JP7182958B2 - Curable encapsulants, cured products and display devices - Google Patents

Description

TECHNICAL FIELD The present invention relates to a curable sealing material, a cured product, and a display device.

2. Description of the Related Art In display devices such as organic EL display devices and liquid crystal display devices, colorization technology has made dramatic progress in recent years. In order to display more beautiful and clear images, it is necessary to improve color reproducibility by increasing the color purities of red, green and blue emitted from the display device as much as possible.
For example, Patent Document 1 discloses an optical filter comprising a substrate containing at least one dipyrromethene metal chelate compound having a maximum absorption wavelength of 440 to 510 nm. Patent Document 1 describes that the optical filter efficiently cuts excess light around 480 nm generated in various displays, and thus has excellent performance of accurately reproducing the green portion of visible light. .

JP-A-2003-57436

However, the use of the optical filter described in Patent Document 1 complicates the manufacturing process and configuration of the display device. Therefore, there is a demand for a technique capable of improving the color purity of the display device and simplifying the configuration of the display device.

The present invention has been made in view of the above circumstances, and provides a curable encapsulant that can improve the color purity of a display device and simplify the configuration of the display device.

The inventors of the present invention have made intensive studies in order to achieve the above problems. As a result, by using a curable sealing material containing a compound (P) having a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less as a sealing material for sealing a light emitting element, the color purity of the display device can be improved. The inventors have found that the display device can be improved and the configuration of the display device can be simplified, and have completed the present invention.

That is, according to the present invention, the following curable encapsulant, cured product, and display device are provided.

［式中、Ｘ_１～Ｘ_８はそれぞれ独立に、水素原子、直鎖もしくは分岐のアルキル基、エチニル基、直鎖もしくは分岐のアルキル基で置換されたエチニル基、フェニル基を有するエチニル基、または、直鎖もしくは分岐のアルキル基で置換されたフェニル基を有するエチニル基を表す。ただし、Ｘ_１～Ｘ_８のすべてが水素原子であることはない。Ｒ_１～Ｒ_４は、それぞれ独立に、水素原子、直鎖もしくは分岐のアルキル基を表し、Ｍは２個の水素原子、２価の金属原子、３価の置換金属原子、４価の置換金属原子、水酸化金属原子、または酸化金属原子を表す。］
［３］
上記［１］または［２］に記載の硬化型封止材において、
当該硬化型封止材を硬化することによって厚さ１０μｍの硬化物シートを作製したとき、
上記硬化物シートの４００ｎｍ以上８００ｎｍ以下の範囲での平均光線透過率が８０％以上である硬化型封止材。
［４］
上記［１］乃至［３］のいずれか一つに記載の硬化型封止材において、
当該硬化型封止材を硬化することによって厚さ１０μｍの硬化物シートを作製したとき、
４５０ｎｍ以上５００ｎｍ以下の範囲に存在する吸収極大波長での光線透過率が３０％以上である硬化型封止材。
［５］
上記［１］乃至［４］のいずれか一つに記載の硬化型封止材において、
上記化合物（Ｐ）が下記一般式（Ａ－１）または（Ａ－２）で示されるポルフィリン系化合物を含む硬化型封止材。

［６］
上記［１］乃至［５］のいずれか一つに記載の硬化型封止材において、
発光素子用封止材である硬化型封止材。
［７］
上記［１］乃至［６］のいずれか一つに記載の硬化型封止材において、
熱硬化性樹脂、熱硬化性化合物、光硬化性樹脂および光硬化性化合物からなる群から選択される一種または二種以上の硬化性化合物をさらに含む硬化型封止材。
［８］
上記［７］に記載の硬化型封止材において、
当該硬化型封止材に含まれる硬化性化合物を１００質量部としたとき、上記化合物（Ｐ）の含有量が０．０００１質量部１０質量部以下である硬化型封止材。
［９］
上記［１］乃至［８］のいずれか一つに記載の硬化型封止材において、
硬化剤をさらに含む硬化型封止材。
［１０］
上記［１］乃至［９］のいずれか一つに記載の硬化型封止材を硬化してなる硬化物。
［１１］
発光素子と、上記発光素子を封止するための封止層と、を備え、
上記封止層が上記［１０］に記載の硬化物を含む表示装置。
［１２］
上記［１１］に記載の表示装置において、
有機ＥＬ表示装置または液晶表示装置である表示装置。 [1]
A curable encapsulant containing a compound (P) having a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less.
[2]
In the curable sealing material according to [1] above,
A curable encapsulant in which the compound (P) contains a porphyrin-based compound represented by the following general formula (A).

[In the formula, X ₁ to X ₈ are each independently a hydrogen atom, a linear or branched alkyl group, an ethynyl group, an ethynyl group substituted with a linear or branched alkyl group, an ethynyl group having a phenyl group, or , represents an ethynyl group having a phenyl group substituted with a linear or branched alkyl group. However, not all of X ₁ to X ₈ are hydrogen atoms. R ₁ to R ₄ each independently represent a hydrogen atom or a linear or branched alkyl group, and M is two hydrogen atoms, a divalent metal atom, a trivalent substituted metal atom, or a tetravalent substituted metal represents an atom, a metal hydroxide atom, or a metal oxide atom. ]
[3]
In the curable sealing material according to [1] or [2] above,
When a cured product sheet having a thickness of 10 μm is produced by curing the curable encapsulant,
A curable encapsulant, wherein the cured sheet has an average light transmittance of 80% or more in the range of 400 nm or more and 800 nm or less.
[4]
In the curable sealing material according to any one of [1] to [3] above,
When a cured product sheet having a thickness of 10 μm is produced by curing the curable encapsulant,
A curable encapsulant having a light transmittance of 30% or more at an absorption maximum wavelength in the range of 450 nm or more and 500 nm or less.
[5]
In the curable sealing material according to any one of [1] to [4] above,
A curable encapsulant in which the compound (P) contains a porphyrin-based compound represented by the following general formula (A-1) or (A-2).

