JP7224277B2 - Engineering support equipment - Google Patents

Description

The present application relates to an engineering support device.

Large plants, such as thermal or nuclear power plants, are monitored and controlled by plant supervisory control systems that monitor data and conditions on the plant. When constructing a plant monitoring and control system, a specialized engineer designs plant hardware (hereinafter referred to as H/W) according to an engineering flow consisting of various engineering tasks. The amount of engineering work to be performed in the above engineering flow is large, and when this is performed manually by engineers, a large amount of man-hours and costs are incurred. Therefore, for example, like the engineering tool (so-called maintenance tool) of Patent Document 1, from the device list listing the monitoring and control targets for which the corresponding parts are defined, the operator station screen parts and controller logic parts, and these parts Some automatically generate the signals used.
Also, for example, like the engineering tool of Patent Document 2, a graphic component to which a signal is assigned in advance can be displayed on the screen by using a logic sheet that can assign the label of the control signal to the label column for each terminal of each graphic component. There is one that allows the builder to place it on the monitoring screen.

JP 2008-97424 A (description paragraph 0009-0023, FIG. 2) JP 2018-81343 (description paragraph 0011-0024, FIG. 2)

However, with the engineering tool of Patent Literature 1, an engineer had to create the device list. Further, in the engineering tool of Patent Document 2, an engineer had to create the logic sheet. Both the device list of Patent Document 1 and the logic sheet of Patent Document 2 have the problem that many man-hours are required to input information required for each engineering tool, such as information on each part or each graphic part.

The present application discloses a technique for solving the above problems, and aims to obtain an engineering support device that can reduce the amount of work of engineers in H / W design work than before. .

The engineering support device disclosed in the present application is an engineering support device that supports construction of a plant monitoring and control system that monitors and controls a plant to be monitored and controlled based on inputs from a plurality of distributed PIO modules connected to a control device. a hardware design support unit that generates data related to hardware design in building a plant monitoring and control system; a system configuration definition unit that generates system configuration definition data including system definition data for the monitoring and control system; A distributed PIO module coordinator that generates distributed PIO module adjustment data including operating parameters, and a control device that generates control device logic data including information on arithmetic processing performed by the control device to monitor and control a plant to be monitored and controlled. a logic drawing unit; and a monitoring screen drawing unit for generating monitoring screen data including information on drawing a monitoring screen for monitoring the plant. A first calculation unit that calculates the number of control panels that store the distributed PIO modules and the control devices based on the plant specifications of the plant to be monitored and controlled, and the calculation result of the first calculation unit and the predetermined A first layout editing unit that edits the layout of the distributed PIO modules in the control panel based on layout rules, and an interface for the distributed PIO modules that are laid out in the control device based on the editing result of the first layout editing unit. a second calculation unit that calculates the number of units; a second layout editor that edits the layout of components to be placed in the control device based on the calculation result of the second calculator; and a first layout editor A panel component addition unit that adds panel components to be arranged in the control panel according to the input from the engineer, the calculation result of the first calculation unit, and the editing result of the second layout editing unit to the editing result of the section. , and a hardware design data storage section for storing, as hardware design data, the result of editing by the first layout editing section to which the panel component is added by the panel component addition section.

According to the engineering support device disclosed in the present application, the workload of engineers in H/W design work can be reduced more than before.

1 is a system configuration diagram showing a plant monitoring control system according to Embodiment 1; FIG. 1 is a diagram showing a configuration of a maintenance tool terminal according to Embodiment 1 and an engineering flow according to Embodiment 1; FIG. 2 is a software configuration diagram showing a H/W design support unit according to Embodiment 1; FIG. 4 is a diagram showing an example of a screen image displayed by the H/W design support unit according to Embodiment 1; FIG. 4 is a diagram showing an example of a screen image displayed by the H/W design support unit according to Embodiment 1; FIG. 4 is a diagram showing an example of a screen image displayed by the H/W design support unit according to Embodiment 1; FIG. 2 illustrates an example hardware configuration of a maintenance tool terminal according to Embodiment 1; FIG. 4 is a flow chart showing the operation of the H/W design support unit according to Embodiment 1; FIG. FIG. 10 is a diagram showing the configuration of a maintenance tool terminal and an engineering flow according to the second embodiment; FIG. 9 is a software configuration diagram showing a H/W design support unit according to Embodiment 2; FIG. 11 is a flowchart showing the operation of a H/W design support unit according to Embodiment 2; FIG. 10 is a diagram showing the configuration of a maintenance tool terminal and an engineering flow according to the third embodiment; FIG. 11 is a software configuration diagram showing a H/W design support unit according to Embodiment 3; FIG. 12 is a flowchart showing the operation of a H/W design support unit according to Embodiment 3; FIG. 13 is a diagram showing the configuration of a maintenance tool terminal and an engineering flow according to the fourth embodiment; FIG. 12 is a software configuration diagram showing a H/W design support unit according to Embodiment 4; FIG. 12 is a flowchart showing the operation of a H/W design support unit according to Embodiment 4; FIG. 13 is a diagram showing the configuration of a maintenance tool terminal and an engineering flow according to the fifth embodiment; FIG. 13 is a software configuration diagram showing a H/W design support unit according to Embodiment 5; FIG. 21 is a flowchart showing the operation of a H/W design support unit according to Embodiment 5; FIG. 14 is a diagram showing the configuration of a maintenance tool terminal and an engineering flow according to the sixth embodiment; FIG. 12 is a software configuration diagram showing a H/W design support unit according to Embodiment 6; FIG. 22 is a flowchart showing the operation of a H/W design support unit according to Embodiment 6;

Embodiment 1.
Embodiment 1 will be described below with reference to FIGS. 1 to 6. FIG. FIG. 1 is a system configuration diagram showing a plant monitoring and control system according to Embodiment 1. FIG. The plant monitoring and control system 1000 includes a control device 1 that performs various calculations for monitoring and controlling a plant (not shown) to be monitored and controlled, and various operations such as H/W design for constructing the plant monitoring and control system 1000. A maintenance tool terminal 21 for the engineer 8 to perform maintenance, that is, an engineering support device, a monitoring terminal 3 for the operator 9 to monitor the state of the plant, and a distributed PIO (Processor Input/Output) module for acquiring data on the plant 5 and plant accessories 6 for plant operation. The control device 1, the maintenance tool terminal 21, the monitoring terminal 3, and the distributed PIO module 5 are connected to each other via the network 4, and exchange data and control commands with each other. Plant auxiliaries 6 are connected to distributed PIO modules 5 via network 4 .

The maintenance tool terminal 21 holds system configuration definition data 111 , distributed PIO module adjustment data 112 , controller logic data 113 and monitoring screen data 114 . These data are generated by the engineer 8 according to a predetermined engineering flow. The maintenance tool terminal 21 supports the engineering work by the engineer 8 in generating the above various data. Details of each data will be described later.

