JP7244691B2 - Display device - Google Patents

Description

The present invention relates to display devices.

A bendable display panel has been developed (Patent Document 1). In such a display panel, a resin substrate is used, and an inorganic film is laminated on the resin substrate to block impurities. Further, since the organic electroluminescence display device is easily affected by moisture, the display element is covered with a sealing film (Patent Document 2). A sealing film having a structure in which an organic film is sandwiched between a pair of inorganic films is known to improve moisture barrier properties. A pair of inorganic films are in contact with each other at the periphery of the sealing film. A polarizing plate is attached to the sealing film to prevent reflection of external light (Patent Document 3).

Japanese Unexamined Patent Application Publication No. 2017-211420 JP 2013-105144 A JP 2017-152252 A

At the periphery of the display panel, if the inorganic film is cracked, moisture may enter. Therefore, it is desirable to remove the inorganic film at the periphery of the display panel. The removal of the inorganic film forms a step on the periphery. For example, if a polarizing plate larger than the size of the display panel is attached and this is finally laser-cut, air bubbles are generated under the polarizing plate and the polarizing plate is easily peeled off.

An object of the present invention is to prevent peeling of a polarizing plate.

A display device includes a resin substrate, a barrier inorganic film on the resin substrate, a circuit layer on the barrier inorganic film, an organic layer on the circuit layer, a display element layer on the organic layer, and the display element. A display device comprising: a sealing layer covering a layer; and a polarizing plate disposed on the sealing layer with an adhesive layer interposed therebetween, wherein the display device has a display area and a display area in plan view. the sealing layer includes a sealing organic film and a pair of sealing inorganic films sandwiching the sealing organic film in the display region; The edge and the edge of the pair of sealing inorganic films are arranged to avoid the edge region, and the organic layer is positioned between the resin substrate and the adhesive layer in the edge region.

The display device includes a resin substrate, a plurality of layers laminated on the resin substrate so as to include a display element layer for image display and a sealing layer covering the display element layer, a first layer and a first layer of the plurality of layers. and a polarizing plate attached to two layers via an adhesive layer, wherein the plurality of layers includes a plurality of inorganic films and a plurality of organic films, and the plurality of inorganic films are all the resin substrate. The polarizing plate has an edge positioned above the edge region of the resin substrate, and the first layer is formed of the resin The second layer has an upper surface that is provided to avoid the end region of the substrate and is inclined to become lower toward the end region at the end, and the second layer is provided in the end region of the resin substrate, It may have a portion interposed between the resin substrate and the adhesive layer.

If all of the plurality of inorganic films are provided while avoiding the end region of the resin substrate, the second layer is interposed between the resin substrate and the adhesive layer in the end region. Delamination of the polarizing plate can be prevented.

1 is a plan view of a display device according to a first embodiment of the invention; FIG. 2 is a cross-sectional view of the display device shown in FIG. 1 taken along the line II-II. FIG. 2 is a circuit diagram of the display device shown in FIG. 1; FIG. FIG. 2 is a cross-sectional view of the display device shown in FIG. 1 taken along line IV-IV. 2 is a cross-sectional view of the display device shown in FIG. 1 taken along the line VV. FIG. 2 is a cross-sectional view of the display device shown in FIG. 1 taken along the line VI-VI. FIG. 4A and 4B are diagrams for explaining the manufacturing method of the display device according to the first embodiment; FIG. FIG. 4 is a plan view of a display device according to a second embodiment of the invention; FIG. 9 is a cross-sectional view of the display device shown in FIG. 8 taken along the line IX-IX; FIG. 9 is a cross-sectional view of the display device shown in FIG. 8 taken along the line XX. 9 is a cross-sectional view of the display device shown in FIG. 8 taken along the line XI-XI; FIG. FIG. 5 is a cross-sectional view of a display device according to a third embodiment of the invention; FIG. 11 is a plan view of a display device according to a fourth embodiment of the invention; FIG. 14 is a cross-sectional view of the display device shown in FIG. 13 taken along line XIV-XIV; FIG. 14 is a cross-sectional view of the display device shown in FIG. 13 taken along the line XV-XV; FIG. 14 is a cross-sectional view of the display device shown in FIG. 13 taken along line XVI-XVI; FIG. 14 is a cross-sectional view of the display device shown in FIG. 13 taken along line XVII-XVII; It is a schematic diagram showing a use state of the display device. 19 is a schematic view of the XIX-XIX line cross section of the display device shown in FIG. 18; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention can be implemented in various aspects without departing from the gist thereof, and should not be construed as being limited to the description of the embodiments illustrated below.

