JP7159622B2 - Electronics - Google Patents

Description

The present disclosure relates to electronic equipment.

An electronic device is known that includes a base module, and a first module and a second module that are fitted and connected to the base module (see Patent Documents 1 and 2, for example). Also, as a vibration damping support structure for an electronic device or substrate, for example, the techniques described in Patent Documents 3 and 4 are known.

JP-A-2000-294962 JP-A-2-63192 JP-A-6-45768 Japanese Utility Model Laid-Open No. 62-28489

In the electronic devices described in Patent Documents 1 and 2, a clearance is provided between the first module and the second module for the purpose of absorbing manufacturing tolerances. Such clearances can adversely affect vibration resistance.

Accordingly, an object of the present disclosure is to provide an electronic device with improved vibration resistance with a simple configuration.

An electronic device according to some embodiments includes a base module having at least a first connector and a second connector for connecting modules, and a first surface detachably fitted and connected to the first connector. a second module detachably matingly connected to the second connector and having a second surface facing the first surface and adjacent to the first module; and the first surface and a filler disposed in the clearance between and the second surface, the filler disposed in intimate contact with at least a portion of the first surface and at least a portion of the second surface; It is characterized in that the first module and the second module are fixed. According to such a configuration, since the first module and the second module are fixed so as to support each other through the filler, the rigidity is increased and the vibration resistance is improved.

In one embodiment, the first module has a connection surface on which a connector having one end and the other end located opposite to each other and detachably fit-connected to the first connector is arranged; The module includes a locking portion that locks the one end of the connection surface, and a detachable module by rotating the first module in a state where the one end of the connection surface is locked to the locking portion. and a fitting portion fitted to the other end of the connection surface. According to such a configuration, it is possible to fit the first module to the base module with a simple operation.

In one embodiment, the first surface and the connecting surface of the first module may each be a plane along a vertical direction. With such a configuration, it is possible to improve the operability of attaching and detaching the first module to and from the base module.

In one embodiment, the front first module includes: a circuit board having one end having a connector detachably fitted and connected to the first connector and the other end located on the opposite side of the one end; a case having an opening that exposes the other end and to which the circuit board is attached; a cover attached to the case; and a filler. According to such a configuration, the cover and the circuit board can be mutually supported via another filler, so that the rigidity is increased and the vibration resistance is improved.

In one embodiment, the case may have a rectangular parallelepiped shape. According to such a configuration, stability is improved when the case is installed.

In one embodiment, the case may be flat. According to such a configuration, the space of the case can be saved.

In one embodiment, the other filler may be an elastic body. According to such a configuration, the other filler is compressed between the cover and the circuit board to close clearances of various sizes, allowing load to be transmitted between the cover and the circuit board. Therefore, vibration resistance is further improved.

In one embodiment, the other filler may have anti-vibration properties. According to such a configuration, vibration between the cover and the circuit board can be damped by the other filler, so that the vibration resistance is further improved.

In one embodiment, the other filler material may comprise rubber, sponge or gel-like material.

In one embodiment, the filler material is affixed to one of the first surface of the first module and the second surface of the second module, and the first surface of the first module and the second surface of the second module. It may be slidable relative to the other of said second surface of the two modules. According to such a configuration, when at least one of the first module and the second module is attached to and detached from the base module so that one of the first surface and the second surface moves along the other, the module can be smoothly attached to and detached from the base module.

In one embodiment, the first module has an intermediate connector located on the first surface and the second module is located on the second surface and electrically connected to the intermediate connector of the first module. It may have a relay connector that is connected to the connector. According to such a configuration, it is possible to enhance the support between the first module and the second module by the relay connector, thereby improving vibration resistance.

In one embodiment, the filler may be an elastic body. According to such a configuration, the filling material is compressed between the first module and the second module to fill clearances of various sizes and distribute loads between the first module and the second module. Since it can be made transmissible, vibration resistance is further improved.

In one embodiment, the filler may have anti-vibration properties. According to such a configuration, vibration between the first module and the second module can be attenuated by the filler, so that earthquake resistance is further improved.

In one embodiment, the filler material may comprise a rubber, sponge or gel-like substance.

In one embodiment, the electronics may be a programmable logic controller (PLC).

