JP7134819B2 - Control device - Google Patents

Control device Download PDF

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Publication number
JP7134819B2
JP7134819B2 JP2018188506A JP2018188506A JP7134819B2 JP 7134819 B2 JP7134819 B2 JP 7134819B2 JP 2018188506 A JP2018188506 A JP 2018188506A JP 2018188506 A JP2018188506 A JP 2018188506A JP 7134819 B2 JP7134819 B2 JP 7134819B2
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housing
electric wire
internal
control device
side connector
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JP2020057716A (en
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毅 田頭
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Kawasaki Motors Ltd
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Kawasaki Jukogyo KK
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Priority to JP2018188506A priority Critical patent/JP7134819B2/en
Priority to KR1020217011532A priority patent/KR102562709B1/en
Priority to PCT/JP2019/038982 priority patent/WO2020071447A1/en
Priority to CN201980048646.8A priority patent/CN112514057B/en
Publication of JP2020057716A publication Critical patent/JP2020057716A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0054Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/069Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明は、制御装置に関する。 The present invention relates to control devices.

従来から、サーボモータを制御するサーボアンプは発熱量が大きいことから、これを冷却することが知られている。 2. Description of the Related Art Conventionally, it has been known to cool a servo amplifier that controls a servo motor because it generates a large amount of heat.

例えば、特許文献1には、サーボアンプ及びヒートシンクが一体的に壁板に取り付けられ、壁板の一方の側にサーボアンプが位置するとともにヒートシンクが壁板を他方の側へ貫通しており、この壁板から露出したヒートシンクが、壁板に沿って通流される空気によって冷却される電動射出成型機のドライバの冷却構造が開示されている。 For example, Patent Document 1 discloses that a servo amplifier and a heat sink are integrally attached to a wall plate, the servo amplifier is positioned on one side of the wall plate, and the heat sink penetrates the wall plate to the other side. A cooling structure for a driver of an electric injection molding machine is disclosed in which a heat sink exposed from a wall plate is cooled by air flowing along the wall plate.

特開平9-254214公開特許公報(特に図1参照)Japanese Unexamined Patent Application Publication No. 9-254214 (especially see FIG. 1)

しかし、上記従来のドライバの冷却構造では、サーボアンプが筐体に収容された場合、サーボアンプから延出するモータ動力線の発熱によって筐体内の温度が高くなるという問題が生じる。また、このような問題は、通電により発熱する回路素子(以下、発熱回路素子という)を含む制御回路を筐体に収容する制御装置に共通する問題である。 However, in the above-described conventional driver cooling structure, when the servo amplifier is accommodated in the housing, the heat generated by the motor power line extending from the servo amplifier raises the temperature inside the housing. Moreover, such a problem is common to control devices in which a control circuit including a circuit element that generates heat when energized (hereinafter referred to as a heat generating circuit element) is housed in a housing.

本発明はこのような課題を解決するためになされたもので、通電により発熱する回路素子から延出する電線の発熱による筐体内の温度上昇を抑制することが可能な制御装置を提供することを目的としている。 SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and it is an object of the present invention to provide a control device capable of suppressing temperature rise in a housing caused by heat generated by electric wires extending from circuit elements that generate heat when energized. purpose.

上記目的を達成するために、本発明のある形態(aspect)に係る制御装置は、通電により発熱する発熱回路素子を含む制御回路を収容する回路収容室と前記発熱回路素子のヒートシンクを冷却する外気が流通する外気流路とが隔壁によって内部に区画された筐体と、前記回路収容室の室壁を構成する前記筐体の壁に設けられた、外部電線の一端に設けられた電線側コネクタが外側から着脱される筐体側コネクタと、一端が前記発熱回路素子に接続され、他端が前記筐体側コネクタに内側から接続された内部電線と、を備え、前記内部電線は、前記発熱回路素子から延出し、次いで、前記隔壁を貫通して前記外気流路に進出し、次いで、当該外気流路内を延伸し、次いで、当該外気流路から前記隔壁を貫通して前記回路収容室に進入し、次いで、前記筐体側コネクタに至るように設けられている。ここで、「内部電線」は、単一の電線及び互いに接続された複数の電線を意味する。 To achieve the above object, a control device according to an aspect of the present invention comprises a circuit housing chamber for housing a control circuit including a heat generating circuit element that generates heat when energized, and outside air for cooling a heat sink of the heat generating circuit element. and a wire-side connector provided at one end of an external wire provided on the wall of the housing, which constitutes the wall of the circuit housing chamber. and an internal wire having one end connected to the heat generating circuit element and the other end connected to the housing side connector from the inside, wherein the internal wire is connected to the heat generating circuit element , then penetrates the partition wall and advances into the external air flow path, then extends inside the external air flow path, and then penetrates the partition wall from the external air flow path and enters the circuit housing chamber Then, it is provided so as to reach the housing-side connector. Here, "internal wire" means a single wire and multiple wires connected together.