In the drawings, in order to make the description clearer, the width, thickness, shape, etc. of each part may be schematically represented compared to the actual embodiment, but this is only an example and limits the interpretation of the present invention. not something to do. In this specification and each drawing, elements having the same functions as those described with respect to the previous drawings may be denoted by the same reference numerals, and redundant description may be omitted.

Furthermore, in the detailed description of the present invention, when defining the positional relationship between one component and another component, the terms “above” and “below” refer only to cases where the component is located directly above or below a certain component. However, unless otherwise specified, it includes the case where other components are interposed between them.

[First embodiment]
FIG. 1 is a plan view of a display device according to a first embodiment of the invention. Note that the display device is actually used by being folded. Therefore, FIG. 1 is a developed view before folding the display device. FIG. 18 is a schematic diagram showing how the display device is used. 19 is a schematic view of the XIX-XIX line cross section of the display device shown in FIG. The display device includes display 100 . A spacer 102 is placed inside the bend to prevent the display 100 from bending too much. The display 100 is flexible and folded outside the display area DA. A first flexible printed circuit board FP1 is connected to the display 100 outside the display area DA. An integrated circuit chip CP for driving elements for displaying images is mounted on the first flexible printed board FP1. Further, a second flexible printed board FP2 is connected to the first flexible printed board FP1.

The display device is, for example, an organic electroluminescent display device. The display device has a display area in which an image is displayed. In the display area, for example, unit pixels (sub-pixels) of a plurality of colors of red, green, and blue are combined to form full-color pixels, and a full-color image is displayed.

FIG. 2 is a cross-sectional view of the display device shown in FIG. 1 taken along the line II-II. The resin substrate 10 is made of polyimide. However, other resin materials may be used as long as the base material has sufficient flexibility to form a sheet display or a flexible display. A reinforcing film 14 is attached to the back surface of the resin substrate 10 via a pressure-sensitive adhesive 12 .

A barrier inorganic film 16 (undercoat layer) is laminated on the resin substrate 10 . The barrier inorganic film 16 has a three-layer laminated structure of a silicon oxide film 16a, a silicon nitride film 16b and a silicon oxide film 16c. The lowermost silicon oxide film 16a serves to improve adhesion to the resin substrate 10, the middle silicon nitride film 16b serves as a blocking film against moisture and impurities from the outside, and the uppermost silicon oxide film 16c serves as a silicon nitride film. Each film is provided as a blocking film that prevents the hydrogen atoms contained in the film 16b from diffusing toward the semiconductor layer 18 side of the thin film transistor TR. It may be a single layer or a two-layer laminate.

An additional film 20 may be formed in accordance with the location where the thin film transistor TR is to be formed. The additional film 20 suppresses changes in the characteristics of the thin film transistor TR due to light entering from the rear surface of the channel, etc., and is formed of a conductive material to apply a predetermined potential to give a back gate effect to the thin film transistor TR. can be done. Here, after forming the silicon oxide film 16a, the additional film 20 is formed in an island shape in accordance with the portion where the thin film transistor TR is to be formed, and then the silicon nitride film 16b and the silicon oxide film 16c are laminated to form the barrier inorganic film. Although the additional film 20 is formed so as to enclose the film 16 , the additional film 20 may be first formed on the resin substrate 10 and then the barrier inorganic film 16 may be formed.

A thin film transistor TR is formed on the barrier inorganic film 16 . Taking a polysilicon thin film transistor as an example, only an Nch transistor is shown here, but a Pch transistor may be formed at the same time. The semiconductor layer 18 of the thin film transistor TR has a structure in which a low-concentration impurity region is provided between the channel region and the source/drain regions. A silicon oxide film is used here as the gate insulating film 22 . The gate electrode 24 is part of the first wiring layer W1 made of MoW. The first wiring layer W1 has a first storage capacitor line CL1 in addition to the gate electrode 24 . A part of the storage capacitor Cs is formed between the first storage capacitor line CL1 and the semiconductor layer 18 (source/drain region) with the gate insulating film 22 interposed therebetween.