An electronic device module according to some embodiments has a circuit board having one end having a connector and the other end located on the opposite side of the one end, and an opening exposing the other end of the circuit board. A case to which a circuit board is attached, a cover attached to the case, and a filler disposed in a clearance between the cover and the other end of the circuit board. According to such a configuration, the cover and the circuit board can be mutually supported through the filler, so that the rigidity is increased and the vibration resistance is improved.

According to the present disclosure, it is possible to provide an electronic device with improved vibration resistance with a simple configuration.

1 is a perspective view showing an electronic device according to an embodiment of the invention; FIG. 2 is a front view showing the electronic device of FIG. 1; FIG. 2 is an exploded view showing the electronic device of FIG. 1; FIG. 2 is a perspective view showing an example of an attachment/detachment mechanism for a first module of the electronic device of FIG. 1; FIG. 2 is a perspective view showing the electronic device of FIG. 1 with a first module detached; FIG. FIG. 2 is a perspective view showing an exploded first module of FIG. 1; 7 is a perspective view from the connecting surface side of the first module of FIG. 6 with the cover removed; FIG. It is a figure which shows the modification of a 1st module and a 2nd module.

Embodiments of the present invention will be exemplified below with reference to the drawings. Elements common in each figure are given the same reference numerals. In this specification, the vertical direction means the vertical direction in the state of use of the electronic device 1, and is the vertical direction in FIG. 1 and the like.

FIG. 1 is a perspective view showing an electronic device 1 according to one embodiment of the invention. FIG. 2 is a front view showing the electronic device 1. FIG. FIG. 3 is an exploded view of the electronic device 1. As shown in FIG. As shown in FIGS. 1 to 3, the electronic device 1 includes a base module 10, a first module 30, and a second module 50. FIG.

The electronic device 1 is, for example, a modular control device (router, server, HUB, etc.) such as a programmable logic controller (PLC). The control device can be used, for example, as part of a Subsea Electronic Module (SEM) that is installed and used on the seabed (Subsea).

As shown in FIG. 3, the base module 10 has at least a first connector 11 and a second connector 12 for connecting modules, such as a first module 30 or a second module 50, for example. The first connector 11 is fitted and connected to a connector 31 of a first module 30, which will be described later. The second connector 12 is fitted and connected to a connector 51 of a second module 50, which will be described later. In this embodiment, the base module 10 is flat, and the first connector 11 and the second connector 12 are arranged on one surface of the base module 10 . The first connector 11 can attach and detach the first module 30 . The second connector 12 is detachable with the second module 50 . The first connector 11 of the base module 10 may be fitted and electrically connected to the connector 31 of the first module 30 . The second connector 12 of the base module 10 may be fitted and electrically connected to the connector 51 of the second module 50 . In this case, the base module 10 can electrically connect the first module 30 and the second module 50 via the first connector 11 and the second connector 12 .

The first module 30 is a module that exhibits a predetermined function in the electronic device 1 . In this embodiment, the first module 30 is configured by a power supply module that supplies power to the electronic device 1 . As shown in FIGS. 1-3, the first module 30 has a connector 31 mateable with the first connector 11 of the base module 10 and a first surface 32 . The first module 30 also has a connection surface 33 on which the connector 31 is arranged. The connecting surface 33 has one end 34 (lower end in FIG. 3) and the other end 35 (upper end in FIG. 3) located on mutually opposite sides.

The shape of the first module 30 depends on the shape of a case 44 (see FIG. 6), which will be described later, and is a flat rectangular parallelepiped shape in this embodiment. The first surface 32 and the connection surface 33 constitute planes adjacent to each other in the rectangular parallelepiped, and the area of the first surface 32 is larger than the area of the connection surface 33 .

The second module 50 is a module that exhibits a predetermined function in the electronic device 1 . In this embodiment, the second module 50 is configured by a CPU module that executes arithmetic processing. As shown in FIGS. 1 to 3, the second module 50 includes a connector 51 matingly connectable to the second connector 12 of the base module 10 and a second surface 52 facing the first surface 32 of the first module 30. and have The second module 50 also has a connection surface 53 on which the connector 51 is arranged, similarly to the first module 30 . The shape and dimensions of the second module 50 are substantially the same as the shape and dimensions of the first module 30 . That is, in the present embodiment, the shape of the second module 50 is a flat rectangular parallelepiped shape, the second surface 52 and the connection surface 53 form planes adjacent to each other in the rectangular parallelepiped, and the area of the second surface 52 is larger than that of the second surface 52 . , is larger than the area of the connection surface 53 . Also, the area of the first surface 32 of the first module 30 and the area of the second surface 52 of the second module 50 are substantially equal. The area of the connection surface 33 of the first module 30 and the area of the connection surface 53 of the second module 50 are substantially equal. The first surface 32 and the second surface 52 are surfaces substantially parallel to each other.