The distributed PIO module 5 acquires data on the plant (measured values such as pressure, temperature, flow rate, start/stop status of fans or pumps, open/close status of on/off valves, etc.) as digital or analog signals. , to the control device 1 . A plurality of distributed PIO modules 5 are provided for one plant, and some of them are collectively stored in the control panel 7 together with the control device 1 . A plurality of control panels 7 and control devices 1 are also provided in one plant. As will be described later, the number of control panels 7 and the specifications of the configuration within the control panel depend on the layout conditions of the control panel 7, the maximum number of distributed PIO modules 5 and control devices 1 that can be stored in the control panel, the current consumption capacity in the control panel, and the like. determined based on

The controller 1 holds system configuration definition data 111 , distributed PIO module adjustment data 112 and controller logic data 113 . These data are transferred from the maintenance tool terminal 21 to the control device 1 in advance. The control device 1 acquires data from the signal transmitted by the distributed PIO module 5 according to the system configuration definition data 111 and distributed PIO module adjustment data 112 . Further, the control device 1 performs various kinds of arithmetic processing using the acquired data according to the control device logic data 113, and generates a control command for the plant. The control device 1 transmits a control command to the plant auxiliaries 6 via the distributed PIO module 5 . The plant auxiliary machine 6 operates the plant according to the control command received from the control device 1 .

The monitoring terminal 3 holds system configuration definition data 111 and monitoring screen data 114 . These data are transferred from the maintenance tool terminal 21 to the monitoring terminal 3 in advance. The monitoring terminal 3 has a display unit (not shown) that displays a monitoring screen using the monitoring screen data 114, and the operator 9 monitors the plant via this monitoring screen.

Next, the configuration of the maintenance tool terminal 21 and the engineering flow according to the first embodiment will be explained using FIG. In the engineering flow shown in FIG. 2, manual work is indicated by thick arrows, and engineering support according to the first embodiment is indicated by thin arrows. The maintenance tool terminal 21 includes a H/W design support unit 1201 that generates H/W design data 110 using master information data 100 and plant specifications 101, a system configuration definition unit 121 that generates system configuration definition data 111, It comprises a distributed PIO module adjustment unit 122 that generates distributed PIO module adjustment data 112, a control device logic drawing unit 123 that generates control device logic data 113, and a monitoring screen drawing unit 124 that generates monitoring screen data 114. . The system configuration definition data 111 generated by the system configuration definition section 121 is sent to the distributed PIO module adjustment section 122 , control device logic drawing section 123 , and monitoring screen drawing section 124 . The distributed PIO module adjustment unit 122, the control device logic drawing unit 123, and the monitoring screen drawing unit 124 use the system configuration definition data 111 as necessary in their data generation.

The master information data 100 includes data such as placement rules that define the rack-up placement of the distributed PIO modules 5 and the number of stations and current values of each distributed PIO module 5 . The master information data 100 may also include the types of components of the control device 1 and the control panel 7 . The plant spec 101 is the spec of the plant to be monitored and controlled, such as the number of input/output signals and various design conditions. The H/W design specification 102 describes the number of control panels 7 in the plant to be monitored and controlled, specifications of the configuration inside the panel, and the like. Incidentally, in the first embodiment, the engineer 8 manually creates the H/W design specification 102 .

The H/W design data 110 includes the number of required distributed PIO modules 5, the number of control panels 7 storing them, the types of components arranged in the control device 1 and the control panel 7, and the arrangement of each component. , etc., includes data related to H/W design work in constructing the plant monitoring and control system 1000 .

The system configuration definition data 111 is system definition data of the plant monitoring and control system 1000 . More specifically, the number of control devices 1, maintenance tool terminals 21, and monitoring terminals 3 connected by the network 4 in the plant monitoring and control system 1000, the network configuration of the network 4, the IP addresses of the respective terminals, etc. The system configuration definition data 111 includes property information, property settings of components such as an interface unit (not shown) of the distributed PIO module 5 arranged in the control device 1, and the like. The system configuration definition data 111 also includes information about what types of modules are arranged in what order with respect to the interface units of the distributed PIO modules 5 .

The distributed PIO module adjustment data 112 includes data such as operating parameters of each distributed PIO module 5 and H/W-dependent threshold values such as AI/AO (Analog Input/Analog Output).

The control device logic data 113 includes information on arithmetic processing performed by the control device 1 in the plant monitoring and control system 1000 for monitoring control, and information on RAS (Reliability, Availability and Serviceability) processing of components in the control device 1. including. The control device logic such as these processes is written in a programming language defined by the international standard IEC61131-3 such as structured text (ST language) and function block diagram (FBD language), or POL (Problem Oriented Language).

The monitoring screen data 114 includes data necessary for drawing a monitoring screen in the monitoring terminal 3 , such as graphical data for displaying the system diagram of the plant to be monitored and controlled and graphical data for displaying the parameters of each control device 1 .

The engineer 8 who is the user of the maintenance tool terminal operates the maintenance tool terminal 21 to cause each functional section such as the H/W design support section 1201 to generate the above data. That is, the following operations are performed in order.
1. The H/W design support unit 1201 generates the H/W design data 110 . Also, the H/W design specification 102 is created using the information output by the H/W design support unit 1201 .
2. Generate the system configuration definition data 111 by the system configuration definition unit 121 . Also, the generated system configuration definition data 111 is transferred to the control device 1 and the monitoring terminal 3 .
3. Distributed PIO module adjustment data 112 is generated by the distributed PIO module adjustment unit 122 . Also, the generated distributed PIO module adjustment data 112 is transferred to the control device 1 .
4. Generate the control device logic data 113 by the control device logic drawing unit 123 . Also, the control device logic data 113 generated is transferred to the control device 1 .
5. Generate the monitoring screen data 114 by the monitoring screen drawing unit 124 . Also, the generated monitor screen data 114 is transferred to the monitor terminal 3 .
Data generated in the post-process is generated using the system configuration definition data 111 .
Also, after the engineer 8 completes the above-described works 1 to 5, the tester 10 prepares the H/W design test procedure 103 based on the H/W design specification 102 . The tester 10 conducts the test according to the created H/W design test procedure 103 and summarizes the test results in the H/W design test report 104 .

FIG. 3 is a software configuration diagram showing the H/W design support unit according to the first embodiment, and FIGS. 4A, 4B, and 4C are respectively displayed by the H/W design support unit according to the first embodiment. FIG. 10 is a diagram showing an example of a screen image displayed; The H/W design support unit 1201 supports the H/W design work of the engineer 8. The main screen unit 210 performs the processing on the main screen 901 shown in FIG. 4A, and the distributed PIO module placement calculation shown in FIG. 4B. It is provided with a distributed PIO module placement calculation screen section 220 that performs processing on the screen 902 and a control device component placement calculation screen section 230 that performs processing on the control device component placement calculation screen 903 shown in FIG. 4C.

The main screen portion 210 includes an input/output signal count input portion 211 , a control panel quantity calculation portion 212 , and a H/W design data storage portion 213 . Note that the control panel number calculator 212 corresponds to a first calculator. The input/output signal point number input unit 211 receives input of the plant specifications 101 such as the number of input/output signal points for each IO type ("input point number" in FIG. 4A) by the engineer 8, and calculates the number of input/output signal points as the number of control panels. Send to calculation unit 212 . Also, if the engineer 8 has input "reserve rate", "number of spares", and "multiplexing", the input/output signal point number input unit 211 also receives these inputs and sends them to the control panel number calculation unit 212, respectively. For "multiplexing", a number (for example, 1 to 3 times) indicating how many times to multiplex is input.

Input/output signals to which the score is input on the main screen 901 include, for example, the following.
・DI/DO (Digital Input/Digital Output) [SOE (Sequence Of Event) compatible, etc.]
・Pulse input/pulse output ・AI/AO [with current/voltage/loop power supply, etc.]
・RTD (Resistance Temperature Detector) input [corresponding to disconnection detection, etc.]
・Thermocouple input [temperature/voltage/disconnection detection, etc.]
・Rotation speed input [Minimum sensitivity/EOST (Electric Over Speed Trip) detection support, etc.]