[6]
In the curable sealing material according to any one of [1] to [5] above,
A curable encapsulant that is a light-emitting element encapsulant.
[7]
In the curable sealing material according to any one of [1] to [6] above,
A curable encapsulant further comprising one or more curable compounds selected from the group consisting of thermosetting resins, thermosetting compounds, photocurable resins and photocurable compounds.
[8]
In the curable sealing material according to [7] above,
A curable encapsulant having a content of the compound (P) of 0.0001 part by mass or less than 10 parts by mass when the curable compound contained in the curable encapsulant is 100 parts by mass.
[9]
In the curable sealing material according to any one of [1] to [8] above,
A curable encapsulant further comprising a curing agent.
[10]
A cured product obtained by curing the curable sealing material according to any one of [1] to [9] above.
[11]
A light emitting element and a sealing layer for sealing the light emitting element,
A display device in which the sealing layer contains the cured product of [10] above.
[12]
In the display device according to [11] above,
A display device that is an organic EL display device or a liquid crystal display device.

ADVANTAGE OF THE INVENTION According to this invention, while being able to improve the color purity of a display apparatus, the curable sealing material which can simplify the structure of a display apparatus can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows an example of the display apparatus of embodiment which concerns on this invention.

An embodiment of the present invention will be described below with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. In addition, each component in the drawings schematically shows the shape, size, and arrangement relationship to the extent that the present invention can be understood, and is different from the actual size. In addition, "A to B" indicating a numerical range represents A or more and B or less unless otherwise specified.

<Curable sealing material>
The curable sealing material according to this embodiment contains a compound (P) having a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less. The curable encapsulant according to the present embodiment is a thermosetting encapsulant that is cured by application of heat or a photocurable encapsulant that is cured by irradiation with light.
The compound (P) contained in the curable sealing material according to this embodiment has a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less. Therefore, by using the cured product of the curable encapsulant according to the present embodiment containing such a compound (P) for the encapsulation layer for encapsulating the light emitting element, the Extra light around 480 nm can be cut efficiently. As a result, the green portion of visible light can be reproduced accurately, and the color purity of the display device can be improved.
Furthermore, by using the cured product of the curable sealing material according to the present embodiment as a sealing layer for sealing the light emitting element, an optical filter for cutting excess light around 480 nm from the display device. can be removed, and as a result, the configuration of the display device can be simplified.
As described above, according to the curable encapsulant according to the present embodiment, it is possible to provide a curable encapsulant that can improve the color purity of the display device and simplify the configuration of the display device.
In addition, light with a wavelength of 482 nm acts on photoreceptors in the eye, promotes pupillary light reflection, and constricts the pupil, which is considered to be harmful to the eye. Therefore, by using the cured product of the curable encapsulant according to the present embodiment for the encapsulating layer, light centered at a wavelength of 482 nm can be cut, so that light harmful to the eyes can be removed from the display device. is also possible. Furthermore, by cutting unnecessary wavelengths, it is also possible to adjust the brightness of the display device.

(Compound (P))
The compound (P) contained in the curable sealing material according to the present embodiment is not particularly limited as long as it is a compound having a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less. and more preferably an organic dye having a maximum absorption wavelength in the range of 475 nm to 485 nm. Preferred organic dyes include porphyrin compounds.

The compound (P) according to this embodiment is preferably a porphyrin-based compound represented by the following general formula (A).

In the formula, X ₁ to X ₈ each independently represent a hydrogen atom, a linear or branched alkyl group, or a substituted or unsubstituted ethynyl group. However, not all of X ₁ to X ₈ are hydrogen atoms. R ₁ to R ₄ each independently represent a hydrogen atom or a linear or branched alkyl group, and M is two hydrogen atoms, a divalent metal atom, a trivalent substituted metal atom, or a tetravalent substituted metal atom , represents a metal hydroxide atom or a metal oxide atom.

Here, the substituent of the substituted ethynyl group includes an alkyl group and a substituted or unsubstituted phenyl group.
In general formula (A), X ₁ to X ₈ are preferably each independently a hydrogen atom, a linear or branched alkyl group having 1 to 12 carbon atoms, or a linear or branched alkyl group having 1 to 12 carbon atoms. A substituted ethynyl group, an ethynyl group having a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, or an ethynyl group having an unsubstituted phenyl group. However, not all of X ₁ to X ₈ are hydrogen atoms.

R ₁ to R ₄ are preferably each independently a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms.
Also, M is preferably Cu, Zn, Fe, Co, Ni, Pt, Pd, Mn, Mg, Mn(OH), Mn(OH) ₂ , VO, or TiO.

More preferably, each of X ₁ to X ₈ is independently a hydrogen atom, a linear or branched alkyl group having 1 to 8 carbon atoms, or an ethynyl group substituted with a linear or branched alkyl group having 1 to 8 carbon atoms. , or an ethynyl group having a phenyl group substituted with a linear or branched alkyl group having 1 to 6 carbon atoms.
Further, M is more preferably Cu, Pt, Pd, Ni or VO, more preferably Ni or Pd.
Specific examples of X ₁ to X ₈ are described below.

When X ₁ to X ₈ are linear or branched alkyl groups, the linear or branched alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert -butyl group, n-pentyl group, isopentyl group, neopentyl group, tert-pentyl group, 1,2-dimethylpropyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 2-methylpentyl group, 4 -methylpentyl group, 4-methyl-2-pentyl group, 1,2-dimethylbutyl group, 2,3-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, 3-methylhexyl group, 5-methylhexyl group, 2,4-dimethylpentyl group, n-octyl group, tert-octyl group, 2-ethylhexyl group, 2-propylpentyl group, 2,5-dimethylhexyl group and the like.
Among these, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, isopentyl group, neopentyl group, 1,2-dimethylpropyl group, 1-methylbutyl group, n-hexyl group, 1,2-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, n-octyl group and 2-ethylhexyl group are preferred, methyl group, ethyl group and n-propyl group , isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, isopentyl group, n-hexyl group, 1,2-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, n- An octyl group is more preferred.

