JP7242909B2 - Manufacturing method of heater for heating flavor source - Google Patents

Description

The present invention relates to a method for manufacturing a heater for heating a flavor source.

As a heater for heating the flavor source, a specific metal such as molybdenum or tungsten is placed on the ceramic before sintering as a heating resistor layer precursor, and the heating resistor layer is formed on the ceramic substrate during sintering. Are known. Further, a heater is known in which a heating resistor layer is provided on a base material by direct drawing by plating (for example, Patent Documents 1 and 2).

U.S. Patent Application No. 2018/0296777 U.S. Patent Application No. 2019/0090544

In the method of providing the heating resistor layer precursor on the ceramic before sintering, the types of metal materials that can be used are limited, and the degree of freedom in heater design is limited. Further, the methods of Patent Documents 1 and 2 can increase the degree of freedom in heater design, but are complicated. In view of such circumstances, an object of the present invention is to provide a method for manufacturing a heater for heating a flavor source by a simpler method.

means of resolving resolution

According to one aspect, there is provided a method for manufacturing a heater for heating a flavor source, in which heating resistor layers are formed on the main surface, the back surface, and one side surface. This method comprises the steps of: forming the heating resistor layer on the surface of a plate-like substrate by plating; forming a non-plating region on the plate-like substrate on which the heating resistor layer is formed; have

According to the present invention, a heater for heating a flavor source can be manufactured by a simpler method.

It is a perspective view which shows an example of the heater for flavor source heating manufactured with the manufacturing method which concerns on this embodiment. FIG. 4 is a perspective view showing another example of the heater for heating the flavor source manufactured by the manufacturing method according to the present embodiment; It is a schematic perspective view explaining an example of the manufacturing method of the heater shown to FIG. 1A. It is a schematic perspective view explaining an example of the manufacturing method of the heater shown to FIG. 1A. It is a schematic perspective view explaining an example of the manufacturing method of the heater shown to FIG. 1A. It is a schematic perspective view explaining an example of the manufacturing method of the heater shown to FIG. 1A. 1B is a schematic perspective view illustrating another example of a method for manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic perspective view illustrating another example of a method for manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic perspective view illustrating another example of a method for manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic perspective view illustrating another example of a method for manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic diagram illustrating still another example of the method of manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic diagram illustrating still another example of the method of manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic diagram illustrating still another example of the method of manufacturing the heater shown in FIG. 1A; FIG. 1B is a schematic diagram illustrating still another example of the method of manufacturing the heater shown in FIG. 1A; FIG. 1C is a schematic diagram illustrating an example of a method of manufacturing the heater shown in FIG. 1B; FIG. It is the schematic which shows the shape of a 2nd opening. It is the schematic explaining the other example of the manufacturing method of a heater.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and duplicate descriptions are omitted. FIG. 1A is a perspective view showing an example of a heater for heating a flavor source manufactured by a manufacturing method according to this embodiment. FIG. 1B is a perspective view showing another example of the heater for heating the flavor source manufactured by the manufacturing method according to the present embodiment. The heater 10 for heating the flavor source (hereinafter also simply referred to as "heater") is a heater for heating the flavor source without burning it. A flavor source is a material, such as tobacco, that is capable of producing flavor. Since the heater 10 is inserted into the flavor source, as shown in FIGS. 1A and 1B, the heater 10 preferably has a generally plate-like shape as a whole. Note that the heater 10 may have a rod-like or columnar shape.

The heater 10 has a main surface 10a, a back surface 10b opposite to the main surface 10a, and a side surface 10c connecting the main surface 10a and the back surface 10b. In this specification, the main surface 10a and the back surface 10b refer to surfaces of the heater 10 having the maximum area. In the example shown in FIGS. 1A and 1B, the heater 10 has a heating resistor layer 15 formed on the main surface 10a and the back surface 10b. A heating resistor is a material such as a metal that generates heat when energized, and W, Cu, or the like can be used, for example. The thickness of the heating resistor layer 15 is preferably 10 μm or more and 30 μm or less.

Also, the heating resistor layer 15 is formed on a part of the side surface 10c. That is, the non-plating region 7 is formed on the side surface 10c on which the heating resistor layer 15 is not formed. The heater 10 may have a pair of electrodes 21 respectively connected to the main surface 10a and the back surface 10b. Thus, the pair of electrodes 21, the main surface 10a, the side surface 10c provided with the heating resistor layer 15, and the back surface 10b form a path through which current flows. In order to lengthen the path of the current flowing through the heating resistor layer 15, the electrode 21 may be formed on the main surface 10a and the back surface 10b at a position as far as possible from the side surface 10c on which the heating resistor layer 15 is formed. preferable.

