JP7237546B2 - Electric wiring penetration device and manufacturing method thereof - Google Patents

Description

TECHNICAL FIELD Embodiments of the present invention relate to an electrical wire feed-through device and a method of manufacturing the same.

2. Description of the Related Art In general, electrical wiring that penetrates a partition wall such as a reactor containment vessel of a nuclear power plant is connected by an electrical wiring penetration device (electrical penetration) for radiation shielding or airtightness. A cylindrical module with a conductor passing through the center is attached via a metal O-ring to the through hole of the electrical wiring through device. The module is generally filled with a sealant to hermetically seal the conductors passing through it.

The module of the conventional electrical wiring penetration device for the containment vessel uses an organic material such as epoxy resin as a sealing material, and the sealing performance and insulation performance deteriorate due to the effects of temperature, radiation, and aging. From the perspective of extending the life of future plants and maintaining long-term functions in severe accident (SA) environments, improvements in temperature and radiation resistance and resistance to aging degradation are required for electrical wiring penetration devices. be done.

As a method for solving the above-mentioned problems, it is proposed to use an inorganic material such as ceramic as the boundary sealing material.

Japanese Utility Model Laid-Open No. 61-153428

In the module of the electrical wiring penetrating device using the inorganic sealing material described above, the inorganic material such as ceramic and the conductor cannot be directly bonded. It is necessary to apply a metallizing treatment to the joint between the conductor and the sealing material, and then perform the joint by brazing. However, in a module designed for compatibility with multi-pin structure modules used in existing nuclear power plants, the metallized layer narrows the insulation distance between adjacent conductors, making it difficult to ensure insulation performance.

The embodiments of the present invention have been made to solve the above-described problems, and it is an object of the present invention to improve insulation performance between conductors in an electrical wiring penetration device using an inorganic sealing member.

An electrical wiring penetration device according to an embodiment of the present invention includes a seal member made of an electrically insulating inorganic material and having a plurality of through holes formed therein; a metal conductor passing through the through holes of the seal member; a metallized layer airtightly adhered to the surface of the seal member surrounding each of the through holes of the electrical wiring through-hole, and a brazing material portion airtightly joining the metallized layer and the conductor, wherein the seal The member has a partition portion extending along the surface of the seal member so as to partition the plurality of through holes, and the metallized layer has a plurality of partition portions on the surface of the seal member other than the partition portion. It is characterized in that it is formed so as to surround each of the through holes.
Further, an electrical wiring penetration device according to another embodiment of the present invention includes a seal member made of an electrically insulating inorganic material and having a plurality of through holes formed therein; An electrical wiring penetration device comprising: a conductor; a metallized layer airtightly attached to a surface of the sealing member surrounding each of the plurality of through holes; and a brazing material portion airtightly joining the metallized layer and the conductor. A partition portion extending along the surface of the seal member is formed so as to partition the plurality of through holes, and the metallized layer forms the plurality of partition portions on the surface of the seal member other than the partition portion. The partition portion is formed so as to surround each of the through-holes, and the partition portion is a partition wall extending along the surface of the seal member, and at least the top portion of the surface of the partition wall includes the metallized layer and the brazing material portion. is not in contact with any of

A method of manufacturing an electrical wiring penetration device according to an embodiment of the present invention includes forming a plurality of through holes in a sealing member made of an electrically insulating inorganic material, and forming a plurality of through holes along the surface of the sealing member. forming a partition portion so as to partition and extend the sealing member, and after the step of forming the sealing member, a portion other than the partition portion on the surface of the sealing member is metallized so as to surround each of the plurality of through holes a metallized layer forming step for airtightly adhering layers; a conductor inserting step for inserting a metal conductor into each of the plurality of through holes after the metallizing layer forming step; and after the conductor inserting step, the conductor and the and a brazing step of air-tightly joining the metallized layer with a brazing member.

According to the embodiment of the present invention, it is possible to improve the insulation performance between conductors in an electrical wiring penetration device using an inorganic sealing member.

BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing of the electrical wiring penetration apparatus which concerns on the 1st Embodiment of this invention. FIG. 2 is an enlarged sectional view of part II of FIG. 1; FIG. 2 is a cross-sectional view taken along the line III-III of FIG. 1 and showing a state where an insulating cover is not provided; FIG. 4 is an enlarged sectional view of part IV of FIG. 3; FIG. 2 is a flowchart showing a method of manufacturing the electrical wiring penetration device according to the first embodiment of the present invention; FIG. 2 is a cross-sectional view of the electrical wiring penetration device according to the second embodiment of the present invention, being an enlarged cross-sectional view of a portion corresponding to the II portion of FIG. 1; FIG. 3 is a cross-sectional view of an electrical wiring penetration device according to a third embodiment of the present invention, being an enlarged cross-sectional view of a portion corresponding to the II portion of FIG. 1; FIG. 4 is a cross-sectional view of an electrical wiring penetration device according to a fourth embodiment of the present invention, being an enlarged cross-sectional view of a portion corresponding to the II portion of FIG. 1;

Hereinafter, an embodiment of an electrical wiring penetration device according to the present invention will be described with reference to the drawings. Here, the same or similar parts are denoted by common reference numerals, and repeated explanations are omitted.

