JP7122819B2 - Photosensitive composition, transfer film, cured film, touch panel and manufacturing method thereof - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a photosensitive composition, a transfer film, a cured film, a touch panel, and a manufacturing method thereof.

Conventionally, a photosensitive composition for obtaining a cured film and a polymer used in the photosensitive composition have been known.
Patent Document 1 includes (A) a polymerizable compound, (B) a binder polymer, (C) a photopolymerization initiator, and (D) a titanium black dispersion, and (A) a polymerizable compound/(B) a binder A photosensitive composition is described in which the weight ratio of the polymer is 1.0 or less.
Patent Document 2 describes (A) a polymer compound having a non-acidic hydrogen-bonding group in its side chain and being soluble or swellable in water or an alkaline aqueous solution, and (B) a compound that generates radicals by light or heat. and heat-sensitive/photosensitive compositions are described.
Patent Document 3 discloses a radically polymerizable copolymer containing a carboxyl group, wherein the carboxyl group is arranged on a side chain separated from the main chain by 7 or more elements, and the side chain further has a radically polymerizable double bond. A carboxy group-containing radically polymerizable copolymer characterized by:

JP 2009-265518 A Japanese Patent Application Laid-Open No. 2004-077761 JP 2012-193219 A

A cured film obtained by curing a photosensitive composition is sometimes required to have a reduced water vapor transmission rate (WVTR). For example, when the touch panel protective film contained in the touch panel is formed as a cured film obtained by curing a photosensitive composition, the formed touch panel protective film (that is, the cured film) is required to have a reduced WVTR. be done.
In this regard, WVTR may not be reduced in cured films obtained by curing the photosensitive compositions described in Patent Documents 1 to 3.
In addition, there are cases where the photosensitive composition is required to reduce tackiness.
As an example, when a photosensitive composition is used to form a photosensitive layer to prepare a transfer film, if the photosensitive layer is highly tacky, the temporary support may be difficult to peel off.

Embodiments according to the present disclosure provide a cured film with reduced water vapor transmission rate (WVTR) and a photosensitive composition with low tackiness, a transfer film using the photosensitive composition, and the photosensitive An object of the present invention is to provide a cured film that is a cured product of a photosensitive composition, a touch panel provided with the cured film, and a method for manufacturing a touch panel using the photosensitive composition or the transfer film.

Means for solving the above problems include the following aspects.
<1> Contains 30% to 70% by mass of a structural unit represented by the following formula A1 and 5% to 60% by mass of a structural unit represented by the following formula B1, and has an acid value of 3.50 mmol / g or less polymer, and
A photosensitive composition containing a radical polymerization initiator.

In formula A1, Ar represents a phenyl group or naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In formula B1, X ^B1 and X ^B2 each independently represent -O- or -NR ^N -, R ^N represents a hydrogen atom or an alkyl group, L represents a methylene group, an ethylene group or an arylene group, R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group.
<2> The photosensitive composition according to <1> above, further comprising a radically polymerizable compound having a functionality of two or more.
<3> The photosensitive composition according to <2> above, which contains a difunctional radically polymerizable compound having a ring structure as the difunctional or higher radically polymerizable compound.
<4> The photosensitive composition as described in any one of <1> to <3> above, further comprising a compound having a heat-reactive group.
<5> The photosensitive composition according to any one of <1> to <4>, which is used for forming a touch panel protective film.
<6> a temporary support;
a photosensitive layer containing the solid content of the photosensitive composition according to any one of <1> to <5>;
A transfer film comprising:
<7> The transfer film according to <6> above, further comprising a transparent layer having a refractive index of 1.60 or more at a wavelength of 550 nm on the side of the photosensitive layer opposite to the temporary support.
<8> The transfer film according to <6> or <7>, which is used for forming a touch panel protective film.
<9> A cured film which is a cured product of the photosensitive composition according to any one of <1> to <5> above.
<10> A touch panel comprising the cured film according to <9> above.
<11> The above Forming a photosensitive layer using the photosensitive composition according to any one of <1> to <5> or the transfer film according to any one of <6> to <8>;
Pattern exposure of the photosensitive layer formed on the touch panel substrate;
Obtaining a touch panel protective film that protects at least a part of at least one of the touch panel electrode and the touch panel wiring by developing the pattern-exposed photosensitive layer;
A touch panel manufacturing method comprising:

According to embodiments of the present disclosure, a photosensitive composition that provides a cured film with reduced water vapor transmission rate (WVTR) and has low tackiness, and a transfer film using the photosensitive composition, Provided are a cured film that is a cured product of the photosensitive composition, a touch panel provided with the cured film, and a method for producing a touch panel using the photosensitive composition or the transfer film.

It is a schematic sectional drawing which shows an example of the transfer film which concerns on one Embodiment of this invention. 1 is a schematic cross-sectional view showing a first specific example of a touch panel according to one embodiment of the present invention; FIG. FIG. 5 is a schematic cross-sectional view showing a second specific example of the touch panel according to one embodiment of the present invention;

An embodiment of the present invention will be described below.
Regarding the notation of groups (atomic groups) in the present specification, notations that do not describe substitution and unsubstituted include not only those not having substituents but also those having substituents. For example, an "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). Also, the term "organic group" as used herein refers to a group containing at least one carbon atom.
In the present specification, a numerical range represented by "to" means a range including the numerical values before and after "to" as lower and upper limits.
As used herein, the amount of each component in the composition refers to the total amount of the above substances present in the composition when there are multiple substances corresponding to each component in the composition, unless otherwise specified. means.
In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended purpose of the process is achieved. .
As used herein, "(meth)acrylic acid" is a concept that includes both acrylic acid and methacrylic acid, "(meth)acrylate" is a concept that includes both acrylate and methacrylate, and "( A meth)acryloyl group" is a concept that includes both acryloyl groups and methacryloyl groups.

As used herein, the term "solid content of the photosensitive composition" means components other than the solvent in the photosensitive composition, and the term "solid content of the photosensitive composition" refers to the solid content of the photosensitive composition. means a whole amount of minutes.
As used herein, "light" is a concept that includes active energy rays such as γ-rays, β-rays, electron beams, ultraviolet rays, visible rays, and infrared rays.
The term "exposure" as used herein means, unless otherwise specified, not only exposure by the emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays, X-rays, and EUV light, but also electron beams and ion beams. It also includes exposure by particle beams such as beams.
As used herein, “transparent” means that the minimum transmittance at a wavelength of 400 nm to 800 nm at 23° C. is 80% or more (preferably 90% or more, more preferably 95% or more).
Moreover, in the present specification, a combination of two or more preferred aspects is a more preferred aspect.

(Photosensitive composition)
The photosensitive composition according to the present disclosure contains 30% by mass to 70% by mass of the structural unit represented by the above formula A1 and 5% by mass to 60% by mass of the structural unit represented by the above formula B1, and an acid It contains a polymer having a molecular weight of 3.50 mmol/g or less (hereinafter also referred to as "specific polymer") and a radical polymerization initiator.
The photosensitive composition according to the present disclosure is preferably a so-called negative photosensitive composition that is cured by exposure.

The photosensitive composition according to the present disclosure contains a specific polymer and a radical polymerization initiator to cure by radical polymerization to form a cured film. The resulting cured film has a reduced water vapor transmission rate (WVTR). Moreover, the tackiness of the photosensitive composition and the photosensitive layer formed from the photosensitive composition is reduced.
Although the mechanism by which the above effect is obtained is not clear, it is speculated as follows.
When the specific polymer contains the structural unit represented by formula A1 in a content of 30% by mass or more, the hardness of the specific polymer is improved and the tackiness of the photosensitive composition is thought to be reduced.
In addition, since the specific polymer contains the structural unit represented by the formula A1 in a content of 70% by mass or less, the specific polymer is easily copolymerized, and a relatively high molecular weight specific polymer is easily formed. , it is thought that the hardness of the photosensitive composition as a whole is improved and the tackiness is reduced.
When the specific polymer contains the structural unit represented by the formula B1 in a content of 5% by mass or more, a crosslinked structure is formed in the cured film and the film becomes dense, making it difficult to permeate water vapor. , WVTR is reduced.
In addition, it is believed that when the specific polymer contains the structural unit represented by formula B1 in a content of 60% by mass or less, the hardness of the photosensitive composition as a whole is less likely to decrease and the tackiness is reduced.
It is believed that when the acid value of the specific polymer is 3.50 mmol/g or less, adhesion of water molecules to the cured film is suppressed, and water vapor permeability is reduced.

<Application of photosensitive composition>
The photosensitive composition according to the present disclosure can be used without particular limitation for forming a cured film that requires reduction in WVTR.
One example of a cured film that requires a reduction in WVTR is a touch panel protective film.
That is, the photosensitive composition according to the present disclosure is preferably used for forming a touch panel protective film.
A touch panel and a protective film for a touch panel will be described below.

<Touch panel and protective film for touch panel>
Electronic devices such as mobile phones, car navigation systems, personal computers, ticket vending machines, and bank terminals include electronic devices in which a touch panel (i.e., a tablet-type input device) is arranged on the surface of a liquid crystal display device having an image display area. Are known.
In such an electronic device, information is input by touching a portion of the touch panel corresponding to the instruction image with a finger or a touch pen while referring to the instruction image displayed in the image display area.

The touch panel is provided with at least one of a touch panel electrode (for example, a transparent electrode pattern) and a touch panel wiring (for example, a lead wiring (for example, a metal wiring such as a copper wire) formed in a frame portion). The touch panel further includes a touch panel protective film that covers the electrodes directly or through another layer for the purpose of protecting at least one of the touch panel electrodes and the touch panel wiring (hereinafter also referred to as "electrodes, etc."). be provided.
In a touch panel, electrodes and the like may corrode due to humidity (that is, water vapor). Furthermore, the thickness of the touch panel protective film may be thinner than, for example, the thickness of a general printed wiring board protective film. Therefore, the touch panel protective film is sometimes required to reduce the WVTR in order to suppress the corrosion of the electrodes and the like.
Therefore, the photosensitive composition according to the present disclosure provides a touch panel protective film that protects the electrodes and the like of a touch panel including electrodes and the like (that is, at least one of the touch panel electrodes and the touch panel wiring). It is particularly suitable for use in forming as

Each component that can be contained in the photosensitive composition according to the present disclosure will be described below.

<Specific polymer>
The photosensitive composition according to the present disclosure contains 30% to 70% by mass of the structural unit represented by the above formula A1 and 5% to 60% by mass of the structural unit represented by the above formula B1. , the specific polymer having an acid value of 3.50 mmol/g or less may contain structural units other than the units described above.

[Structural Unit Represented by Formula A1]
The specific polymer contains 30% by mass to 70% by mass of structural units represented by the following formula A1.

In formula A1, Ar represents a phenyl group or naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In Formula A1, Ar may have a substituent, but is preferably an unsubstituted phenyl group or an unsubstituted naphthyl group. Examples of substituents that the phenyl group or naphthyl group may have include an alkyl group, an alkoxy group, an aryl group, a halogen atom, and a hydroxy group. Moreover, the phenyl group or naphthyl group may have a plurality of substituents.
In formula A1, R ^A1 is preferably a hydrogen atom. When R ^A1 represents an alkyl group, it is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group.

The structural unit represented by the formula A1 is introduced into the specific polymer by using, for example, a monomer represented by the following formula A2 as a monomer used in producing the specific polymer.

In formula A2, Ar and R ^A1 have the same meanings as Ar and R ^A1 in formula A1, respectively, and preferred embodiments are also the same.

Specific examples of the monomer represented by formula A2 include styrene, α-methylstyrene, 1-vinylnaphthalene, 2-vinylnaphthalene, 4-hydroxystyrene, 4-bromostyrene, 4-methoxystyrene and the like. , and styrene are particularly preferred.

Specific examples of the structural unit represented by formula A1 are shown below, but the structural unit represented by formula A1 is not limited thereto.

From the viewpoint of reducing the tackiness, the content of the structural unit represented by formula A1 with respect to the total mass of the specific polymer is 30% by mass to 70% by mass, and preferably 40% by mass to 60% by mass. preferable.
The specific polymer may contain a plurality of structural units represented by Formula A1. In that case, the above content is the total value of the content of a plurality of constitutional units represented by formula A1.

[Structural Unit Represented by Formula B1]
The specific polymer contains 5% to 60% by mass of structural units represented by the following formula B1.

In formula B1, X ^B1 and X ^B2 each independently represent -O- or -NR ^N -, R ^N represents a hydrogen atom or an alkyl group, L represents a methylene group, an ethylene group or an arylene group, R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group.
In formula B1, at least one of X ^B1 and X ^B2 is preferably —O—, more preferably both are —O—.
In formula B1, R 3 ^N is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or a methyl group, still more preferably a hydrogen atom.
In addition, the above L may have a substituent, and examples of the substituent include an alkyl group, more preferably an alkyl group having 1 to 4 carbon atoms, and still more preferably a methyl group.
In formula B1, L is preferably a methylene group, an ethylene group or a methylethylene group.
Moreover, when L represents an arylene group, a phenylene group or a naphthylene group is preferable, and a phenylene group is more preferable.
In Formula B1, R 1 ^B1 and R ^{2 B2} are each independently preferably a hydrogen atom or a methyl group. From the viewpoint of reducing tackiness, R ^B1 is more preferably a methyl group.