FIG. 4 is a perspective view showing an example of an attachment/detachment mechanism for the first module 30 of the electronic device 1. As shown in FIG. As shown in FIG. 4 , the base module 10 of this embodiment has a locking portion 13 that locks one end 34 of the connecting surface 33 of the first module 30 and a fitting portion 14 . As shown in FIGS. 3 and 4 , the fitting portion 14 is detachably attached to the connection surface 33 by rotating the first module 30 with one end 34 of the connection surface 33 locked to the locking portion 13 . is fitted to the other end 35 of the The direction in which the first module 30 is rotated is the direction in which the first surface 32 extends along the second surface 52 . Thus, the base module 10 fixes the first module 30 by fitting.

The base module 10 of the present embodiment fixes the second module 50 by fitting in the same manner as the first module 30 . That is, as shown in FIG. 3, the base module 10 of this embodiment has a locking portion 13a that locks one end 54 of the connecting surface 53 of the second module 50, and a fitting portion 14a. The fitting portion 14a is detachably fitted to the other end 55 of the connection surface 53 by rotating the second module 50 with one end 54 of the connection surface 53 locked to the locking portion 13a. The direction in which the second module 50 is rotated is the direction in which the second surface 52 extends along the first surface 32 .

In the electronic device 1 of the present embodiment, the first module 30 and the second module 50 are designed so as not to contact each other so that the first module 30 and the second module 50 can be smoothly attached to and detached from the base module 10 . be. That is, as shown in FIG. 2, a clearance C1 is formed between the first surface 32 of the first module 30 and the second surface 52 of the second module 50. As shown in FIG. The clearance C1 is, for example, approximately 0.3 mm.

Thus, when the clearance C<b>1 is formed between the first surface 32 and the second surface 52 , a movable range is created between the first module 30 and the second module 50 . Therefore, when an external force such as a large vibration or shock is applied to the electronic device 1 , the electronic device 1 may rattle when resonance occurs, which may cause a failure or the like. Therefore, in the electronic device 1 of the present embodiment, the vibration resistance can be improved by arranging the first filler 91, which will be described later, in the clearance C1.

FIG. 5 is a perspective view showing the electronic device 1 with the first module 30 removed. As shown in FIG. 5, the electronic device 1 further includes a first filler 91 arranged in the clearance C1 (see FIG. 2). The first filler 91 is arranged to close (fill) the clearance C1. Specifically, the first filler material 91 is intimately disposed on at least a portion of the first surface 32 of the first module 30 and at least a portion of the second surface 52 of the second module 50 to provide a separation between the first module 30 and the second module 30 . Module 50 is fixed. According to such a configuration, since the first module 30 and the second module 50 are fixed so as to support each other via the first filler 91, the rigidity is increased and the vibration resistance is improved. The first filler material 91 of this embodiment is adhered to the second surface 52 of the second module 50 . The first filler 91 may be fixed to the first surface 32 instead of the second surface 52 .

The material of the first filler 91 is, for example, an elastic body. Elastic bodies include, for example, rubber, sponge, gel-like substances, and the like. When an elastic body is used as the material, the first filler 91 preferably has a thickness larger than the clearance C1 in a natural state, and the compressibility between the first module 30 and the second module 50 is 20% to 20%. It is preferable to compress to about 30%. When using an elastic body as the material, the first filler 91 may have a thickness of, for example, about 0.5 mm in its natural state. According to such a configuration, the first filler 91 is compressed between the first module 30 and the second module 50 to close the clearances C1 of various sizes, thereby Since the load can be transmitted between the modules 50, vibration resistance is further improved. Here, the restoring force of the first filler 91 is sufficiently smaller than the force with which the base module 10 fixes the first module 30 and the second module 50 by fitting. Therefore, the restoring force of the first filler 91 hardly changes the distance between the first surface 32 of the first module 30 and the second surface 52 of the second module 50 .

The first filler 91 may have anti-vibration properties. According to such a configuration, the vibration between the first module 30 and the second module 50 can be damped by the first filler 91, so the earthquake resistance is further improved.

