JP7174110B1 - Laminate molding system and laminate molding method using laminate molding system - Google Patents

Abstract

[Problem] To provide a laminate molding system and a laminate molding system in which at least one of the uniformity of the surface pressure distribution during pressurization by a press device, the smoothness of a laminate molded product, and the releasability at the completion of laminate molding is improved compared to the conventional one. A laminate molding method using the method is provided. SOLUTION: In a lamination molding system 1 including a vacuum lamination device 2 and a press device 3 arranged in a post-process of the vacuum lamination device 2, the press device 3 is provided with at least one of an upper platen 312 and a lower platen 314. Pressure blocks 317 and 318 attached to the board, cushioning materials 321 and 324 attached to the surfaces of the pressure blocks 317 and 318, and metal plates 322 and 325 attached to the surfaces of the cushion materials 321 and 324. At least one coating layer 323, 326 of titanium or titanium alloy, nickel or nickel alloy, metal nitride, or DLC is formed on the surface of the metal plates 322, 325. [Selection drawing] Fig. 2

Description

The present invention is a lamination molding comprising a vacuum lamination device, a press device arranged in a post-process of the vacuum lamination device, and a conveying device for conveying an intermediate laminated material laminated and formed by the vacuum lamination device to the press device. The present invention relates to a laminate molding method using a system and the laminate molding system.

A lamination molding system comprising a vacuum lamination device, a press device arranged in a post-process of the vacuum lamination device, and a transport device for transporting an intermediate laminated material laminated and formed by the vacuum lamination device to the press device, The one described in Patent Document 1 is known. In Patent Document 1, a flattening press, which is a press device, is provided in the post-process of the vacuum lamination device. In the flattening press, a cushioning material made of rubber or the like having a thickness of about 1.5 mm is attached to the surface of a polishing plate, which is a pressure block, and a stainless steel plate having a thickness of about 2 mm is attached to the surface of the cushioning material. An elastically deformable mirror plate made of, for example, is attached. During molding, the mirror plate that forms the molding surface initially elastically deforms according to the unevenness of the surface of the product, and then gradually returns to its original plane due to the elastic deformation of the cushioning material and the elastic deformation of the mirror plate. It is stated that

Japanese Patent Application Laid-Open No. 2002-120100

However, the press device of the conventional lamination molding system can sufficiently satisfy at least one of the uniformity of the surface pressure distribution during pressurization, the smoothness of the lamination molded product, and the releasability at the completion of lamination molding. In some cases, no results were obtained. Therefore, in the present invention, a laminate molding system and laminate molding that are improved in at least one of the uniformity of the surface pressure distribution at the time of pressurization by the press device, the smoothness of the laminate molded product, and the releasability at the completion of laminate molding. An object of the present invention is to provide a laminate molding method using the system.

Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

A lamination molding system according to claim 1 of the present invention comprises a vacuum lamination device, a press device arranged in a post-process of the vacuum lamination device, and an intermediate laminated material laminated and formed by the vacuum lamination device to the press device. In a laminate molding system comprising a conveying device for conveying, the press device includes a pressure block attached to at least one of the upper plate and the lower plate, a cushioning material attached to the surface of the pressure block, and a metal plate attached to the surface of the buffer material, and the surface of the metal plate is coated with at least one coating layer of titanium or titanium alloy, nickel or nickel alloy, metal nitride, or DLC. .

A lamination molding system of the present invention comprises a vacuum lamination device, a press device arranged in a post-process of the vacuum lamination device, and a conveying device for conveying an intermediate laminated material laminated and formed by the vacuum lamination device to the press device. The press device includes a pressure block attached to at least one of the upper plate and the lower plate, a cushioning material attached to the surface of the pressure block, and a cushioning material attached to the surface of the cushioning material and a metal plate mounted thereon, the surface of which is coated with at least one coating layer of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, or DLC so that when pressurized Good results can be obtained with respect to at least one of the uniformity of the surface pressure distribution, the smoothness of the laminate molded product, and the releasability at the completion of laminate molding.

1 is a schematic explanatory diagram of a laminate molding system of a first embodiment; FIG. 1 is an enlarged view of a main part of the lamination molding system of the first embodiment; FIG. It is a schematic explanatory drawing of the laminate molding system of 2nd Embodiment. FIG. 11 is a schematic explanatory diagram of a laminate molding system of a third embodiment; FIG. 10 is a schematic explanatory view of press molding using a press device of a conventional laminate molding system.

A laminate molding system 1 according to a first embodiment of the present invention will be described with reference to FIG. 1 showing a cross section of a vacuum lamination device 2 and a press device 3. A lamination molding system 1 is a laminated material having uneven portions transported from the vacuum lamination device 2 by carrier films F1 and F2 sent by a transport device. An intermediate laminated material A4 composed of a certain substrate A1 and laminated film A2 is pressure-molded by the press device 3. As shown in FIG.