The structural unit represented by the formula B1 is introduced into the specific polymer by using, for example, a monomer represented by the following formula B2 or the following formula B3 as a monomer used in the production of the specific polymer. be done. Specifically, for example, after polymerization using at least the above-described monomers, ethylene By forming a polyunsaturated group, the structural unit represented by Formula B1 is introduced into the specific polymer.

In Formulas B2 and B3, R ^B1 , X ^B1 , X ^B2 and L have the same meanings as R ^B1 , X ^B1 , X ^B2 and L in Formula 1, respectively, and preferred embodiments are also the same.
In Formulas B2 and B3, R ^{4 B4} and R 4 ^B5 each have the same meaning as R ^{2 B2} in Formula 1, and preferred embodiments are also the same.
In formulas B2 and B3, A ^B1 and A ^B2 each represent a halogen atom, preferably a chlorine atom, a bromine atom, or an iodine atom.

-Base compound used to cause elimination reaction-
In addition, examples of the base compound used for causing the elimination reaction include inorganic base compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium hydrogen carbonate, potassium carbonate, potassium hydrogen carbonate, sodium methoxide, Examples include metal alkoxides such as sodium ethoxide and potassium t-butoxide, and organic base compounds such as triethylamine, pyridine and diazabicycloundecene (DBU).

Examples of the polymerizable monomer represented by Formula B2 or Formula B3 include the following compounds (i-1) to (i-6) and (ii-1) to (ii-6), but are limited to these not to be

Specific examples of the structural unit represented by Formula B1 are shown below, but are not limited thereto.
In the specific examples below, each R independently represents a hydrogen atom or a methyl group.

From the viewpoint of achieving both reduction in WVTR and reduction in tackiness of the cured film, the content of the structural unit represented by formula B1 is 5% by mass to 60% by mass with respect to the total mass of the specific polymer. % by mass to 50% by mass.
The specific polymer may contain a plurality of structural units represented by formula B1. In that case, the above content is the total value of the content of a plurality of structural units represented by formula B1.

[Acid value]
From the viewpoint of reducing the WVTR of the cured film, the acid value of the specific polymer is 3.50 mmol/g or less, more preferably 3.00 mmol/g or less, and preferably 2.50 mmol/g or less. More preferred.
Further, from the viewpoint of developability, the acid value of the specific polymer is preferably 0.50 mmol/g or more, more preferably 1.00 mmol/g or more, and 1.50 mmol/g or more. is more preferred.
The acid value of the polymer dispersant is measured by a neutralization titration method according to JIS K0070 (1992), and calculated by conversion as 1 mmol/g=56.1 mgKOH/g.

- Structural Unit Having an Acidic Group -
In order to make the acid value of the specific polymer within the above range, the specific polymer preferably has a structural unit having an acidic group.
The acidic group is a substituent having a dissociative proton, and means an acidic group such as a carboxyl group, a phosphonyl group, a phosphoryl group, a sulfo group, and a boric acid group. Among these, the acidic group is preferably a carboxy group, a sulfo group or a phosphonyl group, more preferably a carboxy group.

The structural unit having an acidic group has an acidic group such as (meth)acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, bis(methacryloxyethyl)phosphate or 2-acrylamido-2-methylpropanesulfonic acid. It is preferably a structural unit derived from a monomer, more preferably a structural unit derived from methacrylic acid or acrylic acid, and further preferably a structural unit derived from methacrylic acid from the viewpoint of reducing tackiness. preferable.

The content of the structural unit having an acidic group with respect to the total mass of the specific polymer is preferably 5% by mass or more and 30% by mass or less, from the viewpoint of making the above-mentioned acid value a preferable range, and 10% by mass or more and 25% by mass. % by mass or less is more preferable.
The specific polymer may contain a plurality of structural units having an acidic group. In that case, the above content is the total value of the content of a plurality of constitutional units having an acidic group.

[Structural Unit Having Alicyclic Structure]
From the viewpoint of reducing tackiness, the specific polymer preferably further has a structural unit having an alicyclic structure.
The alicyclic structure includes a dicyclopentanyl ring structure, a dicyclopentenyl ring structure, an isobornyl ring structure, an adamantane ring structure and the like.
Structural units having an alicyclic structure are preferably structural units derived from dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, or adamantyl (meth)acrylate. . From the viewpoint of reducing tackiness, the structural unit having an alicyclic structure is more preferably a structural unit derived from dicyclopentanyl methacrylate, dicyclopentenyl methacrylate, isobornyl methacrylate, or adamantyl methacrylate. .

From the viewpoint of reducing the WVTR of the cured film, the content of the structural unit having an alicyclic structure with respect to the total mass of the specific polymer is preferably 5% by mass or more and 30% by mass or less, and 10% by mass or more and 25% by mass. % by mass or less is more preferable.
The specific polymer may contain a plurality of structural units having an alicyclic structure. In that case, the above content is the total value of the content of a plurality of constitutional units containing an alicyclic structure.

The content of other structural units with respect to the total mass of the specific polymer is preferably 0% by mass to 20% by mass, and 0.2% by mass to 10% by mass, from the viewpoint of reducing tackiness and WVTR of the cured film. % by mass is more preferred.
The specific polymer may contain a plurality of other structural units. In that case, the above content is the total value of the content of other plural structural units.

[Weight average molecular weight of specific polymer]
The weight average molecular weight (Mw) of the specific polymer is not particularly limited, but is preferably 10,000 to 200,000 from the viewpoint of further reducing developability, WVTR of the cured film, and reducing tackiness. 10,000 to 100,000 is more preferred, and 10,000 to 60,000 is particularly preferred.
In the present disclosure, weight average molecular weight (Mw) can be measured by gel permeation chromatography (GPC) under the following conditions. The calibration curve is manufactured by Tosoh Corporation "Standard sample TSK standard, polystyrene": "F-40", "F-20", "F-4", "F-1", "A-5000", "A -2500", "A-1000", and "n-propylbenzene".
-conditions-
・ GPC: HLC (registered trademark)-8020GPC (manufactured by Tosoh Corporation)
・ Column: TSKgel (registered trademark), Super Multipore HZ-H (manufactured by Tosoh Corporation, 4.6 mm ID × 15 cm) 3 columns ・ Eluent: THF (tetrahydrofuran)
・Sample concentration: 0.45% by mass
・Flow rate: 0.35 ml/min
・Sample injection volume: 10 μl
・Measurement temperature: 40°C
・Detector: Differential refractometer (RI)

〔Content〕
There is no particular limitation on the content of the specific polymer in the photosensitive composition according to the present disclosure.
The content of the specific polymer is preferably 10% by mass to 95% by mass, more preferably 10% by mass to 60% by mass, relative to the solid content of the photosensitive composition, and 20% by mass to 50% by mass. % by weight is particularly preferred.
In addition, the inclusion of the specific polymer in the photosensitive composition according to the present disclosure improves the resistance to salt water and heat of the cured film. Here, the resistance to heat and humidity in salt water means resistance to heat and humidity when exposed to a salt-containing liquid such as sweat (the same applies hereinafter).

The photosensitive composition according to the present disclosure may contain other polymers (for example, acrylic resin, polysiloxane resin, polystyrene resin, polyimide resin, etc.) other than the specific polymer.
In the photosensitive composition according to the present disclosure, the content of the specific polymer relative to the total content of the polymer contained is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and 90% by mass. % to 100% by weight is particularly preferred.

[Method for producing specific polymer]
The specific polymer is, for example, a monomer represented by the above formula A2, at least one selected from the group consisting of monomers represented by the above formulas B2 and B3, and the above acid group and a monomer having and are polymerized by a known method, followed by an elimination reaction using the above-described basic compound.
The method described in Japanese Patent No. 5512095 can be referred to for details of the method for producing the specific polymer.

〔Concrete example〕
Specific examples of the specific polymer used in the present disclosure include polymer P-1 to polymer P-13 in Examples described later.

<Radical polymerization initiator>
The photosensitive composition according to the present disclosure contains at least one radical polymerization initiator.
The radical polymerization initiator is not particularly limited, and known radical polymerization initiators can be used.
The radical polymerization initiator is preferably a radical photopolymerization initiator.
As a radical polymerization initiator,
a radical polymerization initiator having an oxime ester structure (hereinafter also referred to as "oxime-based polymerization initiator"),
a radical polymerization initiator having an α-aminoalkylphenone structure (hereinafter also referred to as “α-aminoalkylphenone-based polymerization initiator”);
a radical polymerization initiator having an α-hydroxyalkylphenone structure (hereinafter also referred to as “α-hydroxyalkylphenone-based polymerization initiator”);
a radical polymerization initiator having an acylphosphine oxide structure (hereinafter also referred to as an "acylphosphine oxide-based polymerization initiator");
etc.

The radical polymerization initiator preferably contains at least one selected from the group consisting of oxime polymerization initiators, α-aminoalkylphenone polymerization initiators, and α-hydroxyalkylphenone polymerization initiators. More preferably, it contains at least one selected from the group consisting of initiators and α-aminoalkylphenone-based polymerization initiators.

Further, as the radical polymerization initiator, for example, polymerization initiators described in paragraphs 0031 to 0042 of JP-A-2011-95716 and paragraphs 0064-0081 of JP-A-2015-014783 may be used.

Commercially available radical polymerization initiators include 1,2-octanedione, 1-[4-(phenylthio)-,2-(O-benzoyloxime)] (trade name: IRGACURE (registered trademark) OXE-01, BASF company), ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) (trade name: IRGACURE OXE-02, BASF company), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: IRGACURE 379EG, manufactured by BASF) , 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: IRGACURE 907, manufactured by BASF), 2-hydroxy-1-{4-[4-(2- Hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: IRGACURE 127, manufactured by BASF), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl) -butanone-1 (trade name: IRGACURE 369, manufactured by BASF), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: IRGACURE 1173, manufactured by BASF), 1-hydroxycyclohexylphenyl ketone (trade name: IRGACURE 184, manufactured by BASF), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: IRGACURE 651, manufactured by BASF), oxime ester-based (trade name: Lunar 6 , DKSH Japan Co., Ltd.) and the like.

〔Content〕
The content of the radical polymerization initiator in the photosensitive composition according to the present disclosure is not particularly limited.
The photosensitive composition according to the present disclosure may contain one type of radical polymerization initiator alone, or two or more types thereof may be used in combination.
The content of the radical polymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1.0% by mass or more, relative to the solid content of the photosensitive composition.
Moreover, the content of the radical polymerization initiator is preferably 10% by mass or less, more preferably 5% by mass or less, relative to the solid content of the photosensitive composition.

<Radical polymerizable compound>
From the viewpoint of further improving the strength of the cured film, the photosensitive composition according to the present disclosure preferably contains at least one radically polymerizable compound.
The radically polymerizable compound preferably contains a difunctional or higher radically polymerizable compound.

Here, the radically polymerizable compound means a monomer having a radically polymerizable group in one molecule, and the difunctional or higher radically polymerizable compound is a monomer having two or more radically polymerizable groups in one molecule. means
The radically polymerizable group is preferably an ethylenically unsaturated group (that is, a group having an ethylenic double bond), more preferably a (meth)acryloyl group.
(Meth)acrylates are preferred as the radically polymerizable compound.

From the viewpoint of reducing the WVTR of the cured film and improving the resistance to salt water and heat, the photosensitive composition according to the present disclosure includes a bifunctional radically polymerizable compound (preferably a bifunctional (meth)acrylate) and a trifunctional or higher and a radically polymerizable compound (preferably trifunctional or higher (meth)acrylate).
In addition, when the photosensitive composition according to the present disclosure contains a tri- or higher functional (meth)acrylate, the crosslink density in the resulting cured film increases, making it easier to reduce the WVTR.

[Bifunctional radically polymerizable compound having a ring structure]
From the viewpoint of reducing the WVTR of the cured film, the photosensitive composition according to the present disclosure preferably contains a bifunctional radically polymerizable compound having a ring structure as the bifunctional or higher radically polymerizable compound.
The ring structure may be either an alicyclic structure or an aromatic ring structure, but is preferably an alicyclic structure.
Examples of bifunctional radically polymerizable compounds having an alicyclic structure include tricyclodecanediol di(meth)acrylate, and tricyclodecanedimethanol di(meth)acrylate is preferred.
Examples of the bifunctional radically polymerizable compound having an aromatic ring structure include bifunctional radically polymerizable compounds having a bisphenol structure (bisphenol A structure, bisphenol F structure, etc.). ) Acrylate compounds (for example, alkylene oxide-modified bisphenol A di(meth)acrylate, etc.) are preferred.
As the bifunctional radically polymerizable compound having an alicyclic structure, a commercially available product may be used, and a commercially available product is tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.). , tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), and the like.