As shown in FIG. 4 , when the first module 30 is attached to or detached from the base module 10 such that the first surface 32 moves along the second surface 52 , the first module 30 fixed to the second surface 52 is A filler material 91 contacts the first surface 32 of the first module 30 . Therefore, it is preferable that the first surface 32 of the first module 30 is slidable with respect to the first filler 91 when attaching and detaching in this way. With such a configuration, the first module 30 can be smoothly attached to and detached from the base module 10 . Examples of a configuration in which the first surface 32 can slide with respect to the first filler 91 include a configuration in which at least the surface of the first filler 91 is made of a lubricating substance, the first surface 32 and/or the first filler. A configuration in which a lubricating material such as lubricating oil or grease is applied to the surface of 91 may be mentioned. When the first filler 91 is fixed to the first surface 32 instead of the second surface 52 , the first filler 91 may be slidable relative to the second surface 52 . preferable.

The first filler 91 may be configured to adhere to both the first surface 32 and the second surface 52 . As a configuration in which the first filler 91 is fixed to both the first surface 32 and the second surface 52, for example, a configuration in which the first filler 91 is a gel-like substance can be mentioned. If the first filler material 91 were adhered to both the first surface 32 and the second surface 52, the first module 30 and the second module 50 would not be able to slide against each other. The two modules 50 cannot be fitted to the base module 10 individually. In this case, for example, in a state in which the first surface 32 of the first module 30 and the second surface 52 of the second module 50 are attached via the first filler 91, the first module 30 and the second module 50 are integrally fitted to the base module 10 . With such a configuration, the first module 30 and the second module 50 after being fitted to the base module 10 are restrained from moving along the first surface 32 and the second surface 52. .

As shown in FIG. 5 , the first filler 91 of this embodiment is arranged over substantially the entire second surface 52 of the second module 50 . With such a configuration, the first module 30 and the second module 50 can be mutually supported over substantially the entire surfaces of the first surface 32 and the second surface 52 via the first filler 91. , the rigidity is further increased. The first filler 91 is arranged in the vicinity of at least two of the four corners of the second surface 52 located on the side opposite to the connecting surface 53 (upper right and lower right corners in FIG. 5). preferably. According to such a configuration, the first filler 91 is arranged at a position away from the connection surface 53 fixed by the base module 10, where displacement due to vibration tends to increase, thereby efficiently improving the vibration resistance. be able to.

FIG. 6 is an exploded perspective view of the first module 30. As shown in FIG. As shown in FIG. 6 , the first module 30 has a circuit board 40 , a case 44 and a cover 47 . The circuit board 40 has a flat plate shape and has one end 41 having the connector 31 and the other end 42 located on the opposite side of the one end 41 . The circuit board 40 of this embodiment is used with its longitudinal direction along the vertical direction.

The case 44 has an opening 45 for exposing the other end 42 of the circuit board 40 and the circuit board 40 is attached. Specifically, the case 44 has a restriction portion 46 that restricts movement of the circuit board 40 . The case 44 of this embodiment has a flat rectangular parallelepiped shape. The case 44 is used with the longitudinal direction of the opening 45 along the vertical direction and the short side direction along the horizontal direction. The cover 47 is attached to the case 44 while the circuit board 40 is fixed within the case 44 .

In the first module 30 of the present embodiment, there is a clearance (hereinafter also referred to as "in-case clearance" as appropriate) between the cover 47 and the other end 42 of the circuit board 40 in consideration of manufacturing tolerances and the like. is formed. The clearance inside the case is, for example, approximately 0.2 to 0.3 mm.

In this way, when the in-case clearance is formed between the cover 47 and the other end 42 of the circuit board 40, a movable range of the circuit board 40 is generated between the cover 47 and the other end 42 of the circuit board 40. . Therefore, when an external force such as a large vibration or impact is applied to the first module 30, rattling may occur, which may cause a failure or the like. Therefore, in the first module 30 of the present embodiment, a second filler 92 (see FIG. 7), which will be described later, is arranged in the clearance within the case, thereby making it possible to improve vibration resistance.

FIG. 7 is a perspective view from the connecting surface 33 side of the first module 30 with the cover 47 removed. As shown in FIG. 7, it further has a second filler 92 arranged in the clearance between the cover 47 and the other end 42 of the circuit board 40 (see FIG. 6). With such a configuration, the cover 47 and the circuit board 40 can support each other via the second filler 92, so that rigidity is increased and vibration resistance is improved. The second filler 92 of this embodiment is fixed to the rear surface 48 of the cover 47 .