Based on the number of input/output signals received from the number of input/output signal points input unit 211, the reserve margin, the number of spares, and multiplexing, the control panel number calculation unit 212 calculates the number of installed distributed PIO modules 5 and the number of distributed PIO modules 5 for each IO type. 5 is calculated. In calculating the number of installed distributed PIO modules 5, the spare rate input by the engineer 8 is integrated, and the number of spare modules input by the engineer 8 is also taken into consideration. That is, the formula for calculating the number of mounted distributed PIO modules 5 is, for example, the following formula (1).

Mounted number = number of input signal points x (1 + spare rate/100) x multiplexing + number of spares (1)

The number of mounted control panels 7 is calculated from the number of mounted distributed PIO modules 5 and the type of each distributed PIO module 5 ("IO type" in FIG. 4A). The number of installed distributed PIO modules 5 and the number of installed control panels 7 calculated by the control panel number calculator 212 can be corrected later by the engineer 8 . Note that only the "input points" is required to be entered on the main screen 901, and other inputs such as the "reserve rate" are optional. If no input is made in the optional input item, a predetermined default value is used for calculation in equation (1). As default values, for example, "reserve ratio"=0, "multiplexing"=1, and "reserve number"=0.

The control panel number calculation unit 212 sends the calculation result of the number of distributed PIO modules 5 and the number of control panels 7 to be mounted to the H/W design data storage unit 213 and the distributed PIO module rackup layout editing unit 221 .

The H/W design data storage unit 213 stores data on the number of installed distributed PIO modules 5 and the number of installed control panels 7 received from the control panel number calculation unit 212, as well as a panel component addition unit 223 and components in the control device, which will be described later. The data received from the rackup arrangement editing unit 231 is saved as the H/W design data 110. FIG.

The distributed PIO module placement calculation screen unit 220 includes a distributed PIO module rackup placement editing unit 221 , a number of stations/current consumption calculation unit 222 , and a panel component addition unit 223 . The distributed PIO module rackup layout editor 221 corresponds to the first layout editor, and the number of stations/current consumption calculator 222 corresponds to the second calculator. After the number of control panels 7 is determined on the main screen 901, the distributed PIO module rackup layout editing unit 221 calculates the number of distributed PIO modules 5 to be installed and the number of control panels 7 and the number of installed distributed PIO modules 5 received from the control panel number calculation unit 212. Based on this, the rack-up arrangement of the distributed PIO modules 5 in each control panel 7 is edited. Here, specific rack-up placement is performed according to a placement rule predetermined in the master information data 100. FIG. 4B, the distributed PIO module rackup layout editing unit 221 stores the number of each distributed PIO module 5 mounted ("mounted number" in FIG. 4B) and the number of distributed PIO modules 5 disposed on the control panel 7. The sum of the numbers (“allocation” in FIG. 4B) may be compared to determine whether all distributed PIO modules 5 to be deployed have been deployed. Even after the distributed PIO module rackup layout editor 221 has edited the layout, the engineer 8 can manually make corrections. The rack-up arrangement of the distributed PIO modules 5 is finally confirmed by the engineer 8, and the distributed PIO modules 5 to be arranged are changed or added as necessary and determined as an editing result. The distributed PIO module rackup arrangement editing unit 221 sends the editing result to the number of stations/current consumption calculating unit 222 and the panel component adding unit 223 .

The number of stations/current consumption calculator 222 calculates the number of stations and current consumption of each distributed PIO module 5 according to the number of stations and current value of each distributed PIO module 5 defined in the master information data 100 . In addition, the number of stations/current consumption calculation unit 222 calculates the number of stations and current consumption of each control device 1 according to the editing result of the rackup arrangement received from the distributed PIO module rackup arrangement editing unit 221 and the number of stations and current consumption of each distributed PIO module 5. , and calculates the number of interface units of distributed PIO modules 5 that need to be arranged in each control device 1 . The number of stations/current consumption calculator 222 also calculates the number of distributed PIO modules 5 and DI/DO power supplies. The number of stations/current consumption calculation unit 222 calculates the number of interface units of the distributed PIO modules 5 that need to be arranged in each control device 1, etc. send to The number of interface units of the distributed PIO module 5 calculated by the number of stations/current consumption calculator 222 can be corrected later by the engineer 8 .

The panel component addition unit 223 adds panel components to the control panel 7 on which the distributed PIO module 5 is arranged, according to the engineer 8's input, as a result of rackup arrangement editing by the distributed PIO module rackup arrangement editing unit 221 . Add The panel component addition unit 223 receives the input of the panel components to be arranged on the control panel 7 from the engineer 8, and edits the rackup arrangement of the components of the control panel received from the distributed PIO module rackup arrangement editing unit 221. Add to results. Such board components include, for example, a power supply module. The board component adding unit 223 adds the board component as described above, updates the editing result of the distributed PIO module rackup layout editing unit 221 , and sends it to the H/W design data storage unit 213 . Note that the panel components arranged on the control panel 7 are, for example, as follows.
・Power supply chassis and power supply module in chassis ・Terminal block for external cable ・Auxiliary relay ・Section switch ・Media converter ・Network hub

The intra-controller component layout calculation screen section 230 includes an intra-controller component rackup layout editing section 231 . Note that the controller component rackup layout editor 231 corresponds to a second layout editor. The control device components rackup layout editing unit 231 uses the calculation result of the number of stations/current consumption calculation unit 222, that is, the number of interface units of the distributed PIO module 5 that must be configured in each control device 1. Based on this, the rackup arrangement of components in each control device 1 is edited. In addition, the controller component rack-up layout editor 231 also arranges other components in each controller 1 in accordance with the input from the engineer 8, thereby arranging the rack-up layout of the components in the controller 1. Determined as the result of editing. The controller internal component rackup layout editing unit 231 sends the editing result of the rackup layout of components within the controller 1 to the H/W design data storage unit 213 . Components arranged in the control device 1 are, for example, as follows.
・CPU (Central Processing Unit) unit ・Interface unit for distributed PIO module 5 ・Ethernet (registered trademark) communication interface unit ・Other general-purpose and unique communication interface units ・Power supply unit ・Extension base unit

Next, a hardware configuration that implements each functional unit of the maintenance tool terminal 21 will be described. 5 is a diagram illustrating an example of a hardware configuration of a maintenance tool terminal according to Embodiment 1. FIG. The maintenance tool terminal 21 is mainly composed of a processor 91, a memory 92 as a main storage device, and an auxiliary storage device 93. FIG. The processor 91 includes, for example, a CPU, an ASIC (Application Specific Integrated Circuit), a DSP (Digital Signal Processor), and an FPGA (Field Programmable Gate Array). The memory 92 is composed of a volatile storage device such as a random access memory, and the auxiliary storage device 93 is composed of a non-volatile storage device such as a flash memory or a hard disk. A predetermined program to be executed by the processor 91 is stored in the auxiliary storage device 93, and the processor 91 appropriately reads and executes this program to perform various arithmetic processing. At this time, the predetermined program is temporarily stored in the memory 92 from the auxiliary storage device 93 , and the processor 91 reads the program from the memory 92 . Arithmetic processing by each functional unit shown in FIG. 2 is realized by the processor 91 executing a predetermined program as described above. The results of arithmetic processing by the processor 91 are temporarily stored in the memory 92 and then stored in the auxiliary storage device 93 depending on the purpose of the executed arithmetic processing.

