JP7141306B2 - Welding equipment - Google Patents

Description

The present invention relates to a joining device.

Laminated ultrasonic bonding is a bonding method in which two workpieces are overlapped and set between an anvil (workbench) and a horn (ultrasonic tool), and the workpieces are bonded by ultrasonically vibrating the horn. . Japanese Patent No. 3780637 (Patent Document 1) discloses a bonding quality determination method in superimposed ultrasonic bonding.

Japanese Patent No. 3780637

In the superimposed ultrasonic bonding method disclosed in Japanese Patent No. 3780637 (Patent Document 1), bonding is performed according to predetermined bonding parameters such as set pressure, amplitude, and time, and a workpiece (plate) to be bonded when bonding is completed. The bonding quality is determined by the amount of displacement between the two. However, since this method does not judge the quality during the bonding process, if the bonding parameters are not appropriate, the bonding quality may deteriorate or the yield may decrease.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object thereof is to provide a welding apparatus capable of obtaining good quality welding regardless of initial setting of welding parameters.

TECHNICAL FIELD The present disclosure relates to a joining device that joins an upper plate and a lower plate. The joining device includes an anvil for placing the lower plate, a horn for transmitting vibration to the upper plate, a pressure device for pressing the horn toward the anvil, a vibrating device for applying vibration to the horn, the upper plate and the lower plate. and a control device for controlling the pressurizing device and the vibrating device. During the bonding time during which the horn is pressed toward the anvil by the pressurizing device and the horn is vibrated by the vibrating device, the magnitude of the acceleration of the vibration detected by the vibration detector exceeds the threshold value. Repeatedly lowering the pressure of the pressure device so as not to

In this case, since the control device adjusts the pressure of the pressure device, good bonding can be obtained without damaging the upper plate, lower plate, horn and anvil.

Preferably, the vibration detector includes an acceleration sensor that detects acceleration of the lower plate.
With the acceleration sensor, the control device can detect the acceleration of the lower plate, so that the degree of welding progress can be known, and the welding parameters can be adjusted according to the degree of welding progress.

Preferably, the vibration detector includes an acceleration sensor that detects acceleration of the upper plate.
With the acceleration sensor, the control device can detect the acceleration of the upper plate, so that the degree of progress of welding can be known, and the welding parameters can be adjusted according to the degree of progress of welding.

According to the joining apparatus of the present invention, good quality joining can be obtained regardless of the initial setting of joining parameters.

It is a figure which shows the structure of the joining apparatus which concerns on this Embodiment. 2 is a functional block diagram showing the configuration of the control device 100; FIG. 4 is a flowchart for explaining the content of control executed by the control device 100 in Embodiment 1. FIG. FIG. 10 is a waveform diagram for explaining a comparison between a case where a joining parameter is adjusted during joining and a case where the joining parameter is not adjusted. FIG. 5 is a diagram showing a configuration of a joining device according to a modification of Embodiment 1; 9 is a flowchart for explaining the content of control executed by the control device 100 in Embodiment 2;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. A plurality of embodiments will be described below, but appropriate combinations of the configurations described in the respective embodiments have been planned since the filing of the application. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

[Embodiment 1]
FIG. 1 is a diagram showing the configuration of a joining apparatus according to this embodiment. With reference to FIG. 1 , the bonding apparatus 1 includes a power source 20 , a vibrating device 30 , a support portion 40 , a pressure device 50 , a vibration sensor 60 and a control device 100 .

The support portion 40 supports the upper plate 72 as the first base material and the lower plate 71 as the second base material. The support portion 40 includes a horn 41 that vibrates the upper plate 72 and an anvil 42 that fixes the lower plate 71 . The support portion 40 generates relative motion between the upper plate 72 and the lower plate 71 by being vibrated by the vibrating device 30 . The pressurizing device 50 presses the upper plate 72 toward the lower plate 71 . The vibration sensor 60 is used as a motion detector that detects relative motion between the upper plate 72 and the lower plate 71 .

The control device 100 controls the vibrating device 30 and the pressurizing device 50 that vibrate the supporting portion 40 . The controller 100 adjusts the bonding parameter according to the output of the vibration sensor 60 during bonding in which the pressure device 50 presses the upper plate 72 toward the lower plate 71 and the support portion 40 generates relative motion. adjust the In Embodiment 1, this bonding parameter is the pressure applied by the pressure device 50 .

An example in which the bonding apparatus 1 is an ultrasonic bonding apparatus will be described below, but the bonding apparatus of this embodiment is not limited to ultrasonic bonding. The improvement disclosed in this embodiment can be widely applied to a welding apparatus that heats and welds a first base material and a second base material by frictional force.