[First embodiment]
FIG. 1 is a cross-sectional view of an electrical wiring penetration device according to a first embodiment of the present invention. FIG. 2 is an enlarged sectional view of part II of FIG. FIG. 3 is a cross-sectional view taken along the line III--III in FIG. 1, showing a state in which the insulating cover is not provided. FIG. 4 is an enlarged cross-sectional view of the IV portion of FIG.

The electrical wiring penetration device according to the present embodiment has, for example, a cylindrical sealing member 11 made of an electrically insulating inorganic material and a plurality of metallic conductors 12 penetrating through the sealing member 11 . A plurality of through holes 13 are formed in the sealing member 11 in parallel with each other in the axial direction, and each conductor 12 passes through each through hole 13 .

For example, glass or ceramic is used for the sealing member 11 . The conductor 12 extends linearly and is made of a high electrical conductivity material such as copper.

Since inorganic materials such as glass and ceramics cannot be directly connected by brazing or the like, a metallized layer 14 (see FIGS. 2, 3 and 4) is formed at a position surrounding the conductor 12 on the surface of the sealing member 11, and the metallized layer A brazing member 15 is formed between 14 and conductor 12 . As a result, the conductor 12 and the sealing member 11 are airtightly and firmly joined via the metallized layer 14 and the brazing material portion 15 . Here, as the metallized layer 14, for example, Mo--Mn or Ag--Cu--Ti can be applied. Further, Ag--Cu or Au--Ni, for example, can be applied as the brazing material portion 15 .

As shown in FIG. 3, the conductors 12 are arranged in a houndstooth pattern. As a result, the maximum number of conductors 12 can be arranged within the limited size of the seal member 11 while maintaining the distance between the closest portions of the conductors 12 to a predetermined value or more.

In this embodiment, a groove 16 is formed on the surface of the sealing member 11 at a position apart from the metallized layer 14 so as to separate the through holes 13 from each other. Preferably, neither the metallization layer 14 nor the brazing material portion 15 are present in the grooves 16 . In particular, it is preferable that neither the metallization layer 14 nor the brazing material portion 15 are present at least on the bottom portion 17 (see FIG. 2) of the groove 16 .

As shown in FIGS. 3 and 4, a metallized layer 14 is formed on the surface of the sealing member 11 so as to surround each through hole 13, and grooves 16 are formed in a mesh shape so as to surround each metallized layer 14. As shown in FIGS. In the example shown in FIGS. 3 and 4, each metallization layer 14 has a hexagonal shape, but it could also be circular. Also, in the examples shown in FIGS. 3 and 4, the metallization layer 14 extends to the edges of the grooves 16, but the outer edges of the metallization layer 14 need not extend to the edges of the grooves 16. may extend to just before the edge of the groove 16.

Since the grooves 16 are formed so as to partition the through holes 13 in this manner, a long creepage distance can be secured between the metallized layers 14 adjacent to each other. Thereby, air discharge along the surface of the seal member 11 can be avoided, and the insulation performance can be improved.

Furthermore, the groove 16 is filled with an insulating filler 21 of an electrical insulating material. An insulating cover (insulating coating) 22 made of an electrical insulating material is arranged so as to cover the sealing member 11 , the metallized layer 14 , the brazing material portion 15 and the insulating filler 21 as a whole. The insulating material applied to insulating filler 21 and insulating cover 22 preferably has particularly high temperature resistance, such as epoxy resin. Also, different insulating materials may be used for the insulating filler 21 and the insulating cover 22 . By arranging the insulating filler 21 and the insulating cover 22 on the portion of the metallized layer 14 exposed to the outside air in this way, air discharge can be avoided and the insulating performance can be improved.

In the above description, the insulating filler 21 and the insulating cover 22 are described separately, but they may be integrated and the insulating cover 22 may cover the metallized layer 14 and the brazing material portion 15 .

As described above, according to the first embodiment, by staggering the plurality of conductors 12, the maximum number of conductors 12 can be obtained while maintaining the distance of the closest portion between the conductors 12 at a predetermined value or more. can be arranged. Further, by forming grooves 16 on the surface of the sealing member 11 between the conductors 12, the creepage distance between the metallized layers 14 for joining the conductors 12 and the inorganic sealing member 11 is ensured. In addition, by filling the formed grooves 16 with an insulating material and forming a shape in which the insulating material covers the vicinity of the grooves 16 of the metallized layer 14, air discharge between the metallized layers 14 is prevented, and the electrical discharge between the conductors 12 is prevented. Insulation performance can be secured.

