JP7256601B2 - 焼結方法、製造装置、オブジェクトデータ処理方法、データキャリア及びオブジェクトデータ処理装置 - Google Patents
焼結方法、製造装置、オブジェクトデータ処理方法、データキャリア及びオブジェクトデータ処理装置 Download PDFInfo
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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Description
当該方法は、前記素地体を支持するための支持体を表す支持データを、前記オブジェクトデータに基づき生成するステップを含む。当該方法は、前記支持体により支持される前記オブジェクト体を表す結合データ(combined data)を得るために前記支持データと前記オブジェクトデータとを組み合わせるステップを含む。当該方法は、前記結合データを出力するステップを含む。
Claims (13)
- オブジェクトを製造する方法であって、
構成材料の第1の複数の層を配置するステップと、
素地支持体を形成するために前記第1の複数の層の各配置層の部分を各配置層にバインダを選択的に配置することで選択的に結合するステップと、
構成材料の第2の複数の層を配置するステップと、
前記素地支持体により支持される素地体を形成するために、前記第2の複数の層の各配置層の部分を各配置層にバインダを選択的に配置することで選択的に結合するステップと、
前記素地支持体により支持されている前記素地体を前記素地支持体と共に焼結するステップと、
を含み、前記素地体及び前記素地支持体は、焼結の間に呈する線収縮の割合が実質的に同じである方法。 - 前記焼結するステップの前に、前記素地支持体により支持されている前記素地体の脱バインダ処理を行うステップをさらに含む、請求項1に記載の方法。
- 前記素地支持体及び前記素地体は同じバインダで結合された同じ構成材料で形成されている、請求項1又は2に記載の方法。
- 前記素地支持体は、平面状のベース面を有する、請求項1乃至3のいずれか一項に記載の方法。
- 前記素地支持体は前記素地体を支持するための支持面を有し、該支持面は前記素地体との間欠的な接触面を提供する、請求項1乃至4のいずれか一項に記載の方法。
- 前記間欠的な接触面は、前記支持面の突起、凹部又は波状部のうちの少なくとも1つによって形成されている、請求項5に記載の方法。
- 前記素地支持体は、前記素地体の形状に合致するように適合されている、請求項1乃至6のいずれか一項に記載の方法。
- 前記素地支持体は、前記素地体上の複数の位置で前記素地体に接触するように適合されている、請求項7に記載の方法。
- 前記素地支持体は、前記素地体全体を支持できるような寸法を有する、請求項1乃至8のいずれか一項に記載の方法。
- 前記素地支持体をバインダによって前記素地体に連結するステップをさらに含む、請求項1乃至9のいずれか一項に記載の方法。
- 前記素地支持体は前記素地体から分離している、請求項1乃至9のいずれか一項に記載の方法。
- 請求項1乃至11のいずれか一項に記載の方法により製造されるオブジェクトを表すオブジェクトデータの処理方法であって、
製造すべきオブジェクト体を表すオブジェクトデータを取得するステップと、 前記素地体を支持するための支持体を表す支持データを、前記オブジェクトデータに基づき生成するステップと、
前記支持体により支持される前記オブジェクト体を表す結合データを得るために前記支持データと前記オブジェクトデータとを組み合わせるステップと、
前記結合データを出力するステップと、
を含む処理方法。 - 実行された場合に、請求項12に記載の処理方法をデータプロセッサに行わせるように構成されたプログラム命令を記憶したデータキャリア。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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GBGB1500608.3A GB201500608D0 (en) | 2015-01-14 | 2015-01-14 | Sintering method, manufacturing method, object data processing method, data carrier and object data processor |
GB1500608.3 | 2015-01-14 | ||
PCT/EP2016/050361 WO2016113213A1 (en) | 2015-01-14 | 2016-01-11 | Sintering method, manufacturing method, object data processing method, data carrier and object data processor |
Publications (2)
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JP2018505309A JP2018505309A (ja) | 2018-02-22 |
JP7256601B2 true JP7256601B2 (ja) | 2023-04-12 |
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JP2017533758A Active JP7256601B2 (ja) | 2015-01-14 | 2016-01-11 | 焼結方法、製造装置、オブジェクトデータ処理方法、データキャリア及びオブジェクトデータ処理装置 |
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US (2) | US20180001381A1 (ja) |
EP (1) | EP3245017B1 (ja) |
JP (1) | JP7256601B2 (ja) |
KR (1) | KR102367043B1 (ja) |
CN (1) | CN107257719B (ja) |
GB (1) | GB201500608D0 (ja) |
TW (1) | TWI719008B (ja) |
WO (1) | WO2016113213A1 (ja) |
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KR102367043B1 (ko) | 2022-02-24 |
TW201627136A (zh) | 2016-08-01 |
US20220274177A1 (en) | 2022-09-01 |
WO2016113213A1 (en) | 2016-07-21 |
EP3245017A1 (en) | 2017-11-22 |
TWI719008B (zh) | 2021-02-21 |
CN107257719B (zh) | 2021-04-13 |
JP2018505309A (ja) | 2018-02-22 |
EP3245017B1 (en) | 2024-03-06 |
CN107257719A (zh) | 2017-10-17 |
GB201500608D0 (en) | 2015-02-25 |
KR20170134325A (ko) | 2017-12-06 |
US20180001381A1 (en) | 2018-01-04 |
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