この構成によれば、発熱回路素子と筐体側コネクタとを接続する内部電線の一部が外気流路に延在し、当該外気流路を通流する外気によって冷却される。一方、回路収容室の内部には残りの内部電線しか存在しないので、内部電線の発熱に起因する回路収容室の温度上昇を抑制することができる。その結果、通電により発熱する回路素子から延出する電線の発熱による筐体内の温度上昇を抑制することが可能な制御装置を提供することができる。 According to this configuration, a part of the internal electric wire connecting the heat-generating circuit element and the housing-side connector extends to the external air flow path, and is cooled by the external air flowing through the external air flow path. On the other hand, since only the remaining internal wires are present inside the circuit housing chamber, it is possible to suppress temperature rise in the circuit housing chamber due to heat generation of the internal wires. As a result, it is possible to provide a control device capable of suppressing temperature rise in the housing due to heat generated by wires extending from circuit elements that generate heat when energized.

前記発熱回路素子がパワーモジュールであり、前記内部電線及び前記外部電線が、それぞれ、内部動力線及び外部動力線であってもよい。 The heating circuit element may be a power module, and the internal electric wire and the external electric wire may be an internal power line and an external power line, respectively.

この構成によれば、通電による発熱量が特に大きいパワーモジュールから延出する内部動力線は発熱量が特に大きいので、内部電線の発熱に起因する回路収容室の温度上昇の抑制効果がより顕著になる。 According to this configuration, since the internal power line extending from the power module, which generates a particularly large amount of heat when energized, generates a particularly large amount of heat, the effect of suppressing the temperature rise in the circuit housing chamber due to the heat generated by the internal wire is more pronounced. Become.

前記回路収容室は密室であり、前記筐体側コネクタは少なくとも気密に設けられ、前記内部動力線は少なくとも気密に前記隔壁を貫通していてもよい。 The circuit housing chamber may be a closed chamber, the housing-side connector may be provided at least airtightly, and the internal power line may pass through the partition wall at least airtightly.

この構成によれば、回路収容室は密室であるので、内部電線の発熱量が同じあっても回路収容室が密室でない場合に比べて、内部電線の発熱に起因する回路収容室の温度上昇が大きくなる。従って、内部電線の発熱に起因する回路収容室の温度上昇の抑制効果がより顕著になる。 According to this configuration, since the circuit housing chamber is a closed room, the temperature rise in the circuit housing chamber due to the heat generation of the internal wires is less than in the case where the circuit housing chamber is not a sealed chamber even if the heat generation amount of the internal wires is the same. growing. Therefore, the effect of suppressing the temperature rise in the circuit housing chamber caused by the heat generated by the internal wires becomes more pronounced.

前記内部動力線の前記一端に近い前記隔壁における当該内部動力線の貫通部分が前記パワーモジュールの近傍に位置し、前記内部動力線の前記一端から遠い前記隔壁における当該内部動力線の貫通部分が前記コネクタの近傍に位置していてもよい。 A penetrating portion of the internal power line in the partition near the one end of the internal power line is located near the power module, and a penetrating portion of the internal power line in the partition far from the one end of the internal power line is the It may be located near the connector.

この構成によれば、内部電線のうちの外気流路に延在する部分の割合が大きくなるので、内部電線の発熱に起因する回路収容室の温度上昇の抑制効果が大きくなる。 According to this configuration, the proportion of the portion of the internal wire that extends to the outside air passage is increased, so the effect of suppressing the temperature rise in the circuit housing chamber due to the heat generated by the internal wire is increased.

前記ヒートシンクは、少なくとも前記隔壁の一部を構成することによって前記外気流路に露出していてもよい。 The heat sink may be exposed to the outside air flow path by forming at least a part of the partition wall.

この構成によれば、ヒートシンクを効果的に冷却することができる。 With this configuration, the heat sink can be effectively cooled.

前記制御装置が、多関節ロボットの動作を制御するロボット制御器であり、前記発熱回路素子が、前記多関節ロボットの関節を駆動するサーボモータを制御するサーボアンプであり、前記電線がモータ動力線であってもよい。 The control device is a robot controller for controlling the motion of the multi-joint robot, the heating circuit element is a servo amplifier for controlling a servo motor that drives the joints of the multi-joint robot, and the electric wire is a motor power line. may be

この構成によれば、多関節ロボットの関節を駆動するサーボモータを制御するサーボアンプの数が多いので、内部電線の発熱に起因する回路収容室の温度上昇の抑制効果がより顕著になる。 According to this configuration, since the number of servo amplifiers controlling the servo motors that drive the joints of the articulated robot is large, the effect of suppressing the temperature rise in the circuit housing chamber caused by the heat generated by the internal wires becomes more pronounced.