The communication interface 94 transmits and receives various data to and from the control device 1 and the monitoring terminal 3 via the network 4 . The input/output interface 95 is connected to an input device (not shown) such as a keyboard, mouse, or touch panel, receives input from the engineer 8, and is connected to a display device such as a liquid crystal display (not shown) and a printer (not shown). , or an external storage device (not shown) to output data. Although not shown, the hardware configurations of the control device 1 and the monitoring terminal 3 are the same.

Next, the operation of H/W design support section 1201 will be described with reference to FIG. First, the H/W design support unit 1201 displays the main screen 901 and makes the engineer 8 input the number of input/output signals (the number of input/output signals, reserve ratio, spare number, multiplexing) on the main screen 901 . Input/output signal point number input section 211 receives inputs such as the input/output signal point number from engineer 8 (step ST1010). The input/output signal point number input unit 211 sends the input/output signal point number and the like input to the engineer 8 to the control panel number calculation unit 212 .

Next, based on the number of input/output signals received from the input/output signal number input unit 211, the control panel number calculation unit 212 stores the number of distributed PIO modules 5 mounted and the number of distributed PIO modules 5 for each IO type. , the number of control panels 7 to be mounted is calculated (step ST1020). The control panel number calculator 212 sends the calculation result of the number of distributed PIO modules 5 and control panels 7 to the H/W design data storage section 213 and the distributed PIO module rackup arrangement editor 221 . Hereinafter, step ST1030 to step ST1060, which will be described later, are performed for all control panels 7. FIG.

After the required number of control panels 7 is calculated in step ST1020, the rackup arrangement of the distributed PIO modules 5 in the control panel 7 is edited and determined on the distributed PIO module arrangement calculation screen 902 (step ST1030). First, the distributed PIO module rackup layout editor 221 edits the rackup layout of the distributed PIO modules 5 in the control panel 7, and the engineer 8 corrects this editing result as necessary. The engineer 8 manually corrects the editing results through screen operations. The rackup layout of the distributed PIO modules 5 is determined through layout editing by the distributed PIO module rackup layout editor 221 and correction by the engineer 8 . The distributed PIO module rackup layout editing unit 221 sends the rackup layout of the distributed PIO modules 5 as the editing result to the number of stations/current consumption calculation unit 222 and the panel component addition unit 223 .

Next, based on the rack-up arrangement of the distributed PIO modules 5 determined in step ST1030, the number of stations and current of the distributed PIO modules 5 are calculated, and the components to be arranged in the control device 1 are determined (step ST1040). First, the number of stations/current consumption calculator 222 calculates the number of stations and current consumption of the distributed PIO module 5 . Based on the results of these calculations, automatic allocation of channels in each control device 1 and calculation of the number of interface units of distributed PIO modules 5 that need to be arranged in each control device 1 are performed. These calculations are performed according to the number of stations and current value of each distributed PIO module 5 defined in the master information data 100 . The engineer 8 corrects the calculation result of the number of stations/current consumption calculator 222 as necessary. The types of components to be arranged in the control device 1 are determined through each calculation by the number of stations/current consumption calculator 222 and correction by the engineer 8 . The number of stations/current consumption calculation unit 222 stores the calculation result of the number of interface units of the distributed PIO module 5 arranged in the control device 1 and the information of other components that need to be arranged in the control device 1 in the control device. It is sent to the component rackup layout editor 231 .

Next, the rack-up arrangement of components to be arranged in the control device 1 is determined on the control device component arrangement calculation screen 903 (step ST1050). First, based on the number of interface units of the distributed PIO module 5 determined in step ST1040, the component rack-up layout editor 231 in the controller 1 edits the rack-up layout of components in each controller 1. . In addition, the controller internal component rackup arrangement editing unit 231 adds components to be arranged in the control device 1 according to the input from the engineer 8 and determines the rackup arrangement within the control device 1 . The controller component rackup layout editing unit 231 sends the rackup layout of the components in the controller 1 as the editing result to the H/W design data storage unit 213 .

Next, return to the distributed PIO module placement calculation screen 902 again, and determine the components to be placed on the control panel 7 (step ST1060). Since the placement of the distributed PIO modules 5 on the control panel 7 has been determined in step ST1030, components other than the distributed PIO modules 5, such as power supply modules, are determined in step ST1060. The board component addition unit 223 receives input of board components to be arranged on the control panel 7 from the engineer 8 and adds the input board components to the editing result of the distributed PIO module rackup layout editing unit 221 . The board component addition unit 223 sends the editing result of the distributed PIO module rackup layout editing unit 221 to which the board components are added to the H/W design data storage unit 213 .

After step ST1060 is completed, H/W design support section 1201 determines whether steps ST1030 to ST1060 have been performed for all control panels 7 (step ST1070). If steps ST1030 to ST1060 have been performed for all control panels 7, the process proceeds to step ST1080. If there is a control panel 7 for which steps ST1030 to ST1060 have not been performed, the process returns to step ST1030 and the processes up to step ST1070 are performed.

Finally, the H/W design data storage unit 213 stores the H/W design data 110 . The H/W design data storage unit 213 stores the calculation results of the control panel quantity calculation unit 212, the layout editing results of the controller component rackup layout editing unit 231, and the panel components added by the panel component addition unit 223. The distributed PIO module rackup layout editor 221 puts together the data of the layout editing result (corrected data if the engineer 8 has corrected it) and saves it as the H/W design data 110 (step ST1080). The generated H/W design data 110 includes, for all the control panels 7, the types of components (including the distributed PIO modules 5) arranged on the control panels 7 and their arrangement status, and the Information about the types of components (including the interface units of the distributed PIO modules 5) placed in the control device 1 and the status of their placement will be included.

According to Embodiment 1, it is possible to reduce the workload of engineers in H/W design work compared to the conventional art. More specifically, a control panel number calculator that calculates the number of distributed PIO modules and the number of control panels that store the distributed PIO modules and control devices based on the plant specifications, and the calculation result of the control panel number calculator and a distributed PIO module rackup layout editing unit that edits the rackup layout of the distributed PIO modules in the control panel based on predetermined layout rules; Number of stations/current consumption calculator for calculating the number of interface units of distributed PIO modules placed in the controller, and rack-up arrangement of components in the controller based on the calculation results of the number of stations/current consumption calculator In response to the editing results of the rackup layout editor for the components in the control device and the distributed PIO module rackup layout editor, the panel components to be placed in the control panel are added according to the input from the engineer. The addition unit, the calculation result of the control panel number calculation unit, the editing result of the component rackup layout editing unit in the control device, and the distribution PIO module rackup layout editing unit to which the panel components have been added by the panel component addition unit. A hardware design support unit having a hardware design data storage unit that stores an edited result as hardware design data is provided. This allows engineers to obtain the required number of distributed PIO modules and the required number of control panels by inputting the plant specifications. Also, the hardware design support section edits the rack-up arrangement of the components of the control panel and the components of the control device, and the engineer only needs to make necessary additions and corrections. Therefore, the work load of engineers can be reduced more than before. In addition, since the possibility of human error due to manual work can be reduced, it is possible to suppress delays in work due to the occurrence of errors and an increase in man-hours due to checking work to prevent errors.