An interlayer insulating film 26 (silicon oxide film and silicon nitride film) is laminated on the gate electrode 24 . A second wiring layer W2 including portions to be source/drain electrodes 28 is formed on the interlayer insulating film 26 . Here, a three-layer laminated structure of Ti, Al and Ti is adopted. Through the interlayer insulating film 26, the first storage capacitor line CL1 (part of the first wiring layer W1) and the second storage capacitor line CL2 (part of the second wiring layer W2) are connected to the other side of the storage capacitor Cs. part is formed.

A planarizing organic film 32 is provided to cover the source/drain electrodes 28 . The planarizing organic film 32 is made of a resin such as photosensitive acrylic because it has superior surface planarity compared to an inorganic insulating material formed by CVD (Chemical Vapor Deposition) or the like. A laminated inorganic film between the resin substrate 10 and the planarizing organic film 32 constitutes a circuit layer 34 . The circuit layer 34 is connected to the display element layer 30 for displaying images.

The planarizing organic film 32 is removed at the pixel contact portion 36 and an indium tin oxide (ITO) film 38 is formed thereon. The indium tin oxide film 38 includes a first transparent conductive film 38a and a second transparent conductive film 38b separated from each other.

The second wiring layer W2 whose surface is exposed by removing the planarizing organic film 32 is covered with the first transparent conductive film 38a. A silicon nitride film 40 is provided on the planarizing organic film 32 so as to cover the first transparent conductive film 38a. The silicon nitride film 40 has an opening in the pixel contact portion 36, and the pixel electrode 42 is laminated so as to be electrically connected to the source/drain electrode 28 through this opening. The pixel electrode 42 is formed as a reflective electrode and has a three-layer laminated structure of an indium zinc oxide film, an Ag film, and an indium zinc oxide film. Here, an indium tin oxide film may be used instead of the indium zinc oxide film. The pixel electrode 42 extends laterally from the pixel contact portion 36 and reaches above the thin film transistor TR.

The second transparent conductive film 38b is provided adjacent to the pixel contact portion 36 and below the pixel electrode 42 (further below the silicon nitride film 40). The second transparent conductive film 38b, the silicon nitride film 40, and the pixel electrode 42 overlap each other, forming an additional capacitance Cad.

An insulating organic film 44 is formed on the planarizing organic film 32 and, for example, above the pixel contact portion 36, and is called a bank (rib) and serves as a partition wall between adjacent pixel regions. The insulating organic film 44 is made of photosensitive acryl or the like, like the planarizing organic film 32 . It is preferable that the insulating organic film 44 is opened so as to expose the surface of the pixel electrode 42 as a light emitting region, and that the opening end has a gently tapered shape. If the opening edge has a steep shape, poor coverage of the organic electroluminescence layer 46 formed thereon will occur.

The planarizing organic film 32 and the insulating organic film 44 are in contact with each other through an opening provided in the silicon nitride film 40 between them. As a result, moisture and degassing released from the planarizing organic film 32 during heat treatment or the like after the insulating organic film 44 is formed can be extracted through the insulating organic film 44 .

An organic electroluminescence layer 46 made of an organic material is laminated on the pixel electrode 42 . The organic electroluminescence layer 46 may be a single layer, or may have a structure in which a hole transport layer, a light emitting layer and an electron transport layer are stacked in this order from the pixel electrode 42 side. These layers may be formed by vapor deposition, may be formed by coating after dispersing a solvent, may be formed selectively with respect to the pixel electrode 42 (each sub-pixel), or may be formed on the display layer. It may be solidly formed on the entire surface covering the area DA. In the case of solid formation, white light is obtained in all sub-pixels, and a desired color wavelength portion is taken out by a color filter (not shown).

A counter electrode 48 is provided on the organic electroluminescent layer 46 . Here, since the top emission structure is adopted, the counter electrode 48 is transparent. For example, the Mg layer and Ag layer are formed as thin films through which the light emitted from the organic electroluminescence layer 46 is transmitted. According to the formation order of the organic electroluminescence layer 46 described above, the pixel electrode 42 becomes the anode and the counter electrode 48 becomes the cathode. A display element layer 30 is composed of a plurality of pixel electrodes 42 , a counter electrode 48 , and an organic electroluminescence layer 46 interposed between the central portion of each of the plurality of pixel electrodes 42 and the counter electrode 48 .