[Other bifunctional radically polymerizable compounds]
Other bifunctional radically polymerizable compounds are not particularly limited, and can be appropriately selected from known compounds.
Other difunctional radically polymerizable compounds include alkylenediol di(meth)acrylates such as 1,9-nonanediol di(meth)acrylate and 1,6-hexanediol di(meth)acrylate.
As other difunctional radically polymerizable compounds, commercially available products may be used, and commercially available products include 1,9-nonanediol diacrylate (A-NOD-N manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) and the like.

[Trifunctional or higher radically polymerizable compound]
The trifunctional or higher radically polymerizable compound is not particularly limited, and can be appropriately selected from known compounds.
Trifunctional or higher radically polymerizable compounds include, for example, dipentaerythritol (tri/tetra/penta/hexa) (meth)acrylate, pentaerythritol (tri/tetra) (meth)acrylate, trimethylolpropane tri(meth)acrylate. , ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate skeleton (meth)acrylate compound, and the like.

Here, "(tri/tetra/penta/hexa) (meth)acrylate" is a concept including tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate. , "(tri/tetra)(meth)acrylate" is a concept including tri(meth)acrylate and tetra(meth)acrylate.

As the radically polymerizable compound,
Caprolactone-modified compounds of (meth) acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxides of (meth) acrylate compounds Modified compounds (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel Allnex Co., Ltd.),
Ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.) and the like are also included.

[Urethane (meth)acrylate]
Urethane (meth)acrylates (preferably trifunctional or higher urethane (meth)acrylates) can also be used as the radically polymerizable compound.
Trifunctional or higher urethane (meth)acrylates include, for example, 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd. ) made), etc.

[Radical polymerizable compound having an acidic group]
Moreover, the radically polymerizable compound preferably contains a radically polymerizable compound having an acidic group from the viewpoint of improving alkali solubility (that is, improving developability) and improving resistance to salt water and heat of the cured film.
The acidic group includes, for example, a phosphate group, a sulfonic acid group, and a carboxy group, with the carboxy group being preferred.
Examples of the radically polymerizable compound having an acidic group include
Tri- to tetra-functional radically polymerizable compounds having an acidic group (having a carboxylic acid group introduced into the pentaerythritol tri- and tetraacrylate [PETA] skeleton (acid value = 80 mgKOH/g to 120 mgKOH/g)),
5- to 6-functional radically polymerizable compounds having an acidic group (dipentaerythritol penta and hexaacrylate [DPHA] skeletons into which a carboxylic acid group is introduced (acid value = 25 to 70 mgKOH/g)), and the like.
These trifunctional or higher radically polymerizable compounds having an acidic group may be used in combination with a bifunctional radically polymerizable compound having an acidic group, if necessary.

As the radically polymerizable compound having an acidic group, at least one selected from the group consisting of difunctional or higher radically polymerizable compounds containing a carboxyl group and carboxylic acid anhydrides thereof is preferable. This increases the resistance to salt water and heat of the cured film.
The bifunctional or higher radically polymerizable compound containing a carboxy group is not particularly limited, and can be appropriately selected from known compounds.
Examples of the bifunctional or higher radically polymerizable compound containing a carboxy group include Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix M-520 (manufactured by Toagosei Co., Ltd.), or Aronix M-510 (manufactured by Toagosei Co., Ltd.) can be preferably used.

The radical polymerizable compound having an acidic group is also preferably a polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942. The contents of this publication are incorporated herein.

[Molecular weight]
The molecular weight of the radically polymerizable compound that may be contained in the photosensitive composition according to the present disclosure (weight average molecular weight when having a distribution) is preferably 200 to 3000, more preferably 250 to 2600, and further 280 to 2200. preferable.
When the photosensitive composition according to the present disclosure contains a radically polymerizable compound, among all the radically polymerizable compounds contained in the photosensitive composition, the molecular weight of the one with the smallest molecular weight is preferably 250 or more, 280 or more. is more preferable, and 300 or more is even more preferable.
When the photosensitive composition according to the present disclosure contains a radically polymerizable compound, among all the radically polymerizable compounds contained in the photosensitive composition, the content ratio of the radically polymerizable compound having a molecular weight of 300 or less is 30% by mass or less is preferable, 25% by mass or less is more preferable, and 20% by mass or less is even more preferable with respect to all polymerizable compounds contained in the photosensitive composition.

〔Content〕
When the photosensitive composition according to the present disclosure contains a radically polymerizable compound, the content of the radically polymerizable compound is preferably 1% by mass to 70% by mass, preferably 10% by mass, based on the solid content of the photosensitive composition. ~70% by mass is more preferable, 20% by mass to 60% by mass is even more preferable, and 20% by mass to 50% by mass is particularly preferable.

Further, when the photosensitive composition according to the present disclosure contains a bifunctional radically polymerizable compound and a trifunctional or higher radically polymerizable compound, the content of the bifunctional radically polymerizable compound is It is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 85% by mass, and even more preferably 30% by mass to 80% by mass, based on all radically polymerizable compounds contained.
In this case, the content of the trifunctional or higher radically polymerizable compound is preferably 10% by mass to 90% by mass, more preferably 15% by mass to 80% by mass, with respect to all the radically polymerizable compounds contained in the photosensitive composition. %, more preferably 20% by mass to 70% by mass.
In this case, the content of the difunctional or higher radically polymerizable compound is 50% by mass or more and less than 100% by mass with respect to the total content of the difunctional radically polymerizable compound and the trifunctional or higher radically polymerizable compound. is preferably 60% by mass to 95% by mass, and particularly preferably 70% by mass to 95% by mass.

In addition, when the photosensitive composition according to the present disclosure contains a difunctional or higher radically polymerizable compound, the photosensitive composition may further contain a monofunctional radically polymerizable compound.
However, when the photosensitive composition according to the present disclosure contains a difunctional or higher radically polymerizable compound, in the radically polymerizable compound contained in the photosensitive composition, the difunctional or higher radically polymerizable compound is the main component. Preferably.
Specifically, when the photosensitive composition according to the present disclosure contains a difunctional or higher radically polymerizable compound, the content of the difunctional or higher radically polymerizable compound is the radical contained in the photosensitive composition. It is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass, based on the total content of the polymerizable compound.

Further, when the photosensitive composition according to the present disclosure contains a radically polymerizable compound having an acidic group (preferably, a difunctional or higher radically polymerizable compound containing a carboxy group or a carboxylic acid anhydride thereof), the acidic The content of the radically polymerizable compound having a group is preferably 1% by mass to 50% by mass, more preferably 1% by mass to 20% by mass, and 1% by mass to 10% by mass, based on the solid content of the photosensitive composition. is more preferred.

In the photosensitive composition according to the present disclosure, the content mass ratio of the radical polymerizable compound to the specific polymer (radical polymerizable compound/specific polymer) is preferably 1.5 or less, more preferably 0.1 to 1.5. It is preferably 0.5 to 1.5, more preferably 0.8 to 1.5, and particularly preferably 1.0 to 1.4.

<Compound Having a Thermally Reactive Group (Thermal Crosslinkable Compound)>
From the viewpoint of further reducing the WVTR of the cured film, the photosensitive composition according to the present disclosure preferably further contains a compound having a thermoreactive group.
In the present disclosure, a thermally reactive group means a group that forms a bond and whose reactivity is changed by the action of heat.
The compound having a heat-reactive group is preferably a compound having two or more heat-reactive groups in one molecule from the viewpoint of further reducing the WVTR of the cured film.
A compound having two or more heat-reactive groups in one molecule reacts with heat to form a crosslinked structure. Hereinafter, a compound having two or more thermally reactive groups in one molecule is also referred to as a "thermally crosslinkable compound".
When the photosensitive composition according to the present disclosure contains a thermally crosslinkable compound, the photosensitive composition has not only photosensitivity (that is, photocuring), but also thermosetting.
When the photosensitive composition according to the present disclosure has both photocurable and thermosetting properties, it is possible to form a cured film having excellent strength by photocuring, and heat curing after forming the cured film increases the strength of the cured film. can be further improved and the WVTR of the cured film can be further reduced.

The thermally reactive group of the thermally crosslinkable compound is at least one selected from the group consisting of an isocyanate group, a ketene group, a blocked isocyanate group, and a blocked ketene group, from the viewpoint of further reducing the WVTR of the cured film. is preferred.
That is, the thermally crosslinkable compound has at least one thermally reactive group selected from the group consisting of an isocyanate group, a ketene group, a blocked isocyanate group, and a blocked ketene group, in total two or more in one molecule. It is particularly preferred to have The upper limit of the number of thermally reactive groups in one molecule is not particularly limited, but the number of thermally reactive groups in one molecule can be, for example, 30 or less, more preferably 10 or less.

The thermally crosslinkable compound may have a hydrophilic group in one molecule.
Developability is improved by having a hydrophilic group in one molecule of the thermally crosslinkable compound.
The thermally crosslinkable compound having a hydrophilic group in one molecule is not particularly limited, and known compounds can be used.
The method for synthesizing the thermally crosslinkable compound having a hydrophilic group in one molecule is also not particularly limited.
A nonionic hydrophilic group or a cationic hydrophilic group is preferable as the hydrophilic group in the thermally crosslinkable compound having a hydrophilic group in one molecule.
The nonionic hydrophilic group is not particularly limited, and includes, for example, a group having a structure in which ethylene oxide or propylene oxide is added to the hydroxyl group of any one of methanol, ethanol, butanol, ethylene glycol, and diethylene glycol.

The thermally crosslinkable compound may be a compound that thermally reacts with an acid.
A thermally crosslinkable compound, which is a compound that reacts with an acid by heat, reacts with an acidic group present in the system (for example, an acidic group in a specific polymer when the specific polymer contains an acid group-containing unit) by heating. do. As a result, the polarity in the system decreases, and the hydrophilicity decreases.
The thermally crosslinkable compound, which is a compound that reacts with an acid by heat, includes, as a thermally reactive group, a group that is temporarily inactivated by a blocking agent (e.g., blocked isocyanate group, blocked ketene group, etc.). and capable of reacting with an acid by dissociation of a group derived from the blocking agent at a predetermined dissociation temperature.
The thermally crosslinkable compound, which is a compound that reacts with an acid by heat, is preferably a compound whose reactivity with an acid after heating above 25°C is higher than that with an acid at 25°C. .

Examples of the thermally crosslinkable compound, which is a compound that reacts with an acid by heat, include a compound having a blocked isocyanate group (hereinafter referred to as "blocked isocyanate compound") or a compound having a blocked ketene group (hereinafter referred to as "blocked ketene compound"). Especially preferred.
In this aspect, when the protective film for protecting the electrode (metal or metal compound) is formed from the photosensitive composition, rusting of the electrode due to the thermally crosslinkable compound is suppressed.

[Blocked isocyanate compound]
As the blocked isocyanate compound, a compound having a structure in which the isocyanate group of an isocyanate compound (that is, a compound having an isocyanate group) is protected (masked) with a blocking agent is preferable.

The blocked isocyanate compound preferably has a hydrophilic group in one molecule. Preferred aspects of the hydrophilic group are as described above.

The dissociation temperature of the blocked isocyanate compound is preferably 100°C to 160°C, more preferably 130°C to 150°C.
Here, the dissociation temperature of the blocked isocyanate compound is defined as "a differential scanning calorimeter (manufactured by Seiko Instruments Inc., DSC6200), when measured by DSC (Differential Scanning Calorimetry) analysis, the deprotection reaction of the blocked isocyanate. The temperature of the endothermic peak associated with

Blocking agents for forming blocked isocyanate compounds (for example, blocked isocyanate compounds having a dissociation temperature of 100° C. to 160° C.) include, for example, pyrazole compounds (3,5-dimethylpyrazole, 3-methylpyrazole, 4- Bromo-3,5-dimethylpyrazole, 4-nitro-3,5-dimethylpyrazole, etc.), active methylene compounds (malonic acid diesters (dimethyl malonate, diethyl malonate, di-n-butyl malonate, di-2-malonate -ethylhexyl, etc.), triazole compounds (1,2,4-triazole, etc.), oxime compounds (compounds having a structure represented by -C (=N-OH)- in one molecule; for example, form aldoxime, acetoaldoxime, acetoxime, methylethylketoxime, cyclohexanone oxime, etc.).
Among them, from the viewpoint of storage stability, oxime compounds and pyrazole compounds are preferable, and oxime compounds are more preferable.