Embodiment 2.
Embodiment 2 will be described below with reference to FIGS. 7 to 9. FIG. 1 to 6 are denoted by the same reference numerals, and description thereof will be omitted. In the first embodiment, information such as the rackup arrangement of the distributed PIO modules 5 in the control panel 1, the components in the control device 1 and their rackup arrangement, the components in the control panel 7 and their rackup arrangement, etc. /W design data 110 is generated and stored in the H/W design support unit 1201 . In the H/W design work, the H/W design specification 102 describing the information contained in the H/W design data 110 is created as described above. However, in Embodiment 1, the H/W design specifications 102 had to be compiled manually by the engineer 8 himself. Embodiment 2 differs from Embodiment 1 in that a template of H/W design specification 102 is created from H/W design data 110 . The reason why the H/W design specification 102 is referred to as a "template" is that the final H/W design specification 102 is completed after the engineer 8 makes additions and corrections.

FIG. 7 is a diagram showing the configuration of a maintenance tool terminal according to Embodiment 2 and an engineering flow according to Embodiment 2, and FIG. 8 is a software configuration diagram showing a H/W design support unit according to Embodiment 2. is. As shown in FIG. 7, H/W design specifications 102 are created using H/W design data 110 in the maintenance tool terminal 22 . The H/W design specification 102 may be in a format readable by the engineer 8 (document data, paper medium, etc.). The H/W design support unit 1202 includes a H/W design specification creation unit 214 as shown in FIG. The H/W design specification creating unit 214 reads the H/W design data 110 and converts it into document format data that the engineer 8 can read. The H/W design specification creating unit 214 outputs the converted H/W design data 110 as the H/W design specification template 102a. The engineer 8 completes the H/W design specification 102 by adding necessary additions, corrections, etc. to the H/W design specification template 102a. If there are a plurality of H/W design data 110, the engineer 8 selects the H/W design data 110 to be used for creating the H/W design specification template 102a on the main screen 901, and creates the H/W design specification. The unit 214 uses the selected H/W design data 110 to create and output the H/W design specification template 102a.

The H/W design specification creating unit 214 converts the information included in the H/W design data 110 into expressions that can be used as they are in the H/W design specification template 102a, such as data in diagram format or tabular format. information is embedded in the H/W design specification template 102a as it is. For example, information not included in the H/W design data 110, such as supplementary comments on arrangements, is left blank in the H/W design specification template 102a to be created so that the engineer 8 can input it later.
Other configurations are the same as those of the first embodiment.

Next, the operation of H/W design support section 1202 will be described with reference to FIG. First, the processing from step ST1010 to step ST1080 described in Embodiment 1 is performed (step ST2010). That is, the operation up to generation of H/W design data 110 is the same as that of the first embodiment.

Next, the engineer 8 selects the H/W design data 110 used for creating the H/W design specification template 102a, and the H/W design specification creating unit 214 creates the H/W design data selected by the engineer 8. 110 is read (step ST2020).

Next, a template of H/W design specifications is created and output (step ST2030). H/W design specification creation unit 214 creates and outputs H/W design specification template 102a by converting H/W design data 110 read in step ST2020 into a document format. The engineer 8 completes the H/W design specification 102 by making necessary additions, corrections, etc. to the output H/W design specification template 102a.

According to the second embodiment, effects similar to those of the first embodiment can be obtained. It also has a H/W design specification creation unit that creates a model of H/W design specification from H/W design data and outputs it. As a result, the engineer can create the H/W design specification using the template, which simplifies the work of creating the H/W design specification. Therefore, the workload of engineers in H/W design work can be further reduced.

Embodiment 3.
Embodiment 3 will be described below with reference to FIGS. 10 to 12. FIG. 1 to 9 are denoted by the same reference numerals, and description thereof will be omitted. In Embodiments 1 and 2, in generating the system configuration definition data 111 in the system configuration definition unit 121 and in generating the distributed PIO module adjustment data 112 in the distributed PIO module adjustment unit 122, the engineer 8 prepares the H/W design specifications 102. I entered the necessary data while referring to it. Embodiment 3 reduces the work of the engineer 8 in generating the system configuration definition data 111 and the distributed PIO module adjustment data 112. FIG.

FIG. 10 is a diagram showing the configuration of a maintenance tool terminal according to Embodiment 3 and an engineering flow according to Embodiment 3, and FIG. 11 is a software configuration diagram showing a H/W design support unit according to Embodiment 3. is. As shown in FIG. 10, in the maintenance tool terminal 23, the H/W design data 110 are sent to the system configuration definition section 121 and the distributed PIO module adjustment section 122, respectively. The H/W design support unit 1203 has an export unit 215 as shown in FIG. The export unit 215 reads the H/W design data 110 and exports the read H/W design data 110 to the system configuration definition unit 121 . At this time, data necessary for generating the system configuration definition data 111 may be extracted from the H/W design data 110 and only the extracted data may be exported to the system configuration definition section 121 . The export unit 215 also exports the read H/W design data 110 to the distributed PIO module adjustment unit 122 . At this time, data necessary for generating the distributed PIO module adjustment data 112 may be extracted from the H/W design data 110 and only the extracted data may be exported to the distributed PIO module adjustment section 122 .

The system configuration definition unit 121 embeds the data exported to itself from the export unit 215 into the system configuration definition data 111 to complete part of the system configuration definition data 111 . The system configuration definition unit 121 blanks the information necessary for the system configuration definition data 111 that is not included in the H/W design data 110, such as a supplementary comment on the device, and allows the engineer 8 to freely change the information. Allow input.

The distributed PIO module adjustment unit 122 embeds the data exported to itself from the export unit 215 into the distributed PIO module adjustment data 112 to complete part of the distributed PIO module adjustment data 112 . The distributed PIO module adjustment unit 122 adjusts the information necessary for the distributed PIO module adjustment data 112 that is not included in the H/W design data 110, such as the adjusted threshold value of the distributed PIO module 5. It is left blank so that the engineer 8 can freely enter it.
Other configurations are the same as those of the second embodiment.

Next, the operation of H/W design support section 1203 will be described with reference to FIG. First, the processing from step ST1010 to step ST1080 described in Embodiment 1 is performed (step ST3010). That is, the operation up to generation of H/W design data 110 is the same as that of the first embodiment. In addition to this, the processing of steps ST2020 and ST2030 of FIG. 9 (Embodiment 2) may be performed.

Next, the engineer 8 selects the H/W design data 110 to be exported to the system configuration definition unit 121 and the distributed PIO module adjustment unit 122, and the export unit 215 reads the H/W design data 110 selected by the engineer 8. (Step ST3020).

Next, export section 215 exports H/W design data 110 read in step ST3020 to system configuration definition section 121 (step ST3030). As described above, the system configuration definition unit 121 embeds the data exported to itself from the export unit 215 into the system configuration definition data 111 to complete part of the system configuration definition data 111 .

Export section 215 also exports H/W design data 110 read in step ST3020 to distributed PIO module adjustment section 122 (step ST3040). As described above, the distributed PIO module adjustment unit 122 embeds the data exported to itself from the export unit 215 into the distributed PIO module adjustment data 112 to complete part of the distributed PIO module adjustment data 112 .
Note that the order in which steps ST3030 and ST3040 are performed after step ST3020 is not particularly limited.

