JP7194613B2 - Substrate manufacturing method - Google Patents

Description

The present invention relates to a substrate manufacturing method.

A substrate manufacturing process includes an inspection step for detecting defects in the manufactured substrate. For example, in Japanese Patent Laid-Open No. 2002-200001, a portion necessary for inspection is cut out from an image (image of a board) captured by an inspection image capturing unit to be used as an inspection image, and the inspection image is compared with a reference image and an adjacent image. It is disclosed that the substrate is inspected by

JP 2015-190826 A

2. Description of the Related Art At the site where printed circuit boards are manufactured, it is required to realize quick and accurate inspection of printed circuit board products.

The present invention has been made in view of the above problems. One of the objects of the present invention is to provide a technique for improving productivity by performing rapid and accurate inspection of circuit board products.

According to the invention,
a step of processing a predetermined raw material to obtain a substrate to be inspected;
a step in which an inspection apparatus determines whether or not there is an abnormality in the substrate to be inspected by processing using a discriminator generated by machine learning;
obtaining a product substrate by performing post-processing on the abnormal substrate according to the group into which the abnormal substrate is classified;
There is provided a method of manufacturing a substrate comprising:

ADVANTAGE OF THE INVENTION According to this invention, productivity of a board|substrate product can be improved.

1 is a flow chart schematically showing the flow of a substrate manufacturing method according to the present invention. It is a figure which illustrates the functional structure of the board|substrate inspection apparatus of 1st Embodiment. It is a block diagram which illustrates the hardware constitutions of a board|substrate inspection apparatus. 4 is a flowchart illustrating the flow of processing executed by the substrate inspection apparatus of the first embodiment; It is a figure which shows the functional structure of the board|substrate inspection apparatus which concerns on 2nd Embodiment. 9 is a flow chart illustrating the flow of processing executed by a substrate inspection apparatus in an inspection step (S20) of the substrate manufacturing method according to the second embodiment; FIG. 10 is a diagram showing an example of information used when determining post-processing to be performed on a board to be inspected that has been determined to have an abnormality; FIG. 10 is a diagram showing an example of information used when determining post-processing to be performed on a board to be inspected that has been determined to have an abnormality; It is a figure which illustrates the functional structure of the board|substrate inspection apparatus which concerns on 3rd Embodiment. 10 is a flow chart showing the flow of processing executed by the board inspection apparatus in the inspection step (S20) of the board manufacturing method according to the third embodiment. It is a figure which shows an example of the information which links|links a classifier and the attribute corresponding to the classifier. 9 is a flow chart illustrating the flow of processing executed by a substrate inspection apparatus according to a modification of the first embodiment;

The present invention relates to a substrate manufacturing method. In the following description, the methods for manufacturing ceramic substrates and ceramic circuit substrates are exemplified, but the present invention can also be applied to methods for manufacturing other types of substrates. In that case, it is permissible to make various changes, improvements, etc. to the contents described below based on the knowledge of those skilled in the art. Here, the ceramic substrate is a ceramic plate produced by forming and sintering raw material powder. A ceramic circuit board is a composite (ceramic-metal composite) in which the aforementioned ceramic board and metal plate (e.g., copper plate, aluminum plate, etc.) are bonded using brazing material, etc., and then subjected to resist coating, etching, and plating. Then, a desired circuit pattern is formed.

Embodiments of the present invention will be described below with reference to the drawings. Various modifications, improvements, etc. may be made. A plurality of constituent elements disclosed in the embodiments can be appropriately combined to form various inventions. For example, some constituent elements may be omitted from all the constituent elements shown in the embodiments, or constituent elements of different embodiments may be combined as appropriate.

[First embodiment]
FIG. 1 is a flow chart schematically showing the flow of the substrate manufacturing method according to the present invention. As shown in FIG. 1, the substrate manufacturing method according to the present invention includes a substrate manufacturing step (S10) for manufacturing a substrate to be inspected, an inspection step (S20) for inspecting whether or not there is an abnormality in the inspection target substrate, It includes a post-processing step (S30) in which post-processing is performed on the detected substrates, and a shipping step (S40) in which substrates certified as acceptable products are packed. As shown, the post-processing step of S30 is executed when an abnormality is found in the inspection target substrate in the inspection step of S20. If no abnormality is found in the inspection target board in the inspection process of S20, the post-processing process of S30 is skipped, and the process proceeds to the shipping process of S40. Details of each step will be described below.