Here, a method for manufacturing the electrical wiring penetration device according to the first embodiment will be described. FIG. 5 is a flowchart showing a method of manufacturing an electrical wiring feed-through device according to the first embodiment of the present invention.

First, the seal member 11 is formed from an electrically insulating inorganic material (seal member forming step S11). A plurality of through holes 13 and grooves 16 are formed in the seal member 11 . The through holes 13 and the grooves 16 may be formed by cutting or the like, or may be integrally formed from the beginning by firing or the like.

Next, the metallized layer 14 is hermetically adhered to the surface of the sealing member 11 surrounding each through hole 13 except for the grooves 16 (metallized layer forming step S12). Next, a metal conductor 12 is inserted into each of the plurality of through holes 13 (conductor insertion step S13). Next, brazing is performed between the conductor 12 and the metallized layer 14 to form the brazing member 15 (brazing step S14). Next, the groove 16 is filled with the insulating filler 21 (groove filling step S15). Next, coating is performed so as to cover the entire metallized layer 14 and brazing material portion 15 with the insulating cover 22 (coating step S16).

As described above, the electrical wiring penetration device according to the first embodiment can be assembled.

[Second embodiment]
FIG. 6 is a cross-sectional view of an electrical wire feed-through device according to a second embodiment of the present invention, and is an enlarged cross-sectional view of a portion corresponding to the portion II in FIG.

The second embodiment is a modification of the first embodiment, and has a structure in which the grooves 16 of the first embodiment are replaced with partition walls 30. FIG. Although drawings corresponding to FIGS. 3 and 4 in the first embodiment are omitted, in this second embodiment, the portions shown as grooves 16 in FIGS.

That is, in the second embodiment, a partition wall 30 is formed on the surface of the seal member 11 at a position apart from the metallized layer 14 so as to separate the through holes 13 from each other. It is preferable that neither the metallized layer 14 nor the brazing material portion 15 exist on the surface of the partition wall 30 . In particular, it is preferable that neither the metallized layer 14 nor the brazing material portion 15 exist at least on the top portion 31 of the partition wall 30 .

3 and 4, in this second embodiment, the metallized layer 14 is formed so as to surround each through-hole 13 on the surface of the seal member 11, and the metallized layer 14 is formed so as to surround each metallized layer 14. A partition wall 30 is formed in a mesh shape. However, in this second embodiment, partition walls 30 are arranged instead of the grooves 16 shown in FIGS.

The outer edge of the metallized layer 14 may extend to the edge of the partition wall 30 or may extend just before the edge of the partition wall 30 .

In the second embodiment, since the partition walls 30 are formed so as to partition the through holes 13, a long creepage distance can be secured between the metallized layers 14 adjacent to each other. Thereby, air discharge along the surface of the seal member 11 can be avoided, and the insulation performance can be improved.

Furthermore, in the second embodiment, the area surrounded by the partition wall 30 is filled with an insulating filler 21 of an electrical insulating material. An insulating cover 22 made of an electrical insulating material is arranged so as to cover the sealing member 11 , the metallized layer 14 , the brazing material portion 15 and the insulating filler 21 as a whole. The functions and constituent materials of the insulating filler 21 and the insulating cover 22 made of an electrical insulating material in the second embodiment are the same as in the first embodiment.

As described above, according to the second embodiment, substantially the same as in the first embodiment, the maximum number of conductors 12 are arranged while maintaining the distance of the closest portion between the conductors 12 at a predetermined value or more. It is possible to secure the creepage distance between the metallized layers 14 for bonding each conductor 12 and the inorganic sealing member 11 . Also, air discharge between the metallized layers 14 can be prevented, and insulation performance between the conductors 12 can be ensured.

[Third embodiment]
FIG. 7 is a cross-sectional view of an electrical wire feed-through device according to a third embodiment of the present invention, and is an enlarged cross-sectional view of a portion corresponding to the portion II in FIG.

The third embodiment is a modification of the first embodiment. In the third embodiment, in the through hole 13 of the seal member 11, the portion closer to the brazing material portion 15 has a larger diameter than the other portions to form a hole large diameter portion 40, and the hole large diameter portion 40 is formed. A metallized layer 14 is formed on the inner surface of the portion 40 and the surface of the sealing member 11 around it.

The brazing material part 15 is formed so as to join the metallized layer 14 and the conductor 12 . An annular gap between the metallized layer 14 formed along the inner surface of the large-diameter hole 40 and the conductor 12 is filled with a brazing material to constitute a part of the brazing material part 15 .

