JP7132410B1 - Electronic equipment with electronic modules, electronic modules and electronic equipment - Google Patents

Abstract

An electronic device with an electronic module, an electronic module, and an electronic device capable of suppressing the formation of unintended electrical connection are provided. An electronic device with an electronic module includes an electronic device and an electronic module detachable from the electronic device. The electronic module includes a body portion having a mounting surface facing downward, and a plurality of conductive pins protruding downward from the mounting surface, biased downward in an upwardly movable state, and arranged side by side in the left-right direction. , wherein the plurality of conduction pins include a first power supply pin, a second power supply pin, a first signal pin, and a second signal pin, and the first power supply pin and the The distance between the first signal pin is called d1, the distance between the first signal pin and the second signal pin is called d2, and the distance between the second signal pin and the second power pin is called d2. When the distance is called d3, d3≧2×d1 and d2≧3×d1 are established. [Selection drawing] Fig. 9A

Description

The present invention relates to an electronic device with an electronic module, an electronic module, and an electronic device.

Conventionally, a PC (Personal Computer) with a built-in camera module as disclosed in Patent Document 1 below is known. This camera module built-in PC includes a display housing and a camera module (electronic module) accommodated in the display housing.

Japanese Patent No. 5197822

2. Description of the Related Art In recent years, there has been a demand for electronic devices having a narrow frame structure from the viewpoint of design. In other words, it is desired to reduce the width of the bezel. In order to realize a configuration with a small bezel width, it is necessary to place the electronic module outside the display housing (electronic device) instead of housing the electronic module in the display housing. Adopting a detachable configuration is conceivable.

However, as a result of intensive studies by the inventors of the present application, it was conceived that when the above configuration is adopted, the electronic module may be attached at a position different from the original position due to user error. In this case, an unintended electrical connection may be formed between the electronic module and the electronic device, causing problems in the electronic device or the electronic module.

On the other hand, in order to facilitate positioning of the electronic module, a method of forming unevenness such as positioning holes in the bezel is also conceivable. However, from the viewpoint of design, it is not desirable to form the above unevenness on the bezel. In this way, it was thought that if design was emphasized and a smooth bezel was adopted, the possibility that the electronic module would be installed in a position different from its original position would increase.

It is an object of the present invention to provide an electronic device with an electronic module, an electronic module, and an electronic device that can suppress the formation of unintended electrical connections.

In order to solve the above problems, an electronic device with an electronic module according to an aspect of the present invention is an electronic device with an electronic module including an electronic device and an electronic module detachable from the electronic device, The electronic module includes a body portion having a mounting surface facing downward, and a plurality of conductive pins protruding downward from the mounting surface, biased downward in an upwardly movable state, and arranged side by side in the left-right direction. , wherein the electronic device includes a display housing, and a pad section exposed on the upper surface of the display housing and having a plurality of conductive pads arranged in the horizontal direction, wherein the plurality of conductive pins are arranged in the horizontal direction. a first power supply pin, a second power supply pin, a first signal pin, and a second signal pin, wherein the plurality of conductive pads are first power supply pads connected to the first power supply pins; A second power supply pad connected to the second power supply pin, a first signal pad connected to the first signal pin, and a second signal pad connected to the second signal pin. , wherein the distance in the horizontal direction between the first power supply pin and the first signal pin is called d1, and the distance in the horizontal direction between the first signal pin and the second signal pin is When the distance is called d2 and the distance in the horizontal direction between the second signal pin and the second power pin is called d3, d3≧2×d1 and d2≧3×d1 are established.

Further, an electronic module according to an aspect of the present invention is an electronic module that can be attached to and detached from an electronic device, and includes a body portion that has a mounting surface facing downward, and a main body portion that protrudes downward from the mounting surface and is movable upward. a plurality of conductive pins biased downward in a positive state and arranged side by side in the horizontal direction, the plurality of conductive pins being a first power supply pin, a second power supply pin, and a first signal pin; , a second signal pin, the distance between the first power supply pin and the first signal pin in the lateral direction is called d1, and the distance between the first signal pin and the second signal pin is called d1. , the distance in the horizontal direction is called d2, and the distance in the horizontal direction between the second signal pin and the second power pin is called d3, then d3≧2×d1 and d2≧3 xd1 holds.

Further, an electronic device according to an aspect of the present invention includes a display housing, and a pad portion exposed on the upper surface of the display housing and having a plurality of conductive pads arranged in a horizontal direction, wherein the plurality of conductive pads includes a first power supply pad, a second power supply pad, a first signal pad, and a second signal pad, and between the first power supply pad and the first signal pad , the distance in the left-right direction is called d1, the distance in the left-right direction between the first signal pad and the second signal pad is called d2, the second signal pad and the second power supply When the distance in the left-right direction with respect to the control pad is called d3, d3≧2×d1 and d2≧3×d1 are established.

According to the above aspect of the invention, the distances d1-d3 are different from each other. Therefore, when the electronic module is displaced in the left-right direction from the originally attached position, both the first power supply pin and the second power supply pin may be simultaneously connected to any one of the plurality of conductive pads. Suppressed. This suppresses the formation of unintended electrical connections between the plurality of conductive pins (electronic module) and the plurality of conductive pads (electronic device).

Here, of the plurality of conduction pins, two conduction pins arranged at symmetrical positions in the left-right direction may have the same function as each other.