The carrier film unwinding device 4 of the transporting device 10, which serves as both a transporting device and a tensioning device for the substrate A1 and the laminated film A2, includes a lower unwinding roll 411 and a driven roll 412. As shown in FIG. The direction of the lower carrier film F1 unwound from the unwind roll 411 is changed to a horizontal state at the driven roll 412 portion. A mounting stage section 413 is provided on the portion where the lower carrier film F1 is in a horizontal state, on which the substrate A1 and the laminated film A2, which are the materials to be molded which are superimposed and sent from the previous process, are mounted. The carrier film unwinding device 5 of the conveying device 10 includes an upper unwinding roll 414 and a driven roll 415 , and the upper carrier film F<b>2 unwound from the unwinding roll 414 is attached to the substrate at the driven roll 415 . It is overlaid on a laminated molding A3 consisting of A1 and laminated film A2. The substrate A1 and the laminated film A2 are transported while being sandwiched between the carrier films F1 and F2, and the laminated film A2 is melted by performing lamination molding via the carrier films F1 and F2 in the vacuum lamination device 2 and the press device 3. In particular, the pressing device 3 has the advantage of providing a certain cushioning effect when the intermediate laminated material A4 is pressed. Further, depending on the type of the laminated molded product A5, after the temperature of the laminated molded product A5 taken out from the press device 3 is lowered, the carrier films F1, F2 and the laminated molded product A5 are separated. Mold release can be performed.

The vacuum lamination device 2, which is arranged in the post-process of the carrier film unwinding device 4 of the conveying device 10, consists of the substrate A1 and the lamination film A2 by a pressurizing body such as a diaphragm 211 in a vacuum state (decompressed state) chamber C. By pressurizing the laminate A3, an intermediate laminate A4, which is a primary molded product, is laminate-molded. In the vacuum lamination apparatus 2, a lower board 213 is provided so as to be able to be raised and lowered by a lifting mechanism 214 with respect to an upper board 212 which is fixedly provided. A chamber C can be formed. The chamber C is connected to a vacuum pump (not shown) so that it can be evacuated. A heat plate 215 is attached to the lower surface of the center of the upper board 212, and an elastic member 216 such as a heat-resistant rubber film (not shown) is attached to the surface of the heat plate 215. As shown in FIG. On the other hand, a heat plate 217 is also attached to the central upper surface of the lower plate 213 . A diaphragm 211 made of a heat-resistant rubber film, which is a pressurizing body, is attached to the portion of the lower plate 213 surrounding the hot plate 217 so as to cover the upper surface of the hot plate 217 . A compressor (not shown) sends pressurized air to the back side of the diaphragm 211 to expand the diaphragm 211 in the chamber C and press the substrate A 1 and the laminated film A 2 together with the hot plate 217 . Incidentally, the diaphragm 211 of the vacuum lamination device 2 may be attached to the upper board. The pressurizing body of the vacuum lamination apparatus may be one that presses the substrate A1 and the laminated film A2 between roll bodies having elastic bodies on their surfaces or between the roll body and a pressure plate. As the vacuum lamination apparatus, a press apparatus may be used in which elastic sheets such as rubber are attached to the surfaces of the upper and lower hot plates, and the elastic sheets serve as pressure surfaces.

A press device 3, which is arranged in series after the vacuum lamination device 2, is composed of a substrate A1, which is a laminated material having uneven portions pressure-molded by the vacuum lamination device 2, and a lamination film A2. The intermediate laminated material A4 in which unevenness remains on the film A2 side is further pressurized to form a flatter laminated product A5. The press device 3 includes a substantially rectangular base plate 311 provided below and tie bars 313 erected between four corners of an upper plate 312 which is a substantially rectangular fixed plate located above the base plate 311 . It has In the press device 3, a lower platen 314, which is a substantially rectangular movable platen, can move up and down between a base plate 311 and an upper platen 312. As shown in FIG. The base board 311 is provided with a pressurizing cylinder 315 which is a pressurizing means and is operated by hydraulic pressure. The pressurizing means of the press device 3 of the first embodiment is one that rotates a ball screw by an electric motor to directly move the bottom plate or the like, or one that moves the bottom plate or the like via a toggle device by an electric motor. Other methods such as Furthermore, the press device 3 may be one in which the upper board descends with respect to the lower board. Furthermore, although the press device 3 of the first embodiment does not have a chamber capable of being evacuated, it may be equipped with a chamber capable of being evacuated and pressurize in the vacuum chamber. good.