本発明は、通電により発熱する回路素子から延出する電線の発熱による筐体内の温度上昇を抑制することが可能な制御装置を提供することができるという効果を奏する。 Advantageous Effects of Invention The present invention has the effect of providing a control device capable of suppressing temperature rise in a housing due to heat generated by wires extending from circuit elements that generate heat when energized.

図1は、本発明の実施形態1に係る制御装置の構成の一例を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a control device according to Embodiment 1 of the present invention.

以下、本発明の実施の形態を、図面を参照しながら説明する。なお、以下では全ての図を通じて同一又は相当する要素には同一の参照符号を付して、その重複する説明を省略する。また、本発明は、以下の実施形態に限定されない。なお、以下の図は、本発明を説明するための図であるので、本発明に関係のない要素が省略される場合、誇張等により寸法が正確でない場合等がある。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same or corresponding elements are denoted by the same reference numerals throughout all the drawings, and duplicate descriptions thereof will be omitted. Moreover, the present invention is not limited to the following embodiments. It should be noted that the following figures are for the purpose of explaining the present invention, and therefore there may be cases where elements unrelated to the present invention are omitted, or where dimensions are not accurate due to exaggeration or the like.

(実施形態1)
[構成]
図1は、本発明の実施形態1に係る制御装置の構成の一例を模式的に示す断面図である。
(Embodiment 1)
[Constitution]
FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a control device according to Embodiment 1 of the present invention.

図1を参照すると、制御装置100は、筐体1と、筐体側コネクタ5と、内部電線7と、を備える。 Referring to FIG. 1 , the control device 100 includes a housing 1 , a housing-side connector 5 and an internal wire 7 .

制御装置100の用途は、特に限定されない。なお、制御装置100がロボット制御装置である形態が実施形態2において説明される。 The application of the control device 100 is not particularly limited. A form in which the control device 100 is a robot control device will be described in the second embodiment.

筐体1は、内部に回路収容室2と外気流路3とが隔壁4によって区画されている。回路収容室2は、密室(密閉されている部屋)であってもよく、密室でなくてもよい。回路収容室2は、制御回路8を収容している。制御回路8は、例えば、回路基板11に複数の回路素子9a~9cが装着されている。回路素子9aは、発熱回路素子であるパワーモジュールである。回路素子9bは、パワーモジュール以外の発熱回路素子である。回路素子9cは、発熱回路素子9a,9b以外の一般の回路素子である。 The housing 1 has a circuit housing chamber 2 and an outside air flow path 3 partitioned by a partition wall 4 therein. The circuit housing chamber 2 may or may not be a closed room (a closed room). The circuit housing chamber 2 houses the control circuit 8 . The control circuit 8 has a plurality of circuit elements 9a to 9c mounted on a circuit board 11, for example. The circuit element 9a is a power module that is a heat generating circuit element. The circuit element 9b is a heating circuit element other than the power module. The circuit element 9c is a general circuit element other than the heating circuit elements 9a and 9b.

一般の回路素子9cは、例えば、回路基板11の表面に装着される。発熱回路素子9a,9bは、例えば、回路基板11の裏面に装着される。 A general circuit element 9c is mounted on the surface of the circuit board 11, for example. The heat generating circuit elements 9a and 9b are mounted on the back surface of the circuit board 11, for example.

発熱回路素子9a,9bの先端部には、薄い絶縁部材(図示せず)を介して隣接するように、ヒートシンク10がそれぞれ配置されている。各ヒートシンク10は、隔壁4を、回路収容室2から外気流路3へ貫通するように、当該隔壁4に取り付けられている。 Heat sinks 10 are arranged adjacent to the tips of the heating circuit elements 9a and 9b via a thin insulating member (not shown). Each heat sink 10 is attached to the partition wall 4 so as to pass through the partition wall 4 from the circuit housing chamber 2 to the outside air flow path 3 .

外気流路3の上流端及び下流端を構成する筐体1の壁には、それぞれ、外気入口3a及び外気出口3bが設けられている。外気入口3aの外方にはファン41及びモータ42が配置されている。ファン41は、モータ42によって駆動されて、外気流路3に外気を送る。ファン41により送られる外気は、外気入口3aから外気流路3に流入し、外気流路3を通流して外気出口3bから外に流出する。この際、隔壁4から外気流路3に露出している各ヒートシンク10が、通流する外気によって冷却される。 An outside air inlet 3a and an outside air outlet 3b are provided on the walls of the housing 1 that constitute the upstream end and the downstream end of the outside air flow path 3, respectively. A fan 41 and a motor 42 are arranged outside the outside air inlet 3a. The fan 41 is driven by a motor 42 to send outside air to the outside air flow path 3 . The outside air sent by the fan 41 flows into the outside air channel 3 from the outside air inlet 3a, flows through the outside air channel 3, and flows out from the outside air outlet 3b. At this time, each heat sink 10 exposed from the partition wall 4 to the outside air flow path 3 is cooled by the flowing outside air.