A sealing layer 50 is formed on the counter electrode 48 . One of the functions of the sealing layer 50 is to prevent moisture from entering the previously formed organic electroluminescence layer 46 from the outside, and high gas barrier properties are required. The sealing layer 50 has a laminated structure of a sealing organic film 50b and a pair of sealing inorganic films 50a and 50c (for example, silicon nitride films) sandwiching the sealing organic film 50b. The pair of sealing inorganic films 50a and 50c are in contact and overlap around the sealing organic film 50b (see FIG. 4). A silicon oxide film or an amorphous silicon layer may be provided between the sealing inorganic films 50a and 50c and the sealing organic film 50b for the purpose of improving adhesion. A reinforcing organic film 52 is laminated on the sealing layer 50 . A polarizing plate 56 is attached to the reinforcing organic film 52 via an adhesive layer 54 . The polarizing plate 56 is, for example, a circularly polarizing plate.

FIG. 3 is a circuit diagram of the display device shown in FIG. The circuit has a plurality of scanning lines GL connected to the scanning circuit GD and a plurality of signal lines DL connected to the signal driving circuit SD. A signal drive circuit SD is arranged in the integrated circuit chip CP shown in FIG. A region surrounded by two adjacent scanning lines GL and two adjacent signal lines DL is one pixel PX. The pixel PX includes a thin film transistor TR as a drive transistor, a thin film transistor TR2 as a switch, a storage capacitor CS, and an additional capacitor Cad. By applying a gate voltage to the scanning line GL, the thin film transistor TR2 is turned on, a video signal is supplied from the signal line DL, and charges are accumulated in the storage capacitor CS and the additional capacitor Cad. By accumulating charges in the storage capacitor CS, the thin film transistor TR is turned on, and current flows from the power supply line PWL to the light emitting element OD. This current causes the light emitting element OD to emit light.

FIG. 4 is a cross-sectional view of the display device shown in FIG. 1 taken along line IV-IV. A plurality of layers are laminated on the resin substrate 10 . Each of the multiple layers is an organic film or an inorganic film. The display element layer 30 (FIG. 2) for image display described above is included in a plurality of layers, the sealing layer 50 is also included in a plurality of layers, and the sealing organic film 50b and the sealing inorganic films 50a and 50c are also included in a plurality of layers. is one of

All the inorganic films included in the plurality of layers are provided to avoid the edge area EA which is at least a part of the peripheral edge of the resin substrate 10 (outside the display area DA shown in FIG. 1), and the entire peripheral edge is You may avoid In FIG. 4, the barrier inorganic film 16 is included in the circuit layer 34 and integrated. Circuit layer 34 has an edge 34E adjacent edge area EA, as shown in FIG.

The multiple layers include a first layer L1. The reinforcing organic film 52 described above is the first layer L1. The first layer L1 (reinforcing organic film 52) is provided to avoid the edge area EA of the resin substrate 10, but covers the entire display area DA shown in FIG. Outside the display area DA, the first layer L1 has, as shown in FIG. 4, an upper surface that slopes downward toward the edge area EA. The tip of the first layer L1 coincides with the pair of sealing inorganic films 50a and 50c. This is because the first layer L1 (reinforcing organic film 52) was used as an etching mask for the pair of sealing inorganic films 50a and 50c and then left without being removed. The insulating organic film 44 is also provided avoiding the edge area EA.

The multiple layers include a second layer L2. The planarizing organic film 32 described above is the second layer L2. The second layer L2 (planarizing organic film 32) is stacked on the circuit layer 34 as shown in FIG. 2 and intermittently reaches the end area EA. The second layer L2 may cover the entire periphery of the resin substrate 10 . The outer edge of the second layer L2 is aligned with the edge area EA of the resin substrate 10 . The second layer L2 overlaps the edge of the circuit layer 34 . The second layer L2 overlaps the ends of the pair of sealing inorganic films 50a and 50c. Due to the order of formation, the ends of the pair of sealing inorganic films 50a, 50c are above the ends of the second layer L2. Above the ends of the pair of sealing inorganic films 50a and 50c is the end of the first layer L1. That is, the second layer L2 also overlaps the edge of the first layer L1. A portion of the second layer L2 is interposed between the resin substrate 10 and the adhesive layer 54 in the end area EA of the resin substrate 10 .