Pressure blocks 317 and 318 are attached to the opposing surfaces of the upper platen 312 and the lower platen 314 of the press device 3, respectively. Next, the pressing block 318 and the like on the side of the lower board 314 will be described in detail with reference to FIG. 2, the cushioning material 321 made of a resin film, the metal plate 322 made of stainless steel which is a thin metal plate, and the thickness of the titanium nitride film layer 323 with respect to the length direction (horizontal direction in FIG. 2) (vertical direction in FIG. 2) direction) is drawn thicker and deformed than the actual one. A heat insulating material 319 is arranged between a lower plate 314 of the press device 3 and a pressure block 318 , and a plurality of cartridge heaters 320 as heating means are arranged in parallel inside the pressure block 318 . The pressure block 318 and the like, which are also hot plates, may be provided with a polishing plate or a plate-like heater as in Patent Document 1, and are not limited to those shown in FIG.

On the smooth surface 318a of the pressure block 318, a cushioning material 321 made of engineering plastic such as polyimide film or resin film of thermosetting resin is superimposed. The resin film used in the present invention is an engineering plastic film or a thermosetting resin film, preferably an industrial functional film. Specifically, a film made of engineering plastics (including super engineering plastics) such as polyimide or a thermosetting resin film such as fluorine resin is desirable. It is particularly preferable that these resin films have a Rockwell R scale hardness ((ISO 2039-2) of 15 to 140 and a heat resistance temperature of 150° C. or higher. to 3.00 mm, more preferably 0.05 mm to 1.00 mm.The material of the cushioning material may be resin, elastomer, fiber, paper, or a composite thereof.

A metal plate 322 made of stainless steel or the like is superimposed on the surface of the cushioning material 321 . In the first embodiment, the surface 318a of the pressure block 318, the cushioning material 321, and the metal plate 322 made of stainless steel have the same shape in plan view. The length of one side of the metal plate 322 or the like in plan view is not limited to this, but is 250 mm to 1,000 mm as an example. The shape of the metal plate 322 or the like may be rectangular or square, and may have various corners chamfered or uneven portions for attachment. In the case of stainless steel, the material of the metal plate 322 is particularly preferably martensanite stainless steel (such as SUS440C) with high hardness. Alternatively, as the high-hardness stainless steel, one having a hardness HRC of 54 or more or an elastic modulus (×10 ³ kg/mm ² ) of 20.0 or more is particularly desirable. Alternatively, the metal forming the metal plate 322 may be stainless steel, nickel, iron, copper, zinc, aluminum, or an alloy of these metals. The thickness of the metal plate 322 is preferably 0.05 mm to 5.0 mm, more preferably 0.3 mm to 3.0 mm.

In the present invention, a coating layer 323 of at least one of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride, and DLC is formed on the surface 322a of the metal plate 322 such as stainless steel. More specifically, in this embodiment, a coating layer 323 of titanium nitride (Tin), which is a type of metal nitride, is formed. The titanium nitride coating layer 323 is formed by an ion plating method, which is a kind of PVD method, and the thickness of the titanium nitride coating layer 323 is 0.1 μm to 100 μm. Further, the thickness of the coating layer of metal nitride such as titanium nitride is more preferably 0.3 μm to 2.0 μm. Then, the pressure surface 323a on the surface of the coating layer 323 of metal nitride such as titanium nitride formed by the ion plating method is polished using a polishing buff or the like as necessary, and the surface roughness as described below is obtained. finished to

Further, the roughness of the pressure surface 323a of the surface of the titanium nitride film layer 323 formed on the surface 322a of the metal plate 322 is not limited to this, but the arithmetic mean roughness Ra (JIS B0601:2013 ) is desirably 0.07 μm or less, and particularly desirably Ra 0.04 μm or less. As for the surface roughness of the titanium nitride coating, the maximum height roughness Rz (JIS B0601:2013) is desirably 0.06 μm or less, and particularly desirably Rz 0.35 μm or less. For both the arithmetic mean roughness Ra and the maximum height roughness Rz, it is more desirable that the numerical values are smaller, but the surface treatment method is selected in consideration of the relationship with the cost.

In addition to TiN, the metal nitride coating layer may be a coating layer obtained by nitriding titanium or a titanium alloy such as TiC, TiCN, or TiAIN. As the film of metal nitride other than titanium, a nitrided film layer of CrN, molybdenum nitride, tungsten nitride, or the like may be used. Furthermore, DLC, which is a diamond carbide coating layer, can be mentioned as a suitable material for the coating layer. These films also preferably have a thickness of 0.3 μm to 100 μm and a surface roughness Ra of 0.1 μm or less. As for the method of forming the above-mentioned film, an optimum film forming method is selected according to the type of the film layer, such as ion plating, vacuum vapor deposition or sputtering by PVD, or CVD.