The heater 10 can be inserted into the flavor source, for example, so that the side surface 10c on which the heating resistor layer 15 is formed becomes the tip. As shown in FIG. 1A, the tip of the heater 10 has a straight shape when viewed from the main surface 10a. Further, as shown in FIG. 1B, the tip shape of the heater 10 viewed from the main surface 10a is a convex shape with an acute angle. Not limited to this, the tip shape of the heater 10 viewed from the main surface 10a may be a curved convex shape.

In one aspect, the thickness of the heater 10 is preferably 0.1 mm or more and 5.0 mm or less, and more preferably 0.3 mm or more and 1.0 mm or less. In one aspect, the width of the heater 10 is preferably 1 mm or more and 50 mm or less, more preferably 3.0 mm or more and 7.0 mm or less. In one aspect, the length of the heater 10 is preferably 3 mm or more and 100 mm or less, more preferably 10 mm or more and 30 mm or less. In this specification, the thickness of the heater 10 refers to the length between the main surface 10a and the back surface 10b, and the length of the heater 10 refers to the length in the direction in which the heater 10 is inserted into the flavor source. The width of the heater 10 means the length of the heater 10 in the direction orthogonal to the direction of insertion into the flavor source.

In another aspect, the heater 10 is a rod-shaped heater having a round-shaped cross section formed by chamfering a tangent line between the main surface 10a of the heater 10 and the side surface 10c forming the non-plating region 7. may be

Next, a method for manufacturing the heater 10 shown in FIGS. 1A and 1B will be described. 2A to 2D are schematic perspective views explaining an example of a method of manufacturing the heater 10 shown in FIG. 1A. As shown in FIG. 2A, first, a plate-like substrate 1, which is the material of the heater 10, is prepared. In the illustrated example, the plate-like substrate 1 is a rectangular plate. The plate-shaped substrate 1 has a main surface 1a, a back surface 1b, and a side surface 1c connecting the main surface 1a and the back surface 1b. The plate-like substrate 1 can be made of a known insulating material. Such materials include, for example, engineering plastics, heat-resistant polymers such as thermosetting resins, and ceramics. The size of the plate-like substrate 1 depends on the shape of the heater 10 finally obtained.

Next, as shown in FIG. 2B, the heating resistor layer 15 is formed on the surface of the plate-like substrate 1 by plating. The heating resistor layer 15 can be formed by a known plating method such as an electrolytic plating method or an electroless plating method, but is preferably formed by an electroless plating method. In this embodiment, the surface of the plate-like substrate 1 may be plated. From the viewpoint of workability, it is preferable that the main surface 1a, the back surface 1b, and at least part of the side surface 1c are plated, and it is more preferable that the main surface 1a, the back surface 1b, and the side surface 1c are entirely plated. FIG. 2B shows the plate-like substrate 1 with the main surface 1a, the back surface 1b, and the side surfaces 1c all plated. When the heating resistor layer 15 is formed by an electroless plating method, the surface of the plate-like substrate 1 is immersed in a plating solution containing the metal forming the heating resistor layer 15 . The heating resistor layer 15 can be plated on the entire surface (that is, the main surface 1a, the back surface 1b, and the side surfaces 1c).

Next, a non-plating region 7 is formed on the plate-like substrate 1 on which the heating resistor layer 15 is formed. Specifically, the heating resistor layer 15 formed on the side surface 1c is removed from the plate-shaped base material 1, leaving a part thereof. For example, as shown in FIG. 2C, along the cut line CL, side surfaces 1c on three sides of the plate-like substrate 1 are cut and removed to leave a part of the side surface 1c, so that the plate-like substrate 1 Non-plated regions 7 can be formed. For cutting the plate-like substrate 1, a cutter such as a diamond cutter or a known cutting machine such as a press cutting machine can be used. Without being limited to this, by etching the heating resistor layer 15 on the other portion of the side surface 1c of the plate-shaped substrate 1 while masking the portion where the heating resistor layer 15 of the side surface 1c of the plate-shaped substrate is left. , a part of the heating resistor layer 15 on the side surface 1c may be removed. Further, by cutting the heating resistor layer 15 on the side surface 1c of the plate-like substrate 1, the heating resistor layer 15 on the side surface 1c may be partially removed. From the viewpoint of simplification of the manufacturing process, it is preferable to cut and remove the plate-like substrate 1 including the side surface 1c along the cut line CL, as shown in FIG. 2C.