Ultrasonic bonding is a bonding method in which ultrasonic band vibration is generated between a first member and a second member to bond them. Normally, welding is performed by setting welding parameters such as the time and amplitude of vibration and the pressure to be applied between members in the welding apparatus in advance.

If there is a bonding database that stores the bonding parameters of each material, bonding can be performed according to the database.

In the present embodiment, in ultrasonic lap welding, the pressure is automatically adjusted based on the difference in acceleration between the bottom plate and the anvil of the workpiece to be welded from the start of welding to the completion of welding with respect to the set pressure, amplitude, and time. to adjust. Thereby, the bonding quality of ultrasonic bonding can be ensured.

Referring to FIG. 1 again, the bonding apparatus 1 includes an anvil 42 on which a lower plate 71 is placed, a horn 41 that transmits vibration to the upper plate 72, and a pressurizing device 50 that presses the horn 41 toward the anvil 42. , a vibrating device 30 for vibrating the horn 41, a vibration sensor 60 for detecting vibration of at least one of the upper plate 72 and the lower plate 71, and a control device 100 for controlling the pressure device 50 and the vibrating device 30. and

The vibrating device 30 includes a vibrator 31 that vibrates by receiving a high frequency from a power supply 20 that generates a high-frequency AC voltage for joining from a commercial power supply 10 , and an amplifier 32 that amplifies the vibration of the vibrator 31 .

The control device 100 adjusts the bonding parameter according to the output of the vibration sensor 60 during bonding in which the pressure device 50 presses the horn 41 toward the anvil 42 and the vibrating device 30 vibrates the horn 41 . adjust the

Since the control device 100 adjusts the bonding parameters in this manner, good quality bonding can be obtained regardless of the values of the initially set bonding parameters.

In Embodiment 1, the bonding parameter is the pressure applied by the pressure device 50 . In this case, since the control device 100 adjusts the pressure applied by the pressure device 50, good bonding can be obtained without damaging the upper plate 72, the lower plate 71, the horn 41, and the anvil .

Preferably, an acceleration sensor that detects acceleration of the lower plate 71 can be used as the vibration sensor 60 . Since the contact area between the lower plate 71 and the anvil 42 is larger than the contact area between the upper plate 72 and the horn 41 , the frictional force acting between the lower plate 71 and the anvil 42 is greater than the frictional force acting between them. Further, the anvil 42 is stationary, and a frictional force works so that the lower plate 71 is stationary together with the anvil 42 . On the other hand, the horn 41 is vibrating, and a frictional force acts on the upper plate 72 so that it vibrates together with the horn 41 . In this case, if the weight of the top plate 72 is large or the material of the top plate 72 is soft, the top plate 72 may not be able to follow the vibration of the horn 41 . Therefore, while the top plate 72 and the bottom plate 71 are unbonded, the relative velocity and relative acceleration between the bottom plate 71 and the anvil 42 are zero relative to the relative velocity and relative acceleration between the top plate 72 and the horn 41. is considered to be close to As the bonding progresses, the vibration of the horn 41 is more likely to be transmitted to the lower plate 71, so the relative velocity and relative acceleration, which were close to zero, increase.

With the acceleration sensor, the control device 100 can detect the acceleration Asp of the lower plate 71, so that the degree of welding progress can be known, and the welding parameters can be adjusted according to the degree of welding progress.

FIG. 2 is a functional block diagram showing the configuration of the control device 100. As shown in FIG. Referring to FIG. 2 , control device 100 includes an acceleration calculator 101 , a pressure calculator 102 , a pressure controller 103 , a vibration controller 104 , a timer 105 and a setting panel 106 .

Via the setting panel 106, the operator inputs initial welding parameters such as a set time St, a set amplitude Svw, and a set pressure Sp to the control device 100. FIG.

The acceleration calculator 101 receives the acceleration Asp of the lower plate 71 from the vibration sensor 60 . The pressure calculator 102 calculates a pressure correction command value Pca indicating the pressure generated by the pressurizing device 50 based on the acceleration Au calculated by the acceleration calculator 101 .

The timer 105 calculates the operating time Tp of the pressure control section 103 and the operating time Tv of the vibration control section 104 based on the set time St.

The pressure control unit 103 applies the pressure Pset to the pressurizing device 50 during the operation time Tp based on the set pressure Sp, which is the initial value, and the pressure correction command value Pca.

The vibration control unit 104 causes the vibrating device 30 to vibrate with the amplitude Vset during the operation time Tv based on the initial values of the set amplitude Svw and the acceleration Au.

The control device 100 can be realized by a microcomputer containing a processor and memory. A program stored in the memory is read into the processor and causes the processor to operate as each functional block shown in FIG.

FIG. 3 is a flowchart for explaining the content of control executed by control device 100 in the first embodiment. 1 to 3, initial values of welding parameters such as pressure, time and amplitude are set from the setting panel 106 in step S1. The control device 100 determines whether or not there is a welding start input in step S2. For example, a welding start input is given by pressing an operation button provided on the welding device.