一方、回路収容室2の室壁を構成する筐体1の壁には、筐体側コネクタ5が、先端部が筐体1の外に突出するとともに基端部が回路収容室に突出するように設けられている。筐体側コネクタ5は、電線側コネクタ32と接合(嵌合)されて、コネクタ接合体(一対のコネクタ)を構成する。電線側コネクタ32は、外部電線6の先端部に設けられる。 On the other hand, on the wall of the housing 1 that constitutes the wall of the circuit housing chamber 2, the housing side connector 5 is arranged so that the distal end protrudes outside the housing 1 and the base end protrudes into the circuit housing chamber. is provided. The housing-side connector 5 is joined (fitted) to the wire-side connector 32 to form a connector assembly (a pair of connectors). The wire-side connector 32 is provided at the tip of the external wire 6 .

筐体側コネクタ5及び電線側コネクタ32として、周知のコネクタを用いることができる。従って、筐体側コネクタ5及び電線側コネクタ32の詳しい説明を省略する。筐体側コネクタ5と電線側コネクタ32とは接合されることによって互いに電気的に接続される。ここでは、筐体側コネクタ5が雌コネクタ(レセプタクル)であり、電線側コネクタ32が雄コネクタ(プラグ)であって、筐体側コネクタ5に電線側コネクタ32が嵌挿されるが、逆であってもよい。また、筐体側コネクタ5及び電線側コネクタ32は、互いに当接するとともに磁石の吸引力(又は係合等)によって接合される構造であってもよい。 Well-known connectors can be used as the housing-side connector 5 and the wire-side connector 32 . Accordingly, detailed description of the housing-side connector 5 and the wire-side connector 32 is omitted. The housing-side connector 5 and the wire-side connector 32 are electrically connected to each other by joining. Here, the housing-side connector 5 is a female connector (receptacle), the wire-side connector 32 is a male connector (plug), and the wire-side connector 32 is inserted into the housing-side connector 5, but the reverse is also possible. good. Further, the housing-side connector 5 and the wire-side connector 32 may have a structure in which they abut against each other and are joined by the attractive force (or engagement, etc.) of magnets.

なお、回路収容室2が密室である場合、筐体側コネクタ5は、筐体1を密閉するために、所定の密閉度(Degree of sealing)を有するように設けられ、且つ、電線側コネクタ32は、所定の密閉度を備える。この所定の密閉度は、例えば、少なくとも気密である密閉度に設定(設計)される。 When the circuit housing chamber 2 is a closed room, the housing side connector 5 is provided so as to have a predetermined degree of sealing in order to seal the housing 1, and the wire side connector 32 is provided with a predetermined degree of sealing. , with a predetermined tightness. This predetermined sealing degree is set (designed) to, for example, a sealing degree that is at least airtight.

内部電線7は、パワーモジュール9aと筐体側コネクタ5とを接続するように設けられる。従って、内部電線7及び外部電線6は、それぞれ、パワーモジュール9aに通電される動力用電流を流す内部動力線及び外部動力線である。内部電線7は、一部が外気流路3に延在するように設けられる。具体的には、内部電線7は、パワーモジュール9aから延出し、次いで、隔壁4を貫通して外気流路3に進出し、次いで、当該外気流路3内を延伸し、次いで、当該外気流路3から隔壁4を貫通して回路収容室2に進入し、次いで、筐体側コネクタ5に至るように設けられている。 The internal electric wire 7 is provided so as to connect the power module 9 a and the housing-side connector 5 . Therefore, the internal electric wire 7 and the external electric wire 6 are an internal power line and an external power line, respectively, through which a power current is supplied to the power module 9a. The internal electric wire 7 is provided so as to partially extend into the external air flow path 3 . Specifically, the internal electric wire 7 extends from the power module 9a, penetrates the partition wall 4, advances into the outside air flow path 3, extends inside the outside air flow path 3, and then extends into the outside air flow path 3. The path 3 penetrates the partition wall 4 to enter the circuit housing chamber 2 and then reaches the housing-side connector 5 .