When X ₁ to X ₈ are substituted ethynyl groups, the substituted ethynyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group and n-pentyl group. , isopentyl group, neopentyl group, tert-pentyl group, 1,2-dimethylpropyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 2-methylpentyl group, 4-methylpentyl group, 4-methyl -2-pentyl group, 1,2-dimethylbutyl group, 2,3-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, 3-methylhexyl group, 5-methylhexyl group, 2,4-dimethylpentyl ethynyl group having a linear or branched alkyl group as a substituent such as a group, n-octyl group, tert-octyl group, 2-ethylhexyl group, 2-propylpentyl group, 2,5-dimethylhexyl group; unsubstituted Ethynyl group having a phenyl group as a substituent; 2-methylphenyl group, 4-methylphenyl group, 3-ethylphenyl group, 4-n-propylphenyl group, 4-n-butylphenyl group, 4-isobutylphenyl group, Direct groups such as 4-tert-butylphenyl group, 4-n-pentylphenyl group, 4-tert-pentylphenyl group, 4-n-hexylphenyl group, 4-n-octylphenyl group and 4-n-nonylphenyl group an ethynyl group having, as a substituent, a phenyl group substituted with a chain or branched alkyl group; and the like.
Among these, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, isopentyl group, n-hexyl group, 1,2-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, ethynyl group having a linear or branched alkyl group such as n-octyl group as a substituent; ethynyl group having a phenyl group as a substituent; 2-methylphenyl group, 4 -methylphenyl group, 3-ethylphenyl group, 4-n-propylphenyl group, 4-n-butylphenyl group, 4-isobutylphenyl group, 4-tert-butylphenyl group, 4-n-pentylphenyl group, 4 An ethynyl group having, as a substituent, a phenyl group substituted with a linear or branched alkyl group such as a -tert-pentylphenyl group is more preferable.

When R ₁ to R ₄ are linear or branched alkyl groups, the linear or branched alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert -butyl group, n-pentyl group, isopentyl group, neopentyl group, tert-pentyl group, 1,2-dimethylpropyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 2-methylpentyl group, 4 -methylpentyl group, 4-methyl-2-pentyl group, 1,2-dimethylbutyl group, 2,3-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, 3-methylhexyl group, 5-methylhexyl group, 2,4-dimethylpentyl group, n-octyl group, tert-octyl group, 2-ethylhexyl group, 2-propylpentyl group, 2,5-dimethylhexyl group and the like.
Among these, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, isopentyl group, neopentyl group, 1,2-dimethylpropyl group, 1-methylbutyl group, n-hexyl group, 1,2-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, n-octyl group and 2-ethylhexyl group are preferred, methyl group, ethyl group and n-propyl group , isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, isopentyl group, n-hexyl group, 1,2-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, n- An octyl group is more preferred.

As the compound (P) according to this embodiment, a porphyrin-based compound represented by the following general formula (A-1) or (A-2) is more preferable.

Since such a porphyrin-based compound used in the curable sealing material according to the present embodiment has a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less, the curable sealing material according to the present embodiment containing such a porphyrin-based compound By using the cured product of the encapsulant for the encapsulating layer, excess light around 480 nm generated from the light-emitting element in the display device can be efficiently cut off. As a result, the green portion of visible light can be reproduced accurately, and the color purity of the display device can be improved.

The porphyrin-based compound used in the curable encapsulant according to the present embodiment can be produced with reference to a method known per se. That is, the compound represented by the general formula (A) includes, for example, compounds represented by the general formulas (B-1) to (B-4) and general formulas (C-1) to general formulas (C- 4) is subjected to a dehydration condensation reaction and oxidation (for example, 2,3-dichloro-5,6-dicyano -1,4-benzoquinone), synthesized by the so-called Rothermunt reaction, and optionally can be produced by reacting a metal or a metal salt (eg, an acetylacetone complex, a metal acetate) in an appropriate solvent.

In the formula, X ₁ to X ₈ and R ₁ to R ₄ have the same meanings as in general formula (A).
In the present embodiment, the porphyrin-based compound represented by general formula (A) actually represents a mixture of one or more isomers. Even when describing the structure of such a mixture consisting of a plurality of isomers, in the present embodiment, for convenience, one structural formula represented by general formula (A), for example, is described.

In the curable sealant according to this embodiment, the porphyrin-based compound according to this embodiment can be used as a mixture of one kind or two or more isomers. Moreover, if desired, each isomer can be separated from the mixture and one compound among the isomers can be used. The porphyrin-based compound according to the present embodiment includes not only crystals but also amorphous forms.

In the curable encapsulant according to the present embodiment, one type of porphyrin-based compound may be used alone, or two or more types may be used in combination.

(sealant)
The curable sealing material according to this embodiment is a composition for forming a sealing layer for sealing a light-emitting element in a display device provided with the light-emitting element.

It is preferable that the curable encapsulant according to the present embodiment further contains a curable compound.
As the curable compound, known resins and curable compounds used in curable encapsulants can be used. Examples of such curable compounds include thermosetting resins, thermosetting compounds, photocurable resins and photocurable compounds.

Curing resins such as thermosetting resins and photo-curing resins can be used as resins contained in the curable sealing material according to the present embodiment.

The curable resin (thermosetting resin and/or photocurable resin) is not particularly limited, but examples include epoxy resin, oxetane resin, phenol resin, silicone resin, urethane resin, polyimide resin, urea resin, melamine resin, Examples include saturated polyester resins and resins having (meth)acryloyloxy groups, preferably epoxy resins, oxetane resins, resins having (meth)acryloyloxy groups, phenolic resins and melamine resins, and more preferably epoxy resins. be. These curable resins may be used singly or in combination of two or more.