In this case, even if the electronic module is attached to the electronic device so that the electronic module faces either the display direction or the back direction of the electronic device, the function of each conductive pin does not change when viewed from the electronic device. Therefore, the direction of the electronic module can be easily reversed while the function of the electronic module is effective only by reversing the electronic module 180 degrees about the vertical direction and attaching it to the electronic device.

A lower end of the first power pin and a lower end of the second power pin may be positioned below a lower end of the first signal pin and a lower end of the second signal pin.

In this case, when the electronic module is attached to the electronic device, the connection between the first power supply pin and the first power supply pad is realized earlier than the connection between the first signal pin and the first signal pad. easier to be This prevents the signal connection from being realized earlier than the power supply connection, thereby preventing problems from occurring in the electronic module or the electronic device.

Also, the upper ends of the first power supply pads and the upper ends of the second power supply pads may be positioned below the upper ends of the first signal pads and the upper ends of the second signal pads.

In this case, the first signal pin or the second signal pin is less likely to come into contact with the first power supply pad when the electronic module is displaced in the horizontal direction from the position where it should be attached. This more reliably suppresses the formation of unintended electrical connections between the electronic module and the electronic device.

According to the above aspects of the present invention, it is possible to provide an electronic device with an electronic module, an electronic module, and an electronic device capable of suppressing the formation of unintended electrical connections.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the whole electronic device with an electronic module which concerns on this embodiment. 1 is a perspective view showing an electronic module according to this embodiment; FIG. 3 is a view of the electronic module shown in FIG. 2 as viewed from arrow III; FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG. 3; FIG. It is a perspective view showing a mode that an electronic module is mounted|worn with an electronic device. FIG. 2 is a cross-sectional view taken along the line VI-VI shown in FIG. 1; FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG. 6; FIG. 8 is a diagram showing a state in which the mounting attitude of the electronic module is reversed in FIG. 7; It is a figure which expands and sees a mode that an electronic module is mounted|worn in an electronic device. FIG. 9B is a diagram illustrating a state following FIG. 9A; FIG. 9C is a diagram showing a state in which the electronic module is displaced in the horizontal direction in FIG. 9B. FIG. 9C is a diagram showing a state in which the electronic module is displaced in the horizontal direction in FIG. 9B.

An electronic device with an electronic module, an electronic module included therein, and an electronic device according to the present embodiment will be described below with reference to FIGS. 1 to 11. FIG.
As shown in FIG. 1 , an electronic device 3 with an electronic module includes an electronic device 2 and an electronic module 1 . The electronic device 2 has a plate-shaped display housing 50 . The electronic module 1 is detachably attached to one side of the display housing 50 . As shown in FIG. 2 , the electronic module 1 has a plurality of conductive pins 30 that serve as an interface for electrical connection with the electronic device 2 .

Note that the electronic device 2 of the present embodiment is a so-called tablet terminal, but other types of electronic device 2 may be employed. For example, the electronic device 2 may be a clamshell PC, smart phone, game machine, or the like. If the electronic device 2 is a clamshell PC, the second housing is connected to the display housing 50 via hinges. A keyboard, a motherboard, and the like are provided in the second housing.

Also, in the present embodiment, the electronic module 1 is a camera module and has an imaging element 22, but other types of electronic modules 1 may be employed. For example, electronic module 1 may be a fingerprint sensor, keyboard, docking station, or the like.

(direction definition)
Here, in this embodiment, an XYZ orthogonal coordinate system is set and the positional relationship of each component will be described. The X-axis direction is the direction in which the plurality of conductive pins 30 are arranged. The Z-axis direction is the direction in which each conduction pin 30 extends. The Z-axis direction is a direction orthogonal to both the X-axis direction and the Z-axis direction. In this specification, the X-axis direction may be referred to as the horizontal direction X, the Y-axis direction may be referred to as the depth direction Y, and the Z-axis direction may be referred to as the vertical direction Z. One direction along the horizontal direction X is referred to as +X direction or leftward. The direction opposite to the +X direction is called the -X direction or rightward. In the depth direction Y, the direction in which the imaging element 22 faces is referred to as the +Y direction, imaging direction, or forward. The direction opposite to the +Y direction is called the -Y direction, the non-imaging direction, or the rear. A direction from the electronic device 2 toward the electronic module 1 along the vertical direction Z is referred to as a +Z direction or upward. The direction opposite to the +Z direction is called the -Z direction or down.

The electronic module 1 can take two mounting postures, a first posture and a second posture, with respect to the electronic device 2 . The first posture is a mounting posture in which the direction in which the display 51 of the display housing 50 faces (display direction) and the imaging direction match (see FIGS. 1 and 7). The second posture is a mounting posture in which the direction opposite to the direction in which the display 51 faces (backward direction) matches the imaging direction (see FIG. 8). In the following description, the positional relationship of each part will be described when the electronic module 1 is in the first posture, unless otherwise specified.

(electronic module)
As shown in FIGS. 2 to 4 and the like, the electronic module 1 includes a body portion 10, an imaging portion 20 housed in the body portion 10, a plurality of conduction pins 30, and at least one fixing member 40. . In this embodiment, the number of conductive pins 30 is seven and the number of fixing members 40 is two, but these numbers may be changed as appropriate.