When there is a joining start input (YES in S2), in step S3, the control device 100 causes the pressurizing device 50 to start applying pressure at the initial set pressure. Subsequently, in step S4, the control device 100 activates the vibrating device 30 to start time measurement by the timer.

In subsequent step S<b>5 , control device 100 obtains acceleration Asp from vibration sensor 60 . While the magnitude of the acceleration Asp is smaller than the threshold value (YES in S6), welding is not progressing, and the process returns to step S5 without lowering the pressure until the timer stops.

When the magnitude of the acceleration Asp exceeds the threshold value (NO in S6), bonding progresses, and the vibration of the horn begins to be transmitted to the lower plate 71 which is being bonded to the upper plate 72 as well. In this case, the process proceeds to step S7, and control device 100 instructs pressure device 50 to reduce the pressure.

In step S8, when the stop time set in the timer arrives, the process proceeds to step S9, where the control device 100 stops the vibrating device 30, stops pressurization of the pressurizing device 50 in step S10, and step S11. ends the joining process.

FIG. 4 is a waveform diagram for explaining a comparison between the case where the welding parameters are adjusted while the welding is in progress and the case where the welding parameters are not adjusted. The upper part of FIG. 4 shows the acceleration Asp of the lower plate 71 . The lower part of FIG. 4 shows the pressure P applied by the pressure device 50 .

In FIG. 4, the acceleration A1 and the pressure P1 (solid line) indicate the case where the bonding apparatus 1 of the present embodiment is used, and the acceleration A0 and the pressure P0 (broken line) indicate the case of using the bonding apparatus without the adjustment function of the bonding parameters. The case of using

Pressurization by the pressurizing device 50 is started at time t1. The applied pressure at this time is the initial set value. At time t2, application of vibration by the vibrating device 30 is started.

As indicated by the applied pressure P0, if the applied pressure is kept constant during the welding process, the lower plate 71 vibrates together with the upper plate 72 as the welding progresses. Therefore, the acceleration gradually increases as indicated by the acceleration A0. This is undesirable because it indicates that the lower plate 71 moves relative to the anvil 42 and the projections of the anvil 42 damage the lower plate 71 .

On the other hand, as indicated by the applied pressure P1, when the applied pressure is adjusted within a range in which the acceleration A1 does not increase, it is possible to prevent the protrusion of the anvil 42 from damaging the lower plate 71 .

[Modification of Embodiment 1]
In the first embodiment, the pressing force is adjusted considering that the lower plate 71 fixed to the anvil 42 vibrates together with the upper plate 72 as the bonding progresses. In the first embodiment, when the upper plate 72 and the lower plate 71 are not joined, it is better to detect the relative velocity or relative acceleration between the lower plate 71 and the anvil 42 than the contact between the upper plate 72 and the horn 41 . It has been described that detecting the unbonded state is more accurate than detecting the relative velocity or relative acceleration between. However, after the upper plate 72 and the lower plate 71 are in a joined state, if the fixation between the anvil 42 and the lower plate 71 is strong, the upper plate 72 and the lower plate 71 may be attached to the anvil 42 together with the lower plate 71 . , and it may be better to detect when the vibration of the horn 41 is no longer transmitted to the upper plate 72 . A modified example of the first embodiment shows a configuration in which the pressure can be adjusted in such a case.

FIG. 5 is a diagram showing a configuration of a joining device according to a modification of Embodiment 1. FIG. The bonding apparatus 100A shown in FIG. It includes a vibrating device 30 that applies vibration, a vibration detection unit that detects vibration of at least one of the upper plate 72 and the lower plate 71 , and a control device 100 that controls the pressing device 50 and the vibrating device 30 . In this modification, the vibration detector includes an acceleration sensor 160 that detects acceleration of the upper plate and an acceleration sensor 161 that detects acceleration of the horn 41 .

Except for the vibration detection section, the bonding apparatus 100A shown in FIG. 5 has the same configuration as the bonding apparatus 1 shown in FIG. 1, so the description will not be repeated here.

The acceleration sensor 160 allows the control device 100 to detect the acceleration Asp of the top plate 72 . Further, the acceleration sensor 161 allows the controller 100 to detect the acceleration Ash of the horn 41 . The control device 100 can calculate the difference between the acceleration Ash and the acceleration Asp, and know the degree of progress of bonding based on the calculated acceleration difference. Therefore, as in the first embodiment, the bonding parameters can be adjusted according to the progress of bonding.

As described above, in Embodiment 1, since the bonding parameters are adjusted according to the degree of progress of bonding, defective bonding is reduced, and damage to the horn 41, the anvil 42, the upper plate 72, and the lower plate 71 is prevented. be able to.