2A to 2C, the heating resistor layer 15 extending from the main surface 10a to the back surface 10b via the side surface 10c (left side surface in FIG. 2D) as shown in FIG. 2D. is obtained. Since the three side surfaces 10c of the heater 10 are the non-plating regions 7, short-circuiting can be prevented when the main surface 10a and the back surface 10b are energized. The heating resistor layer 15 may be provided on the entire surfaces of the main surface 1a, the back surface 1b, and the side surface 1c of the plate-shaped substrate 1, but may be provided on a part of each surface.

3A to 3D are schematic perspective views explaining another example of the method of manufacturing the heater 10 shown in FIG. 1A. As shown in FIG. 3A, first, a plate-like substrate 1 similar to that shown in FIG. 2A is prepared. Moreover, as shown in FIG. 3B, the main surface 1a, the back surface 1b, and the side surface 1c of the plate-shaped substrate 1 are plated in the same manner as in FIG. 2B. As described with reference to FIG. 2B, the main surface 1a, the back surface 1b, and at least a portion of the side surfaces 1c may be plated.

Next, as shown in FIG. 3C, a first opening 17 is formed in the plate-like substrate 1 on which the heating resistor layer 15 is formed. The first opening 17 can be formed by cutting the plate-like substrate 1, for example. As a result, the non-plating region 7 is formed on the opening side surface 17 a that defines the first opening 17 . Subsequently, the plate-like substrate 1 is cut along the first cut line CL1 and the second cut line CL2 extending from the first opening 17 to the side surface 1c. The second cutline CL2 preferably does not cross the first cutline CL1. A non-plating region 7 is formed in the plate-like substrate 1 by cutting the plate-like substrate 1 along the first cut line CL1 and the second cut line CL2. As a result, as shown in FIG. 3D, the heating resistor layer 15 extending from the main surface 10a to the back surface 10b via the side surface 10c (the left side surface in FIG. 3D) is formed, and the three side surfaces 10c are non-plating regions. 7 is obtained.

Alternatively, the plate-like substrate 1 may be cut along a first cut line CL1' and a second cut line CL2' extending from the first opening 17 to the other side surface 1c. The second cutline CL2' preferably does not cross the first cutline CL1'. Thereby, one more heater 10 can be obtained from the plate-like substrate 1 .

The first cutline CL1 and the first cutline CL1' preferably extend on the same straight line. Thereby, the plate-shaped substrate 1 can be easily cut along the first cut line CL1 and the first cut line CL1' in one cutting step. Similarly, the second cutline CL2 and the second cutline CL2' preferably extend on the same straight line. Thereby, the plate-like substrate 1 can be easily cut along the second cut line CL2 and the second cut line CL2' in one cutting step. Further, the heater 10 can be obtained by cutting the plate-shaped base material 1 along two more cut lines extending from the first opening 17 to the other side surfaces.

4A to 4D are schematic diagrams explaining still another example of the method of manufacturing the heater 10 shown in FIG. 1A. As shown in FIG. 4A, first, a plate-like substrate 1, which is the material of the heater 10, is prepared. The plate-like substrate 1 is a rectangular plate as a whole and has at least one second opening 19 . In the illustrated example, the plate-shaped substrate 1 has six second openings 19, two second openings 19 are arranged vertically in the figure, and three second openings 19 are arranged horizontally in the figure. . The plate-like substrate 1 has a main surface 1a, a back surface 1b (not shown), and a side surface 1c connecting the main surface 1a and the back surface 1b.

The plate-like substrate 1 can be prepared by any method. For example, the plate-shaped base material 1 can be manufactured by applying known processing such as cutting to a plate-shaped member to form the second openings 19 . Alternatively, a material such as a thermosetting resin is filled into a mold capable of molding a plate-like member having openings, and the material is cured to simultaneously form the base material portion and the second openings 19 to manufacture the plate-like base material 1 . can also

Next, as shown in FIG. 4B, the heating resistor layer 15 is formed on the surface of the plate-like substrate 1 by plating. The heating resistor layer 15 can be formed by a known plating method such as an electrolytic plating method or an electroless plating method, but is preferably formed by an electroless plating method.
The heating resistor layer 15 is formed at least on the main surface 1 a , the back surface 1 b , and the opening side surfaces of the second opening 19 . The heating resistor layer 15 may not be formed on the side surface 1c. In this embodiment, the heating resistor layer 15 is formed by plating on the main surface 1a, the back surface 1b, the side surface 1c, and the opening side surface of the second opening 19. FIG. When the heating resistor layer 15 is formed by an electroless plating method, the surface of the plate-like substrate 1 is immersed in a plating solution containing the metal forming the heating resistor layer 15 . The heating resistor layer 15 can be plated on the entire surface (that is, the main surface 1a, the back surface 1b, the side surface 1c, and the opening side surface of the second opening 19).