The coating layer may also be a coating layer made of titanium or a titanium alloy, nickel or a nickel alloy. These metals form a coating layer on the surfaces of the metal plates 322 and 325 made of stainless steel by a method such as plating or thermal spraying. Furthermore, the coating layer may be a mixture of coating layers of titanium or titanium alloys, nickel or nickel alloys, metal nitrides, or DLC, and said coating layers may be applied to the metal plates 322, 325 as multiple coating layers. As an example, the surface of an intermediate layer such as a titanium nitride layer is coated with DLC, or the surface of an intermediate layer such as a titanium alloy or nickel alloy is coated with a film layer of a metal nitride such as titanium nitride. is selected as appropriate.

The cushioning material 321 and the metal plate 322 made of stainless steel are provided with bolt holes (not shown) at a plurality of locations (4, 6, 8, etc.) on the periphery other than the pressure surface. A bolt (not shown) is passed from the front side of the metal plate 322 to the bolt hole of the pressure block 318 through the hole, and the cushioning material 321 and the metal plate 322 made of stainless steel are fixed to the pressure block 318. . In addition, in order to allow thermal expansion of the metal plate 322 made of stainless steel, etc., an adjusting portion such as a hole or an elongated hole having a larger cross-sectional area than the bolt may be provided in the portion through which the bolt is inserted. As for the method of adhering the cushioning material 321 and the metal plate 322 made of stainless steel to the pressure block 318, they may be attached by adhesion using a holder or an adhesive material other than bolts. Due to the above structure, the pressing block 318 of the press device 3 is provided with a metal plate 322 via a cushioning material 321 which is a cushioning material.

In the press apparatus 3 of the first embodiment, the upper platen 312 also includes a pressing block 317 having the same side size and area as the lower platen 314, a cushioning material 324, and a metal plate 325. FIG. The surface of the metal plate 325 is provided with a metal plate 325 made of stainless steel coated with a film layer 326 of titanium nitride. However, the metal plates 322 and 325 of the pressure block 317 on the side of the upper plate 312 and the pressure block 318 on the side of the lower plate 314 may have different plate thicknesses, types of surface coating layers, and surface roughness.

A carrier film unwinding device 5 of a conveying device 10 that serves as both a conveying device and a tensioning device for the laminated molded product A5 is provided in the post-process of the press device 3 . The carrier film unwinding device 5 includes a lower winding roll 511 and a driven roll 512, and the winding roll 511 winds up the lower carrier film F1. Further, the carrier film unwinding device 5 is provided with an upper take-up roll 513 and a driven roll 514, and the upper carrier film F2 is peeled off from the laminated molded product A5 at the portion of the driven roll 514. It is wound up on the winding roll 513 on the upper side. A take-out stage 515 for the laminated molded product A5 is provided at a portion where only the lower carrier film F1 is fed in a horizontal state. As a transfer device for the carrier films F1 and F2, a transfer device that grips both sides of the carrier films F1 and F2 and pulls them toward the post-process may be provided. Further, the conveying device 10 for conveying the laminate molded product A3 of the lamination molding system 1 to the vacuum lamination device 2 and conveying the intermediate laminated material A4 laminated and molded by the vacuum lamination device 2 to the press device 3 is not limited to the above. , a multi-axis robot or the like may be used.

Next, a laminate molding method for the substrate A1 and the laminate film A2, which are the materials to be laminated, using the laminate molding system 1 including the press device 3 of the first embodiment will be described. In the lamination molding system 1 for continuous molding, pressure molding is simultaneously performed in batch processing by sequence control in a diaphragm type vacuum lamination device 2 and a press device 3 which is a flattening press device. However, here, the molding order of the substrate A1 and the laminated film A2, which are the materials to be laminated for one batch, will be described. Upper and lower carrier films F1. Although F2 is not limited to this, it is often made of polyethylene terephthalate (PET) and has a thickness of 0.01 mm to 0.50 mm. Other types of carrier films F1 and F2 may be made of polyethylene, polypropylene, polyimide, or the like.

The substrate A1 placed on the placing stage portion 413 of the transfer device 10 has an uneven portion A1a formed of a convex portion A1b of the copper foil portion adhered to the surface of the substrate and a concave portion A1c of the portion without the copper foil. circuit board. The thickness of the copper foil (height with respect to the substrate portion) is not limited to this, but is about several micrometers to several tens of micrometers, and is 0.1 mm or less in most cases. Laminated films A2 are laminated on the upper and lower sides of the substrate A1, respectively, to form a laminated molding A3 for build-up molding. In FIG. 1, one laminated molded product A3 is shown, but a plurality of laminated molded products A3 may be laminated and molded at the same time.

