the base point O. As shown in FIG. A circular central guide 73 is provided on the rear surface of the central plate 71 .

The substrate 70 includes a plurality of split plates 72 split along boundary lines L74 radially extending from the base point O. As shown in FIG. The substrate 70 has, for example, 12 split plates 72 . The plurality of split plates 72 have the same shape. The split plate 72 has, for example, a fan shape in plan view. The split plate 72 includes a pair of oblique sides 74 , an inner peripheral edge 75 and an outer peripheral edge 76 . The oblique side 74 is arranged along the boundary line L74. The inner peripheral edge 75 has an arc shape and is arranged along the contour of the central plate 71 . The outer peripheral edge 76 has an arc shape and is arranged along the contour of the substrate 70 .

A central guide 73 is provided on the rear surface of the central plate 71 . A central guide 73 is arranged at the center of the central plate 71 . The central guide 73 is a concave portion that is recessed in the plate thickness direction. The central guide 73 has a circular shape. The central guide 73 is not limited to having a circular shape, and may have other shapes.

A guide groove 77 is provided on the rear surface of the split plate 72 . For example, it is formed along a normal extending from the central portion of the outer peripheral edge 76 toward the central portion of the inner peripheral edge 75 . The guide groove 77 extends linearly in plan view.

A modeling apparatus including the substrate 70 according to such a modified example also has the same effects as the modeling apparatus 1 according to the above-described embodiment.

<Modification 3>
Next, a substrate 80 according to Modification 3 shown in FIG. 11 will be described. A description similar to that of the substrate 60 is omitted. The substrate 80 has a rectangular shape. The substrate 80 includes a plurality of split plates 81 split along a plurality of boundary lines L85 that pass through the base point O and extend radially. The plurality of split plates 81 have the same shape. The substrate 80 is divided into four equal parts around the base point O and has four dividing plates 81 . The four split plates 81 are arranged to form a quadrangle. The outer shape of the substrate 80 is not limited to a square, and may be circular or other polygonal. A modeling apparatus including the substrate 80 according to such a modified example also has the same effects as the modeling apparatus 1 according to the above-described embodiment.

<Modification 4>
Next, a substrate 90 according to Modification 4 shown in FIG. 12 will be described. A description similar to that of the substrate 60 is omitted. The substrate 90 has a circular shape. The substrate 90 may include a peripheral plate 95 in addition to the plurality of split plates 61 . The substrate 90 may include a plurality of outer peripheral plates 95 radially divided around the base point O. As shown in FIG. The outer peripheral plate 95 is arranged outside the split plate 61 in the radial direction of the substrate 90 . The substrate 90 has, for example, eight outer peripheral plates 95 . The boundary between the outer peripheral plates 95 is the same as the boundary between the split plates 61, for example, in the circumferential direction. One outer peripheral plate 95 includes an inner peripheral side 56 , a pair of oblique sides 57 and an arc 58 . The inner peripheral side 56 is arranged along the bottom side 63 of the split plate 61 . The oblique side 57 is arranged on the boundary line L62 extending along the oblique side 62 of the split plate 61 . Arcs 58 are arranged along the outline of circular substrate 90 . Thus, substrate 90 may comprise other plates positioned outside of dividing plate 61 .

In the above modification, the electron beam is irradiated to melt the powder, but the beam irradiated to the powder is not limited to the electron beam, and other energy beams (for example, laser) may be used. The modeling apparatus 1 may include, for example, a laser transmitter to irradiate a laser beam to melt or sinter powder. A modeling apparatus that irradiates a laser beam may be provided with a chamber for holding an inert gas atmosphere instead of the vacuum chamber 4 . In this case, the irradiation device for irradiating the laser beam may include, for example, optical components such as a mirror for polarizing the laser beam, a drive unit for moving the mirror, and a condenser lens. The modeling apparatus may be configured to include a powder solidification unit that solidifies the powder by applying an adhesive or the like to the powder.

Although the guide grooves 65 are formed in the split plate 61 in the modified example described above, the guide grooves (concavo-convex shape) 65 may not be formed in the split plate 61 . Also, instead of the guide grooves 65, the dividing plate 61 may be provided with a convex shape. In this case, instead of the guide pin 67, a concave portion that engages with the convex shape is formed on the main surface 5a of the work table.

Although the center guide 64 is formed in the split plate 61 in the above modified example, the center guide (concavo-convex shape) 64 may not be formed in the split plate 61 . Further, the dividing plate 61 may be provided with a convex shape instead of the central guide 64 . In this case, instead of the central pin 66, the surface of the work table 5 is formed with a recess that engages in a convex shape.