After that, the engineer 8 inputs necessary data to the incomplete parts of the system configuration definition data 111 and the distributed PIO module adjustment data 112 to complete the system configuration definition data 111 and the distributed PIO module adjustment data 112 .

According to the third embodiment, effects similar to those of the second embodiment can be obtained. It also has an exporter that exports the H/W design data to the system configuration definition section and the distributed PIO module coordination section. As a result, of the system configuration definition data and the distributed PIO module adjustment data, information that can be obtained from the H/W design data is automatically input. Therefore, the engineer can complete the system configuration definition data and the distributed PIO module adjustment data by inputting only information that cannot be acquired from the H/W design data. This simplifies the work of creating system configuration definition data and distributed PIO module adjustment data, so that the workload of engineers in H/W design work can be further reduced.

Embodiment 4.
Embodiment 4 will be described below with reference to FIGS. 13 to 15. FIG. 1 to 12 are denoted by the same reference numerals, and description thereof will be omitted. In the first to third embodiments, the engineer 8 refers to the H/W design specifications 102 in generating the control device logic data 113 in the control device logic drawing unit 123 and in generating the monitoring screen data 114 in the monitoring screen drawing unit 124. I entered the required data. Also, in generating the control device logic data 113, the engineer 8 had to describe the processing related to the control device 1 and its components by programming in ST language, FBD language, or the like. In the monitoring screen data 114, in order to graphically display the system diagram of the plant to be monitored and the parameters of the control device 1 on the monitoring terminal 3, the monitoring screen drawing unit 124 needs work such as arranging standard graphic parts. Met. Embodiment 4 reduces the work of the engineer 8 in generating the control device logic data 113 and the monitor screen data 114 .

FIG. 13 is a diagram showing the configuration of a maintenance tool terminal in Embodiment 4 and an engineering flow according to Embodiment 4, and FIG. 14 is a software configuration diagram showing a H/W design support unit according to Embodiment 4. is. As shown in FIG. 13, in the maintenance tool terminal 24, the H/W design data 110 is sent to the controller logic drawing section 123 and the monitoring screen drawing section 124, respectively. The H/W design support section 1204 has a second export section 216 as shown in FIG. The second export section 216 reads the H/W design data 110 and exports the read H/W design data 110 to the controller logic drawing section 123 . At this time, data necessary for generating the control device logic data 113 may be extracted from the H/W design data 110 and only the extracted data may be exported to the control device logic drawing section 123 . The second export unit 216 also exports the read H/W design data 110 to the monitoring screen drawing unit 124 . At this time, data necessary for generating the monitoring screen data 114 may be extracted from the H/W design data 110 and only the extracted data may be exported to the monitoring screen drawing section 124 .

The control device logic drawing unit 123 embeds the data exported to itself from the second export unit 216 into the control device logic data 113 to complete part of the control device logic data 113 . The control device logic drawing unit 123 draws information necessary for the control device logic data 113 that is not included in the H/W design data 110, such as non-standard monitoring control logic specific to the control device 1. It is left blank so that the engineer 8 can freely enter it.

The monitor screen drawing unit 124 embeds the data exported to itself from the second export unit 216 into the monitor screen data 114 to complete part of the monitor screen data 114 . The monitoring screen drawing unit 124 blanks the information that is not included in the H/W design data 110 among the information necessary for the monitoring screen data 114, such as a picture of the system diagram screen, so that the engineer 8 can freely Allow input.
Other configurations are the same as those of the third embodiment.

Next, the operation of the H/W design support section 1204 will be explained with reference to FIG. First, the processing from step ST1010 to step ST1080 described in Embodiment 1 is performed (step ST4010). That is, the operation up to generation of H/W design data 110 is the same as that of the first embodiment. In addition to this, the processing of steps ST2020 and ST2030 of FIG. 9 (Embodiment 2) and the processing of steps ST3020 to ST3040 of FIG. 12 (Embodiment 3) may be performed.

Next, the engineer 8 selects the H/W design data 110 to be exported to the control device logic drawing unit 123 and the monitoring screen drawing unit 124, and the second export unit 216 exports the H/W design data selected by the engineer 8. 110 is read (step ST4020).

Next, the second export section 216 exports the H/W design data 110 read in step ST4020 to the controller logic drawing section 123 (step ST4030). As described above, the control device logic drawing unit 123 embeds the data exported to itself from the second export unit 216 into the control device logic data 113 to complete part of the control device logic data 113 .

Second export section 216 also exports H/W design data 110 read in step ST4020 to monitoring screen drawing section 124 (step ST4040). As described above, the monitoring screen drawing unit 124 embeds the data exported to itself from the second exporting unit 216 into the monitoring screen data 114 to complete part of the monitoring screen data 114 .
Note that the order in which steps ST4030 and ST4040 are performed after step ST4020 is not particularly limited.

Thereafter, the engineer 8 inputs necessary data to the unfinished portions of the control device logic data 113 and the monitor screen data 114 to complete the control device logic data 113 and the monitor screen data 114 .

According to the fourth embodiment, effects similar to those of the third embodiment can be obtained. It also has a second export section for exporting the H/W design data to the controller logic drawing section and the monitor screen drawing section. As a result, of the control device logic data and the monitoring screen data, information that can be obtained from the H/W design data is automatically input. Therefore, the engineer can complete the control device logic data and the monitoring screen data by inputting only information that cannot be acquired from the H/W design data. This simplifies the work of creating the control device logic data and the monitoring screen data, so that it is possible to further reduce the workload of the engineer in the H/W design work.

Embodiment 5.
Embodiment 5 will be described below with reference to FIGS. 16 to 18. FIG. 1 to 15 are denoted by the same reference numerals, and description thereof will be omitted. In the engineering work when constructing the plant monitoring and control system 1000, post-process work is performed based on the results of the H/W design work. may need to be redone. In such a case, duplication of work may be suppressed by back-dating the data generated in the post-process to the H/W design work. Since the flow of data to the functional units of the process (system configuration definition unit, distributed PIO module adjustment unit, controller logic drawing unit, and monitoring screen drawing unit) is one-way, data backdate is not performed. Embodiment 5 corresponds to the reverse data flow, that is, the data flow from the post-process functional unit to the H/W design support unit.

FIG. 16 is a diagram showing the configuration of the maintenance tool terminal and the engineering flow according to the fifth embodiment, and FIG. 17 is a software configuration diagram showing the H/W design support unit according to the fifth embodiment. is. As shown in FIG. 16, in the maintenance tool terminal 25, system configuration definition data 111, distributed PIO module adjustment data 112, controller logic data 113, and monitoring screen data 114 are sent to the H/W design support unit 1205. . In FIG. 16, the system configuration definition data 111, the distributed PIO module adjustment data 112, the control device logic data 113, and the monitoring screen data 114 are backdated. , the distributed PIO module adjustment unit 122, the control device logic drawing unit 123, and the monitoring screen drawing unit 124. Other data that can be obtained may be backdated. The point is that the data generated in the post-process should be back-dated to the H/W design support unit 1205 .

The H/W design support unit 1205 includes a backdate data fetching unit 217 as shown in FIG. The back date data acquisition unit 217 acquires the data specified by the engineer 8 among the system configuration definition data 111, the distributed PIO module adjustment data 112, the control device logic data 113, and the monitoring screen data 114, thereby backing up the data. conduct a date. In addition, the backdate data fetching unit 217 checks the consistency with the already saved H/W design data when backdating, so as to avoid contradiction. Data that is determined to be unbackdated by this consistency check is not backdated, and the main screen 901 is left blank (no data input).