The laminated film A2 in the first embodiment is an insulating film, and is used after peeling off the PET films laminated on both sides from the original storage state. The resin material of the laminated film A2 is a thermosetting resin such as epoxy or a thermosetting resin as a main component. In addition, materials other than the thermosetting resin include roughness adjustment, flame retardancy, low expansibility, fluidity, film formation, low dielectric loss tangent (insulation), moisture content reduction, etc. Various materials and additives are contained for the purpose. In recent years, in particular, there has been an increasing number of types in which the content of inorganic materials is increased in order to provide roughness adjustment, low expansion, low dielectric loss tangent, lower moisture content, and the like. Examples of inorganic materials include, but are not limited to, SiO2.

In the first embodiment, the laminated film A2 containing 20% or more of SiO2, which is an inorganic material, is suitably used. In the present invention, the laminated film A2 in which the content (% by volume) of SiO2, which is an inorganic material, is 20% or more is defined as a laminated film having a high inorganic material content. Although not limited to this, in the example of "Ajinomoto Build-up Film (ABF)" (registered trademark), which is an interlayer insulation film of Ajinomoto Fine-Techno Co., Ltd., GX13 (Young's modulus (GPa) 4.0), GX92 (Young's modulus (GPa) 5.0), GX-T31 (Young's modulus (GPa) 7.5), NextGX (Young's modulus (GPa) 7.5), GZ41 (Young's modulus (GPa) 9.0), or A film having a Young's modulus (GPa) of 9.0 or more is exemplified as a laminated film having a high inorganic material content.

In addition, other companies' products also include laminated films with a high content of inorganic materials of similar materials. As described above, these laminated films improve the adhesion to the laminated object by lowering the roughness of the film surface, prevent peeling from the substrate by lowering the coefficient of thermal expansion, and improve insulation (reduce dielectric loss). Reduction) Inorganic materials are contained in an amount of 20% by volume or more, or 40% by weight or more for the purpose of reducing the moisture content. In particular, for substrates for 5G, which is the fifth generation communication system, a laminated film A2 (interlayer insulating film) containing 25% by volume or more of inorganic material is particularly preferably used because higher accuracy is required. The thickness of the laminate film A2 is not limited to this, but interlayer insulation films of 0.01 mm to 0.1 mm are commercially available and are widely used, such as those manufactured by Ajinomoto Fine-Techno Co., Ltd. . The laminate film A2 may be a laminate of copper foil layers, and these films are also used in the press device 3 of the laminate molding system 1 of the present invention.

The laminate A3 placed on the placement stage 413 is sent together with the upper and lower carrier films F1 and F2 as the winding rolls 511 and 513 rotate, and enters the chamber C of the vacuum lamination apparatus 2 in the open state. sent and positioned. Next, the chamber C of the vacuum lamination apparatus 2 is closed and the inside of the chamber C is evacuated by a vacuum pump (not shown). Then, pressurized air is supplied to inflate the diaphragm 211 into the chamber C, and the laminate A3 composed of the substrate A1 and laminate film A2 is pressed between the elastic body 216 of the hot plate 215 on the upper plate 212 side. At this time, the pressure applied by the diaphragm 211 is, for example, 1.0 MPa or less, and the substrate A1 and the laminated film A2 are bonded in such a manner that the laminated film A2 is embedded in the concave portion A1c of the substrate A1, and the primary molded product is obtained. The intermediate laminated material A4 is laminate-molded. However, the surface of the laminated film A2 of the intermediate laminated material A4 laminated and molded by the vacuum lamination apparatus still has irregularities following the shape of the irregularities A1a of the substrate A1. Further, in this case, if the laminated film A2 used has a high content of inorganic material, the fluidity of the molten resin is low, so that irregularities are more likely to remain.

In the vacuum lamination device 2, the chamber C is opened when the intermediate lamination material A4 consisting of the substrate A1 having the uneven portion A1a and the lamination film A2, both of which are adhered together, is lamination-molded. Then, by feeding the next carrier films F1 and F2 by the carrier film unwinding device 5 of the conveying device 10, the intermediate laminated material A4 is conveyed between the upper platen 312 and the lower platen 314 of the press device 3, and pressurized by a predetermined pressure. stopped in position. Next, the pressurizing cylinder 315 of the press device 3 is actuated to raise the lower platen 314 and the pressurizing block 318 . As described above, the pressurizing block 318 is provided with a metal plate 322 made of stainless steel, which is elastically deformable via a cushioning material 321 having a cushioning effect, and whose surface is coated with a coating layer 323 made of titanium nitride. As described above, after the pressure surface 323a of the surface of the titanium nitride coating layer 323 of the stainless steel metal plate 322 contacts the lower carrier film F1, the intermediate laminate A4 is further pushed up through the lower carrier film F1. Then, the intermediate laminated material A4 is brought into contact with the pressing surface 326a on the surface of the titanium nitride coating layer 326 on the surface of the stainless steel metal plate 325 of the upper board 312 via the upper carrier film F2, and then the upper and lower pressing surfaces 323a. and the pressure surface 326a via the carrier films F1 and F2.