Next, by extracting the portion between the second opening 19 and the side surface 1c of the plate-like substrate 1 from the plate-like substrate 1 on which the heating resistor layer 15 is formed, the non-plating region 7 of the heater 10 is formed. to form Specifically, as shown in FIG. 4C, along the third cutline CL3 directed from each second opening 19 to the side surface 1c and the fourth cutline CL4 directed from the same second opening 19 to the side surface 1c A plate-shaped substrate 1 is cut. Thereby, the portion between the second opening 19 and the side surface 1c can be extracted from the plate-shaped base material 1 . Specifically, as shown in FIG. 4C, the third cutline CL3 or the fourth cutline CL4 faces the opening side surface of the second opening 19 corresponding to the side surface 10c having the heating resistor layer 15 of the heater 10. It preferably extends linearly toward the side surface 1c. Moreover, it is preferable that the fourth cutline CL4 does not cross the third cutline CL3. As shown in FIG. 4C, both the third cutline CL3 and the fourth cutline CL4 are preferably straight lines and parallel to each other. However, the third cutline CL3 and the fourth cutline CL4 may be curved, zigzag, or have any shape. In addition, in the example shown in FIG. 4C, the third cutline CL3 and the fourth cutline CL4 reach the side surface 1c of the plate-like substrate 1, but it is sufficient if they reach the cutline CL. In this specification, the cutting direction based on each cut line is arbitrary.

When the heating resistor layer 15 is not formed on the side surface 1c of the plate-like substrate 1, the portion between the second opening 19 extracted from the plate-like substrate 1 and the side surface 1c of the plate-like substrate 1 is The non-plating region 7 is formed by the side surface 1c and the portions cut by the third cut line CL3 and the fourth cut line CL4, and the heating resistor layer 15 is formed on the portion corresponding to the opening side surface of the second opening 19. FIG. Therefore, in this case, the portion between the second opening 19 extracted from the plate-like substrate 1 and the side surface 1 c of the plate-like substrate 1 can be used as the heater 10 . For example, by masking the side surface 1c during electroless plating of the plate-like substrate 1, the heating resistor layer 15 is prevented from being formed on the side surface 1c of the plate-like substrate 1, and only the side surface 1c is non-electrolytic. It may have plated areas 7 .

On the other hand, when the heating resistor layer 15 is formed on the side surface 1c of the plate-shaped substrate 1 as in the present embodiment, the heating resistor layer 15 formed on the side surface 1c of the plate-shaped substrate 1 or the second 2. The heating resistor layer 15 formed on the opening side surface of the opening 19 is removed. In the example shown in FIG. 4C, the plate-like substrate 1 including the side surface 1c is cut and removed along the cut line CL orthogonal to the third cut line CL3 and the fourth cut line CL4. A plated region 7 is formed. As a result, the portion between the second opening 19 extracted from the plate-like substrate 1 and the side surface 1c of the plate-like substrate 1 is the portion corresponding to the side surface 1c or the opening side surface of the second opening 19 and the third opening. A non-plating region 7 is provided in a portion cut by the cut line CL3 and the fourth cut line CL4. By etching the heating resistor layer 15 on the side surface 1c of the plate-shaped substrate 1 or by cutting the heating resistor layer 15 on the side surface 1c of the plate-shaped substrate 1, the heating resistor layer on the side surface 1c 15 may be removed.

4C, the heater 10 is extracted by dividing the portion between the pair of second openings 19 of the plate-like substrate 1 in the direction in which the pair of second openings 19 are arranged. can do. Specifically, the plate-like substrate 1 is cut along the fifth cut line CL5, the sixth cut line CL6, and the seventh cut line CL7 shown in FIG. 4C. A fifth cutline CL5 extends between one of the second openings 19 and another one of the second openings 19 . The sixth cutline CL6 extends between one of the second openings 19 and the other one of the second openings 19 so as not to cross the fifth cutline CL5. The seventh cutline CL7 extends between the fifth cutline CL5 and the sixth cutline CL6. Thereby, two heaters 10 can be extracted while forming the non-plating region 7 .

By the process described above, the twelve heaters 10 shown in FIG. can be manufactured.