The body portion 10 has a housing portion 11 , a mounting portion 12 and a guide portion 13 . An imaging device 22 is housed inside the housing portion 11 . The mounting portion 12 is provided at the lower end of the housing portion 11 . The guide portion 13 protrudes downward from the lower end of the housing portion 11 . The mounting portion 12 is arranged forward of the guide portion 13 . Note that the body portion 10 may not have the guide portion 13 .

The housing portion 11 has a vertically extending cylindrical case 11b and a top wall 11a that closes the upper end of the case 11b. The case 11b is formed in an oval shape that is longer in the horizontal direction X than in the depth direction Y when viewed in the vertical direction Z. As shown in FIG. The case 11b is provided with an imaging hole 11c into which an imaging window 21 (described later) of the imaging section 20 is fitted. The imaging hole 11c penetrates in the depth direction Y through the surface of the case 11b facing the imaging direction.

The guide section 13 has a guide surface 13a facing the imaging direction. The guide surface 13a is a flat surface extending in the vertical direction Z and the horizontal direction X. As shown in FIG. The guide portion 13 is connected to the housing portion 11 by an annular connecting portion 13c. The connecting portion 13 c is provided at the lower end of the case 11 b of the housing portion 11 and also has a role of supporting the mounting portion 12 .

The mounting portion 12 has a plurality of conduction pin holes 12a and a plurality of first holding portions 12b. The plurality of conduction pin holes 12a are arranged side by side in the left-right direction X and extend along the up-down direction Z. As shown in FIG. The first holding portion 12b has a role of holding a fixing member 40, which will be described later. The mounting portion 12 has a mounting surface 12c facing downward. When the electronic module 1 is attached to the electronic device 2, the mounting surface 12c abuts or comes close to the electronic device 2 (more specifically, the upper bezel portion 52a).

The imaging unit 20 has an imaging window 21 fitted in the imaging hole 11 c of the main body 10 and an imaging element 22 . The imaging window 21 is formed by a transparent member. The imaging device 22 has a function of converting light into an electrical signal (image data). For example, an RGB camera or an infrared camera can be used as the imaging device 22 .

The plurality of conduction pins 30 are inserted through the conduction pin holes 12a one by one. In this embodiment, so-called pogo pins are employed as the conduction pins 30 . That is, each conductive pin 30 is biased downward while being movable upward. More specifically, each conductive pin 30 has a connecting portion 30a and a biasing portion 30b electrically connected to the connecting portion 30a. The biasing portion 30b is biased downward so as to be able to move upward relative to the connecting portion 30a. At least some of the conductive pins 30 (connection portions 30 a ) are electrically connected to the imaging device 22 . The lower end of each conductive pin 30 (biasing portion 30b) is located below the mounting surface 12c. The plurality of conductive pins 30 are arranged side by side in the left-right direction X and extend along the up-down direction Z. As shown in FIG.

In this embodiment, seven conduction pins 30 are arranged. The seven conduction pins 30 include a pair of first power supply pins 31A and 31B, a second power supply pin 32, a pair of first signal pins 33A and 33B, a pair of second signal pins 34A, 34B and. As a result, it is possible to transmit and receive electrical signals conforming to the USB standard via each conduction pin 30 . In this embodiment, the first power supply pins 31A and 31B are VCC pins, and the second power supply pin 32 is a GND pin. That is, the first power supply pins 31A and 31B and the second power supply pin 32 are power supply pins. On the other hand, the first signal pins 33A and 33B are D- pins, and the second signal pins 34A and 34B are D+ pins. That is, the first signal pins 33A and 33B and the second signal pins 34A and 34B are signal (data) pins.

Also, the two conductive pins 30 arranged at symmetrical positions in the left-right direction X have the same function as each other. In other words, the first power supply pin 31A and the first power supply pin 31B are arranged symmetrically with the second power supply pin 32 as the center. Similarly, the first signal pin 33A and the first signal pin 33B are arranged with the second power supply pin 32 as the center. The second signal pin 34A and the second signal pin 34B are arranged around the second power supply pin 32 .

In this manner, the two conductive pins 30 arranged at symmetrical positions in the left-right direction X have the same function, so that the signal arrangement seen from the electronic device 2 is constant regardless of the mounting orientation of the electronic module 1. Become. Note that the above signal arrangement is an example, and may be changed as appropriate.

Here, in this specification, distances d1 to d3 are defined as shown in FIG. 9A. The distance d1 is the distance in the horizontal direction X between the first power supply pin 31A and the first signal pin 33A. The distance d2 is the distance in the horizontal direction X between the first signal pin 33A and the second signal pin 34A. A distance d3 is a distance in the horizontal direction X between the second signal pin 34A and the second power supply pin 32 . In the definition of the distance d1, the wording "the distance between the first power supply pin 31A and the first signal pin 33A" is more specifically It means the distance between the central axis of the pin 33A. The same applies to the distances d2 and d3.
In this embodiment, the distances d1 to d3 satisfy d3≧2×d1 and d2≧3×d1.