At this time, the temperature of the pressure blocks 317 and 318 (hot plates) of the press device 3 varies depending on the materials of the substrate A1 and the laminated film A2, and is not limited to this, but is preferably 30°C to 200°C. is controlled between 80°C and 140°C. If the temperature at this time is too high, the viscosity of the melted resin material constituting the laminated film becomes low and the fluidity becomes too high, so that the resin material constituting the laminated film flows out from the end of the intermediate laminated material A4. Therefore, the desired thickness of the laminated molded product and the desired thickness of the insulating layer cannot be obtained. Furthermore, if the temperature of the pressing blocks 317 and 318 during pressurization is too high, problems such as the deterioration of the resin material and the need for a longer molding cycle time including cooling in the post-process also occur. On the other hand, if the temperature of the pressurizing blocks 317 and 318 during pressurization is too low, the viscosity of the resin material is too high and desired fluidity cannot be obtained, and the laminated film A2 cannot be sufficiently embedded in the substrate A1. Otherwise, the problem arises that the surface of the laminated molded product A5 cannot obtain sufficient flatness.

In addition, the pressure (surface pressure) on the intermediate laminated material A4 varies depending on the material of the substrate A1 and the laminated film A2, but is not limited thereto, but is 0.1 MPa to 3.0 MPa, more preferably 0.5 MPa to 0.5 MPa. It is controlled at 2.5 MPa. If the pressurizing force at this time is too strong, the molten resin material forming the laminated film A2 flows out from the end of the intermediate laminated material A4, making it impossible to perform pressure molding as well as the temperature conditions. On the other hand, if it is too low, the laminated film A2 cannot be sufficiently embedded in the substrate A1, or the surface of the laminated molded product A5 cannot be obtained with sufficient flatness.

In the first embodiment, metal plates 322 and 325 made of stainless steel having coating layers 323 and 326 of titanium nitride or the like formed on the surfaces thereof are used, and the intermediate laminated material A4 is mounted via carrier films F1 and F2. By applying pressure, the smoothness of the intermediate laminate A4 can be improved. Also, by using stainless steel metal plates 322, 325 on which titanium nitride coating layers 323, 326 are formed, and cushioning materials 321, 324 made of resin films made of polyimide or fluorine resin, when the intermediate laminated material A4 is pressurized, It is possible to improve the uniformity of the surface pressure distribution. Alternatively, the combination of the coating layers 323, 326 and the cushioning materials 321, 324 made of resin film presses the intermediate laminated material A4 between the pressure blocks 102, 103 of the pressing device 101 as shown in FIG. In this case, it is possible to prevent the melted resin material of the laminated film A2 from flowing out due to the concentration of stress at the time of pressurization near the ends A4c and A4d of the intermediate laminated material A4.

Then, when a predetermined pressurizing time has elapsed in the press device 3, the pressurizing cylinder 315 of the press device 3 is operated, and the lower board 314 and the pressurizing block 318 are lowered. As a result, the pressure surface 323a of the titanium nitride coating layer 323 formed on the surface 322a of the metal plate 322 attached to the pressure block 318 on the side of the lower board 314 and the lower carrier film F1 are separated from each other. Also, the space between the pressure surface 326a of the titanium nitride film layer 326 formed on the surface of the metal plate 325 attached to the upper board 312 and the upper carrier film F2 is released. However, in the present invention, since the titanium nitride coating layers 323, 326 are formed on the surfaces of the metal plates 322, 325, the carrier film F1. Mold release from F2 can be performed more easily than before. Therefore, the carrier film F1. At least one of F2 is released from the mold while being stuck to the metal plate, and the laminated molded product A5 press-molded between the carrier films F1 and F2 is unintentionally separated from the carrier films F1 and F2 in the press device 3. The phenomenon of being typed can be suppressed as much as possible.

In the next molding cycle, the laminate molded product A5 that has been laminated and molded by the press device 3 is sent to the take-out stage 515 of the laminated molded product A5 by the operation of the carrier film unwinding device 5 of the conveying device 10 . Up to this time, the upper carrier film F2 is satisfactorily released from the laminate molded product A5 at the driven roll 514 portion. Then, the laminated molded product A5 is taken out from the take-out stage 515 by a robot or the like. When the laminated molded product A5 is a substrate for a build-up substrate, the present invention is effective because surface smoothness is particularly important. In the case of a substrate for a build-up substrate, the surface of the laminated molded product A5 may be very finely roughened with a chemical or the like in order to attach a copper foil or the like in the next step, but the surface smoothness of the present invention is In any case, it is important to secure the smoothness of the laminate molded product A5 for the build-up board by the press device 3, since the smoothness of a larger unit than that is required.