Examples of epoxy resins include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol S type epoxy resin; novolac type epoxy resins such as phenol novolak type epoxy resin and cresol novolak type epoxy resin; Nitrogen-containing ring type epoxy resins such as glycidyl isocyanurate type and hydantoin type; naphthalene type epoxy resin; biphenyl type epoxy resin; glycidyl ether type epoxy resin; dicyclo type epoxy resin; ester type epoxy resin; Novolac type epoxy resins; alicyclic epoxy resins (such as celoxide from Daicel); aliphatic epoxy resins; modified products or hydrogenated products thereof.
Examples of the oxetane resin include Aron oxetane manufactured by Toagosei Co., Ltd., and the like.

As the phenol resin, for example, phenol novolak resin, phenol aralkyl resin, biphenyl aralkyl resin, dicyclopentadiene type phenol resin, cresol novolac resin, resol resin, and the like are used.

Examples of resins having a (meth)acryloyloxy group include (meth)acrylic acid esters and those having a (meth)acryloyl group in the molecule by modifying a reactive functional group. Among these, (meth)acrylic acid esters are preferable from the viewpoint that polymerization or cross-linking proceeds rapidly with active radicals generated by irradiation with ultraviolet rays. In addition, in this embodiment, (meth)acrylic acid means acrylic acid or methacrylic acid.
Examples of the (meth)acrylic acid ester include an ester compound obtained by reacting (meth)acrylic acid with a compound having a hydroxyl group, an epoxy obtained by reacting (meth)acrylic acid with an epoxy compound ( Urethane (meth)acrylate obtained by reacting a (meth)acrylic acid derivative having a hydroxyl group with meth)acrylate, and isocyanate.
Examples of (meth)acrylic esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tertiary butyl (meth)acrylate, isoamyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cetyl (meth)acrylate, decyl (meth)acrylate, isodecyl Linear or branched alkyl (meth)acrylates such as (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, isomyristyl (meth)acrylate, stearyl (meth)acrylate, and isostearyl (meth)acrylate; Cyclic alkyl (meth)acrylates such as cyclohexyl (meth)acrylate, tertiarybutylcyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and isobornyl (meth)acrylate; (Meth)acrylates having a heterocyclic ring such as furyl (meth)acrylate and 3-methyl-3-oxetanyl (meth)acrylate; phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenyl diethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol-polypropylene glycol-(meth) acrylate, nonylphenol ethylene oxide adduct (meth) acrylate, etc. (Meth)acrylates having an aromatic ring; 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3 - (meth)acrylates having an alkyloxysilyl group such as acryloxypropyltrimethoxysilane; trifluoroethyl (meth)acrylate, octafluoropentyl (meth)acrylate, perfluorooctylethyl (meth)acrylate, and tetra fluoroalkyl (meth)acrylates such as fluoropropyl (meth)acrylate; and the like.
Epoxy (meth)acrylates include, for example, bisphenol A, bisphenol F, bisphenol S, bisphenols such as tetrabromobisphenol A, or bisphenol type epoxy resins obtained by the condensation reaction of hydrogenated products thereof with epichlorohydrin, and polypropylene. Polyepoxy resins such as alkanediol-based polyepoxy resins obtained by the condensation reaction of alkanediols such as glycol and polybutylene glycol with epichlorohydrin and epoxy poly(meth)acrylates obtained by reacting (meth)acrylic acid can be mentioned. .
As the urethane (meth)acrylate, an organic diisocyanate compound is reacted with a hydroxy group-containing (meth)acrylate having at least two (meth)acryloyloxy groups and one hydroxy group in the molecule (meth)acrylate. ) Acrylates; alkane diols, polyether diols, polybutadiene diols, polyester diols, polycarbonate diols, amide diols, spiroglycol compounds, and other alcohols. , a urethane (meth)acrylate resin obtained by reacting a hydroxyl group-containing (meth)acrylate having two (meth)acryloyloxy groups and one hydroxyl group in the molecule.

Curing agents such as thermosetting agents, thermal radical initiators, and photopolymerization initiators can be added to the curable resin.
Such heat curing agents, thermal radical initiators, and photopolymerization initiators are not particularly limited. Examples of photopolymerization initiators include polymerization initiators (UV radical initiators, UV cationic initiators) that generate radicals or ions when irradiated with light such as ultraviolet rays.

These resins can be used individually by 1 type, respectively, and can also be used in combination of 2 or more types.
Definitions and manufacturing methods of these thermosetting resins and photocurable resins are well known, and can be found in publications such as "Encyclopedia of Practical Plastics" (edited by the Editorial Committee of Practical Plastics, published by Sangyo Research Institute Co., Ltd.). Have been described. The term "resin" used herein may be either soft or hard, and is not particularly limited.

The curable compounds (thermosetting compounds and/or photocurable compounds) contained in the curable encapsulant according to the present embodiment include polyiso(thio)cyanate compounds, bifunctional or higher active hydrogen compounds, poly(meth ) acrylic acid esters and the like.

The polyiso(thio)cyanate compound is a compound having a total of two or more isocyanate groups or isothiocyanate groups. isocyanatomethyl)norbornane, bis(isocyanatocyclohexyl)methane, bis(isocyanatomethylthio)methane, bis(isocyanatomethyl)disulfide, dithiolane diisocyanate, isophorone diisothiocyanate, bis(isothiocyanatomethyl)cyclohexane, bis(isothio cyanatomethyl)norbornane, bis(isothiocyanatocyclohexyl)methane, tris(isocyanatopentyl)isocyanurate, tris(isocyanatohexyl)isocyanurate and the like.