回路収容室2には、発熱回路素子としてパワーモジュール9aとそれ以外の発熱回路素子9bとが存在するが、内部電線7が設けられるとともにその一部が外気流路3に配置される発熱回路素子は、ここでは、パワーモジュール9aのみである。内部電線7が設けられるとともにその一部が外気流路3に配置されるか否かは、発熱回路素子9a,9bの発熱量と回路収容室2の温度上昇の限度等を考慮して決定される。従って、パワーモジュール以外の発熱回路素子9bにも、内部電線7が設けられるとともにその一部が外気流路3に配置されてもよい。 A power module 9 a and other heat generating circuit elements 9 b are present as heat generating circuit elements in the circuit housing chamber 2 . is only the power module 9a here. Whether or not the internal wire 7 is provided and part of it is arranged in the outside air passage 3 is determined by considering the amount of heat generated by the heat generating circuit elements 9a and 9b and the limit of temperature rise in the circuit housing chamber 2. be. Therefore, the heat generating circuit element 9 b other than the power module may also be provided with the internal electric wire 7 and part of it may be arranged in the external air flow path 3 .

また、パワーモジュール9aとそれ以外の発熱回路素子9bの数は、ここでは、それぞれ1つとして例示されているが、特に制限されないことはいうまでもない。 Moreover, although the number of the power module 9a and the number of the other heat generating circuit elements 9b are illustrated here as one each, it goes without saying that the number is not particularly limited.

内部電線7は、単一の電線であっても、コネクタ等によって互いに接続された複数の電線であってもよい。 The internal wire 7 may be a single wire or multiple wires connected to each other by a connector or the like.

内部電線7は、図1にはパワーモジュール9aから延出する形態が示されている。しかし、例えば、回路基板11に、プリント配線によってパワーモジュール9aに接続された基板コネクタ(図示せず)が設けられ、内部電線7の基端に設けられた電線コネクタが当該基板コネクタに接続(嵌合)される形態であってもよい。 The internal electric wire 7 is shown in FIG. 1 as extending from the power module 9a. However, for example, the circuit board 11 is provided with a board connector (not shown) connected to the power module 9a by printed wiring, and the wire connector provided at the proximal end of the internal wire 7 is connected (fitted) to the board connector. may be combined).

隔壁4の内部電線7の貫通部分21,22には、例えば、内部電線7を保護する保護部材31が設けられる。保護部材31は、例えば、中心部に電線挿通孔が形成されていて、隔壁4の貫通孔に嵌めこまれるよう構成されている。このような保護部材31として、グロメットが例示される。なお、隔壁4の内部電線7の貫通部分21,22に、筐体側コネクタ5と同様の隔壁側コネクタが設けられ、内部電線7の外気流路側の端部に電線側コネクタ32と同様の電線側コネクタが設けられてもよい。 For example, protective members 31 for protecting the internal wires 7 are provided at the penetrating portions 21 and 22 of the partition wall 4 for the internal wires 7 . The protection member 31 has, for example, an electric wire insertion hole formed in the center thereof, and is configured to be fitted into the through hole of the partition wall 4 . A grommet is exemplified as such a protection member 31 . A partition-wall-side connector similar to the housing-side connector 5 is provided at the penetrating portions 21 and 22 of the internal wire 7 of the partition 4, and a wire-side connector similar to the wire-side connector 32 is provided at the end of the internal wire 7 on the outside air flow path side. A connector may be provided.

なお、回路収容室2が密室である場合、保護部材31は、筐体1を密閉するために、所定の密閉度を有するように設けられる。この所定の密閉度は、例えば、少なくとも気密である密閉度に設定(設計)される。 When the circuit housing chamber 2 is a closed room, the protective member 31 is provided so as to have a predetermined sealing degree in order to seal the housing 1 . This predetermined sealing degree is set (designed) to, for example, a sealing degree that is at least airtight.

ここでは、内部電線7のパワーモジュール9a側の端に近い隔壁4における当該内部電線7の貫通部分21がパワーモジュール9aの近傍に位置し、内部電線7のパワーモジュール9a側の端から遠い隔壁4における当該内部電線7の貫通部分22が筐体側コネクタ5の近傍に位置している。 Here, the penetrating portion 21 of the internal electric wire 7 in the partition wall 4 near the end of the internal electric wire 7 on the power module 9a side is located near the power module 9a, and the partition wall 4 far from the end on the power module 9a side of the internal electric wire 7 is located. , the penetrating portion 22 of the internal electric wire 7 is positioned near the housing-side connector 5 .

[作用効果]
次に、以上のように構成された制御装置の作用効果を説明する。
[Effect]
Next, the effects of the control device configured as described above will be described.