The material of the second filler 92 is, for example, an elastic body. Elastic bodies include, for example, rubber, sponge, gel-like substances, and the like. When an elastic body is used as the material, the second filler 92 preferably has a thickness larger than the clearance in the case in a natural state, and the compressibility between the cover 47 and the circuit board 40 is 20% to 30%. It is preferably compressed to a degree. When using an elastic material, the second filler 92 may have a thickness of, for example, about 0.5 mm in its natural state. According to such a configuration, the second filler 92 is compressed between the cover 47 and the circuit board 40 , closing various sizes of clearances in the case, and providing a space between the cover 47 and the circuit board 40 . Since the load can be transmitted at , the vibration resistance is further improved.

As shown in FIG. 7 , the second filler 92 of this embodiment is arranged to extend in the vertical direction, that is, along the longitudinal direction of the circuit board 40 . Also, the second filler 92 is arranged so as to extend in the horizontal direction at each of the upper end and the lower end. Thereby, the second filler 92 is stably fixed to the rear surface 48 of the cover 47 .

Although the configuration of the first module 30 has been described with reference to FIGS. 6 and 7 as described above, the second module 50 is also configured similarly to the first module 30 . That is, like the first module 30, the second module 50 has a circuit board, a case, and a cover. In addition, in the second module 50 as well, an in-case clearance is formed between the cover and the circuit board. Therefore, the second module 50, like the first module 30, preferably has a second filler disposed in the case clearance.

The electronic device 1 of this embodiment includes not only the first module 30 and the second module 50 but also another module 70 as modules connected to the base module 10 . However, such other module 70 need not be provided. When the electronic device 1 includes three or more modules connected to the base module 10, any two modules connected adjacent to the base module 10 among the three or more modules are the first modules described above. 30 and a second module 50 may be configured.

Using the electronic device 1 of the present embodiment, an evaluation test of vibration resistance and impact resistance was conducted. As a result, we were able to pass the following evaluation test (according to ISO 13628) in which a load several times higher than the external specifications for vibration resistance and impact resistance of the following product was applied. The external specifications of the product were: vibration frequency range 10 Hz to 57 Hz, amplitude ±0.075 mm; frequency range 57 Hz to 150 Hz, acceleration 1 G; The evaluation test conditions were as follows: vibration: frequency range 5 Hz to 25 Hz; amplitude ±2 mm; frequency range 25 Hz to 1000 Hz; acceleration 5 G; impact: acceleration 30 G; action time 13 ms; half sine waveform. As described above, if the electronic device 1 of the present embodiment is used, there is no need to design special parts such as a metal housing in order to meet the standards for vibration resistance and impact resistance, and a normally used resin housing can be used. body etc. can be used.

FIG. 8 is a diagram showing a first module 30a as a modified example of the first module 30 and a second module 50a as a modified example of the second module 50. As shown in FIG. As shown in FIG. 8, the first module 30a has a relay connector 36 located on the first surface 32. As shown in FIG. The second module 50 a also has a relay connector 56 arranged on the second surface 52 . The relay connector 56 is electrically connected to the relay connector 36 of the first module 30a. According to such a configuration, the relay connector 36 and the relay connector 56 can enhance the support between the first module 30a and the second module 50a, thereby improving vibration resistance. In addition, the relay connector 36 and the relay connector 56 enable direct electrical connection between the first module 30a and the second module 50a without the base module 10 being interposed. In the example shown in FIG. 8 , a plurality of connecting holes 37 are arranged on the first surface 32 , and connecting protrusions 57 inserted into the plurality of connecting holes 37 are arranged on the second surface 52 . The connection between the connecting hole 37 and the connecting projection 57 further stabilizes the connection state between the first module 30a and the second module 50a.

Even when the first module 30a and the second module 50a are connected, a clearance is formed between the first surface 32 and the second surface 52 as in the above embodiment. The clearance is, for example, approximately 0.3 mm. Therefore, also in this example, it is preferable to use the first filler 91a arranged in the clearance. The first filler 91a is preferably arranged so as to close (fill) the clearance. Specifically, the first filler material 91a is intimately disposed on at least a portion of the first surface 32 of the first module 30a and at least a portion of the second surface 52 of the second module 50a to provide a separation between the first module 30a and the second module 30a. Preferably, the module 50a is fixed. According to such a configuration, since the first module 30a and the second module 50a are fixed so as to support each other via the first filler 91a, the rigidity is increased and the vibration resistance is improved. As shown in FIG. 8 , the first filler 91 a of this example is fixed to the second surface 52 . Specifically, the first filler 91 a is arranged on the second surface 52 so as to avoid the relay connector 56 and the connecting protrusion 57 . The first filler 91 a may be fixed to the first surface 32 instead of the second surface 52 .