<S10: Substrate manufacturing process>
In this step, a substrate to be inspected is manufactured by subjecting a predetermined substrate raw material to various processing treatments. If the substrate to be inspected is a ceramics substrate, the processing is performed as follows, for example, although it is not particularly limited. First, a mixture of ceramic raw powder and various additives (sintering aids, organic binders, plasticizers, dispersants, mold release agents, etc.) is molded by a molding method such as extrusion molding or tape molding. It is used to form a sheet (forming process). Thereby, a sheet-like ceramic compact is obtained. A sheet-shaped ceramic molded body obtained by the molding process is punched into a predetermined work size (punching process). Then, the ceramic compact is heated in the air or in an inert gas atmosphere such as nitrogen gas or carbon dioxide gas to remove the organic binder (degreasing treatment). After that, the ceramic compact is sintered in a non-oxidizing atmosphere at a high temperature over a predetermined period of time (sintering process). Through these processing treatments, a ceramic substrate to be inspected is obtained. Further, when the substrate to be inspected is a ceramic circuit substrate, although not particularly limited, for example, processing such as the following is performed. First, a metal plate (for example, a copper plate, an aluminum plate, etc.) is joined to the ceramic substrate obtained by the above-described molding process to sintering process using a brazing material or the like (metal plate joining process). A ceramic-metal composite is thus obtained. Then, a resist is applied to the surface of the metal plate of the ceramic-metal composite to draw a desired circuit pattern (resist coating process), and the surface of the metal plate is eroded by an etchant (etching process). Thereby, a desired circuit pattern is formed on the surface of the metal plate. Furthermore, protective plating is applied to the formed circuit pattern (plating process). Through these processing treatments, a ceramic circuit board to be inspected is obtained.

<S20: Inspection step>
In this step, a substrate inspection device (hereinafter referred to as a “substrate inspection device”) inspects whether or not there is an abnormality in the substrate obtained in the substrate manufacturing process described above.

<<Example of functional configuration of circuit board inspection device>>
FIG. 2 is a diagram illustrating the functional configuration of the board inspection apparatus of the first embodiment. As shown in FIG. 2 , the board inspection apparatus 10 of this embodiment includes an image acquisition section 110 and an abnormality determination section 120 .

The image acquisition unit 110 acquires a plurality of images generated by photographing the substrate to be inspected under different conditions. An image of the substrate to be inspected is generated using an imaging device (not shown). As an example, a plurality of images of the substrate under inspection are generated by photographing the substrate under inspection from various angles using a plurality of imaging devices. As another example, the substrate to be inspected is photographed a plurality of times using one or more imaging devices while changing the characteristics of the light (wavelength of light, amount of light, etc.) irradiated to the substrate to be inspected. Multiple images of the substrate are generated. The image acquisition unit 110 acquires some or all of the generated images.

The abnormality judgment unit 120 judges whether or not there is an abnormality in the substrate to be inspected by processing the plurality of images acquired by the image acquisition unit 110 using the discriminator 122 generated by machine learning. Further, the abnormality determination unit 120 may be configured to classify inspection target boards determined to have an abnormality into a plurality of groups. An example in which the abnormality determining unit 120 determines whether or not an inspection target board has an abnormality and further classifies the inspection target board determined to have an abnormality into a plurality of groups based on the abnormality will be mainly described below. to explain. In the following description, the "inspection target board determined to be abnormal" is also referred to as the "abnormal board".

Here, the discriminator 122 is a learning model constructed so as to be able to detect anomalies on the substrate to be inspected using a known machine learning algorithm (for example, deep learning, SVM (Support Vector Machine), etc.). For example, by performing learning using a learning data set (combination of image data of anomalies that can occur on a board and information identifying the type of the anomaly), it is possible to detect an anomaly on the board from the feature values of the image. A discriminator 122 is constructed that can determine if there is an anomaly on the board, and if so, what type of anomaly it is. Note that the machine learning algorithm used to construct the discriminator 122 is not particularly limited as long as it can discriminate or classify various abnormalities of the substrate to be inspected. Upon receiving the image of the inspection target board acquired by the image acquiring unit 110 as an input, the discriminator 122 identifies an abnormal board ( board with an abnormality). Further, when the board to be inspected is determined to be an abnormal board, the discriminator 122 further outputs information indicating the type of abnormality that the board has. Based on the information output from the discriminator 122, the abnormality determination unit 120 can determine whether or not the board to be inspected is an abnormal board. Further, when the board to be inspected is determined to be an abnormal board, the abnormality determination unit 120 can identify the type of abnormality that the board has based on the information output from the discriminator 122 .

As an example, when the substrate to be inspected is a ceramic substrate, the identifier 122 detects cracks occurring in the ceramic substrate, the presence of dirt or foreign matter on the surface of the substrate, scratches, chips, or cracks in the input image of the substrate to be inspected. It is constructed to detect irregularities and the like as "abnormalities". In this case, based on the information output from the discriminator 122, the abnormality determination unit 120 identifies cracks occurring in the ceramic substrate, the presence of dirt or foreign matter on the surface of the substrate, scratches, chips, or irregularities as substrate abnormalities. be able to. As another example, when the board to be inspected is a circuit board, the classifier 122 regards the input image of the board to be inspected as "abnormal," such as the presence of dirt or foreign matter, scratches, or irregularities on the surface of the board. Built to detect. In this case, based on the information output from the discriminator 122, the abnormality determination unit 120 determines cracks occurring in the ceramic substrate, at least the presence of dirt or foreign matter, scratches, or unevenness on the surface of the substrate as abnormalities of the substrate. can do. The discriminator 122 also detects anomalies that do not actually exist in the substrate, as well as anomalies that do not actually exist in the substrate (such as halation, anomalies that occur only in the image data due to the environment at the time of shooting, the structure of the imaging device, etc.). ) may be learned to be identifiable.