From the viewpoint of improving the toughness of the cured film and adhesion to the substrate, the blocked isocyanate compound preferably has an isocyanurate structure.
A blocked isocyanate compound having an isocyanurate structure is synthesized, for example, by isocyanurating hexamethylene diisocyanate.
Among the blocked isocyanate compounds having an isocyanurate structure, compounds having an oxime structure using an oxime compound as a blocking agent are easier to control the dissociation temperature within a preferred range than compounds having no oxime structure, and , is preferable because it is easy to reduce the development residue.

As the blocked isocyanate compound, the blocked isocyanate compounds described in paragraphs 0074 to 0085 of JP-A-2006-208824 may be used, and the contents of this publication are incorporated herein.
Specific examples of blocked isocyanate compounds include the following compounds. However, the blocked isocyanate is not limited to the following compounds. In the structures of the compounds below, "*" indicates the bonding position.

A commercially available product may be used as the blocked isocyanate compound.
Examples of commercially available blocked isocyanate compounds include Takenate (registered trademark) B870N (manufactured by Mitsui Chemicals, Inc.), which is a methyl ethyl ketone oxime-blocked product of isophorone diisocyanate, and Duranate (registered trademark), which is a hexamethylene diisocyanate-based blocked isocyanate compound. ) MF-K60B, TPA-B80E, and X3071.04 (all manufactured by Asahi Kasei Chemicals Corp.).

[Block ketene compound]
The blocked ketene compound includes a compound having a structure in which the ketene group of a ketene compound (that is, a compound having a ketene group) is protected with a blocking agent, a compound in which a ketene group is generated by light or heat, and the like.
Specific examples of the blocking agent for forming the blocked ketene compound are the same as the specific examples of the blocking agent for forming the blocked isocyanate compound described above.
More specific examples of block ketene compounds include compounds having a naphthoquinonediazide structure, compounds having a Meldrum's acid structure, and the like.

Examples of block ketene compounds include 4-{4-[1,1-bis(4-hydroxyphenyl)ethyl]-α,α-dimethylbenzyl}phenol naphthoquinonediazide sulfonate and 2,3,4-trihydroxybenzophenone. and naphthoquinonediazide sulfonic acid esters.

A commercially available product may be used as the block ketene compound.
Commercial products of block ketene compounds include, for example, Toyo Synthesis ( (stock) TAS-200. Also, naphthoquinonediazide sulfonate esters of 2,3,4-trihydroxybenzophenone are commercially available.

[Compounds Having Other Thermally Reactive Groups]
As the thermally crosslinkable compound, a compound having a thermally reactive group such as an epoxy group or an oxetanyl group may be used.
Specifically, the thermally crosslinkable compound is preferably a polyfunctional epoxy compound having two or more epoxy groups, or a polyfunctional oxetanyl compound having two or more oxetanyl groups, more preferably a polyfunctional epoxy compound, and is bifunctional. Epoxy compounds are more preferred.
As the bifunctional epoxy compound, a bifunctional epoxy compound containing an alicyclic structure or an aromatic ring structure is preferred.
The epoxy group may be a glycidyl group or an alicyclic epoxy group.
Specific examples include epoxy compounds described in JP-A-2017-102432 and epoxy compounds described in JP-A-2015-175923.

〔Content〕
When the photosensitive composition according to the present disclosure contains a thermally crosslinkable compound (for example, a blocked isocyanate compound or a blocked ketene compound), the content of the thermally crosslinkable compound is 1 mass with respect to the solid content of the photosensitive composition. % to 50% by mass, more preferably 5% to 30% by mass, even more preferably 10% to 30% by mass, and 15% to 30% by mass. Especially preferred.

<Solvent>
The photosensitive composition according to the present disclosure may contain at least one solvent from the viewpoint of forming a photosensitive layer by coating.

As the solvent, any commonly used solvent can be used without particular limitation.
Organic solvents are preferred as solvents.
Examples of organic solvents include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, and caprolactam. , n-propanol, 2-propanol, and the like. The photosensitive composition according to the present disclosure may contain a mixed solvent that is a mixture of these compounds.
Examples of the solvent include a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether acetate, a mixed solvent of diethylene glycol ethyl methyl ether and propylene glycol monomethyl ether acetate, or a mixed solvent of methyl ethyl ketone, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate. preferable.

When the photosensitive composition according to the present disclosure contains a solvent, the solid content of the photosensitive composition according to the present disclosure is preferably 5% by mass to 80% by mass with respect to the total amount of the photosensitive composition, 5% to 40% by mass is more preferable, and 5% to 30% by mass is particularly preferable.

When the photosensitive composition according to the present disclosure contains a solvent, the viscosity (25° C.) of the photosensitive composition is preferably 1 mPa s to 50 mPa s, and 2 mPa s to 40 mPa s, from the viewpoint of coatability. is more preferable, and 3 mPa·s to 30 mPa·s is particularly preferable.
Viscosity is measured using, for example, VISCOMETER TV-22 (manufactured by TOKI SANGYO CO. LTD).
When the photosensitive composition according to the present disclosure contains a solvent, the surface tension (25 ° C.) of the photosensitive composition is preferably 5 mN/m to 100 mN/m, from the viewpoint of coatability, and 10 mN/m to 80 mN/ m is more preferred, and 15 mN/m to 40 mN/m is particularly preferred.
The surface tension is measured using, for example, Automatic Surface Tensiometer CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.).

Solvents can also be used as described in paragraphs 0054 and 0055 of US Published Application 2005/282073, the contents of which are incorporated herein.
Also, as the solvent, an organic solvent having a boiling point of 180° C. to 250° C. (high boiling point solvent) can be used as necessary.

<Other ingredients>
The photosensitive composition according to the present disclosure may contain other components than those mentioned above.
Other components include, for example, metal oxidation inhibitors described below, surfactants described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of Japanese Patent Application Laid-Open No. 2009-237362, known fluorosurfactants, Thermal polymerization inhibitors described in paragraph 0018 of Japanese Patent No. 4502784 and other additives described in paragraphs 0058 to 0071 of JP-A-2000-310706 are included.
The photosensitive composition according to the present disclosure preferably contains Megafac F-551 (manufactured by DIC Corporation), which is a fluorosurfactant, as another component.

In addition, the photosensitive composition according to the present disclosure may contain at least one kind of particles (for example, metal oxide particles) as other components for the purpose of adjusting the refractive index and light transmittance.
The metals of the metal oxide particles also include semimetals such as B, Si, Ge, As, Sb, and Te. From the viewpoint of the transparency of the cured film, the average primary particle size of the particles (eg metal oxide particles) is preferably 1 to 200 nm, more preferably 3 to 80 nm. The average primary particle size is calculated by measuring the particle size of 200 arbitrary particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particles is not spherical, the longest side is taken as the particle diameter.
The content of the particles is preferably 0% by mass to 35% by mass, more preferably 0% by mass to 10% by mass, still more preferably 0% by mass to 5% by mass, relative to the solid content of the photosensitive composition. % to 1% by weight is more preferred, and 0% by weight (ie, no particles in the photosensitive composition) is particularly preferred.

In addition, the photosensitive composition according to the present disclosure may contain a small amount of colorant (pigment, dye, etc.) as another component, but from the viewpoint of transparency, it does not substantially contain a colorant. is preferred.
Specifically, the content of the colorant in the photosensitive composition according to the present disclosure is preferably less than 1% by mass, more preferably less than 0.1% by mass, relative to the solid content of the photosensitive composition.

(transfer film)
A transfer film according to the present disclosure comprises a temporary support and a photosensitive layer containing the solid content of the photosensitive composition according to the present disclosure.
The transfer film according to the present disclosure is suitable for forming a cured film on a substrate. When forming a cured film on a substrate using the transfer film according to the present disclosure, for example, the photosensitive layer of the transfer film according to the present disclosure is transferred to the substrate on which the cured film is to be formed, A cured film is formed on the substrate by subjecting the photosensitive layer transferred onto the substrate to treatments such as exposure and development.
According to the transfer film according to the present disclosure, the same effect as the effect of the photosensitive composition according to the present disclosure, that is, the effect that a cured film with reduced WVTR can be formed is exhibited.
Therefore, the transfer film according to the present disclosure is particularly suitable as a cured film for use in forming a touch panel protective film.

The photosensitive layer in the transfer film contains solids of the photosensitive composition according to the present disclosure.
That is, when the photosensitive composition according to the present disclosure contains a solvent, the photosensitive layer in the transfer film contains at least components (that is, solid content) other than the solvent of the photosensitive composition. In this case, the photosensitive layer may further contain a solvent. When the photosensitive layer contains a solvent, for example, when a photosensitive composition containing a solvent is applied and dried to form a photosensitive layer, the solvent remains in the photosensitive layer even after drying. There are cases where
Moreover, when the photosensitive composition according to the present disclosure does not contain a solvent, the photosensitive layer in the transfer film contains all the components of the photosensitive composition.

In the transfer film according to the present disclosure, a layer having a refractive index of 1.50 or more (more preferably 1.55 or more, particularly preferably 1.55 or more, particularly preferably 1.55 or more) at a wavelength of 550 nm is provided on the side of the photosensitive layer opposite to the temporary support. 60 or more) is preferably provided (high refractive index layer).
In this aspect, a touch panel protective film is formed by transferring a photosensitive layer and a high refractive index layer of a transfer film to a touch panel substrate provided with a transparent electrode pattern (for example, a transparent electrode pattern made of ITO (Indium Tin Oxide)). is formed, the transparent electrode pattern becomes less visible (that is, the hiding property of the transparent electrode pattern is further improved).
The high refractive index layer is not particularly limited as long as it has a refractive index of 1.50 or more at a wavelength of 550 nm.
Regarding the phenomenon in which the transparent electrode pattern is visible and the concealability of the transparent electrode pattern, JP-A-2014-10814 and JP-A-2014-108541 can be referred to as appropriate.

As used herein, "refractive index" means a value measured by ellipsometry at a temperature of 23° C. and visible light with a wavelength of 550 nm, unless otherwise specified.

The high refractive index layer has a refractive index of 1.50 or more (more preferably 1.60 or more) because it is easy to adjust the refractive index to 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more). .55 or more, particularly preferably 1.60 or more), a polymer compound having a refractive index of 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more), and a refractive index It is preferable to contain at least one selected from the group consisting of polymerizable monomers having a ratio of 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more).

FIG. 1 is a schematic cross-sectional view of a transfer film 10, which is an example of a transfer film according to the present disclosure.
As shown in FIG. 1, the transfer film 10 has a laminated structure of protective film 16/high refractive index layer 20A/photosensitive layer 18A/temporary support 12 (that is, temporary support 12, photosensitive layer 18A, 20 A of high refractive index layers, and the protective film 16 are laminated|stacked structures arrange|positioned in this order).
However, the transfer film according to the present disclosure is not limited to being the transfer film 10, and for example, the high refractive index layer 20A and the protective film 16 may be omitted. At least one of a thermoplastic resin layer and an intermediate layer, which will be described later, may be provided between the temporary support 12 and the photosensitive layer 18A.

Photosensitive layer 18A is a layer containing the solid content of the photosensitive composition according to the present disclosure.
The high refractive index layer 20A is a layer arranged on the side opposite to the side on which the temporary support 12 is present when viewed from the photosensitive layer 18A, and has a refractive index of 1.50 or more at a wavelength of 550 nm.
The transfer film 10 is a negative material (negative film).

A manufacturing method of the transfer film 10 is not particularly limited.
The method for producing the transfer film 10 includes, for example, a step of forming the photosensitive layer 18A on the temporary support 12, a step of forming the high refractive index layer 20A on the photosensitive layer 18A, and a step of forming the high refractive index layer 20A on the high refractive index layer 20A. and a step of forming the protective film 16 in this order.
In the method for manufacturing the transfer film 10, between the step of forming the high refractive index layer 20A and the step of forming the protective film 16, ammonia is volatilized, which is described in paragraph 0056 of WO 2016/009980. A step may be included.

Each element that can be included in the transfer film according to the present disclosure will be described below.

<Temporary support>
A transfer film according to the present disclosure includes a temporary support (eg, temporary support 12).
The temporary support is preferably a film, more preferably a resin film.
As the temporary support, a film that is flexible and does not undergo significant deformation, shrinkage, or elongation under pressure or under pressure and heat can be used.
Such films include, for example, polyethylene terephthalate films, cellulose triacetate films, polystyrene films, polyimide films, and polycarbonate films.
Among them, a biaxially stretched polyethylene terephthalate film is particularly preferred.

Although the thickness of the temporary support is not particularly limited, it is, for example, 5 μm to 200 μm. The thickness of the temporary support is particularly preferably 10 μm to 150 μm from the viewpoint of ease of handling and versatility.