In addition, the lower ends of the first power supply pins 31A and 31B and the lower ends of the second power supply pins 32 are closer to the lower ends of the first signal pins 33A and 33B and the lower ends of the second signal pins 34A and 34B. is also located below. In the present embodiment, the lower ends of the first power supply pins 31A and 31B and the lower end of the second power supply pin 32 are positioned substantially at the same position in the up-down direction Z. As shown in FIG. Similarly, the lower ends of the first signal pins 33A and 33B and the lower ends of the second signal pins 34A and 34B are positioned substantially at the same position in the up-down direction Z. As shown in FIG. It should be noted that "substantially the same position" also includes the case where it can be regarded as the same position if the manufacturing error is removed. In this embodiment, the lower ends of the power supply pins 31A, 31B, 32 are located below the lower ends of the signal pins 33A, 33B, 34A, 34B by the dimension d7.

The fixing member 40 fixes the electronic module 1 to the electronic device 2 by engaging with a device-side fixing member 80 to be described later. For example, a permanent magnet, iron, or the like can be used as the fixing member 40 and the device-side fixing member 80 . In this case, the electronic module 1 is fixed to the electronic device 2 by the magnetic force generated between the fixing member 40 and the device-side fixing member 80 . Here, more specifically, when the device-side fixing member 80 is a permanent magnet, the fixing member 40 may be iron or a permanent magnet. Similarly, when the fixing member 40 is a permanent magnet, the device-side fixing member 80 may be iron or a permanent magnet.

In this embodiment, permanent magnets are used for both the fixing member 40 and the device-side fixing member 80 . Each of the permanent magnets used in the fixing member 40 is arranged so that the north pole faces outward in the left-right direction X and the south pole faces inward in the left-right direction X. As shown in FIG. On the other hand, each of the permanent magnets used in the device-side fixing member 80 is arranged so that the north pole faces inward in the left-right direction X and the south pole faces outward in the left-right direction X. As shown in FIG. By arranging the polarities of the permanent magnets in this way, it becomes easier to determine the relative positions of the two in the left-right direction X when attaching the electronic module 1 to the electronic device 2 . Moreover, since the polar arrangement is symmetrical as a whole, the same effect can be obtained regardless of the mounting posture of the electronic module 1 . The above polar arrangement is an example, and other polar arrangements may be used as long as the attraction force acts between the fixing member 40 and the device-side fixing member 80 and the polar arrangement is symmetrical as a whole. effect can be obtained.

The fixing member 40 is held inside the mounting portion 12 by the first holding portion 12b. The fixing member 40 is arranged in the vicinity of the mounting surface 12 c so as to generate magnetic force for holding the electronic module 1 with the device-side fixing member 80 . Specifically, in this embodiment, two fixing members 40 are respectively arranged between two different conduction pins 30 . However, the fixing member 40 may be arranged outside in the left-right direction X with respect to the plurality of conduction pins 30 .

(Electronics)
As shown in FIGS. 5 to 7 and the like, the electronic device 2 includes a display housing 50, a pad portion 60, an FPC (Flexible Printed Circuits) 70 housed in the display housing 50, and at least one fixed device side. a member 80;

As shown in FIGS. 1 and 7, the display housing 50 includes a display 51, a bezel 52, and a rear plate portion 53. As shown in FIG. The bezel 52 surrounds the display 51 and has a rectangular shape. In this embodiment, bezel 52 is made of metal, but bezel 52 may be made of non-metal. The rear plate portion 53 covers the surface of the display housing 50 opposite to the display 51 . As the display 51, an OLED (Organic Light Emitting Diode), a liquid crystal display, or the like can be used. A control unit 51 a that controls the display of the display 51 is provided on the rear surface of the display 51 .

As shown in FIG. 1, the bezel 52 includes an upper bezel portion 52a, two horizontal bezel portions 52b extending downward from both ends of the upper bezel portion 52a in the horizontal direction X, and lower ends of the two horizontal bezel portions 52b. and a lower bezel portion 52c connecting the . The lower bezel portion 52c is arranged parallel to the upper bezel portion 52a. The upper bezel portion 52a and the lower bezel portion 52c are arranged in parallel in the horizontal direction X, and the two horizontal bezel portions 52b are arranged in parallel in the vertical direction Z. As shown in FIG. As shown in FIG. 6, the upper bezel portion 52a is formed with pad holes 52d in which the pad portions 60 are arranged.

The pad hole 52d penetrates in the vertical direction Z through the upper bezel portion 52a. A pad holding portion 52e is formed inside the pad hole 52d. A second holding portion 52f for holding the device-side fixing member 80 is provided in the vicinity of the pad hole 52d in the upper bezel portion 52a.

The pad section 60 is provided with a plurality of conductive pads 61 arranged side by side in the horizontal direction X and an insulating section 62 for insulating each conductive pad 61 from the bezel 52 . The pad portion 60 is held by the pad holding portion 52e. Each central axis of the plurality of conductive pads 61 is arranged so as to coincide with the center of the display housing 50 in the depth direction Y. As shown in FIG.