Here, the handling (post-processing) of the abnormal substrate differs depending on the type of abnormality that the abnormal substrate has. For example, if the output information of the discriminator 122 includes only "abnormality that does not actually exist in the board" as the type of abnormality for a board to be inspected that has been determined to be an abnormal board, it is determined that there is no substantial abnormality in the board. I can say In this case, the substrate does not require any special post-treatment and can be shipped as it is as an acceptable product. Further, for example, if the output information of the discriminator 122 includes "abnormality that actually exists in the board" as the type of abnormality for a board to be inspected that has been determined to be an abnormal board, the board needs to be subjected to some kind of post-processing. becomes. The post-treatment to be performed on the substrate changes according to the abnormality that the substrate has. For example, if the abnormality of the board to be inspected that is determined to be an abnormal board is due to dirt or foreign matter adhering to the surface of the board, the board can be shipped as an acceptable product after being subjected to a predetermined cleaning process. . Further, for example, when the abnormality of the board to be inspected that is determined to be an abnormal board is a minor scratch, the board can be shipped as an acceptable product after performing a predetermined repair process. Further, for example, if the abnormality of the board to be inspected that has been determined to be an abnormal board is a severe crack or flaw that is unlikely to be repaired, the board is discarded, for example.

In this way, a substrate to be inspected that is determined to have an abnormality is handled differently depending on the type of abnormality that the substrate has. Therefore, the abnormality determination unit 120 determines the group to which the board belongs (that is, the group classified based on the type of abnormality) based on the type of abnormality that the board determined as having an abnormality has. For example, as a result of inputting an image of a board to be inspected to the discriminator 122, the board to be inspected is determined to be an abnormal board, and the types of defects of the board are "abnormalities that do not exist on the board" and "abnormalities that do not exist on the board." Assume that an output indicating "abnormality due to foreign matter" is obtained. In this case, based on the output of the discriminator 122, the abnormality determining unit 120 determines the group corresponding to the abnormal board corresponding to the "abnormality that does not exist on the board" and the group corresponding to the "abnormality due to dirt or foreign matter on the board surface". It is judged that it belongs to

<<Example of Hardware Configuration of Circuit Board Inspection Device>>
Each functional component of the board inspection apparatus 10 may be implemented by hardware (eg, hardwired electronic circuit) that implements each functional component, or may be implemented by a combination of hardware and software (eg, combination of an electronic circuit and a program for controlling it, etc.). A case in which each functional component of the substrate inspection apparatus 10 is implemented by a combination of hardware and software will be further described below.

FIG. 3 is a block diagram illustrating the hardware configuration of the substrate inspection apparatus 10. As shown in FIG. The hardware configuration of the board inspection apparatus 10 shown in FIG. 3 is merely an example, and the hardware configuration of the board inspection apparatus 10 is not limited to the configuration shown in FIG.

As shown in FIG. 3, board inspection apparatus 10 has bus 1010 , processor 1020 , memory 1030 , storage device 1040 , input/output interface 1050 and network interface 1060 .

A bus 1010 is a data transmission path through which the processor 1020, the memory 1030, the storage device 1040, the input/output interface 1050, and the network interface 1060 mutually transmit and receive data. However, the method of connecting processors 1020 and the like to each other is not limited to bus connection.

The processor 1020 is a processor realized by a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or the like.

The memory 1030 is a main memory implemented by RAM (Random Access Memory) or the like.

The storage device 1040 is an auxiliary storage device such as a HDD (Hard Disk Drive), SSD (Solid State Drive), memory card, or ROM (Read Only Memory). The storage device 1040 stores program modules that implement each function of the substrate inspection apparatus 10 (the image acquisition unit 110, the abnormality determination unit 120, etc.). Each function corresponding to the program module is realized by the processor 1020 reading each program module into the memory 1030 and executing it.

The input/output interface 1050 is an interface for connecting the board inspection apparatus 10 and peripheral devices. In the example of FIG. 3 , an imaging device 1052 and an input/output device 1054 are connected to the board inspection apparatus 10 via an input/output interface 1050 . The imaging device 1052 is a device that generates an image of a substrate to be inspected using a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, or the like. In the example of this figure, one imaging device 1052 is connected to the substrate inspection apparatus 10 via the input/output interface 1050 so that the imaging range includes the inspection target substrate S placed on the inspection table. A plurality of imaging devices 1052 may be connected to the substrate inspection apparatus 10 via the input/output interface 1050, without being limited to the example of this figure. The input/output device 1054 includes the input/output device 1054 such as the imaging device 15 for photographing the substrate to be inspected, for example, a mouse, a keyboard, a speaker, and a display (touch panel display).