[Embodiment 2]
In Embodiment 1, the welding parameter adjusted by the controller 100 during welding was the pressure applied by the pressure device 50 . On the other hand, in the second embodiment, the welding parameter adjusted by the controller 100 during welding is the amplitude with which the vibrating device 30 vibrates the horn 41 . In this case, since the control device 100 adjusts the amplitude of vibration of the vibrating device 30, good bonding can be obtained without damaging the upper plate 72, the lower plate 71, the horn 41, and the anvil 42. FIG.

Since the configuration of the bonding apparatus of Embodiment 2 is the same as that of the bonding apparatus 1 described with reference to FIG. 1, the description will not be repeated here.

FIG. 6 is a flowchart for explaining the content of control executed by control device 100 in the second embodiment. In the process of the flowchart of FIG. 6, step S7A is executed instead of step S7 in the process of the flowchart of FIG.

Referring to FIG. 6, initial values of welding parameters such as pressure, time and amplitude are set from setting panel 106 in step S1. The control device 100 determines whether or not there is a welding start input in step S2. For example, a welding start input is given by pressing an operation button provided on the welding device.

When there is a joining start input (YES in S2), in step S3, the control device 100 causes the pressurizing device 50 to start applying pressure at the initial set pressure. Subsequently, in step S4, the control device 100 activates the vibrating device 30 to start time measurement by the timer.

In subsequent step S<b>5 , control device 100 obtains acceleration Asp from vibration sensor 60 . While the magnitude of the acceleration Asp is smaller than the threshold value (YES in S6), welding is not progressing, and the process returns to step S5 without lowering the pressure until the timer stops.

When the magnitude of the acceleration Asp exceeds the threshold value (NO in S6), bonding progresses, and the vibration of the horn begins to be transmitted to the lower plate 71 which is being bonded to the upper plate 72 as well. In this case, the process proceeds to step S7A, and control device 100 instructs vibrating device 30 to reduce the amplitude of vibration.

In step S8, when the stop time set in the timer arrives, the process proceeds to step S9, where the control device 100 stops the vibrating device 30, stops pressurization of the pressurizing device 50 in step S10, and step S11. ends the joining process.

Note that the configuration of the modification shown in FIG. 5 can also be applied to the second embodiment.

As described above, in the second embodiment as well, since the bonding parameters are adjusted in accordance with the progress of bonding, defective bonding is reduced and damage to the horn 41, the anvil 42, the upper plate 72, and the lower plate 71 is prevented. can be prevented.

The embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the description of the above-described embodiments, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.

1,100A joining device, 10 commercial power source, 20 power source, 30 device, 31 vibrator, 32 amplifier, 40 support portion, 41 horn, 42 anvil, 50 pressure device, 60 vibration sensor, 71 lower plate, 72 upper plate, 100 control device, 101 acceleration calculator, 102 pressure calculator, 103 pressure controller, 104 vibration controller, 105 timer, 106 setting panel, 160, 161 acceleration sensor.

Claims (5)

A joining device for joining an upper plate and a lower plate,
an anvil on which the lower plate is placed;
a horn for transmitting vibration to the upper plate;
a pressure device that presses the horn toward the anvil;
a vibrating device that vibrates the horn;
a vibration detection unit that detects vibration of at least one of the upper plate and the lower plate;
A control device that controls the pressurizing device and the vibrating device,
The control device presses the horn toward the anvil by the pressurizing device and accelerates the vibration detected by the vibration detection unit during the bonding time during which the horn is vibrated by the vibrating device. The bonding device repeatedly lowers the pressure applied by the pressure device so that the magnitude of the pressure does not exceed a threshold value . A joining device for joining an upper plate and a lower plate,
an anvil on which the lower plate is placed;
a horn for transmitting vibration to the upper plate;
a pressure device that presses the horn toward the anvil;
a vibrating device that vibrates the horn;
a vibration detection unit that detects vibration of at least one of the upper plate and the lower plate;
A control device that controls the pressurizing device and the vibrating device,
The control device presses the horn toward the anvil by the pressurizing device and accelerates the vibration detected by the vibration detecting unit during the bonding time during which the horn is vibrated by the vibrating device. A bonding apparatus that repeats lowering the amplitude at which the vibrator vibrates the horn such that the amplitude does not exceed a threshold value . The bonding time is set in advance,
3. The bonding apparatus according to claim 1, wherein said control device stops the vibration by said vibrating device and the pressurization by said pressurizing device when said bonding time elapses. The bonding apparatus according to any one of claims 1 to 3, wherein the vibration detection section includes an acceleration sensor that detects acceleration of the lower plate. The bonding apparatus according to any one of claims 1 to 3, wherein said vibration detection section includes an acceleration sensor that detects acceleration of said upper plate.

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