The polarizing plate 56 is attached to the first layer L1 and the second layer L2 via the adhesive layer 54 . The polarizing plate 56 has an end located above the end area EA of the resin substrate 10 . The polarizing plate 56 has an outer edge that matches the end area EA of the resin substrate 10 .

According to this embodiment, all of the plurality of inorganic films are provided while avoiding the edge area EA of the resin substrate 10 . Since the second layer L2 is interposed between the resin substrate 10 and the adhesive layer 54 in the end area EA, the step can be reduced and the polarizing plate 56 can be prevented from peeling off.

FIG. 5 is a cross-sectional view of the display device shown in FIG. 1 taken along line VV. FIG. 6 is a sectional view of the display device shown in FIG. 1 taken along the line VI-VI. The resin substrate 10 has a bending area BA for use in a bent state. For bending, no inorganic film is provided in the bending area BA. The circuit layer 34 also avoids the bending area BA. Pressure sensitive adhesive 12 and reinforcing film 14 also avoid bending area BA. The bending area BA is not provided with the insulating organic film 44, but is provided with the planarizing organic film 32 (second layer L2). The planarizing organic film 32 is laminated in contact with the resin substrate 10 in the bending area BA. As shown in FIG. 5, the reason why the insulating organic film 44 is provided adjacent to the tip of the first layer L1 is that the insulating organic film 44 stops the flow of the material in the process of forming the first layer L1. is.

Neither the adhesive layer 54 nor the polarizing plate 56 is provided in the bending area BA, and a soft resin 58 is provided instead. The soft resin 58 has a higher flexibility than other organic films, and prevents the curvature of the bent resin substrate 10 from becoming too large (curvature radius is small). The soft resin 58 is laminated in contact with the planarizing organic film 32 . The soft resin 58 is provided over the bending area BA, and is placed on a part of the first flexible printed circuit board FP1 (the part indicated by the dashed line in FIG. 1). Further, the soft resin 58 reaches the periphery of the resin substrate 10 as shown in FIG.

FIG. 7 is a diagram for explaining the method of manufacturing the display device according to the first embodiment. In the manufacturing process, the resin substrate 10 and the polarizing plate 56 are cut out from the resin substrate material 10A and the polarizing plate material 56A which are larger than these. Since the resin substrate 10 and the polarizing plate 56 are cut out from such a large material, the end faces of the resin substrate 10 and the polarizing plate 56 are aligned, and the positional accuracy of the polarizing plate 56 and the display area DA is also improved.

Specifically, layers up to the first layer L1 shown in FIG. 2 (including the first layer L1) are laminated on the resin substrate material 10A. For example, the circuit layer 34 including the barrier inorganic film 16 is formed by patterning an inorganic material on the resin substrate material 10A. A planarizing organic film 32 is formed thereon. A pixel electrode 42, an insulating organic film 44, an organic electroluminescence layer 46 and a counter electrode 48 are laminated thereon.

Furthermore, a sealing layer 50 is formed. As shown in FIG. 4, a dam for blocking the flow of the organic material for forming the sealing organic film 50b is formed in part of the insulating organic film 44. As shown in FIG. Formation of the pair of sealing inorganic films 50a and 50c includes etching using the first layer L1 formed thereon as an etching mask. As shown in FIG. 5, a dam for blocking the flow of the organic material for forming the first layer L1 may be formed by part of the insulating organic film 44. As shown in FIG.

Then, the polarizing plate material 56A shown in FIG. 7 is attached to the first layer L1 and the second layer L2 with the adhesive layer 54 interposed therebetween. As shown in FIG. 4, since the second layer L2 is outside the circuit layer 34, the step between them is small. In other words, a step is formed between the resin substrate 10 and the circuit layer 34 adjacent to the end portion 34E of the circuit layer 34, but the step is relieved by the second layer L2. Therefore, air bubbles are less likely to form under the adhesive layer 54 . Then, the laminate including the resin substrate material 10A and the polarizing plate material 56A is cut along the cut line L shown in FIG. A laser may be used for cutting.

[Second embodiment]
FIG. 8 is a plan view of a display device according to a second embodiment of the invention. 9 is a cross-sectional view of the display device shown in FIG. 8 taken along the line IX-IX. Note that FIG. 8 is a developed view of the display device before being folded.