A network interface 1060 is an interface for connecting the substrate inspection apparatus 10 to a network. This network is, for example, a LAN (Local Area Network) or a WAN (Wide Area Network). A method for connecting the network interface 1060 to the network may be a wireless connection or a wired connection.

<<Flow of Processing Executed by Board Inspection Apparatus>>
Processing executed by the board inspection apparatus 10 of the present embodiment will be described with reference to FIG. FIG. 4 is a flowchart illustrating the flow of processing executed by the substrate inspection apparatus 10 of the first embodiment.

First, the image acquisition unit 110 acquires an image of the substrate to be inspected from the imaging device 1052 connected via the input/output interface 1050 (S202). The abnormality determination unit 120 inputs the image of the inspection target substrate acquired by the image acquisition unit 110 to the discriminator 122 constructed in advance by machine learning (S204). Based on the output result obtained from the discriminator 122 by inputting the image of the inspection target board, the abnormality determination part 120 determines whether or not the inspection target board is an abnormal board ( S206). If an abnormality is detected in the inspection target board (S206: YES), the abnormality determination unit 120 selects the group to which the inspection target board (abnormal board) determined to have an abnormality is classified by the discriminator 122. (S208). Then, the abnormality determination unit 120 notifies the person who inspects the product board of the information about the group specified in the process of S208, for example, via a display or a lamp connected to the board inspection apparatus 10 (S210). . In response to this notification, the person who inspects the product board sends the board to be inspected, which has been determined to be an abnormal board, to the post-processing step. On the other hand, if no abnormality is detected in the inspection target board (S206: NO), the abnormality determination unit 120 determines the inspection target board as a passing product (S212). A person who inspects product substrates sends the substrates determined to be acceptable by the abnormality determining unit 120 to the shipping process, which will be described later.

<<Modification>>
Here, the abnormality determination unit 120 does not have to perform the process of classifying the abnormal boards based on the abnormality. FIG. 12 is a flowchart illustrating the flow of processing executed by the substrate inspection apparatus 10 of the modification of the first embodiment.

The processes of S502-S506 and S510 in FIG. 12 are the same as the processes of S202-S206 and S210 in FIG. 4, respectively. In the process of S506, if an abnormality is detected in the inspection target board (S506: YES), the abnormality determination unit 120 of this modification outputs the inspection result via an output device such as a display connected to the board inspection apparatus 10. The abnormality of the target substrate is notified (S508). For example, the abnormality determination unit 120 indicates information indicating whether or not the substrate to be inspected is an abnormal substrate, and the type of abnormality detected in the substrate to be inspected (adhesion of dirt or foreign matter, cracks, scratches, chipping, unevenness, etc.). Information or information indicating the detected position of the abnormality is notified via the output device. This information is used by a person involved in the inspection of product boards to determine whether there is an abnormality in the board to be inspected, or to grasp the type of abnormality detected in the board to be inspected and its detection position. help. Such information is expected to have the effect of facilitating the post-processing of an abnormal substrate to be inspected.

<S30: Post-processing step>
In this step, post-processing is performed based on the abnormality of the board to be inspected, which has been determined by the board inspection apparatus 10 to be an "abnormal board" in the inspection process of S20. For example, if the type of abnormality determined by the abnormality determination unit 120 is "attachment of foreign matter", post-processing (for example, air blowing or cleaning processing using a cleaning liquid) is performed to remove the foreign matter. A board to be inspected whose abnormality has been resolved by executing post-processing is sent to a shipping process described later as a product board (accepted product).

Here, the post-processing to be performed on the abnormal substrate includes, for example, at least one of the following types of processing.
(a) Use the abnormal board as it is as the product board (b) Remove the foreign matter adhering to the abnormal board and use it as the product board (c) Repair the abnormalities (scratches, warping, etc.) of the abnormal board and use it as the product board to be

The post-processing of (a) is a process in which a board to be inspected that has been determined to have an abnormality is sent to the shipping process as an acceptable product without being subjected to post-processing. The above (b) post-treatment is one of the treatments for resolving the abnormality of the substrate to be inspected. It includes a process of cleaning and removing dirt and foreign matter. The above (c) post-processing is one of the processes for resolving the abnormality of the substrate to be inspected, and includes, for example, a repair process by heating or polishing. For example, stains, foreign matter, minor scratches, dried stains, etc. on the ceramic substrate that cannot be removed by washing can be repaired by polishing. Moreover, if the warp that occurs in the ceramic substrate or the like is mild, it can be repaired by heat treatment. In addition, minor scratches, chips, or irregularities on the substrate surface can be repaired by polishing. In addition to the heat treatment and polishing treatment described above, the post-treatment (c) may include a treatment of stripping the protective plating of the formed circuit pattern and then plating it again. In this case, the discriminator 122 performs machine learning using a learning data set related to abnormalities in the plating portion, such as poor adhesion of the plating, variation in film thickness, surface roughness of the plating surface, and staining of plating solution residue. It is constructed to be able to detect abnormalities in the site. Then, as a result of inputting the image of the board to be inspected to the discriminator 122, the board to be inspected is determined to be an abnormal board, and an output indicating "abnormality of the plating part" as the type of abnormality of the board is obtained. , the abnormality determination unit 120 classifies the substrate into a group corresponding to "recoverable abnormality occurring on the substrate surface".