図1を参照すると、本実施形態によれば、発熱回路素子であるパワーモジュール9aと筐体側コネクタ5とを接続する内部電線7の一部が外気流路3に延在し、当該外気流路3を通流する外気によって冷却される。一方、回路収容室2の内部には残りの内部電線7しか存在しないので、内部電線7の発熱に起因する回路収容室2の温度上昇を抑制することができる。その結果、通電により発熱する回路素子9aから延出する電線7の発熱による筐体1内の温度上昇を抑制することが可能な制御装置100を提供することができる。 Referring to FIG. 1, according to this embodiment, a part of the internal electric wire 7 connecting the power module 9a, which is a heating circuit element, and the housing-side connector 5 extends to the external air flow path 3, and the external air flow path 3 is cooled by outside air passing through. On the other hand, since only the remaining internal wires 7 exist inside the circuit housing chamber 2, the temperature rise of the circuit housing chamber 2 caused by the heat generated by the internal wires 7 can be suppressed. As a result, it is possible to provide the control device 100 capable of suppressing the temperature rise in the housing 1 due to the heat generated by the wires 7 extending from the circuit elements 9a that generate heat when energized.

また、通電による発熱量が特に大きいパワーモジュール9aから延出する内部動力線である内部電線7は発熱量が特に大きいので、内部電線7の発熱に起因する回路収容室2の温度上昇の抑制効果がより顕著になる。 In addition, since the internal electric wire 7, which is an internal power line extending from the power module 9a, which generates a particularly large amount of heat when energized, generates a particularly large amount of heat, the temperature rise of the circuit housing chamber 2 due to the heat generated by the internal electric wire 7 is suppressed. becomes more pronounced.

また、回路収容室2が密室である場合、内部電線7の発熱量が同じあっても回路収容室2が密室でない場合に比べて、内部電線7の発熱に起因する回路収容室2の温度上昇が大きくなるので、内部電線7の発熱に起因する回路収容室2の温度上昇の抑制効果がより顕著になる。 In addition, when the circuit housing chamber 2 is a closed room, the temperature rise in the circuit housing chamber 2 due to the heat generation of the internal wire 7 is higher than when the circuit housing chamber 2 is not a sealed room even if the heat generation amount of the internal wire 7 is the same. increases, the effect of suppressing temperature rise in the circuit housing chamber 2 due to heat generation of the internal wires 7 becomes more pronounced.

また、内部電線7のパワーモジュール9a側の端に近い隔壁4における当該内部電線7の貫通部分21がパワーモジュール9aの近傍に位置し、内部電線7の内部電線7のパワーモジュール9a側の端から遠い隔壁4における当該内部電線7の貫通部分22が筐体側コネクタ5の近傍に位置していることから、内部電線7のうちの外気流路3に延在する部分の割合が大きくなるので、内部電線7の発熱に起因する回路収容室2の温度上昇の抑制効果が大きくなる。 In addition, the penetrating portion 21 of the internal electric wire 7 in the partition wall 4 near the end of the internal electric wire 7 on the power module 9a side is located near the power module 9a, and the internal electric wire 7 from the end of the internal electric wire 7 on the power module 9a side is located near the power module 9a. Since the penetrating portion 22 of the internal wire 7 in the distant partition wall 4 is located near the housing-side connector 5, the proportion of the portion of the internal wire 7 that extends to the outside air flow path 3 increases. The effect of suppressing the temperature rise of the circuit housing chamber 2 caused by the heat generated by the electric wire 7 is increased.

(実施形態2)
本発明の実施形態2は、制御装置100が、多関節ロボットの動作を制御するロボット制御器である形態を例示する。本実施形態では、以下に説明する構成が実施形態1と相違し、それ以外の構成は実施形態1と同じである。
(Embodiment 2)
Embodiment 2 of the present invention exemplifies a mode in which the control device 100 is a robot controller that controls the motion of an articulated robot. This embodiment differs from the first embodiment in the configuration described below, and the rest of the configuration is the same as the first embodiment.

図1を参照すると、本実施形態では、制御装置100が、多関節ロボットの動作を制御するロボット制御器である。発熱回路素子の1つであるパワーモジュール9aが、多関節ロボットの関節を駆動するサーボモータを制御するサーボアンプである。内部電線7及び外部電線6がモータ動力線である。 Referring to FIG. 1, in this embodiment, a control device 100 is a robot controller that controls the motion of an articulated robot. The power module 9a, which is one of the heating circuit elements, is a servo amplifier that controls the servo motors that drive the joints of the articulated robot. The internal electric wire 7 and the external electric wire 6 are motor power lines.

サーボアンプは、各関節に対応して設けられる。サーボモータは三相であるので、各サーボアンプには、3本のモータ動力線が設けられる。つまり、本実施形態では、内部電線の数が、多関節ロボットの関節の数×3本となる。 A servo amplifier is provided corresponding to each joint. Since the servomotor is three-phase, each servo amplifier is provided with three motor power lines. That is, in this embodiment, the number of internal electric wires is the number of joints of the articulated robot×3.