<Photosensitive layer>
A transfer film according to the present disclosure comprises a photosensitive layer (eg, photosensitive layer 18A) containing solids of a photosensitive composition according to the present disclosure.
The photosensitive layer has photosensitivity (that is, photocurability), and may also have thermosetting property. Examples of means for imparting thermosetting properties to the photosensitive layer include means for incorporating the above-described thermally crosslinkable compound into the photosensitive composition according to the present disclosure. When the photosensitive layer has both photocurability and thermosetting properties, the strength of the cured film can be further improved and the WVTR of the cured film can be further reduced.
The photosensitive layer preferably further has alkali solubility (for example, solubility in a weakly alkaline aqueous solution). Means for imparting alkali-solubility to the photosensitive layer include, for example, means for incorporating the aforementioned acidic group-containing units into the specific polymer.
Also, the photosensitive layer is preferably a transparent layer. Examples of means for making the photosensitive layer transparent include means for setting the content of the colorant in the photosensitive composition according to the present disclosure to less than 1% by mass.

The film thickness of the photosensitive layer is preferably 1 μm to 20 μm, more preferably 2 μm to 15 μm, even more preferably 3 μm to 12 μm.
By setting the film thickness of the photosensitive layer within the above range, the transmittance is less likely to decrease.
By setting the film thickness of the photosensitive layer within the above range, the photosensitive layer becomes less likely to absorb radio waves (short waves) with a wavelength of 10 nm to 100 nm, and yellowing of the photosensitive layer is suppressed.

The refractive index of the photosensitive layer (that is, the refractive index measured by ellipsometry with visible light having a wavelength of 550 nm at a temperature of 23° C.) is preferably from 1.47 to 1.56, and from 1.50 to 1.53. It is more preferred, 1.50 to 1.52 is even more preferred, and 1.51 to 1.52 is particularly preferred.
A method for controlling the refractive index of the photosensitive layer is not particularly limited.
Methods for controlling the refractive index of the photosensitive layer include, for example, a method of selecting a specific polymer having a desired refractive index, a method of controlling by adding metal oxide particles or metal particles, a method of controlling by adding a metal salt and a specific polymer. A method of controlling using a complex with coalescence, and the like.
The photosensitive layer is preferably applied to the image display portion of the touch panel, and in that case, the photosensitive layer preferably has high transparency and high transmittance.

The method for forming the photosensitive layer is not particularly limited.
An example of a method for forming the photosensitive layer includes a method of applying the photosensitive composition according to the present disclosure in a form containing a solvent onto a temporary support, and drying it as necessary.
As a coating method, a known method can be used, and examples thereof include a printing method, a spray method, a roll coating method, a bar coating method, a curtain coating method, a spin coating method, a die coating method (that is, a slit coating method), and the like. and the die coating method is preferred.
As a drying method, known methods such as natural drying, heat drying, and reduced pressure drying can be applied singly or in combination.

<High refractive index layer>
The transfer film according to the present disclosure further includes a high refractive index layer having a refractive index of 1.50 or more at a wavelength of 550 nm (for example, a high refractive index layer in FIG. 1) on the side opposite to the temporary support when viewed from the photosensitive layer 20A).
The high refractive index layer is preferably positioned adjacent to the photosensitive layer, as shown in FIG.
The high refractive index layer is not particularly limited except that it is a layer having a refractive index of 1.50 or more at a wavelength of 550 nm.
The refractive index of the high refractive index layer is preferably 1.55 or higher, more preferably 1.60 or higher.
Although the upper limit of the refractive index of the high refractive index layer is not particularly limited, it is preferably 2.10 or less, more preferably 1.85 or less, still more preferably 1.78 or less, and particularly preferably 1.74 or less.

The high refractive index layer may be photocurable (that is, photosensitive), thermosetting, or both photocurable and thermosetting. .
From the viewpoint of forming a cured film having excellent strength by photocuring after transfer, the high refractive index layer preferably has photocurability.
Moreover, the high refractive index layer preferably has thermosetting properties from the viewpoint that the strength of the cured film can be further improved and the WVTR of the cured film can be further reduced by heat curing.
The high refractive index layer preferably has thermosetting and photosetting properties.
The high refractive index layer preferably has alkali solubility (for example, solubility in a weakly alkaline aqueous solution).
Also, the high refractive index layer is preferably a transparent layer.

The embodiment in which the high refractive index layer is photosensitive has the advantage that after transfer, the photosensitive layer and the high refractive index layer transferred onto the substrate can be patterned collectively by photolithography once.

The thickness of the high refractive index layer is preferably 500 nm or less, more preferably 110 nm or less, and particularly preferably 100 nm or less.
The thickness of the high refractive index layer is preferably 20 nm or more, more preferably 55 nm or more, still more preferably 60 nm or more, and particularly preferably 70 nm or more.
The thickness of the high refractive index layer is more preferably 55 nm to 100 nm, still more preferably 60 nm to 100 nm, and particularly preferably 70 nm to 100 nm.

The refractive index of the high refractive index layer is preferably 1.50 or higher (more preferably 1.55 or higher, particularly preferably 1.60 or higher) and higher than the refractive index of the photosensitive layer.
After transfer, the high refractive index layer is sandwiched between the transparent electrode pattern (preferably the ITO pattern) and the photosensitive layer, thereby forming a laminate (for example, the touch panel 30 in FIG. 2) together with the transparent electrode pattern and the photosensitive layer. ) may form. In this case, light reflection is further reduced by reducing the refractive index difference between the transparent electrode pattern and the high refractive index layer and the refractive index difference between the high refractive index layer and the photosensitive layer. This further improves the concealability of the transparent electrode pattern.
For example, when a transparent electrode pattern, a high refractive index layer, and a photosensitive layer are laminated in this order, the transparent electrode pattern becomes less visible when viewed from the transparent electrode pattern side.

The refractive index of the high refractive index layer is preferably adjusted according to the refractive index of the transparent electrode pattern.
When the refractive index of the transparent electrode pattern is in the range of 1.8 to 2.0 as in the case of forming using oxides of In and Sn (ITO), the refractive index of the high refractive index layer is 1.60 or more is preferable. Although the upper limit of the refractive index of the high refractive index layer in this case is not particularly limited, it is preferably 2.1 or less, more preferably 1.85 or less, even more preferably 1.78 or less, and particularly preferably 1.74 or less.
When the refractive index of the transparent electrode pattern exceeds 2.0 as in the case of forming using an oxide of In and Zn (IZO; Indium Zinc Oxide), the refractive index of the high refractive index layer is 1.0. 70 or more and 1.85 or less are preferable.

The method for controlling the refractive index of the high refractive index layer is not particularly limited. and a method using a complex of

The high refractive index layer includes inorganic particles having a refractive index of 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more), and a refractive index of 1.50 or more (more preferably 1.55 or more). , particularly preferably 1.60 or more), and a polymerizable monomer having a refractive index of 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more). It is preferable to contain at least one.
In this aspect, it is easy to adjust the refractive index of the high refractive index layer to 1.50 or more (more preferably 1.55 or more, particularly preferably 1.60 or more).
Preferred aspects of each of the inorganic particles having a refractive index of 1.50 or higher, the resin having a refractive index of 1.50 or higher, and the polymerizable monomer having a refractive index of 1.50 or higher will be described later.

Also, the high refractive index layer preferably contains a binder polymer, a polymerizable monomer, and particles.
Regarding the components of the high refractive index layer, the components of the curable transparent resin layer described in paragraphs 0019 to 0040 and 0144 to 0150 of JP 2014-108541, paragraphs 0024 to 0035 of JP 2014-10814 and the components of the transparent layer described in WO 2016/009980, the components of the composition having an ammonium salt described in paragraphs 0034 to 0056 of WO 2016/009980, and the like.

Also, the high refractive index layer preferably contains at least one metal oxidation inhibitor.
When the high refractive index layer contains a metal oxidation inhibitor, when the high refractive index layer is transferred onto the substrate (i.e., the object to be transferred), a member that is in direct contact with the high refractive index layer (e.g., substrate conductive members formed thereon) can be surface treated. This surface treatment imparts a metal oxidation suppressing function (protective property) to the member that is in direct contact with the high refractive index layer.

The metal oxidation inhibitor is preferably a compound having an aromatic ring containing a nitrogen atom. A compound having an aromatic ring containing a nitrogen atom may have a substituent.
The aromatic ring containing a nitrogen atom is preferably an imidazole ring, a triazole ring, a tetrazole ring, a thiazole ring, a thiadiazole ring, or a condensed ring of any one of these and another aromatic ring, such as an imidazole ring, a triazole ring, and a tetrazole ring. A ring or a condensed ring of any one of these and another aromatic ring is more preferred.
The "other aromatic ring" forming the condensed ring may be a monocyclic ring or a heterocyclic ring, but is preferably a monocyclic ring, more preferably a benzene ring or a naphthalene ring, and still more preferably a benzene ring.

The metal oxidation inhibitor is preferably imidazole, benzimidazole, tetrazole, 5-amino-1H-tetrazole, mercaptothiadiazole or benzotriazole, more preferably imidazole, benzimidazole, 5-amino-1H-tetrazole or benzotriazole.
A commercial product may be used as the metal oxidation inhibitor, and as a commercial product, BT120 manufactured by Shirohoku Chemical Industry Co., Ltd. containing benzotriazole, for example, can be preferably used.

When the high refractive index layer contains a metal oxidation inhibitor, the content of the metal oxidation inhibitor is preferably 0.1% by mass to 20% by mass, preferably 0.5% by mass, based on the solid content of the high refractive index layer. ~10% by mass is more preferable, and 1% by mass to 5% by mass is even more preferable.

The high refractive index layer may contain components other than the components described above.
Other components that can be contained in the high refractive index layer include those similar to other components that can be contained in the photosensitive composition according to the present disclosure.
The high refractive index layer preferably contains a surfactant as another component.

The method for forming the high refractive index layer is not particularly limited.
As an example of a method for forming a high refractive index layer, a composition for forming a high refractive index layer in a form containing an aqueous solvent is applied onto the above photosensitive layer formed on a temporary support, and dried if necessary. A method of forming by causing the
Specific examples of the coating and drying methods are the same as the specific examples of coating and drying when forming the photosensitive layer.

The composition for forming a high refractive index layer may contain each component of the high refractive index layer described above.
The high refractive index layer-forming composition contains, for example, a binder polymer, a polymerizable monomer, particles, and an aqueous solvent.
Moreover, as the composition for forming a high refractive index layer, a composition having an ammonium salt described in paragraphs 0034 to 0056 of WO 2016/009980 is also preferable.

<Protective film>
The transfer film according to the present disclosure may further include a protective film (eg, protective film 16 in FIG. 1) on the opposite side of the temporary support from the photosensitive layer.
When the transfer film according to the present disclosure includes a high refractive index layer, the protective film is preferably arranged on the side opposite to the temporary support (that is, the side opposite to the photosensitive layer) as viewed from the high refractive index layer. (See, for example, FIG. 1).
Protective films include, for example, polyethylene terephthalate films, polypropylene films, polystyrene films, and polycarbonate films.
As the protective film, for example, those described in paragraphs 0083 to 0087 and 0093 of JP-A-2006-259138 may be used.

<Thermoplastic resin layer>
The transfer film according to the present disclosure further includes a thermoplastic resin layer (non- shown).
When the transfer film is provided with a thermoplastic resin layer, when the transfer film is transferred to the substrate to form a laminate, air bubbles are less likely to occur in each element of the laminate. When this laminate is used in an image display device, image unevenness is less likely to occur, and excellent display characteristics can be obtained.
The thermoplastic resin layer preferably has alkali solubility.
The thermoplastic resin layer functions as a cushioning material that absorbs irregularities on the base material surface during transfer.
The irregularities on the base material surface include already formed images, electrodes, wiring, and the like. It is preferable that the thermoplastic resin layer has a property that it can be deformed according to unevenness.

The thermoplastic resin layer preferably contains an organic polymer substance described in JP-A-5-72724, and the Vicat method (specifically, the polymer softening point according to the American material testing method ASTM D1235) It is more preferable to include an organic polymeric substance having a softening point of about 80° C. or less according to the measurement method).

The thickness of the thermoplastic resin layer is preferably 3 μm to 30 μm, more preferably 4 μm to 25 μm, even more preferably 5 μm to 20 μm.
When the thickness of the thermoplastic resin layer is 3 μm or more, the conformability to the unevenness of the base material surface is improved, so that the unevenness of the base material surface can be more effectively absorbed.
When the thickness of the thermoplastic resin layer is 30 μm or less, process suitability is further improved. For example, the load of drying (solvent removal) when the thermoplastic resin layer is formed by coating on the temporary support is further reduced, and the development time of the thermoplastic resin layer after transfer is shortened.

The thermoplastic resin layer can be formed by coating a temporary support with a thermoplastic resin layer-forming composition containing a solvent and a thermoplastic organic polymer, and drying if necessary.
Specific examples of the coating and drying methods are the same as the specific examples of coating and drying when forming the photosensitive layer.
The solvent is not particularly limited as long as it dissolves the polymer component forming the thermoplastic resin layer, and organic solvents (eg, methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol). is mentioned.