For example, the board inspection apparatus 10 may send a notification indicating that the board to be inspected, which has been determined to be an "abnormal board" in the inspection process of S20, has been classified into only the group corresponding to "abnormalities that do not exist in the board". is output. In this case, the person who inspects the product board may determine that the post-processing of (a) above should be performed on the assumption that there is no substantive abnormality in the board to be inspected that has been determined to be the defective board. can. At this time, the person who inspects the product substrate may simply check the surface of the substrate to be inspected just in case.

Further, for example, for a board to be inspected that has been determined to be an "abnormal board" in the inspection process of S20, a notification indicating that the board has been classified into a group corresponding to "abnormality due to dirt or foreign matter on the board surface" may be sent to the board. Suppose that the inspection apparatus 10 outputs. In this case, the person who inspects the product substrate can determine that post-processing (b) should be performed in order to remove stains and foreign matter from the surface of the substrate to be inspected.

Further, for example, for a board to be inspected that has been determined to be an "abnormal board" in the inspection process of S20, a notification indicating that the board has been classified into a group corresponding to "a repairable abnormality occurring on the board surface" Assume that the board inspection apparatus 10 outputs. In this case, the person who inspects the product board can determine that the above post-processing (c) should be performed in order to repair the abnormality that has occurred on the surface of the board to be inspected.

Further, post-processing to be performed on an abnormal substrate is not limited to the above-described processing (a) to (c). For example, post-processing to be performed on an abnormal board includes a process of discarding the abnormal board as a rejected product, or a process of reusing the abnormal board as a raw material for another board. good too. Here, the process of reusing the abnormal substrate as a raw material for another substrate specifically means reusing the ceramic aggregate collected by crushing the ceramic base portion as a material for another ceramic substrate. processing, and processing to generate a new metal plate using the metal recovered by dissolving the metal portion of the ceramic circuit board. For example, for a board to be inspected that has been determined to be an "abnormal board" in the inspection process of S20, a notification indicating that the board has been classified into a group corresponding to "an unrecoverable abnormality occurring on the board surface" When the board inspection apparatus 10 outputs, the person who inspects the product board either disposes the abnormal board as a rejected product or reuses the abnormal board as a raw material for other boards. should be executed.

<S40: Shipping process>
In this step, the inspection target board determined as a passing product (product board) in the inspection process of S20 or the inspection target board certified as a product board through the post-processing process of S30 is shipped. After being packed, the product substrate is shipped to a predetermined delivery destination.

In the substrate manufacturing method according to the present invention described above, particularly in the step of inspecting the inspection target substrate (inspection step of S20), the inspection target substrate (abnormal substrate) determined to have an abnormality is A group is identified based on the type of anomaly it has. Then, information about the group identified for the abnormal board is notified to the person involved in the product board inspection work. By confirming the information output from the board inspection apparatus 10 in this way, even a person with little work experience (a person with a low degree of proficiency in work) can understand how the board to be inspected is determined to be abnormal. It becomes possible to accurately and quickly determine whether there is an abnormality, and to proceed with the subsequent steps accurately. As a result, an effect of improving the productivity of product substrates can be expected. Further, in the board inspection apparatus 10 of this embodiment, machine learning is used to detect the presence or absence of an abnormality on the product board. As a result, compared to the case where a person checks the image, there is less bias in determining whether there is an abnormality in the board, and it is expected that the quality of work can be maintained above a certain level regardless of the person who performs the work.

Further, in the modified example of the present embodiment, when the board inspection apparatus 10 detects an abnormality in the inspection target board in the inspection process of S20, information regarding the detected abnormality is notified via the output device. The information notified via the output device can be used by persons involved in product board inspection to determine whether or not there is an abnormality in the board to be inspected, or to determine the type of abnormality detected in the board to be inspected and its detection. It will help you to know your position. Such information is expected to have the effect of facilitating the post-processing of an abnormal substrate to be inspected.

[Second embodiment]
This embodiment is similar to the first embodiment described above, except for the points described below.

<Example of functional configuration>
FIG. 5 is a diagram showing the functional configuration of the board inspection apparatus 10 according to the second embodiment. As shown in FIG. 5, the substrate inspection apparatus 10 of this embodiment further includes a post-processing specifying unit 130 in addition to the configuration of the first embodiment. The post-processing specifying unit 130 specifies post-processing to be performed on the abnormal board using the groups classified by the abnormality determining unit 120 .