As shown in FIG. 6, each conductive pad 61 has a vertically extending shaft portion 61b and a head portion 61a positioned at the upper end of the shaft portion 61b. In plan view, the head portion 61a has a larger area than the shaft portion 61b. Each head portion 61a is exposed to the outside of the display housing 50 through the pad hole 52d. In addition, the center axis of each shaft portion 61b is positioned substantially at the center of the upper bezel portion 52a in the depth direction Y (see FIG. 7). The insulating portion 62 has an insulating sheet 62a that abuts on the lower surface of each head portion 61a, and an insulating tube 62b that partially covers each shaft portion 61b. The insulating sheet 62a is formed with a through-hole through which the shaft portion 61b of the conductive pad 61 is inserted. Each conductive pad 61 and the upper bezel portion 52a are electrically insulated by the insulating sheet 62a and the insulating tube 62b. In this embodiment, the number of insulating sheets 62a and pad holding portions 52e is three. Each pad holding portion 52e holds a separate insulating sheet 62a from below. Three conductive pads 61 (second power supply pad 612 and second signal pads 614A and 614B) are inserted through an insulating sheet 62a located in the center in the horizontal direction X. As shown in FIG. Two conductive pads 61 (first power supply pad 611A and first signal pad 613A, or first power supply pad 611B and first signal pad 613B) is inserted.

As described above, the insulating sheet 62a, the insulating tube 62b, and each conductive pad 61 are formed separately. For this reason, compared with the case where each conductive pad 61 and the insulating portion 62 are integrally formed by insert molding or the like, it becomes easier to form the insulating sheet 62a and the insulating tube 62b thin. Accordingly, it is possible to prevent the size of the upper bezel portion 52a having the insulating portion 62 from increasing. However, the conductive pad 61 and the insulating portion 62 may be formed integrally.

As shown in FIG. 6, seven conductive pads 61 are arranged in this embodiment. The seven conductive pads 61 include a pair of first power supply pads 611A and 611B, a second power supply pad 612, a pair of first signal pads 613A and 613B, a pair of second signal pads 614A, and 614B. The first power supply pads 611A and 611B are connected to the first power supply pins 31A and 31B. The second power supply pad 612 is connected to the second power supply pin 32 . The first signal pads 613A, 613B are connected to the first signal pins 33A, 33B. The second signal pads 614A, 614B are connected to the second signal pins 34A, 34B.

Here, in this specification, distances d4 to d6 are defined as shown in FIGS. 6 and 9A. A distance d4 is a distance in the horizontal direction X between the first power supply pad 611A and the first signal pad 613A. A distance d5 is a distance in the horizontal direction X between the first signal pad 613A and the second signal pad 614A. A distance d6 is a distance in the horizontal direction X between the second signal pad 614A and the second power supply pad 612. As shown in FIG. In the definition of the distance d4, the term "distance between the first power supply pad 611A and the first signal pad 613A" is more specifically means the distance from the central axis of the pad 613A. The same applies to the distances d4 and d5.
In this embodiment, the distance d4 substantially matches the distance d1. Similarly, the distance d5 substantially matches the distance d2, and the distance d6 substantially matches the distance d3. Therefore, for the distances d4 to d6, d6≧2×d4 and d5≧3×d4 are established. Note that "approximately matching" includes the case where the two distances can be regarded as matching if the manufacturing error is removed.

Also, the upper ends of the first power supply pads 611A and 611B and the upper ends of the second power supply pads 612 are separated from the upper ends of the first signal pads 613A and 613B and the upper ends of the second signal pads 614A and 614B. is also located below. In the present embodiment, the upper ends of the first power supply pads 611A and 611B and the upper end of the second power supply pad 612 are positioned substantially at the same position in the vertical direction Z. As shown in FIG. Similarly, the upper ends of the first signal pads 613A and 613B and the upper ends of the second signal pads 614A and 614B are substantially at the same position in the up-down direction Z. As shown in FIG. It should be noted that "substantially the same position" also includes the case where it can be regarded as the same position if the manufacturing error is removed. In this embodiment, the upper ends of the power supply pads 611A, 611B, 612 are located lower than the upper ends of the signal pads 613A, 613B, 614A, 614B by the dimension d8. Note that the dimension d8 is smaller than the dimension d7.

As shown in FIG. 6 , the FPC 70 has a base portion 71 and three projecting portions 72 projecting upward from the base portion 71 . As shown in FIG. 7, a plurality of conductive pads 61 are electrically connected by solder S to the upper end of the projecting portion 72 . More specifically, the lower end of the shaft portion 61b of the conductive pad 61 protrudes downward from the insulating tube 62b. A lower end portion of the shaft portion 61b is fixed to the projecting portion 72 by solder S. As shown in FIG.

As shown in FIG. 6, at least one device-side fixing member 80 is provided inside the upper bezel portion 52a. In this embodiment, two device-side fixing members 80 are spaced apart in the left-right direction X so as to correspond to the fixing members 40 of the electronic module 1 . The device-side fixing member 80 is held near the pad section 60 by the second holding section 52f. The position of the device-side fixing member 80 can be appropriately changed as long as it is in the vicinity of the pad section 60 and can generate a magnetic force with the fixing member 40 .

(electronic device with electronic module)
As shown in FIG. 6, the electronic device 3 with an electronic module of this embodiment has two suction portions P1 and P2. The suction portions P1 and P2 are arranged with a space therebetween in the left-right direction X. As shown in FIG. Each attraction part P1, P2 includes a fixing member 40 and a device-side fixing member 80 that attract each other by magnetic force. With this configuration, the electronic module 1 can be fixed to the electronic device 2 using magnetic force.

Moreover, the plurality of conduction pins 30 and the plurality of conduction pads 61 are provided so that each conduction pin 30 and each conduction pad 61 face each other in the vertical direction Z. As shown in FIG. Since the lower end of each conductive pin 30 is located below the mounting surface 12c, the lower end of each conductive pin 30 is pressed against each conductive pad 61 when the mounting portion 12 and the upper bezel portion 52a are brought close to each other. Thereby, each conduction pin 30 and each conduction pad 61 can be electrically connected.