また、筐体側コネクタ5及び保護部材31は防水可能な密閉度を有するように設けられる。 Further, the housing-side connector 5 and the protective member 31 are provided so as to have a degree of waterproof sealing.

このような本実施形態によれば、多関節ロボットの関節を駆動するサーボモータを制御するサーボアンプの数が多いので、内部電線7の発熱に起因する回路収容室2の温度上昇の抑制効果がより顕著になる。 According to this embodiment, since the number of servo amplifiers that control the servo motors that drive the joints of the articulated robot is large, the effect of suppressing the temperature rise of the circuit housing chamber 2 caused by the heat generated by the internal wires 7 can be obtained. become more pronounced.

<変形例>
本実施形態では、以下の変形例を採用してもよい。
<Modification>
In this embodiment, the following modifications may be adopted.

制御装置100を小型化しようする場合、サーボアンプによる回路収容室の温度上昇と内部電線7による回路収容室2の温度上昇とを効果的に抑制する必要がある。そこで、本変形例では、サーボアンプによる回路収容室2の温度上昇を効果的に抑制するために、ヒートシンク10として、主要な発熱回路素子9a,9bに共通のヒートシンク(図示せず)が用いられ、このヒートシンクが実質的に隔壁4を構成する。 When miniaturizing the control device 100, it is necessary to effectively suppress the temperature rise of the circuit housing chamber 2 caused by the servo amplifier and the temperature rise of the circuit housing chamber 2 caused by the internal wires 7. FIG. Therefore, in this modification, a heat sink (not shown) common to the main heat generating circuit elements 9a and 9b is used as the heat sink 10 in order to effectively suppress the temperature rise of the circuit housing chamber 2 due to the servo amplifier. , this heat sink substantially constitutes the partition wall 4 .

また、内部電線7による回路収容室2の温度上昇を効果的に抑制するために、保護部材31に代えて、例えば、以下の隔壁貫通構造(図示せず)が採用される。 Moreover, in order to effectively suppress the temperature rise of the circuit housing chamber 2 due to the internal wires 7, instead of the protective member 31, for example, the following partition penetrating structure (not shown) is adopted.

この隔壁貫通構造では、隔壁4であるヒートシンクの貫通孔の近傍に回路基板11が配置され、当該貫通孔に基板対電線コネクタのコネクタ接合体が配置される。このコネクタ接合体の基板コネクタが回路基板11に取り付けられ、プリント配線によってサーボアンプに電気的に接続される。このコネクタ接合体の電線コネクタが外気流路3に配置される内部電線7のサーボアンプ側の端に設けられる。そして、上記貫通孔及びコネクタ接合体を覆うように適宜な防塵機構が設けられる。この防塵機構の密閉度は防水可能な密閉度に設定される。 In this partition wall penetrating structure, the circuit board 11 is arranged in the vicinity of the through hole of the heat sink, which is the partition wall 4, and the connector assembly of the board-to-wire connector is arranged in the through hole. A board connector of this connector assembly is attached to the circuit board 11 and electrically connected to the servo amplifier by printed wiring. The wire connector of this connector assembly is provided at the end of the internal wire 7 arranged in the outside air flow path 3 on the servo amplifier side. An appropriate dustproof mechanism is provided so as to cover the through hole and the connector assembly. The sealing degree of this dustproof mechanism is set to a waterproof sealing degree.

このような変形例によれば、主要な発熱回路素子9a,9bを共通のヒートシンクにより効果的に冷却することができるとともに、サーボアンプから隔壁の貫通孔に至る内部電線7を省略することできるので、回路収容室2の温度上昇を効果的に抑制することができ、ひいては制御装置100を小型化することができる。 According to this modification, the main heat generating circuit elements 9a and 9b can be effectively cooled by the common heat sink, and the internal electric wire 7 from the servo amplifier to the through-hole of the partition can be omitted. , the temperature rise of the circuit housing chamber 2 can be effectively suppressed, and the size of the control device 100 can be reduced.

上記説明から、当業者にとっては、多くの改良や他の実施形態が明らかである。従って、上記説明は、例示としてのみ解釈されるべきである。 Many modifications and other embodiments will be apparent to those skilled in the art from the above description. Accordingly, the above description should be construed as illustrative only.

本発明の制御装置は、通電により発熱する回路素子から延出する電線の発熱による筐体内の温度上昇を抑制することが可能な制御装置として有用である。 INDUSTRIAL APPLICABILITY The control device of the present invention is useful as a control device capable of suppressing temperature rise in the housing due to heat generated by electric wires extending from circuit elements that generate heat when energized.