The backdate data importing unit 217 separately holds the data exported by the exporting unit 215 and the second exporting unit 216 so as not to cause data loss when exporting again. That is, data unrelated to H/W design (not acquired by the H/W design support unit 1205 as a result) is stored in the H/W design data storage unit 213 as non-input data. This data is stored separately, and is exported together with the regenerated H/W design data 110 in the second export. As a result, it is possible to prevent data that has been designed in a post-process from being lost due to backdating and re-exporting.

The backdated data acquisition unit 217 sends the backdated data to the control panel number calculation unit 212 . Therefore, the control panel quantity calculation unit 212 in the fifth embodiment uses both the data such as the number of input/output signals received from the input/output signal count input unit 211 and the back date data received from the back date data acquisition unit 217. , the number of distributed PIO modules 5, etc. are recalculated.
Other configurations are the same as those of the fourth embodiment.

Next, the operation of H/W design support section 1204 will be described with reference to FIG. First, the engineer 8 selects and inputs which of the system configuration definition data 111, the distributed PIO module adjustment data 112, the control device logic data 113, and the monitoring screen data 114 is to be backdated. 217 accepts the selection input of engineer 8 (step ST5010). The engineer 8 may select a plurality of data to backdate, or may not backdate any data.

When data in system configuration definition section 121 is selected as data to be backdated, backdate data fetching section 217 backdates the selected data from system configuration definition section 121 (step ST5020).

When data in distributed PIO module adjustment section 122 is selected as data to be backdated, backdate data fetching section 217 backdates the selected data from distributed PIO module adjustment section 122 (step ST5030).

When the data of the control device logic drawing section 123 is selected as the data to be backdated, the backdate data fetching section 217 backdates the selected data from the control device logic drawing section 123 (step ST5040).

When the data of monitoring screen drawing section 124 is selected as the data to be backdated, backdate data fetching section 217 backdates the selected data from monitoring screen drawing section 124 (step ST5050).

Note that the order in which steps ST5020 to ST5050 are performed after step ST5010 is not particularly limited. Further, as described above, the backdated data importing unit 217 separately holds the data exported by the exporting unit 215 and the second exporting unit 216 when backdating is performed.

Next, the processing from step ST1010 to step ST1080 described in Embodiment 1 is performed, and H/W design data 110 is saved. (Step ST5060). However, in Embodiment 5, since part or all of the data has been input in advance by backdating, in the input processing in step ST1010, only data that has not been input at the time of backdating and data that has been input but needs to be corrected is input. It will be done. Further, the calculation processing and layout editing processing after step ST1020 are recalculation processing and reediting processing using back dated data in addition to the data input in step ST1010.

Next, the processing from step ST2020 to step ST2030 described in the second embodiment is performed, and H/W design specification template 102a is output by H/W design specification creating section 214 (step ST5070).

Next, the processing from step ST3020 to step ST3040 described in the third embodiment is performed, and the H/W design data 110 and the data held for export are exported by the export unit 215 to the system configuration definition unit 121 and distributed PIO module adjustment. Each is exported to section 122 (step ST5080).

Next, the processing from step ST4020 to step ST4040 described in the fourth embodiment is performed, and the H/W design data 110 and the data held for export are transferred by the second export unit 216 to the controller logic drawing unit 123 and Each is exported to monitoring screen drawing section 124 (step ST5090).

It should be noted that the processing from step ST5070 to step ST5090 is related to the second to fourth embodiments, and the effect of each embodiment can be obtained by executing each of them, but the execution is not essential.

According to the fifth embodiment, effects similar to those of the fourth embodiment can be obtained. In addition, a backdate data importing unit that imports data generated in a process subsequent to the hardware design work in the hardware design support unit as backdate data, and sends the imported backdata to the control panel quantity calculation unit. prepared. As a result, the control panel number calculation unit can recalculate using back date data, and the H/W design support unit can easily reflect changes in H/W design work in the post-process. be able to. Therefore, it becomes easier to deal with changes in the results of the H/W design work in the post-process, such as when an error in the H/W design work is corrected in the post-process. The amount can be further reduced.

Embodiment 6.
Embodiment 6 will be described below with reference to FIGS. 19 to 21. FIG. 1 to 18 are denoted by the same reference numerals, and description thereof will be omitted. In the engineering work at the time of building the plant monitoring and control system 1000, after the engineer 8 has performed all the engineering work, the test is performed by the person in charge of testing 10, and the plant monitoring and control system 1000 is built according to the H/W design specifications 102. is confirmed. The H/W design test procedure document 103 describing the test procedure for the test to be conducted by the tester 10 is normally prepared by the tester 10 . In Embodiments 1 to 5, the H/W design test procedure 103 was manually created by the person in charge of testing 10 . Specifically, the person in charge of testing 10 acquires a captured image of the screen of the maintenance tool terminal 21 or the like while confirming the H/W design specifications 102 or the like, and the acquired captured image is transferred to the H/W design test procedure document 103 . I was doing work such as pasting it on. Embodiment 6 differs from Embodiments 1 to 5 in that a model of H/W design test procedure 103 is created from H/W design data 110 . The reason why the H/W design test procedure manual is referred to as a "template" is that the final H/W design test procedure manual 103 is completed through additions, corrections, and the like by the person in charge of testing.

FIG. 19 is a diagram showing the configuration of a maintenance tool terminal according to Embodiment 6 and an engineering flow according to Embodiment 6, and FIG. 20 is a software configuration diagram showing a H/W design support unit according to Embodiment 6. is. As shown in FIG. 19, in the maintenance tool terminal 26, H/W design data 110, system configuration definition data 111, distributed PIO module adjustment data 112, controller logic data 113, and monitoring screen data 114 are used to A design test procedure 103 is created. 19, H/W design test procedure 103 is created using H/W design data 110, system configuration definition data 111, distributed PIO module adjustment data 112, controller logic data 113, and monitoring screen data 114. However, other data generated by the system configuration definition unit 121, the distributed PIO module adjustment unit 122, the control device logic drawing unit 123, and the monitoring screen drawing unit 124 may be used. good. In particular, since the H/W design test procedure 103 is for checking whether the construction of the plant monitoring and control system 1000 is performed correctly, the tester 10 can easily grasp the status of the construction of the plant by the engineer 8. It is effective to use the captured image of the screen in each functional unit from the viewpoint of making it easy to use.

The H/W design support unit 1206 includes a H/W design test procedure creation unit 218 as shown in FIG. The H/W design test procedure preparation unit 218 obtains necessary data from the H/W design data 110, the system configuration definition unit 121, the distributed PIO module adjustment unit 122, the control device logic drawing unit 123, and the monitoring screen drawing unit 124. A H/W design test procedure template 103a is created and output using the collected data. The tester 10 completes the H/W design test procedure manual 103 by adding necessary additions, corrections, etc. to the H/W design test procedure template 103a. If there are a plurality of H/W design data 110, the person in charge of testing 10 selects the H/W design data 110 to be used for creating the H/W design test procedure template 103a on the main screen 901 and selects the H/W design data 110. Based on the selected H/W design data 110, the design test procedure manual creating unit 218 creates and outputs the H/W design test procedure template 103a.