In this embodiment, the insulating organic film 244 is the second layer L2. The insulating organic film 244 has a portion interposed between the resin substrate 210 and the adhesive layer 254 in the end area EA, and the polarizing plate 256 is attached via the adhesive layer 254 . In the edge area EA, there is a planarizing organic film 232 under the insulating organic film 244 . The planarizing organic film 232 is also stacked on the circuit layer 34 (FIG. 2) intermittently reaching the edge area EA.

The second layer L2 (insulating organic film 244) does not overlap the ends of the pair of sealing inorganic films 250a and 250c, but the planarizing organic film 232 overlaps the ends of the pair of sealing inorganic films 250a and 250c. . There is a gap between the pair of sealing inorganic films 250a and 250c and the second layer L2. The planarizing organic film 232 is in contact with the adhesive layer 254 in the gap.

10 is a cross-sectional view of the display device shown in FIG. 8 taken along the line XX. 11 is a cross-sectional view of the display device shown in FIG. 8 taken along the line XI-XI. In addition to the planarizing organic film 232, an insulating organic film 244 (second layer L2) is also provided in the bending area BA. The soft resin 258 is laminated in contact with the insulating organic film 244 . Other contents of the present embodiment are the same as those described in the first embodiment. A step is formed between the resin substrate 210 and the circuit layer 34 adjacent to the end portion 34E of the circuit layer 34, but the step is relieved by the second layer L2.

[Third embodiment]
FIG. 12 is a cross-sectional view of a display device according to a third embodiment of the invention. This embodiment differs from the second embodiment in that the second layer L2 (insulating organic film 344) overlaps the ends of the pair of sealing inorganic films 350a and 350c. Also, the adhesive layer 354 contacts the insulating organic film 344 but does not contact the planarizing organic film 332 . Other contents of the present embodiment are the same as those described in the first embodiment.

[Fourth embodiment]
FIG. 13 is a plan view of a display device according to a fourth embodiment of the invention. 14 is a cross-sectional view of the display device shown in FIG. 13 taken along line XIV-XIV. Note that FIG. 13 is a developed view of the display device before being folded.

In this embodiment, the second layer L2 is provided in the end area EA of the resin substrate 410, avoiding the display area DA. That is, the second layer L2 is an organic film provided separately from the laminated structure in the display area DA. The second layer L2 can be provided, for example, by inkjet. A second layer L2 overlies the circuit layer 434 adjacent the edge area EA. The second layer L2 overlies the planarizing organic film 432 over the circuit layer 434 and overlies the planarizing organic film 432 over the pair of sealing inorganic films 450a and 450c. Furthermore, the second layer L2 rests on the edge of the first layer L1 (reinforcing organic film 452). Neither the planarizing organic film 432 nor the insulating organic film 444 is provided on the peripheral edge portion (the left end portion in FIG. 17) of the resin substrate 410 .

15 is a cross-sectional view of the display device shown in FIG. 13 taken along line XV-XV. 16 is a cross-sectional view of the display device shown in FIG. 13 taken along line XVI-XVI. As shown in FIG. 15 , the second layer L2 does not reach the bending area BA of the resin substrate 410 . On the other hand, the soft resin 458 spreads in the direction from the bending area BA to the display area DA, does not reach the display area DA, but slightly overlaps the second layer L2. The second layer L2 has an upper surface that descends toward the tip overlapping the soft resin 458 . The second layer L2 rests on the edge of the circuit layer 434 in the area adjacent to the peripheral edge of the resin substrate 410 (FIG. 14) and the area adjacent to the bending area BA (FIG. 15). On the other hand, as shown in FIG. 16, the second layer L2 does not exist in the region away from the peripheral portion of the resin substrate 410. As shown in FIG. Of the four directions surrounding the display area DA, the second layer L2 continuously surrounds the display area DA in three directions (the upper side and the left and right sides in FIG. 13) in which adjacent angles are perpendicular to each other, and the remaining one direction. discontinued on the side (lower side of FIG. 13).