The thermoplastic resin layer preferably has a viscosity of 1,000 Pa·s to 10,000 Pa·s measured at 100°C. Further, the viscosity of the thermoplastic resin layer measured at 100°C is preferably lower than the viscosity of the photosensitive layer measured at 100°C.

<Middle layer>
The transfer film according to the present disclosure further includes an intermediate layer (not shown) between the temporary support (for example, temporary support 12 in FIG. 1) and the photosensitive layer (for example, photosensitive layer 18A in FIG. 1) may be provided.
When the transfer film according to the present disclosure comprises a thermoplastic layer, the intermediate layer is preferably positioned between the thermoplastic layer and the photosensitive layer.
Components of the intermediate layer include, for example, polyvinyl alcohol, polyvinylpyrrolidone, cellulose, or a resin that is a mixture containing at least two of these.
As the intermediate layer, the one described as "separation layer" in JP-A-5-72724 can also be used.

In the case of producing a transfer film in which a thermoplastic resin layer, an intermediate layer, and a photosensitive layer are provided in this order on a temporary support, the intermediate layer includes, for example, a solvent that does not dissolve the thermoplastic resin layer, and the above resin. can be formed by applying an intermediate layer-forming composition containing and drying if necessary. Specific examples of the coating and drying methods are the same as the specific examples of coating and drying when forming the photosensitive layer.
In the above case, for example, first, the thermoplastic resin layer-forming composition is applied onto the temporary support and dried to form the thermoplastic resin layer. Next, an intermediate layer-forming composition is applied onto the thermoplastic resin layer and dried to form an intermediate layer. After that, the photosensitive composition according to the present disclosure in the form containing an organic solvent is applied onto the intermediate layer and dried to form a photosensitive layer. The organic solvent in this case is preferably an organic solvent that does not dissolve the intermediate layer.

(cured film)
A cured film according to the present disclosure is a cured product of the photosensitive composition according to the present disclosure.
That is, the cured film according to the present disclosure is a cured film with reduced WVTR.
The cured film according to the present disclosure is not particularly limited as long as it is a solid cured product of the photosensitive composition according to the present disclosure, but is preferably a touch panel protective film.

A cured film according to the present disclosure may be formed on a substrate.
When the cured film according to the present disclosure is a touch panel protective film, a structure in which at least one of a touch panel electrode and a touch panel wiring is arranged on a substrate (for example, a glass substrate or a resin substrate) as a substrate. A touch panel substrate having

The thickness of the cured film according to the present disclosure is not particularly limited, but is preferably 0.1 μm to 100 μm, more preferably 2 μm to 20 μm, and particularly preferably 4 μm to 10 μm.
In general, the thinner the film, the higher the WVTR of the cured film.
However, even when the cured film according to the present disclosure is thin (for example, the thickness is 10 μm or less), the WVTR is sufficiently reduced. Therefore, the cured film according to the present disclosure is suitable for touch panel protective films.
Moreover, when the thickness of the cured film according to the present disclosure is 2 μm or more, the production aptitude of the cured film is particularly excellent.

The method for producing the cured film according to the present disclosure is not particularly limited, but the cured film according to the present disclosure can be manufactured, for example, by the following manufacturing method A.
Manufacturing method A is
A step of forming a photosensitive layer on a substrate using the photosensitive composition according to the present disclosure or the transfer film according to the present disclosure (hereinafter also referred to as "photosensitive layer forming step");
A step of pattern-exposing a photosensitive layer formed on a substrate (hereinafter also referred to as an “exposure step”);
A step of forming a cured film that is a cured product of the solid content of the photosensitive composition by developing the pattern-exposed photosensitive layer (hereinafter also referred to as a “development step”);
including.

<Photosensitive layer forming step>
The photosensitive layer forming step in manufacturing method A forms a photosensitive layer on a substrate using the photosensitive composition according to the present disclosure or the transfer film according to the present disclosure.

As the substrate, a glass substrate or a resin substrate is preferable.
Also, the substrate is preferably a transparent substrate, more preferably a transparent resin substrate. The meaning of transparency is as described above.
The refractive index of the substrate is preferably 1.50 to 1.52.
As the glass substrate, for example, tempered glass such as Corning Gorilla Glass (registered trademark) can be used.
As the resin substrate, it is preferable to use at least one of those having no optical distortion and having high transparency. ), polyimide (PI), polybenzoxazole (PBO), and cycloolefin polymer (COP).
Materials described in JP-A-2010-86684, JP-A-2010-152809, and JP-A-2010-257492 are preferably used as the material of the transparent substrate.
Further, as the base material in the photosensitive layer forming step, a touch panel substrate having a structure in which at least one of touch panel electrodes and touch panel wirings is arranged on a substrate (for example, a glass substrate or a resin substrate) can also be used.

In the photosensitive layer forming step, the method of forming the photosensitive layer on the substrate includes a method using the transfer film according to the present disclosure and a photosensitive composition according to the present disclosure without using the transfer film according to the present disclosure. and a method using

Hereinafter, first, a method using the transfer film according to the present disclosure will be described.
In the method using the transfer film according to the present disclosure, the transfer film according to the present disclosure is laminated on the substrate, and the photosensitive layer of the transfer film according to the present disclosure is transferred onto the substrate, thereby forming a photosensitive layer on the substrate. form a layer.
Lamination (transfer of the photosensitive layer) can be performed using a known laminator such as a vacuum laminator and an autocut laminator.
When using a transfer film having a laminate structure of protective film/photosensitive layer/intermediate layer/thermoplastic resin layer/temporary support, first, the protective film is peeled off from the transfer film to expose the photosensitive layer, and then , the exposed photosensitive layer and the substrate are in contact with each other, the transfer film and the substrate are bonded together, and heat and pressure are applied. As a result, the photosensitive layer of the transfer film is transferred onto the substrate to form a laminate of temporary support/thermoplastic resin layer/intermediate layer/photosensitive layer/substrate. After that, if necessary, at least the temporary support is peeled off from the laminate.

As an example of the method of transferring the photosensitive layer of the transfer film onto the substrate, pattern-exposing, and developing, the descriptions in paragraphs 0035 to 0051 of JP-A-2006-23696 can also be referred to.

Next, a method of using the photosensitive composition according to the present disclosure without using the transfer film according to the present disclosure will be described.
As a suitable example of this method, the photosensitive composition according to the present disclosure in a form containing a solvent is applied onto a substrate and dried to form a photosensitive layer on the substrate.
Specific examples of the coating and drying methods are the same as the specific examples of coating and drying for forming the photosensitive layer on the temporary support. If necessary, the photosensitive layer after drying and before exposure may be subjected to heat treatment (so-called pre-baking).

<Exposure process>
The exposure step in the manufacturing method A is a step of patternwise exposing the photosensitive layer formed on the substrate.
Here, pattern exposure means exposure in a pattern.
The pattern exposure may be exposure through a mask or digital exposure using a laser or the like.

A light source for pattern exposure can be appropriately selected and used as long as it can emit light in a wavelength range capable of curing the photosensitive layer (for example, 365 nm or 405 nm). Examples of light sources include various lasers, LEDs, ultra-high pressure mercury lamps, high pressure mercury lamps, and metal halide lamps. The exposure amount is preferably 5 mJ/cm ² to 200 mJ/cm ² , more preferably 10 mJ/cm ² to 100 mJ/cm ² .

When the photosensitive layer is formed on the substrate using a transfer film, the pattern exposure may be performed after peeling off the temporary support, or the exposure may be performed before peeling off the temporary support, followed by The temporary support may be peeled off.
In the exposure step, the photosensitive layer may be subjected to heat treatment (so-called PEB (Post Exposure Bake)) after pattern exposure and before development.

<Development process>
The development step in production method A is a step of obtaining a cured film, which is a cured product of the solid content of the photosensitive composition, by developing the pattern-exposed photosensitive layer.

The developer used for development is not particularly limited, and known developers such as the developer described in JP-A-5-72724 can be used.
As the developer, it is preferable to use an alkaline aqueous solution.
Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrapropylammonium hydroxide. , tetrabutylammonium hydroxide, choline (2-hydroxyethyltrimethylammonium hydroxide), and the like.
The pH of the alkaline aqueous solution at 25° C. is preferably 8-13, more preferably 9-12, and particularly preferably 10-12.
The content of the alkaline compound in the alkaline aqueous solution is preferably 0.1% by mass to 5% by mass, more preferably 0.1% by mass to 3% by mass, relative to the total amount of the alkaline aqueous solution.

The developer may contain an organic solvent that is miscible with water.
Examples of organic solvents include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, benzyl alcohol, acetone, methyl ethyl ketone. , cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam, and N-methylpyrrolidone. The concentration of the organic solvent is preferably 0.1% by mass to 30% by mass.
The developer may contain a known surfactant. The surfactant concentration is preferably 0.01% by mass to 10% by mass.
The liquid temperature of the developer is preferably 20.degree. C. to 40.degree.

Development methods include, for example, puddle development, shower development, shower and spin development, and dip development.
In the case of shower development, the uncured portion is removed by showering the developer onto the photosensitive layer after pattern exposure. In the case of using a transfer film comprising a photosensitive layer and at least one of a thermoplastic resin layer and an intermediate layer, after transferring these layers onto a substrate and before developing the photosensitive layer, a photosensitive It is preferable to previously remove at least one of the thermoplastic resin layer and the intermediate layer (if both are present, both of them) by spraying an alkaline liquid having a low solubility of the thermoplastic layer in a shower.
Further, after development, it is preferable to remove development residues by rubbing with a brush or the like while spraying a detergent or the like with a shower.
The liquid temperature of the developer is preferably 20.degree. C. to 40.degree.

The development step may include the step of performing the development and the step of heat-treating (hereinafter also referred to as “post-baking”) the cured film obtained by the development.
When the substrate is a resin substrate, the post-baking temperature is preferably 100°C to 160°C, more preferably 140°C to 150°C.

For example, when a substrate with a transparent electrode such as ITO (for example, an electrode for a touch panel) is used as the substrate, the resistance value of the transparent electrode can be adjusted by post-baking.
Moreover, when the photosensitive layer contains a carboxy group-containing acrylic resin, post-baking can convert at least a portion of the carboxy group-containing acrylic resin into a carboxylic acid anhydride. Thereby, a cured film having excellent salt water wet heat resistance can be obtained.

The development step may include the step of performing the development and the step of exposing the cured film obtained by the development (hereinafter also referred to as “post-exposure”).
When the development step includes the step of post-exposure and the step of post-baking, it is preferably performed in the order of post-exposure and post-baking.

For pattern exposure, development, etc., it is also possible to refer to, for example, paragraphs 0035 to 0051 of JP-A-2006-23696.

Production method A may include other steps (for example, a washing step, etc.) other than the steps described above. As other processes, processes (for example, a cleaning process, etc.) that may be provided in a normal photolithography process can be applied without particular limitation.

(touch panel)
A touch panel according to the present disclosure includes a cured film according to the present disclosure (that is, a cured film that is a cured product of the solid content of the photosensitive composition according to the present disclosure).
A preferred embodiment of the touch panel according to the present disclosure includes a touch panel substrate having a structure in which at least one of a touch panel electrode and a touch panel wiring (hereinafter also referred to as “electrodes, etc.”) is arranged on the substrate, and a touch panel electrode and the touch panel. and a protective film for a touch panel that protects at least a part of at least one of the wirings, and the protective film for the touch panel is a cured film according to the present disclosure.
Since the touch panel according to the present disclosure includes the cured film (for example, a touch panel protective film) according to the present disclosure with reduced WVTR, corrosion of electrodes and the like due to water vapor is suppressed.

The touch panel of the preferred embodiment may further include a first high refractive index layer between the electrodes and the like and the touch panel protective film.
Preferred aspects of the first high refractive index layer are the same as preferred aspects of the high refractive index layer that can be provided in the transfer film. The first high refractive index layer may be formed by coating and drying the composition for forming the first high refractive index layer, or may be formed by transferring the high refractive index layer of a transfer film having a high refractive index layer. may
The touch panel in the aspect including the first high refractive index layer is preferably formed by using the transfer film according to the present disclosure in the aspect including the high refractive index layer and transferring the photosensitive layer and the high refractive index layer in the transfer film. do. In this case, the protective film for a touch panel is formed from the photosensitive layer of the transfer film, and the first high refractive index layer is formed from the high refractive index layer of the transfer film.

The touch panel of the above preferred embodiment may further include a second high refractive index layer between the substrate and the electrode or the like.
Preferred aspects of the second high refractive index layer are the same as preferred aspects of the high refractive index layer that can be provided in the transfer film.

An aspect in which the touch panel according to the present disclosure includes the first high refractive index layer (more preferably, an aspect in which the first high refractive index layer and the second high refractive index layer are included) has an advantage that the electrodes and the like are less visible.