According to the third embodiment, in addition to obtaining the same effect as the first embodiment, since the metallized layer 14 and the brazing material portion 15 are formed in the hole large diameter portion 40, the conductor 12 and the sealing member 11, the bonding area is increased, and the strength and pressure resistance performance can be improved.

[Fourth embodiment]
FIG. 8 is a cross-sectional view of an electrical wire feed-through device according to a fourth embodiment of the present invention, and is an enlarged cross-sectional view of a portion corresponding to the portion II in FIG.

The fourth embodiment is a modification of the third embodiment. In the third embodiment described above, as a modification of the first embodiment, the hole large diameter portion 40 is formed in the through hole 13 . In the fourth embodiment, the hole large-diameter portion 40 of the through hole 13 in the third embodiment is incorporated into the electrical wiring penetration device of the second embodiment.

That is, in the fourth embodiment, in the electrical wiring penetration device similar to the electrical wiring penetration device of the second embodiment, the portion of the through hole 13 of the seal member 11 near the brazing material portion 15 is the other portion. A hole large-diameter portion 40 is formed with a larger diameter than the hole, and a metallized layer 14 is formed on the inner surface of the hole large-diameter portion 40 and the surface of the sealing member 11 around it. The brazing material part 15 is formed so as to join the metallized layer 14 and the conductor 12 .

According to the fourth embodiment, effects similar to those of the third embodiment are obtained.

[Other embodiments]
Although several embodiments of the invention have been described above, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 11... Seal member 12... Conductor 13... Through hole 14... Metallized layer 15... Brazing material part 16... Groove 17... Bottom part 21... Insulating filler 22... Insulating cover 30... Partition wall 31... top part, 40... hole large diameter part

Claims (9)

a sealing member made of an electrically insulating inorganic material and having a plurality of through holes;
a metal conductor passing through the through-hole of the sealing member;
a metallized layer hermetically adhered to the surface of the sealing member surrounding each of the plurality of through-holes;
a brazing material portion that airtightly joins the metallized layer and the conductor;
An electrical wiring penetration device comprising:
The sealing member has a partition extending along the surface of the sealing member so as to partition the plurality of through holes,
The metallized layer is formed so as to surround each of the plurality of through-holes on the surface of the sealing member other than the partition portion,
An electrical wiring penetration device characterized by: The partition portion is a groove extending along the surface of the seal member, and at least a bottom portion of the surface of the groove is in contact with neither the metallized layer nor the brazing material portion;
The electrical wiring penetration device according to claim 1, characterized by: 3. The electrical wire feed-through device according to claim 2, wherein said groove is filled with an insulating filler made of an electrical insulating material. a sealing member made of an electrically insulating inorganic material and having a plurality of through holes;
a metal conductor passing through the through-hole of the sealing member;
a metallized layer hermetically attached to the surface of the sealing member surrounding each of the plurality of through holes;
a brazing material portion that airtightly joins the metallized layer and the conductor;
An electrical wiring penetration device comprising:
forming a partition extending along the surface of the sealing member so as to partition between the plurality of through-holes;
The metallized layer is formed so as to surround each of the plurality of through-holes on the surface of the sealing member other than the partition portion,
The partition portion is a partition wall extending along the surface of the sealing member, and at least a top portion of a surface of the partition wall is in contact with neither the metallized layer nor the brazing material portion;
An electrical wiring penetration device characterized by: The partition wall is arranged to surround the through hole, the metallized layer, and the brazing material portion,
5. The electrical wiring penetration device according to claim 4, wherein the area surrounded by the partition wall is filled with an insulating filler made of an electrical insulating material. 2. The electrical wiring penetration device according to claim 1, further comprising an insulating cover made of an electrical insulating material covering surfaces of said sealing member, said metallized layer and said brazing material portion. 2. The electrical wiring penetration device according to claim 1, wherein the plurality of through holes are arranged in a zigzag pattern. A portion of the metallized layer adheres to at least a portion of the inner surface of the through hole of the seal member, and a portion of the brazing material portion adheres to the inner surface of the through hole. 7. The electrical wiring penetration device according to claim 1, wherein the portion and the conductor are connected. A sealing member forming step of forming a plurality of through holes in a sealing member made of an electrically insulating inorganic material, and forming a partition portion along the surface of the sealing member so as to partition and extend between the plurality of through holes. and,
a metallized layer forming step of airtightly adhering a metallized layer so as to surround each of the plurality of through-holes on the surface of the sealing member other than the partition portion, after the sealing member forming step;
a conductor inserting step of inserting a metallic conductor into each of the plurality of through-holes after the metallized layer forming step;
a brazing step of air-tightly joining the conductor and the metallized layer with a brazing material portion after the conductor inserting step;
A method for manufacturing an electrical wiring penetration device, comprising:

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