In the example shown in FIG. 4C, the third cutline CL3 and the fourth cutline CL4 are preferably straight lines. Moreover, it is preferable that the fifth cutline CL5 and the sixth cutline CL6 are straight lines. Furthermore, it is preferable that the third cutline CL3 and the fifth cutline CL5 extend on the same straight line. Thereby, the plate-like substrate 1 can be easily cut from the third cut line CL3 to the fifth cut line CL5 in one cutting step. Moreover, as shown in FIG. 4C, it is preferable that the fourth cutline CL4 and the sixth cutline CL6 extend on the same straight line. Thereby, the plate-like substrate 1 can be easily cut from the fourth cut line CL4 to the sixth cut line CL6 in one cutting step.

Further, when the third cutline CL3 and the fifth cutline CL5 extend on the same straight line, and the fourth cutline CL4 and the sixth cutline CL6 extend on the same straight line, as shown in FIG. 4C, The third cutline CL3 and the fifth cutline CL5 are preferably substantially parallel to the fourth cutline CL4 and the sixth cutline. Thereby, the width of the heater 10 manufactured from between the second opening 19 and the side surface 1c can be made the same as the width of the heater 10 manufactured from between the second opening 19 and the second opening 19. .

Also, in the example shown in FIG. 4C, a plurality of pairs of second openings 19 arranged vertically in the figure are arranged adjacent to each other in the horizontal direction in the figure. As shown in FIG. 4C, a seventh cutline CL7 dividing the portion between the pair of second openings 19, and another pair of second openings 19 aligned horizontally with the pair of second openings 19 in the figure. It is preferable that the seventh cut line CL7 that divides the portion of the plate-like substrate 1 therebetween extends on the same straight line. As a result, when a plurality of pairs of second openings 19 are arranged adjacent to each other as shown in FIG. can be done.

Moreover, it is preferable that the seventh cutline CL7 extends between the center of the fifth cutline CL5 and the center of the sixth cutline CL6. Thereby, when the fifth cut line CL5 and the sixth cut line are straight lines, the two heaters 10 extracted from the portion between the pair of second openings 19 can have the same length. .

In the example shown in FIG. 4C, the heater 10 is manufactured from the portion of the plate-like substrate 1 between the pair of second openings 19 by the fifth cut line CL5, the sixth cut line CL6, and the seventh cut line CL7. , but not limited to this. That is, the heater 10 may be manufactured by cutting the portion of the plate-like substrate 1 between the pair of second openings 19 along arbitrary cut lines. For example, the fifth cutline CL5 and the sixth cutline CL6 may extend between one of the second openings 19 and the other one of the second openings 19 while crossing each other. In that case, the portion of the plate-like substrate 1 partitioned by the fifth cutline CL5, the sixth cutline CL6, and the second opening 19 is extracted as the heater 10 without providing the seventh cutline CL7.

Although the shape of the second opening 19 is rectangular in the examples shown in FIGS. 4A to 4D, the shape of the second opening 19 is not limited, and may be any shape such as a rounded rectangle, circle, or ellipse. good too. FIG. 5 is a schematic diagram illustrating an example of a method of manufacturing the heater 10 shown in FIG. 1B. As shown in FIG. 5, the shape of the second opening 19 is a hexagon formed by connecting two trapezoids at their short sides. The plate-like substrate 1 shown in FIG. 5 is cut along the third cutline CL3, the fourth cutline CL4, the fifth cutline CL5, the sixth cutline CL6, and the seventh cutline CL7 as described in FIG. 4C. can be cut. As a result, 12 heaters 10 having a convex shape with an acute angle as shown in FIG. 2 can be obtained. Moreover, as shown in FIG. 6, for example, the second opening 19 may have a shape in which two obtuse angles of the shape of the second opening 19 shown in FIG. 5 are rounded.

7A and 7B are schematic diagrams illustrating still another example of the method of manufacturing the heater 10. FIG. In the example shown in FIG. 7 , the plate-like substrate 1 has a plurality of second openings 19 . As illustrated, the shape of the second opening 19 includes a rectangle, an ellipse, and a hexagon formed by connecting two trapezoids at their short sides. The plate-like substrate 1 shown in FIG. 7 may have the same structure except for the number and shape of the second openings 19 and the size of the plate-like substrate 1 . In the example shown in FIG. 7, the plate-shaped substrate 1 has an eighth cut line in addition to the third cut line CL3, the fourth cut line CL4, the fifth cut line CL5, the sixth cut line CL6, the seventh cut line CL7. It can be cut along the line CL8 and the ninth cut line CL9.