For the structure of the touch panel, reference may be made to the structure of the capacitive input device described in Japanese Unexamined Patent Application Publication No. 2014-10814 or Japanese Unexamined Patent Application Publication No. 2014-108541.

(Manufacturing method of touch panel)
A preferred method for manufacturing a touch panel according to the present disclosure includes:
of the touch panel substrate having a structure in which at least one of the touch panel electrodes and the touch panel wirings is arranged on the substrate, on the side on which at least one of the touch panel electrodes and the touch panel wirings is arranged, the touch panel according to the present disclosure. Forming a photosensitive layer using a photosensitive composition or a transfer film according to the present disclosure, pattern-exposing the photosensitive layer formed on the touch panel substrate, and pattern-exposing the photosensitive layer obtaining a touch panel protective film that protects at least a portion of at least one of the touch panel electrode and the touch panel wiring by developing the layer.
The touch panel manufacturing method according to the present disclosure may include other steps as necessary.

The step of preparing the touch panel substrate is a step for convenience.
The step of preparing the touch panel substrate may be a step of simply preparing a prefabricated touch panel substrate, or may be a step of manufacturing the touch panel substrate.
As the substrate in the touch panel substrate, the glass substrate or the resin substrate described above can be used.
At least one of the touch panel electrodes and the touch panel wirings in the touch panel substrate may be formed on another layer (for example, the second high refractive index layer described above) disposed on the substrate.
At least one of the touch panel electrodes and the touch panel wirings in the touch panel substrate can be formed, for example, by a normal photoetching (that is, photolithography and etching) technique.

Preferred aspects of the step of forming a photosensitive layer, the step of pattern exposure, and the step of forming a protective film for a touch panel are the preferred aspects of the photosensitive layer forming step, the exposure step, and the developing step, respectively, in the manufacturing method A described above. is similar to
The touch panel manufacturing method according to the present disclosure may include other processes (for example, a cleaning process, etc.) other than the processes described above. As other processes, processes (for example, a cleaning process, etc.) that may be provided in a normal photolithography process can be applied without particular limitation.

<First specific example of touch panel>
FIG. 2 is a schematic cross-sectional view of a touch panel 30, which is a first specific example of the touch panel according to the present disclosure.
As shown in FIG. 2, the touch panel 30 includes a substrate 32, a second high refractive index layer 36, an electrode pattern 34 as a touch panel electrode, a first high refractive index layer 20, and a touch panel protective film. and a protective film 18 are arranged in this order.
The protective film 18 is a layer formed by transferring and then curing the photosensitive layer 18A of the transfer film 10 shown in FIG. It is a layer formed by transferring ten high refractive index layers 20A and then curing them.
In the touch panel 30 , the protective film 18 and the first high refractive index layer 20 cover the entire electrode pattern 34 . However, the touch panel according to the present disclosure is not limited to this aspect. The protective film 18 and the first high refractive index layer 20 need only cover at least part of the electrode pattern 34 .

In addition, the second high refractive index layer 36 and the first high refractive index layer 20 are directly or via another layer, respectively, the first region 40 where the electrode pattern 34 exists and the second region 42 where the electrode pattern 34 does not exist. It is preferable to coat continuously through the This makes the electrode pattern 34 less visible.
The second high refractive index layer 36 and the first high refractive index layer 20 preferably cover both the first region 40 and the second region 42 directly rather than covering them via other layers. Examples of "another layer" include an insulating layer, an electrode pattern other than the electrode pattern 34, and the like.

The first high refractive index layer 20 is laminated over both the first region 40 and the second region 42 . The first high refractive index layer 20 is adjacent to the second high refractive index layer 36 and is also adjacent to the electrode pattern 34 .
When the shape of the end portion of the electrode pattern 34 in contact with the second high refractive index layer 36 is tapered as shown in FIG. , the first high refractive index layer 20 is preferably laminated.

As the electrode pattern 34, a transparent electrode pattern (for example, an ITO pattern) is suitable.
The electrode pattern 34 can be formed, for example, by the following method.
An electrode thin film (for example, an ITO film) is formed by sputtering on the substrate 32 on which the second high refractive index layer 36 is formed. An etching protective layer is formed on the electrode thin film by applying a photosensitive resist for etching or by transferring a photosensitive film for etching. Then, a desired pattern is formed in this etching protection layer by exposure and development. Next, etching is performed to remove portions of the electrode thin film that are not covered with the etching protection layer. As a result, the electrode thin film is patterned in a desired shape (that is, the electrode pattern 34). Subsequently, the etching protection layer is removed with a stripping solution.

The first high refractive index layer 20 and the protective film 18 can be formed, for example, by referring to the manufacturing method A described above.
The first high refractive index layer 20 and the protective film 18 are formed on the substrate 32 on which the electrode pattern 34 is formed, for example, as follows.
First, the transfer film 10 shown in FIG. 1 (that is, the transfer film 10 having a laminated structure of protective film 16/high refractive index layer 20A/photosensitive layer 18A/temporary support 12) is prepared.
Next, the protective film 16 is removed from the transfer film 10 .
Next, the transfer film 10 from which the protective film 16 has been removed is laminated on the substrate 32 on which the second high refractive index layer 36 and the electrode pattern 34 are sequentially provided. Lamination is performed in a direction in which the high refractive index layer 20A of the transfer film 10 from which the protective film 16 has been removed and the electrode pattern 34 are in contact with each other. By this lamination, a laminate having a laminated structure of temporary support 12/photosensitive layer 18A/high refractive index layer 20A/electrode pattern 34/second high refractive index layer 36/substrate 32 is obtained.
Next, the temporary support 12 is removed from the laminate.
Next, the laminate from which the temporary support 12 has been removed is pattern-exposed to cure the photosensitive layer 18A and the high refractive index layer 20A in a pattern. The patternwise curing of the photosensitive layer 18A and the high refractive index layer 20A may be performed separately by separate patternwise exposures, but is preferably performed simultaneously by one patternwise exposure.
Next, by removing the unexposed portions (uncured portions) of the photosensitive layer 18A and the high refractive index layer 20A by development, the protective film 18 (the pattern shape is (not shown), and the first high refractive index layer 20 (pattern shape not shown), which is a patterned cured product of the high refractive index layer 20A, are obtained. The development of the photosensitive layer 18A and the high refractive index layer 20A after the pattern exposure may be performed separately by separate development, but preferably performed simultaneously by one development.

For preferred aspects of lamination, pattern exposure, and development, the preferred aspects of production method A can be referred to.

For the structure of the touch panel, reference may be made to the structure of the capacitive input device described in Japanese Unexamined Patent Application Publication No. 2014-10814 or Japanese Unexamined Patent Application Publication No. 2014-108541.

<Second example>
FIG. 3 is a schematic cross-sectional view of a touch panel 90 that is a second specific example of the touch panel according to the present disclosure.
As shown in FIG. 3 , the touch panel 90 has touch panel electrodes on both sides of the substrate 32 . Specifically, the touch panel 90 includes a first transparent electrode pattern 70 on one surface of the substrate 32 and a second transparent electrode pattern 72 on the other surface.
In the touch panel 90 , a conductive member 56 that serves as an extraction wiring is connected to each of the first transparent electrode pattern 70 and the second transparent electrode pattern 72 .
In the touch panel 90, the protective film 18 is formed on one surface of the substrate 32 so as to cover the first transparent electrode pattern 70 and the conductive member 56, and on the other surface of the substrate 32, the second transparent electrode pattern 72 is formed. And a protective film 18 is formed to cover the conductive member 56 .
One surface and the other surface of the substrate 32 may be provided with the first high refractive index layer and the second high refractive index layer in the first specific example, respectively.
The touch panel 90 has a display area 74 corresponding to an area touched by a finger or a touch pen, and a non-display area 75 corresponding to a frame portion.

(Image display device)
A touch panel according to the present disclosure (for example, the touch panels of the first and second specific examples) is provided in an image display device.
As for the structure of the image display device, for example, "Latest Touch Panel Technology" (published July 6, 2009, Techno Times Co., Ltd.), supervised by Yuji Mitani, "Technology and Development of Touch Panel", CMC Publishing (2004, 12). , FPD International 2009 Forum T-11 Lecture Textbook, Cypress Semiconductor Corporation Application Note AN2292.

Examples of the present invention are shown below, but the present invention is not limited to the following examples.
Hereinafter, "parts" and "%" mean "mass parts" and "mass%" respectively.
Further, compounds i-1 to i-6 and compounds ii-1 to ii-6 in the following examples are respectively compound i-1 to compound i-6 and compound ii-1 to compound ii in the above specific examples. -6 is the same compound.

As shown below, polymer P-1 to polymer P-13, which are specific examples of the specific polymer in the present disclosure, and polymer R-1 to polymer R-4, which are comparative polymers, synthesized respectively.

<Synthesis of polymer P-1>
[Synthesis of compound (ii-1)]
52.1 parts of 2-hydroxyethyl methacrylate (manufactured by Wako Pure Chemical Industries, Ltd.) and 104.1 parts of dimethylacetamide (manufactured by Wako Pure Chemical Industries, Ltd.) were mixed, and the internal temperature was cooled to 5°C. 39.06 parts of 3-chloropropionyl chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added dropwise, and the mixture was stirred at 25°C for 1 hour. 26.96 parts of 3-chloropropionyl chloride was further added dropwise, and the mixture was stirred at 25°C for 0.5 hour. 521 parts of ethyl acetate (manufactured by Wako Pure Chemical Industries, Ltd.), 44 parts of sodium hydrogen carbonate (manufactured by Wako Pure Chemical Industries, Ltd.), and 475 parts of pure water were added to the reaction solution, and the mixture was separated and the organic layer was taken out. The organic layer was separated with 44 parts of sodium bicarbonate and 475 parts of pure water, and the organic layer was washed twice with 475 parts of pure water and once with 475 parts of brine (saturated saline). The organic layer was dehydrated with magnesium sulfate, 0.05 part of p-methoxyphenol (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and the solvent was removed to obtain 86 parts of compound ii-1.

[Synthesis of polymer P-1]
66.7 parts of dimethylacetamide (manufactured by Wako Pure Chemical Industries, Ltd.) was placed in a three-necked flask, stirred under nitrogen, and maintained at 90°C. Separately, 50 parts of styrene (manufactured by Wako Pure Chemical Industries, Ltd.), 42.2 parts of compound (i-1) (manufactured by Shikuma-Aldrich), 20 parts of methacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.), V 8.0 parts of -601 (manufactured by Wako Pure Chemical Industries, Ltd.) and 66.7 parts of dimethylacetamide were mixed, and the mixture was added dropwise over 3 hours. After dropping, the mixture was stirred for 1 hour, and 0.72 part of V-601 was added 3 times at 1 hour intervals. After stirring for 3 hours, 167 parts of dimethylacetamide was added and the mixture was cooled to 25°C. 0.055 parts of p-methoxyphenol (manufactured by Wako Pure Chemical Industries, Ltd.) and 104 parts of 1,8-diazabicyclo[5.4.0]-7-undecene (manufactured by Wako Pure Chemical Industries, Ltd.) were added. , 50° C. for 6 hours. The reaction mixture was neutralized with concentrated hydrochloric acid, diluted with acetone, reprecipitated with water and dried to obtain 72 parts of polymer P-1. The weight average molecular weight (Mw) of this polymer was 15,000.

<Synthesis of polymer P-2 to polymer P-13 and polymer R-1 to polymer R-4 (for comparison)>
Polymer P-1 was synthesized in the same manner as for polymer P-1, except that the type and amount of each monomer was changed so that the content of the structural units shown in Table 1 below was obtained.
The numerical values in Table 1 indicate the contents (% by mass) of structural units derived from the compounds described in the column of monomers. In Table 1, the content (% by mass) of structural units derived from compound i-1 or compound i-2 is described as the content of structural units after formation of ethylenically unsaturated groups.

Details of the abbreviations in Table 1 are as follows.
St: Styrene (manufactured by Wako Pure Chemical Industries, Ltd.)
VN: vinyl naphthalene (manufactured by Wako Pure Chemical Industries, Ltd.)
i-1: compound i-1
ii-1: compound ii-1
MAA: methacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
AA: acrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
DCPMA: dicyclopentanyl methacrylate (Funkryl 513M, manufactured by Hitachi Chemical Co., Ltd.)

(Examples 1 to 13, Comparative Examples 1 to 4)
<Preparation of photosensitive composition>
A photosensitive composition was prepared by mixing the compositions shown in Table 2 below.