Next, the lamination molding system 6 of the second embodiment shown in FIG. 3 will be described with reference numerals, focusing on the differences from the lamination molding system 1 of the first embodiment. The press device 8 of the laminate molding system 6 of the second embodiment does not use a diaphragm, and the pressurizing mechanism such as the pressurizing cylinder 821 has substantially the same structure as the press device 3 of the first embodiment. . Pressing blocks 813 and 814 attached to an upper platen 811 and a lower platen 812 of the press device 8 are made of resin film buffers 815 and 816 such as polyimide, and metal thin metal plates made of stainless steel. 817 and 818, respectively, and coating layers 819 and 820 of titanium nitride or the like, which are the same as in the first embodiment, are formed on the surfaces of the metal plates 817 and 818 made of stainless steel. Surfaces of the coating layers 819 and 820 are pressure surfaces 819a and 820a. Also, it is the same that the lower board 812 is lifted by the pressurizing cylinder 821 and pressurized between the pressurizing surfaces 819a and 820a.

The difference between the press device 3 of the first laminate molding system 1 and the press device 8 of the laminate molding system 6 of the second embodiment is that the press device 8 has a chamber formed in at least one of the upper platen 811 and the lower platen 812. The side walls 822 and 823 are formed as members, and the chamber C is formed when the relative distance between the upper board 811 and the lower board 812 becomes closer due to the rise of the lower board 812 and the like. is. The pressing device 8 is equipped with a vacuum pump (not shown) for evacuating the inside of the chamber C. As shown in FIG. The press device 8 is therefore a vacuum lamination device.

In addition, in the post-process of the press device 8, a press device 3 used for secondary molding, which is the same as in the first embodiment, is provided. The press device 8 includes cushioning materials 815 and 816 made of resin films such as polyimide, and metal plates 817 and 818 made of stainless steel which are thin metal plates. The stainless steel metal plates 817, 818 of the press device 8, the stainless metal plates 817, 818 of the press device 3, and the stainless metal plates 322, 325 of the press device 3 may be of the same material but different materials. may The coating layers such as titanium nitride on the metal plates 817 and 818 and the coating layers 323 and 326 such as titanium nitride on the metal plates 322 and 325 may be made of the same material or different materials. The roughness Ra and the maximum height roughness Rz may be the same or different, and the surface roughness of the coating layers 323, 326 such as titanium nitride on the metal plates 322, 325 of the press device 3 in the post-process is higher. You can make it smaller.

Next, a lamination molding system 7 of a third embodiment shown in FIG. 4 will be described with reference numerals, focusing on differences from the lamination molding system 1 of the first embodiment. The laminate molding system 7 of the third embodiment is provided with another press apparatus 9 similar to the press apparatus 3 of the laminate molding system 1 of the first embodiment. That is, the press devices 3 and 9 of the lamination molding system 7 are provided in series in the post-process of the vacuum lamination device 2 . Then, an intermediate laminated material A4 composed of a substrate A1 having uneven portions and a laminated film A2 transported from the vacuum lamination device 2 by the carrier films F1 and F2 is successively pressure-formed by the two press devices 3.9. It is.

The press device 9 has substantially the same structure as the press device 3. Pressure blocks 913 and 914 attached to an upper platen 911 and a lower platen 912, respectively, are composed of cushioning materials 915 and 916 made of resin films such as polyimide and metal made of stainless steel. Plates 917 and 918 are respectively provided, and coating layers 919 and 920 such as titanium nitride are formed on the surface of the metal plate 918 made of stainless steel, and the surfaces thereof serve as pressure surfaces 919a and 920a.

The resin film cushioning materials 915 and 916 and the stainless steel metal plates 917 and 918 of the pressing device 9, and the resin film cushioning materials 321 and 324 and the stainless steel metal plates 322 and 325 of the pressing device 3 are Even if they have the same thickness, one of them may be thicker. The material and thickness of the film layers 919 and 920 such as titanium nitride formed on the metal plates 917 and 918 and the material and thickness of the film layers 323 and 326 such as titanium nitride formed on the metal plates 322 and 325 are also determined. Even if they have the same thickness, one of them may be thicker.