The eighth cutline CL8 extends between one of the second openings 19 and the other one of the second openings 19 so as not to cross the fifth cutline CL5 and the sixth cutline CL6. By cutting the plate-like substrate 1 along the eighth cut line CL8, the portion between the pair of second openings 19 can be divided. It should be noted that an optional cutline extending between one of the second openings 19 and another one of the second openings can also be added.

The ninth cutline CL9 is a cutline extending from the second opening 19 toward the side surface 1c and different from the third cutline CL3 and the fourth cutline CL4. The ninth cutline CL9 preferably does not cross the third cutline CL3 and the fourth cutline CL4. By cutting the plate-like substrate 1 along the ninth cut line CL9, the heater 10 obtained from the portion between the second opening 19 and the side surface 1c can be divided. An arbitrary cut line extending from the second opening 19 to the side surface 1c can be added.

According to the manufacturing method described above, it is possible to obtain the heater 10 having the heating resistor layer 15 on the main surface 10a, the back surface 10b, and part of the side surface 10c. Further, the electrodes 21 may be formed on each of the main surface 10a and the back surface 10b of these heaters 10 . Specifically, it is preferable to form the electrode 21 on the main surface 10a and the back surface 10b at a position as far as possible from the side surface 10c on which the heating resistor layer 15 is formed. A known material such as a metal plate can be used for the electrode 21 .

In the heater 10 manufactured by the manufacturing method described above, it is not necessary to provide the heating resistor layer 15 on the entire surface of the main surface 10a or the back surface 10b. Therefore, part of the heating resistor layer 15 may be removed from the main surface 10a or the back surface 10b. In this case, the heating resistor layer 15 is patterned so that the electric path extending between the side surface 10c on which the heating resistor layer 15 is formed and the side surface 10c facing the main surface 10a or the back surface 10b is curved, The resistance value may be increased by extending the electric path distance.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the technical ideas described in the claims, specification and drawings. is possible. Any shape or material that is not directly described in the specification and drawings is within the scope of the technical concept of the present invention as long as it produces the action and effect of the present invention.

Some of the forms disclosed in this specification are described below.
According to the first aspect, there is provided a method for manufacturing a heater for heating a flavor source, in which heating resistor layers are formed on the main surface, the back surface, and one side surface. This method comprises the steps of: forming the heating resistor layer on the surface of a plate-like substrate by plating; forming a non-plating region on the plate-like substrate on which the heating resistor layer is formed; have

A second aspect is characterized in that, in the first aspect, the step of forming the heating resistor layer includes a step of forming the heating resistor layer on the main surface, the back surface, and the side surface of the plate-shaped base material. do.

According to a third aspect, in the second aspect, the step of forming the non-plating region includes a step of removing the heating resistor layer formed on the side surface from the plate-shaped base material except for a part. is the gist.

According to a fourth aspect, in the second aspect or the third aspect, the step of forming the non-plating region includes forming a first opening in the plate-like substrate on which the heating resistor layer is formed; a first cut line extending between the first opening and the side surface; and a second cut line extending between the first opening and the side surface and not intersecting the first cut line. and cutting the material.

A fifth aspect is the first aspect or the second aspect, wherein the plate-like substrate has a second opening, and the step of forming the heating resistor layer comprises at least a main surface of the plate-like substrate, The gist of the method is to include a step of forming the heating resistor layer on the rear surface and the opening side surface of the plate-like substrate defining the second opening.

A sixth aspect is the fifth aspect, wherein the step of forming the non-plating region includes extracting a portion between the second opening and a side surface of the plate-like substrate from the plate-like substrate. This is the gist of it.

According to a seventh aspect, in the sixth aspect, the step of forming the non-plating region includes: a third cut line extending from the second opening toward the side surface of the plate-shaped substrate; 4 cut lines, and a step of cutting the plate-shaped substrate along.

An eighth aspect is any one of the fifth aspect to the seventh aspect that quotes the second aspect, wherein the step of forming the non-plating region includes: Alternatively, the method includes a step of removing the heating resistor layer formed on the side surface of the opening.

A ninth aspect is any one of the fifth aspect to the eighth aspect, wherein the plate-like substrate has a pair of the second openings, and the step of forming the non-plating regions includes: The gist is to include a step of dividing a portion between the pair of second openings in a direction in which the pair of second openings are arranged.