17 is a cross-sectional view of the display device shown in FIG. 13 taken along the line XVII-XVII. A peripheral portion (the left end portion in FIG. 17) of the resin substrate 410 has a region where the second layer L2 is not provided. The second layer L2 is also provided to avoid the bending area BA of the resin substrate 410 . In the bending area BA, the planarizing organic film 432 is provided avoiding the peripheral edge of the resin substrate 410 . Other contents of the present embodiment are the same as those described in the first embodiment. Although a step is formed between the resin substrate 410 and the circuit layer 434 adjacent to the end portion 434E of the circuit layer 434, the second layer L2 can ensure a sufficient thickness, so that the step can be further alleviated. be.

The display device is not limited to an organic electroluminescence display device, and may be a display device having a light emitting element OD such as a quantum dot light emitting element OD (QLED: Quantum-Dot Light Emitting Diode) in each pixel. good.

The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the configurations described in the embodiments can be replaced with configurations that are substantially the same, configurations that produce the same effects, or configurations that can achieve the same purpose.

10 resin substrate 10A resin substrate material 12 pressure sensitive adhesive 14 reinforcing film 16 barrier inorganic film 16a silicon oxide film 16b silicon nitride film 16c silicon oxide film 18 semiconductor layer 20 additional film 22 gate insulation film 24 gate electrode 26 interlayer insulating film 28 drain electrode 30 display element layer 32 planarizing organic film 34 circuit layer 36 pixel contact portion 38 indium tin oxide film 38a first transparent conductive film 38b second 2 Transparent Conductive Film 40 Silicon Nitride Film 42 Pixel Electrode 44 Insulating Organic Film 46 Organic Electroluminescence Layer 48 Counter Electrode 50 Sealing Layer 50a Sealing Inorganic Film 50b Sealing Organic Film 50c Sealing Inorganic film 52 Reinforcing organic film 54 Adhesive layer 56 Polarizing plate 56A Polarizing plate material 58 Soft resin 210 Resin substrate 232 Planarizing organic film 244 Insulating organic film 250a Sealing inorganic film 250c Sealing inorganic Film 254 adhesive layer 256 polarizing plate 258 soft resin 332 planarizing organic film 344 insulating organic film 350a sealing inorganic film 350c sealing inorganic film 354 adhesive layer 410 resin substrate 432 planarizing organic film , 434 circuit layer, 3444 insulating organic film, 450a sealing inorganic film, 450c sealing inorganic film, 452 reinforcing organic film, 458 soft resin, BA bending region, Cad additional capacitance, CL1 first storage capacitance line, CL2 second holding capacity line CP integrated circuit chip Cs holding capacity DA display area DL signal line EA end area FP1 first flexible printed board FP2 second flexible printed board GD scanning circuit GL scanning line L cut Line, L1 first layer, L2 second layer, OD light emitting element, PWL power supply line, SD signal drive circuit, TR thin film transistor, TR2 thin film transistor, W1 first wiring layer, W2 second wiring layer.

Claims (6)

a resin substrate;
a barrier inorganic film on the resin substrate;
a circuit layer on the barrier inorganic film;
an organic layer on the circuit layer, a display element layer on the organic layer, a sealing layer covering the display element layer, a reinforcing organic film on the sealing layer, and an adhesive layer on the reinforcing organic film . A display device comprising a polarizing plate arranged through
The display device has a display area and an end area outside the display area in plan view,
The sealing layer has a sealing organic film and a pair of sealing inorganic films sandwiching the sealing organic film in the display region,
an end portion of the barrier inorganic film and an end portion of the pair of sealing inorganic films are arranged to avoid the end region;
The organic layer is positioned between the resin substrate and the adhesive layer in the end region ,
the pair of sealing inorganic films contact and overlap around the sealing organic film;
the reinforcing organic film has an upper surface that slopes downward toward the end region;
A display device , wherein the reinforcing organic film is aligned with the pair of sealing inorganic films . The display device according to claim 1 ,
The display device, wherein the organic layer overlaps the end portion of the barrier inorganic film. The display device according to claim 1 or 2 ,
A display device, wherein the organic layer is intermittently laminated on the circuit layer. In the display device according to any one of claims 1 to 3 ,
A display device, wherein the display element layer includes a pixel electrode, a counter electrode, and an organic electroluminescence layer disposed between the pixel electrode and the counter electrode. The display device according to claim 1,
The display device, wherein the organic layer overlaps the ends of the pair of sealing inorganic films. The display device according to claim 1,
A display device according to claim 1, wherein the organic layer has an outer edge that coincides with the end region of the resin substrate.

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