Examples of bifunctional or higher active hydrogen compounds include compounds having two or more functional groups selected from a hydroxy group, a mercapto group, and an amino group. Examples include ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, Bifunctional or higher active hydrogen compounds having hydroxyl groups such as glycerin, polyglycerin, thioglycerin; trithioglycerin, pentaerythritol tetrakis (thioglycolate), trimethylolpropane (3-mercaptopropionate), pentaerythritol tetrakis 3-mercaptopropionate), dipentaerythritol hexa(3-mercaptopropionate), bis(2-mercaptoethyl) sulfide, 4-mercaptomethyl-3,6-dithiaoctane-1,8-dithiol, 4,8 -bis(mercaptomethyl)-3,6,9-trithiundecane-1,11-dithiol, 4,7-bis(mercaptomethyl)-3,6,9-trithiundecane-1,11-dithiol, 5 ,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 1,1,3,3-tetrakis(mercaptomethyl)-2-thiapropane, 1,4-dithiane-2 ,5-dithiol, 2,5-bis(mercaptomethyl)-1,4-dithiane, xylylenedithiol, and other difunctional or higher active hydrogen compounds having a mercapto group; xylylenediamine, α, α, α', α '-Tetramethyl-xylylenediamine, 1,5-diaminopentane, 1,6-diaminohexane, diaminopolypropylene, diaminopolyethylene, isophoronediamine, bis(aminocyclohexyl)methane, bis(aminomethyl)cyclohexane, bis(aminomethyl) ) Bifunctional or higher active hydrogen compounds having an amino group such as norbornane.

Examples of poly(meth)acrylic acid esters include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di( meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate ) acrylate, 1,6-hexanediol di(meth)acrylate, pentaerythritol di(meth)acrylate, glycerin di(meth)acrylate and other aliphatic di(meth)acrylates; 2,2-bis[4-(meth) ) acryloyloxyphenyl]propane, 2,2-bis[4-(meth)acryloyloxyethoxyphenyl]propane, 2,2-bis[4-(meth)acryloyloxydiethoxyphenyl]propane, 2,2-bis[ 4-(meth)acryloyloxypropyloxyphenyl]propane, 2,2-bis[4-(meth)acryloyloxydipropyloxyphenyl]propane, 2,2-bis[4-(meth)acryloyloxypolyethoxyphenyl] Aromatics such as propane, 2,2-bis[4-(meth)acryloyloxypolypropyloxyphenyl]propane, 2,2-bis[4-(meth)acryloyloxy(2′-hydroxypropyloxy)phenyl]propane Containing type di (meth) acrylate; tri (meth) acrylate such as trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, glycerin tri (meth) acrylate; pentaerythritol tetra (meth) acrylate derivative and di Examples include polyfunctional (meth)acrylates substituted with four or more (meth)acrylic groups such as pentaerythritol penta(meth)acrylate.

The content of the compound (P) in the curable encapsulant according to the present embodiment is around 480 nm generated in a display device when the curable compound contained in the curable encapsulant is 100 parts by mass. From the viewpoint of cutting excess light more efficiently, it is preferably 0.0001 parts by mass or more, more preferably 0.001 parts by mass or more, even more preferably 0.005 parts by mass or more, and particularly 0.01 parts by mass or more. preferable.
The content of the compound (P) in the curable encapsulant according to the present embodiment is such that the resulting encapsulating layer is transparent when the curable compound contained in the curable encapsulant is 100 parts by mass. 10 parts by mass or less is preferable, 5 parts by mass or less is more preferable, 1 part by mass or less is even more preferable, and 0.5 parts by mass or less is preferable from the viewpoint of further improving the light-emitting properties of the display device. Especially preferred.

The total content of the curable compound and the compound (P) in the curable encapsulant according to the present embodiment is preferably 50% by mass or more, more preferably 100% by mass of the entire curable encapsulant. is 70% by mass or more, more preferably 80% by mass or more, and particularly preferably 90% by mass or more.

If desired, various additives can be added to the curable encapsulant according to the present embodiment. Examples of additives include organic fillers, inorganic fillers, catalysts, ultraviolet polymerization initiators, thermal polymerization initiators, internal release agents, antistatic agents, ultraviolet absorbers, antioxidants, photochromic agents, and thermochromic agents. , pigments, dyes, pigments, leveling agents, surfactants, plasticizers, curing accelerators, silane coupling agents and the like.

The curable encapsulant according to the present embodiment is cured from the viewpoint of improving the transparency of the resulting encapsulating layer and further improving the luminescence and brightness of the display device. The average light transmittance in the range of 400 nm or more and 800 nm or less of the 10 μm thick cured sheet obtained by the above is preferably 80% or more, more preferably 85% or more, and 90% or more. is more preferred.
Here, the cured product sheet obtained by curing the curable encapsulant can be obtained, for example, by heating the curable encapsulant according to the present embodiment or by irradiating light such as ultraviolet rays. can be done. The heating conditions and light irradiation conditions for curing the curable encapsulant are not particularly limited because they are appropriately selected depending on the type of the curable compound constituting the curable encapsulant, and can be appropriately selected from known information. . In the present embodiment, it is not necessary to completely cure the curable encapsulant, and for example, a cured product can be defined as having a reaction rate of 80% or higher, as described in Examples below.

The curable sealing material according to the present embodiment is obtained by curing the curable sealing material from the viewpoint of improving the transparency of the obtained sealing layer and further improving the luminescence property of the display device. The resulting cured sheet having a thickness of 10 μm preferably has a light transmittance of 30% or more, more preferably 40% or more, at an absorption maximum wavelength in the range of 450 nm to 500 nm.
Here, the cured product sheet obtained by curing the curable encapsulant can be obtained, for example, by heating the curable encapsulant according to the present embodiment or by irradiating light such as ultraviolet rays. can be done. The heating conditions and light irradiation conditions for curing the curable encapsulant are not particularly limited because they are appropriately selected depending on the type of the curable compound constituting the curable encapsulant, and can be appropriately selected from known information. . In the present embodiment, it is not necessary to completely cure the curable encapsulant, and for example, a cured product can be defined as having a reaction rate of 80% or higher, as described in Examples below.