In the above embodiment, the recoater 13a is moved in the X direction to level the surface 2a of the powder bed A. Surface 2a may be leveled. Alternatively, the recoater 13a may be arranged along the radial direction of an imaginary circle having the base point O as its center, and the recoater 13a may be rotated about the base point O as its center. Further, the modeling apparatus 1 may be configured to move the modeling tank 10 relative to the recoater 13a. The modeling tank 10 may be configured to reciprocate in the X direction, for example, or may be configured to be movable in other directions. The modeling tank 10 may be configured to be rotatable around the base point O. FIG. For example, the modeling apparatus has a circular work table in a plan view, and rotates the work table, the substrate, and the powder layer about a virtual line extending in the Z direction (the center of the work table and the center of the substrate). However, the powder application and the beam irradiation may be performed sequentially.

1 Modeling device 2 Metal powder 2a Surface 3 Modeled object 4 Vacuum chamber 5 Working table 5a Main surface of working table 6 Lifting device 6a Vertical member 6b Drive source 7 Powder supply device 8 Electron beam irradiation device (powder solidification unit)
10 Modeling tank 10a Side wall 11 Raw material tank 12 Overhang plate 13 Powder application mechanism 13a Recoater 15 Substrate 15A Substrate 15B Substrate 16 Support 18 Controller 19 Additional direction control unit 20 Central plate (divided plate, first divided plate)
20B central plate (division plate, first division plate)
20a central plate main surface 20b central plate rear surface 21 central guide 22 central pin 23 position regulating portion 24 guide hole 30 first peripheral plate (divided plate, second divided plate)
30a First peripheral plate main surface 30b First peripheral plate rear surface 31 First peripheral guide 32 First peripheral pin 33 First direction regulating portion 40 Second peripheral plate (split plate, second split plate)
40a Second peripheral plate main surface 40b Second peripheral plate rear surface 41 Second peripheral guide 42 Second peripheral pin 44 Second direction regulating portion 45 Guide pin 46 Rotation regulating portion 47 Guide groove 50A Third peripheral plate (divided plate)
50B 4th peripheral plate (split plate)
56 side 57 oblique side 58 arc 60 substrate 61 division plate 61a main surface 61b rear surface 62 oblique side 63 bottom 64 center guide 64a side wall 65 guide groove 65a side wall 66 center pin 67 guide pin 68 post 70 substrate 71 center plate 72 division plate 73 center guide 74 Oblique side 75 Inner peripheral edge 76 Outer peripheral edge 77 Guide groove 80 Substrate 81 Division plate 90 Substrate 95 Peripheral plate A Powder bed D Irradiation area G Guide S Support surface L74 Boundary line L21X Axis line L21Y Axis line L31 First movement axis L31a Additional movement axis L41 Second Movement axis L41a Additional movement axis L62 Boundary line L63 Normal line L85 Boundary line O Base point

Claims (7)

a substrate including a plurality of split plates supporting powder;
a powder solidifying unit that solidifies the powder on the split plate;
a guide including a direction restricting portion that defines the direction of movement and/or deformation of the split plate in a direction along the movement axis ;
The laminate molding apparatus , wherein the direction of the movement axis is the in-plane direction of the split plate . the dividing plate includes a support surface that supports the powder;
The layered manufacturing apparatus according to claim 1, wherein the support surface has a rectangular shape. The plurality of split plates are
a first dividing plate;
a second split plate disposed around the first split plate and provided with the direction restricting portion;
the guide further includes a position regulating portion provided on the first split plate for regulating the position of the first split plate;
The layered manufacturing apparatus according to claim 1 or 2, wherein the direction restricting portion allows movement of the second split plate along a movement axis passing through the position restricting portion. the dividing plate includes a support surface that supports the powder;
the guide further includes an additional direction restricting portion provided on the second split plate and extending along an additional movement axis that intersects with the movement axis;
When each of the plurality of second divided plates is viewed from the normal direction of the support surface, the direction restricting portion and the additional direction restricting portion have the same shape in each of the second divided plates. Item 4. The layered manufacturing apparatus according to Item 3. The layered manufacturing apparatus according to claim 3 or 4, wherein the guide further includes a rotation restricting portion provided on the second divided plate and extending along an axis parallel to the movement axis. The substrate includes a plurality of divided plates divided along boundary lines extending radially around a base point,
The layered manufacturing apparatus according to claim 1, wherein the plurality of divided plates have the same shape. a substrate including a plurality of split plates supporting powder;
a powder solidifying unit that solidifies the powder on the split plate;
a guide including a direction restricting portion that defines the direction of movement and/or deformation of the split plate;
The plurality of split plates are
a first dividing plate;
a second split plate disposed around the first split plate and provided with the direction restricting portion;
the guide further includes a position regulating portion provided on the first split plate for regulating the position of the first split plate;
The layered manufacturing apparatus, wherein the direction restricting portion allows movement of the second split plate along a movement axis passing through the position restricting portion.

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