As shown in FIG. 7, in this specification, the thickness (dimension in the depth direction Y) of the display housing 50 is represented as L1. Also, L2 represents the average value of the distances in the depth direction Y from the center axis O of the plurality of conduction pins 30 to the guide surface 13a. The dimension L1 is approximately twice the dimension L2. Note that "substantially twice" means that the guide portion 13 can effectively receive the external force acting on the electronic module 1 regardless of whether the electronic module 1 is in the first mounting posture or the second mounting posture. This means that the gap between the portion 13 and the display housing 50 is sufficiently small. However, the dimension L1 does not have to be approximately twice the dimension L2.

Next, the operation of the electronic device 3 with an electronic module configured as described above will be described.

When the user wants to capture an image in the display direction, first, the electronic module 1 is held so that the image capturing direction of the electronic module 1 and the display direction match, and the mounting surface 12c faces the upper surface of the upper bezel portion 52a (see FIG. 5). ). Next, the mounting surface 12c is brought close to the pad portion 60 from above while the guide surface 13a is aligned with the rear surface of the rear plate portion 53. As shown in FIG. At this time, the relative positions of the conductive pins 30 and the conductive pads 61 in the depth direction Y are determined by bringing the guide surface 13a and the rear surface of the rear plate portion 53 into contact with each other. When the user separates the electronic module 1 with the mounting surface 12c sufficiently close to the pad section 60 (see FIG. 9A), an attractive force (magnetic force) acts between the fixing member 40 and the device-side fixing member 80 . As a result, the mounting surface 12c is brought into contact with or close to the upper bezel portion 52a, and each conductive pin 30 is pressed against each conductive pad 61 (see FIG. 9B). Therefore, each conduction pin 30 and each conduction pad 61 are electrically connected, and the electronic module 1 can be attached to the electronic device 2 in the first attachment posture (see also FIG. 7).

Further, in the present embodiment, the lower ends of the power supply pins 31A, 31B, 32 are positioned below the lower ends of the signal pins 33A, 33B, 34A, 34B. Also, as described above, dimension d8 is smaller than dimension d7. Therefore, the connections between the power supply pins 31A, 31B, 32 and the power supply pads 611A, 611B, 612 are made prior to the connections between the signal pins 33A, 33B, 34A, 34B and the signal pads. easier to implement. This prevents the signal connection from being realized earlier than the power supply connection, and prevents the electronic module 1 or the electronic device 2 from having problems.

When the user wants to image the back direction of the electronic device 2, first, the electronic module 1 is mounted so that the imaging direction of the electronic module 1 and the back direction of the electronic device 2 match, and the mounting surface 12c faces the upper surface of the upper bezel portion 52a. 1 is grasped. Next, while the guide surface 13a is aligned with the display surface of the display housing 50, the mounting surface 12c is brought close to the pad portion 60 from above. After that, each conductive pin 30 and each conductive pad 61 are electrically connected in the same manner as in the case of the first mounting posture, and the electronic module 1 can be mounted on the electronic device 2 in the second mounting posture (FIG. 8). , 9B).

Moreover, when the user removes the electronic module 1 from the electronic device 2 , it is sufficient to simply pull the electronic module 1 away from the electronic device 2 by holding and lifting the electronic module 1 . As described above, the electronic module 1 can be easily attached to and detached from the electronic device 2 .

By the way, in the electronic device 3 with the electronic module according to the present embodiment, only the fixing member 40 and the device-side fixing member 80 contribute to the positioning of the electronic module 1 and the electronic device 2 in the horizontal direction X. For example, the bezel 52 does not have projections and depressions for positioning. Therefore, it is conceivable that the electronic module 1 may be arranged at a different position in the left-right direction X from the position where it should be attached due to user error (see also FIGS. 10 and 11). Alternatively, the user may search for a position where the electronic module 1 should be attached while sliding the electronic module 1 in the horizontal direction X with respect to the electronic device 2 .

In such a case, if an unintended closed circuit is formed between the electronic module 1 and the electronic device 2 , problems may occur in the electronic module 1 or the electronic device 2 . For example, both the first power supply pin 31A and the second power supply pin 32 are connected to the conduction pads 61 other than the conduction pads 61 (the first power supply pad 611A and the second power supply pad 612) to be originally connected. There are cases where Alternatively, both the first power supply pad 611A and the second power supply pad 612 are connected to conduction pins 30 other than the conduction pins 30 (the first power supply pin 31A and the second power supply pin 32) that should be originally connected. There are cases where

On the other hand, in the electronic device 3 with an electronic module according to the present embodiment, d3≧2×d1 and d2≧3×d1 are established for the distances d1 to d3. With this configuration, as shown in FIGS. 10 and 11, the formation of an unintended closed circuit is suppressed when the electronic module 1 is placed at a position X different from the position where it should be originally attached. For example, both the first power supply pin 31A and the second power supply pin 32 are connected to the conduction pads 61 other than the conduction pads 61 (the first power supply pad 611A and the second power supply pad 612) to be originally connected. less likely to be Alternatively, both the first power supply pad 611A and the second power supply pad 612 are connected to conduction pins 30 other than the conduction pins 30 (the first power supply pin 31A and the second power supply pin 32) that should be originally connected. less likely to be Therefore, unintended formation of electrical connection between the electronic module 1 and the electronic device 2 can be suppressed.