<Processing flow of substrate inspection device>
Processing executed by the board inspection apparatus 10 of the present embodiment will be described with reference to FIG. FIG. 6 is a flow chart illustrating the flow of processing executed by the board inspection apparatus 10 in the inspection step (S20) of the board manufacturing method according to the second embodiment. The process shown in FIG. 6 is executed after the process of S208 in FIG.

The post-processing identifying unit 130 determines post-processing to be performed on the abnormal board based on the information regarding the abnormal board group identified in the process of S208 (S302).

The post-processing specifying unit 130 can determine the post-processing to be performed on the inspection target board determined to have an abnormality using, for example, the information shown in FIG. 7 . FIG. 7 is a diagram showing an example of information used when determining post-processing to be performed on a board to be inspected that has been determined to have an abnormality. FIG. 7 depicts a table defining post-processing to be executed according to the processing result of the abnormality determination unit 120 . Specifically, information indicating post-processing to be executed (post-processing information) is associated with each information indicating a classified group as a processing result of the abnormality determination unit 120 . For example, when the abnormality determining unit 120 classifies the abnormal substrates into group B in the process of S208, the post-processing specifying unit 130 uses the information illustrated in FIG. It can be determined as post-processing to be performed on the organic substrate.

Then, the post-processing specifying unit 130 transmits information indicating the post-processing to be performed on the abnormal board to a person who is involved in the inspection work of the product board via a display or a lamp connected to the board inspection apparatus 10, for example. (S304). For example, the post-processing specifying unit 130 causes the display to display a message (eg, "Please perform cleaning removal processing") that notifies the post-processing to be performed on the substrate to be inspected.

As described above, in the present embodiment, the post-processing to be executed for the abnormal substrate is determined based on the classification result of the abnormal substrate group by the abnormality determination unit 120 . Then, information indicating post-processing to be performed on the abnormal board is notified to a person who is involved in inspection work of the product board. A person who is involved in the inspection work of product boards should check the information output from the board inspection apparatus 10 of the present embodiment, and what kind of post-processing should be performed on the board to be inspected that is determined to have an abnormality. can be determined immediately. As a result, it is possible to improve the efficiency of inspection work for product substrates.

<First modification>
Here, when a board to be inspected has a plurality of types of abnormalities, the board may be classified into a plurality of groups depending on the type of abnormality present in the board. For example, as a result of inputting an image of a board to be inspected to the discriminator 122, the board to be inspected is determined to be an abnormal board, and the types of defects of the board are "abnormalities due to dirt or foreign matter on the board" and "abnormalities due to board surface." Suppose that an output indicating "a repairable abnormality occurred" was obtained. In this case, based on the output of the discriminator 122, the abnormality determination unit 120 classifies the abnormal board into a group corresponding to "abnormalities due to dirt or foreign matter on the board" and to a group corresponding to "abnormalities occurring on the substrate surface that can be repaired." Categorize into corresponding groups. Then, the post-processing specifying unit 130 selects the above post-processing (b) corresponding to the group corresponding to "abnormality due to dirt or foreign matter on the substrate" and the group corresponding to "recoverable abnormality occurring on the substrate surface". The corresponding post-processing of (c) above is determined as the post-processing to be executed for the abnormal board.

In this case, the post-processing specifying unit 130 can determine the execution order of the plurality of post-processings by associating information indicating priority with each group. The post-processing specifying unit 130 can specify, for example, using information such as that shown in FIG. 8, the place where post-processing should be performed on the inspection target board determined to have an abnormality. FIG. 8 is a diagram showing an example of information used when determining post-processing to be performed on a board to be inspected that has been determined to have an abnormality. For example, as a result of inputting an image of a board to be inspected into the discriminator 122, when the board is classified into "group B" and "group C", the post-processing specifying unit 130 performs Thus, the "cleaning and removing process" and the "repair process" can be determined as the post-processing to be performed on the substrate to be inspected determined to be abnormal. Furthermore, the post-processing specifying unit 130 determines the execution order of the post-processing based on the information indicating the priority linked to the group B and the group C among the information illustrated in FIG. can be done. In this case, the post-processing specifying unit 130 determines the order of the “cleaning removal processing” and the “repair processing” as the execution order of the post-processing. Then, the post-processing specifying unit 130 adds information indicating the order of execution to the information indicating the post-processing to be performed on the board to be inspected that has been determined to have an abnormality. Notice. For example, the post-processing specifying unit 130 sends a message (eg, "Please perform repair processing after cleaning removal processing") that notifies the post-processing to be performed on the substrate to be inspected and the execution order of the post-processing. show on the display.

According to the configuration of this modified example, a person who is in charge of inspecting a product board can easily determine in what order post-processing should be performed on a board to be inspected that has been determined to have an abnormality. can. This is expected to further improve the efficiency of product inspection operations.