1 筐体
2 回路収容室
3 外気流路
4 隔壁
5 筐体側コネクタ
6 外部電線
7 内部電線
8 制御回路
9a パワーモジュール(発熱回路素子)
9b 発熱回路素子
9c 一般の回路素子
10 ヒートシンク
11 回路基板
21,22 貫通部分
31 保護部材
32 電線側コネクタ
41 ファン
42 モータ
100 制御装置
Reference Signs List 1 housing 2 circuit housing chamber 3 outside air flow path 4 partition wall 5 housing side connector 6 external wire 7 internal wire 8 control circuit 9a power module (heat generating circuit element)
9b heat-generating circuit element 9c general circuit element 10 heat sink 11 circuit boards 21, 22 penetrating portion 31 protective member 32 wire-side connector 41 fan 42 motor 100 control device

Claims (6)

通電により発熱する発熱回路素子を含む制御回路を収容する回路収容室と前記発熱回路素子のヒートシンクを冷却する外気が流通する外気流路とが隔壁によって内部に区画された筐体と、
前記回路収容室の室壁を構成する前記筐体の壁に設けられた、外部電線の一端に設けられた電線側コネクタが外側から着脱される筐体側コネクタと、
一端が前記発熱回路素子に接続され、他端が前記筐体側コネクタに内側から接続された内部電線と、を備え、
前記内部電線は、前記発熱回路素子から延出し、次いで、前記隔壁を貫通して前記外気流路に進出し、次いで、当該外気流路内を延伸し、次いで、当該外気流路から前記隔壁を貫通して前記回路収容室に進入し、次いで、前記筐体側コネクタに至るように設けられている、制御装置。
a housing in which a circuit housing chamber for housing a control circuit including a heat generating circuit element that generates heat when energized and an outside air flow path for cooling a heat sink of the heat generating circuit element are partitioned by partition walls;
a housing-side connector to which a wire-side connector provided at one end of an external electric wire is attached and detached from the outside and which is provided on the wall of the housing constituting the chamber wall of the circuit housing chamber;
an internal wire having one end connected to the heating circuit element and the other end connected from the inside to the housing-side connector;
The internal electric wire extends from the heating circuit element, then penetrates the partition wall, advances into the outside air flow path, extends inside the outside air flow path, and then passes through the partition wall from the outside air flow path. A control device that penetrates into the circuit housing chamber and then reaches the housing-side connector.
前記発熱回路素子がパワーモジュールであり、前記内部電線及び前記外部電線が、それぞれ、内部動力線及び外部動力線である、請求項1に記載の制御装置。 2. The control device according to claim 1, wherein the heating circuit element is a power module, and the internal electric wire and the external electric wire are an internal power line and an external power line, respectively. 前記回路収容室は密室であり、前記筐体側コネクタは少なくとも気密に設けられ、前記内部電線は少なくとも気密に前記隔壁を貫通している、請求項1又は2に記載の制御装置。 3. The control device according to claim 1, wherein said circuit housing chamber is a closed chamber, said housing-side connector is provided at least airtightly, and said internal electric wire penetrates said partition wall at least airtightly. 前記内部電線の前記一端に近い前記隔壁における当該内部電線の貫通部分が前記発熱回路素子の近傍に位置し、前記内部電線の前記一端から遠い前記隔壁における当該内部電線の貫通部分が前記筐体側コネクタの近傍に位置している、請求項1乃至3のいずれかに記載の制御装置。 A penetrating portion of the internal electric wire in the partition wall near the one end of the internal electric wire is located near the heating circuit element , and a penetrating portion of the internal electric wire in the partition wall far from the one end of the internal electric wire is the housing-side connector. 4. A control device according to any one of claims 1 to 3, located in the vicinity of the 前記ヒートシンクは、少なくとも前記隔壁の一部を構成することによって前記外気流路に露出している、請求項1乃至4のいずれかに記載の制御装置。 5. The control device according to any one of claims 1 to 4, wherein the heat sink is exposed to the outside air flow path by forming at least part of the partition wall. 前記制御装置が、多関節ロボットの動作を制御するロボット制御器であり、前記発熱回路素子が、前記多関節ロボットの関節を駆動するサーボモータを制御するサーボアンプであり、前記内部電線がモータ動力線である、請求項1乃至5のいずれかに記載の制御装置。 The control device is a robot controller that controls the motion of the articulated robot, the heating circuit element is a servo amplifier that controls a servo motor that drives the joints of the articulated robot, and the internal wire is the motor power. 6. A control device as claimed in any preceding claim, which is a line.
JP2018188506A 2018-10-03 2018-10-03 Control device Active JP7134819B2 (en)

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