In the laminate molding method using the laminate molding system 6 of the third embodiment, the intermediate laminated materials A4a and A4b laminated and molded are sent to the vacuum lamination device 2, the press device 3, and the press device 9 in order. In the case of two laminating devices as in the first embodiment, the press device 3 often requires a longer pressing time than the vacuum laminating device 2, and the entire molding time is defined by the press device 3. there were many cases. However, in the laminate molding system 7 of the third embodiment, it is possible to disperse the molding time by performing pressure molding twice by the press device 3 and the press device 9. In most cases, molding by the device 3 and the press device 9 is also possible.

In addition, since pressure molding can be performed twice by the press device 3 and the press device 9, even if the laminated film A2 contains a large amount of inorganic material and has poor fluidity when melted, it can be laminated and molded satisfactorily. can. Also, the temperature and pressure (surface pressure) of the pressure blocks of the press device 3 and the press device 9 may be the same or different. Although not limited to this, as an example, the temperature of the pressure block is higher in the press device 3 than in the press device 9 to improve the fluidity of the molten resin material of the laminated film A2, and the press is performed. The pressing force of the press device 9 may be set higher than that of the device 3 to increase the smoothness of the surface of the laminate A5. Also in the third embodiment, another device such as a cooling press device may be provided in the post-process of the press device 9 .

As a modification of the third embodiment, instead of the press device 3 installed next to the vacuum lamination device 2, a press device having a pressure surface made of an elastic plate such as rubber may be used. In that case, the press device according to the invention is only used for the third lamination.

The press devices 3, 8, and 9 of the present invention are shipped without the resin film or metal plate as a buffer material attached at the time of shipment, and later, the metal plate on which the coating layer of titanium nitride or the like of the present invention is formed. are also envisioned, and those forms are also encompassed by the present invention.

Although the present invention is not enumerated one by one, it is not limited to the first to third embodiments described above. Needless to say, the combination of each description of the embodiments is also applied. Laminated molded products laminated by the laminated molding systems 1, 6, and 7 are particularly suitable for laminated molded products for which surface smoothness is important, and other circuit boards, semiconductor wafers, etc., in addition to build-up boards. Not well defined.

1, 6.7 lamination molding system 2, vacuum lamination device 3, 8, 9 press device 212, 312, 811, 911 upper platen 213, 314, 812, 912 lower platen
317, 318, 813, 814, 913, 914 pressure blocks 321, 324, 815, 816, 915, 916 cushioning materials 322, 325, 817, 818, 917, 918 metal plates 323, 326, 819, 820, 919, 920 Coating layers 323a, 326a, 821a, 822a, 919a, 920a Pressure surface

Claims (5)

A vacuum laminating device, a press device arranged in a post-process of the vacuum laminating device, and a conveying device for conveying an intermediate laminated material obtained by laminating and forming a laminated material on a material to be laminated in the vacuum laminating device to the pressing device. A laminate molding system in which the intermediate laminated material is conveyed by the conveying device together with the film arranged on the laminated material side, and the intermediate laminated material is pressed through the film ,
The press device includes a pressure block attached to at least one of the upper board and the lower board,
a cushioning material attached to the surface of the pressure block;
and a metal plate attached to the surface of the cushioning material,
A laminate molding system, wherein a surface of the metal plate is coated with at least one coating layer of titanium or titanium alloy, nickel or nickel alloy, metal nitride, or DLC. The cushioning material of the press device is made of resin, elastomer, fiber, paper, or a composite thereof, and has a thickness of 0.005 mm to 3.0 mm,
The metal plate of the pressing device is made of stainless steel, nickel, iron, copper, zinc, aluminum, or an alloy of these metals, and has a thickness of 0.05 mm to 5.0 mm.
The laminate molding system of claim 1. The coating on the surface of the metal plate has a thickness of 0.1 μm to 100 μm,
The laminate molding system according to claim 1 or 2, wherein the surface roughness is Ra 0.07 µm or less. A vacuum laminating device, a press device arranged in a post-process of the vacuum laminating device, and a conveying device for conveying an intermediate laminated material obtained by laminating and forming a laminated material on a material to be laminated in the vacuum laminating device to the pressing device. A laminate molding method using a laminate molding system in which the intermediate laminated material is conveyed by the conveying device together with a film arranged on the laminated material side of the intermediate laminated material, and the intermediate laminated material is pressed through the film ,
The press device includes a pressure block attached to at least one of the upper board and the lower board,
a cushioning material attached to the surface of the pressure block;
and a metal plate attached to the surface of the cushioning material,
a coating layer of at least one of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride, or DLC is formed on the surface of the metal plate;
A laminate molding method using a laminate molding system, wherein the temperature of the pressing block during press molding by the press device is 30° C. to 200° C., and the surface pressure for pressing the intermediate laminate material is 0.1 MPa to 3.0 MPa. 5. The laminate molding method using the laminate molding system according to claim 4, wherein the intermediate laminated material is pressurized via a carrier film sent by a conveying device during press molding by the press device.

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