The “necessary data” collected by the H/W design test procedure creation unit 218 is information data designed by the engineer 8 in each functional unit, such as control logic diagrams or distributed PIO module adjustment data. The H/W design test procedure preparation unit 218 determines “necessary data” for each functional unit based on the H/W design data 110 . Then, a captured image of a screen on which information related to "necessary data" is displayed is obtained, and is embedded in the H/W design test procedure template 103a as it is. If the captured image embedded in the H/W design test procedure template 103a displays correct setting values, such captured image serves as evidence that the plant monitoring and control system 1000 is constructed as designed. .

The H/W design test procedure document creation unit 218 captures, for example, a screen capture image of each functional unit, and embeds the captured image in the H/W design test procedure template 103a in a diagram format or table format. The H/W design test procedure creation unit 218 obtains from any of the H/W design data 110, the system configuration definition unit 121, the distributed PIO module adjustment unit 122, the control device logic creation unit 123, and the monitoring screen creation unit 124. Information that cannot be entered is left blank in the H/W design test procedure template 103a to be created so that the person in charge of testing 10 can enter it later.
Other configurations are the same as those of the fifth embodiment.

Next, the operation of the H/W design support section 1206 will be described with reference to FIG. First, the processing from step ST5010 to step ST5090 described in Embodiment 5 is performed (step ST6010). Since the essential process is the generation of H/W design data 110, among the processes included in steps ST5010 to ST5090, the essential process is the process of Embodiment 1 (steps ST1010 to ST1080), Implementation of other processing is arbitrary. In order to obtain the effects peculiar to the second to fifth embodiments, corresponding processing is performed.

Next, the tester 10 selects the H/W design data 110 used for creating the H/W design test procedure template 103a, and the H/W design test procedure creation unit 218 is selected by the tester 10. is read from the H/W design data 110 (step ST6020).

Next, H/W design test procedure preparation section 218 collects necessary data from system configuration definition section 121 (step ST6030).

Next, H/W design test procedure preparation section 218 collects necessary data from distributed PIO module adjustment section 122 (step ST6040).

Next, H/W design test procedure preparation section 218 collects necessary data from control device logic drawing section 123 (step ST6050).

Next, H/W design test procedure preparation section 218 collects necessary data from monitoring screen drawing section 124 (step ST6060).

Next, a template of the H/W design test procedure is created and output (step ST6070). The H/W design test procedure manual creation unit 218 creates the H/W design test procedure template 103a by embedding the collected data in the H/W design test procedure template 103a in accordance with each expression format, Output. The tester 10 completes the H/W design test procedure manual 103 by making necessary additions, corrections, etc. to the output H/W design test procedure template 103a.

According to the sixth embodiment, effects similar to those of the fifth embodiment can be obtained. Also provided is a H/W design test procedure creation unit that creates and outputs a H/W design test procedure template from the H/W design data and the data of each functional unit. As a result, the person in charge of the test can create the H/W design test procedure using the template, so the work of creating the H/W design test procedure is simplified. Therefore, the amount of work involved in H/W design work can be further reduced.

While this application describes various exemplary embodiments and examples, various features, aspects, and functions described in one or more embodiments may not apply to particular embodiments. can be applied to the embodiments singly or in various combinations.
Therefore, countless modifications not illustrated are envisioned within the scope of the technology disclosed in the present application. For example, modification, addition or omission of at least one component, extraction of at least one component, and combination with components of other embodiments shall be included.
For example, the back date data acquisition unit 217 of the fifth embodiment may be added to the first embodiment, or the second export unit 216 of the fourth embodiment may be added to the second embodiment.

1 control device, 21, 22, 23, 24, 25, 26 maintenance tool terminal, 3 monitoring terminal, 5 distributed PIO module, 7 control panel, 8 engineer, 10 tester, 101 plant spec, 102 H/W design spec book, 102a H/W design specification template, 103 H/W design test procedure, 103a H/W design test procedure template, 110 H/W design data, 111 system configuration definition data, 112 distributed PIO module adjustment data, 113 control device logic data, 114 monitoring screen data, 1201, 1202, 1203, 1204, 1205, 1206 H/W design support unit, 121 system configuration definition unit, 122 distributed PIO module adjustment unit, 123 control device logic drawing unit, 124 Monitoring screen drawing unit, 211 input/output signal point input unit, 212 control panel number calculation unit, 213 H/W design data storage unit, 214 H/W design specification creation unit, 215 export unit, 216 second export unit, 217 back date data importing unit, 218 H/W design test procedure preparation unit, 221 distributed PIO module rackup layout editing unit, 222 number of stations/current consumption calculation unit, 223 panel component addition unit, 231 internal configuration of control device Product Rackup Arrangement Editor, 1000 Plant Monitoring and Control System

Claims (6)

An engineering support device that supports construction of a plant monitoring and control system that monitors and controls a plant to be monitored and controlled based on inputs from a plurality of distributed PIO modules connected to a control device,
a hardware design support unit that generates data related to hardware design in building the plant monitoring and control system;
a system configuration definition unit that generates system configuration definition data including system definition data of the plant monitoring and control system;
a distributed PIO module coordinator that generates distributed PIO module adjustment data including operating parameters of the distributed PIO module;
a control device logic drawing unit that generates control device logic data including information about arithmetic processing performed by the control device to monitor and control the plant to be monitored and controlled;
a monitoring screen drawing unit that generates monitoring screen data including information on drawing a monitoring screen for monitoring the plant,
The hardware design support unit determines the number of the plurality of distributed PIO modules and the number of control panels storing the plurality of distributed PIO modules and the control device based on the plant specifications of the plant to be monitored and controlled. a first calculation unit that calculates
a first layout editing unit that edits the layout of the distributed PIO modules in the control panel based on the calculation result of the first calculation unit and a predetermined layout rule;
a second calculation unit for calculating the number of interface units of distributed PIO modules arranged in the control device based on the editing result of the first arrangement editing unit;
a second layout editing unit that edits the layout of components to be placed in the control device based on the calculation result of the second calculation unit;
a panel component addition unit for adding panel components to be arranged in the control panel according to an input from an engineer to the editing result of the first layout editing unit;
The calculation result of the first calculation unit, the editing result of the second layout editing unit, and the editing result of the first layout editing unit to which the board component is added by the board component adding unit are transferred to the hardware. An engineering support device, comprising a hardware design data storage unit for storing design data. 2. The hardware design support unit comprises a hardware design specification creation unit that reads the hardware design data and creates a hardware design specification template using the read hardware design data. The engineering support device according to . 2. The hardware design support unit includes an export unit that reads the hardware design data and exports the read hardware design data to the system configuration definition unit and the distributed PIO module adjustment unit, respectively. 2. The engineering support device according to 2. The hardware design support unit includes a second export unit that reads the hardware design data and exports the read hardware design data to the control device logic drawing unit and the monitor screen drawing unit, respectively. 4. The engineering support device according to any one of items 1 to 3. The hardware design support unit takes in data generated in a process subsequent to hardware design in the hardware design support unit as backdate data, and sends the backdate data to the first calculation unit. A data acquisition unit is provided, and the first calculation unit calculates the number of the plurality of distributed PIO modules, the number of control panels storing the plurality of distributed PIO modules and the control device, and the plant spec and the backup. 5. The engineering support device according to claim 1, which is calculated based on date data. The hardware design support unit collects data from the hardware design data and data generated in a process after the hardware design, and uses the collected data to create a hardware design test procedure template. 6. The engineering support device according to any one of claims 1 to 5, further comprising a hardware design test procedure preparation unit.

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