Although the form of the curable encapsulant according to the present embodiment is not particularly limited, a liquid form or a sheet form is preferable from the viewpoint of excellent handleability and workability.

<Display device>
The display device according to this embodiment includes a light-emitting element and a sealing layer for sealing the light-emitting element, and the sealing layer is cured by curing the curable sealing material according to this embodiment. Including the thing (Q).

The present inventors have made intensive studies to improve color purity and provide a display device with a simple configuration. It has been found that the color purity of the display device can be improved and the configuration of the display device can be simplified by using the sealing material as a sealing material for sealing the light emitting element.
Since the compound (P) has a maximum absorption wavelength in the range of 450 nm or more and 500 nm or less, the sealing layer made of the cured product (Q) of the curable sealing material according to the present embodiment containing such a compound (P) is , it is possible to efficiently cut extra light in the vicinity of 480 nm generated from the light emitting element in the display device. Therefore, by providing the sealing layer made of the cured product (Q) of the curable sealing material according to the present embodiment, when the light from the light emitting element is transmitted through the sealing layer, the sealing layer containing the compound (P) can be obtained. The stop layer can effectively cut excess light around a wavelength of 480 nm, accurately reproduce the green portion of visible light, and improve the color purity of the display device.
Furthermore, by providing a sealing layer made of the cured product (Q) of the curable sealing material according to the present embodiment, an optical filter for cutting excess light around 480 nm can be removed from the display device. As a result, the configuration of the display device can be simplified.

Although the display device according to the present embodiment is not particularly limited, examples thereof include an organic EL display device and a liquid crystal display device.
In addition, since the curable sealing material according to the present embodiment is curable, it has excellent adhesiveness between the light emitting element and the sealing layer. Therefore, the curable encapsulant according to the present embodiment can be suitably used for a display device such as a bendable display that can be repeatedly bent and a rollable display that can be rolled up, where a large stress is applied to the device. .
That is, the display device according to the present embodiment includes devices such as a bendable display that can be repeatedly bent and a rollable display that can be wound up.

The configuration of the display device according to this embodiment is not particularly limited as long as the light emitting element is sealed with a sealing layer containing the cured product (Q), and a known configuration can be adopted. An organic EL display device will be described below as an example.

FIG. 1 is a cross-sectional view showing an example of a display device 100 according to an embodiment of the invention.
The display device 100 shown in FIG. 1 is an organic EL display device, and includes, for example, a barrier layer 21 (which may be the touch panel layer 21 or the surface protective layer 21), an overcoat layer 22 (the sealing layer 22 or a barrier layer). layer 22), a sealing layer 23, a barrier layer 24, and the like.
For example, the display device 100 shown in FIG. 23, the overcoat layer 22 provided on the base material layer 50 so as to cover the sealing layer 23 and the barrier layer 24, and the overcoat layer 22 provided on the and a barrier layer 21 .
A specific configuration of each layer is not particularly limited, and an appropriate configuration can be adopted based on generally known information. Moreover, such a display device 100 can be manufactured based on generally known information.

Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be employed within the scope that does not impair the effects of the present invention.

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these. Materials and evaluation methods used in the examples are as follows.

[Example 1]
In a flask, 150 parts by weight of YX8000 (manufactured by Mitsubishi Chemical Corporation; hydrogenated bisphenol A type epoxy resin), 200 parts by weight of jER1004 (manufactured by Mitsubishi Chemical Corporation; bisphenol A type solid epoxy resin), and 150 parts by weight of jER1256 ( A phenoxy resin manufactured by Mitsubishi Chemical Co., Ltd.) was added, and 500 parts by mass of methyl ethyl ketone was added thereto and dissolved with stirring at room temperature to obtain a resin solution.
100 parts by mass of this resin solution was placed in a separately prepared flask, and 0.025 parts by mass of the porphyrin compound (A-1) represented by the above general formula (A-1) and 1 part by mass of CXC-1612 ( Kusumoto Kasei Co., Ltd.; thermal cationic polymerization initiator) and 0.5 parts by mass of KBM-403 (Shin-Etsu Chemical Co., Ltd.; silane coupling agent) are added to the flask and stirred at room temperature to remove the varnish. prepared.
Here, the porphyrin-based compound (A-1) represented by the general formula (A-1) was synthesized according to Synthesis Example 1 described in paragraphs 0111 to 0115 of WO 2015/037627.

The prepared varnish was applied to a substrate film (release-treated PET film, A53, manufactured by Teijin Film Solutions Co., Ltd., thickness 50 μm) using a coating machine with an applicator so that the thickness after drying was about 20 μm. . This film was dried in an inert oven at 90° C. for 3 minutes to remove the methyl ethyl ketone in the varnish coating film by drying to form a layer of the sheet-like epoxy resin composition on the substrate film. Furthermore, a protective film (release-treated PET film, A31, manufactured by Teijin Film Solutions Ltd., thickness 38 μm) was thermocompression bonded at 70° C. to obtain a sealing sheet. In addition, the protective film was appropriately peeled off to expose the surface of the layer composed of the sheet-like epoxy resin composition.

[Example 2]
In a flask, 150 parts by mass of YL983U (manufactured by Mitsubishi Chemical Corporation; bisphenol F type epoxy resin), 200 parts by mass of jER1004, and 150 parts by mass of jER1256 are added, 500 parts by mass of methyl ethyl ketone are added, The resin solution was prepared by stirring and dissolving at room temperature.
100 parts by mass of this resin solution was placed in a separately prepared flask, and 0.025 parts by mass of porphyrin compound (A-1) and 0.5 parts by mass of 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.; epoxy resin curing agent) were added. and 0.5 parts by mass of KBM-403 were added to the flask and stirred at room temperature to prepare a varnish. A sealing sheet having a layer of the sheet-like epoxy resin composition was obtained in the same manner as in Example 1, except that this varnish was used.