<Evaluation of tackiness>
A photosensitive composition was coated on a polyethylene terephthalate film so that the film thickness after drying was 10 μm, dried to form a photosensitive layer, and a transfer film was formed. The transfer film was cut into a rectangle of 5 cm×18 cm.
Cut Therapyal (manufactured by Toray Advanced Film Co., Ltd., product number 38BKE (RX)) into a rectangle of 10 cm x 15 cm, and place the cut Therapyal on a horizontal surface so that the surface coated with the release agent faces up. Fixed.
The therapyal and the transfer film are superimposed so that the surface of the fixed therapyal coated with the release imparting agent and the surface of the cut transfer film on which the photosensitive layer is formed are in contact, and 4 cm x 4 cm is placed thereon. A rectangular parallelepiped weight of 70 g with a size of 6 cm×3 cm was put thereon (contact surface of the weight: 4 cm×6 cm).
Using a SHIMPO Force Gauge Stand, the superimposed transfer film was pulled at a constant speed in the horizontal direction parallel to the long side, and the frictional force (unit: N) under the load of the weight was measured.
A value obtained by dividing the frictional force by 70 (hereinafter also referred to as a "tackiness index value") was used as a tackiness index. In the following evaluation criteria, A or B is preferable, and A is more preferable.

-Evaluation Criteria for Tackiness-
A: The tackiness index value is less than 5.
B: The tackiness index value is 5 or more and less than 10.
C: The tackiness index value is 10 or more and less than 15.
D: The tackiness index value is 15 or more.

<Evaluation of Water Vapor Transmission Rate (WVTR)>
[Preparation of sample for moisture permeability measurement]
On a polyethylene terephthalate (PET) film with a thickness of 75 μm as a temporary support, using a slit nozzle, any one of the photosensitive compositions of each example and each comparative example is applied and then dried. , a photosensitive layer having a thickness of 10 μm was formed to obtain a transfer film for sample preparation.
Next, the transfer film for sample preparation is laminated on Sumitomo Electric's PTFE (polytetrafluoroethylene resin) membrane filter FP-100-100, and the layer structure of temporary support/photosensitive layer with a thickness of 10 μm/membrane filter A laminate A having was formed. The lamination conditions were a membrane filter temperature of 40° C., a lamination roll temperature of 110° C., a linear pressure of 3 N/cm, and a conveying speed of 2 m/min.
Next, the temporary support was peeled off from the laminate A.
By repeating the above operation four times, a laminate B having a laminate structure of a photosensitive layer/membrane filter with a total thickness of 40 μm was formed.
After exposing the photosensitive layer of the obtained laminate B with an i-line at an exposure amount of 300 mJ/cm ² , post-baking was performed at 145° C. for 30 minutes to cure the photosensitive layer to form a cured film. formed.
As described above, a sample for moisture permeability measurement having a laminated structure of cured film/membrane filter with a total film thickness of 40 μm was obtained.

[Measurement of water vapor transmission rate (WVTR)]
Using a sample for moisture permeability measurement, moisture permeability was measured by the cup method with reference to JIS-Z-0208 (1976). Details will be described below.
First, a circular sample with a diameter of 70 mm was cut out from a sample for moisture permeability measurement. A lidded measuring cup was then prepared by placing 20 g of dried calcium chloride in the measuring cup and then lidding with the circular sample.
This lidded measuring cup was left for 24 hours under conditions of 65° C. and 90% RH in a constant temperature and humidity chamber. The water vapor transmission rate (WVTR) (unit: g/(m ² ·day)) of the circular sample was calculated from the mass change of the lidded measuring cup before and after the standing.
The above measurements were performed three times, and the average value of WVTR for the three measurements was calculated. Based on the WVTR average value, the water vapor transmission rate (WVTR) was evaluated according to the following evaluation criteria. In the following evaluation criteria, A or B is preferable, and A is more preferable.
Table 2 shows the results.
In the above measurement, as described above, the WVTR of a circular sample having a laminated structure of cured film/membrane filter was measured. However, since the WVTR of the membrane filter is much higher than that of the cured film, the WVTR of the cured film itself is substantially measured in the above measurement.

-Evaluation Criteria for Water Vapor Transmission Rate (WVTR)-
A: The average value of WVTR was less than 100 g/(m ² ·day), and the WVTR of the cured film was extremely reduced.
B: The average value of WVTR was 100 g/(m ² ·day) or more and less than 150 g/(m ² ·day), and the WVTR of the cured film was reduced.
C: The WVTR average value was 150 g/(m ² ·day) or more and less than 200 g/(m ² ·day), and the WVTR of the cured film was high.
D: The average value of WVTR was 200 g/(m ² ·day) or more, and the WVTR of the cured film was extremely high.

In Table 2, the amount (parts) of each component means parts by mass. The amount of polymer in Table 2 means the amount of polymer solution (polymer concentration: 35% by mass). Also, "-" means that the corresponding component is not contained.
Details of abbreviations for each component are as follows.
A-DCP: tricyclodecanedimethanol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.; bifunctional monomer)
TO-2349: Carboxylic acid-containing monomer (manufactured by Toagosei Co., Ltd.; a mixture of a pentafunctional monomer and a hexafunctional monomer)
OXE-02: Ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime) (BASF; oxime-based photopolymerization initiator )
Irg-907: 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (manufactured by BASF; α-aminoalkylphenone photopolymerization initiator)
TPA-B80E: Duranate TPA-B80E (manufactured by Asahi Kasei Chemicals Corp.; compound having two or more blocked isocyanate groups in one molecule)
F551: Megafac F-551 (manufactured by DIC; fluorine-containing group/lipophilic group-containing oligomer)
PGMEA: propylene glycol monomethyl ether acetate MEK: methyl ethyl ketone

As shown in Tables 1 and 2, 30% to 70% by mass of the structural unit represented by formula A1 and 5% to 60% by mass of the structural unit represented by formula B1 are contained, and the acid value is A photosensitive composition containing a polymer having a molecular weight of 3.50 mmol/g or less and a radical polymerization initiator can provide a cured film having low tackiness and a reduced water vapor transmission rate (WVTR). Recognize.
Moreover, in Comparative Example 1, the acid value of the polymer was 4.65 mmol/g, and in such a case, it can be seen that the WVTR was not reduced.
In Comparative Example 2, the content of the structural unit represented by formula B1 in the polymer was 1% by mass, and in such a case, it can be seen that the WVTR was not reduced.
In Comparative Example 3, the content of the structural unit represented by formula A1 in the polymer is 20% by mass, the content of the structural unit represented by formula B1 in the polymer is 70% by mass, In such a case, it can be seen that the tackiness is large.
In Comparative Example 4, the content of the structural unit represented by formula A1 in the polymer was 20% by mass, and the acid value of the polymer was 4.65 mmol/g. In such a case, it can be seen that the tackiness is large and the WVTR is not reduced.

10 Transfer Film 12 Temporary Support 16 Protective Film 18 Protective Film 18A Photosensitive Layer 20 First High Refractive Index Layer 20A High Refractive Index Layer 30 Touch Panel 32 Substrate 34 Electrode Pattern 36 Second High Refractive Index Layer 40 First Region 42 Second Region 56 Conductive member 70 First transparent electrode pattern 72 Second transparent electrode pattern 74 Display region 75 Non-display region 90 Touch panel

Claims (29)

Containing 30% to 70% by mass of a structural unit represented by the following formula A1 and 5% to 60% by mass of a structural unit represented by the following formula B1, and having an acid value of 3.50 mmol/g or less a polymer that is
A photosensitive composition containing a radical polymerization initiator.

In Formula A1, Ar represents an unsubstituted phenyl group or an unsubstituted naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In formula B1, X ^B1 and X ^B2 represent -O-, L represents a methylene group, ethylene group or arylene group, and R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group. 2. The photosensitive composition according to claim 1, wherein the polymer has an acid value of 1.50 mmol/g to 3.50 mmol/g. 3. The photosensitive composition according to claim 1, wherein the polymer has a weight average molecular weight of 10,000 to 60,000. 4. The photosensitive composition according to any one of claims 1 to 3, further comprising a difunctional or higher radically polymerizable compound. 5. The photosensitive composition according to claim 4, comprising a difunctional radically polymerizable compound having a ring structure as the difunctional or higher radically polymerizable compound. 6. The photosensitive composition according to any one of claims 1 to 5, further comprising a compound having a thermally reactive group. 7. The photosensitive composition according to claim 6, wherein the thermally reactive group is at least one selected from the group consisting of isocyanate groups, ketene groups, blocked isocyanate groups, and blocked ketene groups. 8. The photosensitive composition according to any one of claims 1 to 7, which is used for forming a touch panel protective film. A cured film which is a cured product of the photosensitive composition according to any one of claims 1 to 8. A temporary support and a photosensitive layer containing a solid content of the photosensitive composition,
The photosensitive composition contains 30% to 70% by mass of a structural unit represented by the following formula A1 and 5% to 60% by mass of a structural unit represented by the following formula B1, and has an acid value is 3.50 mmol / g or less, and a radical polymerization initiator,
transfer film.

In formula A1, Ar represents a phenyl group or naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In formula B1, X ^B1 and X ^B2 each independently represent -O- or -NR ^N -, R ^N represents a hydrogen atom or an alkyl group, L represents a methylene group, an ethylene group or an arylene group, R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group. 11. The transfer film according to claim 10, wherein the photosensitive composition further contains a difunctional or higher radically polymerizable compound. 12. The transfer film according to claim 11, comprising a bifunctional radically polymerizable compound having a ring structure as the difunctional or higher radically polymerizable compound. The transfer film according to any one of claims 10 to 12, wherein the photosensitive composition further contains a compound having a heat-reactive group. The transfer according to any one of claims 10 to 13, further comprising a transparent layer having a refractive index of 1.60 or more at a wavelength of 550 nm on the side of the photosensitive layer opposite to the temporary support. the film. 15. The transfer film according to any one of claims 10 to 14, which is used for forming a touch panel protective film. The transfer film according to any one of claims 10 to 15, wherein the polymer has a weight average molecular weight of 10,000 to 60,000. The transfer film according to any one of claims 10 to 16, wherein X ^B1 and X ^B2 represent -O- in the formula B1. Equipped with a cured film that is a cured product of the photosensitive composition,
The photosensitive composition contains 30% to 70% by mass of a structural unit represented by the following formula A1 and 5% to 60% by mass of a structural unit represented by the following formula B1, and has an acid value is 3.50 mmol / g or less, and a radical polymerization initiator,
touch panel.

In formula A1, Ar represents a phenyl group or naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In formula B1, X ^B1 and X ^B2 each independently represent -O- or -NR ^N -, R ^N represents a hydrogen atom or an alkyl group, L represents a methylene group, an ethylene group or an arylene group, R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group. 19. The touch panel according to claim 18, wherein said photosensitive composition further contains a difunctional or higher radically polymerizable compound. The touch panel according to claim 19, wherein the difunctional or higher radically polymerizable compound includes a bifunctional radically polymerizable compound having a ring structure. The touch panel according to any one of claims 18 to 20, wherein the photosensitive composition further contains a compound having a thermoreactive group. The touch panel according to any one of claims 18 to 21, wherein the polymer has a weight average molecular weight of 10,000 to 60,000. The touch panel according to any one of claims 18 to 22, wherein X ^B1 and X ^B2 in formula B1 represent -O-. A photosensitive composition is applied onto a surface of a touch panel substrate having a structure in which at least one of a touch panel electrode and a touch panel wiring is arranged on the substrate, the side on which at least one of the touch panel electrode and the touch panel wiring is arranged. or forming a photosensitive layer using the transfer film according to any one of claims 10 to 17;
patternwise exposing the photosensitive layer formed on the touch panel substrate;
Obtaining a touch panel protective film that protects at least a part of at least one of the touch panel electrode and the touch panel wiring by developing the pattern-exposed photosensitive layer;
including
The photosensitive composition contains 30% to 70% by mass of a structural unit represented by the following formula A1 and 5% to 60% by mass of a structural unit represented by the following formula B1, and has an acid value is 3.50 mmol / g or less, and a radical polymerization initiator,
A method for manufacturing a touch panel.

In formula A1, Ar represents a phenyl group or naphthyl group, and R ^A1 represents a hydrogen atom or an alkyl group.
In formula B1, X ^B1 and X ^B2 each independently represent -O- or -NR ^N -, R ^N represents a hydrogen atom or an alkyl group, L represents a methylene group, an ethylene group or an arylene group,
R ^B1 and R ^B2 each independently represent a hydrogen atom or an alkyl group. 25. The method of manufacturing a touch panel according to claim 24, wherein the photosensitive composition further contains a difunctional or higher radically polymerizable compound. 26. The method of manufacturing a touch panel according to claim 25, wherein the difunctional or higher radically polymerizable compound includes a bifunctional radically polymerizable compound having a ring structure. The method for manufacturing a touch panel according to any one of claims 24 to 26, wherein the photosensitive composition further contains a compound having a thermoreactive group. The method for manufacturing a touch panel according to any one of claims 24 to 27, wherein the polymer has a weight average molecular weight of 10,000 to 60,000. The method for manufacturing a touch panel according to any one of claims 24 to 28, wherein X ^B1 and X ^B2 represent -O- in the formula B1.

Images