Furthermore, in this embodiment, the upper ends of the power supply pads 611A, 611B, 612 are positioned below the upper ends of the signal pads 613A, 613B, 614A, 614B. As a result, the distances in the vertical direction Z between the signal pins 33A, 33B, 34A, 34B and the power supply pads 611A, 611B, 612 are increased. For example, as shown in FIG. 10, even when the electronic module 1 and the electronic device 2 are in contact with each other, the first signal pin 33B and the first power supply pad 611B are less likely to contact each other. In this way, when the electronic module 1 is displaced in the left-right direction X from its intended position, the signal pins 33A, 33B, 34A, and 34B are less likely to come into contact with the power supply pads 611A, 611B, and 612. FIG. Therefore, the formation of unintended electrical connection between the electronic module 1 and the electronic device 2 is more reliably suppressed.

As described above, the electronic device 3 with an electronic module according to the present embodiment is an electronic device 3 with an electronic module including the electronic device 2 and the electronic module 1 detachable from the electronic device 2, The electronic module 1 includes a main body 10 having a mounting surface 12c facing downward, and a plurality of electronic modules 1 protruding downward from the mounting surface 12c, being urged downward while being movable upward, and arranged side by side in the left-right direction X. The electronic device 2 includes a display housing 50 and a pad section 60 exposed on the upper surface of the display housing 50 and having a plurality of conductive pads 61 arranged in the horizontal direction X, The plurality of conduction pins 30 include first power supply pins 31A and 31B, a second power supply pin 32, first signal pins 33A and 33B, and second signal pins 34A and 34B. The conduction pads 61 include first power supply pads 611A and 611B connected to the first power supply pins 31A and 31B, a second power supply pad 612 connected to the second power supply pin 32, and a first signal pin. First signal pads 613A, 613B connected to 33A, 33B, second signal pads 614A, 614B connected to second signal pins 34A, 34B, and first power supply pins 31A, 31B and the first signal pins 33A, 33B in the horizontal direction X is called d1, and the distance in the horizontal direction X between the first signal pins 33A, 33B and the second signal pins 34A, 34B is called d1. When the distance is called d2 and the distance in the left-right direction X between the second signal pins 34A, 34B and the second power supply pin 32 is called d3, d3≧2×d1 and d2≧3×d1. holds.

With this configuration, the electronic module 1 can be attached to the electronic device 2 from the outside. As a result, the thickness of the display housing 50 in the depth direction Y and the width of the upper bezel portion 52a in the vertical direction Z can be reduced compared to the case where the electronic module 1 is incorporated in the electronic device 2 . Further, since the conductive pin 30 is urged downward while being movable upward, by pressing the conductive pin 30 against the conductive pad 61, the electronic device 2 and the imaging element 22 are electrically connected. can be connected to Furthermore, by satisfying the above relationship for the distances d1 to d3, unintended formation of electrical connection between the electronic module 1 and the electronic device 2 can be suppressed.

In addition, among the plurality of conduction pins 30, two conduction pins 30 arranged at symmetrical positions in the left-right direction X have the same function as each other. According to this configuration, regardless of whether the electronic module 1 is attached to the electronic device 2 so that the electronic module 1 faces either the display direction or the back direction of the electronic device 2, each conduction pin 30 can be seen from the electronic device 2. does not change its functionality. Therefore, only by reversing the electronic module 1 by 180 degrees about the vertical direction Z and attaching it to the electronic device 2, the direction of the electronic module can be easily reversed while the function of the electronic module 1 is effective.

In addition, the lower ends of the first power supply pins 31A and 31B and the lower ends of the second power supply pins 32 are positioned below the lower ends of the first signal pins 33A and 33B and the lower ends of the second signal pins 34A and 34B. . According to this configuration, when the electronic module 1 is attached to the electronic device 2, it is suppressed that the connection for the signal is realized earlier than the connection for the power source. is suppressed.

Also, the upper ends of the first power supply pads 611A and 611B and the upper ends of the second power supply pads 612 are positioned below the upper ends of the first signal pads 613A and 613B and the upper ends of the second signal pads 614A and 614B. . According to this configuration, formation of an unintended electrical connection between the electronic module 1 and the electronic device 2 is more reliably suppressed.

The technical scope of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

For example, in the above embodiment, the electronic device 3 with an electronic module has the fixing member 40 and the device-side fixing member 80, but the electronic device 3 with the electronic module has the fixing member 40 and the device-side fixing member 80. It doesn't have to be. Even in this case, unintended electrical connection between the electronic module 1 and the electronic device 2 is suppressed because the distances d1 to d3 satisfy the above-described relationship.

Further, although the electronic device 3 with an electronic module has only one second power supply pin 32 in order to minimize the number of conduction pins 30, the configuration of the conduction pin 30 is not limited to this. For example, the electronic device 3 with an electronic module may have two second power supply pins 32A and 32B. Alternatively, the electronic device 3 with an electronic module may have signal pins other than the first signal pins 33A, 33B and the second signal pins 34A, 34B. Further, along with the addition of these conduction pins 30, conduction pads 61 may be added as appropriate. In these cases as well, the configuration of the plurality of conduction pins 30 is preferably symmetrical in the left-right direction X as in the above embodiment.