<Second modification>
In the present embodiment, for example, a priority is set for each of a plurality of groups, and the post-processing specifying unit 130 determines the post-processing to be performed on the abnormal substrate based on the priority set for each group. , may be configured to specify one post-processing. For example, when a certain post-processing includes other post-processing, the priority of the former post-processing is higher than that of the latter post-processing. As a specific example, a case is given in which the substrate to be inspected is classified into a group corresponding to "repair processing" and a group corresponding to "cleaning processing". Here, in restoration processes such as polishing and re-plating, there is a possibility that dirt, debris, etc. will adhere separately during work, so be sure to perform cleaning work of the substrate as a set in order to remove such dirt and debris. become. In this case, it can be said that the cleaning process is included in the repair process. Therefore, as a result of the abnormality determination unit 120 determining an abnormality based on the image of the substrate to be inspected, when the substrate to be inspected is classified into a group corresponding to "repair processing" and a group corresponding to "cleaning processing", at least If the repair process is executed, then the cleaning process can also be executed. In such a case, for example, as shown in FIG. 7, by setting the priority of the group corresponding to the repair process higher than the priority of the group corresponding to the cleaning process, the post-processing specifying unit 130 Using the information shown in FIG. 7, it can be determined that the "repair process", which has a higher priority than the "repair process" and the "cleaning process", should be executed. Information such as that illustrated in FIG. 7 is stored in advance in a storage area accessible by the post-processing specifying unit 130, such as the memory 1030 or the storage device 1040, for example. With such a configuration, an effect of improving the efficiency of work including post-processing can be expected.

[Third embodiment]
This embodiment is similar to the first embodiment described above, except for the points described below.

<Example of functional configuration>
FIG. 9 is a diagram illustrating the functional configuration of the board inspection apparatus 10 according to the third embodiment. As shown in FIG. 9 , in this embodiment, the abnormality determination section 120 has a plurality of discriminators 122 . Each of the plurality of discriminators 122 is constructed for each attribute using a plurality of data sets for learning collected for each attribute (a combination of an image of an abnormality occurring on the board and information for identifying the type of the abnormality). ing.

Here, the attributes of the board are, for example, the type of the board (for example, the type based on the board material, the type based on the configuration of the board such as a ceramic board or a ceramic circuit board), or the place where the board was manufactured (for example, factory or a line in a factory). However, the attribute of the board is not particularly limited as long as it can affect the type of abnormality that occurs on the board.

In the present embodiment, the abnormality determination unit 120 acquires information indicating attributes of the inspection target substrate (hereinafter also referred to as “board attribute information”). Then, the abnormality determination unit 120 specifies the discriminator 122 corresponding to the attribute indicated by the board attribute information as "a discriminator used when determining whether or not the board to be inspected has an abnormality". Then, the abnormality judgment unit 120 judges whether or not there is an abnormality in the board to be inspected using the specified discriminator 122 .

<Process flow>
The flow of processing executed by the substrate inspection apparatus 10 of this embodiment will be described with reference to FIG. FIG. 10 is a flow chart showing the flow of processing executed by the board inspection apparatus 10 in the inspection step (S20) of the board manufacturing method according to the third embodiment.

First, the abnormality determination unit 120 acquires data (board attribute information) of the inspection target board (S402). For example, the abnormality determination unit 120 receives input of information (board attribute information) indicating the type and manufacturing location of the board to be inspected via an input device (keyboard or touch panel) connected to the board inspection apparatus 10 .

The abnormality determination unit 120 selects a discriminator corresponding to the attribute indicated by the input board attribute information from among the plurality of discriminators 122 (S404). For example, the abnormality determination unit 120 selects a discriminator corresponding to the attribute indicated by the board attribute information acquired in the process of S402 using a table (eg, FIG. 11) that stores attributes corresponding to each discriminator. can be done. FIG. 11 is a diagram showing an example of information linking classifiers and attributes corresponding to the classifiers. The information illustrated in FIG. 11 is stored in advance in a storage area such as the memory 1030 or the storage device 1040, for example. For example, when the attribute indicated by the substrate attribute information is "ceramic substrate", the abnormality determination unit 120 is configured for inspection of the ceramic substrate based on the information illustrated in FIG. select the discriminator A that has been identified. Further, when the attribute indicated by the board attribute information is "ceramic circuit board", the abnormality determination unit 120 uses a discriminator constructed for inspection of the ceramic circuit board based on the information illustrated in FIG. Choose B. Further, when the attribute indicated by the board attribute information is neither "ceramic board" nor "ceramic circuit board", the abnormality judgment unit 120 uses a generically constructed identification board based on the information as illustrated in FIG. Select vessel C.