[Example 3]
In a flask, 100 parts by mass of CEL2021P (manufactured by Daicel; alicyclic epoxy resin), 125 parts by mass of Epolite 40E (manufactured by Kyoeisha Chemical Co., Ltd.; linear aliphatic epoxy resin), and 275 parts by mass of OXT221 (Toa Gosei company; oxetane resin) was added, and mixed and stirred at room temperature to obtain a resin solution.
100 parts by mass of this resin liquid was placed in a separately prepared flask, and 0.05 parts by mass of the porphyrin compound (A-1), 1 part by mass of CPI210S (manufactured by San-Apro Co.; 5 parts by mass of UVS-1331 (manufactured by Kawasaki Kasei Co., Ltd.: photocationic sensitizer) and 1 part by mass of KBM-403 were added to the flask and stirred at room temperature to prepare a sealant composition. .

[Example 4]
In a flask, 50 parts by mass of light acrylate PO-A (manufactured by Kyoeisha Chemical Co., Ltd.; phenoxyethyl acrylate), 450 parts by mass of light acrylate 3EG-A (manufactured by Kyoeisha Chemical Co., Ltd.; aliphatic acrylate), and 0.5 parts by mass of MEHQ (polymerization inhibitor) was added, and mixed and stirred at room temperature to obtain a resin solution.
100 parts by mass of this resin liquid was placed in a separately prepared flask, and 0.05 parts by mass of the porphyrin compound (A-1) and 5 parts by mass of the radical polymerization initiator IRGACURE_TPO (manufactured by BASF Japan; UV radical initiator ) and 1 part by mass of KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.; silane coupling agent) were added to the flask and stirred at room temperature to prepare a sealant composition.

[Comparative Example 1]
A varnish was prepared in the same manner as in Example 1 except that 100 parts by mass of the resin solution prepared in Example 1 was placed in a separately prepared flask and the composition ratio (mass ratio) shown in Table 1 was changed. A sealing sheet having a layer of the sheet-like epoxy resin composition was obtained in the same manner as in Example 1, except that this varnish was used.

[Comparative Example 2]
A varnish was prepared in the same manner as in Example 2 except that 100 parts by mass of the resin solution prepared in Example 2 was placed in a separately prepared flask and the composition ratio (mass ratio) shown in Table 1 was changed. A sealing sheet having a layer of the sheet-like epoxy resin composition was obtained in the same manner as in Example 2, except that this varnish was used.

[Comparative Example 3]
A sealant composition was prepared in the same manner as in Example 3 except that 100 parts by mass of the resin liquid prepared in Example 3 was placed in a separately prepared flask and the composition ratio (mass ratio) was changed to that shown in Table 1. .

[Comparative Example 4]
A sealant composition was prepared in the same manner as in Example 4 except that 100 parts by mass of the resin liquid prepared in Example 4 was placed in a separately prepared flask and the composition ratio (mass ratio) shown in Table 1 was changed. .

<Evaluation method>
Evaluations performed in Examples 1 to 4 and Comparative Examples 1 to 4 are as follows. Table 2 shows the results obtained.

[Average transmittance]
1) The sealing sheets obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were cut into pieces having a length of about 60 mm and a width of about 40 mm to obtain test pieces. A layer composed of the sheet-like epoxy resin composition of the obtained test piece was placed on a glass plate (Matsunami Glass No. 3, thickness 0.3 mm, 70 mm x 50 mm) heated on a hot plate heated to 70°C. It was transferred and pasted with a roll so as not to enter. The test piece was removed from the hot plate and allowed to cool for 3 minutes. Thereafter, the base film was peeled off, and the sheet-like epoxy resin composition on the glass plate was heated in an oven at 100° C. for 120 minutes to obtain a cured product. The light transmittance at a wavelength of 400 nm to 800 nm of the glass plate on which the cured product of the sheet-like epoxy resin composition is formed is measured using an ultraviolet-visible light spectrophotometer (Shimadzu Corporation, UV-2550). The average transmittance (in steps of 1 nm) was calculated. In the measurement, the light transmittance of the glass plate alone was used as a baseline.

2) The sealing material compositions obtained in Examples 3 and 4 and Comparative Examples 3 and 4 were applied to a glass plate (Matsunami Glass No. 3, thickness 0.3 mm, 70 mm × 50 mm) so as to have a thickness of 10 μm. were applied by an ink-jet device to obtain test pieces. Next, the obtained test piece is irradiated with ultraviolet rays having a wavelength of 395 nm at an irradiation intensity of 1000 mW/cm ² for 1.5 seconds in a nitrogen atmosphere to UV-cure the test piece to obtain a cured product. rice field. The light transmittance at a wavelength of 400 to 800 nm of the glass plate on which the cured product of the epoxy resin composition was formed was measured using an ultraviolet-visible light spectrophotometer (Shimadzu Corporation, UV-2550). In the measurement, the light transmittance of the glass plate alone was used as a baseline.