In addition, in the example of FIG. 9A and the like, since the lower end of the first power supply pin 31A is located below the lower end of the first signal pin 33A, the biasing portion 30b of the first power supply pin 31A is It was formed larger than the biasing portion 30b of the first signal pin 33A. However, the configuration for positioning the lower end of the first power supply pin 31A below the lower end of the first signal pin 33A is not limited to this. For example, instead of the urging portion 30b, the size of the connection portion 30a may be appropriately adjusted.

Similarly, in the example of FIG. 9A and the like, since the upper end of the first power supply pad 611A is positioned below the upper end of the first signal pad 613A, the head portion 61a of the first power supply pad 611A is It was formed smaller than the head portion 61a of the first signal pad 613A. However, the configuration for positioning the upper end of the first power supply pad 611A below the upper end of the first signal pad 613A is not limited to this. For example, a plurality of pad holding portions 52e may be formed in the bezel 52 so as to correspond to the plurality of conduction pins 30 on a one-to-one basis, and the position of each pad holding portion 52e in the vertical direction Z may be appropriately adjusted.

Further, the electronic module 1 may have a connection status display device (such as an LED) that emits light when the electronic module 1 and the electronic device 2 are normally connected. In this case, the user can confirm whether the electronic module 1 and the electronic device 2 are normally connected by confirming whether the connection status display device emits light. Moreover, the connection state display device may be formed on both sides in the depth direction Y. FIG. For example, the connection state display device may be formed along the entire circumference of the housing portion 11 at the upper edge of the housing portion 11 . In this case, the connection state between the electronic module 1 and the electronic device 2 can be easily checked regardless of whether the electronic module 1 is in the first or second mounting posture.

In addition, it is possible to appropriately replace the components in the above-described embodiments with well-known components without departing from the scope of the present invention, and the above-described embodiments and modifications may be combined as appropriate.

DESCRIPTION OF SYMBOLS 1... Electronic module 2... Electronic device 3... Electronic device with electronic module 10... Main body part 12c... Mounting surface 30... Conductive pin 31A, 31B... First power supply pin 32... Second power supply pin 33A, 33B... First signal Application pins 34A, 34B Second signal pin 50 Display housing 60 Pad section 61 Conductive pad 611A, 611B First power supply pad 612 Second power supply pad 613A, 613B First signal pad 614A , 614B... Second signal pad d1, d2, d3... Distance X... Horizontal direction Z... Vertical direction

Claims (6)

an electronic device;
An electronic device with an electronic module, comprising an electronic module detachable from the electronic device,
The electronic module is
a body portion having a mounting surface facing downward;
a plurality of conduction pins protruding downward from the mounting surface, biased downward while being movable upward, and arranged side by side in the left-right direction;
The electronic device
a display housing;
A pad portion exposed on the upper surface of the display housing and having a plurality of conductive pads arranged in the horizontal direction,
the plurality of conductive pins includes a first power pin, a second power pin, a first signal pin, and a second signal pin;
The plurality of conductive pads are connected to a first power supply pad connected to the first power supply pin, a second power supply pad connected to the second power supply pin, and the first signal pin. and a second signal pad connected to the second signal pin,
The distance in the horizontal direction between the first power supply pin and the first signal pin is called d1,
The distance in the horizontal direction between the first signal pin and the second signal pin is called d2,
When the distance in the horizontal direction between the second signal pin and the second power supply pin is called d3,
An electronic device with an electronic module that satisfies d3≧2×d1 and d2≧3×d1. 2. The electronic device with an electronic module according to claim 1, wherein, of said plurality of conduction pins, two conduction pins arranged at symmetrical positions in said left-right direction have the same function as each other. 3. The lower end of the first power pin and the lower end of the second power pin according to claim 1, wherein the lower end of the first power pin and the lower end of the second power pin are positioned below the lower ends of the first signal pin and the second signal pin. electronic equipment with electronic modules. 4. The upper end of said first power supply pad and the upper end of said second power supply pad are positioned lower than the upper ends of said first signal pad and said second signal pad. or an electronic device with an electronic module according to claim 1. An electronic module detachable from an electronic device,
a body portion having a mounting surface facing downward;
a plurality of conduction pins protruding downward from the mounting surface, biased downward while being movable upward, and arranged side by side in the left-right direction;
the plurality of conductive pins includes a first power pin, a second power pin, a first signal pin, and a second signal pin;
The distance in the horizontal direction between the first power supply pin and the first signal pin is called d1,
The distance in the horizontal direction between the first signal pin and the second signal pin is called d2,
When the distance in the horizontal direction between the second signal pin and the second power supply pin is called d3,
An electronic module in which d3≧2×d1 and d2≧3×d1 are established. a display housing;
A pad portion exposed on the upper surface of the display housing and having a plurality of conductive pads arranged in the horizontal direction,
the plurality of conductive pads includes a first power supply pad, a second power supply pad, a first signal pad, and a second signal pad;
a distance in the horizontal direction between the first power supply pad and the first signal pad is called d1;
a distance in the horizontal direction between the first signal pad and the second signal pad is called d2;
When the distance in the horizontal direction between the second signal pad and the second power supply pad is called d3,
An electronic device that satisfies d3≧2×d1 and d2≧3×d1.

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