After that, when the image of the substrate to be inspected is acquired by the image acquisition unit 110 (S406), the abnormality determination unit 120 inputs the image of the substrate to be inspected to the discriminator 122 selected in the process of S304 (S408). . Based on the output result obtained from the discriminator 122 by inputting the image of the inspection target board, the abnormality determination part 120 determines whether or not the inspection target board is an abnormal board ( S410). If an abnormality is detected in the board to be inspected (S410: YES), the abnormality determination unit 120 selects a group to which the board to be inspected (abnormal board) determined to have an abnormality is classified by the discriminator 122. (S412). Then, the abnormality determination unit 120 notifies the person who is involved in the product board inspection work of the information about the group specified in the process of S412, for example, via a display or a lamp connected to the board inspection apparatus 10 (S414). . On the other hand, if no abnormality is detected in the inspection target board (S410: NO), the abnormality determination unit 120 determines the inspection target board as a passing product (S416). Boards that are determined to be acceptable products are shipped as products after being packed. The flow of processing from S406 to S416 is the same as the flow of processing from S202 to S212 in FIG.

As described above, in this embodiment, the discriminator is switched for each attribute of the board to be inspected, and the presence or absence of an abnormality in the board is determined. Here, the attributes of a substrate can affect the types of anomalies that can occur on that substrate. For example, the types and tendencies of abnormalities that occur vary depending on the material and configuration of the substrate. In addition, there are considerable individual differences in the manufacturing machines used at the manufacturing site, and the types and tendencies of abnormalities occurring in substrates may differ from one manufacturing machine to another. Therefore, as described in the present embodiment, by appropriately selecting a discriminator that matches the attributes of the board to be inspected, an effect of improving the accuracy of discriminating whether or not there is an abnormality in the board can be expected.

10 board inspection device 110 image acquisition unit 120 abnormality judgment unit 122 discriminator 130 post-processing identification unit 1010 bus 1020 processor 1030 memory 1040 storage device 1050 input/output interface 1052 imaging device 1054 input/output device 1060 network interface

Claims (13)

a step of processing a predetermined raw material to obtain a substrate to be inspected;
An inspection apparatus determines whether or not there is an abnormality in the inspection target board by processing an image of the inspection target board using a discriminator generated by machine learning, and determining whether the inspection target board has an abnormality. a step of classifying the abnormal substrates into a plurality of groups ;
a step of obtaining a product substrate by performing post-processing based on the abnormality of the inspection target board when the inspection target board has an abnormality;
with
The substrate manufacturing method , wherein the plurality of groups includes a group indicating an abnormality that actually exists in the substrate and a group indicating an abnormality that does not actually exist in the substrate. The abnormality that does not actually exist in the substrate is an abnormality that occurs only in the image due to the environment in which the image is captured or the structure of an imaging device that captures the image.
A method of manufacturing a substrate according to claim 1 . 3. The substrate manufacturing method according to claim 1 , further comprising the step of specifying post-processing to be performed on said abnormal substrate by said inspection apparatus using said classified groups. A priority is set for each of the plurality of groups,
The inspection device specifies one post-processing as a post-processing to be performed on the abnormal board based on the priority order;
4. The method of manufacturing a substrate according to claim 3, comprising: A priority is set for each of the plurality of groups,
The inspection apparatus determines an execution order of post-processing to be performed on the substrate based on the priority.
4. The method of manufacturing a substrate according to claim 3, comprising: The inspection device
Identifying the type of abnormality that the abnormal board has,
determining a group to which the abnormal board belongs based on the type of the abnormality;
The method of manufacturing a substrate according to any one of claims 1 to 5, comprising: The inspection device
when the substrate is a ceramic substrate, identifying cracks, presence of dirt/foreign matter, flaws, chipping or irregularities as abnormalities of the substrate;
When the substrate is a circuit substrate, discriminating dirt, scratches, or unevenness on the surface as an abnormality of the substrate;
The method for manufacturing a substrate according to any one of claims 1 to 5, comprising: The post-processing to be performed on the board with abnormality, which is the board to be inspected that has been determined to have an abnormality, includes at least one of the following (a) to (c):
A method for manufacturing a substrate according to any one of claims 1 to 7.
(a) Use the board with abnormality as a product board (b) Remove foreign matter adhering to the board with abnormality and use it as a product board (c) Repair the abnormality in the board with abnormality and use it as a product board The post-treatment of (b) includes a step of cleaning and removing foreign matter with a predetermined gas or liquid.
A method of manufacturing a substrate according to claim 8 . The post-treatment of (c) includes a repair process by heat or polishing,
10. A method for manufacturing a substrate according to claim 8 or 9. The post-processing to be performed on the board with abnormality, which is the board to be inspected that has been determined to have an abnormality, further includes a process of discarding the board with abnormality as a rejected product.
A method for manufacturing a substrate according to any one of claims 8 to 10. The discriminator is constructed for each attribute using learning data corresponding to the attribute of the substrate,
The inspection device
Acquiring board attribute information indicating an attribute of the board, and using an identifier corresponding to the attribute indicated by the board attribute information, determining whether or not the board has an abnormality;
12. The method of manufacturing a substrate according to any one of claims 1 to 11, comprising: The attributes of the substrate include at least one of the substrate type and the location where the substrate was manufactured,
A method for manufacturing a substrate according to any one of claims 1 to 12.

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