The material of the first filler 91a is, for example, an elastic body. Elastic bodies include, for example, rubber, sponge, gel-like substances, and the like. When an elastic body is used as the material, the first filler 91a preferably has a thickness greater than the clearance, for example, about 0.5 mm, in a natural state. According to such a configuration, the first filler 91a is compressed between the first module 30a and the second module 50a to fill clearances of various sizes, thereby Vibration resistance is further improved because the load can be transmitted between them.

The first module 30a and the second module 50a are connected to each other via the first filler 91a, and the first module 30a and the second module 50a are integrated into the base module 10 (see FIG. 1, etc.). to connect. Therefore, it is preferable that the first filler 91 a be configured to be fixed to both the first surface 32 and the second surface 52 . As a configuration in which the first filler 91a is fixed to both the first surface 32 and the second surface 52, for example, there is a configuration in which the first filler 91a is a gel-like substance. With such a configuration, mutual movement of the first module 30a and the second module 50a after being fitted to the base module 10 along the first surface 32 and the second surface 52 is suppressed. . Other configurations of the first module 30a and the second module 50a are the same as those of the first module 30 and the second module 50 of the above-described embodiment, respectively, so description thereof will be omitted.

The present disclosure is not limited to the configurations specified in the respective embodiments described above, and various modifications are possible without departing from the scope of the claims.

The present disclosure relates to electronic equipment.

1: Electronic Device 10: Base Module 11: First Connector 12: Second Connectors 13, 13a: Locking Portions 14, 14a: Fitting Portions 30, 30a: First Module 31: Connector 32: First Surface 33: Connection Surface 34: One end of connection surface 35: Other end of connection surface 36: Relay connector 37: Connection hole 40: Circuit board 41: One end of circuit board 42: Other end of circuit board 44: Case 45: Opening 46: Regulating portion 47 : cover 48: back surface 50, 50a: second module 51: connector 52: second surface 53: connection surface 54: one end of connection surface 55: other end of connection surface 56: relay connector 57: connecting projection 70: other module 91, 91a: first filler 92: second filler C1: clearance between the first surface and the second surface C2: clearance between the cover and the other end of the circuit board

Claims (8)

a base module having at least a first connector and a second connector for connecting the modules;
a first module having a first surface detachably matingly connected to the first connector;
a second module adjacent to the first module, detachably matingly connected to the second connector and having a second surface arranged to face the first surface;
a filler disposed in a clearance between the first surface and the second surface;
the filler material is intimately disposed on at least a portion of the first surface and at least a portion of the second surface to secure the first module and the second module ;
the first module has a relay connector disposed on the first surface;
The electronic device , wherein the second module has a relay connector disposed on the second surface and electrically connected to the relay connector of the first module . The first module has one end and the other end located opposite to each other, and has a connection surface on which a connector detachably fitted and connected to the first connector is arranged,
The base module is detachable by rotating the locking portion that locks the one end of the connection surface and the first module with the one end of the connection surface locked to the locking portion. , and a fitting portion fitted to the other end of the connection surface. 3. The electronic device according to claim 2, wherein said first surface and said connection surface of said first module are planes extending in a vertical direction. The first module includes a circuit board having one end having a connector detachably fitted and connected to the first connector and the other end located on the opposite side of the one end, and the other end of the circuit board being exposed. a case having an opening and to which the circuit board is attached, a cover attached to the case, and another filler disposed in the clearance between the cover and the other end of the circuit board; The electronic device according to any one of claims 1 to 3. 5. The electronic device according to claim 4, wherein said case has a rectangular parallelepiped shape. 6. The electronic device according to claim 5, wherein said case has a flat shape. 7. The electronic device according to any one of claims 4 to 6, wherein said other filler includes rubber, sponge or gel-like substance. 8. The electronic device according to any one of claims 1 to 7 , wherein said filler includes rubber, sponge or gel-like substance.

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