In a tenth aspect based on the ninth aspect, the step of forming the non-plating region includes: a fifth cut line extending between one of the second openings and the other one of the second openings; and the other one of the second openings, a sixth cut line that does not cross the fifth cut line, and a sixth cut line that extends between the fifth cut line and the sixth cut line, the plate and a step of cutting the plate-shaped substrate along a seventh cut line that divides the portion between the pair of second openings of the plate-shaped substrate.

An eleventh aspect is the tenth aspect, wherein the fifth cut line and the sixth cut line are straight lines extending between one of the second openings and the other one of the second openings. do.

A twelfth aspect is characterized in that, in the tenth aspect or the eleventh aspect, the seventh cutline is a straight line extending between the center of the fifth cutline and the center of the sixth cutline.

A thirteenth aspect is any one of the tenth to twelfth aspects citing the seventh aspect, wherein the third cutline and the fifth cutline extend on the same straight line, and the fourth cutline and the fourth cutline The gist is that the 6-cut lines extend on the same straight line.

A fourteenth aspect is characterized in that, in the thirteenth aspect, the third cutline and the fifth cutline are substantially parallel to the fourth cutline and the sixth cutline.

A fifteenth aspect is any one of the tenth to fourteenth aspects, wherein the step of forming the non-plating region includes an eighth cut extending between one of the second openings and the other one of the second openings. The gist is that the method includes cutting the plate-like substrate along a line, wherein the eighth cut line does not cross the fifth cut line and the sixth cut line.

A sixteenth aspect is any one of the tenth to fifteenth aspects, wherein the plate-like substrate has another pair of the second openings adjacent to the pair of second openings, and the plate-like substrate and the seventh cut line dividing the portion between the pair of second openings of the plate-like substrate is the same as the seventh cut line dividing the portion between the other pair of second openings of the plate-like substrate The gist is that it extends in a straight line.

The gist of a seventeenth aspect is that in any one of the first to sixteenth aspects, the method includes the step of forming electrodes on each of the main surface and the back surface of the heater for heating the flavor source.

1: plate-like substrate 7: non-plating area 10: heater 10a: main surface 10b: back surface 10c: side surface 15: heating resistor layer 17: first opening 17a: opening side surface 19: second opening 21: electrode CL1: second 1 cut line CL1': 1st cut line CL2: 2nd cut line CL2': 2nd cut line CL3: 3rd cut line CL4: 4th cut line CL5: 5th cut line CL6: 6th cut line CL7: 3rd 7th cut line CL8: 8th cut line

Claims (19)