[Curability]
1) Epoxy reaction rate (DSC method)
A 10 mg sample was taken from the sealing sheets obtained in Examples 1 and 2 and Comparative Examples 1 and 2, and packed in an aluminum cell for DSC measurement to prepare a measurement test sample. Then, the calorific value of the uncured product was measured by DSC at a heating rate of 5°C/min and a measurement temperature range of 20°C to 300°C.
A measurement sample was prepared in the same manner as the uncured product. Curing was performed in an oven preliminarily set at 100° C., and the measurement sample was taken out 120 minutes after the introduction of the sample. Then, the calorific value of the cured product was measured by DSC at a heating rate of 5°C/min and a measurement temperature range of 20°C to 300°C. Then, from the measured calorific value, the epoxy reaction rate (%) at a curing temperature of 100° C. was obtained from the following formula.
Reaction rate (%) = (calorific value of uncured product - calorific value of cured product) / calorific value of uncured product x 100

2) Epoxy reaction rate (FT-IR method)
The encapsulant compositions obtained in Example 3 and Comparative Example 3 were applied to a glass plate (Matsunami Glass No. 3, thickness 0.3 mm, 70 mm x 50 mm) with an inkjet device so as to have a thickness of 10 µm. Then, a test piece was obtained. Next, the obtained test piece is irradiated with ultraviolet rays having a wavelength of 395 nm at an irradiation intensity of 1000 mW/cm ² for 1.5 seconds in a nitrogen atmosphere to UV-cure the test piece to obtain a cured product. rice field. The IR spectra of the cured product and the uncured product were measured by ATR (FT/IR-6600, manufactured by JASCO Corp.).
With the standard peak at 1732 cm ⁻¹ and the reaction peaks at 980 cm ⁻¹ , 910 cm ⁻¹ and 830 cm ⁻¹ , the epoxy reaction rate (%) in UV curing was obtained from the following equation.
Reaction rate (%) = [1-(reaction peak intensity after UV curing/standard peak intensity after UV curing)/(reaction peak intensity before UV curing/standard peak intensity before UV curing)] × 100

3) Acrylic reaction rate (FT-IR method)
The sealing material compositions obtained in Example 4 and Comparative Example 4 were applied to a glass plate (Matsunami Glass No. 3, thickness 0.3 mm, 70 mm × 50 mm) by an inkjet device so as to have a thickness of 10 µm. Then, a test piece was obtained. Next, the obtained test piece is irradiated with ultraviolet rays having a wavelength of 395 nm at an irradiation intensity of 1000 mW/cm ² for 1.5 seconds in a nitrogen atmosphere to UV-cure the test piece to obtain a cured product. rice field. The IR spectra of the cured product and the uncured product were measured by ATR (FT/IR-6600, manufactured by JASCO Corp.).
Taking the standard peak as 1725 cm ⁻¹ and the reaction peak as 1637 cm ⁻¹ , the acryl reaction rate (%) in UV curing was obtained from the following formula.
Reaction rate (%) = [1-(reaction peak intensity after UV curing/standard peak intensity after UV curing)/(reaction peak intensity before UV curing/standard peak intensity before UV curing)] × 100

[Adhesion]
1) Adhesion evaluation A: Aluminum-PET composite film (aluminum surface)/resin/alkali glass Spring-type balance (for weighing 1 kg) was used to measure the 90-degree peel strength between the aluminum surface and the cured product of the encapsulating sheet composition. did. In Examples 1 and 2 and Comparative Examples 1 and 2, this 90-degree peel strength was defined as adhesive strength.

2) Adhesion evaluation B: Nichiban tape (CT-24) / resin / SiNx deposition substrate peeling tester (device name: STOROGRAPH-ES, peeling speed 300 mm / min) SiNx deposition substrate and sealing material composition The 180-degree peel strength with the cured product was measured. In Examples 3 and 4 and Comparative Examples 3 and 4, this 180-degree peel strength was defined as the adhesive strength.

10 Light emitting element 21 Barrier layer, touch panel layer or surface protective layer 22 Overcoat layer, sealing layer or barrier layer 23 Sealing layer 24 Barrier layer 50 Base material layer 100 Display device

Claims (11)

including a compound (P) having an absorption maximum wavelength in the range of 450 nm or more and 500 nm or less,
A curable encapsulant that is a light-emitting element encapsulant . In the curable sealing material according to claim 1,
A curable encapsulant in which the compound (P) contains a porphyrin-based compound represented by the following general formula (A).

[In the formula, X ₁ to X ₈ are each independently a hydrogen atom, a linear or branched alkyl group, an ethynyl group, an ethynyl group substituted with a linear or branched alkyl group, an ethynyl group having a phenyl group, or , represents an ethynyl group having a phenyl group substituted with a linear or branched alkyl group. However, not all of X ₁ to X ₈ are hydrogen atoms. R ₁ to R ₄ each independently represent a hydrogen atom or a linear or branched alkyl group, and M is two hydrogen atoms, a divalent metal atom, a trivalent substituted metal atom, or a tetravalent substituted metal represents an atom, a metal hydroxide atom, or a metal oxide atom. ] In the curable sealing material according to claim 1 or 2,
When a cured product sheet having a thickness of 10 μm is produced by curing the curable encapsulant,
A curable encapsulant, wherein the cured sheet has an average light transmittance of 80% or more in the range of 400 nm or more and 800 nm or less. In the curable sealing material according to any one of claims 1 to 3,
When a cured product sheet having a thickness of 10 μm is produced by curing the curable encapsulant,
A curable encapsulant having a light transmittance of 30% or more at an absorption maximum wavelength in the range of 450 nm or more and 500 nm or less. In the curable sealing material according to any one of claims 1 to 4,
A curable encapsulant in which the compound (P) comprises a porphyrin-based compound represented by the following general formula (A-1) or (A-2).

In the curable sealing material according to any one of claims 1 to 5 ,
A curable encapsulant further comprising one or more curable compounds selected from the group consisting of thermosetting resins, thermosetting compounds, photocurable resins and photocurable compounds. In the curable sealing material according to claim 6 ,
A curable encapsulant, wherein the content of the compound (P) is 0.0001 parts by mass or more and 10 parts by mass or less when the curable compound contained in the curable encapsulant is 100 parts by mass. In the curable sealing material according to any one of claims 1 to 7 ,
A curable encapsulant further comprising a curing agent. A cured product obtained by curing the curable encapsulant according to any one of claims 1 to 8 . A light emitting element and a sealing layer for sealing the light emitting element,
A display device in which the sealing layer comprises the cured product according to claim 9 . The display device according to claim 10 ,
A display device that is an organic EL display device or a liquid crystal display device.

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