A method for manufacturing a heater for heating a flavor source, which has a tip to be inserted into the flavor source, and has a heating resistor layer formed on the main surface, the back surface, and the tip surface,
a step of forming the heating resistor layer on the surface of the plate-shaped substrate by plating;
A method for manufacturing a heater for heating a flavor source, comprising: forming a non-plating region on the plate-like substrate on which the heating resistor layer is formed. In the method for manufacturing the heater for heating the flavor source according to claim 1,
Manufacture of a heater for heating a flavor source, wherein the step of forming the heating resistor layer includes a step of forming the heating resistor layer on side surfaces including the main surface, the back surface, and the tip surface of the plate-shaped substrate. Method. In the method for manufacturing the heater for heating the flavor source according to claim 2,
A method for manufacturing a heater for heating a flavor source, wherein the step of forming the non-plated region includes a step of removing the heating resistor layer formed on the side surface of the plate-shaped base material except for a part thereof. In the method for manufacturing the heater for heating the flavor source according to claim 2 or 3,
The step of forming the non-plating region includes:
a step of forming a first opening in the plate-like substrate on which the heating resistor layer is formed;
The plate along a first cut line extending between the first opening and the side surface and a second cut line extending between the first opening and the side surface and not intersecting the first cut line A method of manufacturing a heater for heating a flavor source, comprising: cutting a shaped base material. In the method for manufacturing the heater for heating the flavor source according to claim 1 or 2,
The plate-like substrate has a second opening,
The step of forming the heating resistor layer includes forming the heating resistor layer on at least the main surface, the back surface of the plate-shaped substrate, and the opening side surface of the plate-shaped substrate defining the second opening. A method of manufacturing a heater for heating a flavor source, comprising: In the method for manufacturing the heater for heating the flavor source according to claim 5,
A method for manufacturing a heater for heating a flavor source, wherein the step of forming the non-plating region includes extracting a portion between the second opening and a side surface of the plate-shaped substrate from the plate-shaped substrate. . In the method for manufacturing the heater for heating the flavor source according to claim 6,
The step of forming the non-plating region includes forming the plate along a third cut line extending from the second opening toward the side surface of the plate-shaped substrate and a fourth cut line extending from the second opening toward the side surface. A method for manufacturing a heater for heating a flavor source, comprising cutting a base material. In the method for manufacturing a heater for heating a flavor source according to any one of claims 5 to 7 citing claim 2,
The step of forming the non-plated region includes the step of removing the heating resistor layer formed on the side surface of the plate-shaped substrate or the heating resistor layer formed on the side surface of the opening. Flavor source heating A method of manufacturing a heater for In the method for manufacturing the heater for heating the flavor source according to any one of claims 5 to 8,
The plate-like substrate has a pair of the second openings,
A heater for heating a flavor source, wherein the step of forming the non-plating region includes the step of dividing the portion between the pair of second openings of the plate-like substrate in the direction in which the pair of second openings are arranged. manufacturing method. In the method for manufacturing the heater for heating the flavor source according to claim 9,
The step of forming the non-plating region includes: a fifth cut line extending between one of the second openings and the other one of the second openings; a sixth cut line extending between one and not intersecting the fifth cut line; and a pair of second openings in the plate-like substrate extending between the fifth cut line and the sixth cut line. A method for manufacturing a heater for heating a flavor source, comprising a step of cutting the plate-shaped substrate along a seventh cut line that divides the portion between. In the method for manufacturing the heater for heating the flavor source according to claim 10,
The method of manufacturing a heater for heating a flavor source, wherein the fifth cut line and the sixth cut line are straight lines extending between one of the second openings and the other one of the second openings. In the method for manufacturing the heater for heating the flavor source according to claim 10 or 11,
The manufacturing method of the heater for heating the flavor source, wherein the seventh cut line is a straight line extending between the center of the fifth cut line and the center of the sixth cut line. In the method for manufacturing a heater for heating a flavor source according to any one of claims 10 to 12 citing claim 7,
The third cut line and the fifth cut line extend on the same straight line,
A method for manufacturing a heater for heating a flavor source, wherein the fourth cut line and the sixth cut line extend on the same straight line. In the method for manufacturing the heater for heating the flavor source according to claim 13,
The method of manufacturing a heater for heating a flavor source, wherein the third cut line and the fifth cut line are substantially parallel to the fourth cut line and the sixth cut line. In the method for manufacturing the heater for heating the flavor source according to any one of claims 10 to 14,
The step of forming the non-plating region includes cutting the plate-like substrate along an eighth cut line extending between one of the second openings and the other one of the second openings;
A method for manufacturing a heater for heating a flavor source, wherein the eighth cut line does not cross the fifth cut line and the sixth cut line. In the method for manufacturing the heater for heating the flavor source according to any one of claims 10 to 15,
the plate-like substrate has another pair of second openings adjacent to the pair of second openings,
The seventh cut line that divides the portion between the pair of second openings of the plate-like substrate, and the seventh cut line that divides the portion between the other pair of second openings of the plate-like substrate. A method for manufacturing a heater for heating a flavor source in which a cut line extends on the same straight line. In the method for manufacturing the heater for heating the flavor source according to any one of claims 1 to 16,
A method for manufacturing a heater for heating a flavor source, comprising the step of forming electrodes on each of the main surface and the back surface of the heater for heating the flavor source. A method for manufacturing a heater for heating a flavor source in which a heating resistor layer is formed on the main surface, the back surface, and one side surface,
a step of forming the heating resistor layer on the surface of the plate-shaped substrate by plating;
forming a non-plating region on the plate-shaped substrate on which the heating resistor layer is formed;
The step of forming the heating resistor layer includes a step of forming the heating resistor layer on the main surface, the back surface, and the side surface of the plate-shaped substrate,
The step of forming the non-plating region includes:
a step of forming a first opening in the plate-like substrate on which the heating resistor layer is formed;
The plate along a first cut line extending between the first opening and the side surface and a second cut line extending between the first opening and the side surface and not intersecting the first cut line A method of manufacturing a heater for heating a flavor source, comprising: cutting a shaped base material. A method for manufacturing a heater for heating a flavor source in which a heating resistor layer is formed on the main surface, the back surface, and one side surface,
a step of forming the heating resistor layer on the surface of the plate-shaped substrate by plating;
forming a non-plating region on the plate-shaped substrate on which the heating resistor layer is formed;
The plate-like substrate has a second opening,
The step of forming the heating resistor layer includes forming the heating resistor layer on at least the main surface, the back surface of the plate-shaped substrate, and the opening side surface of the plate-shaped substrate defining the second opening. A method of manufacturing a heater for heating a flavor source, comprising:

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